Qualcomm, CEVA, ARM Race to Next-Gen Modem

by Junko Yoshida, EETimes

PARIS, Feb. 17, 2016 – 

Advancements of LTE technology, including LTE Advanced and LTE Advanced Pro, are creating havoc. They are spawning a host of new demands that make the next-gen baseband designs far more complex than any of the previous smartphone modems.

The world's leading telecom chip vendor Qualcomm, CEVA, a DSP core supplier, and ARM, a processor core company, are all racing to meet that challenge. They have developed new processor architectures, which they are unveiling in prior to the Mobile World Congress next week. Qualcomm announced Snapdragon X16 last week, while CEVA this week revealed CEVA-X4 and ARM is now talking up its new Cortex-R8. Qualcomm for the first time deploys its own DSP core in the new modem, instead of ARM.

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