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MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium

Enabling Innovation from RTL to Volume Production

Santa Clara, USA, April 21, 2025 -- MosChip® Technologies will participate in the TSMC 2025 North America Technology Symposium to showcase its spectrum of capabilities in Turnkey ASIC, Silicon Design, and IP Services. As a long-standing member of TSMC OIP Design Center Alliance (DCA), MosChip will spotlight its engineering expertise across advanced technology nodes, packaging, test, and production workflows, with a proven track record of 200+ SoC tapeouts.

With deep technical expertise in varied industry domains, MosChip empowers global customers to accelerate the time to market for complex silicon solutions.

Event Details:

What: At the TSMC 2025 North America Technology Symposium, MosChip will demonstrate its latest silicon engineering achievements and capabilities, including:

Who:

Available for media interactions and customer briefings:

When: 23 April 2025, 8:30 AM

Where: TSMC 2025 North America Technology Symposium

Santa Clara Convention Centre, Booth #620

5001 Great America Parkway,
Santa Clara, California 95054, USA

About MosChip® Technologies

MosChip® Technologies is a trusted partner to leading global enterprises and technology innovators. Our silicon and product engineering services, backed by over 25 years of expertise in chip design, hardware engineering, embedded software development, cloud computing, and AI solutions, empower clients to develop next-generation intelligent products that drive industry transformation. To know more, visit www.moschip.com

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