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New Siemens Aprisa IC place-and-route software version targets faster time-to-market with performance improvements

Plano, TX, USA -- October 12, 2021 -- Siemens Digital Industries Software today announced that the latest release of its Aprisa™ physical design solution is now available. Aprisa 21.R1 has achieved major performance and technology advancements, including dramatic improvements in both runtime and memory footprint reductions. For customers, these enhancements can translate to lower design costs and faster time-to-market.

The technology advancements available in Aprisa 21.R1 demonstrate Siemens’ commitment to delivering best-in-class physical design Integrated Circuit (IC) solutions to its Electronic Design Automation (EDA) customers. Since completing the acquisition of the Aprisa portfolio in December 2020, Siemens has more than doubled the Aprisa R&D team as part of a substantial investment in the Aprisa technology portfolio.

The latest release of Aprisa targets advanced technology nodes and includes the following milestones and highlights:

“This new release reconfirms Siemens’ commitment to providing truly world class physical design technology to our EDA customers,” said Inki Hong, division director of the Aprisa product line for Siemens Digital Industries Software. “With Aprisa 21.R1, our customers can work more efficiently with larger and more challenging designs than ever before.”

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation. For more information on Siemens Digital Industries Software products and services, visit www.sw.siemens.com or follow us on LinkedIn, Twitter, Facebook and Instagram. Siemens Digital Industries Software – Where today meets tomorrow.

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