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High-performance and low power connectivity

The Ensigma CRF4600 is a high-performance Wi-Fi and Bluetooth RFIC IPs in TSMC 65nm LP. It provides a highly flexible, dual-band Wi-Fi solution capable of supporting up to IEEE 802.11n/ac 4×4 MIMO, IEEE 802.11p and Bluetooth 5.0. The IPs provide a compact ultra-small form factor solution with minimal external components to drive the costs for mass volumes and allows for flexibility in size, form, and function.


  • Automotive qualification
  • Silicon ready design
  • Lowest power consumption
  • Easy integration with companion baseband chip


  • Automotive V2X
  • Connected home
  • Digital TV and set-top boxes

Tech Specs

Geometry nm65
Maturity Silicon proven
Target Process NodeTSMC 65 LP


    • Designed for TSMC 65nm process
    • Internal power amplifiers
    • Designed for QFN packages
    • Dual synthesisers
  • Process
    • TSMC 65 nm LP (1P6M, 1.2V/2.5V)
    • 6 metal layers including UTM (ultra-thick metal)
  • General Features
    • 3/4-wire SPI control interface
    • On-chip LDO regulators
    • On-chip XO for XTAL operation
    • Direct conversion receiver and transmitter
    • RX RSSI function
    • TX TSSI function
    • On-chip baluns for single-ended RF input and output
    • No external trimming required in production except for XO frequency trimming
    • Low output spur and strong receive blocking performance
    • Support for power compensation of external PA to produce stable transmit power across temperature
    • Fast AGC and wide dynamic range allow for excellent robustness against fading
    • Fully integrated fractional-N synthesizer
    • Low phase noise and fast switching time
    • Support for antenna diversity
  • Package
    • Package: QFN with 56 pins
  • Key Characteristics
    • 2.4 GHz and 5 GHz operation
    • Integrated power amplifiers
    • +15 dBm maximum output power in 5 GHz
    • +17 dBm maximum output power in 2.4 GHz
    • Support for digital pre-distortion
    • 22 dB gain range in transmit mode
    • TX EVM < -32 dB internal power amplifier mode
    • Supported for 40 and 52 MHz reference clocks
    • Support for 10 MHz in 802.11p configuration
    • Fast Channel Switching (< 200 µs)
    • Fast wake up from standby, typically 20 µs
    • Die area: 8.2 mm2
    • Die dimensions: 2176 um x 3776 um








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