www.design-reuse-china.com
2 SoCs

1
Die-to-Die PHY

Eliyan uses its NuLink technology to develop die-to-die PHY IP products to support multiple standards (including UCIe and BoW) and multiple packaging types (including advanced packaging and standar...


2
NuLink - Interconnect Solution
Eliyan s Interconnect technology built with standard organic chip packaging delivers the same performance as advanced packaging technology, and enables The Ultimate Chiplet Systems at a fraction of to...

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