Next-Gen IoT Consortium Launches

MEMS, photonics the focus

By R. Colin Johnson,EEtimes,LAKE WALES, Fla., Aug. 05, 2016 – 

By uniting the quest for heterogenous integration of microelectromechanical systems (MEMS) and silicon photonic devices into the same package, the next-generation of Internet of Things (IoT) could be redefined. A consortium of nearly a dozen manufacturers - from InvenSense and Corning to Fraunhofer and NTT - has pledged to meld MEMS+Photonics before the end of the decade.

"The Internet of Things will drive sensor growth to trillions of units as sensors become a fundamental economic driver. Disruptive sensor applications are expected to change our lives. Materializing these huge business opportunities requires a paradigm shift in sensor innovation and manufacturing." Mo Maghsoudnia, vice president, technology and worldwide manufacturing at InvenSense told EE Times. "IME's packaging consortia partnership will allow us to identify and develop MEMS packaging innovative solutions in order to scale up for the IoT."

The Singapore-based Agency for Science, Technology and Research (A*STAR) has commissioned its Institute of Microelectronics (IME) to form two consortia, first the MEMS and Photonics Consortium. So far their ranks include Delta Electronics, Inc., InvenSense Inc., Standing Egg Inc., STATS ChipPAC Limited, ULVAC, Inc. The second consortium is the Silicon Photonics Packaging Consortium consisting of Accelink Technologies Co., Ltd., Corning Inc., Fujikura Ltd., Fraunhofer Heinrich Hertz Institute and NTT.

 Back