Eliyan s Interconnect technology built with standard organic chip packaging delivers the same performance as advanced packaging technology, and enables The Ultimate Chiplet Systems at a fraction of total cost of ownership.
NuLink™ delivers performance and power/area efficiency that no other technology can offer. Our exclusive trade secrets and patent-protected technologies deliver a UCIe compliant interconnect at twice the bandwidth and half the power.
The NuLink architecture leveraged cross-technology innovations to deliver the highest bandwidth and lowest latency, at best-in-class area and power efficiency.