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China plans 3D NAND production next year
Oct. 20, 2016 –
3D NAND industry leaders Toshiba, Samsung and Intel/ Micron are in production of 48-layer NAND.
XMC, which was taken over by YRST earlier this year, developed the flash technology with Spansion which is now merged into Cypress.
YRST's Wuhan fab is due to start running wafers at the end of this year with first products due by the end of 2017.
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