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- AI重塑所有产业，解析安谋科技"AI Arm China"战略背后的逻辑 (Dec. 05, 2025)
- M31 2025 TSMC 南京生态系统论坛 (Dec. 05, 2025)
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- 芯原NPU IP VIP9000NanoOi-FS获ISO 26262 ASIL B认证 (Dec. 02, 2025)
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- RISC-V应用落地，已经Next-Level (Nov. 28, 2025)
- Codasip announces strategic licensing agreement with EnSilica for its CHERI-enabled embedded CPU from the 700 family (Nov. 27, 2025)
- Nordic Semiconductor nRF54L15 斩获 IIC Shenzhen 2025 "全球电子成就奖" 年度射频 / 无线 / 微波产品奖 (Nov. 27, 2025)
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- 新思科技亮相微软Ignite大会，展示数字孪生赋能的制造流程优化框架 (Nov. 26, 2025)
- Siemens在CES 2026揭晓AI时代的工业技术 (Nov. 26, 2025)
- WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS (Nov. 26, 2025)
- 深入理解量子计算的物理原理 (Nov. 25, 2025)
- Perceptia 正式启动将 pPLL03 移植至三星 14 纳米工艺 (Nov. 25, 2025)
- 锐成芯微闪耀ICCAD 2025，卓越IP平台赋能AIoT 3.0新时代 (Nov. 25, 2025)
- 戴伟民博士荣获2025年度最佳管理者奖 (Nov. 25, 2025)
- Arm 将推出AI加速芯片：Cortex-M52 (Nov. 24, 2025)
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- VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor (Nov. 24, 2025)
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- RISC-V赋能云网智算 - 中国移动与赛昉科技邀请行业专家共话RISC-V赋能云网智算 (Nov. 21, 2025)
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- M31 亮相 ICCAD 2025：以高性能与低功耗 IP 驱动 AI 芯片新世代 (Nov. 21, 2025)
- EagleChip 选用 CAST TSN IP 核以增强其先进智能控制 SoC (Nov. 19, 2025)
- 芯原连续五年荣获"中国芯"优秀支撑服务IP企业 (Nov. 19, 2025)
- d-Matrix携手Andes团队打造全球最顶尖高效大规模AI推理加速器 (Nov. 18, 2025)
- QuickLogic 的 EFPGA 硬核 IP 被 Chipus 选中，用于 12 纳米高性能数据中心 ASIC。 (Nov. 18, 2025)
- 上汽赛宝携手西门子，利用数字孪生技术，加快车载芯片验证流程 (Nov. 18, 2025)
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- Ceva携手大有半导体为工业物联网领域打造1GHz以下可重置无线SoC解决方案 (Nov. 17, 2025)
- ICCAD 2025 - 芯动科技邀您相约成都 (Nov. 17, 2025)
- 韩企巨头宣布韩国投资计划 三星未来5年拟投入超3100亿美元 (Nov. 17, 2025)
- Ceva荣获物联网Evolution World颁发的2025年物联网边缘计算卓越奖 (Nov. 17, 2025)
- 经济学人：2026年底中国有望满足国内大部分AI芯片需求 (Nov. 16, 2025)
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- 智原科技将参与ICCAD 2025 展示AI时代的芯实力 (Nov. 14, 2025)
- 对话Ceva：深度融合"连接、感知、推理"，积极拥抱中国市场 (Nov. 14, 2025)
- IntelPro采用Ceva Wi-Fi 6与蓝牙5 IP，推出支持Matter协议的AIoT系统级芯片 (Nov. 14, 2025)
- 客户案例 - Imagination GPU助力安霸 CV3-AD655 环视系统 (Nov. 14, 2025)
- 连续三年！牛芯半导体再获"中国芯"关键基础支撑优秀产品奖 (Nov. 14, 2025)
- ICCAD 2025 - 锐成芯微邀您共赴成都之约 (Nov. 14, 2025)
- 灿芯半导体邀您共赴ICCAD-Expo 2025！ (Nov. 14, 2025)
- CAST 推出用于高质量机内静止图像压缩的 JPEG XL 编码器 IP 核 (Nov. 14, 2025)
- 芯原与谷歌联合推出开源Coral NPU IP (Nov. 13, 2025)
- ICCAD 2025，牛芯半导体邀您相聚成都！ (Nov. 13, 2025)
- 中芯国际发布25Q3财报 销售收入为23.82亿美元 (Nov. 13, 2025)
- Perceptia 更新基于格芯（GlobalFoundries）22FDX工艺平台的 pPLL03 设计套件 (Nov. 12, 2025)
- Cadence旗下的Secure-IC推出Securyzr™ Xperience，开启安全创新体验新门户 (Nov. 12, 2025)
- CAST CAN IP内核客户突破200家 (Nov. 11, 2025)
- CAST突破CAN IP核客户200余家 (Nov. 11, 2025)
- ICCAD-Expo 2025 成都站 — 与Andes晶心科技相约！探索RISC-V芯片创新力量 (Nov. 11, 2025)
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- Ceva与Microchip Technology合作，推动边缘设备和数据中心基础设施的人工智能加速。 (Nov. 05, 2025)
- CAST推出全新后量子密码学内核系列，扩展其安全IP产品线 (Nov. 05, 2025)
- X100 系统安全防护：RISC-V 边缘端的 AI (Nov. 04, 2025)
- SIA：全球半导体销售额 2025Q3 环比增长 15.8%，9 月同比增长 25.1% (Nov. 04, 2025)
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- 报名 SiFive 网络研讨会，探索 RISC-V 如何驱动 AI/ML 技术最前沿！ (Oct. 04, 2024)
- 传IBM、富士通考虑投资晶圆代工厂Rapidus (Oct. 04, 2024)
- 感谢参加Tower Semiconductor全球技术研讨会的嘉宾 (Oct. 04, 2024)
- Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs (Oct 03, 2024)
- Xiphera Partners with IPro for the Israeli Chip Design Market (Oct 03, 2024)
- Launching MosChip DigitalSky™ for Building Connected Intelligent Enterprises (Oct 03, 2024)
- BrainChip 发布超低功耗人工智能加速协处理器 (Oct. 03, 2024)
- Achronix Releases Groundbreaking Speedster AC7t800 Mid-Range FPGA, Driving Innovation in AI/ML, 5G/6G and Data Center Applications (Oct 02, 2024)
- EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP (Oct 02, 2024)
- Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes (Oct 02, 2024)
- 高通完成2亿美元收购Sequans 4G物联网技术 (Oct. 02, 2024)
- M31荣获MSCI ESG评级「A」级殊荣迈向永续发展新里程 (Oct. 02, 2024)
- BrainChip Introduces Lowest-Power AI Acceleration Co-Processor (Oct 01, 2024)
- RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs (Oct 01, 2024)
- MulticoreWare collaborates with Arm to optimize and advance x265 video encoding on AWS Graviton4 (Oct 01, 2024)
- Comcores announces the launch of the Centralized Network Configurator for TSN-based networks (Oct 01, 2024)
- QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time (Oct 01, 2024)
- 赛昉芯驱动 | 全球首款 RISC-V 工业防火墙荣获网络安全创新大奖 (Sept. 30, 2024)
- Paul Williamson on Edge AI, Llama 3.2 on Arm (Sep 30, 2024)
- Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports (Sep 30, 2024)
- Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology (Sep 30, 2024)
- Qualcomm and Sequans Complete Sale of 4G IoT Technology (Sep 30, 2024)
- Gartner发布2024 年新兴技术成熟度曲线 (Sept. 30, 2024)
- 日本调查公司：中国芯片技术仅落后台积电3年 (Sept. 29, 2024)
- IAR全面支持国科环宇AS32X系列RISC-V车规MCU (Sept. 29, 2024)
- 有预测称,世界最大的代工(半导体委托生产)企业台湾TSMC得益于人工智能(AI)需求的强势,有望在下半年创下历史最高业绩。 (Sept. 29, 2024)
- 西门子 Simcenter Testlab 更新，增强协同能力，减少原型依赖 (Sept. 29, 2024)
- 中国信通院发布量子计算测评体系1.0 (Sept. 29, 2024)
- 台积电与 Cadence 合作提供 AI 驱动的先进节点设计流程、硅验证 IP 和 3D-IC 解决方案 (Sept. 27, 2024)
- Achronix加入台积电（TSMC）半导体知识产权（IP）联盟计划 (Sept. 27, 2024)
- 完整IP平台加速智能高效双引擎 (Sept. 27, 2024)
- 下一代PCIe5.0/6.0技术热潮趋势与测试挑战 (Sept. 27, 2024)
- 英特尔推出一颗128核心256线程的"算力炸弹"：至强6性能核处理器背后有什么技术？ (Sept. 27, 2024)
- EnSilica joins TSMC Design Center Alliance (Sep 26, 2024)
- Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design (Sep 26, 2024)
- EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP (Sep 26, 2024)
- Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP (Sep 26, 2024)
- M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process (Sep 26, 2024)
- eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes (Sep 26, 2024)
- Siemens extends collaboration with TSMC to advance integrated circuit and systems design (Sep 26, 2024)
- TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions (Sep 26, 2024)
- SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment (Sep 26, 2024)
- MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface To Enable Emerging Vehicle Architectures (Sep 26, 2024)
- Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America (Sep 26, 2024)
- Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award (Sep 26, 2024)
- 台积电封装业务正在疯狂扩产 (Sept. 26, 2024)
- EnSilica加入台积电设计中心联盟 (Sept. 26, 2024)
- MIPI联盟发布A-PHY v2.0，将汽车SerDes接口的最大数据速率翻倍以支持新兴的车辆架构 (Sept. 26, 2024)
- 锐成芯微荣获"2024金芯奖"，助力汽车电子创新潮流 (Sept. 26, 2024)
- 边缘GPU算力开启智能安防新纪元 (Sept. 26, 2024)
- 牛芯半导体亮相ICDIA 2024 (Sept. 26, 2024)
- 功率半导体各品类及下游应用市场空间分析 (Sept. 26, 2024)
- SIAE Microelettronica 选择 Ensilica 作为主要合作伙伴来设计下一代电信设备的 ASIC (Sept. 26, 2024)
- Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET and Advanced CMOS Technologies (Sep 25, 2024)
- Introducing a Versatile 1G Ethernet PHY IP Core with BroadR-Reach™ Technology for Automotive and Industrial Applications (Sep 25, 2024)
- Certus Semiconductor releases I/O library in TowerJazz's 65nm process (Sep 25, 2024)
- Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design (Sep 25, 2024)
- 台积电2nm小规模试产 (Sept. 25, 2024)
- SiFive 推出 Intelligence XM 系列加速 AI 处理，并阐述推动 RISC-V 在 AI 领域应用的关键拐点 (Sept. 25, 2024)
- 新思科技携手台积公司助力万亿晶体管时代的人工智能和多芯片系统设计 (Sept. 25, 2024)
- intoPIX 在IBC 2024 上预发布新的JPEG XSIP-Cores &SDK ，带主编码和代理编码功能 (Sept. 24, 2024)
- 確保多晶粒系統的健康與可靠度 (Sept. 24, 2024)
- 创飞芯受邀参加IDAS2024 探讨基于SONOS的低成本车规级嵌入式闪存解决方案 (Sept. 24, 2024)
- SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller (Sep 24, 2024)
- Alphawave Semi and InnoLight Extend PCIe over Optics Collaboration with Demonstration of 128Gbps Gen 7.0 over Low Latency Linear Pluggable Optics at ECOC 2024 (Sep 24, 2024)
- GUC Announces Adoption of HBM3E IP by CSP Data Center (Sep 24, 2024)
- Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications (Sep 24, 2024)
- GenAI v1-Q launched with 4 bits Quantization support to accelerate larger LLMs at the Edge (Sep 24, 2024)
- SigmaSense携手Dolphin Design提升其SDC300触控控制 器电源效率 (Sept. 24, 2024)
- 越南发布半导体产业"2030年发展策略和2050年愿景" (Sept. 24, 2024)
- XtremeSilica Successfully Ships First SDRAM Controller for Tapeout GF40nm (Sep 23, 2024)
- RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory (Sep 23, 2024)
- Alphawave Semi - Interim results for the six months ended 30 June 2024 (Sep 23, 2024)
- Comcores and Extoll successfully completed the interoperability test of Comcores JESD204C IP core and Extoll SerDes PHY (Sep 23, 2024)
- Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group (Sep 23, 2024)
- VyperCore plans 5nm RISC-V server chip and card (Sep 23, 2024)
- 锐成芯微与您相聚ICDIA 2024 (Sept. 23, 2024)
- ICDIA 2024即将开幕 赛昉科技邀您共襄盛会 (Sept. 23, 2024)
- Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum (Sep 23, 2024)
- Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio (Sep 23, 2024)
- JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents (Sep 23, 2024)
- synopsys工具的功耗计算方法 (Sept. 23, 2024)
- 据报高通公司已向英特尔提出收购要约 (Sept. 21, 2024)
- 2024 西门子 EDA 技术峰会：开启系统设计新时代 (Sept. 20, 2024)
- Arm 通过新的 PyTorch 和 ExecuTorch 集成加速从云到边的人工智能，赋能开发者即刻实现性能提升 (Sept. 20, 2024)
- SK海力士首次参加OIP论坛 AI半导体生态界开始扩张 (Sept. 20, 2024)
- 如何预防高级人工智能网络安全攻击 (Sept. 20, 2024)
- 博世CEO：全球汽车市场增长将非常缓慢 (Sept. 20, 2024)
- ICDIA2024 | 芯动科技与您相约中国集成电路设计创新大会暨IC应用博览会 (Sept. 20, 2024)
- 2024 ICDIA 创飞芯与您在无锡相遇！ (Sept. 20, 2024)
- 面向高端汽车电子和消费类应用的CAN XL 控制器 IP 及完整安全套件可立即向客户授权！ (Sept. 19, 2024)
- Cryptomathic and PQShield form strategic alliance to offer PQC solutions for code signing and data protection in compliance with latest NIST and CNSA recommendations (Sep 19, 2024)
- 三星开始量产 PCle 5.0 PM9E1 固态硬盘 (Sept. 19, 2024)
- 基于RISC-V的AI芯片，SiFive重磅发布！ (Sept. 19, 2024)
- 本土自研再上新！安谋科技发布首款"玲珑"DPU和新一代VPU (Sept. 19, 2024)
- 是德科技携手Capgemini验证了用于非地面网络的5G NR RAN解决方案 (Sept. 19, 2024)
- 算力飙升50%，Imagination发布旗舰级汽车GPU IP (Sept. 19, 2024)
- 台湾助捷克建构半导体研究中心10月正式投入运营 (Sept. 19, 2024)
- Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family (Sep 18, 2024)
- RaaS, a collaborative initiative, adopted Menta's eFPGA technology for RaaS Edge Computing platform (Sep 18, 2024)
- SiFive Highlights Key Inflection Points Driving RISC-V Adoption for AI and Introduces Intelligence XM Series for AI Workload Acceleration (Sep 18, 2024)
- Alphawave Semi to Showcase Latest Advances in AI Connectivity IP at ECOC 2024 (Sep 18, 2024)
- 西门子以人工智能赋能苏州产业智能化转型升级 (Sept. 18, 2024)
- Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing (Sep 17, 2024)
- Joachim Kunkel Joins Arteris Board of Directors (Sep 17, 2024)
- 反超台积电重回工艺世界第一 Intel最先进18A芯片即将落地 (Sept. 17, 2024)
- The CAN XL Controller IP Core with a complete safety package is now available for immediate licensing to high-end automotive and consumer applications (Sep 16, 2024)
- 運用全新早期架構探索技術避免多晶粒系統重新流片 (Sept. 16, 2024)
- Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar (Sep 16, 2024)
- Thalia launches AI-powered Layout Automation software with AMALIA 24.3 (Sep 16, 2024)
- intoPIX Pre-Releases New JPEG XS IP-Cores & SDK with Master and Proxy Encoding at IBC 2024 (Sep 16, 2024)
- Expedera Appoints Siyad Ma as New CEO to Drive Expansion, Innovation (Sep 16, 2024)
- Arm Accelerates AI From Cloud to Edge With New PyTorch and ExecuTorch Integrations to Deliver Immediate Performance Improvements for Developers (Sep 16, 2024)
- 英特爾和亞馬遜擴大戰略合作伙伴關係，幫助推進美國半導體制造業；英特爾將在Intel 18A上生產定製的人工智能芯片，並在Intel 3上生產定製的Xeon 6芯片供亞馬遜使用；多年、數十億美元的合作加速了俄亥俄州的芯片製造業的發展。 (Sept. 16, 2024)
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- 芯原出席IP SoC China 2024 (Sept. 14, 2024)
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- Logic Design Solutions launches a new version of its NVMe HOST IP Targeting embedded recorder systems (Sep 13, 2024)
- Arm Announces Appointment of Young Sohn to its Board of Directors (Sep 13, 2024)
- Enosemi and GlobalFoundries announce the availability of silicon-validated electronic-photonic design IP available in the GF Fotonix platform (Sep 13, 2024)
- 技术洞见 | UCIe封装与异构算力集成详解 (Sept. 13, 2024)
- OpenAI如何颠覆人工智能市场 (Sept. 13, 2024)
- 芯璐科技荣获2024年上海市"专精特新"中小企业荣誉称号 (Sept. 13, 2024)
- 芯璐科技荣获2024年上海市"专精特新"中小企业荣誉称号 (Sept. 13, 2024)
- Imagination Announces Highest Performance Automotive GPU IP with FuSa Advancement (Sep 12, 2024)
- Axiomise launches Essential Introduction to Practical Formal Verification Training (Sep 12, 2024)
- intoPIX Launches Access Program for Titanium Viewer and Titanium Show Apps at IBC 2024 Amsterdam (Sep 12, 2024)
- Chevin Technology, Alpha-Data & Correct Designs collaborate to deliver fast and secure data offload for NASA-JPL's Airborne Visible/Infrared Imaging Spectrometer-3 (AVIRIS-3) (Sep 12, 2024)
- 三星首批面向AI时代的QLC第九代V-NAND启动量产 (Sept. 12, 2024)
- Xiphera将开发应用在太空基础设施中的抗量子硬件安全解决方案 (Sept. 12, 2024)
- 同芯促发展｜锐成芯微出席IC World 2024大会 (Sept. 12, 2024)
- Rivos Selects Andes NX45 for Control Functions in Upcoming High-Performance RISC-V SoC (Sep 11, 2024)
- Sondrel appoints new Head of Projects (Sep 11, 2024)
- Logic Fruit Launches the Advanced Kritin iXD 6U VPX Single Board Computer (SBC) (Sep 11, 2024)
- 芯原成都荣获"2024年四川省企业技术中心"认定 (Sept. 11, 2024)
- intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology (Sep 10, 2024)
- BrainChip Identifies Advantages to Radar and Lidar Systems Leveraging Event-Based AI (Sep 10, 2024)
- Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps (Sep 10, 2024)
- Sondrel announces Advanced Modelling Process for AI chip designs (Sep 10, 2024)
- Rambus Announces Industry-First HBM4 Controller IP to Accelerate Next-Generation AI Workloads (Sep 10, 2024)
- Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets (Sep 10, 2024)
- Xiphera Develops Quantum-Resilient Hardware Security Solutions for Space (Sep 10, 2024)
- TSMC August 2024 Revenue Report (Sep 10, 2024)
- EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP (Sep 10, 2024)
- ZeroPoint Technologies Releases New Hardware-Accelerated Memory Optimization Solutions and Receives Industry Recognition for Innovation (Sep 10, 2024)
- Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design (Sep 10, 2024)
- Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless Company (Sep 09, 2024)
- 美国、英国、欧盟将签署首份AI标准协议 (Sept. 09, 2024)
- SMIC cuts capex and R&D (Sep 09, 2024)
- Semidynamics on major recruitment drive for RISC-V software engineers (Sep 09, 2024)
- T2M IP Unveils Advanced H.264 and H.265 HEVC Codec IP Cores for High-Efficiency Video Solutions (Sep 09, 2024)
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- Alphawave Semi "Redefines Connectivity" in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects (Sep 09, 2024)
- GlobalFoundries 与 Silicon Catalyst 携手为半导体初创企业加速提供差异化技术解决方案 (Sept. 09, 2024)
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- 倪光南院士：RISC-V提供硬件定制新路径 (Sept. 09, 2024)
- 上海设立未来产业基金，规模达100亿元 (Sept. 08, 2024)
- 工信部公布三项智能网联汽车强制性国家标准 (Sept. 08, 2024)
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- 深度学习——学习模型的深层神经网络 (Sept. 06, 2024)
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- UMC Reports Sales for August 2024 (Sep 05, 2024)
- GUC Monthly Sales Report - August 2024 (Sep 05, 2024)
- CAST Ships I2C/SPI Controller IP Core for Easier Serial Communication (Sep 05, 2024)
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- 英特尔至强处理器在AISBench测试中展现卓越AI大模型推理性能 (Sept. 05, 2024)
- 芯动科技与腾讯云达成战略合作，为客户打造一站式芯片设计服务云平台 (Sept. 05, 2024)
- 通过超低功耗ULP和ULL工艺验证的22nm 节点USB 3.0 IP已完成10多家全球客户授权 (Sept. 04, 2024)
- SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development (Sep 04, 2024)
- Global Semiconductor Sales Increase 18.7% Year-to-Year in July (Sep 04, 2024)
- SiliconAuto 采用西门子 PAVE360 软件加速硅前 ADAS SoC 开发 (Sept. 04, 2024)
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- SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market (Sep 02, 2024)
- Advanced USB 3.0 IP in 22nm boasting a very low power ULP and ULL Technology Licensed to Over 10 Global Customers (Sep 02, 2024)
- DeepX Hints At Next-Gen AI Chips (Sep 02, 2024)
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- Intel considers foundry split, fab cancellations (Sep 02, 2024)
- SiFive 携手开阳电子进军高端车用 SoC 领域，推动 RISC-V 在汽车电子发展 (Sept. 02, 2024)
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产品升级！亚科鸿禹推出更大规模验证容量的融合Emulator--HyperSemu2.0！
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- TSMC December 2023 Revenue Report (Jan 10, 2024)
- Sunplus and Ceva Expand Collaboration to Bring Bluetooth Audio to the airlyra SoC Family for Wireless Speakers, Soundbars and other Wireless Audio Devices (Jan 10, 2024)
- intoPIX Showcases Groundbreaking Sensorand Video Compression Technologies at CES 2024 (Jan 10, 2024)
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- Valens Semiconductor and Intel Foundry Services Announce Strategic Relationship for Next Generation A-PHY Product (Jan 09, 2024)
- Comcores JESD204D IP core conforming to the Revision D of the JESD204 standard released in Dec'2023 now available (Jan 09, 2024)
- VeriSilicon's 2nd generation automotive ISP series IP passed ISO 26262 ASIL B and ASIL D certifications (Jan 09, 2024)
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- 2024年多晶粒(multi-die)系統的下一步 (Jan. 09, 2024)
- 芯原第二代面向汽车应用的ISP系列IP已通过ISO 26262 ASIL B和ASIL D认证 (Jan. 09, 2024)
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- MIPS Launches New Corporate Brand At CES 2024 (Jan 09, 2024)
- Semiconductor Market: Rebound Expected in 2024, But Challenges Lie Ahead (Jan 09, 2024)
- GUC Taped Out UCIe 32G IP using TSMC's 3nm and CoWoS Technology (Jan 09, 2024)
- Ceva and THX Ltd. Partner to Bring Premium Spatial Audio to Hearables, Consumer and Mobile Products (Jan 09, 2024)
- Andes Technology and Spacetouch Collaborate to Unveil High-Tech Edge-Side AI Audio Processor Featuring the Powerful RISC-V AndesCore™ D25F (Jan 09, 2024)
- Thalia's AMALIA qualified on 12nm FinFET technology (Jan 09, 2024)
- VeriSilicon extends watch GUI ecosystem in partnership with QDay Technology for enhanced user experience (Jan 09, 2024)
- 芯原第二代面向汽车应用的ISP系列IP已通过ISO 26262 ASIL B和ASIL D认证 (Jan. 09, 2024)
- The SHD Group Has Released a Complimentary Version of the 2024 RISC-V Market Analysis Report Containing Current Market Data and Future Projections (Jan 08, 2024)
- DisplayPort v1.4 Tx PHY and Controller IP Cores which is Silicon proven in 12nm technology and also production proven is available for Worldwide instant licensing (Jan 08, 2024)
- OPENEDGES Achieves ISO9001: 2015 Certification, Proving IP Quality for its Customers (Jan 08, 2024)
- Electronic System Design Industry Posts Record $4.7 Billion in Revenue in Q3 2023, ESD Alliance Reports (Jan 08, 2024)
- Comcores JESD204D IP core confirming to the Revision D of the JESD204 standard released in Dec'2023 now available (Jan 08, 2024)
- Creonic GmbH Joins the Science and Innovation Alliance Kaiserslautern (Jan 08, 2024)
- VeriSilicon unveils the new VC9800 IP for next generation data centers (Jan 08, 2024)
- Ceva and India's No. 1 Audio and Wearable Brand, boAt, Announce Strategic Partnership to Enhance the Wireless Audio Experience (Jan 08, 2024)
- Cadence Acquires Invecas to Accelerate System Realization (Jan 08, 2024)
- BrainChip and NVISO Group Demonstrate AI-Enabled Human Behavioral Analysis at CES 2024 (Jan 08, 2024)
- Ceva Expands AI Ecosystem for its Class-Leading NPU IP with New Partnerships for Automotive and Edge AI (Jan 08, 2024)
- 芯原推出面向下一代数据中心的全新VC9800系列IP (Jan. 08, 2024)
- 芯原推出面向下一代数据中心的全新VC9800系列IP (Jan. 08, 2024)
- 为加强RISC-V研发，MIPS挖了SiFive的墙角！ (Jan. 08, 2024)
- 2023傑出資訊人才系列報導-林志明 (Jan. 08, 2024)
- 中國中科院發表「浙江大晶片」架構，一片晶圓只做一個處理器、22nm也能造出1600核心 (Jan. 06, 2024)
- 博世、英飞凌等五家欧美半导体公司在德国成立新公司，普及车载RISC-V (Jan. 06, 2024)
- UMC Reports Sales for December 2023 (Jan 05, 2024)
- GUC Monthly Sales Report - December 2023 (Jan 05, 2024)
- Andes Announces General Availability of the New RISC-V Out-Of-Order Superscalar Multicore Processor, the AndesCore™ AX65 (Jan 05, 2024)
- Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift™ Data Converters (Jan 05, 2024)
- Socionext to Showcase Leading-Edge Technologies at CES 2024, Featuring Custom SoC Solutions, Low Power Sensors, Smart Display Controller, and Advanced Image Processor (Jan 05, 2024)
- AI 2024：回望哇声一片，前瞻道阻且长 (Jan. 05, 2024)
- Gartner发布2024年网络安全9大趋势 (Jan. 05, 2024)
- MulticoreWare and Imagination collaboration accelerates automotive compute workloads (Jan 04, 2024)
- Faraday Collaborates in Arm Total Design to Provide Arm Neoverse CSS-based Design Services (Jan 04, 2024)
- German Court Fines Netflix €7.05 Million for Continued Infringement of Broadcom HEVC Patent (Jan 04, 2024)
- BrainChip to Unveil Akida Neuromorphic Processor Enabled by Microchip's 32-bit MPU at CES 2024 (Jan 04, 2024)
- VESA Updates Adaptive-Sync Display Standard with New Dual-Mode Support (Jan 04, 2024)
- 年底 3nm 产能利用率达 80%，消息称台积电将接下英伟达、高通等公司的 N3E 订单 (Jan. 04, 2024)
- 英特尔将于2月公布Intel 18A后的新工艺路线图 (Jan. 04, 2024)
- 智原与Arm合作提供基于Arm Neoverse CSS的设计服务 (Jan. 04, 2024)
- M31成功驗證12奈米USB4 PHY IP 助力新世代高速數據傳輸 (Jan. 04, 2024)
- 【產業研究報告】年成長率高達40%的崛起產業，由淺入深一起認識RISC-V指令集 (Jan. 04, 2024)
- 英特尔Intel破冰新领域 成立新AI公司Articul8 AI (Jan. 04, 2024)
- Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports (Jan 03, 2024)
- Arm PCs Get a New Lease on Life (Jan 03, 2024)
- M31 Successfully Validates 12nm USB4 PHY IP Empowering Next-Generation High-Speed Data Transmission (Jan 03, 2024)
- Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT (Jan 03, 2024)
- MIPS Welcomes New Executives as Part of Company's Growth and Expansion (Jan 03, 2024)
- Crypto Quantique 和汉芝电子( iMQ) 联手打造量子安全ship-to-cloud连接方案 (Jan. 03, 2024)
- Accelerate Innovation: Harnessing the Speed of Tomorrow with PCIe Gen 4 PHY and Controller IP Cores (Jan 02, 2024)
- Siemens EDA faces Chinese startup competitor (Jan 02, 2024)
- ELECTRA IC Marks a Decade of Design and Verification Excellence at CES 2024 (Jan 02, 2024)
- Synopsys plus Ansys: The making of an EDA giant? (Jan 02, 2024)
- 台积电第一家日本工厂即将开张 预生产28nm工艺芯片 (Jan. 02, 2024)
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- 扛起数据中心大旗，迈向更多高性能领域 | 赛昉科技2023年度盘点 (Jan. 02, 2024)
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- 【回顾】2023年热点技术归纳总结 (Dec. 31, 2023)
- 2023汽车行业十大新闻 (Dec. 30, 2023)
- BrainChip Awarded Latest Patent for Event-Based Pattern Detection (Dec 29, 2023)
- 台积电谈Chiplet：不去主导，建立平台，一起发展！ (Dec. 29, 2023)
- PCIe 6.0产品将在2024年开始商用 IP提供商已准备好构建基于新协议的芯片 (Dec. 29, 2023)
- 【展望2024】Cadence：助力半导体产业，全力推进AI驱动EDA (Dec. 29, 2023)
- 【展望2024】Imagination：持续投入新品开发，满足四大市场IP需求 (Dec. 29, 2023)
- 台积电TSMC研发团队获特别贡献奖 2nm工艺或取得突破 (Dec. 29, 2023)
- PCIe 6.0 距离 2024 年上市又近了一步：Alphawave 展示了互操作性 (Dec. 29, 2023)
- Rambus Advances Data Center Server Performance with Industry-First Gen4 DDR5 RCD (Dec 28, 2023)
- Established "Advanced SoC Research for Automotive" with 12 companies, led by automotive manufacturers (Dec 28, 2023)
- 2024年七大网络安全威胁 (Dec. 28, 2023)
- 台积电首提 1nm A10 工艺，计划到 2030 年实现 1 万亿晶体管的单个芯片封装 (Dec. 28, 2023)
- Can There Be Any Doubt? In Our Industry, 2023 Was 'The Year of AI' (Dec. 28, 2023)
- 实现最高效的数据转换：深入了解Achronix JESD204C解决方案 (Dec. 27, 2023)
- Rambus 通过业界首款第四代 DDR5 RCD 提升数据中心服务器性能 (Dec. 27, 2023)
- M31明年營運樂觀 衝千元成台股第13千金 (Dec. 27, 2023)
- 百家跨國公司看中國丨意法半導體曹誌平：持續完善在華產業鏈部署 (Dec. 27, 2023)
- 芯原科技获临港新片区2023年企业研发创新机构认定 (Dec. 26, 2023)
- 晶心盃RISC-V創意大賽成績揭曉 百萬獎金鼓勵學子參與 (Dec. 26, 2023)
- 智原推出14纳米ASIC整合设计服务 加速迈向人工智能新时代 (Dec. 26, 2023)
- 车规应用，RISC-V架构如何发力？ (Dec. 26, 2023)
- Samsung, Intel Gear Up for Intense Competition in 2-NM Semiconductor Process, Chasing TSMC (Dec. 26, 2023)
- 一座2纳米晶圆厂的造价预计高达280亿美元 比3纳米工艺高出多达50% (Dec. 25, 2023)
- 芯原股份拟募资定增18.08亿元，将投建Chiplet、新一代IP研发项目 (Dec. 24, 2023)
- Synopsys拟收购Ansys|工业软件发展史就是并购史 (Dec. 24, 2023)
- Five Leading Semiconductor Industry Players Incorporate New Company, Quintauris, to Drive RISC-V Ecosystem Forward (Dec. 22, 2023)
- 基辛格：英特尔18A略优于台积电N2 两年内实现技术领先 (Dec. 22, 2023)
- tomshardware报道，据可靠信息来源，中芯国际在开发3nm工艺技术 (Dec. 22, 2023)
- 生成式人工智能如何改变数据中心的要求？ (Dec. 22, 2023)
- Tiempo Secure's Unique IP Expertise Required to Secure First Post Quantum Sovereignty Chip (Dec 21, 2023)
- Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development (Dec 21, 2023)
- XYALIS unveils Hartroid: A Strategic Initiative to Counter Hardware Trojans in Defense Systems (Dec 21, 2023)
- Is Software and Hardware Ready for TinyML Tsunami? (Dec 21, 2023)
- Synopsys Acquires RISC-V Processor Simulation Tools Firm (Dec 21, 2023)
- 睿思芯科：携手开源社区共筑未来RISC-V生态 (Dec. 21, 2023)
- GlobalLogic Announces Acquisition of Mobiveil (Dec 20, 2023)
- Top Ten IC Design Houses Ride Wave of Seasonal Consumer Demand and Continued AI Boom to See 17.8% Increase in Quarterly Revenue in 3Q23, Says TrendForce (Dec 20, 2023)
- TSMC Announces Dr. Mark Liu Not to Participate in Next Board of Directors Election (Dec 20, 2023)
- Reed Solomon Encoder and Decoder FEC IP Core From Global IP Core (Dec 20, 2023)
- Siemens collaborates with sureCore and Semiwise to pioneer quantum computing ready cryogenic semiconductor designs (Dec 20, 2023)
- 精准对接产业需求，西门子携手生态伙伴共建制造行业产教融合共同体 (Dec. 20, 2023)
- 2023 MRAM Forum Shows MRAM For Automotive And Other Applications (Dec. 20, 2023)
- ST Engineering Acquires D'Crypt to Strengthen its Cyber Capabilities (Dec 19, 2023)
- VeriSilicon and Google Collaborate on the Open-Source Project Open Se Cura (Dec 19, 2023)
- ST Engineering Acquires D'Crypt to Strengthen its Cyber Capabilities (Dec 19, 2023)
- 芯原与谷歌携手合作开源项目Open Se Cura (Dec. 19, 2023)
- Takashi Yamada, Memory Industry Expert Joins OPENEDGES to Lead Japan Business (Dec 19, 2023)
- Intrinsic ID to Showcase New Embedded Security Solutions at CES 2024 (Dec 19, 2023)
- 晶心科技、TASKING與MachineWare三方合作 推動RISC-V ASIL合規汽車用晶片快速開發 (Dec. 19, 2023)
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- Infineon, POLYN to Collaborate on Advanced Tire Monitoring Products (Dec 18, 2023)
- ARM重组中国软件业务 裁员70多名工程师 (Dec. 18, 2023)
- Apple-TSMC-Amkor Pact Bolsters U.S. Chip Supply Chain (Dec 18, 2023)
- Igniting Innovation: Siemens EDA launches Cre8Ventures in support of the EU Chips Act (Dec 18, 2023)
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- 台积电全面展开1.4nm级工艺制程研发，命名为A14 (Dec. 15, 2023)
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- 西门子成都数字化工厂获评世界经济论坛"可持续灯塔工厂" (Dec. 15, 2023)
- BSC presents Sargantana, the new generation of the first open-source chips designed in Spain (Dec 15, 2023)
- Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity (Dec 14, 2023)
- T2M 发布超高精度、支持无缝集成的12位 2G/s高速ADC IP，客户可立即获得技术授权 (Dec. 14, 2023)
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- Amidst export restrictions, RISC-V continues to advance (Dec 14, 2023)
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- Neurxcore leverages Aedvices VIPs for the verification of its neural processors (Dec 14, 2023)
- QC Design announces launch of fault-tolerance design automation tool Plaquette+ and first sale to QuiX Quantum (Dec 14, 2023)
- Imec's extremely scaled SOT-MRAM devices show record low switching energy and virtually unlimited endurance (Dec 14, 2023)
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- Visit Quadric at CES to Discover the GPNPU that Solves The Biggest ML Inference Chip Design Challenges (Dec 12, 2023)
