Interconnect, D2D, C2C / Chip to Chip SoC Catalog

www.design-reuse-china.com

从IP到片上系统以及物联网扫描上方二维码关注我们的微信号哦! 新闻视频加入D&R 社区

Interconnect, D2D, C2C Catalog

Chip to Chip (5)

Die-to-die (32)

Intra SoC Connectivity (10)

Network Interconnect (15)

Innovative Ultra-High-Speed Chiplet Solution

Innosilicon INNOLINK™ IP provides a leading-edge chiplet solution allowing massive amounts of low-latency data to pass seamlessly between smaller chips as if they were all on the same bus. Chiplets, d...

Nutcracker XSR Connectivity Chiplet

Core and analog logic may not always deploy at the same time in the same process. Maturing high performance analog typically takes longer in moving to next generation of advanced process geometries...

UCIE 2.0 Controller

The InPsytech UCIe 2.0 (Universal Chiplet Interconnect Express) Controller is a high-performance designe to facilitate efficient communication between Die-to-Die or Chip-to-Chip for AI server, data ce...

Low Power Dual PHY for UCIe low cost robust Chiplets

YorChip UniPHY™ Dual PHY is a flexible version of YorChip's multi-protocol PHY which supports UCIe and BOW standards. The Dual PHY's unique feature is support for standard 50V CDM chi...

NuLink - Interconnect Solution

Eliyan s Interconnect technology built with standard organic chip packaging delivers the same performance as advanced packaging technology, and enables The Ultimate Chiplet Systems at a fraction of to...

Back

业务合作

添加产品

点击此处了解更多关于D&R的隐私政策