如何利用 Synopsys 3DIO PHY 应对 AI 芯片与先进封装设计挑战

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www.design-reuse.com – May. 04, 2026 –

The Evolution of Synopsys 3DIO: Setting the Stage

As AI workloads push the limits of compute scale, power efficiency, and bandwidth density, traditional die-to-die interconnect approaches—such as SerDes‑based links and wide-parallel IO— are becoming bottlenecks because they cannot deliver the required bandwidth density or energy efficiency. To address these challenges, Synopsys introduced the 3DIO solution IP: a protocol free, digitally friendly die-to-die IO architecture, purpose-built for low-power and low-latency heterogeneous 3D integration.

The emergence of hybrid bonding further clarified this architectural direction. By enabling ultra-short vertical connections and by allowing ultra-fine interconnect pitches, hybrid bonding makes it possible to achieve significantly higher bandwidth density and lower power, while avoiding the complexity inherent in long reach analog signaling and clock recovery.

As these benefits became evident, the industry rapidly aligned with a similar model. UCIe 2.0 introduced a new system level manageability architecture, followed by UCIe 3D, which is explicitly optimized for fine pitch hybrid bonding across a broad bump pitch range. Its emphasis on vertical connectivity and digitally managed die-to-die links closely mirrors the architectural path already established by the Synopsys 3DIO IP.

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