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- Andes Awards Imperas 2023 Partner of the Year (Dec 12, 2023)
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- TSMC November 2023 Revenue Report (Dec 08, 2023)
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- What Is Holding Back Neuromorphic Computing? (Dec 07, 2023)
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- 2023年Q3全球十大晶圆代工厂排名出炉 (Dec. 07, 2023)
- 联电11月营收同比下降16.7%，Q4利用率预计为61%~63% (Dec. 07, 2023)
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- Pragmatic Semiconductor secures £182m ($231m) investment led by M&G and UK Infrastructure Bank (Dec 06, 2023)
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- Global Semiconductor Sales Increase 3.9% Month-to-Month in October; Annual Sales Projected to Increase 13.1% in 2024 (Dec 06, 2023)
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- JEDEC Publishes New CAMM2 Memory Module Standard (Dec 06, 2023)
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- ProvenRun secures €15 million Series A to accelerate its growth in security-by-design for the Internet of Things (IoT) (Dec 06, 2023)
- Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation (Dec 06, 2023)
- Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities (Dec 06, 2023)
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- GUC Monthly Sales Report - November 2023 (Dec 05, 2023)
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- Gartner Forecasts Worldwide Semiconductor Revenue to Grow 17% in 2024 (Dec 04, 2023)
- USPTO announces Semiconductor Technology Pilot Program in support of CHIPS for America Program (Dec 04, 2023)
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- 工业化架构芯片最佳PPA并非绝对，RISC-V厂商如何通过定制计算取得优势？ (Dec. 01, 2023)
- Faraday Receives ISO/IEC 27001:2022 Certification for Information Security Management System (Dec 01, 2023)
- Leadership Spotlight: Sanjeev Kumar Earns Global CEO Business Excellence Award (Dec 01, 2023)
- Lockheed Martin Prepares First 5G.MIL® Payload for Orbit (Dec 01, 2023)
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- Renesas Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition (Nov 30, 2023)
- Agile Analog's New VP Sales to Expand Ties With Foundries (Nov 30, 2023)
- QuickLogic Secures New eFPGA IP Contract on UMC's 22nm Process (Nov 30, 2023)
- BrainChip Details Olfactory Capabilities of Identifying Bacteria in the Blood in New Research Report (Nov 30, 2023)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2023 (Nov 30, 2023)
- Agnisys Announces Wacom Selects IDesignSpec™ to Automate Its IP and Chip Development Flow from Executable Specifications (Nov 30, 2023)
- Credo Technology Group Holding Ltd Reports Second Quarter of Fiscal Year 2024 Financial Results (Nov 30, 2023)
- Cadence Signoff Solutions Empower Samsung Foundry's Breakthrough Success on 5G Networking SoC Design (Nov 30, 2023)
- 台积电获英特尔140亿美元大单 (Nov. 30, 2023)
- 网络安全领域的12个大语言模型用例 (Nov. 30, 2023)
- 功能安全性与完整性对汽车定位解决方案的重要性 (Nov. 30, 2023)
- 瑞萨推出第一代32位RISC-V CPU内核 (Nov. 30, 2023)
- Intel to place US$14 billion orders with TSMC, says report (Nov 29, 2023)
- Quantum Effect Technology Breakthrough in Analog Circuit Design (Nov 29, 2023)
- Untether AI Joins UCIe Consortium to Drive Chiplet Technology and Energy-Centric AI Acceleration (Nov 29, 2023)
- Manufacturers Anticipate Completion of NVIDIA's HBM3e Verification by 1Q24; HBM4 Expected to Launch in 2026, Says TrendForce (Nov 29, 2023)
- Logic Fruit Technologies Launches LIN Master Slave IP Core (Nov. 29, 2023)
- Eliyan Appoints former head of Facebook/Meta AI infrastructure Dr. Jason Taylor to Board of Directors (Nov 29, 2023)
- M31 Completes Validation of 7nm ONFI 5.1 I/O IP - Targeting for the Global AI Big Data Storage Market (Nov 29, 2023)
- Unleashing Edge AI Potential: Eta Compute's New Collaboration with NXP Semiconductors (Nov 29, 2023)
- Omni Design Technologies Announces Expanded Silicon IP Solutions on Multiple TSMC Processes (Nov 29, 2023)
- 从 L1~L5 自动驾驶芯片发生了哪些变化？ (Nov. 29, 2023)
- 256核！赛昉科技发布全新RISC-V众核子系统IP平台 (Nov. 29, 2023)
- M31 開發驗證7奈米ONFi5.1 IO IP 佈局全球人工智慧大數據存儲市場 (Nov. 29, 2023)
- Production Proven USB 3.2 Gen1/Gen2 IP Cores to ensure a seamless throughput for Next-Gen SoCs available for Immediate licensing (Nov 28, 2023)
- 運用類比式記憶體運算In-Memory Computing技術 晶心科技與 TetraMem 合作打造突破性人工智慧加速器晶片 (Nov. 28, 2023)
- Bridging the Talent Gap in Flanders' Semiconductor Industry (Nov 28, 2023)
- Arteris Celebrates 3rd Year of Automotive ISO 26262 TCL1 Functional Safety Compliance for Magillem SoC Integration Automation (Nov 28, 2023)
- Jayson Bethurem Joins Flex Logix as VP Marketing & Business Development (Nov 28, 2023)
- 芯原股份戴伟民：Chiplet会在AIGC和智慧驾驶领域率先落地 (Nov. 27, 2023)
- 西门子携手舍弗勒，共同推进生成式人工智能辅助工具Industrial Copilot的落地应用 (Nov. 27, 2023)
- Tenstorrent Gains Momentum in Asia With Rapidus Partnership (Nov 27, 2023)
- Market Leaders Collaborate with Synopsys to Realize Gains of Generative AI Across Synopsys.ai Full EDA Stack (Nov 27, 2023)
- 台积电会在日本落地3纳米芯片？ (Nov. 24, 2023)
- 量子计算对机器学习算法的革命性影响 (Nov. 24, 2023)
- 嵌入式FPGA IP正在发现更广阔的用武之地 (Nov. 24, 2023)
- 聯華電子「綠獎」八年催生68件環境解方 (Nov. 24, 2023)
- 三星2022年注册8531项专利 成全球最具创新力公司 (Nov. 24, 2023)
- 音频设备头部OEM厂家采用T2M提供的LC3plus音频编解码器设计 (Nov. 23, 2023)
- Arm Extends Cortex-M Portfolio to Bring AI to the Smallest Endpoint Devices (Nov 23, 2023)
- Axelera AI Platform Accelerates Edge Application Deployment (Nov 23, 2023)
- BrainChip Announces Dr. Tony Lewis as the New Chief Technology Officer (Nov 23, 2023)
- LeWiz Open Source LVDS Transceiver Design (Nov 23, 2023)
- Broadcom Completes Acquisition of VMware (Nov 23, 2023)
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- 西门子推出云端 PAVE360，加速汽车行业创新 (Nov. 23, 2023)
- 2023汽车电子创新周开幕式暨第三届智能网联汽车技术大会成功召开 (Nov. 23, 2023)
- Arm 扩展 Cortex-M 产品组合，将人工智能引入超小型端点设备 (Nov. 23, 2023)
- LC3plus audio codec software licensed by major Audio OEM (Nov 22, 2023)
- VeriSilicon's Vector Graphics GPU is selected by LG Electronics (Nov 22, 2023)
- Agile Analog appoints former GUC Europe President as new VP of Sales (Nov 22, 2023)
- Arm Extends Cortex-M Portfolio to Bring AI to the Smallest Endpoint Devices? (Nov 22, 2023)
- Alchip Unveils Industry's First Automotive ASIC Design Platform (Nov 22, 2023)
- LG電子採用芯原向量圖形GPU (Nov. 22, 2023)
- Secure-IC宣布SecuryzrTM技术已集成到MediaTek的全新旗舰智能手机芯片Dimensity 9300 (Nov. 22, 2023)
- Xiphera's Crypto Module Offers Customisable Offload and Acceleration Solutions (Nov 21, 2023)
- New RISC-V processors address demand for open source and performance (Nov 21, 2023)
- Weebit Nano receives wafers manufactured in GlobalFoundries' 22FDX® process (Nov 21, 2023)
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- 首款可自動解決EM-IR違規的生成式AI技術 (Nov. 21, 2023)
- Secure-IC strengthens its innovation leadership in embedded cybersecurity with the acquisition of eShard patents portfolio (Nov 21, 2023)
- Weebit Nano's ReRAM IP achieves high temperature qualification in SkyWater Technology's S130 process (Nov 20, 2023)
- 台积电扩产SoIC 明年月产能将超3000片 (Nov. 20, 2023)
- 西门子荣膺第七届CSR中国教育奖 (Nov. 20, 2023)
- Insyde Software Becomes the First Independent BIOS Vendor to Achieve Arm SystemReady SR-SIE Certification for the NVIDIA GH200 Grace Hopper Superchip Platform (Nov 20, 2023)
- Rapidus and Tenstorrent Partner to Accelerate Development of AI Edge Device Domain Based on 2nm Logic (Nov 17, 2023)
- Green Mountain Semiconductor Participates in Unveiling of Innovative AI processor (Nov 17, 2023)
- 不满足2纳米芯片，日本Rapidus与东京大学和法国Leti合作剑指1纳米 (Nov. 17, 2023)
- 国内首款 14nm Chiplet大模型推理芯片发布 (Nov. 17, 2023)
- 芯原股份戴伟民：Chiplet将在AIGC与智慧驾驶领域率先落地 (Nov. 17, 2023)
- 深、北、上三城联动，Arm年度技术大会为您献上年度"未来计算"盛宴 (Nov. 17, 2023)
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- 新思科技与微软合作，引入生成式AI Copilot加速芯片设计 (Nov. 17, 2023)
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- 西门子再出手收购 Insight EDA 扩展 Calibre 可靠性验证系列 (Nov. 17, 2023)
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- Thalia's AMALIA (23.4a) qualified on Siemens AFS for increased analog design migration flexibility (Nov 16, 2023)
- Secure-IC announces the integration of Securyzr™ technology in MediaTek's new flagship smartphone chip, Dimensity 9300 (Nov 16, 2023)
- Faraday Unveils Enhanced Gigabit Ethernet PHY on UMC's 28HPC+ Process (Nov 16, 2023)
- Siemens acquires Insight EDA to expand Calibre integrated circuit reliability verification offering (Nov 16, 2023)
- Mixel Celebrates 25 Years of Mixed-Signal Excellence (Nov 16, 2023)
- QuickLogic Announces New Aurora™ FPGA/eFPGA User Tools with Enhancements for Reconfigurable Computing (Nov 16, 2023)
- Arm Collaborates with Microsoft on Custom Silicon to Unlock Sustainable, AI-Driven Infrastructure (Nov 16, 2023)
- Scale FD-SOI to 7nm? Yes, We Can (Nov 16, 2023)
- Bringing Arm TCS23 to Life on Next-gen Flagship Smartphones with MediaTek and vivo (Nov 16, 2023)
- 英特尔CEO："四年五个制程节点"进展正在得到第三方肯定 (Nov. 16, 2023)
- AndeSentry™ 安全合作框架實現全面的RISC-V資訊安全解決方案 (Nov. 16, 2023)
- 智原推出新一代乙太網路GPHY於聯電28HPC+平台 (Nov. 16, 2023)
- 《各報要聞》陸晶圓代工成熟製程 明年爆量 (Nov. 16, 2023)
- Synopsys Announces Synopsys.ai Copilot, Breakthrough GenAI Capability to Accelerate Chip Design (Nov 15, 2023)
- Xiphera Announces a New Batch of CAVP Validated IP Cores (Nov 15, 2023)
- QuickLogic Reports Third Quarter Fiscal 2023 Results Including Record Non-GAAP Net Income (Nov 15, 2023)
- M31 Q3 Profit Surged Over 50%, Accumulated EPS NT$9.34 (Nov 15, 2023)
- Andes Technology Partners with WITTENSTEIN high integrity systems (WHIS) to Build Safety-Critical Solutions with RISC-V Processors (Nov 14, 2023)
- Arm Announces Appointment of Ami Badani as Chief Marketing Officer (Nov 14, 2023)
- 芯片制造商Imagination Technologies宣布裁员20% (Nov. 14, 2023)
- Rambus Demonstrates CXL Platform Development Kit at SC23 (Nov 14, 2023)
- Movellus Introduces Aeonic Insight™ Product Line for On-die Telemetry (Nov 14, 2023)
- Imagination to lay off 20% of staff (Nov 14, 2023)
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- Arteris Ncore Cache Coherent Interconnect IP Certified for ISO 26262 Automotive Functional Safety Standard (Nov 14, 2023)
- CXL Consortium Announces Compute Express Link 3.1 Specification Release (Nov 14, 2023)
- Siemens works with Arm and AWS to bring PAVE360 to the cloud and unlocks next generation automotive innovation (Nov 14, 2023)
- 中国服务器芯片迎来高光时刻 (Nov. 14, 2023)
- Global Semiconductor Manufacturing Industry Set for Q4 2023 Recovery, SEMI Reports (Nov 13, 2023)
- T2M-IP Presents Silicon Proven 22nm 1.5GHz Fractional-N PLL IP Core, with Dynamic Configuration for Wireless and Automotive SoCs - Licensing Now Available. (Nov 13, 2023)
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- TSMC October 2023 Revenue Report (Nov 10, 2023)
- 中芯国际：地缘政治或将引发全球芯片产能过剩 (Nov. 10, 2023)
- Cadence：应对生成式AI变革 打造"芯片到系统"AI驱动EDA全平台 (Nov. 10, 2023)
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- 张忠谋获颁"李国鼎奖"！黄仁勋：张忠谋是中国台湾科技教父！ (Nov. 10, 2023)
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- CEVA, Inc. Announces Expansion of Existing Share Repurchase Program (Nov 09, 2023)
- Accellera Announces IEEE 1666™-2023 Standard Available Through IEEE GET Program (Nov 09, 2023)
- SMIC Reports 2023 Third Quarter Results (Nov 09, 2023)
- Alphawave Semi Named One of Canada's Enterprise-Industry Leaders Winners in Deloitte's Technology Fast 50™ Program (Nov 09, 2023)
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- Arm Holdings plc Reports Results for the Second Quarter of the Financial Year Ending 2024 (Nov 09, 2023)
- SPARK Microsystems Revolutionizes Wireless Headsets with Ultra-Wideband Audio Technology (Nov 09, 2023)
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- RISC-V Pioneer SiFive Takes Stock, Realigns, Moves Forward (Nov 09, 2023)
- Cadence EMX 3D Planar Solver Certified for Samsung Foundry 8nm LPP Process Technology (Nov 09, 2023)
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- Ventana and Imagination Partner to Deliver World's Highest Performance RISC-V CPU & GPU Solutions (Nov 08, 2023)
- OpenHW Group Announces CORE-V CVA6 Platform Project for RISC-V Software Development & Testing (Nov 08, 2023)
- BeagleBoard.org Makes FPGA and RISC-V Accessible with New BeagleV-Fire Single Board Computer at $150 (Nov 08, 2023)
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- RISC-V International Marks Banner Year for RISC-V Adoption, Technical Momentum, and Community Engagement (Nov 08, 2023)
- Ventana Introduces Veyron V2 - World's Highest Performance Data Center-Class RISC-V Processor and Platform (Nov 08, 2023)
- CEVA, Inc. Announces Third Quarter 2023 Financial Results (Nov 08, 2023)
- Arteris Announces Financial Results for the Third Quarter 2023 and Fourth Quarter and Full Year 2023 Guidance (Nov 08, 2023)
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- Synopsys Expands Its ARC Processor IP Portfolio with New RISC-V Family (Nov 07, 2023)
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- Imagination launches brand new line of high-performance GPU IP with DirectX? (Nov 07, 2023)
- Andes and Vector Propel RISC-V AUTOSAR Software Innovations for the Automotive Industry (Nov 07, 2023)
- Ubilite Licenses RISC-V Application Processor IP Core from CAST (Nov 07, 2023)
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- Arteris Awarded ISO 9001 Certification for Semiconductor System IP Quality Management System (Nov 07, 2023)
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- SkyWater Announces Availability of Cadence Open-Source PDK and Reference Design for SkyWater's 130 nm Process (Nov 06, 2023)
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- NeuReality and Veriest Achieve Great Engineering Feat to Advance AI Chips for World's Largest Data Centers (Oct 25, 2023)
- Layoffs at SiFive as RISC-V upstart faces a crossroads (Oct 25, 2023)
- 安谋科技举办智能物联生态研讨会，"万物智联"时代共谋计算产业新未来 (Oct. 25, 2023)
- RISC-V 领军企业 SiFive 大裁员：20% 员工被裁，大部分是工程师 (Oct. 25, 2023)
- Semidynamics launches first fully-coherent RISC-V Tensor unit to supercharge AI applications (Oct. 24, 2023)
- 日本芯片设计商Socionext将研发3nm车用芯片 采用台积电N3A制程 (Oct. 24, 2023)
- PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology (Oct 24, 2023)
- Sofics releases its ESD technology on TSMC 3nm process (Oct 24, 2023)
- Cadence Reports Third Quarter 2023 Financial Results (Oct 24, 2023)
- Faraday Reports Third Quarter 2023 Results (Oct 24, 2023)
- Intrinsic ID Looks Back on 15 Years of Building Digital Trust (Oct 24, 2023)
- 三星电子拓展汽车工艺解决方案新战略 (Oct. 24, 2023)
- 本土RISC-V CPU IP企业芯来科技获得的ASIL D认证是什么？ (Oct. 24, 2023)
- Socionext Begins Development of SoCs for Advanced ADAS and AD Using 3nm Automotive Process (Oct 23, 2023)
- Revolutionizing Automotive Connectivity: Cutting-Edge Silicon IP Cores Now Available with T2M (Oct 23, 2023)
- Green Mountain Semiconductor Inc. awarded a contract from NASA to Pave the Way for Space-Ready Neural Processors (Oct 23, 2023)
- Qualinx's Series A Financing for All-Digital GNSS IoT Wireless Technology Hits $20 Million (Oct 23, 2023)
- lowRISC Announces Expansion of OpenTitan Project with New Hardware (Oct 23, 2023)
- Renesas Extends Tender Offer for Proposed Acquisition of Sequans (Oct 23, 2023)
- Alphawave Semi Announces Appointment of Rahul Mathur as Chief Financial Officer (Oct 23, 2023)
- ST：18nm FD-SOI工艺将在汽车电子与6G领域大展拳脚 (Oct. 23, 2023)
- 台积电Q3营收：环比增长，同比下滑，Q4或仍然下滑 (Oct. 23, 2023)
- 台积电的3nm工艺，亏大了，要10年才收回成本？ (Oct. 22, 2023)
- 发力汽车半导体，三星宣布开发业界首款车用级5nm eMRAM (Oct. 21, 2023)
- Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards (Oct 20, 2023)
- How Arm Total Design is built around 5 key building blocks (Oct 20, 2023)
- New POLYN Patent Covers Smart Tires, Industrial IoT Applications (Oct 20, 2023)
- Orthogone Technologies Unveils FPGA-Based Lightning-Fast PCIe DMA Controller Solution (Oct 20, 2023)
- Neurxcore Introduces Innovative NPU Product Line for AI Inference Applications, Powered by NVIDIA Deep Learning Accelerator Technology (Oct 20, 2023)
- RISC-V声名鹊起，究竟为何？ (Oct. 20, 2023)
- 车联网安全相关工具 (Oct. 20, 2023)
- 英特尔启动首个 AI PC 加速计划 (Oct. 20, 2023)
- 上海微系统所在300mm SOI晶圆制造技术方面实现突破 (Oct. 20, 2023)
- 时分交织流水线架构14位4.32GSps 宽带ADC，现已提供白盒授权 - 包括无限制使用权和完全修改权 (Oct. 19, 2023)
- Weebit Nano licenses ReRAM to DB HiTek, a global top-10 foundry (Oct 19, 2023)
- Cadence Collaborates with Broadcom to Implement AI-Driven Solutions with Impressive Quality of Results (Oct 19, 2023)
- CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs (Oct 19, 2023)
- Prophesee launches the world's smallest and most power-efficient event-based vision sensor, bringing more intelligence, privacy and safety than ever to consumer Edge-AI devices (Oct 19, 2023)
- US extends China chip ban (Oct 19, 2023)
- Ansys Semiconductor Simulation Solutions Certified for UMC's 3D Chip Technology (Oct 19, 2023)
- Analysts Debate Latest U.S. Export Controls (Oct 19, 2023)
- Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU (Oct 19, 2023)
- SEMIFIVE Signs MOU with TeraPixel Technologies to Collaborate on Semiconductor Design (Oct 19, 2023)
- CXL Gets Off the Drawing Board (Oct 19, 2023)
- 新思科技携手台积公司加速2nm工艺创新，为先进SoC设计提供经认证的数字和模拟设计流程 (Oct. 19, 2023)
- Arm 全面设计借助生态系统之力，拥抱 Arm 定制芯片时代 (Oct. 19, 2023)
- 车载DSP：新应用孕育国产"芯"机遇 (Oct. 19, 2023)
- Alphawave Semi通过Arm总体设计提升用于人工智能计算的芯片驱动型硅平台 (Oct. 19, 2023)
- SiFive宣布推出面向生成式AI和ML应用的差异化解决方案，引领RISC-V进入高性能创新的新时代 (Oct. 19, 2023)
- Harnessing the power of the ecosystem in the era of custom silicon on Arm (Oct 18, 2023)
- Andes Technology Unveils Andes D23 and N225 Cores Pioneering the Next Generation of Compact, Performant, and Secure RISC-V Processor Technology (Oct 18, 2023)
- Alphawave Semi Elevates Chiplet-Powered Silicon Platforms for AI Compute through Arm Total Design (Oct 18, 2023)
- Arm and Synopsys Strengthen Partnership to Accelerate Custom Silicon on Advanced Nodes (Oct 18, 2023)
- Qualcomm to Bring RISC-V Based Wearable Platform to Wear OS by Google (Oct 18, 2023)
- M31 Opens Bangalore R&D Design Center in India Expands Recruitment of Global Talent (Oct 18, 2023)
- Cadence Joins Arm Total Design to Accelerate Development of Arm-Based Custom SoCs (Oct 18, 2023)
- Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development (Oct 18, 2023)
- 中科院微电子所在新型纳米环栅CMOS工艺与器件技术方面取得进展 (Oct. 18, 2023)
- "日特估"芯片龙头创最大日内涨幅 与台积电、Arm合作开发2nm芯片 (Oct. 18, 2023)
- Codasip发布适用于定制计算的新一代RISC-V处理器系列产品 (Oct. 18, 2023)
- 晶心科技隆重推出高性能 AndesCore™ RISC-V 多核心向量處理器 AX45MPV (Oct. 18, 2023)
- 我国加快推进5G轻量化技术演进和应用创新 (Oct. 18, 2023)
- Synopsys Partners with Indian Institute of Technology Bombay to Develop Talent for Semiconductor Industry (Oct 17, 2023)
- Codasip announces next-generation RISC-V processor family for Custom Compute (Oct 17, 2023)
- Fraunhofer IESE Partners With Arteris To Accelerate Advanced Network-on-chip Architecture Development for AI/ML Applications (Oct. 17, 2023)
- Silicon Creations Named 2023 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP (Oct 17, 2023)
- CEA-Leti Launches R&D Program to Improve "Cooperation" Between Autonomous Vehicles Via V2X Communication (Oct. 17, 2023)
- 台积电正推进N3E制程工艺量产 已获得苹果下单承诺 (Oct. 17, 2023)
- GOWIN Semiconductor Expands its GW1NZ Series of Low-Cost, Small-Size, and Low-Power Devices (Oct 16, 2023)
- 14-bit, 4.32GSps Wide Band ADC with Time-Interleaved Pipeline Architecture, Now Available for WhiteBox Licensing - Unlimited Usage and Modification Rights Included (Oct 16, 2023)
- eMemory Won TSMC OIP Partner of the Year Award for the 14th Consecutive Year (Oct 16, 2023)
- OPENEDGES Extends Partnership with InnoGrit Corp for 6nm LPDDR5/4X/4 Memory Controller IP (Oct 16, 2023)
- Electronic System Design Industry Posts $4 Billion in Revenue in Q2 2023, ESD Alliance Reports (Oct 16, 2023)
- LeapMind's New AI Chip Paves the Way for Unprecedented Cost-Effective AI Computing (Oct 16, 2023)
- Access Advance Announces Newest VVC Advance Licensors and Licensees (Oct 16, 2023)
- 三星新获 3nm 高性能服务器芯片代工订单 (Oct. 16, 2023)
- OPENEDGES公司与英韧科技(Innogrit)公司，扩展合作于使用6纳米的LPDDR5/4X/4内存控制器IP (Oct. 16, 2023)
- 台积电3nm芯片销售额预计将占2023年收入的4-6% (Oct. 16, 2023)
- 力旺電子連續14年榮獲台積公司OIP合作夥伴獎 (Oct. 16, 2023)
- 中美科技竞争"新战线"：RISC-V中国会被"卡脖子"吗？ (Oct. 16, 2023)
- 首次采用EUV技术！英特尔宣布Intel 4已大规模量产 (Oct. 15, 2023)
- 传苹果确认iPhone 16系列将采用台积电第二代3nm工艺N3E (Oct. 15, 2023)
- Semiconductor startup, Enosemi, launches with a committed commercial license to key silicon photonics design IP created by Luminous Computing (Oct 13, 2023)
- Imagination Optimizes PPA and Speeds the Delivery of Low-Power GPUs Using AI-Driven Cadence Cerebrus in the OnCloud Platform (Oct. 13, 2023)
- 追赶台积电，消息称三星正整合优势资源全力攻关 2nm 工艺 (Oct. 13, 2023)
- SiFive 宣布推出针对生成式 AI／ML 应用的差异化解决方案，引领 RISC－V 进入高性能创新时代 (Oct. 13, 2023)
- RISC-V International：不受任何单一公司或国家控制 (Oct. 13, 2023)
- 未来五年工业AI的八大发展趋势 (Oct. 13, 2023)
- 西门子发布Solid Edge 2024添加AI辅助设计功能 (Oct. 13, 2023)
- 最大化产品的灵活性能！黑盒14nm 和白盒28 FDSOI 的LPP 1G以太网PHY IP 现已正式开放授权 (Oct. 12, 2023)
- Achronix Announces FPGA-Powered Accelerated Automatic Speech Recognition Solution (Oct 12, 2023)
- SiFive Announces Differentiated Solutions for Generative AI and ML Applications Leading RISC-V into a New Era of High-Performance Innovation (Oct 12, 2023)
- Thalia appoints Sou Bennani-McCord as Global VP of Sales (Oct 12, 2023)
- Credo Joins with Industry Players to Announce Effort to Standardize CXL Active Electrical Cables & Optics at OCP Global Summit 2023 (Oct 12, 2023)
- 新思科技PCIe 6.0 IP与英特尔PCIe 6.0测试芯片实现互操作 (Oct. 12, 2023)
- 谁能限制RISC-V？ (Oct. 12, 2023)
- 华为开发下一代基于RISC-V的车载MCU (Oct. 12, 2023)
- JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation (Oct 11, 2023)
- Arteris Interconnect IP Deployed in NeuReality Inference Server for Generative AI and Large Language Model Applications (Oct. 11, 2023)
- BrainChip and Circle8 Clean Technologies/AVID Group Work to Reduce and Recycle Waste Through Joint Development of Intelligent "Smart Bins" (Oct 11, 2023)
- Embedded Flash memory developer Floadia has raised 1.05 billion yen from INABATA and others (Oct 11, 2023)
- ADTechnology to start 3nm 2.5D ASIC design project for HPC application (Oct 11, 2023)
- Microchip推出集成嵌入式硬件安全模块的新型32位MCU (Oct. 11, 2023)
- 人工智能 (AI) 利用深度学习技术改进高级驾驶辅助系统(ADAS) (Oct. 11, 2023)
- Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe (Oct 10, 2023)
- Update on Israel situation; Weebit's operations unaffected (Oct 10, 2023)
- 摩尔定律下一步，新思科技为SysMoore落地带来最佳实践 (Oct. 10, 2023)
- Accellera Releases Portable Test and Stimulus Standard 2.1 (Oct 10, 2023)
- Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures (Oct 10, 2023)
- AMD to Acquire Open-Source AI Software Expert Nod.ai (Oct 10, 2023)
- Siemens launches Tessent tool for Verilog and RTL design for test (Oct. 10, 2023)
- 1G Ethernet PHY IP Core is now available in 14nm LPP for Blackbox License and in 28FDSOI as Whitebox License for maximum flexibility (Oct 09, 2023)
- 三星计划在DRAM行业"反弹"之际提高DDR5产量 (Oct. 09, 2023)
- TSMC September 2023 Revenue Report (Oct 09, 2023)
- Siemens extends leadership in EDA design-for-test with the launch of Tessent RTL Pro (Oct 09, 2023)
- TSMC looks to standardise chiplet protocols in "world changing" move (Oct 09, 2023)
- RISC-V要被美国管制，会有哪些影响？ (Oct. 08, 2023)
- 日本首相将公布生成式AI监管规则 (Oct. 08, 2023)
- 苹果3nm A17 Pro/M3芯片等订单疲软，台积电今年收入将下滑 (Oct. 08, 2023)
- 格芯和 Microchip 宣布Microchip 28纳米SuperFlash 嵌入式闪存解决方案投产 (Oct. 07, 2023)
- 国产工艺硅验证SerDes IP如何助力PCIe产业加速前行？ (Oct. 07, 2023)
- 欧盟将加强人工智能技术和半导体芯片的出口管制 (Oct. 07, 2023)
- 中国图象图形学学会2023年度会士增选名单公布 (Oct. 07, 2023)
- Imec启动针对汽车芯片的Chiplet研究计划 (Oct. 07, 2023)
- IP厂商想要抬高"天花板" (Oct. 07, 2023)
- GUC Monthly Sales Report - September 2023 (Oct 06, 2023)
- EDGX Announces Collaboration with BrainChip to Develop Disruptive Data Processing Solutions for Space (Oct 06, 2023)
- UMC Reports Sales for September 2023 (Oct 06, 2023)
- Arteris Wins Autonomous Vehicle Technology of the Year Award (Oct. 06, 2023)
- Marquee Semiconductor Expands Presence in India with New Location at Veer Surendra Sai University of Technology Campus in Odisha (Oct 06, 2023)
- ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips (Oct 06, 2023)
- 三星3nm GAA完整晶圆遭遇难产，良率仅50% (Oct. 06, 2023)
- 英特尔分拆FPGA业务，国产发展几何？ (Oct. 06, 2023)
- Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet (Oct 05, 2023)
- Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub (Oct 05, 2023)
- Cadence Completes Acquisition of Intrinsix (Oct 05, 2023)
- ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics (Oct. 05, 2023)
- MachineWare announces new ARM processor simulation and SystemC profiling products, adds Windows support (Oct 05, 2023)
- SmartDV Rolls Out Multi-Phase Expansion Plan (Oct. 05, 2023)
- Using Open-Source Hardware to Speed Product Development (Oct 05, 2023)
- Swiss-Based Enclustra Announces US Operations in San Diego to Realize the Full Potential of Embedded Chip Technologies (Oct 05, 2023)
- Global Semiconductor Sales Increase 1.9% Month-to-Month in August (Oct 05, 2023)
- Renesas Extends Tender Offer and Receives CFIUS Clearance for Proposed Acquisition of Sequans (Oct 05, 2023)
- JUPITER Exascale Supercomputer, lead customer for SiPearl (Oct 05, 2023)
- Intel Announces Intent to Operate Programmable Solutions Group (PSG) as Standalone Business (Oct 04, 2023)
- EdgeCortix Closes $20 Million in Additional Funding Round (Oct 04, 2023)
- TSMC selects IC'Alps for its Design Center Alliance (DCA) (Oct. 04, 2023)
- Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect (Oct. 03, 2023)
- Tachyum Books Purchase Order to Build System with 25,000x ChatGPT4 Capacity and 25x Faster than Current Supercomputers (Oct 03, 2023)
- BrainChip Makes Second-Generation Akida Platform Available to Advance State of Edge AI Solutions (Oct. 03, 2023)
- CEA and Siemens collaborate on research to expand applications of Digital Twin for industry (Oct. 03, 2023)
- Alphawave Semi Earns Great Place to Work® Certification™ for 2023-24 (Oct 02, 2023)
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- Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows (Sep 28, 2023)
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- Intrinsic ID Becomes World's First IP Vendor with PSA Certified Level 3 Root of Trust Component (Sept. 28, 2023)
- Capgemini boosts its semiconductor capabilities in Europe with acquisition of HDL Design House (Sept. 28, 2023)
- M31 Announces Low-Power IP Solutions for TSMC's N12e Process (Sep 28, 2023)
- Percepio Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs (Sep 28, 2023)
- China Gears Up for Chip Dumping, Ex-DoC Official Says (Sep 28, 2023)
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- TSMC Announces Breakthrough Set to Redefine the Future of 3D IC (Sep 28, 2023)
- Microchip FPGAs Speed Intelligent Edge Designs and Reduce Development Cost and Risk with Tailored PolarFire® FPGA and SoC Solution Stacks (Sep 28, 2023)
- EU Turns Rivals into Allies (Sep 28, 2023)
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- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum (Sep 27, 2023)
- PrimisAI Forms to Revolutionize Hardware Design with Leading AI Solutions (Sep 27, 2023)
- Chips&Media Announces the Release of "CMNP," the New Neural Processor IP (Sept. 27, 2023)
- GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production (Sep 27, 2023)
- GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit (Sep 27, 2023)
- Siemens and TSMC collaborate to help mutual customers optimize designs using foundry's newest advancements (Sep 27, 2023)
- Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process (Sep 27, 2023)
- 辅助驾驶ADAS系统主要功能 (Sept. 27, 2023)
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- Cadence AI-Powered Virtuoso Studio Supports RF and mmWave Design Reference Flows for TSMC N16RF, N6RF and N4PRF (Sep 26, 2023)
- GlobalFoundries Announces Opening of New Malaysia Office to Support Global Manufacturing Operations (Sep 26, 2023)
- Kneron Announces $49M in Additional Funding, Bringing Total Series B to $97M (Sep 26, 2023)
- Synopsys Unveils Industry's Broadest Portfolio of Automotive-Grade IP on TSMC's N5A Process Technology (Sep 26, 2023)
- Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies (Sep 26, 2023)
- SambaNova Unveils New AI Chip, the SN40L, Powering its Full Stack AI Platform (Sep 26, 2023)
- Codasip selects Verilock to provide secure hardware authentication technology (Sep 26, 2023)
- Introducing Tomi Jalonen - Xiphera's Sales Representative for Central European Markets (Sep 26, 2023)
- QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries™ 22FDX® Platform (Sep 26, 2023)
- Ashling's RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST (Sep 26, 2023)
- Unlocking IoT Security: Crypto Quantique Introduces QuarkLink Ignite - A Free IoT Security SaaS Platform (Sep 26, 2023)
- 在RISC-V世界中谁会成为另一个"Arm"？ (Sept. 26, 2023)
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- 新思科技針對台積公司N5A製程技術 推出業界涵蓋範圍最廣的車用級IP產品組合 (Sept. 26, 2023)
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- Flex Logix Expands Upon Industry-leading Embedded FPGA Customer Base (Sep 25, 2023)
- Arm shares return to offer price (Sep 25, 2023)
- Alphawave Semi: Interim results for the six months ended 30 June 2023 (Sep 25, 2023)
- Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes (Sep 25, 2023)
- Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows (Sep 25, 2023)
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- GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding (Sep 25, 2023)
- proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem (Sep 25, 2023)
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- Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings (Sep 22, 2023)
- Rambus MACsec-IP-361 is Certified ASIL-B Ready (Sep 22, 2023)
- Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record, Says TrendForce (Sep 22, 2023)
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- Nordic combines Arm and RISC-V for "remarkable" EEMBC benchmarks (Sep 21, 2023)
- Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports (Sep 21, 2023)
- Alphacore Recognized for its TID Results of 22-nm FDSOI SRAM Published in IEEE Transactions on Nuclear Science journal (Sep 21, 2023)
- Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP (Sep 21, 2023)
- U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing (Sep 21, 2023)
- SMIC Well on Its Way to 5-nm Breakthrough, Observers Say (Sep 21, 2023)
- CEVA, Inc. Appoints Iri Trashanski as Chief Strategy Officer (Sep 21, 2023)
- Kalray announces the availability of its new processor "Coolidge™2", the first DPU optimized for AI and data intensive processing (Sep 21, 2023)
- BrainChip Engages VVDN to Deliver Industry's First Commercial Edge Box Based on Neuromorphic Technology (Sep 21, 2023)
- Inuitive Adopts VeriSilicon's Advanced ISP IP for its Vision AI Processor (Sep 21, 2023)
- Cadence将从CEVA手中收购Intrinsix公司 (Sept. 21, 2023)
- 泰雷兹与英特尔合作提高机密计算的可信度 (Sept. 21, 2023)
- 芯来RISC-V CPU IP连续三年获"中国芯"优秀支撑服务产品 (Sept. 21, 2023)
- 传智驿芯联手Arteris，利用创新NoC技术驾驭复杂SoC设计 (Sept. 21, 2023)
- T2M发布MIPI I3C智能、主从控制器IP，专为SoC传感器通信功能设计，客户可立即获得技术授权 (Sept. 20, 2023)
- ADTechnology and BOS Semiconductor Collaborate to develop 5nm automotive semiconductors (Sep 20, 2023)
- Cadence to Acquire Intrinsix Corporation from CEVA (Sep 20, 2023)
- Thalia expands footprint in China with appointment of Business Partner Fionn Liu (Sep 20, 2023)
- AiM Future Introduces Next-Generation NeuroMosAIc Processors, Expands Partnerships (Sept. 20, 2023)
- Cadence 推出面向硅设计的全新 Neo NPU IP 和 NeuroWeave SDK，加速设备端和边缘 AI 性能及效率 (Sept. 20, 2023)
- 牛芯半导体荣获第十八届"中国芯"优秀支撑服务产品奖 (Sept. 20, 2023)
- 工信部：我国蜂窝物联网终端用户达 21.48 亿户，产业规模接近 3 万亿元 (Sept. 20, 2023)
- OpenJDK 21 发布，中科院软件所进入主要贡献单位队列，看护 RISC-V 生态重要基础设施 (Sept. 20, 2023)
- 英飞凌携手海华科技，以Wi-Fi 6 技术加速推动消费与工业物联网市场发展 (Sept. 20, 2023)
- OPENEDGES 和 VisioNexT 塑造了人工智能视觉 SoCs 的未来 (Sept. 19, 2023)
- Rambus Added to PHLX Semiconductor Sector Index (SOX) (Sep 19, 2023)
- OPENEDGES and VisioNexT Shapes the Future of Vision AI SoCs (Sept. 19, 2023)
- Arm Announces Closing of Initial Public Offering and Full Exercise of Underwriters' Option to Purchase Additional American Depositary Shares (Sep 19, 2023)
- SandBox Semiconductor Adds Hybrid Metrology Capabilities to Industry's Leading Physics-based, AI-enabled Process Optimization Platform, Creating the First Software Solution to Holistically Address Process Development Challenges (Sep 19, 2023)
- QuickLogic and Xiphera Partner to Pioneer Post-Quantum Cryptography on eFPGAs (Sep 19, 2023)
- Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator (Sept. 19, 2023)
- 国产CPU四个生态并行发展 (Sept. 19, 2023)
- 新思擴充Synopsys.ai電子設計自動化套件 (Sept. 19, 2023)
- Quadric Announces Llama2 LLM Support Immediately Available for Chimera GPNPUs (Sep 18, 2023)
- Panmesia Raises $12.5 Million in Seed Funding with a Valuation Exceeding $81.4 Million in the CXL Semiconductor Arena (Sep 18, 2023)
- LIN Controller IP Core, equipped with a Safety package (Safe LIN, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing (Sep 18, 2023)
- Flex Logix Announces Reconfigurable Block RAM with ECC Option (Sep 18, 2023)
- Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip (Sept. 18, 2023)
- Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm (Sep 18, 2023)
- Arm Begins 2nd Term on Nasdaq, at $54.5 Billion Valuation (Sep 18, 2023)
- TCL Joins Via Licensing Alliance's ATSC 3.0 Broadcasting Patent Pool (Sep 18, 2023)
- Driving Europe's Chip Renaissance: TSMC's Vision with ESMC (Sep 18, 2023)
- HighTec, Synopsys team for AI on Infineon’s AURIX TC4x (Sept. 18, 2023)
- 中国电子学会与中国计量科学研究院助推绿色计算机标准，英特尔与产业加速响应迈向高能低碳未来 (Sept. 18, 2023)
- 台积电日本厂预计2024年底量产 或在2025年盈利 (Sept. 15, 2023)
- 持续推动封装技术创新英特尔看好玻璃衬底 (Sept. 15, 2023)
- 格芯宣布扩产！ (Sept. 15, 2023)
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- Realtek and V-Nova Announce Support for MPEG-5 Part 2 LCEVC on Set-Top-Box SoCs (Sep 14, 2023)
- Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design (Sept. 14, 2023)
- Fraunhofer IIS and IHSE announce their partnership for new JPEG XS implementations at IBC 2023 (Sep 14, 2023)
- Lawo and intoPIX Partner to Deliver Edge-Compute JPEG XS Support at IBC 2023 (Sep 14, 2023)
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- Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÜV Saar (Sep 13, 2023)
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- Cadence推出新一代PCB软件OrCAD X，AI和云双加持，效率提升5倍 (Sept. 13, 2023)
- Hailo Selected VeriSilicon's ISP and Video IP for its AI Vision Processors Empowering Intelligent Surveillance Cameras (Sep 12, 2023)
- Meet T2M at IBC 2023 to explore High Performance, Cost-effective, and Innovative Semiconductor IP Cores for your next generation SoCs (Sep 12, 2023)
- Signature IP Extends Global Footprint to Israel with Local Sales and Application Engineering Presence (Sep 12, 2023)
- intoPIX showcases the new lightweight video compression standards and technologies driving automotive innovation at AutoSens 2023 (Sep 12, 2023)
- GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs (Sep 12, 2023)
- 英特尔和新思科技深化合作，提供基于英特尔先进制程节点的领先IP (Sept. 12, 2023)
- 英业达与瑞萨电子联合开发汽车网关概念验证产品 (Sept. 12, 2023)
- Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets (Sep 12, 2023)
- Tachyum Offers Its TPU Inference IP to Edge and Embedded Markets (Sep 12, 2023)
- Allegro DVT Launches a New Generation of High-Performance Multi-Format Video Encoder IP for 4K/8K Video Resolutions (Sept. 12, 2023)
- Bluespec's Accelerate-HLS Leverages RISC-V to Simplify and Speed the Development of HLS Applications (Sep 12, 2023)
- 2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports (Sep 12, 2023)
- 智原推出整合Chiplets的2.5D/3D先進封裝服務 (Sept. 12, 2023)
- 芯片越来越复杂，Cadence的破局之道！ (Sept. 12, 2023)
- Hailo AI视觉处理器采用芯原ISP和VPU，赋能智慧监控摄像头 (Sept. 12, 2023)
- T2M发布28nm制程的18位100 dB立体声音频ADC IP；实现卓越的音频信号处理能力，适用于音频芯片组、数码相机以及汽车应用等领域的产品 (Sept. 11, 2023)
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- Enhanced Artel SMART openGear® Leverages intoPIX JPEG XS Technology for Ultimate Low-Latency Transport Solutions (Sep 11, 2023)
- TSMC August 2023 Revenue Report (Sep 11, 2023)
- Q2 2023 Global Semiconductor Equipment Billings Dip 2% Year-Over-Year, SEMI Reports (Sep 11, 2023)
- CAST adds Ascon Lightweight Encryption Engine to Security IP Cores Line (Sep 11, 2023)
- Flex Logix Announces Upgraded Emulation Models For EFLX™ eFPGA (Sep 11, 2023)
- NR-5G Polar Decoder and Encoder FEC IP Core Available For Licensing and Implementation from Global IP Core (Sep 11, 2023)
- SK hynix's memory chips next in Huawei's 5G phone saga (Sep 11, 2023)
- Renesas Commences Tender Offer for All Outstanding Shares and ADSs of Sequans (Sep 11, 2023)
- Blue Pearl Adds Design Verification and Methodology Services to its Product Portfolio (Sep 11, 2023)
- 芯来科技助力"芯原杯"全国嵌入式软件开发大赛圆满落幕 (Sept. 11, 2023)
- 2023新思科技开发者大会：以创新引领航向，以远见先见未来 (Sept. 11, 2023)
- 机器学习操作可以彻底改变网络安全 (Sept. 09, 2023)
- T2M发布畅销千兆以太网PHY IP，无使用次数限制及修改限制，现已开放授权 (Sept. 08, 2023)
- OneNav Closes $17 Million Round, Launches GNSS Augmentation Product (Sep 08, 2023)
- Andes Announces General Availability of the New AndesCore™ RISC-V Multicore Vector Processor AX45MPV (Sep 08, 2023)
- GBT Receives Patent Grant Notification Covering its Integrated Circuits Reliability Verification Analysis and Auto-Correction Technology (Sep 08, 2023)
- intoPIX to Celebrate Successful Collaboration with Bridge Technologies at IBC 2023 (Sep 08, 2023)
- 智原自有数字IP完全解决方案加速SoC在地开发 (Sept. 08, 2023)
- TOP10晶圆代工厂营收排名：台积电市占略降 (Sept. 08, 2023)
- Flanders Semiconductors: The New Hub for Semiconductor Ecosystem at the Heart of Europe (Sep 07, 2023)
- Rambus Completes Sale of PHY IP Assets to Cadence (Sep 07, 2023)
- Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution (Sep 07, 2023)
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- Global Semiconductor Sales Increase 2.3% Month-to-Month in July (Sep 07, 2023)
- Creonic Introduces NCR Processor IP Core for DVB-S2X/DVB-RCS2 Satellite Communication (Sep 07, 2023)
- MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024 (Sep 07, 2023)
- BrainChip Showcases Foundation for next generation AI solutions at AI Hardware & Edge AI Summit (Sep 07, 2023)
- Arm IPO Likely to Lag Early Expectations, Observers Say (Sep 07, 2023)
- Numem Announces Series A Funding Led by Cambium Capital to Propel Memory Solutions for AI and IoT (Sep 07, 2023)
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- Credo推出用于光收发器/AOC的四通道跨阻放大器 (Sept. 07, 2023)
- SEMI SOI 国际产业联盟宣布新任领导层和理事会，并公布最新活动 (Sept. 07, 2023)
- VisualSim Secure Model Protector enables companies to collaborate in new product development (Sep 06, 2023)
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- GUC Announced 5nm HBM3 PHY and Controller Silicon Proven at 8.4 Gbps (Sep 06, 2023)
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- 日本半导体公司Rapidus工厂动工开建 拟生产2纳米制程半导体 (Sept. 02, 2023)
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- China-owned Dream Chip tapes out 10TOPS SoC (Aug. 22, 2023)
- Empower Your Wi-Fi 6 and Wi-Fi 6E SoCs with 12-Bit 640Msps Dual Channel ADC and DAC IP Cores, Now Available for Immediate Licensing in Silicon Proven 22nm ULL and ULP Technology (Aug 21, 2023)
- Arm expected to file for IPO this week (Aug 21, 2023)
- T2M发布通过22FDX工艺验证的视频传输IP方案，适用于图形适配器和LCD显示器相关芯片的设计，用户可即刻获得技术授权 (Aug. 18, 2023)
- Dream Chip Technologies tapes out a 10-TOPS SoC in 22nm with a novel AI Accelerator and an Automotive Functional Safety Processor (Aug 18, 2023)
- RISC-V能否颠覆X86和Arm架构的霸权？ (Aug. 18, 2023)
- 数据中心在云端和未来的优势 (Aug. 18, 2023)
- 英飞凌推出全新的TEGRION™系列安全控制器 (Aug. 18, 2023)
- 欧盟电池法规生效：2027 年起，动力电池入欧需持"数字护照" (Aug. 18, 2023)
- 新思科技任命 Sassine Ghazi 为全球总裁兼首席执行官 (Aug. 18, 2023)
- Creonic Engages in Numerous Research Projects within the 6G Platform (Aug 17, 2023)
- Marvell Introduces Industry's First 5nm Multi-Gigabit PHY Platform (Aug 17, 2023)
- Sirius Wireless Partners with S2C on Wi-Fi6/BT RF IP Verification System for Finer Chip Design (Aug 17, 2023)
- Faraday Announces Infineon's SONOS eFlash is Fully Qualified on UMC's 40ULP Process (Aug 17, 2023)
- OpenHW Group Announces Tape Out of RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software (Aug 17, 2023)
- Synopsys Announces Sassine Ghazi to Assume President and CEO Role Jan. 1, 2024 (Aug 17, 2023)
- Silicon Motion Terminates Merger Agreement with MaxLinear and Intends to Pursue Substantial Damages in Excess of the Agreement's Termination Fee Due to MaxLinear's Willful and Material Breaches of the Merger Agreement (Aug 17, 2023)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2023 (Aug 17, 2023)
- Metanoia Adopts Omni Design's Multi Giga Sample Data Converters in 5G products (Aug 17, 2023)
- 台积电组建2nm任务团队冲刺试产：2025年量产 iPhone 17的A19首发 (Aug. 17, 2023)
- 智原開發英飛凌SONOS eFlash子系統於聯電40ULP製程通過晶片品質可靠度驗證 (Aug. 17, 2023)
- 芯动科技国内首款USB3.0 HUB芯片成功进入商用 (Aug. 17, 2023)
- Andes晶心科技协助驱动群联电子共同打造卓越性能低功耗的存储解决方案 (Aug. 17, 2023)
- 芯动科技与达州市共建智算中心，批量采用风华GPU助推数字经济发展 (Aug. 17, 2023)
- 芯耀辉获评国家级专精特新"小巨人" (Aug. 17, 2023)
- 国产RISC-V，重磅发布！ (Aug. 17, 2023)
- Rapid Silicon Announces RapidGPT's Official Availability (Aug. 16, 2023)
- NEUCHIPS Announces the Appointment of Ken Lau as Chief Executive Officer (Aug 16, 2023)
- DVCon India 2023 | Keynote: "Journeying Beyond AI: Unleashing the Art of Verification" by Sivakumar P R, Founder & CEO, Maven Silicon (Aug 16, 2023)
- Tachyum Achieves 192-Core Chip After Switch to New EDA Tools (Aug 16, 2023)
- Tower Announces Termination of Intel Acquisition Agreement (Aug 16, 2023)
- Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0 (Aug 16, 2023)
- GBT Technologies, Inc. & Bannix Acquisition Corp. Announce Execution of Patent Purchase Agreement (Aug 16, 2023)
- Certus Semiconductor Partners with Pragma Design for Embedded ESD Detection Technology (Aug. 16, 2023)
- Intel Announces Termination of Tower Semiconductor Acquisition (Aug 16, 2023)
- Kneron Unveils the KL730 AI Chip, Propelling Low-Energy GPT Solutions at Scale (Aug 16, 2023)
- Global Semiconductor Industry on Track for 2024 Recovery but Near-Term Headwinds Remain, SEMI Reports (Aug 16, 2023)
- Interview: Arm's SystemReady 2.0 to Secure IoT Devices (Aug 16, 2023)
- 英特尔宣布与新思科技达成战略合作，将开发基于Intel 3和Intel 18A制程的IP组合 (Aug. 16, 2023)
- CEVA加入三星SAFE(TM)晶圆代工计划加速面向移动、消费、汽车、无线基础设施和物联网市场的芯片设计 (Aug. 16, 2023)
- Arm 虚拟硬件正式上线百度智能云，加速本土开发者实现创新 (Aug. 16, 2023)
- Nvidia, Cadence, and Ceva Keep Up With AI Processing Demands (Aug. 16, 2023)
- Intel and Synopsys Expand Partnership to Enable Leading IP on Intel Advanced Process Nodes (Aug 15, 2023)
- Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year (Aug 15, 2023)
- 车厂最近的热门话题：RISC-V、AI、Chiplet (Aug. 15, 2023)
- OPENEDGES and Telechips Collaborates for Automotive Applications (Aug 14, 2023)
- Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 22nm, 40nm, 55nm is Available for Immediate Licensing for TWS, Audio Chipsets and Automotive Applications (Aug 14, 2023)
- CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets (Aug 14, 2023)
- OPENEDGES 与 Telechips 合作开发汽车应用 (Aug. 14, 2023)
- 晶心科技与TetraMem合作打造人工智能加速器芯片 (Aug. 12, 2023)
- Socionext Strengthens Design and Development Capabilities with New Office in Bangalore, India (Aug 11, 2023)
- Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing (Aug 11, 2023)
- TSMC allocates $6bn for 2nm capacity in Taiwan (Aug 11, 2023)
- TSMC July 2023 Revenue Report (Aug 11, 2023)
- Rambus Initiates $100 Million Accelerated Share Repurchase Program (Aug 11, 2023)
- 国产替代进入深水区，牛芯半导体高端DDR IP再突破 (Aug. 11, 2023)
- 全球最快LPDDR5T内存登场 全大核CPU架构天玑9300完成性能验证 (Aug. 11, 2023)
- 不止应用于抬头显示 汽车AR增强现实技术能做些什么？ (Aug. 11, 2023)
- 液体神经网络如何解决从机器人到自动驾驶汽车的人工智能问题 (Aug. 11, 2023)
- 人类为大规模AI负荷做好准备了吗？ (Aug. 11, 2023)
- Analog IP tackles side channel attacks (Aug 10, 2023)
- UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification (Aug 10, 2023)
- BrainChip and Edge Impulse Offer a Neuromorphic Deep Dive into Next-Gen Edge AI Solutions (Aug 10, 2023)
- SMIC Reports 2023 Second Quarter Results (Aug 10, 2023)
- Intel CEO Voices Concerns About CHIPS Funds, Export Controls (Aug 10, 2023)
- 台积电、博世、英飞凌和恩智浦半导体成立合资公司，在欧洲引入先进半导体制造 (Aug. 10, 2023)
- 中芯国际发布Q2财报 营收环比增长6.7% 下半年好于上半年 (Aug. 10, 2023)
- Understanding the Compute Hardware Behind Generative AI (Aug. 10, 2023)
- Blueshift Memory announces successful development of computer vision AI accelerator chip (Aug 09, 2023)
- Allegro MicroSystems to Acquire Crocus Technology to Accelerate Innovation in TMR Sensing Technology (Aug 09, 2023)
- MIPI Alliance and Automotive SerDes Alliance Enter Liaison Agreement to Enable Native MIPI CSI-2 Implementation with ASA-ML PHY (Aug 09, 2023)
- CEVA, Inc. Announces Second Quarter 2023 Financial Results (Aug 09, 2023)
- Thalia announces new additions to its senior management team and Board (Aug 09, 2023)
- 消息称苹果和三星将在首次公开募股时投资Arm (Aug. 09, 2023)
- 全球蜂窝物联网通信连接规模将于2030年超过60亿 (Aug. 09, 2023)
- 瑞萨电子宣布收购蜂窝物联网技术领导者Sequans (Aug. 08, 2023)
- Leading Semiconductor Industry Players Join Forces to Accelerate RISC-V (Aug 08, 2023)
- Synopsys Appoints Rob Painter to Board of Directors (Aug 08, 2023)
- UMC Reports Sales for July 2023 (Aug 08, 2023)
- TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe (Aug 08, 2023)
- Synopsys Partners with NowSecure and Secure Code Warrior to Expand Industry-Leading Application Security Testing Solutions Portfolio (Aug 08, 2023)
- 芯来RISC-V内核助力速显微发布"天都二号"多功能MPU (Aug. 08, 2023)
- 汽车芯片行业全力投入RISC-V (Aug. 08, 2023)
- Unlock seamless video transmission between graphics adapters and LCD displays with readily licensable, silicon-proven LVDS IP cores tailored for the advanced 22FDX process node (Aug 07, 2023)
- Arteris Announces Financial Results for the Second Quarter 2023 and Estimated Third Quarter and Full Year 2023 Guidance (Aug 07, 2023)
- CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family (Aug 07, 2023)
- Renesas to Acquire Cellular IoT Technology Leader Sequans Through Tender Offer (Aug 07, 2023)
- CEO Interview: Intrinsic ID's Pim Tuyls on Embedded Security (Aug 07, 2023)
- DVB-C Demodulator IP Core Available For Immediate Implementation From Global IP Core (Aug 07, 2023)
- Tenstorrent Raises a $100M Strategic Up-round Co-led by Hyundai Motor Group and the Samsung Catalyst Fund (Aug 07, 2023)
- GUC Monthly Sales Report - July 2023 (Aug 07, 2023)
- Global Semiconductor Sales Increase 4.7% in Q2 Compared to Q1 (Aug 07, 2023)
- 博世、Nordic、恩智浦、高通和英飞凌携手投资一家RISC-V公司 (Aug. 07, 2023)
- 台积电与亚利桑那州签署协议 愿接受更严格建厂监督 (Aug. 05, 2023)
- 2nm决战2025 (Aug. 04, 2023)
- 德中科学家合作在半导体纳米结构中实现新型量子比特 (Aug. 04, 2023)
- Arasan发布无缝集成CANsec加速器IP的CAN-XL IP (Aug. 04, 2023)
- NoC 互连拓扑解释 (Aug. 04, 2023)
- Cadence 推出新一代可扩展 Tensilica 处理器平台，推动边缘普适智能取得新进展 (Aug. 04, 2023)
- 如何克服物联网十大问题和风险 (Aug. 04, 2023)
- 适用于高端汽车电子领域的CAN控制器IP已通过量产验证，支持各类相关的安全规范（Safe DCAN-FD、ISO 26262规范下的安全标准及FMEDA），客户可立即获得技术授权 (Aug. 03, 2023)
- CDAC, Arm partner to enable semiconductor startups in India through Arm Flexible Access for Startups (Aug 03, 2023)
- Arasan announces its CAN-XL IP with seamlessly integrated CANsec Accelerator IP (Aug 03, 2023)
- Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform (Aug 03, 2023)
- PCI-SIG® Exploring an Optical Interconnect to Enable Higher PCIe Technology Performance (Aug 03, 2023)
- Certifiably Secure - Xiphera Announces a First Batch of CAVP Validated IP Cores (Aug 03, 2023)
- AI加速芯片新品助推，HBM3/3e将成明年HBM市场主流 (Aug. 03, 2023)
- JEDEC Publishes New Standard to Support CXL Memory Module Implementation (Aug 02, 2023)
- University of Virginia Joins the BrainChip University AI Accelerator Program (Aug. 02, 2023)
- Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers (Aug. 02, 2023)
- Synopsys 推出改变游戏规则的工具，优化安全和测试实践：软件风险管理器 (Aug. 02, 2023)
- LeapMind's Ultra Low-Power AI accelerator IP "Efficiera" Achieved industry-leading power efficiency of 107.8 TOPS/W (Aug 01, 2023)
- Rambus Reports Second Quarter 2023 Financial Results (Aug 01, 2023)
- Weebit Nano qualifies its ReRAM module for automotive grade temperature (Aug. 01, 2023)
- Dolphin Design enables Orca's RF SoCs for direct-to-satellite communications (Aug 01, 2023)
- 2023 RISC-V中国峰会即将举行 报名通道现已开启 (Aug. 01, 2023)
- Production-proven CAN Controller IP Core, equipped with a Safety package (Safe DCAN-FD, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing (Jul 31, 2023)
- Terapines ZCC Toolchain Fully Supports Andes RISC-V Processors (Jul 31, 2023)
- Huawei planning on using SMIC to fab 7nm ICs this year (Jul 31, 2023)
- PCIe Eyes Road Ahead with AI, Automotive (Jul 31, 2023)
- America Faces Significant Shortage of Tech Workers in Semiconductor Industry and Throughout U.S. Economy (Jul 31, 2023)
- Remi El-Ouazzane: "A Tsunami of TinyML Devices is Coming" (Jul 31, 2023)
- Weebit Nano: Q4 FY23 Quarterly Activities Report (Jul 31, 2023)
- 台积电CoWoS产能告急，谁能分得一杯羹？ (Jul. 31, 2023)
- RISC-V不止替代，更搭AI (Jul. 31, 2023)
- 车规级CPU IP和RISC-V的选择 (Jul. 29, 2023)
- 塑造网络安全未来的10种安全技术 (Jul. 28, 2023)
- 小鹏+大众=大鹏？ (Jul. 28, 2023)
- 面对汽车新需求，村田亮剑 (Jul. 28, 2023)
- Achronix"内外兼修"赋能AI/ML数据加速 (Jul. 28, 2023)
- A methodology for turning an SoC into chiplets (Jul 27, 2023)
- T2M发布适用于 WiFi RF SoC的12位 640Msps 双通道 IQ ADC 高速/高性能 IP，可立即进行技术授权 (Jul. 27, 2023)
- Creonic Unveils CCSDS 131.2 Wideband Modulator IP Core Achieving 1 GSymb/s (Jul 27, 2023)
- 中科院微电子所在新型存储器领域取得重要进展 (Jul. 27, 2023)
- 全新 Arm IP Explorer 平台助力 SoC 架构师与设计厂商加速 IP 选择 (Jul. 27, 2023)
- 推出34个AI套件，英特尔为AI发展提速度 (Jul. 27, 2023)
- 英特尔与爱立信深化合作，推动下一代5G基础设施优化 (Jul. 27, 2023)
- 挖呀挖，中国功率半导体发展潜力乍现 (Jul. 27, 2023)
- Two IP announcements herald a new normal in chip world (Jul 26, 2023)
- Worldwide Silicon Wafer Shipments Rise in Q2 2023, SEMI Reports (Jul 26, 2023)
- Intrinsic ID Announces QuiddiKey 100 - Providing a Strong Root of Trust Solution for Internet Connected Devices (Jul 26, 2023)
- Arm and industry leaders launch Semiconductor Education Alliance to address the skills shortage (Jul. 26, 2023)
- YorChip launches UniPHY™ - the first dual-use PHY for Chiplets (Jul 26, 2023)
- Intrinsic ID 发布 QuiddiKey 100 – 为互联网连接设备提供强大的信任根解决方案 (Jul. 26, 2023)
- 芯来科技与IAR达成战略合作伙伴关系 (Jul. 26, 2023)
- 日本Rapidus次世代晶圆代工厂正与美国大型科技公司进行供应谈判 (Jul. 25, 2023)
- Mobiveil and InPsytech Announce Successful Inter-Op Verification of Enterprise Flash Controller Design IP and ONFI 5.1 PHY IP (Jul. 25, 2023)
- Faraday Reports Second Quarter 2023 Results (Jul 25, 2023)
- YorChip launches UniPHY™? - the first dual-use PHY for Chiplets (Jul 25, 2023)
- 新思科技針對台積公司3奈米製程 運用廣泛IP產品組合加速先進晶片設計 (Jul. 25, 2023)
- 中电科汽车芯片技术发展研究中心与牛芯半导体（深圳）有限公司签署战略合作协议 (Jul. 25, 2023)
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- 晶心科搭AI 業績爆發 (Jul. 24, 2023)
- 2023"芯原杯"全国嵌入式软件开发大赛在海口举行 (Jul. 24, 2023)
- Has the electronics market bottomed out? (Jul 24, 2023)
- Chip Experts See Talent Shortage as Main Growth Hurdle (Jul 24, 2023)
- 12bit 640Msps Dual-Channel IQ ADC High-Speed/High-Performance IP Cores for WiFi RF SoC is available for immediate licensing (Jul 24, 2023)
- Cadence RTL design tool claims 5x faster RTL convergence (Jul. 24, 2023)
- Siemens launches assistive AI solution for IC design and verification (Jul. 24, 2023)
- T2M发布适用于车规级芯片研发的验证IP集，帮助相关客户缩短芯片的验证周期 (Jul. 21, 2023)
- Cadence to Acquire Rambus PHY IP Assets (Jul 21, 2023)
- TSMC Reports Second Quarter EPS of NT$7.01 (Jul 21, 2023)
- Cadence将收购Rambus半导体公司PHY IP资产 (Jul. 21, 2023)
- 哈尔滨工业大学（深圳）师生一行到牛芯半导体参观交流 (Jul. 21, 2023)
- T2M发布适用于下一代显示应用所需的MIPI D-PHY和DSI控制器IP，相关设计已通过硅验证 (Jul. 20, 2023)
- Semidynamics发布完全可定制的四路Atrevido 423 RISC-V内核，用于大数据应用 (Jul. 20, 2023)
- SK hynix adopts Siemens' Polarion to help gain Korea's first ASPICE certification (Jul 20, 2023)
- BrainChip's Latest US Patent Award Extends Intellectual Property Strength and its Leadership in Edge Learning (Jul 20, 2023)
- Arm expands open-source partnerships to reinforce commitment to open collaboration (Jul 20, 2023)
- Semidynamics announces fully customisable, 4-way, Atrevido 423 RISC-V core for big data applications (Jul 20, 2023)
- Thalia Secures $2.7 Million Funding to Strengthen Position as Leading IP Reuse Partner for Semiconductor Industry (Jul 20, 2023)
- Synopsys Accelerates Advanced Chip Design with First-Pass Silicon Success of IP Portfolio on TSMC 3nm Process (Jul 20, 2023)
- 三星3nm GAA工艺已商业量产，中国加密货币矿机商尝鲜 (Jul. 20, 2023)
- 瑞萨电子汽车级MCU和SoC网络安全管理通过ISO/SAE 21434:2021认证 (Jul. 20, 2023)
- 三星SD部门选择"半导体传奇"Jim Keller进行AI半导体合作 (Jul. 20, 2023)
- Expedera Announces LittleNPU AI Processors for Always-Sensing Camera Applications (Jul 19, 2023)
- New Wave Design and Verification Appoints Ike Song to Advisory Committee (Jul 19, 2023)
- Lightelligence Partners With ZeroPoint Technologies to Increase Data Center Connectivity Performance by Up to 50% (Jul 19, 2023)
- Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology (Jul. 19, 2023)
- VSORA Announces All-in-One Single Chip Architecture to Meet Generative AI Processing Challenges (Jul 19, 2023)
- VSORA reveals Jotunn generative AI processor (Jul. 19, 2023)
- 新思科技在台积电 N3E 工艺上最大限度地降低设计风险并实现硅片一次性成功 (Jul. 19, 2023)
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- DENSO Adopts Attopsemi's OTP to Upgrade Future Automotive Products (Jul. 18, 2023)
- 超低功耗技术助力BLE进入无源应用市场 (Jul. 18, 2023)
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- Accelerate the verification process of your design IP by licensing the Verification IP Cores, which come equipped with a solid track record of automotive compatibility (Jul 17, 2023)
- GMAC Intelligence Goes Big with BrainChip Partnership (Jul 17, 2023)
- Cadence Unveils Joules RTL Design Studio, Delivering Breakthrough Gains in RTL Productivity and Quality of Results (Jul 17, 2023)
- The industry's first RISC-V IoT security chip, "Towngas Chip", had sold over 1,000,000 pieces (Jul 17, 2023)
- RED Semiconductor and Crypto Quantique agree MOU for Development of Chip with Advanced Processing Capability and Quantum-based Security (Jul 17, 2023)
- Allegro DVT joins the DVB Project (Jul 17, 2023)
- SMIC: Resignation of Chairman of the Board and Executive Director Appointment of Chairman of the Board and Change of Authorised Representative (Jul 17, 2023)
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- 实况直击！芯耀辉在ICDIA现场都分享了什么？ (Jul. 17, 2023)
- 机构：2023 年处理器市场规模达到 1500 亿美元 (Jul. 16, 2023)
- RISC-V主要发明人：RISC-V将主导垂直半导体商业模式时代 (Jul. 15, 2023)
- M31 Partners with Intel IFS Alliance to Present Latest IP Development Achievements (Jul 14, 2023)
- Cadence 数字、定制/模拟设计流程通过认证，Design IP 现已支持 Intel 16 FinFET 制程 (Jul. 14, 2023)
