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   Technological innovation has accelerated at an unprecedented pace in the recent years and so have the disruptions in the sector of Silicon engineering - complex IC development, increasing failures, inadequate facilities for design, development and testing. At Tessolve, we address these disruptions, helping Semiconductor product companies in Semiconductor IC Design, Test & Product Engineering, PCB Design, Failure Analysis and Systems design. An enabler of smooth design and productization of chips, we leverage our in-house infrastructure, quality excellence practices and cost-effective approaches to bring value driven solutions and services.   
2 SoCs

1
MAGIK2:i.MX6 Q-Seven Module with Carrier Board
Using Q7 standard for embedded modules, TESSOLVE EMBEDDED SYSTEMS introduces a series of ultra-low power ARM System-On-Module based on the NXP i.MX Family which is powered by ARM Cortex AP CPUs

2
Tessolve System Design platform
In the embedded system arena, a certain depth of experience is what Tessolve brings to the foray, exposed to varied scenario, requirements and design related challenges.

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