Toshiba's system-on-a-chip (SoC) offerings incorporate a combination of deep submicron technologies, complex cores and a broad range of ASIC families down to 90 nanometers (nm). Toshiba holds a significant technological lead in delivering low-risk 130nm SoCs by first implementing an aluminum interconnect version followed by a copper interconnect version. This enabled Toshiba to deliver high-volume, high-yield manufacturing ahead of the industry. Toshiba also holds a full-volume manufacturing lead in embedded DRAM technology for performance applications, or applications where availability of discrete DRAMs is uncertain. An extensive lineup of embedded MIPS and ARM RISC cores and other IP from both internal and third-party suppliers can also be implemented in these designs. To solve the challenge of engineering productivity, Toshiba's customers have cut their design cycles by months by using Toshiba's commercial and third-party EDA tools that enable hierarchical design, full-chip verification, timing closure and enhanced signal integrity and cross talk analysis.