- 行业首款 RISC-V 物联网安全芯片"港华芯"销量破百万，用于智能燃气表 (Jul. 14, 2023)
- 人工智能模型能有多大? (Jul. 14, 2023)
- End-to-end design and verification for PCIe 6.0 (Jul. 13, 2023)
- European Commission Approves Broadcom's Acquisition of VMware (Jul 13, 2023)
- Global Semiconductor Equipment Sales Forecast: $87 Billion in 2023 With 2024 Rebound, SEMI Reports (Jul 13, 2023)
- Truechip Announces First Customer Shipment Of USB4v2 Verification IP (Jul 13, 2023)
- Rambus Delivers Quantum Safe IP Solutions with Next-Generation Root of Trust for Data Center Security (Jul 13, 2023)
- The Future of Mobility: Fraunhofer IPMS drives the Revolution in Vehicle Architecture (Jul 13, 2023)
- proteanTecs and Teradyne Partner to Bring Machine Learning-driven Telemetry to SoC Testing (Jul. 13, 2023)
- 中国量子计算研究获新突破，将现有世界记录提升了两倍多 (Jul. 13, 2023)
- 三星宣布开始量产其功耗最低的车载 UFS 3.1 存储器解决方案 (Jul. 13, 2023)
- Cycuity Achieves ISO/SAE 21434 Certification for Automotive Cybersecurity Compliance (Jul. 12, 2023)
- T2M Presents Silicon Proven MIPI D-PHY and DSI Controller IP Cores in 12FFC & 22ULL For Your Next Generation Display Products (Jul 12, 2023)
- Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process (Jul 12, 2023)
- Crypto Quantique Selected for European Innovation Council (EIC) Grant Funding (Jul. 12, 2023)
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- M31攜手英特爾IFS聯盟 發表最新矽智財研發成果 (Jul. 12, 2023)
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- Faraday's Launched SerDes Advanced Service to Accelerate ASICs into Production (Jul 11, 2023)
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- Siemens' Calibre platform now certified for IFS' Intel 16 process technology (Jul 11, 2023)
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- TSMC June 2023 Revenue Report (Jul 10, 2023)
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- Siemens unveils Calibre DesignEnhancer for Calibre correct-by-construction IC layout optimization (Jul 10, 2023)
- Siemens expand collaboration with AWS to help IC and electronics design customers accelerate innovation (Jul 10, 2023)
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- Siemens advances intelligent custom IC verification platform with new, AI-powered Solido Design Environment (Jul 10, 2023)
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- Xpeedic Launches High-Speed Digital Signal Integrity, Power Integrity Suite at Design Automation Conference (Jul 10, 2023)
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- Global Semiconductor Sales Increase 1.7% Month-to-Month in May (Jul 07, 2023)
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- sureCore和Universal Quantum宣布推出低温IP演示芯片 (Jul. 07, 2023)
- 深圳AI产业规模突破两千亿元，1920家企业 (Jul. 07, 2023)
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- True Circuits Attends 60th Design Automation Conference, Celebrates 25 Years of Timing Excellence (Jul 06, 2023)
- New PNG Encoder IP Core Expands CAST's Lossless Compression Suite (Jul 06, 2023)
- IC Manage GDP-XL Enterprise IP Catalog enables NXP to Improve IP Asset Management and Reuse (Jul 06, 2023)
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- proteanTecs to Showcase the Future of Health and Performance Monitoring at DAC and SEMICON West 2023 (Jul 06, 2023)
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- UMC Reports Sales for June 2023 (Jul 06, 2023)
- Imperas Helps Navigate the Journey to RISC-V Based Silicon at DAC 2023 (Jul 06, 2023)
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- True Circuits Announces Availability of JSPICE™ Simulation and Design Environment (Jul 05, 2023)
- EUROPRACTICE starts offering access to Pragmatic's flexible integrated circuit foundry services through imec (Jul 05, 2023)
- GUC Monthly Sales Report - June 2023 (Jul 05, 2023)
- Faraday to Exhibit FPGA-Go-ASIC, SONOS eFlash, and eFPGA Solutions at DAC 2023 (Jul 05, 2023)
- Truechip: Exhibiting and Showcasing Latest Verification IPs and NOC IPs at Design Automation Conference (DAC) 2023 (Jul 05, 2023)
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- AI Can't Design Chips Without People (Jul 04, 2023)
- Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023 (Jul 04, 2023)
- 张忠谋：技术全球化正让位于国家间抗争 (Jul. 04, 2023)
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- AccelerComm Announces 5G PUSCH Channel Equalizer (Jul. 03, 2023)
- ADTechnology Joins Synopsys IP OEM Partner Program (Jul. 03, 2023)
- Tiempo Secure's new TESIC RISC-V IP successfully passes SERMA CC EAL5+ security assessment tests (Jul. 03, 2023)
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- Synopsys and Golden Electronics Collaborate to Expand Chip Design Talent in Jordan (Jul. 03, 2023)
- StarFive and Youyeetoo jointly delivered the official metal case for VisionFive 2 (Jul. 03, 2023)
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- Ansys and Synopsys Accelerate RFIC Semiconductor Design with New Reference Flow for Samsung Technology (Jun 29, 2023)
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- OKI IDS adopts Siemens Catapult High-Level Synthesis platform for design and verification services (Jun 29, 2023)
- Secure-IC's Securyzr achieves ISO 26262 ASIL-D certification, reinforcing its commitment to Automotive Safety and Security (Jun 29, 2023)
- Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding (Jun 29, 2023)
- Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer (Jun 29, 2023)
- AMD Introduces World's Largest FPGA-Based Adaptive SoC for Emulation and Prototyping (Jun 29, 2023)
- Cadence AI-Based Virtuoso Studio Certified for Samsung Foundry PDKs for Mature and Advanced Nodes (Jun 29, 2023)
- Samsung Foundry Certifies Cadence Virtuoso Studio Flow to Automate Analog IP Migration on Advanced Process Technologies (Jun 29, 2023)
- Cadence Digital and Custom/Analog Design Flows Certified for Samsung Foundry's SF2 and SF3 Process Technologies (Jun 29, 2023)
- Cadence Delivers Certified, Innovative Backside Implementation Flow to Support Samsung Foundry SF2 Technology (Jun 29, 2023)
- Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform (Jun 29, 2023)
- Weebit Nano's ReRAM IP now fully qualified in SkyWater Technology's S130 process (Jun. 29, 2023)
- Lightelligence Revolutionizes Big Data Interconnect with World's First Optical Network-on-Chip Processor (Jun 29, 2023)
- Quadric Joins the Silicon Catalyst In-Kind Partner Ecosystem (Jun 29, 2023)
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- Cadence 推出开拓性的 Virtuoso Studio以人工智能为助力开启 (Jun. 29, 2023)
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- 2023上海世界移动通信大会 (MWC上海) - (Jun. 28, 2023)
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- CEVA Introduces Channel Sounding over Bluetooth® to Enable High-Accuracy Secure Positioning for Automotive, Industrial and the IoT Ecosystem (Jun 28, 2023)
- Synopsys and Samsung Foundry Deepen Collaboration to Accelerate Multi-Die System Design for Advanced Samsung Processes (Jun 28, 2023)
- Synopsys and Samsung Foundry Boost Power, Performance and Area for Modern SoCs on Samsung's SF2 Process (Jun 28, 2023)
- DCAN FD Full - a final step to CAN XL? (Jun 28, 2023)
- Siemens extends support for Samsung Foundry's latest process technologies (Jun 28, 2023)
- 三星电子在2023年三星晶圆代工论坛上公布AI时代晶圆代工发展愿景 (Jun. 28, 2023)
- Arasan通过参加MIPI成员会议的I3C互操作性会议进一步推进其I3C IP的合规性 (Jun. 28, 2023)
- M31發表最新12奈米Digital PLL IP 推動物聯網時脈技術的先進優勢 (Jun. 28, 2023)
- 赛昉科技联合风火轮推出昉·星光 2 VISIONFIVE 2官配金属外壳 (Jun. 28, 2023)
- 芯来科技加入中国移动物联网联盟RISC-V工作组 (Jun. 28, 2023)
- Leti details move to 10nm, 7nm FD-SOI process in Europe (Jun. 28, 2023)
- Dolphin Design推出用于声音分类的创新IP，可减少99%的功耗 (Jun. 27, 2023)
- 消息称台积电正与2nm制程潜在客户商谈，单片晶圆报价2.5万美元 (Jun. 27, 2023)
- Andes Technology Unveils the Annual Andes RISC-V CON, Scheduled for June 27th at the San Jose Airport DoubleTree Hotel (Jun 27, 2023)
- Blue Pearl Software and NanoXplore SAS team to Accelerate Development and Verification of Radiation Hardened FPGA Designs (Jun 27, 2023)
- Arasan furthers the compliance of their I3C IP with its participation in the I3C Interop at MIPI Member Meeting (Jun 27, 2023)
- Dolphin Design unveils an innovative IP for sound classification cutting down energy by 99% (Jun 27, 2023)
- YorChip and Siloxit Collaborate on Industry's First Secure Data Acquisition Chiplet for Mass Markets (Jun 27, 2023)
- Logic Fruit Technologies: Exhibiting and Showcasing Cutting-Edge Solutions at Design Automation Conference (DAC) 2023 (Jun 27, 2023)
- Comcores Unveils JESD204 IP Core Integration Guide to Streamline Customer PHY Integration Challenges (Jun. 27, 2023)
- MAXEYE License and Deploy CEVA Sensor Fusion Software in Digital Pen for Leading Global Mobile OEM (Jun. 27, 2023)
- 芯片也能"知天命"，如何监测芯片性能和故障预测？ (Jun. 27, 2023)
- 强强联合！Codasip与SmartDV建立伙伴关系以携手加速芯片设计项目 (Jun. 27, 2023)
- 一文读懂台积电上海技术论坛 (Jun. 27, 2023)
- SiFive RISC-V 中国技术论坛 (Jun. 26, 2023)
- T2M发布新款核心IP，为AI芯片组赋能，释放AI的真正潜力 (Jun. 26, 2023)
- BrainChip Selects IPro Silicon IP to Serve Israel's high growth AI market (Jun 26, 2023)
- DB GlobalChip Deploys Cadence's Spectre FX and AMS Designer, Accelerating IP Verification by 2X (Jun 26, 2023)
- 12Bit ADC and DAC IP Cores with High-Speed, High-Performance for Wireless applications that requires RF are available for immediate licensing (Jun 26, 2023)
- Rapidus CEO Chasing Single-Wafer-Processing Dream (Jun 26, 2023)
- SEMIFIVE announces commercialization of its 5nm HPC SoC Platform with lead partner Rebellions, AI Chipmaker startup based in Korea (Jun. 26, 2023)
- How Will 5G Advanced Change RF Design? (Jun 26, 2023)
- 三星向外界公布 GAA MBCFET 技术最新进展 (Jun. 25, 2023)
- 炫黑科技：神经形态传感&处理3D集成芯片 (Jun. 25, 2023)
- aiMotive achieves an industry first milestone with ISO26262 ASIL B certification for aiWare4 NPU IP (Jun 23, 2023)
- DRAM Alternative Spawns U.K. Startup (Jun 22, 2023)
- Intel Provides Update on Internal Foundry Model (Jun 22, 2023)
- Codasip partners with SmartDV to accelerate chip design projects (Jun 22, 2023)
- 进击的RISC-V (Jun. 22, 2023)
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- OPENEDGES Achieves Tapeout of LPDDR5x/5/4x/4 PHY IP on 5nm SF5A Process Technology (Jun. 21, 2023)
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- 后摩尔时代的Chiplet D2D解决方案 (Jun. 20, 2023)
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- 加强追赶台积电 三星把AI与大数据应用于整体芯片制程 (Jun. 20, 2023)
- Nordic Semiconductor将在2023上海世界移动通信大会展示全系列物联网连接解决方案ai 2023 (Jun. 20, 2023)
- Imagination如何引领更安全的汽车行业？ (Jun. 20, 2023)
- Imagination如何引领更安全的汽车行业？ (Jun. 20, 2023)
- Introducing T2M's Key IP Cores Empowering AI Chipsets and unleashing the true AI Potential (Jun 19, 2023)
- Chips Acts' Role in Reshaping a Global Industry (Jun 19, 2023)
- 第三届中国集成电路设计创新大会暨无锡IC应用博览会（ ICDIA 2023） (Jun. 19, 2023)
- 第十届汽车电子创新大会暨应用展（AEIF 2023） (Jun. 19, 2023)
- MosChip Announces the appointment of Semiconductor Industry Veteran Dr. Naveed Ahmed Sherwani to the Board of Directors (Jun 19, 2023)
- Blueshift Memory and Crypta Labs to develop quantum-resilient cybersecurity memory module (Jun 19, 2023)
- SEGGER adds Stack Overflow Prevention (STOP) technology to Embedded Studio for ARM (Jun 19, 2023)
- 携手安谋科技，Arm推出全新智能视觉参考设计 (Jun. 19, 2023)
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- Extending Moore's Law: CEA-Leti & Intel to Develop Atomically Thin 2D TMDs on 300mm Wafers Using Layer Transfer Technology for Future Transistor Scaling (Jun. 19, 2023)
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- M31 Has Expanded MIPI IP Portfolio, Successfully Validated 7nm MIPI C/D PHY Combo IP (Jun 16, 2023)
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- Gartner发布中国企业人工智能趋势浪潮3.0 (Jun. 16, 2023)
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- Securing Embedded Systems - Making it the Norm (Jun 12, 2023)
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- D&R IP SoC Day China (Jun. 09, 2023)
- Arasan announces the Industry's First CAN FD Light Bus Controller IP (Jun. 08, 2023)
- T2M发布适用于无线射频设计的12位1Gsps DAC IP，已通过硅验证，客户可立即获得技术授权 (Jun. 08, 2023)
- Computex 2023 Reveals Taiwan's Critical Role in AI (Jun 08, 2023)
- Cortus Launches ULYSS automotive MCU family (Jun. 08, 2023)
- Leading Aerospace and Defense Company purchases Interlaken IP core from Comcores (Jun 08, 2023)
- Q1 2023 Global Semiconductor Equipment Billings Grow 9% Year-Over-Year, SEMI Reports (Jun 08, 2023)
- Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications (Jun 08, 2023)
- Global Semiconductor Sales Increase 0.3% Month-to-Month in April (Jun 07, 2023)
- Defacto will celebrate its 20th anniversary at DAC with customer presentations and major technical announcements (Jun 07, 2023)
- S2C Accelerates Development Timeline of Bluetooth LE Audio SoC (Jun 07, 2023)
- Arm SystemReady surpasses 100 certifications, driving standardization where it matters (Jun. 07, 2023)
- Kalray Announces Production Launch of New "Coolidge™2" DPU Processor Optimized for AI and Intensive Data Processing (Jun 07, 2023)
- Green Hills Software adds support for production-ready RTOS and tools to Imagination Technologies' RISC-V CPUs (Jun 07, 2023)
- intoPIX and PlexusAV Pioneer IPMX Standard-Based AV-over-IP Solutions (Jun 07, 2023)
- 前有追兵后有堵截 3nm会是下一个长寿节点吗？ (Jun. 07, 2023)
- 台积电刘德音：前景十分光明! (Jun. 07, 2023)
- 集微访谈|Akshara Bassi：28nm简直YYDS，它是如何做到屹立不倒的？ (Jun. 07, 2023)
- 調查：比利時微電子研究中心被評選為全球最好的育成中心 (Jun. 07, 2023)
- Cadence：以 AI 技术驱动数字验证的变革 (Jun. 07, 2023)
- intoPIX 和PlexusAV先锋IPMX基于标准的AV-over-IP 解决方案 (Jun. 07, 2023)
- Cadence expands Arm agreement for EDA tool verification (Jun. 07, 2023)
- Lorser选择BrainChip Akida AI开发软件定义无线电 (Jun. 06, 2023)
- 炬芯取得熵码科技芯片安全信任根IP授权，从硬件层面构建安全设计 (Jun. 06, 2023)
- Actions Technology Partners with PUFsecurity to Secure Wireless Bluetooth and IoT Applications (Jun 06, 2023)
- VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution (Jun 06, 2023)
- UMC Reports Sales for May 2023 (Jun 06, 2023)
- Marquee Semiconductor Acquires Semikunn Technology Services, Expanding Design Services Portfolio (Jun 06, 2023)
- 芯原低功耗蓝牙整体解决方案完成蓝牙5.3认证 (Jun. 06, 2023)
- 中国科大取得量子密钥分发攻防研究重要进展 (Jun. 06, 2023)
- 全球数字经济大会人工智能高峰论坛7月5日北京见，爱集微承办 (Jun. 06, 2023)
- CSEAC2023报名开启！附报名指南，限时福利 (Jun. 06, 2023)
- BrainChip and Lorser Industries to Develop Neuromorphic Computing Systems for Software-Defined Radio Devices (Jun 05, 2023)
- Agile Analog launches first complete RISC-V analog IP subsystem at RISC-V Summit Europe (Jun 05, 2023)
- Imperas at the RISC-V Summit Europe, June 5-9 2023 (Jun 05, 2023)
- Silicon Proven 12bit 1Gsps DAC IP Core designed for Wireless RF Applications is available for immediate license (Jun 05, 2023)
- 消息称台积电已启动 2nm 试产前期准备工作，目标今年试产近千片 (Jun. 05, 2023)
- 瑞萨电子携多款先进解决方案亮相2023上海国际嵌入式展 (Jun. 05, 2023)
- Consortium's Move Will Boost RISC-V Ecosystem, Thankfully (Jun 05, 2023)
- Andes Technology Showcases Pioneering RISC-V CPU IP Solutions at RISC-V Summit Europe (Jun 05, 2023)
- GlobalFoundries and STMicroelectronics Finalize Agreement for New 300mm Semiconductor Manufacturing Facility in France (Jun 05, 2023)
- Microchip Slashes Time to Innovation with Industry's Most Power-Efficient Mid-Range FPGA Industrial Edge Stack, More Core Library IP and Conversion Tools (Jun 05, 2023)
- Dolphin Design Selects Imperas for Processor Functional Design Verification (Jun 05, 2023)
- GUC Monthly Sales Report - May 2023 (Jun 05, 2023)
- Are Chiplets Enough to Save Moore's Law? (Jun 05, 2023)
- 国产ARM宜考虑将RISC-V作备份 (Jun. 05, 2023)
- Complete RISC-V analog IP subsystem targets IoT (Jun. 05, 2023)
- 台积电将扩充CoWos先进封装产能 将在本月的法说会上公布详细信息 (Jun. 04, 2023)
- 參與全球RISC-V軟體生態計劃RISE 平頭哥究竟有何來歷？ (Jun. 03, 2023)
- Axiomise Launches Next-Generation formalISA App for RISC-V Processors (Jun. 02, 2023)
- 消息称台积电为英伟达微调生产计划，使晶圆产能更平均 (Jun. 02, 2023)
- X-FAB率先向市场推出110纳米BCD-on-SOI代工解决方案 (Jun. 02, 2023)
- Chiplet，迈出重要一步 (Jun. 02, 2023)
- RISC-V厂商如何通过差异化定制获得竞争优势? (Jun. 02, 2023)
- MCU是否会从ADAS域控制器消失 (Jun. 02, 2023)
- T2M全新发布的JESD204C PHY和控制器IP，兼容汽车电子应用且已通过硅验证，现已对客户开放技术授权 (Jun. 01, 2023)
- OPENEDGES 的 TSS公司加入了加拿大半导体委员会 (Jun. 01, 2023)
- Semidynamics announces largest, fully customisable Vector Unit in the RISC-V market, delivering up to 2048b of computation per cycle for unprecedented data handling (Jun 01, 2023)
- The Six Semiconductor of OPENEDGES Joins Canada's Semiconductor Council (Jun 01, 2023)
- University of Oklahoma Joins the BrainChip University AI Accelerator Program (Jun 01, 2023)
- Vtool appoints Incusolution to be its sales-channel partner in Korea (Jun. 01, 2023)
- Xiphera extends its Transport Layer Security product family (Jun. 01, 2023)
- Industry Leaders Launch RISE to Accelerate the Development of Open Source Software for RISC-V (Jun 01, 2023)
- UltraRISC Selects Valtrix STING for Verification of RISC-V SoC Designs (Jun 01, 2023)
- Tachyum Testing Applications on Prodigy FPGA (Jun 01, 2023)
- The game-changing addition of intoPIX JPEG XS codec by Providius heralds a new era of IP media analysis (Jun 01, 2023)
- NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G (Jun 01, 2023)
- 联网就能用量子计算机？中国量子计算云平台"祖冲之号"上线 (Jun. 01, 2023)
- Linux基金会欧洲分部推出RISC-V软件生态系统（RISE）项目。 (Jun. 01, 2023)
- Semidynamics宣布推出RISC－V市场上最大的、完全可定制的矢量单元 (Jun. 01, 2023)
- Synopsys长期 AI 投资正在取得回报 (Jun. 01, 2023)
- 操盤心法－AI革命帶來投資浪潮 (Jun. 01, 2023)
- LPDDR5X：重要性与日俱增的移动存储器 (May. 31, 2023)
- Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future (May 31, 2023)
- Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era (May 31, 2023)
- Intel Foundry Services Ushers in a New Era (May 31, 2023)
- SDIC 从 CAST 获得 8051 微控制器 IP 核的授权 (May. 30, 2023)
- AndeSentry™ Collaborative Framework Enables Comprehensive RISC-V Security Solutions (May 30, 2023)
- SDIC Licenses 8051 Microcontroller IP Cores from CAST (May 30, 2023)
- Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions (May 30, 2023)
- U.S. Government Accredits GlobalFoundries to Manufacture Trusted Semiconductors at New York Facility (May 30, 2023)
- MIPS Leverages Siemens' Veloce proFPGA platform to Implement and Make Available Capabilities of its New High-Performance eVocore P8700 RISC-V Multiprocessor (May 30, 2023)
- 用GDDR助力AI芯片？Rambus做好准备！ (May. 30, 2023)
- Arm CEO：我們正處於運算的黃金時代 (May. 30, 2023)
- Capgemini and Google Cloud expand long-standing partnership to create first-of-its-kind Generative AI Center of Excellence to accelerate client value (May. 30, 2023)
- SDV Safety Calls for Partnerships, Open Source (May. 30, 2023)
- New Arm Total Compute Solutions enable a mobile future built on Arm (May 29, 2023)
- JESD204C PHY & Controller IP Cores with proven automotive compatibility are instantly licensable for extremely reliable performance for your SOC's (May 29, 2023)
- Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes (May 29, 2023)
- SiFive Gives WorldGuard to RISC-V International to Make this Robust Security Model More Accessible to the RISC-V Community (May 29, 2023)
- M31 Technology: Q1 EPS NT$2.24, Up 75% YoY, Revenue Growth for the 19th Consecutive Month (May 29, 2023)
- Socionext Introduces Ultra-compact, Ultra-low-power 60GHz Radio-frequency Ranging Sensors for Automotive Applications (May 29, 2023)
- MediaTek Partners With NVIDIA to Provide Full-Scale Product Roadmap to the Automotive Industry (May 29, 2023)
- Cadence全面支持Arm TCS23产品线 (May. 29, 2023)
- 2023中关村论坛|加速推进 RISC-V生态发展势不可挡 (May. 27, 2023)
- 新思科技推出业内首款高性能仿真系统ZeBu Server 5，助力实现系统级芯片电子数字孪生 (May. 26, 2023)
- Achronix采用CEM插卡模式的VectorPath®加速卡在业内率先通过PCIe Gen5 x16 32 GT/s认证 (May. 26, 2023)
- 深入了解RISC-V处理器的安全验证 (May. 26, 2023)
- 中科院微电子所在自旋神经形态器件方面取得新进展 (May. 26, 2023)
- 台积电：瞄准车用MCU (May. 26, 2023)
- Cadence发布面向TSMC 3nm工艺的112G-ELR SerDes IP展示 (May. 25, 2023)
- JEDEC Publishes Major Update to JEP30 PartModel Guidelines (May 25, 2023)
- FIVEberry Establishes Broad and Easy Access to RISC-V Technology (May 25, 2023)
- Crypto Quantique signs first major client in Taiwan (May 25, 2023)
- TSMC lays out a killer roadmap (May 25, 2023)
- Nanusens announces that it can now create ASICs with embedded sensors (May 25, 2023)
- DRAM Industry Q1 Revenues Decline 21.2% QoQ, Marking Third Consecutive Quarter of Downturn, Says TrendForce (May 25, 2023)
- Alphawave Semi has published its audited results for the year ended 31 December 2022 (May 25, 2023)
- China bars Micron ICs destined for key infrastructure (May 25, 2023)
- 台积电为2纳米节点增加两个变体，英特尔能赶上吗？ (May. 25, 2023)
- 延续摩尔定律：英特尔公布堆叠式CFET场效应管架构，迈向1nm制程 (May. 25, 2023)
- Socionext 利用 ZETag ® 云标签进行资产管理演示实验 (May. 25, 2023)
- BrainChip and CVEDIA Team to Advance State-of-the-Art Edge AI and Neuromorphic Computing (May. 24, 2023)
- Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets (May 24, 2023)
- Apple announces multibillion-dollar deal with Broadcom for components made in the USA (May 24, 2023)
- USB 4.0主机和设备控制器IP现已开放技术授权! ！释放USB通道的潜力，获得PCIe和DP的高速连接！！ (May. 24, 2023)
- Experts Weigh Impact of Intel-Arm Collaboration (May 24, 2023)
- Imagination launches IMG CXM, the smallest GPU to bring effortless user interfaces into homes (May 23, 2023)
- PCI-SIG Certifies VectorPath Accelerator Card for PCIe Gen5 x16 @ 32 GT/s (May 23, 2023)
- Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities (May 23, 2023)
- Sequans Introduces Taurus 5G NR: The World's First Chipset Specifically Optimized for 5G Broadband IoT Devices (May 23, 2023)
- Imagination推出IMG CXM最小GPU，为家庭娱乐带来无比便捷的用户界面 (May. 23, 2023)
- 为何安全是物联网的关键 (May. 23, 2023)
- 〈M31法说〉第一季EPS2.24元 年增75% 营收连续19个月逆势成长 (May. 23, 2023)
- TSMC高管：台积电赴德国设厂最快8月做出决定 (May. 23, 2023)
- USB 4.0 Host and Device Controller IP Cores unleashing the Power of High-Speed Connectivity with tunnelling of Display Port and PCIe is now available for Licensing (May 22, 2023)
- New £1 billion strategy for UK's semiconductor sector (May 22, 2023)
- Syntiant's Deep Learning Computer Vision Models Deployed on Renesas RZ/V2L Microprocessor (May 22, 2023)
- NVIDIA Grace Drives Wave of New Energy-Efficient Arm Supercomputers (May 22, 2023)
- Fabless Semiconductor Innovator Stathera Announces US $15M Series A Funding Round (May 22, 2023)
- CEVA and proteanTecs Announce Partnership to Optimize Reliability and Power of Complex SoCs (May 22, 2023)
- We don't compete with our customers - TSMC (May 22, 2023)
- Quadric's DevStudio Speeds Software Development with Industry's First Integrated ML + DSP Cloud-Based Code Development Platform (May 22, 2023)
- Audio Pioneer xMEMS Announces General Availability of the World's Only All-Silicon, Solid-State Fidelity Micro Speakers (May 22, 2023)
- Axelera AI Raises $50M to Democratize Edge AI (May 22, 2023)
- Arm expands global engineering teams with two new primary sites (May. 22, 2023)
- Green, Digital Transformation: Infineon Launches EU Projects for Power Electronics and Artificial Intelligence (May. 22, 2023)
- 中国供应商主导了2022年全球物联网模块和网关市场出货 (May. 22, 2023)
- Rambus提升GDDR6带宽，以应对边缘计算挑战 (May. 21, 2023)
- 为何越来越多中国半导体开发商转向RISC-V架构？ (May. 20, 2023)
- K-Best MIMO Decoder IP Core Available For Immediate Integration From Global IP Core (May 19, 2023)
- Arasan宣布其SUREBOOT(TM) Total xSPI PHY IP可立即供货 (May. 19, 2023)
- UWB雷達驅動數位鑰匙實現多項優勢 (May. 19, 2023)
- 企业版ChatGPT：我们能让它说真话吗 (May. 19, 2023)
- Rambus 和 Socionext 续签许可协议 (May. 19, 2023)
- Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP (May 18, 2023)
- T2M发布经过量产验证的MIPI C-D Combo Tx/Rx PHY和CSI / DSI控制器IP，可以提升客户显示器和摄像机SoC芯片的性能 (May. 18, 2023)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2023 (May 18, 2023)
- Rambus and Socionext Renew Patent License Agreement (May 18, 2023)
- proteanTecs' Die-to Die Interconnect Monitoring IP Passes TSMC9000 Pre-Silicon Assessment (May 18, 2023)
- SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging (May 18, 2023)
- 从45nm弯道超车2nm 日本重振半导体：拜会七大巨头求合作 (May. 18, 2023)
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- BrainChip and Teksun Demonstrate Rapid Adoption of AI Solutions at Embedded Vision Summit (May 17, 2023)
- Arasan announces the immediate availability of its 2nd Generation MIPI D-PHY for GlobalFoundries 22nm SoC Designs (May 17, 2023)
- Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers (May 17, 2023)
- Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports (May 17, 2023)
- Weebit Nano to present recent ReRAM-based developments at the International Memory Workshop (IMW) 2023 (May 17, 2023)
- MIPI DevCon Returns to Silicon Valley to Explore MIPI in Automotive, IoT and Mobile (May 17, 2023)
- Arasan宣布立即推出第二代MIPI D-PHY (May. 17, 2023)
- BrainChip and Quantum Ventura Partner to Develop Cyber Threat Detection (May. 16, 2023)
- NXP and TSMC to Deliver Industry's First Automotive 16 nm FinFET Embedded MRAM (May 16, 2023)
- 台积电、三星加入imec全球半导体永续计划 (May. 16, 2023)
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- 恩智浦攜手台積 推出業界首款車用16奈米FinFET嵌入式MRAM (May. 16, 2023)
- 纵行科技ZETag云标签资产管理-供应链仓网-循环包装管理-智慧物流 (May. 16, 2023)
- CEVA收购VisiSonics空间音频业务 (May. 16, 2023)
- T2M发布最新LC3+版的音频编解码器IP，提升相关无线系统产品的音频品质 (May. 15, 2023)
- Andes Technology Announces The New Product Line, AndesAIRE™, Ultimately Efficient AI/ML Solutions For Edge And End-Point Inference (May 15, 2023)
- 三星、SK 加快 AI 半导体开发以响应 ChatGPT (May. 15, 2023)
- 晶心科技推出全新產品線AndesAIRE™ 對邊緣與終端裝置人工智慧推論提供極高效率解決方案 (May. 15, 2023)
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- proteanTecs to Present in Open Compute Project (OCP) Webinar on Silent Data Errors for Resilient Data Centers (May 15, 2023)
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- Indian chip startups get seed funds from Sequoia Capital (May 15, 2023)
- AccelerComm secures £21.5m funding to supercharge 5G radio performance (May 15, 2023)
- 消息称英特尔CEO将于5月下旬第三次到访台积电，重启3nm合作 (May. 14, 2023)
- 机构：N3将是台积电FinFET系列最成功的节点？三星3nm被压一头 (May. 12, 2023)
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- Perforce survey reveals software has become central to automotive development (May. 12, 2023)
- CryoCMOS Consortium develops 4K & 77K transistor models to enable CryoIP development (May 11, 2023)
- Alphawave Semi Update on Audit Process (May 11, 2023)
- Canonical enables Ubuntu on StarFive's VisionFive 2 RISC-V single board computer (May 11, 2023)
- BrainChip Showcases Edge AI Technologies at 2023 Embedded Vision Summit (May 11, 2023)
- Kalray, Arteris, Secure-IC, and Thales, Win the Call for Projects Related to the AI Acceleration Strategy of the "France Relance 2030 - Future Investments" Plan (May 11, 2023)
- SMIC Reports 2023 First Quarter Results (May 11, 2023)
- Arteris Selected by BOS Semiconductors for Next-Generation Automotive Chips (May 11, 2023)
- 英伟达紧急向台积电追单先进封装产能 (May. 11, 2023)
- CryoCMOS联盟开发4K和77K晶体管模型，以实现CryoIP的开发 (May. 11, 2023)
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- OPENEDGES 的12nm LPDDR5/4x/4 PHY 已准备在Novachips 的 SSD控制器上进行量产 (May. 10, 2023)
- Upgrade To Solid Sands' Latest SuperTest Version Supports Andes To Its Ambitions For Further Growth In The Automotive Sector (May 10, 2023)
- StarIC appoints Redtree Solutions as Sales Representative in Pan-Europe (May 10, 2023)
- OPENEDGES' 12nm LPDDR5/4x/4 PHY is Ready for Mass Production by Novachips' SSD (May 10, 2023)
- Creonic Introduces 25 Gbit/s LDPC IP Core Solution for ITU G.9804.2 PON Standard (May. 10, 2023)
