EXTOLL 宣布推出业界首款基于 GlobalFoundries 22FDX/22FDX+ 工艺的 16G UCIe PHY IP，现已准备就绪供客户集成

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www.design-reuse.com – May. 12, 2026 –

Mannheim, Germany — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, announces the availability and readiness for customer integration of the industry´s first 16G UCIe PHY IP in GlobalFoundries´ 22FDX/22FDX+ technology.

The IP marks a significant milestone in chiplet interconnectivity for mainstream foundry nodes. It is optimized for standard packaging, with full support for organic substrates across standard-defined bump pitch ranges, and enables advanced die-to-die connectivity for chiplet-based systems. Designed and rigorously verified for interoperability, it empowers customers to develop differentiated, high-performance systems based on the UCIe v2.0 standard.

The chiplet ecosystem is evolving at an unprecedented pace, expanding beyond traditional compute into next-generation applications such as radar, RF, and 5G/6G communications. For these domains, mainstream technology nodes offer an optimal balance of power, performance, and cost (PPA). EXTOLL´s UCIe IP bridges these environments, seamlessly connecting them with high compute capabilities delivered by chiplets built on advanced nodes.

The addressable market is broad, spanning Edge AI, Physical AI, robotics, aerospace and defense, as well as medical and automotive applications.

EXTOLL brings deep expertise in die-to-die connectivity. Its UCIe IP is a key building block for highly efficient chiplet-based architectures, complementing EXTOLL's extensible Network-on-Chip (NoC) and SerDes IP portfolio.

About EXTOLL

EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC- and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces. EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age. Find out more at www.extoll.com

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