AresCORE is a market leading extremely low-power, low-latency interface IP designed by Alphawave IP for very high bandwidth connections between two dies that are on the same package.

The Alphawave DieCORE delivers the world s highest density, lowest power die-to-die connectivity solution for MCMs based on OIF XSR/USR serial standards. The DieCORE is a companion IP to the AlphaCOR...

Die-to-Die (D2D) PHY IP is based on HBM electrical specification and will also be compatible with upcoming interface standards. It is used specifically for heterogenous chiplet solutions in wired comm...

OpenFive s Die-to-Die (D2D) Controller IP is targeted for heterogenous chiplet solutions in wired communications, AI and HPC applications. With recent advances in package technologies, it is possible ...

The DesignWare Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance computing...

The DesignWare Die-to-Die PHY IP enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, AI, and networking applications. The low-latency...

Fortrix™ is a self-contained, feature-rich IP platform which provides Root-of-Trust and cybersecurity features to chiplet based systems and standard SoCs. It s unique combination of hardware an...

RAM of any size and kind in your EFLX® array

Generic RapidIO (GRIO) controller is a highly flexible and configurable IP to provide RapidIO interface on one side and a generic interface on the system side.

eTopus designs ultra-high speed mixed-signal semiconductor IP solutions for high-performance computing and data center applications. Our 1-56/112Gbps ultra-high speed SerDes IP is adopted by global Ti...

Ultra-high speed SerDes IP, adopted by global Tier-1 network/storage/5G OEMs and major semiconductor companies. eTopus is the pioneer on PAN4 ADC/DSP-based SerDes, the first startup demonstrated 56Gb...

The purpose of inter-chip connectivity IP is to connect two different chips together to share computing resources, limit chip-to-chip latency, or maintain the highest possible chip-to-chip bandwidth. ...

Arteris FlexLLI digital controller IP is the industry s first and only silicon-proven implementation of the MIPI Low Level Interface (LLI) specification. Arteris FlexLLI digital controller IP can con...

Arteris IP FlexNoC 5 network-on-chip (NoC) physically aware interconnect IP improves development time, performance, power consumption, and die size of system-on-chip (SoC) devices for mobile, automoti...

FlexNoC is the ideal interconnect for SoC designs requiring higher performance with minimum area and power. Its flexible architecture makes it the right solution for interconnects with both low latency requirements and high throughput needs. FlexNoC provides support for the additional features that today SoCs require, such as clock domain conversion, width conversion, security, and multi-protocol support. The product supports the AMBA (APB, AHB, AXI) protocols and OCP and can easily be extended to support proprietary protocols.

The Arteris FlexNoC Resilience Package provides hardware-based data protection for increased SoC reliability and functional safety.

The Arteris FlexNoC Resilience Package is a complementary product to Arteris FlexNoC fabric IP. It implements hardware resilience features essential for systems-on-chip (SoCs) targeted for mission-cri...

Innosilicon INNOLINK™ IP provides a leading-edge chiplet solution allowing massive amounts of low-latency data to pass seamlessly between smaller chips as if they were all on the same bus. Chiplets, d...

GUC multi-die interLink (GLink) IP provides world’s best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a package for applications such as High Performance ...

For scalable and area-efficient heterogeneous cache coherent systems.

PIANO 2.0 solves back-end timing problems with technology that works earlier in the SoC design flow, thereby reducing schedule risk.

IGAD2DX01A is a high speed die-to-die interface PHY which transmits data through INFO RDL channels. IGAD2DX01A contains 32 Tx lanes and 32 Rx lanes per slice and supports 8 slices in one PHY. Each Tx/...

Analog I/OS and power line ESD solutions All voltage domains (0.75V to 5V) Additional voltage (e.g. 12V in 28nm proven)

Scalable and area efficient interconnect solution optimized for memory coherent systems

Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead

EXTOLL introduces a new interconnection network architecture for High-Performance Computing, which brings a rich set of features to the HPC application space.

Performance (bandwidth and latency) optimized non-coherent NOC solution that significantly reduces silicon wire utilization, resulting in power and area efficient ICs

The AnalogX AXDieIO IP utilizes the silicon-proven AXLinkIO transceiver architecture for die-to-die, in package, type of channel links.

The AXLinkIO MR IP utilizes the silicon-proven AXLinkIO transceiver architecture for medium-reach and PCIe type of channel links.

BlueLynx™ technology revolutionizes the game in silicon design and engineering. Using proprietary technology, Blue Cheetah eliminates inefficiencies inherent in traditional silicon design processes while maintaining complete integrity.

Blue Cheetah's Bunch of Wires [BoW] PHY IP design incorporates the maximum benefit of the Open Compute Project's (OCP) inter-chiplet PHY specification, targeting best in class power, performa...