- CEVA Acquires Spatial Audio Business from VisiSonics to Expand its Application Software Portfolio for Embedded Systems targeting Hearables and other Consumer IoT Markets (May 10, 2023)
- CEVA, Inc. Announces First Quarter 2023 Financial Results (May 10, 2023)
- TSMC April 2023 Revenue Report (May 10, 2023)
- 中芯国际(688981)：风雨征程二十载 回顾SMIC成长史 (May. 10, 2023)
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- 种AI"小小种子"，开芯片验证"大大的花" (May. 09, 2023)
- FuriosaAI通过proteanTecs深度数据分析提升新一代人工智能芯片性能 (May. 09, 2023)
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- GUC Monthly Sales Report - April 2023 (May 08, 2023)
- Arteris Announces Financial Results for the First Quarter 2023 and Estimated Second Quarter and Full Year 2023 Guidance (May 08, 2023)
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- Arteris一季度营业收入1320万美元 同比增长12% (May. 05, 2023)
- Alphawave IP Group Plc Announces CFO Transition (May 04, 2023)
- NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry (May 04, 2023)
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- AccelerComm's LEOphy Shortlisted at SCF Industry Awards 2023 (May 03, 2023)
- UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications (May 03, 2023)
- Via Licensing and MPEG LA Unite to Form Via Licensing Alliance, the Largest Patent Pool Administrator in the Consumer Electronics Industry (May 03, 2023)
- Crypto Quantique Announces Robert Clyde as Chairman of the Board of Directors (May 03, 2023)
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- 聯電推出40奈米RFSOI平台 加速5G毫米波應用 (May. 03, 2023)
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- Rambus Reports First Quarter 2023 Financial Results (May 02, 2023)
- Global Semiconductor Sales Decrease 8.7% in First Quarter; March Sales Tick Up Month-to-Month for First Time Since May 2022 (May 02, 2023)
- BrainChip Pushes the Edge in 2023 with Akida Innovations, Expanded Partner Ecosystem (May. 02, 2023)
- Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets (May 02, 2023)
- Worldwide Silicon Wafer Shipments Decline in Q1 2023, SEMI Reports (May 02, 2023)
- PsiQuantum Expands Development Engagement and Plan for Production Ramp of Quantum Computing Technology at SkyWater's Minnesota Fab (May 02, 2023)
- Menta, Codasip join RISC-V 3D neuromorphic AI project (May. 02, 2023)
- GlobalFoundries Completes Purchase of 800 Acres Adjacent to New York Manufacturing Facility (May 01, 2023)
- TSMC's 3-nm Push Faces Tool Struggles (May 01, 2023)
- EdgeCortix Expands Leadership Team by Appointing Jeffry A. Milrod as Vice President of Product Engineering (May 01, 2023)
- Softbank files to list Arm on the Nasdaq (May 01, 2023)
- Cadence Reports First Quarter 2023 Financial Results (May 01, 2023)
- Arm Announces Confidential Submission of Draft Registration Statement for Proposed Initial Public Offering (May 01, 2023)
- EU-Funded NimbleAI to Deliver 3D Neuromorphic Chip (May 01, 2023)
- LC3plus audio codec for various Audio Application Is Available for Immediate Licensing!! (May 01, 2023)
- Samsung makes $3.4bn Q1 chip loss (May 01, 2023)
- EC approves €7.4bn subsidy for ST-GloFo JV fab (May 01, 2023)
- Processor Startup Innovates Memory Allocation Management (May 01, 2023)
- Electronic System Design Industry Logs $3.9 Billion in Revenue in Q4 2022, ESD Alliance Reports (May 01, 2023)
- 无线通信发展新趋势：地球运算和开放网络 (Apr. 30, 2023)
- 台积电：明年N28及以下技术海外产能将比2020年增加3倍 (Apr. 30, 2023)
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- 格芯和意法半导体在法国设厂计划获欧盟批准 (Apr. 29, 2023)
- Alphawave Semi: Q1 2023 Trading and Business Update (Apr 28, 2023)
- Alphawave to suspend shares (Apr 28, 2023)
- AI、車用電子和 Android 應用領域的最新趨勢，RISC-V CON 研討會即將登場！ (Apr. 28, 2023)
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- 实现自动驾驶需要我们重新思考人车交互 (Apr. 28, 2023)
- Signature IP Corporation Demonstrates Configurable NoC Products at Design & Reuse IP SoC Day (Apr 27, 2023)
- Creonic Introduces FEC IP Core Solution for SDA Free-Space Optical OCT V3.0 Standard (Apr 27, 2023)
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- Weebit Nano ReRAM now commercially available; fab & customer agreements progressing (Apr 27, 2023)
- TSMC Showcases New Technology Developments at 2023 Technology Symposium (Apr 27, 2023)
- Siemens announces certifications for TSMC's latest processes, celebrates recent achievements for Siemens and TSMC collaboration (Apr 27, 2023)
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- Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation (Apr 27, 2023)
- Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies (Apr 27, 2023)
- Cadence Digital and Custom/Analog Design Flows Certified for TSMC's Latest N3E and N2 Process Technologies (Apr 27, 2023)
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- Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies (Apr 27, 2023)
- Esperanto Technologies Launches New Cloud Access Program to Broaden Access to its Massively Parallel, Low Power RISC-V Solutions (Apr 27, 2023)
- Xiphera joins Microchip Technology's FPGA Design Partner program (Apr 27, 2023)
- HDL Design House develops its first full SoC from architecture definition to tapeout for an external customer (Apr 27, 2023)
- Revenue Decline of Global Top 10 IC Design Houses Expanded to Nearly 10% in 4Q22, Decline Expected to Continue into 1Q23, Says TrendForce (Apr 27, 2023)
- Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard (Apr 27, 2023)
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- Fraunhofer IIS/EAS Selects Achronix Embedded FPGAs (eFPGAs) to Build Heterogeneous Chiplet Demonstrator (Apr 26, 2023)
- Arteris IP Licensed by Axelera AI to Accelerate Computer Vision at the Edge (Apr 26, 2023)
- Synopsys, Ansys and Keysight Collaborate with TSMC to Boost Performance of Autonomous Systems with New mmWave Reference Flow (Apr 26, 2023)
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- Agile Analog推出创新的数字包装模拟IP子系統 (Apr. 26, 2023)
- High-precision microsensor technology for a wide application range (Apr. 26, 2023)
- Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology (Apr 25, 2023)
- Andes Technology's N25F RISC-V Processor Enables Superior Performance And Low Power For Phison's X1 Enterprise SSD Controller (Apr 25, 2023)
- Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology (Apr 25, 2023)
- Analog Bits to Demonstrate Working Silicon on TSMC N3E Process at TSMC 2023 North America Technology Symposium (Apr. 25, 2023)
- OPENEDGES' 12nm LPDDR5/4 Memory Subsystem IP that Drives Innovation Licensed by ASICLAND (Apr 25, 2023)
- Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC's N4P Process (Apr 25, 2023)
- Agile Analog launches innovative digitally wrapped analog IP subsystems (Apr 25, 2023)
- Rapid Silicon Launches Vega eFPGA IP for Programmable Solutions (Apr 25, 2023)
- Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC's N2 Process with Optimized EDA Flows (Apr. 25, 2023)
- Sondrel engages The SHD Group to assist in bringing Architecting the Future to the American market (Apr 25, 2023)
- Cadence 发布基于台积电 N4P 工艺的下一代 112G 超长距离 SerDes IP，加快超大规模系统级芯片设计 (Apr. 25, 2023)
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- Coherent Logix collaborates with Omni Design, AkiraNET Co. and Socionext to deliver reference design for Wi-Fi 6E/7 (Apr 24, 2023)
- Weebit Nano raises $15 million via upsized and scaled-back SPP (Apr 24, 2023)
- Introducing High-Speed Fractional PLL IP Cores with SSC that offers exceptional features in different process technologies (Apr 24, 2023)
- Dilithium core complements Xiphera's xQlave® family of post-quantum cryptography (Apr 24, 2023)
- Arm reported to be building a chip (Apr 24, 2023)
- Flex Logix Announces InferX™ High Performance IP for DSP and AI Inference (Apr 24, 2023)
- Synopsys, TSMC and Ansys Strengthen Ecosystem Collaboration to Advance Multi-Die Systems (Apr 24, 2023)
- VyperCore Announces £4 million in Seed Funding (Apr 24, 2023)
- Marvell Demonstrates Industry's First 3nm Data Infrastructure Silicon (Apr 23, 2023)
- Omni Design's High Performance Analog Front Ends are Adopted in Socionext's Next Generation Communications SoCs (Apr 23, 2023)
- 芯原股份2023年Q1实现营业收入5.39亿元，在手订单18亿元 (Apr. 23, 2023)
- 2022年半导体设计IP销售排名出炉 (Apr. 23, 2023)
- OPENEDGES的12纳米LPDDR5/4内存子系统IP驱动创新，已授权给ASICLAND使用 (Apr. 23, 2023)
- 台積電3nm技術進度好於預期 (Apr. 21, 2023)
- 台积电称2nm工艺客户热情高涨：计划2025年量产 (Apr. 21, 2023)
- 迈向净零未来：戴尔科技以创新助推绿色变革 (Apr. 21, 2023)
- Cadence 宣布与 SK 海力士速度最高的 9600Mbps LPDDR5T 移动 DRAM 可实现互操作性 (Apr. 21, 2023)
- OPENEDGES 所属的The Six Semiconductor 荣获 ACCE 最佳国际业务奖 (Apr. 20, 2023)
- Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY (Apr 20, 2023)
- The Six Semiconductor of OPENEDGES Receives Best International Business Award from ACCE (Apr 20, 2023)
- 28HPC+ 工艺的USB 3.0/ PCIe 3Combo PHY IP开放技术授权，可用于高端SoC芯片的设计 (Apr. 20, 2023)
- EU agrees Chips Act terms (Apr 20, 2023)
- GlobalFoundries Files Lawsuit Against IBM to Protect its Intellectual Property and Trade Secrets (Apr 20, 2023)
- TSMC Reports First Quarter EPS of NT$7.98 (Apr 20, 2023)
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- EdgeCortix Expands Delivery of its Industry Leading SAKURA-I AI Co-processor Devices and MERA Software Suite (Apr 20, 2023)
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- Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud (Apr 17, 2023)
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- Pragmatic Semiconductor Announces Appointment of Semiconductor Industry Veteran, David Moore, as CEO (Apr 14, 2023)
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- MainConcept and Fraunhofer IIS collaborate on MPEG-H Audio and xHE-AAC encoding for video and audio streaming services (Apr 14, 2023)
- Experience the Future of Video Processing with intoPIX and Imagine Communications at the 2023 NAB Show (Apr 14, 2023)
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- EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices (Apr 13, 2023)
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- Synopsys Introduces the Industry's First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs (Apr 13, 2023)
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- Xylon推出业界首款支持L5级自动驾驶的数据记录器和HIL系统 (Apr. 13, 2023)
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- XMOS announces xcore®-voice: the next generation intelligent solution for smart voice applications (Apr 03, 2023)
- TurboConcept and Lomicro Information Technology today celebrate two years of successful collaboration (Apr 03, 2023)
- Vtool appoints Wonderep to be its sales-channel partner in Israel (Apr 03, 2023)
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- 芯原股份：Chiplet在智慧出行领域的产业化之路 (Mar. 31, 2023)
- 中国Chiplet的机遇与挑战及芯片接口IP市场展望 (Mar. 31, 2023)
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- 戴伟民博士荣获"年度中国IC产业杰出人物"奖 (Mar. 31, 2023)
- China forms its own chiplet standard amid isolation (Mar 30, 2023)
- Computing Hardware Expert Georgios Konstadinidis Joins proteanTecs Advisory Board (Mar 30, 2023)
- Renesas Expands RISC-V Embedded Processing Portfolio with New Voice-Control ASSP Solution (Mar 30, 2023)
- POLYN Introduces VibroSense, Industry-First Application-Specific Vibration Pre-Processing Chip Design (Mar 30, 2023)
- Interview: Aart de Geus on AI-driven EDA (Mar 30, 2023)
- CXL Testing Leverages PCIe Expertise (Mar 30, 2023)
- Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors (Mar 30, 2023)
- 台积电中科2纳米厂有望11月动工，明年底投产 (Mar. 30, 2023)
- 芯原助力蓝洋智能部署基于Chiplet架构的芯片产品 (Mar. 30, 2023)
- Cadence："Computational Software"-智能系统设计之基石 (Mar. 30, 2023)
- Networking Chip Startup Enfabrica Emerges from Stealth Mode to Solve Scalability and Price-Performance Challenges for AI Growth in Cloud (Mar 29, 2023)
- Report: Arm proposes change to IP royalty model (Mar 29, 2023)
- Tachyum To Use UCIe Interconnect Standards In Prodigy 2 (Mar 29, 2023)
- Synopsys.ai Unveiled as Industry's First Full-Stack, AI-Driven EDA Suite for Chipmakers (Mar 29, 2023)
- Veriest Solutions Promotes Dusica Glisic to Vice President of Frontend Engineering (Mar 29, 2023)
- 愛普*與Mobiveil攜手合作，瞄準SoC端250MHz之PSRAM方案 (Mar. 29, 2023)
- 专家：盘点2023台积电的"风浪与暗礁" (Mar. 29, 2023)
- Mobiveil's PSRAM Controller IP Lets SoC Designers Leverage AP Memory's Xccela x8/x16 250 MHz PSRAM Memory (Mar 28, 2023)
- eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification (Mar 28, 2023)
- 力旺電子和聯華電子合作22奈米RRAM可靠度驗證 提供AIoT和行動通訊市場的低功耗記憶體解決方案 (Mar. 28, 2023)
- 自研矩阵再添新军！安谋科技发布新一代"周易"X2 NPU (Mar. 28, 2023)
- 上市盛宴！150家半导体企业IPO最新进展 (Mar. 28, 2023)
- Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration (Mar 27, 2023)
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets (Mar 27, 2023)
- 全球首款RISC-V笔记本ROMA发布！用上国产开放系统openKylin (Mar. 27, 2023)
- Designing MPUs/MCUs with Functional Safety (Mar 27, 2023)
- Sensor Fusion Explores AI to Prep for ADAS, AV Designs (Mar 27, 2023)
- MIPI A-PHY Specification Levels Up In-Vehicle Connectivity (Mar. 27, 2023)
- 2026 All-Time High in Store for Global 300mm Semiconductor Fab Capacity After 2023 Slowdown, SEMI Reports (Mar 27, 2023)
- Is RISC-V Poised to Benefit From Arm's Licensing Changes? (Mar. 27, 2023)
- 对小米/高通等无情涨价 一些厂商已考虑弃用ARM芯片：RSIC-V的机会来了 (Mar. 26, 2023)
- Alphawave Semi Opens Pune Office, Continues Expansion into India (Mar 24, 2023)
- 台积电在台兴建全球最尖端半导体2nm芯片厂 (Mar. 24, 2023)
- NVIDIA联合半导体三巨头，颠覆计算光刻方法学 (Mar. 24, 2023)
- 中国发布自主Chiplet小芯片标准，重在优化、适用性以及成本可控 (Mar. 24, 2023)
- 在手订单金额21.50亿元！芯原股份2022年扣非净利润扭亏为盈 (Mar. 24, 2023)
- 在IPO之前通知客户调整IP授权费，Arm为哪般？ (Mar. 24, 2023)
- Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration (Mar. 23, 2023)
- OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip (Mar 23, 2023)
- OPENEDGES 完成了 7 纳米 HBM3 存储子系统（PHY 和内存控制器）测试芯片的流片 (Mar. 23, 2023)
- CEO Interview: Ian Lankshear, EnSilica (Mar 23, 2023)
- Renesas to Acquire Panthronics to Extend Connectivity Portfolio with Near-Field Communication Technology (Mar 23, 2023)
- SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speck™" to mass production (Mar 23, 2023)
- Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports (Mar 23, 2023)
- 百度战略投资赛昉科技 RISC-V挺进数据中心大市场 (Mar. 23, 2023)
- 英特尔陈伟：聚焦网络与边缘，缔造可持续数字化未来 (Mar. 23, 2023)
- T2M发布已通过硅验证的超低功耗12bits 2Msps SAR ADC IP ，适用于包括物联网、医疗、消费电子等芯片应用 (Mar. 22, 2023)
- SoftBank and EdgeCortix Partner to Jointly Realize Low-latency and Highly Energy-efficient 5G Wireless Accelerators (Mar 22, 2023)
- BrainChip's Neuromorphic Technology Enables Intellisense Systems to Address Needs for Next-Generation Cognitive Radio Solutions (Mar 22, 2023)
- The Impact Of Blockchain On IoT Data Privacy (Mar. 22, 2023)
- Agile Analog 加入英特尔代工服务 IP 加速器联盟计划，推动半导体设计创新。 (Mar. 22, 2023)
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- NVIDIA携手谷歌云提供强大的新生成式AI推理平台，基于全新L4 GPU和Vertex AI构建 (Mar. 22, 2023)
- Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation (Mar 21, 2023)
- Omni Design Opens Design Center in Hyderabad, India (Mar 21, 2023)
- SkyWater Establishes Cryogenic Lab, Utilizes FormFactor's Leading Tool for RTS Noise Detection in Read-Out Integrated Circuit Applications (Mar 21, 2023)
- 類比技術在物聯網設計中的重要性日益顯著 (Mar. 21, 2023)
- 12bit 2Msps Silicon proven SAR ADC IP Core with Ultra-low power is available in different technology nodes for various applications that includes IoT, Medical, Consumer, etc (Mar 20, 2023)
- TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK (Mar 20, 2023)
- Remote.It Simplifies Secure Access to Arm Virtual Devices (Mar 20, 2023)
- Securing Memory will Take More than Cryptography Alone (Mar. 20, 2023)
- 牛芯半导体荣获深圳市专精特新中小企业认定 (Mar. 20, 2023)
- M31 hit a record high of revenue and profit in last year, and it expects to sustain a double digit growth throughout the year (Mar 17, 2023)
- CoreHW secures €4M investment to accelerate growth in indoor positioning solutions (Mar 17, 2023)
- 传俄罗斯厂商将推出基于中国产ARM芯片的单板计算机 (Mar. 17, 2023)
- 2022年第四季前十大晶圓代工產值季減4.7% (Mar. 17, 2023)
- 地缘政治增加的成本谁来负担？ (Mar. 17, 2023)
- T2M发布适用于高级网络应用的1G 以太网 PHY IP ，可以向芯片设计客户提供各工艺节点下的黑盒技术授权 (Mar. 16, 2023)
- intoPIX revolutionizes the gaming experience at GDC 2023: Image quality BEYOND reality (Mar 16, 2023)
- 台积电强援加盟 三星先进封装能否亡羊补牢 (Mar. 16, 2023)
- CEVA推出用于汽车幼儿遗忘检测系统的UWB Radar平台，以满足新兴安全规范要求 (Mar. 16, 2023)
- Imagination与CoreAVI携手推动安全关键型车规级图形应用的发展 (Mar. 16, 2023)
- VeriSilicon delivered multi-format hardware video decoder Hantro VC9000D supporting 8K@120FPS VVC/H.266 to customers (Mar 15, 2023)
- Ashling and Imagination announce Ashling's RiscFree™ C/C++ SDK support for RISC-V-based Catapult family (Mar 15, 2023)
- proteanTecs Collaborates with BAE Systems to Enable a Zero Trust Supply Chain for Defense Applications (Mar. 15, 2023)
- Telechips showcases Arm-based Dolphin5 automotive SoC at embedded world 2023 (Mar 15, 2023)
- Introducing Signature IP Corporation - Providing a Configurable And Flexible Platform for SoC Development (Mar 15, 2023)
- Codasip和IAR强强联手，共同演示用于RISC-V的双核锁步技术 (Mar. 15, 2023)
- 芯原已向客户交付支持8K@120FPS VVC/H.266的多格式视频硬件解码器Hantro VC9000D (Mar. 15, 2023)
- Imagination与Telechips通过硬件虚拟化提升汽车显示器的多样性 (Mar. 15, 2023)
- 芯原和微软携手为边缘设备部署Windows 10操作 (Mar. 15, 2023)
- ASUS IoT Announces Tinker V (Mar 14, 2023)
- Codasip and IAR demonstrate dual-core lockstep for RISC-V (Mar 14, 2023)
- SPARK Microsystems Announces CDN$48 Million Financing Led by Idealist Capital (Mar 14, 2023)
- At Embedded World 2023, Dolphin Design showcases AI-based vision applications at sub-mW level that fit in less than 1MB RAM (Mar. 14, 2023)
- VeriSilicon collaborates with Microsoft to deliver Windows 10 to the Edge (Mar 14, 2023)
- Imagination and Telechips drive automotive display diversity with hardware virtualization (Mar 14, 2023)
- Imagination and CoreAVI partner for safety-critical automotive graphics applications (Mar 14, 2023)
- Creonic Today Revealed Its New CCSDS 131.2 Wideband Demodulator IP Core with Immediate Availability (Mar. 14, 2023)
- 晶体管的另一种未来：当2D与3D交错 (Mar. 14, 2023)
- 反击RISC-V，Arm为高性能MCU添加自定义指令 (Mar. 14, 2023)
- 1G Ethernet PHY IP Cores is now available with Blackbox licensing option in various technology nodes for advanced networking applications (Mar 13, 2023)
- BrainChip integrates Akida with Arm Cortex-M85 Processor, Unlocking AI Capabilities for Edge Devices (Mar 13, 2023)
- Intrinsic ID Launches Software to Protect Billions of Smart, Connected Devices Addressing Worldwide Cybersecurity Challenges (Mar 13, 2023)
- TSMC February 2023 Revenue Report (Mar 13, 2023)
- Mythic Raises $13 Million to Bring Its Next-generation Analog Computing Solution to Market (Mar 13, 2023)
- Imperas Collaborates with MIPS and Ashling to Accelerate RISC-V Application Software Development from SoC Concept to Deployment (Mar 13, 2023)
- Veriest Solutions and Neuronix AI Labs Collaborate for Neural Network Acceleration (Mar 13, 2023)
- Total Revenue of Top 10 Foundries Fell by 4.7% QoQ for 4Q22 and Will Slide Further for 1Q23, Says TrendForce (Mar 13, 2023)
- Rambus Expands Industry-Leading Security IP Portfolio with Arm CryptoCell and CryptoIsland IP (Mar 13, 2023)
- CEVA Wi-Fi 6 IP Powers ESWIN ECR6600 Smart Connectivity IC (Mar 13, 2023)
- Intrinsic Semiconductor Technologies Secures £7m Investment to Solve the Memory Bottleneck for Data Hungry Applications (Mar 13, 2023)
- Imperas in RISC-V three way deal (Mar. 13, 2023)
- Create high-performance SoCs using network-on-chip IP (Mar. 13, 2023)
- 3纳米不尽人意！三星2023上半年转向量产第三代 4nm 芯片 (Mar. 13, 2023)
- 深度受益AI发展新浪潮！RISC-V市场规模7年料增20倍，受益上市公司有这些 (Mar. 11, 2023)
- CEVA推出UWB雷达平台 用于汽车儿童存在检测 (Mar. 11, 2023)
- EU Chips Act: Key Intellectual Property Considerations (Mar 10, 2023)
- ASICFPGA releases new ISP core supporting AXI4-Lite, AXI4-Stream, new AE, and new AWB (Mar 10, 2023)
- Cadence Verisium AI-Driven Verification Platform Accelerates Debug Productivity for Renesas (Mar 10, 2023)
- AmberSemi Announces Successful Tapeout of Silicon Chip for Patented AC Direct DC Power Delivery Technology (Mar 10, 2023)
- 超越台积电不是梦 "1.8nm"工艺明年量产 Intel关键一战很快公布 (Mar. 10, 2023)
- 中芯国际的扩产之路 (Mar. 10, 2023)
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- sureCore公布了一系列现成的超低功耗储存器IP，以帮助快速的跟踪功率关键设计 (Mar. 10, 2023)
- 日本首台"国产"量子计算机将于本月底上线 拥有64个量子比特 (Mar. 10, 2023)
- 世界首例！我国科学家发现光阴极"量子"材料 (Mar. 10, 2023)
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- T2M发布28 nm HPC+工艺下的 USB 3.2 Gen2x2 主机和设备IP以及整体解决方案，帮助芯片设计公司提供高速的数据传输芯片设计 (Mar. 09, 2023)
- Renesas to Demonstrate First AI Implementations on the Arm Cortex-M85 Processor Featuring Helium Technology at Embedded World (Mar 09, 2023)
- GOMACTech 2023: Menta, a major player in semiconductors for the defense industry (Mar 09, 2023)
- Defacto's SoC Compiler 10.0 is Released (Mar 09, 2023)
- Think Silicon to Showcase its Latest Ultra-Low-Power Graphics and AI Solutions for Edge Computing at Embedded World 2023 (Mar 09, 2023)
- CEVA Introduces UWB Radar Platform for Automotive Child Presence Detection to Meet Emerging Safety Specifications (Mar 09, 2023)
- ProvenRun and SiFive deliver RISC-V-based secure Trusted Execution Environment (TEE) (Mar 09, 2023)
- CEVA to Showcase Latest Wireless Connectivity and Smart Sensing Solutions at embedded world 2023 (Mar 09, 2023)
- TSMC's 3-nm progress report: Better than expected (Mar 09, 2023)
- QuantWare lands €6 million to roll out groundbreaking quantum processors (Mar 09, 2023)
- Blueshift Memory to use Codasip custom compute to develop new memory-efficient processor technology (Mar 09, 2023)
- Imagination launches its first edge AI course (Mar 09, 2023)
- Atlas Credit Partners Provides $85MM Investment in Coherent Logix (Mar 09, 2023)
- IAR Enables Robust End-to-End Embedded Security Solution with the Launch of IAR Embedded Trust (Mar 09, 2023)
- sureCore announces range of off-the-shelf, ultra-low power memory IP to help fast-track power critical designs (Mar 09, 2023)
- 瑞萨电子将在Embedded World展示基于Arm® Cortex®-M85处理器Helium技术的首款AI方案 (Mar. 09, 2023)
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- Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit (Mar. 08, 2023)
- Orca Launches ORC5000 Platform for Low-Power ASIC Designs (Mar. 08, 2023)
- proteanTecs Joins Intel Foundry Services (IFS) Accelerator IP Alliance Program (Mar 08, 2023)
- CAST Announces Very Versatile I2S-TDM Digital Audio Transceiver IP Core (Mar. 08, 2023)
- Sondrel extends multi-year, multi-million dollar EDA license with Synopsys (Mar 07, 2023)
- Andes Technology's N25F RISC-V Processor Enables Superior Immersive Scenarios for ASPEED Technology's Powerful Image Stitching SoC AST1230 (Mar 07, 2023)
- intoPIX showcases its innovative image processing and compression solutions for human & machine vision at Embedded World 2023 (Mar 07, 2023)
- Attopsemi OTP IP embedded in Fingerprints™ biometric solution to facilitate biometric technology (Mar 07, 2023)
- Weebit Nano ReRAM IP now available in SkyWater Technology's S130 process (Mar 07, 2023)
- Infineon and UMC Extend Automotive Partnership with Long-Term Agreement for 40nm eNVM Microcontroller Production (Mar 07, 2023)
- Weebit Nano partners with University of Florida's Nino Research Group to examine effects of radiation on Weebit ReRAM (Mar 07, 2023)
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- 台积电的远虑近忧：芯片补贴太吝啬、五大客户砍单、3nm危机 (Mar. 07, 2023)
- UMC Reports Sales for February 2023 (Mar 06, 2023)
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- Unlocking Lightning-Fast Data Transfer: USB 3.2 Gen2x2 total solution for Host and Device functionalities in 28nm HPC+ technology (Mar 06, 2023)
- Imagination：RISC-V成功不能靠争抢，而是合作 (Mar. 06, 2023)
- Tata Consultancy Services and Renesas Partner to Open Innovation Center to Develop Next-Generation Semiconductor Solutions (Mar 06, 2023)
- New controller IP core for secure data (Mar 06, 2023)
- Global Semiconductor Sales Decrease 5.2% Month-to-Month in January (Mar 06, 2023)
- Arm priced at $30-70bn (Mar 06, 2023)
- GUC Monthly Sales Report - February 2023 (Mar 06, 2023)
- Alphawave Semi Opens Ottawa Office, Expanding Canadian Presence and Technical Leadership (Mar 06, 2023)
- JEDEC Creates New Automotive Steering Subcommittee (Mar 06, 2023)
- DCD Presents RISC-V, Automotive & Cyber during Embedded World 2023 (Mar 06, 2023)
- Chevin Technology partners with Intel® (Mar 06, 2023)
- Spectral Design & Test Announces AI/ML Based Breakthrough Technology to Do Fast and Accurate Characterization & Validate Memory Compilers (Mar 06, 2023)
- BrainChip Introduces Second-Generation Akida Platform (Mar 06, 2023)
- Socionext 推出用于 5G 直接射频发射器和接收器的新型 7nm ADC 和 DAC (Mar. 06, 2023)
- AI革命时代的HPC系统及芯片发展五大趋势 (Mar. 05, 2023)
- 外媒：日本索尼和三星电子洽谈合作，计划讨论半导体供应合作 (Mar. 05, 2023)
- 芯原股份拟发行GDR并在瑞士证券交易所上市 (Mar. 04, 2023)
- CAST Enhances RISC-V Processor Line for Low-Power and Functional Safety Applications (Mar 03, 2023)
- 锐成芯微推出基于BCD工艺的三层光罩eFlash IP (Mar. 03, 2023)
- 国内首款USB3.0 HUB芯片成功进入商用 (Mar. 03, 2023)
- T2M发布支持UFS应用的MIPI M-PHY 4.1 、UFS 3.1 控制器 和 Unipro 1.8 控制器 的IP (Mar. 02, 2023)
- Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C (Mar 02, 2023)
- Safety element for automobiles, production or health can be implemented on the own microcontroller chip: RISC-V processor AIRISC-SAFETY from Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Mar 02, 2023)
- SiFive Adds Adam Dolinko as Chief Legal Officer and SVP of Corporate Development (Mar 02, 2023)
- Arm to list in New York (Mar 02, 2023)
- New Wave Design and Verification Appoints Marti Nyman as President and CEO (Mar 02, 2023)
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- Arteris Announces Financial Results for the Fourth Quarter and Full Year 2022 and Estimated First Quarter and Full Year 2023 Guidance (Mar 02, 2023)
- HDL Design House has opened New design center in Niš - Serbia (Mar 02, 2023)
- 倪光南：RISC-V是中国CPU领域最受欢迎的架构，不受垄断制约 供应链安全有保障 (Mar. 02, 2023)
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- 富提亞科技在台積電130BCD+製程上完成eFlash IP可靠度驗證，並達 (Mar. 01, 2023)
- Omni Design Technologies Awarded ISO 9001 Certification (Mar 01, 2023)
- CEVA推出其迄今功能最强大效率最高的DSP架构，满足5G-Advanced及更先进技术的大规模计 (Mar. 01, 2023)
- A transistor inspired by human synapses (Mar. 01, 2023)
- 全球掀起生成式AI投资热潮 (Mar. 01, 2023)
- Vitruvius+: An Area-Efficient RISC-V Decoupled Vector Coprocessor for High Performance Computing Applications (Mar. 01, 2023)
- Arteris and SiFive Partner to Accelerate RISC-V SoC Design of Edge AI Applications (Feb 28, 2023)
- Xiphera announces collaboration with Spinnaker Systems for sales of cryptographic IP in Japan (Feb 28, 2023)
- Agile Analog announces first customisable, process agnostic, 12-bit ADC IP (Feb. 28, 2023)
- Truechip Announces Early Adopter Version of Sub-System Verification IP (Feb 28, 2023)
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- Avery Design Debuts CXL Validation Suite (Feb 28, 2023)
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- 细谈Intel未来几年的技术规划，及其中国2.0战略 (Feb. 28, 2023)
- 灿芯半导体与德国莱茵TÜV ISO 26262功能安全项目正式启动 (Feb. 28, 2023)
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- Keysight Expands EDA Software Portfolio with the Acquisition of Cliosoft (Feb 27, 2023)
- MIPI M-PHY 4.1 IP, UFS 3.1 Controller IP & Unipro 1.8 Controller IP Cores are available for instant licensing to support your total UFS applications (Feb 27, 2023)
