Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent For Tiling of eFPGA Cores to Create Wide Range of Larger eFPGA Arrays

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领先的eFPGA IP 和软件供应商今天宣布，其联合创始人王成诚博士发明的一项新的eFPGA 互连专利已由美国专利局正式颁发，专利号9,906,225。新的专利使得Flex Logix 在2017 年获得多项互连专利的基础上更进一步，充分体现了公司的EFLX eFPGA 技术的创新性。该技术可使用户对EFLX4K eFPGA 核进行灵活的拼接，组成从4K LUT4 到200K LUT4 大小任选的阵列。

"这项专利互连技术的可扩展性已通过芯片验证，是传统FPGA 中的互连资源不可能达到的。" Geoff Tate, Flex Logix的CEO 和联合创始人说， "这对我们的客户来说是一个很重要的优势。因为客户不仅想要经过芯片验证的eFPGA IP核，还想要能根据应用需求的不同来选择不同大小的eFPGA IP 核。EFLX 是唯一拥有足够的可扩展性的 eFPGA IP，能够提供给客户从几百个LUT4 到二十万个LUT4 大小任选的eFPGA 阵列。

Flex Logix 新的专利技术使得eFPGA IP 核不仅可以单独使用，更能够通过专门的核与核的互连，拼接成不同大小不同形状的阵列。例如EFLX4K eFPGA 核，既可以作为一个4K LUT4 的eFPGA IP 核使用，也可以拼接成最大7x7 的阵列，作为一个包含 200K LUT4 的eFPGA 核整体来使用。

MOUNTAIN VIEW, Calif., Feb. 27, 2018 –  Flex Logix Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, announced that an additional switch interconnect patent, U.S. Patent 9,906,225, was issued today to Flex Logix, naming its co-founder Cheng Wang as the inventor. This patent, which builds on another interconnect patent issued to Flex Logix in late 2017, highlights a breakthrough technology feature of the company's EFLX platform, enabling the tiling of its EFLX 4K eFPGA core to create more than 50 different sized eFPGA arrays from 4K to 200K.

"Traditional interconnect technology used by our competition is not capable of achieving the silicon-proven scalability that this patent describes," said Geoff Tate, CEO and co-founder of Flex Logix. "This is a major competitive advantage for our customers because not only do they want proven eFPGA IP in silicon, but they also want it in very different sizes. Only the EFLX platform has the scalability to deliver either a few thousand LUTs, a couple hundred thousand LUTs, or any size in between."

The new patent enables a single eFPGA IP core, which is itself a complete eFPGA with programmable logic, interconnect and I/O ring, to be arrayed into a large number of arrays of customer-definable larger sizes. This is accomplished by implementing a top-layer mesh-like switch interconnect in the eFPGA core to provide connection between cores when abutted implementing a top-level interconnect that extends across arrays up to a certain maximum size (7x7 in the case of the EFLX4K, enabling a 200K LUT4 array).

About Flex Logix

Flex Logix, founded in March 2014, provides solutions for reconfigurable RTL in chip and system designs using embedded FPGA IP cores and software. The company's technology platform delivers significant customer benefits by dramatically reducing design and manufacturing risks, accelerating technology roadmaps, and bringing greater flexibility to customers' hardware. Flex Logix has secured approximately $13 million of venture backed capital, is headquartered in Mountain View, California and has sales rep offices in China, Europe, Israel, Japan, Taiwan and Texas. More information can be obtained at http://www.flex-logix.com.

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