- IC'ALPS announces successful physical implementation of a demo-chip designed for Weebit Nano's ReRAM technology (Feb 27, 2023)
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- 英特尔CEO反击3nm延迟传闻 Arrow Lake等项目都会在2024年亮相 (Feb. 24, 2023)
- T2M发布12 bit 5G采样速率的电流型 DAC IP，可用于高速通信和汽车 SoC 芯片设计 (Feb. 23, 2023)
- CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond (Feb. 23, 2023)
- Secure-IC & Trasna are introducing a revolutionary PUF solution that eliminates the need of enrollment phase (Feb. 23, 2023)
- Ventana Micro Selects Imperas Solutions for RISC-V Processor Verification (Feb 23, 2023)
- Veriest Solutions to Present Two Verification Papers at DVCon US Conference (Feb 23, 2023)
- M31 earned NT$12.16 per share in 2022 and approved dividend of NT$8 in cash and NT$1 equivalent in stock (Feb 23, 2023)
- Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller (Feb 23, 2023)
- Startup AiM Future Set to Commercialize LG's AI IP (Feb 23, 2023)
- Intrinsic ID to Showcase its Expanding Line of Security Solutions at Embedded World 2023 (Feb 23, 2023)
- 台积电3nm产能，被苹果全包了 (Feb. 23, 2023)
- Arteris推出下一代FlexNoC 5物理感知片上网络IP (Feb. 23, 2023)
- 2023 年汽车行业将面临的 8 大网络安全威胁 (Feb. 23, 2023)
- 营收持续增长，芯原股份2022年净利润同比大涨4.5倍 (Feb. 23, 2023)
- Arteris Unveils Next-Generation FlexNoC 5 Physically Aware Network-on-Chip IP (Feb 22, 2023)
- Pleora Scores a 10 with New High-Performance GigE Vision Embedded Interface (Feb 22, 2023)
- Socionext Introduces New 7nm ADC and DAC for 5G Direct RF Transmitters and Receivers (Feb. 22, 2023)
- Chiplet小芯片时代中的国产EDA (Feb. 22, 2023)
- 国内首款基于Chiplet的AI芯片亮相，华为最早布局的小芯片成弯道超车新机遇？ (Feb. 22, 2023)
- 再谈RISC-V有没有机会，搞定高性能市场 (Feb. 22, 2023)
- 超前業界需求 PCIe 6.0大改版 (Feb. 22, 2023)
- 三星电子5纳米工艺由安霸应用于全新汽车AI域控制器芯片 (Feb. 22, 2023)
- Non-Volatile Memory: What Will 2023 Bring? (Feb 21, 2023)
- Qualinx Raises €8 Million to Bring Game-Changing Digital RF Technology to Market (Feb 21, 2023)
- Faraday Reports Record-High Revenue and Net Income for Full-Year 2022 (Feb 21, 2023)
- 消息称台积电欧洲建厂延后两年 最快2025年才会开工 (Feb. 20, 2023)
- ESA and UK Space Agency back EnSilica to develop satellite broadband chip (Feb 20, 2023)
- Arm China profit falls 90% (Feb 20, 2023)
- Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe (Feb 20, 2023)
- 12bit 5Gsps Current Steering DAC IP Core for Highspeed Communication and Automotive SoCs is available for immediate licensing (Feb 20, 2023)
- Cadence Delivers 13 New VIP and Expands System VIP Portfolio to Accelerate Automotive, Hyperscale Data Center and Mobile SoC Verification (Feb 20, 2023)
- Weebit Nano to demonstrate new silicon at Embedded World 2023 (Feb 20, 2023)
- Arctic Semiconductor Ships Its First 5G RF Chipset, IceWings, for the 5G Market (Feb 20, 2023)
- 芯来科技彭剑英：国内RISC-V应用在专用领域引领发展 (Feb. 20, 2023)
- Accurate Positioning Systems and Proximity Solutions with CoreHW Bluetooth® AoA and AoD Antenna Modules (Feb 17, 2023)
- 消息称苹果大幅削减台积电订单 总共调整12万片N7、N5、N4加上部分N3产线 (Feb. 17, 2023)
- 软银任命新管理层第一年 ARM中国净利润暴跌96% (Feb. 17, 2023)
- OPENEDGES 的 TSS 与 imec.IC-link US合作推出 两款7纳米测试芯片 (Feb. 16, 2023)
- T2M发布用于物联网应用程序设计的Wi-Fi 6（ax）/BLE/15.4 22nm组合射频IP (Feb. 16, 2023)
- The Six Semiconductor of OPENEDGES Technology Collaborates with imec.IC-link US to Tape-out Two 7nm Testchip (Feb 16, 2023)
- Tachyum Validates Prodigy Universal Processor with Kubernetes for High-Performance, High-Density Computing for Containers (Feb 16, 2023)
- Cadence Reports Fourth Quarter and Fiscal Year 2022 Financial Results (Feb 16, 2023)
- embedded world 2023: Codasip presents on custom compute and RISC-V design (Feb 16, 2023)
- NIST Selects "Lightweight Cryptography" Algorithms to Protect Small Devices (Feb 16, 2023)
- Oculi Forms strategic partnership with GlobalFoundries to advance edge sensing technology (Feb 16, 2023)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2023 (Feb 16, 2023)
- RISC-V为超级计算做好准备了吗? (Feb. 16, 2023)
- 英特尔研究院高级研究专家：英特尔正在探索负责任的生成式AI (Feb. 16, 2023)
- 传联电拟5000亿日元日本建新厂 联电回应 (Feb. 16, 2023)
- Andes And IAR Systems Together Enable Leading Vendor ILITEK To Accelerate The Development Of Its ISO 26262 Ready TDDI SoC ILI6600A (Feb 15, 2023)
- Intrinsic ID Protects 500,000,000 Devices Globally: Leading the Way in Secure and Authenticated Connected Devices (Feb 15, 2023)
- CEVA, Inc. Announces Fourth Quarter and Full Year 2022 Financial Results (Feb 15, 2023)
- 150家半导体企业IPO最新进展（附企业名录） (Feb. 15, 2023)
- 三星和SK海力士正受益于HBM订单热潮 (Feb. 14, 2023)
- intoPIX showcases its new JPEG XS solutions to simplify IP video production workflow at HPA Tech Retreat 2023 (Feb 14, 2023)
- Xiphera and Muspark Technologies announce a partnership to enter the Indian technology market (Feb 14, 2023)
- Arm China lays off 14% of staff (Feb 14, 2023)
- EDA/IP三大最新技术发展趋势：EDA Cloud/AI、Chiplet和3D-IC (Feb. 14, 2023)
- 面向低功耗工业4.0应用的可编程安全功能 (Feb. 14, 2023)
- Würth Elektronik Partners with Crypto Quantique for IoT Security (Feb 13, 2023)
- TSMC January 2023 Revenue Report (Feb 13, 2023)
- Wi-Fi 6 (ax)/BLE/15.4 22nm Combo RF IP Core, for IoT Application Is Available for Immediate Licensing (Feb 13, 2023)
- Bluetooth SIG Introduces Wireless Standard for Electronic Shelf Label Market (Feb 13, 2023)
- AccelerComm to deliver cell service from space with 5G NTN LEO (Feb. 13, 2023)
- 中国RISC-V的长征才刚刚开始 (Feb. 13, 2023)
- 真正的全局光照：IMG DXT面向大众的光线追踪方案 (Feb. 13, 2023)
- 5G高算力智能模组：引领AIoT进入摩尔定律时代 (Feb. 12, 2023)
- 苹果什么时候会转向RISC-V？ (Feb. 12, 2023)
- Secure Optical Data Communication Using Quantum Cryptography and Li-Fi (Feb. 12, 2023)
- 2023年上海市重大工程清单公布，中芯国际等项目在列 (Feb. 10, 2023)
- indie to Acquire GEO Semiconductor (Feb 10, 2023)
- Andes Technology: Stepping into the 18th Year with Perseverance and Proud Accomplishments (Feb 10, 2023)
- GlobalFoundries and GM Announce Long-Term Direct Supply Agreement for U.S. Production of Semiconductor Chips (Feb 10, 2023)
- Sharp, Motorola Mobility, and Kyocera Join Access Advance's HEVC Advance Patent Pool as Licensees (Feb 10, 2023)
- 新思科技DSO.ai助力客户完成100次流片，引领AI在芯片设计中的规模化应用 (Feb. 10, 2023)
- 牛芯半导体荣获国家高新技术企业认定 (Feb. 10, 2023)
- 中芯国际发布2022 Q4财报，全年营收突破72亿美元 (Feb. 10, 2023)
- 三星、台积电削减投资 中芯国际逆周期增长：不搞低价竞争 (Feb. 10, 2023)
- 未來車用市場將以軟體定勝負 (Feb. 10, 2023)
- Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs (Feb 09, 2023)
- SMIC Reports 2022 Fourth Quarter Results (Feb 09, 2023)
- GlobalFoundries Acquires Renesas' Non-Volatile Resistive RAM Technology to Proliferate IoT and 5G Applications (Feb 09, 2023)
- Rambus Reports Fourth Quarter and Fiscal Year 2022 Financial Results (Feb 09, 2023)
- GlobalFoundries收购瑞萨的非易失性电阻式RAM技术，推动物联网和5G应用的发展 (Feb. 09, 2023)
- 没有什么能阻止RISC-V (Feb. 09, 2023)
- T2M发布极具可靠性的外设接口类IP，已通过硅验证，可应用于汽车电子芯片的设计 (Feb. 08, 2023)
- ShortLink AB joins X-FAB's Design & Supply Chain Partner Network and IP Portal (Feb 08, 2023)
- HARMAN and proteanTecs Collaborate to Advance Predictive and Preventive Maintenance for Automotive Electronics (Feb 08, 2023)
- Embedded World 2023: Logic Fruit Technologies to Unveil Cutting-Edge Technology Solutions (Feb 08, 2023)
- 【芯视野】三大代工巨头的2023：各有难念的经 (Feb. 08, 2023)
- Arm 技术正构建未来：多元化的市场发展持续助推权利金及授权许可营收的强劲增长，生态系统伙伴达 2,500 亿颗芯片出货量里程碑 (Feb. 08, 2023)
- Chiplet（芯粒）互联：从一团乱麻（BoW）到统一互联标准（UCIe） (Feb. 08, 2023)
- ZeroPoint Technologies raises EUR 3.2 million in seed funding to reduce energy consumption of data centers by more than 25% (Feb 07, 2023)
- T2M发布超低功耗10bit 3Msps SAR ADC IP，帮助客户进行无线通信以及汽车SoC芯片的设计 (Feb. 07, 2023)
- AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology (Feb 07, 2023)
- QuickLogic Drives eFPGA Innovation with New Aurora™ Development Tool Suite (Feb 07, 2023)
- Arm Q3 FY22 financial results (Feb 07, 2023)
- Worldwide Silicon Wafer Shipments and Revenue Set New Records in 2022, SEMI Reports (Feb 07, 2023)
- 晶心科技推出功能豐富、低功耗且高度安全的入門級 RISC-V 處理器 AndesCore™ D23 (Feb. 07, 2023)
- Peripheral IPs with proven automotive compatibility are instantly licensable for extremely reliable performance. (Feb 06, 2023)
- UMC Reports Sales for January 2023 (Feb 06, 2023)
- Gartner Says Top 10 Semiconductor Buyers Decreased Chip Spending by 7.6% in 2022 (Feb 06, 2023)
- GUC Monthly Sales Report - January 2023 (Feb 06, 2023)
- DVB-RCS2 Turbo Decoder and Encoder IP Core Available For Integration From Global IP Core (Feb 06, 2023)
- Global Semiconductor Sales Increase 3.2% in 2022 Despite Second-Half Slowdown (Feb 06, 2023)
- Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs (Feb 06, 2023)
- Denying China IC Manufacturing Tools (Feb 06, 2023)
- U.S. Ban on Huawei Seen Widening China Chip War (Feb 06, 2023)
- 边缘人工智能，从传感器融合到深度神经网络 (Feb. 06, 2023)
- 台积电宣布向学界开放16nmFinFET技术 (Feb. 05, 2023)
- 先进封装-从2D，3D到4D封装 (Feb. 05, 2023)
- 芯片制程背后的秘密：三星、台积电的3nm，实际是22nm？ (Feb. 04, 2023)
- 这会是RISC-V的大挑战？ (Feb. 04, 2023)
- 联华电子和Cadence共同合作开发3D-IC混合键合（hybrid-bonding）参考流程 (Feb. 03, 2023)
- 晶心科技与QuickLogic合作，在RISC-V SoC上轻松集成EFPGA (Feb. 03, 2023)
- GreenWaves Technologies announces a €20M financing (Feb 02, 2023)
- Xfuse, LLC Phoenix ISP Now Available as a Download for AMD Kria KV260 Vision AI Starter Kit (Feb 02, 2023)
- Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance (Feb 02, 2023)
- TOP 100｜芯启源蝉联2022投中榜·锐公司百强榜单 (Feb. 02, 2023)
- UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow (Feb 01, 2023)
- 西门子通过新的数据驱动的 Questa Verification IQ 软件推进集成电路验证 (Feb. 01, 2023)
- 物联网市场规模迅速扩张 欧菲光加码布局IoT生态寻求新发展 (Feb. 01, 2023)
- 智原推出ASIC跨地域生產支援服務 強化永續經營 (Jan. 31, 2023)
- Faraday Announces Multi-site Manufacturing Support in ASIC (Jan 31, 2023)
- Hardware Root of Trust: The Key to IoT Security in Smart Homes (Jan 31, 2023)
- Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution (Jan 31, 2023)
- Tachyum Successfully Runs UEFI on Prodigy FPGA (Jan 31, 2023)
- Siemens advances integrated circuit verification with new, data-driven Questa Verification IQ software (Jan 31, 2023)
- QuickLogic Partners with Andes Technology for eFPGA Joint Promotion (Jan 31, 2023)
- 中国最新量子计算机"悟空"即将问世，已具备整机成功交付能力 (Jan. 31, 2023)
- Intel kills its RISC-V Pathfinder development kit programme (Jan 30, 2023)
- BrainChip Tapes Out AKD1500 Chip in GlobalFoundries 22nm FD SOI Process (Jan 30, 2023)
- 10-bit 3Msps Ultra low power SAR ADC IP core for Wireless Communication and Automotive SoCs is available for immediate licensing (Jan 30, 2023)
- Linaro to Acquire Arm Forge Software Tools Business (Jan 30, 2023)
- 相控陣列天線：從軍用到5G (Jan. 30, 2023)
- 149家科创板公司预告业绩 超六成预喜 "芯""新"赛道动能十足 (Jan. 30, 2023)
- Q4 loss at Intel (Jan 30, 2023)
- Gidel introduces groundbreaking edge computer with NVIDIA Jetson Orin NX system-on-module and high-bandwidth camera frame grabber for real-time image acquisition compute and AI processing (Jan 30, 2023)
- EU Parliament Adopts Position on Chips Act (Jan 30, 2023)
- 英特尔放弃RISC-V？官方回应：并不！ (Jan. 29, 2023)
- 美国和欧盟宣布首个全面人工智能协议，未来将邀请更多国家加入 (Jan. 29, 2023)
- 外资：台积电前景比股价更重要，折射半导体业增速将触近年低点 (Jan. 29, 2023)
- 日本企业Rapidus计划最早2025年试制2纳米半导体 (Jan. 28, 2023)
- 2023，晶圆代工台企海外扩产的关键年 (Jan. 28, 2023)
- 2023年新能源汽车产业链十大趋势展望：千万级销量目标提速供应链布局 (Jan. 28, 2023)
- 5G+AI：IoT下半场的智能化底座 (Jan. 28, 2023)
- 研发人手不足？苹果暂停自研Wi-Fi芯片工作 (Jan. 28, 2023)
- 初入GPU赛道，RISC-V能否取得好表现？ (Jan. 27, 2023)
- Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies (Jan 26, 2023)
- intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023 (Jan 26, 2023)
- Sevya joins TSMC Design Center Alliance (Jan 26, 2023)
- IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS (Jan 26, 2023)
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products (Jan 26, 2023)
- Axiomise Accelerates Formal Verification Adoption Across the Industry (Jan 26, 2023)
- Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design (Jan 25, 2023)
- Weebit Nano nears productisation, negotiating initial customer agreements (Jan 25, 2023)
- Open Compute Project Foundation and JEDEC Announce a New Collaboration (Jan 25, 2023)
- Nexperia invests in sustainable alternatives to batteries (Jan 24, 2023)
- VORAGO Technologies to Move All its Manufacturing Stateside in Strategic Partnership with SkyWater's Trusted Foundry (Jan 24, 2023)
- The latest ASIL-B,C,D, ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing (Jan 23, 2023)
- The latest ASIL-B,C,D and ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing (Jan 23, 2023)
- Accellera Announces the Formation of the Clock Domain Crossing Working Group (Jan 23, 2023)
- Accellera's Security Annotation for Electronic Design Integration Standard 1.0 Moves Toward IEEE Standardization (Jan 23, 2023)
- Xiphera announces the first IP core for the quantum-secure xQlave™ product family (Jan 23, 2023)
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- AI Must Be Secured at the Silicon Level (Jan 23, 2023)
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- CEO Interview: Stephen Fairbanks of Certus Semiconductor (Jan 23, 2023)
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- 客座评论：台积电来了也救不了德国车 (Jan. 22, 2023)
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- Comcores TSN technology and 5G communication expertise to be deployed in a significant EU funded project with pan-European partners (Jan 20, 2023)
- CEVA音频前端软件解决方案通过Alexa语音服务（AVS）认证 (Jan. 20, 2023)
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- 半導體原廠計畫轉型 通路商樂見其成 (Jan. 19, 2023)
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- 汽车芯片短缺仍在持续 2023年将减产300万辆！ (Jan. 18, 2023)
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- Settlement Reached in Lawsuit Brought by Tachyum Against Cadence (Jan 17, 2023)
- Gartner Says Worldwide Semiconductor Revenue Grew 1.1% in 2022 (Jan 17, 2023)
- 台积电3nm成功量产，稳了吗？ (Jan. 17, 2023)
- 晶心科技和 Parasoft 合力為汽車功能安全應用提供無縫的軟體測試工具 (Jan. 17, 2023)
- Unveiling the Future of Home Entertainment: a truly immersive Multimedia experience through HDMI 1.4 Tx-Rx PHY and Controller IP Cores (Jan 16, 2023)
- Analog IPs Automate Integration, Tune to Fab Nodes (Jan 16, 2023)
- National Instruments up for sale (Jan 16, 2023)
- Alphawave IP 2022年第四季度交易和业务更新文告 (Jan. 16, 2023)
- 以5G打造港口4.0 (Jan. 16, 2023)
- Chiplet利好消息密集催化！产业链上市公司一览 (Jan. 15, 2023)
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- Imagination collaborates with Synopsys to accelerate 3D visualisation in mobile and data centre (Jan 13, 2023)
- Alphawave Semi: Q4 2022 Trading and Business Update (Jan 13, 2023)
- Certus Semiconductor releases ESD library in GlobalFoundries 12nm Finfet process (Jan 13, 2023)
- Alphawave to outline long-term strategy and financial targets (Jan 13, 2023)
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- 台积电正研究如何降低3nm制程技术的成本 (Jan. 13, 2023)
- 接棒"后摩尔时代"，Chiplet将利好全产业链 (Jan. 13, 2023)
- 三星推出高性能PCIe 4.0 SSD，能效暴增70% (Jan. 13, 2023)
- CES 2023：ADAS回歸主導地位 (Jan. 13, 2023)
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- Bluespec collaborates with Synopsys to address growing verification demands for RISC-V design community (Jan 12, 2023)
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- VSORA Secures $4.2 Million in Financing from Otium Capital, Angel Investors (Jan 12, 2023)
- Chipletz selects Siemens' EDA solutions for its Smart Substrate IC packaging technology (Jan 12, 2023)
- EDA Tools for Analog: Where Do I Go From Here? (Jan 12, 2023)
- Apple to replace Broadcom IC with in-house designed part (Jan 12, 2023)
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- CES 2023：汽车技术之风吹向哪里? (Jan. 06, 2023)
- Cadence Tensilica HiFi DSP 助力车载杜比全景声系统实现高效节能的音频播放技术 (Jan. 06, 2023)
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- CES 2023：汽车技术之风吹向哪里? (Jan. 06, 2023)
- Dolphin Design and Neovision joint forces to make AI processing viable for ambient computing electronics (Jan 05, 2023)
- GUC Monthly Sales Report - December 2022 (Jan 05, 2023)
- CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution (Jan 05, 2023)
- €270m for RISC-V chiplets to build European exascale supercomputers (Jan 05, 2023)
- Ventana Introduces CES Audience to World's Highest Performance RISC-V CPU, Veyron V1 (Jan 05, 2023)
- VESA Showcases Product Demos Supporting DisplayPort 2.1 and Other High-Performance Video Standards at CES 2023 (Jan 05, 2023)
- Syntiant Unveils NDP115 Neural Decision Processor at CES 2023 (Jan 05, 2023)
- SNIA Spec Gets Data Moving in CXL Environment (Jan 05, 2023)
- SkyWater Technology Expands Borrowing Capacity by Closing New $100 Million Senior Secured Revolving Credit Facility (Jan 05, 2023)
- SpacemiT makes important breakthroughs in RISC-V High-Performance Cores (Jan 05, 2023)
- 三星3nm将采用高端EUV薄膜 (Jan. 05, 2023)
- Chiplet，拯救国产"芯"命门 (Jan. 05, 2023)
- Google、Intel、腾讯等大厂相继入局，RISC-V 终将彻改半导体行业 (Jan. 05, 2023)
- 瑞萨电子推出首款支持新Matter协议的Wi-Fi开发套件 (Jan. 05, 2023)
- intoPIX shows the new lightweight video compression standards and technologies driving automotive at CES 2023 (Jan 04, 2023)
- CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances (Jan 04, 2023)
- ICS 2022回顾 | 牛芯半导体助力中国 (Jan. 04, 2023)
- Weebit Nano tapes-out first 22nm demo chip (Jan 03, 2023)
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- RISC-V Summit 2022: All Your CPUs Belong to Us (Jan 03, 2023)
- intoPIX Showcases Ultra-low Latency Wireless Display Concept at CES Las Vegas 2023 (Jan. 03, 2023)
- Edge Impulse and BrainChip Partner to Further AI Development with Support for the Akida platform (Jan. 03, 2023)
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- 台积电3纳米良率估算 (Jan. 01, 2023)
- 聯電持續深化智財權布局及管理 獲國家級肯定 (Jan. 01, 2023)
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- 中科院RISC-V开源处理器香山第二代计划明年Q1流片 (Dec. 30, 2022)
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- 亚马逊云科技首席信息安全官 CJ Moses预测2023年六大安全趋势 (Dec. 28, 2022)
- 【2023展望】Imagination：知识产权将在应对下行周期时发挥重要作用 (Dec. 28, 2022)
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- Cadence 宣布为新一代 AI、汽车和移动应用推出业界一流的 8533Mbps LPDDR5X IP 解决方案 (Dec. 27, 2022)
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- Cadence Announces Industry Best-In-Class 8533Mbps LPDDR5X IP Solution for Next-Generation AI, Automotive and Mobile Applications (Dec 26, 2022)
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- 消息称台积电亚利桑那工厂获得特斯拉 4nm 芯片订单 (Dec. 23, 2022)
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- IAR Embedded Workbench 将支持 RISC-V 太空级处理器 NOEL-V (Dec. 23, 2022)
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- Stellantis Completes Acquisition of aiMotive to Accelerate Autonomous Driving Journey (Dec 22, 2022)
- BSC develops four open-source hardware components based on RISC-V, contributing to open, reliable and high-performance safety-critical systems for industry (Dec 22, 2022)
- intoPIX TicoRAW technology empowers mobile devices, sensors, and cameras at CES 2023 (Dec 22, 2022)
- Axelera AI Announces Metis AI Platform (Dec 22, 2022)
- 5G在全球經濟挑戰中持續成長 (Dec. 22, 2022)
- PEZY Computing Selects proteanTecs to Monitor Die-to-Die Interconnects in Next-Generation Supercomputer Processors (Dec 21, 2022)
- Dream Chip Technologies Licensed its Real-time Pixel Processor IP to Renesas (Dec 21, 2022)
- IPrium releases 100 Gbps Polar Encoder and Decoder (Dec 21, 2022)
- 三星推出最先进的DDR5 DRAM：EUV技术、7.2Gbps、功耗降低23%.. (Dec. 21, 2022)
- 索尼半导体新的集成芯片组具有多个无线电，可实现大规模物联网连接 (Dec. 21, 2022)
- Efinix® Releases Efinity® RISC-V Embedded Software IDE (Dec 20, 2022)
- GbE (10/100/1000Base-T) PHY IP Core, a robust, low-power, fully featured IP Core along with MAC Controller IP Core is available for immediate licensing (Dec 20, 2022)
- U.S. Blacklists YMTC, 21 Chinese Companies on AI Threat (Dec 20, 2022)
- Arm在下一轮新技术中将有哪些革新？ (Dec. 20, 2022)
- 相控阵天线从军用到5G应用趋势 (Dec. 20, 2022)
- Synopsys Initiates $300 Million Accelerated Share Repurchase Agreement (Dec 19, 2022)
- Low-Power Apps, Foundries Eye Emerging Memories (Dec 19, 2022)
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- 革新践行 再聚ICCAD - Socionext携创新科技亮相ICCAD2022 (Dec. 19, 2022)
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- Labwise by Allegro DVT Introduces StreamWise-ATSC Test Suites to Accelerate Conformance Testing of ATSC 3.0 Receivers (Dec 16, 2022)
- Global Total Semiconductor Equipment Sales Forecast to Reach Record High in 2022, SEMI Reports (Dec 16, 2022)
- 中国首个原生Chiplet技术标准发布 (Dec. 16, 2022)
- 結合AI、雲端 Cadence持續助力加速複雜IC設計流程 (Dec. 16, 2022)
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- T2M发布USB 3.2 OTG 控制器和 PHY IP ，实现超高速、无损的数据传输及电源供电 (Dec. 15, 2022)
- DDMA, multi-channel DMA Controller IP core from DCD-SEMI (Dec 15, 2022)
- Arm declines to sell Neoverse V to Alibaba (Dec 15, 2022)
- Ventana Introduces Veyron, World's First Data Center Class RISC-V CPU Product Family (Dec 15, 2022)
- New CAES, IAR Systems Partnership Brings NOEL-V Support to IAR Embedded Workbench (Dec 15, 2022)
- Imagination extends its commitment to RISC-V with an upgrade to Premier level membership (Dec 15, 2022)
- Quadric Announces Completion of Series B Funding (Dec 15, 2022)
- Codasip Lead IP Architect chosen for the RISC-V Contributor Award (Dec 15, 2022)
- Total Revenue of Global Top 10 IC Design Houses for 3Q22 Showed QoQ Drop of 5.3%; Broadcom Returned to No. 2 Spot in Revenue Ranking by Overtaking NVIDIA and AMD, Says TrendForce (Dec 15, 2022)
- RISC-V 成功运行安卓 12，阿里平头哥公布融合新进展 (Dec. 15, 2022)
- ARM限制对阿里巴巴出售最新系列芯片 (Dec. 15, 2022)
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- Cadence 荣获六项 2022 TSMC OIP 年度合作伙伴大奖 (Dec. 15, 2022)
- SiFive Delivers Record Growth in 2022 with Fast-Growing Roster of New Customers and Products (Dec 14, 2022)
- JEDEC Publishes Automotive Solid State Drive (SSD) Device Standard (Dec 14, 2022)
- Examining the Top Five Fallacies About RISC-V (Dec 14, 2022)
- Pragmatic Semiconductor increases Series C funding to $125 million (Dec 14, 2022)
- Latest aiWare4+ automotive NPU brings enhanced programmability, flexibility and scalability while retaining highest efficiency (Dec 14, 2022)
- 台积电：2025年用几纳米？3D封装怎么整？ (Dec. 14, 2022)
- XMOS announces software-defined SoC platform now compatible with RISC-V (Dec 13, 2022)
- Faraday Unveils SONOS eFlash Platform with Infineon on UMC 40uLP (Dec 13, 2022)
- LeWiz released RISC-V with OmniXtend clustering technology to open source. (Dec 13, 2022)
- 智原與英飛凌聯手推出聯電40uLP SONOS eFlash平台 (Dec. 13, 2022)
- Breker Verification Systems Unveils Easy-To-Adopt Integrity FASTApps Targeting RISC-V Processor Core, SoC Verification Scenarios (Dec 13, 2022)
- KI-FLEX AI chip tapes out with flexible videantis processor platform (Dec 13, 2022)
- Cadence Wins Six 2022 TSMC OIP Partner of the Year Awards (Dec 13, 2022)
- CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022 (Dec 13, 2022)
- Intrinsic ID to Showcase its Security Solutions at CES 2023 (Dec 13, 2022)
- NSITEXE Qualifies Imperas RISC-V Reference Models for Akaria Processors NS72A, NS72VA, and NS31A (Dec 13, 2022)
- Siemens pioneers commercial grade Linux support for the RISC-V architecture (Dec 13, 2022)
- CAES' Quad-Core LEON4FT on its Way to the Moon (Dec 13, 2022)
- RISC-V Sees Significant Growth and Technical Progress in 2022 with Billions of RISC-V Cores in Market (Dec 13, 2022)
- Microchip Showcases RISC-V-Based FPGA and Space-Compute Solutions at RISC-V Summit (Dec 12, 2022)
- BrainChip Joins Intel Foundry Services to Advance Neuromorphic AI at the Edge (Dec 12, 2022)
- USB 3.2 OTG Controller and PHY IP Cores for ultra-high speed, lossless data and power delivery are available for immediate licensing (Dec 12, 2022)
- Sofics joins the Intel Foundry Services (IFS) Accelerator IP Alliance program (Dec 12, 2022)
- QuarkLink scalable IoT Security Platform Now Available on 30-Day Free Trial (Dec 12, 2022)
- Imperas releases new updates, test suites, and functional coverage library to support the rapid growth in RISC-V Verification (Dec 12, 2022)
- MIPS Partners With Mobileye to Accelerate Next Generation Autonomous Driving Technologies and Advanced Driver Assistance Systems (Dec 12, 2022)
- MIPS Announces Availability of its first RISC-V IP core - the eVocore P8700 Multiprocessor (Dec 12, 2022)
- Global Chip Industry Projected to Invest More Than $500 Billion in New Factories by 2024, SEMI Reports (Dec 12, 2022)
- Tata may make chips (Dec 12, 2022)
- Codasip launches SecuRISC5 initiative (Dec 12, 2022)
- Codasip 宣布成立 Codasip 实验室，以加速行业前沿技术的开发和应用！ (Dec. 12, 2022)
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- 英特尔官宣：4nm准备完毕，明年量产3nm (Dec. 10, 2022)
- 意法半导体或将进军10nm工艺 (Dec. 10, 2022)
- TSMC November 2022 Revenue Report (Dec 09, 2022)
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- T2M发布经过12FFC工艺硅验证的DDR4/LPDDR4/DDR3L 组合PHY IP核，实现无缝的DRAM访问 (Dec. 08, 2022)
- Apple, AMD Back TSMC's Tripled Investment, Tech Upgrade in Arizona (Dec 08, 2022)
- Andes Announces RISC-V Multicore 1024-bit Vector Processor: AX45MPV (Dec 08, 2022)
- Global Top 10 Foundries' Total Revenue Grew by 6% QoQ for 3Q22, but Foundry Industry's Revenue Performance Will Enter Correction Period in 4Q22, Says TrendForce (Dec 08, 2022)
- Imperas and Imagination collaborate on providing virtual platform models for the Catapult RISC-V CPU family (Dec 08, 2022)
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- 三星、LG追加数十亿美元投资越南，押宝"下一个世界工厂"？ (Dec. 08, 2022)
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- Intel Pathfinder for RISC-V: New Capabilities and A Growing Ecosystem (Dec 06, 2022)
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- Arteris FlexNoC Interconnect Licensed by Telechips for Use in Advanced Automotive Applications (Dec 06, 2022)
- Avery Design Systems Announces SimXACT-SA™ for Improved Sequential X-Verification (Dec 06, 2022)
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- GUC Monthly Sales Report - November 2022 (Dec 05, 2022)
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- Implement seamless DRAM processing speeds utilizing Silicon Proven DDR4/LPDDR4/DDR3L Combo PHY IP Core in 12FFC process technology (Dec 05, 2022)
- Eliyan eliminates silicon interposer to advance D2D chiplet connect for HPC (Dec 05, 2022)
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- Morse Micro Supercharges its Series B Funding Round with AU $30 Million Top-up from Major Superannuation Funds and Others (Nov 29, 2022)
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- SiFive Expands Presence in India to Keep Up with the Company's Ultra-fast Growth (Nov 29, 2022)
- The MOSIS Service of the USC Information Sciences Institute and SkyWater Collaborate on Silicon IC Design Enablement and Manufacturing Service (Nov 29, 2022)
- CAES Design Win of RISC-V/NOEL-V IP for Idaho Scientific Secure Processor for US Critical Infrastructure (Nov 29, 2022)
- RISC-V Summit 2022: Codasip to showcase processor customization, and safety and security solutions (Nov 29, 2022)
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- Tiempo Secure gears for further expansion with Mikael Dubreucq and Frederic Heitzmann hired in newly created key positions (Nov 28, 2022)
- 三星计划在印度南部投资制造4G、5G设备 (Nov. 28, 2022)
- Gartner Forecasts Worldwide Semiconductor Revenue Growth to Decline 3.6% in 2023 (Nov 28, 2022)
- CAN 2.0 and LIN 2.2 Controller IP Cores with ASIL B, C and D packages for High-End Automotive and Consumer Applications (Nov 28, 2022)
- Cortus announces the launch of LOTUS family with two new RISC-V microcontrollers (MCUs) (Nov 28, 2022)
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- 利用RISC-V客製化擴展優化TWS耳機PPA (Nov. 28, 2022)
- 芯原NPU IP荣获"中国半导体创新产品和技术"奖 (Nov. 26, 2022)
- 更具成本效益 新技術代工廠模式受矚目 (Nov. 25, 2022)
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- 俄罗斯自研CPU拥有48核心 采用16nm工艺 (Nov. 24, 2022)
- RISC-V 与 x86、Arm 再起争端 (Nov. 24, 2022)
- Defacto's SoC Compiler Certified ISO26262 (Nov 24, 2022)
- 中国自动驾驶遭宫刑 (Nov. 24, 2022)
- IPrium releases CCSDS TM Telemetry AR4JA LDPC Encoder and Decoder (Nov 24, 2022)
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- EU edges closer to Chips Act (Nov 24, 2022)
- Global NAND Flash Revenue Fell by 24.3% QoQ for 3Q23 as Suppliers Made Large Price Concessions That in Turn Impacted Their Results, Says TrendForce (Nov 24, 2022)
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- Aniah raises €6 million to speed up the deployment of its verification and design support software for semiconductors (Nov 22, 2022)
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- Arm public offer likely to be postponed beyond Q123 (Nov 22, 2022)
- Intel foundry boss to leave (Nov 22, 2022)
- Embrace the new age of ultra-high-definition multimedia with HDMI 2.0 Rx PHY IP Cores in 12FFC process technology with matching controller (Nov 21, 2022)
- BrainChip Names Former Arm Executive Nandan Nayampally as Chief Marketing Officer (Nov 21, 2022)
- Imagination partners with MulticoreWare Inc. and demonstrates superior performance of its GPUs (Nov 21, 2022)
- CAES Supports NASA's Return to the Moon (Nov 21, 2022)
- 仅靠Chiplet，救不了中国芯 (Nov. 21, 2022)
- ARM路线难圆自主CPU之梦 (Nov. 19, 2022)
- Synopsys Wins Six Partner of the Year Awards at TSMC 2022 OIP Ecosystem Forum (Nov 18, 2022)
- 格芯与Fabrinet合作推出90nm硅光子工艺的光纤连接 (Nov. 18, 2022)
- Alphawave IP宣布荣获德勤奖项 (Nov. 18, 2022)
- Small code, high performance: Latest IAR Embedded Workbench for RISC-V leverages CoDense™ from Andes (Nov 17, 2022)
- intoPIX enables JPEG XS high frame rates real-time encoding from 120fps to more than 1000fps with the TicoXS FPGA IP-cores (Nov 17, 2022)
- Secure-IC and Unseenlabs Partner to Retrofit Satellites already in Mission Mode with the Capability to Secure and Authenticate Data using Post-Quantum Cryptography (Nov 17, 2022)
- Vidatronic Named to the 18th Annual Aggie 100™, Honored as Fastest-Growing Company (Nov 17, 2022)
- Alphawave IP announced as one of Deloitte's Technology Fast 50™ and North American Technology Fast 500™ 2022 award winners (Nov 17, 2022)
- Truechip Announces First Customer Shipment of MIPI A-PHY Verification IP (Nov 17, 2022)
- Stellantis Accelerates Autonomous Driving Journey with Acquisition of aiMotive, a Leading Artificial Intelligence and Autonomous Driving Start-up (Nov 17, 2022)
- ARM出新招，RISC-V能否挑大梁？ (Nov. 17, 2022)
- 全新 IAR Embedded Workbench for RISC-V 支持 Andes CoDense™扩展 (Nov. 17, 2022)
- 強強結盟 台灣與歐盟6G合作現成果 (Nov. 17, 2022)
- Efinix Releases TinyML Platform for Highly Accelerated AI Workloads on Its Efficient FPGAs (Nov 16, 2022)
- intoPIX extends the FastTicoRAW SDK capabilities with lossless RAW coding for measurement and analysis (Nov 16, 2022)
- DSP Concepts and Analog Devices Collaborate on Solution for Rapid Design of In-Vehicle Audio Entertainment Systems (Nov 16, 2022)
- eMemory Collaborates with Renesas on the Development of its Pure 5V OTP IP Using 130nm BCD Plus Process for Automotive Applications (Nov 16, 2022)
- T2M发布超高速14bit 4.32Gbps的ADC IP核，适用于各类高精度、高采样率的芯片设计 (Nov. 16, 2022)
- Cadence Introduces Industry's Leading-Performance, Silicon-Proven 22Gbps GDDR6 IP at TSMC N5 (Nov 16, 2022)
- Silicon Frontline Accepted as Partner in Samsung Foundry SAFE™ Program (Nov 16, 2022)
- CAES GR712RC Microprocessor Selected by Argotec for Multiple Space Missions (Nov 16, 2022)
- Infineon plans €5bn 300mm fab in Dresden (Nov 16, 2022)
- 高通曝3奈米以下訂單計畫 台積電將無法獨拿 (Nov. 16, 2022)
- Cadence 推出业界领先的性能、经过硅验证的 22Gbps GDDR6 IP (Nov. 16, 2022)
- Codasip通过收购Cerberus增强RISC-V处理器设计的安全性 (Nov. 16, 2022)
- CEVA公司宣布首席执行官交接过渡计划 (Nov. 16, 2022)
- 新思科技面向台积公司先进技术推出多裸晶芯片设计解决方案,共同推动系统级创新 (Nov. 15, 2022)
- EASii IC announces first silicon for its DVB-S2X satellite Modem ASIC (Nov 15, 2022)
- TSMC Expansion in Arizona to Target 3-nm Node (Nov 15, 2022)
- StarFive Releases StarFive StarStudio IDE, which supports both Linux and Baremetal Development (Nov 15, 2022)
- CEVA Introduces Voice User Interface Solution for TI SimpleLink™ Wi-Fi® Wireless MCUs (Nov 15, 2022)
- Ultra-high-speed 14-bit at 4.32Gbps ADC IP Cores are available for licensing, with increased accuracy and high sampling rate for a variety of applications (Nov 14, 2022)
- Nexperia invests in sustainable alternatives to batteries by acquiring Delft-based Nowi (Nov 14, 2022)
- Fraunhofer IPMS combines latest hardware in microsensor and actuator technology with artificial intelligence (Nov 14, 2022)
- Arasan announces MIPI CSI IP for FPGA supporting full C-PHY 2.0 speeds (Nov 14, 2022)
- Signing of a Large Contract with an Industry Leader for Kalray's DPU Processor (Nov 14, 2022)
- Marvell Announces Innovative CXL Development Platform for Multi-Host Memory Pooling (Nov 14, 2022)
- JEDEC Announces Publication of the SPD5118 Hub and Serial Presence Detect Device and the DDR5 SPD Contents Specifications (Nov 14, 2022)
- QuickLogic Inks eFPGA Sales Rep Agreement with CHIP-gogo in Japan (Nov 14, 2022)
- ZeroPoint Technologies can reduce data center energy consumption by 25% (Nov 14, 2022)
- Consortium forms Rapidus to get Japan back into chip race at 2nm (Nov 14, 2022)
- SiPearl and AMD collaborate to address exascale supercomputing in Europe (Nov 14, 2022)
- Matter智能家居连接标准发布，仍有问题急需解决 (Nov. 14, 2022)
- ShortLink AB and Dolphin Design partner to create a highly energy-efficient Sub-GHz ASIC design platform (Nov 11, 2022)
- Bringing next-level 3D gaming to life with Arm Immortalis (Nov 11, 2022)
- After 1Q23 Bottom, Expectations Increase for a 2Q23 IC Market Rebound (Nov 11, 2022)
- Cryogenic CMOS design enabled by Semiwise (Nov 11, 2022)
- Arm technology is defining the future of computing: Record royalties highlight increasing diversity of products and market segment growth (Nov 11, 2022)
- 八大日本巨头成立2nm芯片公司，丰田索尼参与 (Nov. 11, 2022)
- 库瀚科技全球首款RISC-V架构PCIe5.0 SSD主控性能发布 (Nov. 11, 2022)
- 高通在中国实现5G毫米波独立组网重要里程碑 (Nov. 11, 2022)
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- Mythic strapped for cash (Nov 10, 2022)
- SMIC Reports 2022 Third Quarter Results (Nov 10, 2022)
- Codasip to boost RISC-V security through Cerberus acquisition (Nov 10, 2022)
- Arteris Announces Financial Results for the Third Quarter 2022 and Estimated Fourth Quarter and Full Year 2022 Guidance (Nov 10, 2022)
- LC3plus certified for the Hi-Res Audio Wireless Logo (Nov 10, 2022)
- TSMC October 2022 Revenue Report (Nov 10, 2022)
- T2M发布经过12FFC工艺验证的DDR5/DDR4/LPDDR5组合PHY IP及控制器IP，可提高内存访问速度 (Nov. 10, 2022)
- 台积电考虑在亚利桑那州展开上百亿美元工厂扩张计划 (Nov. 10, 2022)
- Arasan推出MIPI DSI IP (Nov. 10, 2022)
- 勇攀技术高峰 华为云围绕AI根技术发布四项全新云服务 (Nov. 10, 2022)
- Alphawave获台积公司OIP年度伙伴奖 (Nov. 10, 2022)
- 错过大芯片，可不能再错过小芯粒了 (Nov. 10, 2022)
- Arteris Announces New Employment Inducement Grants (Nov 09, 2022)
- DDR5/DDR4/LPDDR5 Combo PHY IP Cores which is Silicon Proven in 12FFC with Matching Controller IP Cores is available for license to accelerate your Memory Interfacing Speeds (Nov 09, 2022)
- Alphawave IP Receives 2022 TSMC OIP Partner of the Year Award for High-Speed SerDes IP Innovations (Nov 09, 2022)
- CEVA, Inc. Announces Third Quarter 2022 Financial Results (Nov 09, 2022)
- CEVA, Inc. Announces CEO Transition Plan (Nov 09, 2022)
- POLYN Technology, Edge Impulse Join Forces to Advance Tiny AI Products (Nov 08, 2022)
- Weebit Nano receives from SkyWater Technology the first silicon wafers it manufactured with embedded Weebit ReRAM (Nov 08, 2022)
- Silvaco Announces Appointment of Five Industry Veterans to Its Board of Directors (Nov 08, 2022)
- Christel Mauffet-Smith Joins Arteris as Executive Vice President of Global Sales (Nov 08, 2022)
- Arasan announces MIPI DSI IP for FPGA supporting full C-PHY 2.0 speeds (Nov 08, 2022)
- Eliyan Closes $40M Series A Funding Round and Unveils Industry's Highest Performance Chiplet Interconnect Technologies (Nov 08, 2022)
- 探索儲存技術新動向 (Nov. 08, 2022)
- RISC 40年全球首展在深圆满举办，RISC-V展区最吸睛 (Nov. 08, 2022)
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- UMC Reports Sales for October 2022 (Nov 07, 2022)
- eMemory Receives 2022 TSMC OIP Partner of the Year Award for Embedded Memory IP (Nov 07, 2022)
- GUC Monthly Sales Report - October 2022 (Nov 07, 2022)
- Xiphera and Flex Logix Publish Joint White Paper on Solving the Quantum Threat with Post-Quantum Cryptography on eFPGA (Nov 07, 2022)
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- MPEG LA Takes Measures to Assist VVC Adoption (Nov 07, 2022)
- Global Silicon Wafer Shipments Projected to Set New Record in 2022, SEMI Reports (Nov 07, 2022)
- Arm continues to accelerate IoT software development with new partnerships (Nov 07, 2022)
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- NSITEXE develops "DR4100" General Purpose Accelerator for SoC (Nov 04, 2022)
- Creonic Participates in 6G Research Project Led by Deutsche Telekom (Nov 04, 2022)
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- SiMa.ai Welcomes Industry Leader Harald Kroeger to Scale its Business in the Automotive Market (Nov 03, 2022)
- Tony Fadell Joins Arm Board of Directors (Nov 03, 2022)
- Sondrel appoints Thomas Flynn as VP Sales North America (Nov 03, 2022)
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- SiFive Awarded TSMC Open Innovation Platform Partner of the Year (Nov 03, 2022)
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- Codasip为SiliconArts的光线追踪GPU提供定制化的RISC-V处理解决方案 (Nov. 03, 2022)
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- Rambus Reports Third Quarter 2022 Financial Results (Nov 02, 2022)
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- Intel signs 7 out of top 10 fabless companies, sees 18A test chip (Oct 31, 2022)
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- Cadence's New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies (Oct 27, 2022)
- TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations (Oct 27, 2022)
- Weebit Nano successfully qualifies its ReRAM module (Oct 27, 2022)
- Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC's Advanced Technologies (Oct 27, 2022)
- Blueshift Memory Awarded Innovate UK Smart Grant to Develop AI Computer Vision Module (Oct 27, 2022)
- Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow (Oct 27, 2022)
- Zynq® UltraScale+™ MPSoC FPGA: REFLEX CES adds a new FPGA version to its Zeus Zynq® UltraScale+™ MPSoC System-on-module (Oct 27, 2022)
- Siemens partners with TSMC for 3nm product certifications and other technology milestones (Oct 27, 2022)
- Report: TSMC stops work on Chinese AI chip amid sanctions confusion (Oct 27, 2022)
- Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings (Oct 27, 2022)
- SiMa.ai Welcomes New Investor MSD Partners Bringing Total Investment to $187 Million - SiMa.ai extends oversubscribed series B1 funding to $67 Million (Oct 27, 2022)
- Synopsys, Ansys and Keysight Accelerate 5G/6G SoC Designs with New mmWave Reference Flow for TSMC Process Technology (Oct 27, 2022)
- 台积电成立OIP 3D Fabric联盟 ARM、美光等19个合作伙伴加入 (Oct. 27, 2022)
- 台积电打头阵3D封装技术联盟成立巨头共逐Chiplet结合关键 (Oct. 27, 2022)
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- More than 50 members join SOAFEE to enable the software-defined vehicle of the future (Oct 26, 2022)
- Cadence Digital and Custom/Analog Design Flows Achieve Certification for TSMC's Latest N4P and N3E Processes (Oct 26, 2022)
- Worldwide Silicon Wafer Shipments Set a New Record in Q3 2022, SEMI Reports (Oct 26, 2022)
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- Flex Logix EFLX4K eFPGA IP Core on TSMC 7nm Technology Now Available (Oct 26, 2022)
- Alphawave IP 实现首个台积电 N3E 工艺测试芯片流片 (Oct. 26, 2022)
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- Cadence为TSMC提供高级可制造性设计(DFM)解决方案 (Oct. 26, 2022)
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- Faraday Reports Third Quarter 2022 Results (Oct 25, 2022)
- SEGGER introduces streaming trace probe for SiFive RISC-V cores (Oct 25, 2022)
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- Flex Logix Opens Up Licensing to its InferX AI Technology (Oct 25, 2022)
- Avery Continues to Drive CXL Adoption with New Virtual Platform Features in Support of Version 3.0 (Oct 25, 2022)
- SiFive and Synopsys Collaborate to Accelerate SoC Design (Oct 25, 2022)
- Faraday Unveils Design Implementation Services for FinFET Technology Targeting all Foundries (Oct 24, 2022)
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- Socionext to present its Automotive Expertise at electronica 2022 (Oct 24, 2022)
- Nextera Video and Adeas ST 2110 and NMOS FPGA Cores Receive Latest JT-NM Tested Badges (Oct 24, 2022)
- RISC-V Celebrates Upstreaming of Android Open Source Project RISC-V Port (Oct 24, 2022)
- Intel Foundry Services Forms Alliance to Enable National Security, Government Applications (Oct 24, 2022)
- Synopsys Advances Designs on TSMC N3E Process with Production-Proven EDA Flows and Broadest IP Portfolio for AI, Mobile and HPC Applications (Oct 24, 2022)
- 智原推出支援多家晶圓廠FinFET製程的晶片設計服務 (Oct. 24, 2022)
- 短期无解！汽车芯片结构性短缺将持续至2030年 (Oct. 24, 2022)
- PC、手机需求疲软，台积电撤销7/6纳米新产线 (Oct. 22, 2022)
- Everspin Signs Contract to Provide MRAM IP, Design and Manufacturing Services for Strategic Radiation Hardened FPGA Technology (Oct 21, 2022)
- Agile Analog fast tracks IoT design with macros for analog functions (Oct 21, 2022)
- WiLAN Subsidiaries Enter into License Agreement with Micron (Oct 21, 2022)
- 台积电3纳米工艺延期年底 工艺技术路线是否太激进？ (Oct. 21, 2022)
- UCIe为何成为Chiplet设计的首选标准？ (Oct. 21, 2022)
- 物联网设计中的功率管理解决方案 (Oct. 21, 2022)
- CoMira Solutions Expands Global Support (Oct 20, 2022)
- Marvell Announces Industry's Most Comprehensive 3nm Data Infrastructure IP Portfolio (Oct 20, 2022)
- RISC-V移植安卓再进一步！安卓接收RISC-V补丁，全球首批来自阿里平头哥 (Oct. 20, 2022)
- 2022年，物联网企业的日子会继续难下去吗？ (Oct. 20, 2022)
- USB-IF Announces Publication of New USB4® Specification to Enable USB 80Gbps Performance (Oct 19, 2022)
- videantis and ADTechnology to build 5nm ADAS/AD SoCs (Oct 19, 2022)
- SmartDV Achieves ISO 9001:2015 Certification (Oct 19, 2022)
- NEUCHIPS Secures $20 Million in Series B2 Funding to Deliver AI Inference Platform for Deep Learning Recommendation (Oct 19, 2022)
- Global 200mm Semiconductor Fab Capacity Projected to Surge 20% to Record High by 2025, SEMI Reports (Oct 19, 2022)
- 英特尔推动超能云终端进入融合时代，助力生态伙伴云边端协同 (Oct. 19, 2022)
- Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design (Oct 18, 2022)
- VESA发布DisplayPort 2.1规范， 添加新的显示端口带宽管理功能 (Oct. 18, 2022)
- 异构计算这盘棋，Imagination的RISC-V布局 (Oct. 18, 2022)
- VESA Releases DisplayPort 2.1 Specification (Oct 18, 2022)
- IAR Systems' Functional Safety Certified Development Tools for RISC-V support the latest SiFive Automotive Solutions (Oct 18, 2022)
- Arasan Partners with Testmetrix on its 4.5 GSPS C-PHY / D-PHY HDK and Compliance Test Platform (Oct 18, 2022)
- Intrinsic ID Presents Full Range of Chip Security Solutions at TSMC 2022 Open Innovation Platform® Ecosystem Forum (Oct 18, 2022)
- Change drives innovation: New executive assignments at Arm will bring fresh perspectives, renewed focus and growth opportunities (Oct 18, 2022)
- 新思科技推出黄金签核ECO解决方案，加速先进工艺芯片设计收敛路径 (Oct. 18, 2022)
- 智能网联汽车概念是什么 智能网联汽车有哪些品牌 (Oct. 18, 2022)
- Alphawave IP: Q3 2022 Trading and Business Update (Oct 17, 2022)
- Andes Announces the N25F-SE Processor, the World First RISC-V CPU IP with ISO 26262 Full Compliance (Oct 17, 2022)
- MOSCHIP joins TSMC Design Center Alliance (Oct 17, 2022)
- Introducing T2M's impressive collection of Silicon Proven, Automotive Grade Interface IP Cores (Oct 17, 2022)
- 西门子推出 Tessent Multi-die 解决方案 (Oct. 17, 2022)
- TSMC Cuts Expansion Plan to $36B as Outlook Sours (Oct 17, 2022)
- First RISC-V laptop uses Alibaba TH1520 SoC (Oct 17, 2022)
- Electronic System Design Industry Hits Record Revenue of Nearly $3.8 Billion in Q2 2022, ESD Alliance Reports (Oct 17, 2022)
- 非蜂窝物联网大爆发，蓝牙Wi-FiLoRaZigBee的新增长点在哪儿？ (Oct. 15, 2022)
- Brite Semiconductor Provides MIPI IP Total Solution (Oct 14, 2022)
- 功耗直降30% 台积电2nm工艺好于预期：2025量产 (Oct. 14, 2022)
- 灿芯半导体提供MIPI IP完整解决方案 (Oct. 14, 2022)
- 超170亿元！Alphawave IP官宣收购DSP芯片商Banias Labs (Oct. 14, 2022)
- proteanTecs Edge™ Applications Now Available on the Advantest ACS Solution Store (Oct 13, 2022)
- TCP/IP Hardware Stack IP Core now Available from CAST (Oct 13, 2022)
- Alphawave IP Acquires Optical DSP Chip Developer Banias Labs, Advancing its Optical DSP Products for Data Centers (Oct 13, 2022)
- CAST现在可以提供TCP/IP硬件栈IP核 (Oct. 13, 2022)
- BrainChip Fortifies Neuromorphic Patent Portfolio with New Awards and IP Acquisition (Oct 13, 2022)
- Foundries defy chip market downturn (Oct 13, 2022)
- Siliconarts signed a Ray-Tracing GPU IP 'Raycore' license agreement with Verisilicon. (Oct 13, 2022)
- Faraday Delivers SAFE™ IP Portfolio for Samsung Foundry 14LPP Process (Oct 13, 2022)
- POLYN Introduces Voice Processing Tiny AI Chip Delivering Industry-First Voice Extraction (Oct 13, 2022)
- US restricts Sea Turtles in chip industry (Oct 13, 2022)
- Weebit Nano advances its ReRAM selector development to fit embedded & discrete applications (Oct 13, 2022)
- 智原推出14奈米IP組合於三星SAFE™平台 (Oct. 13, 2022)
- RISC-V IP 核异军突起，谁将拔得头筹？ (Oct. 13, 2022)
- 传台积电拟在德国建晶圆厂，10月将派代表团考察 (Oct. 13, 2022)
- Quadric Appoints Former Cadence VP Dhanendra Jani as New VP of Engineering (Oct 12, 2022)
- Cadence and Google Cloud Collaborate to Advance the Electronic System and Semiconductor Design Ecosystem (Oct 12, 2022)
- Achronix Appoints Mahesh Karanth as CFO (Oct 12, 2022)
- T2M发布7nm PCIe 4.0 PHY IP产品，可应用于PCIe卡槽外设产品的设计，提供可靠、高速的数据传输功能 (Oct. 12, 2022)
- Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports (Oct 12, 2022)
- New Cadence Certus Delivers Up to 10X Faster Concurrent Full-Chip Optimization and Signoff (Oct 12, 2022)
- US Government to Fund Expansion of IP Ecosystem for SkyWater's 90 nm Rad-Hard Platform (Oct 12, 2022)
- Cadence Certus 新品亮相！助力全芯片并行优化和签核速度提高 10 倍 (Oct. 12, 2022)
- Cadence 与 Google Cloud 合作推进电子系统和半导体设计生态系统 (Oct. 12, 2022)
- 從晶片、系統到生物科技 Cadence致力實現更多設計創新 (Oct. 12, 2022)
- 三星2022技术日公布三大重要计划 (Oct. 12, 2022)
- SEMI ESD Alliance Adds Axiomise to Member Roster (Oct 11, 2022)
- Tiempo Secure becomes a Strategic Member of RISC-V International (Oct 11, 2022)
- Andes Technology Announces Return of the Annual RISC-V CON on October 18th in the San Jose Airport DoubleTree Hotel (Oct 11, 2022)
- DCD-SEMI introduces multiprotocol combo: HDLC, UART, SPI... with bigger FIFO and... (Oct 11, 2022)
- Introducing PCIe 4.0 PHY IP Cores in 7nm for a reliable, Low area and High-Speed Interface Peripheral slot for all your High-End Devices (Oct 10, 2022)
- TSMC September 2022 Revenue Report (Oct 10, 2022)
- 苹果A17或采用3nm工艺：台积电代工 (Oct. 10, 2022)
- 助推电动汽车发展的新动力：Soitec 的 SmartSiC™ (Oct. 10, 2022)
- EnOcean accelerates its growth and breadth of energy-saving solutions through the acquisition of the assets of the edge computing solutions business from Renesas (Oct 10, 2022)
- 量子计算领域正在飞跃 (Oct. 09, 2022)
- 英特尔离量子芯片的生产又近了一步 (Oct. 09, 2022)
- 英特尔与SiFive共同演示高性能RISC-V Horse Creek开发板 (Oct. 09, 2022)
- CEVA和CERN：边缘AI与粒子物理学的交汇 (Oct. 09, 2022)
- Sondrel announces its intention to list on London Stock Exchange's AIM market on 21 October 2022 (Oct 07, 2022)
- Creonic Releases DVB-RCS2 Multi-carrier Satellite Receiver IP Core (Oct 07, 2022)
- ARM服务器芯片，火了 (Oct. 07, 2022)
- 无线通信基础设施中离不开的有线连接与接插件 (Oct. 07, 2022)
- 欧盟将提供2.9亿欧元支持意法半导体在意大利投建半导体工厂 (Oct. 07, 2022)
- Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022 (Oct 06, 2022)
- GBT Filed a Non-Provisional Patent for Automatic Generation of Integrated Circuits Layout Blocks (Oct 06, 2022)
- GUC Monthly Sales Report - September 2022 (Oct 06, 2022)
- No suggestion from Softbank about Samsung investing in Arm, say reports (Oct 06, 2022)
- Arm chops staff (Oct 06, 2022)
- UMC Reports Sales for September 2022 (Oct 06, 2022)
- 车联网："边缘运算"上路奔驰 (Oct. 06, 2022)
- Credo Introduces Screaming Eagle 112G Retimer DSP with Industry Leading 1.6 Terabit Capacity (Oct 05, 2022)
- Synopsys Unveils Breakthrough Golden Signoff ECO Solution, Delivering 10x Productivity Improvement (Oct 05, 2022)
- 三星电子宣布2027年量产1.4纳米 (Oct. 05, 2022)
- 物聯網無線網路選擇密技大公開 (Oct. 05, 2022)
- Samsung Foundry Certifies Cadence Voltus-XFi Custom Power Integrity Solution for 5LPE Process Technology (Oct 04, 2022)
- EU chip plan would cost €500bn, says NXP CEO (Oct 04, 2022)
- Global Semiconductor Sales Increase 0.1% Year-to-Year in August (Oct 04, 2022)
- Cadence and Samsung Foundry Collaborate to Certify RFIC Design Reference Flow on 8nm Process Technology (Oct 04, 2022)
- Synopsys Expands Code Sight Standard Edition with IntelliJ Support (Oct 04, 2022)
- QuickLogic Partners with ChipMotion for eFPGA Implementations in SoC Designs (Oct 04, 2022)
- Siemens' Aprisa digital implementation solution certified for Samsung Foundry's advanced 4nm processes (Oct 04, 2022)
- SEGGER and Cadence team up to add native J-Link support for Cadence Tensilica cores (Oct 04, 2022)
- AI、機器人、元宇宙…描繪未來工廠樣貌 (Oct. 04, 2022)
- Introducing superfast serial interfacing with JESD204B Tx - Rx PHY IP Cores in 12nm, 28nm and 40nm for all type of ADC/DAC and ASIC/FPGA connections (Oct 03, 2022)
- Mobileye files for IPO, reveals data (Oct 03, 2022)
- Siemens' Calibre platform now certified for Samsung's advanced 3nm process technology (Oct 03, 2022)
- Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports (Oct 03, 2022)
- SEMIFIVE Announces New 5nm HPC SoC Platform (Oct 03, 2022)
- Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs (Oct 03, 2022)
- easics launches nearbAI™ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences (Oct 03, 2022)
- Vidatronic Unveils OmniPOWER™ Distributed Power Systems Available for Licensing in FinFET Technologies (Sep 30, 2022)
- easics launches nearbAI™ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences (Sept. 29, 2022)
- 人工智能将10万个方程的量子物理问题减少到只有4个 (Sept. 29, 2022)
- 西门子与联华电子合作开发 3D IC 混合键合流程 (Sept. 29, 2022)
- Supply Chain Experts Weigh In on CHIPS Act (Sep 29, 2022)
- Silicon Catalyst Announces POLYN Technology as Newest Company Admitted to Semiconductor Incubator (Sep 29, 2022)
- Renesas Expands RZ/V Series with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support (Sep 29, 2022)
- AI "unicorn" Graphcore set to cut jobs (Sep 29, 2022)
- S2C Releases Neuro™ - Advanced Prototype Resource Management Software (Sep 29, 2022)
- Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA (Sep 29, 2022)
- SEGGER licenses C++ runtime library to SiFive for code size and performance efficiency (Sep 29, 2022)
- 瑞萨电子发布内置视觉AI加速器的RZ/V系列器件，实现精确图像识别与多摄像头图像支持 (Sept. 29, 2022)
- Automotive IC Marketshare Seen Rising to 10% by 2026 (Sep 28, 2022)
- T2M发布HDMI 2.0 Tx PHY和控制器IP核!用户可获得源代码级别的全部授权 (Sept. 28, 2022)
- Intel重申4年搞定5代CPU工艺"1.8nm"芯片即将流片 (Sept. 28, 2022)
- 英伟达关闭对RISC-V GPU的软件支持 (Sept. 28, 2022)
- ARM CEO专访万字实录：公司如何赚钱？对美芯片法案是何态度？ (Sept. 28, 2022)
- 台积电被苹果说"不"，苹果拒绝代工涨价 (Sept. 28, 2022)
- Valens Semiconductor Collaborates with Intel to Boost Automotive MIPI A-PHY Implementations (Sep 28, 2022)
- Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware (Sep 27, 2022)
- Chips&Media Expands to New Markets such as Autonomous Vehicles (Sep 27, 2022)
- PUFsecurity's Crypto Coprocessor PUFcc is PSA Certified Level 2 Ready (Sep 27, 2022)
- Arm announces new Board Members and new Chief Financial Officer (Sep 27, 2022)
- 熵碼科技PUFcc加密協處理器IP已取得 PSA Level 2 Ready認證 (Sept. 27, 2022)
- Imagination and Baidu PaddlePaddle create open-source machine learning library for Model Zoo (Sep 27, 2022)
- SiFive and ProvenRun Collaborate to deliver Best-in-Class Security for RISC-V Microprocessors (Sep 27, 2022)
- Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time (Sep 27, 2022)
- U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification (Sep 27, 2022)
- 車用半導體加速智慧車與自駕技術發展 (Sept. 27, 2022)
- Trendforce：2022Q2前十大晶圆代工厂商营收排名 (Sept. 27, 2022)
- Imagination 联合百度飞桨创建 Model Zoo开源机器学习模型库 (Sept. 27, 2022)
- QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer (Sep 26, 2022)
- CXL Spec Grows, Absorbs Others to Collate Ecosystem (Sep 26, 2022)
- GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V (Sep 26, 2022)
- HDMI 2.0 Tx PHY and Controller IP Cores is available with Source Code license (Unlimited use with modification rights) (Sep 26, 2022)
- Codasip加入OpenHW® Group以力助RISC-V验证 (Sept. 26, 2022)
- Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution (Sep 26, 2022)
- 芯动科技高性能计算"三件套"IP解决方案行业领先，满足新一代SoC带宽需求 (Sept. 26, 2022)
- 上海首个新能源汽车零部件产业工会联盟成立，产业链布局提速 (Sept. 24, 2022)
- CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space (Sep 23, 2022)
- Functional Safety Certification Packages for Microchip FPGAs Speed Time to Market (Sep 23, 2022)
- Bosch plans acquisition of Radio Frequency specialist ItoM (Sep 23, 2022)
- 台积电28nm新工厂，取得重要进展 (Sept. 23, 2022)
- ST, CAES team on octacore RISC-V space chip with selectable cores (Sept. 23, 2022)
- Perforce Joins the Global Semiconductor Alliance and Debuts IP Maturity Model (Sep 22, 2022)
- IPrium releases IEEE 802.11n/ac/ax LDPC Encoder and Decoder (Sep 22, 2022)
- Flex Logix Selects Semifore for Advanced Inference Chip Design (Sep 22, 2022)
- Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow (Sep 22, 2022)
- Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October (Sep 22, 2022)
- Inuitive launches NU4100, expanding its Edge-AI Vision-on-Chip IC portfolio (Sep 22, 2022)
- Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks (Sep 22, 2022)
- Split manufacturing for trustworthy electronics "Made in Germany" (Sep 22, 2022)
- 细看三星4nm：今年为数不多的真·4nm (Sept. 22, 2022)
- 既有X86与ARM，为何RISC-V还能受汽车青睐？ (Sept. 22, 2022)
- 晶心科技宣布支援英特爾Pathfinder For RISC-V (Sept. 22, 2022)
- 三星有意染指Arm，但Arm终局可能只有上市 (Sept. 22, 2022)
- 英特尔携百度飞桨共创AI开发者生态，加速千行百业智能化升级 (Sept. 22, 2022)
- 物联网时代，我们需要怎样的存储 (Sept. 22, 2022)
- QuickLogic Raises Approximately $3.2 Million with Strategic Investment by Institutional Investors (Sep 21, 2022)
- DRAM Market Deflates, Cyclical Downturn Looms (Sep 21, 2022)
- CEO interview: Alphawave IP's Pialis on chiplets and custom silicon (Sep 21, 2022)
- Agile Analog launches new Digital Standard Cell Library (Sep 21, 2022)
- Alphawave IP: Interim results for the six months ended 30 June 2022 (Sep 21, 2022)
- Codasip joins OpenHW Group to contribute to RISC-V verification (Sep 21, 2022)
- CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs (Sep 21, 2022)
- IntelliProp First to Market with Memory Fabric Based on CXL; Driving Most Disruptive Technology to Hit Data Centers in Decades (Sep 21, 2022)
- Arm架构是如何一步步成为全球计算的基石？ (Sept. 21, 2022)
- 欧洲推动Chiplet新标准，以保证供应链安全 (Sept. 21, 2022)
- T2M发布其伙伴研发的22nm LP 5G Sub-6GHz射频收发器IP核，可立给蜂窝和工业物联网应用的客户 (Sept. 20, 2022)
- Achronix Acquires Key IP and Expertise from FPGA Networking Solutions Leader Accolade Technology (Sep 20, 2022)
- Movellus Secures $23M in Series B Funding to Accelerate Growth (Sep 20, 2022)
- Synopsys Unveils Industry's First Unified Emulation and Prototyping System Addressing Verification Requirements Across the Chip Development Cycle (Sep 20, 2022)
- CAES' Quad-Core LEON4FT Processor Selected for European Next-Generation Star Sensors (Sep 20, 2022)
- VisionFive 2 will be made compatible with all mainstream Linux Operating Systems (Sep 19, 2022)
- 从R15到R17，一文看懂5G的技术创新 (Sept. 19, 2022)
- 台积电初代3nm为什么被抛弃？ (Sept. 19, 2022)
- 英伟达、英特尔、ARM 将他们的AI未来押在FP8上 (Sept. 19, 2022)
- proteanTecs Joins UCIe™ (Universal Chiplet Interconnect Express™) Consortium to Advance 2.5D/3D Interconnect Monitoring (Sep 19, 2022)
- Ultra-low power 5G Sub-6GHz RF Transceiver IP Cores at 22nm, available for immediate licensing for Cellular and Industrial IoT applications (Sep 19, 2022)
- SkyWater to Provide Foundry Service for new NIST and Google Partnership to Create Supply of Chips for Researchers and Tech Startups (Sep 16, 2022)
- CMOS Image Sensors Stall in "Perfect Storm" of 2022 (Sep 16, 2022)
- QuantWare awarded subsidy from Quantum Delta NL for €1.1M project to develop the use of novel materials in superconducting quantum processors (Sep 16, 2022)
- NeuReality preps 7nm data centre AI chip (Sep 16, 2022)
- 【制造/封测】两大晶圆代工厂谈车用半导体发展 (Sept. 16, 2022)
- 【芯视野】"寒气"入侵台积电？背后蕴藏两大产业真相 (Sept. 16, 2022)
- 要上天的RISC-V到底落地了哪些应用？跃昉携合作伙伴秀出案例 (Sept. 16, 2022)
- 新思科技：软件供应链安全是推动网联汽车产业稳定发展的驱动力 (Sept. 16, 2022)
- 物联网安全需要一站式供应商 (Sept. 16, 2022)
- Redefining the global computing infrastructure with next-generation Arm Neoverse platforms (Sep 15, 2022)
- NIST and Google to Create New Supply of Chips for Researchers and Tech Startups (Sep 15, 2022)
- Silicon Catalyst welcomes NXP Semiconductors as Newest Strategic Partner (Sep 15, 2022)
- Tachyum Enters QA Testing for Prodigy Universal Processor with New EDA Supplier (Sep 15, 2022)
- Ubilite Introduces a Wi-Fi Chip With Less-Than-Bluetooth Power Consumption (Sep 15, 2022)
- 全球速看：Cadence 发布 Verisium AI-Driven Verification Platform 引领验证效率革命 (Sept. 15, 2022)
- 新一代Arm Neoverse平台重新定义全球基础设施 (Sept. 15, 2022)
- Credo Targets Hyperscale Data Centers and 5G Networks with New Optical DSPs (Sep 14, 2022)
- VeriSilicon Announces the One-Stop VeriHealth Chip Design Platform for Smart Healthcare Applications (Sep 14, 2022)
- Cadence Revolutionizes Verification Productivity with the Verisium AI-Driven Verification Platform (Sep 14, 2022)
- New Cadence Joint Enterprise Data and AI Platform Dramatically Accelerates AI-Driven Chip Design Development (Sep 14, 2022)
- Chip industry in "hopeful denial" says Penn (Sep 14, 2022)
- Funding round fuels videantis' growth (Sep 14, 2022)
- VeriSilicon AI-ISP Delivers Innovative Image Quality Enhancement that Breaks the Limits of Computer Vision (Sep 14, 2022)
- Veriest supports the development of Mobileye's innovative automotive sensor products (Sep 14, 2022)
- SiFive 推出用于汽车芯片的 RISC-V 内核路线图 (Sept. 14, 2022)
- CAST introduces the First CANsec IP Core for CAN XL Bus Security (Sep 13, 2022)
- Avalanche Technology and UMC Announce 22nm Production of High-Density MRAM-Based Devices for Aerospace Applications (Sep 13, 2022)
- T2M发布适用于千兆网络的1G以太网PHY IP核 (Sept. 13, 2022)
- CAST推出首款针对CAN XL总线安全的CANsec IP核 (Sept. 13, 2022)
- Flex Logix Unveils First AI Integrated Mini-ITX System to Simplify Edge and Embedded AI Deployment (Sep 13, 2022)
- Global IP Core Announces the Availability of The WiMAX IEEE802.16e Modem and FEC IP Core For Licensing and Integration (Sep 13, 2022)
- SiFive Rolls Out Powerful New RISC-V Portfolio to Address Unmet Performance and Feature Needs of Rapidly Evolving Next-Gen Digital Automobiles (Sep 13, 2022)
- 台积电称2纳米生产将在2025年开始 先进高NA光刻机将于2024年到货 (Sept. 13, 2022)
- 1G Ethernet PHY IP Cores solution for all your Gigabit network applications is available of immediate licensing!! (Sep 12, 2022)
- SoC.one and Imagination Technologies Partner to Enable Adoption of RISC-V for Automotive Design (Sep 12, 2022)
- Cortus Announces the Launch of its New Secure Low Power RISC-V Microcontrollers (Sep 12, 2022)
- 1G Ethernet PHY IP Cores solution for all your Gigabit network applications is available for immediate licensing (Sep 12, 2022)
- Expanded Partnership Between Arteris and Arm to Accelerate Automotive Electronics (Sep 12, 2022)
- Hisense Selects Synaptics' DBM10L Processor For First AI-Enabled Always-On Voice Remote Control (Sep 12, 2022)
- ARM, IBM team on low power analog AI chip (Sep 12, 2022)
- 韩媒：美国力推Chip 4联盟实为削弱三星、台积电对英特尔威胁 (Sept. 10, 2022)
- Brite Semiconductor Provides USB IP Total Solution (Sep 09, 2022)
- Flex Logix's Barrie Mullins To present at the 2022 AI Hardware Summit (Sep 09, 2022)
- intoPIX SDKs rev up performance to meet the rapidly increasing encoding and decoding demand of Software-based Production & Pro-AV (Sep 09, 2022)
- 灿芯半导体推出USB IP完整解决方案 (Sept. 09, 2022)
- Fraunhofer IIS and Astrodesign cooperate to offer JPEG XS solutions for video equipment manufacturer (Sep 09, 2022)
- OPENEDGES Listing on KOSDAQ this September (Sep 09, 2022)
- Andes Technology Corp. Announces Its RISC-V CPU IP Serves as the Computing Engine in the New Renesas R9A02G020 MCU ASSP (Sep 09, 2022)
- 台积电5nm的光刻方案浅析 (Sept. 09, 2022)
- 【ICDIA 2022】Chiplet和RISC-V是不是中国芯片弯道超车的机会？IP厂商这样看 (Sept. 09, 2022)
- RISC-V时代来临，IP供应商都在做些什么 (Sept. 09, 2022)
- 英特尔演示世界最高速度WiFi 7，速度超5Gbps (Sept. 09, 2022)
- 向新向远，新思科技携开发者共赴数智低碳新未来 (Sept. 09, 2022)
- Molex莫仕推出首款用于共封装光学组件 (CPO) 的混合光电连接器互连 (Sept. 09, 2022)
- T2M发布40nm MIPI D-PHY/LVDS组合PHY IP核，提升显示接口的数据速率 (Sept. 08, 2022)
- Renesas Extends Leading RISC-V Embedded Processing Portfolio with New Motor Control ASSP Solution (Sep 08, 2022)
- intoPIX unveils new FastTicoRAW & FastTicoXS codecs for Apple silicon and makes the switch to ARM-based technology simple (Sep 08, 2022)
- Samsung Sounds Alarm About '22 Chip Market Landing (Sep 08, 2022)
- Chris Stevens, Industry Veteran Joins BrainChip to Lead WW Sales (Sep 08, 2022)
- SiMa.ai Partners with GUC to Accelerate Time to Market for Industry's First Purpose-Built Machine Learning Platform for the Embedded Edge (Sep 08, 2022)
- IPrium releases CCSDS 131.2 Turbo SCCC Modulator (Sep 08, 2022)
- Fraunhofer IIS announces its JPEG XS SDK 5.0 solutions achieving 25% higher speed for en- and decoding (Sep 08, 2022)
- Memory Market Collapse to Lift TSMC to Top Spot in 3Q22 Ranking (Sep 08, 2022)
- TSMC August 2022 Revenue Report (Sep 08, 2022)
- QuickLogic Awarded a $6.9 Million Base Contract to Develop Strategic Radiation Hardened FPGA Technology (Sep 08, 2022)
- Global Semiconductor Equipment Billings Increase 7% in Q2 2022, SEMI Reports (Sep 08, 2022)
- 瑞萨电子推出全新电机控制ASSP解决方案，扩展其卓越的RISC-V嵌入式处理产品组合 (Sept. 08, 2022)
- 占据百亿量产一半规模，RISC-V迎来"中国时代"？ (Sept. 08, 2022)
- Global Semiconductor Sales Increase 7.3% Year-to-Year in July, but Growth Slows (Sep 07, 2022)
- NASA Selects SiFive and Makes RISC-V the Go-to Ecosystem for Future Space Missions (Sep 07, 2022)
- Morse Micro Raises $140M in Series B Funding to Accelerate IoT Connectivity and Revolutionize our Digital Future (Sep 07, 2022)
- Global Top Ten IC Design House Revenue Spikes 32% in 2Q22, Ability to Destock Inventory to be Tested in 2H22, Says TrendForce (Sep 07, 2022)
- Sondrel 为架构未来 IP 平台补充了封装供应链方案，以降低风险 (Sept. 07, 2022)
- RISC-V 将推动未来的 NASA 任务：为 HPSC项目选择 SiFive 内核 (Sept. 07, 2022)
- 芯原发布一站式VeriHealth大健康芯片设计平台 (Sept. 07, 2022)
- Sondrel complements its Architecting the Future IP platforms with pre-packaged supply chains for reduced risk (Sep 06, 2022)
- 突破计算机视觉极限，芯原AI-ISP技术带来创新的图像增强体验 (Sept. 06, 2022)
- DELTACAST announces low-bitrate SMPTE 2110-22 video streaming support in its IP Virtual Card with intoPIX JPEG XS Software (Sep 06, 2022)
- UMC Reports Sales for August 2022 (Sep 06, 2022)
- Alphawave Adopts Diakopto's PrimeX™ as Top-Level EM/IR Signoff Methodology for 5nm and 3nm Technologies (Sep 06, 2022)
- Intrinsic ID Collaborates with Synopsys to Boost SoC Security and Accelerate Time to Market (Sep 06, 2022)
- NOR闪存实现汽车和工业创新的安全性 (Sept. 06, 2022)
- GUC Monthly Sales Report - August 2022 (Sep 05, 2022)
- 台积电透露3大关键信息：半导体产业三大改变... (Sept. 05, 2022)
- Chiplet会用在汽车芯片上吗？ (Sept. 05, 2022)
- Sonical partners with Dolphin Design to build the future of hearables (Sep 05, 2022)
- Elevate your High-speed data transmissions to the next level for all Display interfaces with the MIPI D-PHY/ LVDS Combo PHY IP Cores in 40nm (Sep 05, 2022)
- Qualcomm hits back at ARM over lawsuit (Sep 05, 2022)
- New U.S. Rule Could "Impair" China's AI Progress (Sep 05, 2022)
- Chiplet热潮下的误解与迷思：是机遇而非救世主 (Sept. 03, 2022)
- USB Promoter Group Announces USB4® Version 2.0 (Sep 02, 2022)
- Arasan achieves ISO 26262 ASIL B automotive safety certification for its Total eMMC IP Solution (Sep 02, 2022)
- Imagination hires Michael Trzupek as new Chief Financial Officer (Sep 02, 2022)
- USB4 2.0新标准已发布：有源速率翻倍至80Gbps (Sept. 02, 2022)
- Alphawave IP Announces Completion of Acquisition of OpenFive (Sep 01, 2022)
- Cadence Completes Acquisition of OpenEye Scientific (Sep 01, 2022)
- Synopsys Approves Stock Repurchase Program with Authorization Up to $1.5 Billion (Sep 01, 2022)
- Menta SAS is exhibiting at DVCon India 2022 and will offer a Technical Workshop (Sep 01, 2022)
- Intel Taps MIPS eVocore for Intel Pathfinder for RISC-V (Sep 01, 2022)
- Avant Technology Represents NSITEXE's RISC-V Processor IP Products in Taiwan and China (Sep 01, 2022)
- Codasip加入Intel Pathfinder for RISC-V设计支持计划 (Sept. 01, 2022)
- Arm起诉高通和Nuvia违反许可协议，要求销毁设计并寻求赔偿 (Sept. 01, 2022)
- 晶心科技和 Green Hills Software 聯手為 RISC-V 提供先進的汽車安全平台 (Sept. 01, 2022)
- Four Large Agreements Prop Up 2022 Semiconductor M&A Total (Aug 31, 2022)
- Intel® Pathfinder for RISC-V Delivers New Capabilities for Pre-Silicon Development (Aug 31, 2022)
- Q2'22 saw a significant decline in GPU and PC shipments quarter to quarter (Aug 31, 2022)
- Allegro DVT Partners with SiMa.ai to Optimize Power Efficiency for Embedded Edge Applications (Aug 31, 2022)
- Codasip joins Intel Pathfinder for RISC-V program (Aug 31, 2022)
- Rapid Silicon's Raptor Software Out-Performs All EDA Tools in the Industry (Aug 31, 2022)
- Arm Files Lawsuit Against Qualcomm and Nuvia for Breach of License Agreements and Trademark Infringement (Aug 31, 2022)
- Allegro DVT与SiMa.ai携手优化嵌入式边缘应用的能效 (Aug. 31, 2022)
- 三星迎来3纳米芯片首个大单 将为谷歌代工Pixel 8处理器 (Aug. 31, 2022)
- NSITEXE, OTSL, Kyoto Microcomputer, AXELL, Collaborate to develop RISC-V based Reliable Edge AI platform (Aug 30, 2022)
- 14-bit, 4.32 Gs/ps, 1.7GHz BW, 时间交错流水线 ADC IP 内核 (Aug. 30, 2022)
- Imagination's PowerVR architecture marks its 30th anniversary (Aug 30, 2022)
- Arteris Collaborates with SiMa.ai to Optimize ML Implementation With Efficient Topology Interconnect IP for the Embedded Edge (Aug 30, 2022)
- Tachyum Signs Memorandum of Understanding with MatLogica (Aug 30, 2022)
- SiMa.ai Develops the Industry's First Purpose-Built Machine Learning System-on-Chip with TSMC's Power Efficient Technology (Aug 30, 2022)
- SiMa.ai Achieves First Silicon Success with Synopsys Solutions, Launching the Industry's Most Power-Efficient MLSoC Platform for the Embedded Edge (Aug 30, 2022)
- SiMa.ai Ships First Industry Leading Purpose-built Machine Learning SoC Platform to Customers for Embedded Edge Applications (Aug 30, 2022)
- Sequans Communications Closes Multi-Year Strategic 5G Partnership Agreement (Aug 30, 2022)
- Siemens introduces Questa Verification IP solution support for the new CXL 3.0 protocol (Aug 30, 2022)
- Imperas partners with Intel Pathfinder for RISC-V (Aug 30, 2022)
- Crypto Quantique's quantum-driven silicon IP enables root-of-trust in the Intel Pathfinder for RISC-V environment (Aug 30, 2022)
- Andes Technology Corp. Announces Its Contribution To The Intel Pathfinder For RISC-V (Aug 30, 2022)
- FD-SOI的倔强，能否为国产14nm之路打开一扇窗？ (Aug. 30, 2022)
- 阿里云发布飞天智算平台，可将AI训练效率提升11倍 (Aug. 30, 2022)
- Intel预告万亿晶体管芯片时代：FinFET将被淘汰 (Aug. 29, 2022)
- Enhance your Automotive Application with 14-bit wideband Time-Interleaved Pipeline Data converter's IP cores (Aug 29, 2022)
- StarFive Announced 2 High-Performance RISC-V Products: JH7110 SoC and VisionFive 2 SBC (Aug 29, 2022)
- 攜手產業前進未來 量子科技產業平台揭牌 (Aug. 29, 2022)
- Credo Introduces 800Gbps and 400Gbps Optical Digital Signal Processors with Integrated Drivers (Aug 29, 2022)
- Semico Research Concludes proteanTecs Deep Data Analytics Gives SoC Manufacturers a Six-Month Time-to-Market Advantage with Significant Savings (Aug 29, 2022)
- Racyics wins new automotive customer for its GF 22FDX Adaptive-Body-Biasing solution (Aug 29, 2022)
- 晶圆代工"台积电时代"即将结束？ (Aug. 29, 2022)
- 传台积电决定放弃N3工艺 苹果未予采用 (Aug. 27, 2022)
- 75亿美元大手笔扩产！中芯国际官宣天津新建12英寸厂 (Aug. 27, 2022)
- Alphawave IP Acquisition of OpenFive Approved by All Regulators (Aug 26, 2022)
- 走向深水区的RISC-V (Aug. 26, 2022)
- 車載智慧和連續移動性的RF-SOI工程基板 (Aug. 26, 2022)
- 关于 6G 技术的五个重要问题 (Aug. 26, 2022)
- RISC-V商用加速：今天的一小步可能是10年后的一大步 (Aug. 26, 2022)
- 更智慧、更綠能的建築：物聯網徹底改變能源消耗 (Aug. 26, 2022)
- 牛芯半导体：下半年将重点拓展高速短距互联技术 面向CPU、GPU、DPU等领域 (Aug. 26, 2022)
- A closer look at TSMC's 3-nm node and FinFlex technology (Aug 25, 2022)
- China's RISC-V pioneer, Nuclei, raises funds for IoT, automotive push (Aug 25, 2022)
- CXL™ Consortium and JEDEC® Sign MOU Agreement to Advance DRAM and Persistent Memory Technology (Aug 25, 2022)
- CEO Interview: Sammy Cheung: Filling the General-Purpose FPGA Void (Aug 25, 2022)
- Alibaba Cloud Unveils Chip Development Platform to Support Developers with RISC-V based High-performance SoCs (Aug 25, 2022)
- Imagination's GPU and AI Accelerator Licensed for the latest AIoT RISC-V-based applications (Aug 25, 2022)
- Synopsys Initiates $240 Million Accelerated Share Repurchase Agreement (Aug 25, 2022)
- Untether Unveils 2-PFLOPS AI Chip, Edge Roadmap (Aug 25, 2022)
- Imagination的GPU和AI加速器应用于AIoT最新的RISC-V应用 (Aug. 25, 2022)
- 探究中芯7纳米芯片制造陷入困境的真相 (Aug. 25, 2022)
- 安谋科技刘澍：立足本土创新，为客户提供多元化异构计算平台 (Aug. 25, 2022)
- T2M发布其伙伴研发的PCIe 4.0 PHY IP核与配套的PCIe 4.0控制器IP核，12FFC工艺带来的低功耗及高吞吐量可提升计算机外设的性能 (Aug. 24, 2022)
- Intel Introduces First-of-its-Kind Semiconductor Co-Investment Program (Aug 24, 2022)
- UMC and Cadence Collaborate on Analog/Mixed-Signal Flow for 22ULP/ULL Process Technologies (Aug 24, 2022)
- Verific's Rick Carlson Appointed Advisory Board Member for the College of Computing at Illinois Institute of Technology (Aug 24, 2022)
- 阿里发布首个高性能RISC-V芯片平台"无剑600" (Aug. 24, 2022)
- Semi Capex On Pace For 21% Growth to $185.5B This Year (Aug 23, 2022)
- Imagination GPU selected by StarFive for next-generation VisionFive 2 single-board computer (Aug 23, 2022)
- Composable Data Center Innovator, IntelliProp Names Tech Veteran John Spiers as CEO and President (Aug 23, 2022)
- 因應高速傳輸與低延遲應用 5G時間同步成大挑戰 (Aug. 23, 2022)
- Pliops Secures $100M in Series D Funding as Data Center Professionals Continue to Rethink Storage Architectures (Aug 22, 2022)
- Diakopto Unveils PrimeX™ - Revolutionary EDA Solution for Top-Hierarchy Power Grid and Signal Net EM/IR (Aug 22, 2022)
- Augment your Peripheral slot's performance with the Low Power and High Throughput PCIe 4.0 PHY IP Cores in 12FFC with matching PCIe 4.0 Controller IP Cores (Aug 22, 2022)
- The Worldwide Semiconductor Market is expected to increase 13.9 percent in 2022, continuing to grow by 4.6 percent in 2023. (Aug 22, 2022)
- RF-SOI：毫米波时代射频前端的终极答案？ (Aug. 20, 2022)
- SiFive's RISC-V Leadership Strengthens with New Vector Solutions (Aug 19, 2022)
- Cadence and GlobalFoundries Collaborate on RF and mmWave Design Flow to Accelerate Mobile and 5G Innovation (Aug 19, 2022)
- UK blocks Chinese purchase of EDA company Pulsic (Aug 19, 2022)
- 中国闪存市场峰会CFMS2022正式开启：演讲阵容曝光，9.20约！ (Aug. 19, 2022)
- 内嵌RTOS的DSP是物联网的最佳选择 (Aug. 19, 2022)
- 芯原股份获颁"中国半导体20年特殊贡献奖" (Aug. 19, 2022)
- Cadence 和 GlobalFoundries 就射频和毫米波设计流程展开合作，以加速移动和 5G 创新 (Aug. 19, 2022)
- MediaTek Adds MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets (Aug 18, 2022)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2022 (Aug 18, 2022)
- JEDEC Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard (Aug 18, 2022)
- Thalia brings AMALIA IP reuse platform to Israel (Aug 18, 2022)
- 消息称台积电 3nm 工艺将于 9 月量产，初期良品率优于 5nm (Aug. 18, 2022)
- Credo正式推出基于台积电5nm及4nm先进制程工艺的全系列112G SerDes IP产品 (Aug. 18, 2022)
- JEDEC宣布UFS 4.0新标准和其它附加闪存规范技术支持更新 (Aug. 18, 2022)
- 三星正准备量产第8代V-NAND闪存 持续改进存储密度与传输性能 (Aug. 18, 2022)
- 深入浅出理解CXL，为什么关键是内存？ (Aug. 18, 2022)
- 芯来科技完成数亿元新一轮融资，加速推进RISC-V新进程 (Aug. 18, 2022)
- Rambus扩大面向数据中心和PC设备的DDR5内存接口芯片组合 (Aug. 18, 2022)
- BrainChip Empowers Next Generation of Technology Innovators with Launch of the University AI Accelerator Program (Aug 17, 2022)
- Efinix Low Power, Small Footprint FPGA Selected for SPRESENSE Development Platform (Aug 17, 2022)
- Alphawave IP is officially 5.0 certified on the PCI-SIG Integrator's List (Aug 17, 2022)
- QuickLogic Reports Fiscal 2022 Second Quarter Results (Aug 17, 2022)
- OPENEDGES Files Registration Statement for the Initial Public Offering (IPO) (Aug 17, 2022)
- T2M发布其伙伴研发的MIPI D-PHY IP与MIPI DSI控制器IP核，可应用于高性能、低成本的相机和显示器芯片设计！ (Aug. 17, 2022)
- Credo Launches Comprehensive Family of 112G PAM4 SerDes IP for TSMC N5 and N4 Process Technologies (Aug 17, 2022)
- Autotalks Enhances 5G C-V2X Chipsets with proteanTecs Deep Data Analytics (Aug 17, 2022)
- 芯原股份戴伟民：Chiplet是"换道超车"的技术 (Aug. 17, 2022)
- MIPI D-PHY IP Cores along with MIPI DSI Controller IP Cores for both Tx & Rx is available for immediate licensing for high-performance, cost-optimized cameras and displays (Aug 16, 2022)
- 处理器随着物联网和人工智能在演进 (Aug. 16, 2022)
- Nordic Semiconductor announces its first Wi-Fi chip, the dual-band Wi-Fi 6 nRF7002 (Aug 16, 2022)
- Exclusive CEO Interview: Latest Funding Drives Ventana's First RISC-V Chiplets in Data Centers (Aug 16, 2022)
- 从MCU到SoC：繁荣和现实 (Aug. 16, 2022)
- 中国芯光荣的桂冠上，必有美国制裁的荆棘 (Aug. 16, 2022)
- 历史首次，英特尔转让近5000项专利，以授权第三方 (Aug. 16, 2022)
- Arm拿下全球7.1%服务器CPU市场，AMD在全球X86 CPU市场份额升至31.4% (Aug. 16, 2022)
- Andes Technology and Green Hills Software Team Up to Deliver Advanced Automotive Safety Platform for RISC-V (Aug 16, 2022)
- New US EDA Software Ban May Affect China's Advanced IC Design, Says TrendForce (Aug 15, 2022)
- Intel Elects Lip-Bu Tan to Its Board of Directors (Aug 15, 2022)
- Edgewater Wireless Expands Intellectual Property Monetization Initiatives (Aug 15, 2022)
- Vidatronic Expands Portfolio of Power Management, Analog, and Security IP with Additional 180 nm to 22 nm Technologies for IoT Applications Available for Licensing (Aug 12, 2022)
- Truechip Announces First Customer Shipment of CXL 3 Verification IP and CXL Switch Model (Aug 12, 2022)
- 2022国际集成电路展览会暨研讨会（IIC 2022)"芯"品发布会 (Aug. 12, 2022)
- 嵌入式C语言是不是过时了？ (Aug. 12, 2022)
- Nordic Semi sets up RISC-V design team (Aug 11, 2022)
- Tudor Brown resigns from SMIC (Aug 11, 2022)
- SMIC Reports 2022 Second Quarter Results (Aug 11, 2022)
- Opinion: CHIPS Act Escalates Long-Standing U.S.-China Tech Rivalry (Aug 11, 2022)
- Arasan refreshes its Total USB IP Solution with its next generation of USB 2.0 PHY IP (Aug 11, 2022)
- CEVA 庆祝第 150 亿个 CEVA 驱动的芯片出货 (Aug. 11, 2022)
- 浅谈量子运算技术现况与未来发展前景 (Aug. 11, 2022)
- T2M宣布其伙伴的超高速SD 4.1 UHS-II PHY IP核通过量产验证，可进行授权 (Aug. 10, 2022)
- Arteris Announces Financial Results for the Second Quarter 2022 and Estimated Third Quarter and Full Year 2022 Guidance (Aug 10, 2022)
- CEVA, Inc. Announces Second Quarter 2022 Financial Results (Aug 10, 2022)
- Siemens selected by Microsoft for Rapid Assured Microelectronics Prototypes (RAMP) Program (Aug 10, 2022)
- Nordic组建RISC-V 团队，入局CPU (Aug. 10, 2022)
- 汽车电子革命要求接口更快更智能 (Aug. 10, 2022)
- 拜登签署芯片法案，美光、西部数据、英特尔等企业将如何花这笔钱？ (Aug. 10, 2022)
- Arm 2022 财年第一季度营收与出货量创新纪录 (Aug. 09, 2022)
- CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped (Aug 09, 2022)
- Logic Fruit appoints Vijay Pal Sharma as VP - Engineering (Aug 09, 2022)
- 中国汽车半导体迈出自主一步 (Aug. 08, 2022)
- Enhance your SD Card experience by integrating SD 4.1 UHS-II PHY IP Core to achieve Ultra High Speeds (Aug 08, 2022)
- Arm achieves record revenue and shipments in Q1 FY 2022 (Aug 08, 2022)
- GlobalFoundries and Qualcomm Announce Extension of Long-term Agreement to Secure U.S. Supply through 2028 (Aug 08, 2022)
- Space Codesign Systems joins Siemens Digital Industries Software Solution Partner Program as a Software and Technology Partner (Aug 08, 2022)
- 从NXP i.MX 7ULP看FD-SOI的意义 (Aug. 08, 2022)
- 2nm，硅芯片终极之战？ (Aug. 07, 2022)
- 三星将于 2023 年开始在越南生产芯片 (Aug. 07, 2022)
- 晶圆代工厂的工艺节点 (Aug. 07, 2022)
- 英特尔首款Chiplet处理器，或将推迟 (Aug. 06, 2022)
- Brite Semiconductor provides xSPI/Hyperbus™/Xcella™ controller and PHY total solution (Aug 05, 2022)
- Cadence Accelerates Hyperscale SoC Design with Industry's First Verification IP and System VIP for CXL 3.0 (Aug 05, 2022)
- GUC Monthly Sales Report - July 2022 (Aug 05, 2022)
- 先进芯片制造技术下滑？台积电回应 (Aug. 05, 2022)
- 灿芯半导体推出xSPI/Hyperbus™/Xcella™控制器和PHY整体解决方案 (Aug. 05, 2022)
- 消息称英特尔即将与意大利政府达成50亿美元建厂协议 (Aug. 05, 2022)
- T2M宣布提高移动嵌入设备安全性的SD/eMMC 主机和设备控制器 IP 核及配套PHY IP完成硅验证，可向芯片设计公司进行授权 (Aug. 04, 2022)
- Cadence Library Characterization Solution Accelerates Delivery and Enhances Quality of Arm Memory Products (Aug 04, 2022)
- Architect of CHIPS Act Speaks on Its Impact (Aug 04, 2022)
- Neuromorphic Device with Low Power Consumption (Aug 04, 2022)
- Access Advance VVC Patent Pool Momentum Grows (Aug 04, 2022)
- UMC Reports Sales for July 2022 (Aug 04, 2022)
- June Swoon - IC Sales Turn Negative as Economy Weighs on Market (Aug 04, 2022)
- Edge Impulse Releases Deployment Support for BrainChip Akida Neuromorphic IP (Aug 04, 2022)
- Rambus Reports Second Quarter 2022 Financial Results (Aug 04, 2022)
- Efinix® Extends Breakthrough Family of Titanium Products with Launch of the Titanium Ti180 FPGA (Aug 04, 2022)
- Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce (Aug 04, 2022)
- IPrium releases CCSDS TC Telecommand LDPC Encoder and Decoder (Aug 04, 2022)
- 车辆电压保护——将电压水平保持在限度内 (Aug. 04, 2022)
- Global Semiconductor Sales Increase 13.3% in Q2 2022 Compared to Q2 2021 (Aug 03, 2022)
- Imperas leads the RISC-V verification ecosystem as the first to release an open-source SystemVerilog RISC-V processor functional coverage library (Aug 03, 2022)
- Accellera Announces Proposed Working Group to Explore Clock Domain Crossing Standard (Aug 03, 2022)
- Alma Technologies Announces the Immediate Availability of an Ultra-High Throughput Image Scaler IP Core (Aug 03, 2022)
- CXL Consortium Releases Compute Express Link 3.0 Specification to Expand Fabric Capabilities and Management (Aug 03, 2022)
- UCIe™ (Universal Chiplet Interconnect Express™) Consortium Announces Incorporation and New Board Members; Open for Membership (Aug 03, 2022)
- 為何執行RTOS的DSP是物聯網最佳選擇？ (Aug. 03, 2022)
- 一文浅析智能驾驶中的智能 (Aug. 02, 2022)
- Rambus Appoints Desmond Lynch as Chief Financial Officer (Aug 02, 2022)
- Avery Design Announces CXL 3.0 VIP (Aug 02, 2022)
- PUFsecurity gains Riscure accreditation for its Anti-Tamper solution, PUFrt (Aug 02, 2022)
- CXL Consortium and OpenCAPI Consortium Sign Letter of Intent to Transfer OpenCAPI Specifications to CXL (Aug 02, 2022)
- NSITEXE expands products lineup of RISC-V CPU supported functional safety (Aug 02, 2022)
- OPENEDGES Passes the Eligibility Examination of the KOSDAQ listing (Aug 02, 2022)
- Avery Announces 800G Ethernet VIP virtual network co-simulation platform, enabling SoC pre-silicon validation in real networked application environments (Aug 02, 2022)
- Mobiveil and Avery Design Systems Extend Partnership to Accelerate Design and Verification of NVMe 2.0-Enabled SSD Development (Aug 02, 2022)
- RISC-V芯片出货量激增，2025年将突破600亿 (Aug. 01, 2022)
- T2M宣布Sub-6GHz 频段的5G射频收发器 IP 核，可立即授权给蜂窝和工业物联网应用的客户。 (Aug. 01, 2022)
- Google 開源晶片設計服務增加 90nm 製程選項 加速推動更多元的開源晶片設計發展 (Aug. 01, 2022)
- SD/eMMC Host and Device Controller IP Cores including matching PHYs with high performance, and high storage capacity available for license to secure your removable and embedded storage (Aug 01, 2022)
- Avery Design Systems Verification IP Helps Solid State Storage Controller Startup Validate its Designs and Get to Market Faster (Aug 01, 2022)
- U.S. Passes CHIPS Act, Increasing Restrictions on China Lead to Rising Geopolitical Risk, Says Trendforce (Aug 01, 2022)
- 英特尔第14代酷睿将首发4nm工艺 (Jul. 30, 2022)
- 美日拟联手抢占2nm高地 (Jul. 30, 2022)
- Intel Wi-Fi 7解决方案2024年问世 (Jul. 30, 2022)
- ARM服务器又杀回来了 (Jul. 29, 2022)
- Faraday Unveiled FPGA-Go-ASIC Prototyping Platform to Accelerate FPGA-to-ASIC Conversion (Jul 28, 2022)
- Faraday Reports Second Quarter 2022 Results (Jul 28, 2022)
- Arm announces appointment of Spencer Collins as Chief Legal Officer (Jul 28, 2022)
- NSITEXE product brand "Akaria", expand portfolio (Jul 28, 2022)
- SkyWater Receives Funding from DOD, Partners with Google to Facilitate Open Source Design for its new 90 nm Technology Offering (Jul 28, 2022)
- Worldwide Silicon Wafer Shipments Set New Record in Q2 2022, SEMI Reports (Jul 28, 2022)
- 智原發表FPGA-Go-ASIC驗證平台 加速FPGA轉換ASIC (Jul. 28, 2022)
- MIPI UniPro v2.0 将峰值数据速率翻倍，为闪存存储应用提供更高的吞吐量和更低的延迟 (Jul. 28, 2022)
- Xfuse, LLC Enters AI Vision Market with New Image Signal Processing (ISP) Technology (Jul 27, 2022)
- Gartner Forecasts Worldwide Semiconductor Revenue Growth to Slow to 7% in 2022 (Jul 27, 2022)
- MIPI UniPro v2.0 Doubles Peak Data Rate and Delivers Greater Throughput and Reduced Latency for Flash Memory Storage Applications (Jul 27, 2022)
- Soitec 公布 2023 财年第一季度财报，同比增长 12% (Jul. 27, 2022)
- Samsung Foundry Achieves 2X Productivity on Large-Scale Analog and Mixed-Signal IP with the Spectre FX Simulator (Jul 26, 2022)
- DCD-SEMI adds extra features to LIN IP Core and GuardKnox license the solution (Jul 26, 2022)
- CFX announces commercial availability of anti-fuse OTP technology on 55nm CIS process (Jul 25, 2022)
- Silicon Labs Selects CoreHW Advanced Bluetooth AoA Switch for Dual Polarized Antenna Array Pro Kit (Jul 25, 2022)
- Creonic Offers High-throughput Single-chip DVB-S2X Satellite Modem for Zynq UltraScale+ RFSoC (Jul 25, 2022)
- CAES' Quad Core LEON4FT Processor Selected for Next-Generation On-orbit Servicing Spacecraft (Jul 25, 2022)
- 射频前端器件正在通过SOI技术实现未来 (Jul. 25, 2022)
- Cadence Expands into Molecular Simulation with Acquisition of OpenEye Scientific, a Pioneering Leader in Computational Molecular Design (Jul 25, 2022)
- CIX Technology joins Linaro's Windows on Arm Group (Jul 25, 2022)
- 5G Sub-6GHz RF Transceiver IP Cores, available for immediate licensing to the customers for Cellular and Industrial IoT applications (Jul 25, 2022)
- SMIC shipping 7nm ICs (Jul 25, 2022)
- eMMC Holds Its Own Against UFS (Jul 25, 2022)
- Intel and MediaTek Form Foundry Partnership (Jul 25, 2022)
- 传台积电、联电等中国台湾半导体制造商将访问印度 (Jul. 24, 2022)
- 中芯国际客户：7nm芯片自2021年7月开始量产 (Jul. 23, 2022)
- [原创] 三星半导体，火力全开 (Jul. 22, 2022)
- 聯電助力產業鏈變綠 目標2025綠色產品佔逾七成 (Jul. 22, 2022)
- Soitec 宣布与 KLA 公司拓展合作，提升碳化硅生产良率 (Jul. 22, 2022)
- SkyWater Plans to Build Advanced $1.8B Semiconductor Manufacturing Facility in Partnership with the State of Indiana and Purdue University (Jul 21, 2022)
- Alma Technologies Scales-up the Performance of the JPEG-LS Image Compression IP Core by Employing its Ultra High Throughput - UHT™ Architecture (Jul 21, 2022)
- Big Fish Semiconductor's U2 5.2 Audio SoC enters mass production with Dolphin Design's Audio IPs (Jul 21, 2022)
- Americas' Chip Suppliers Continue to Dominate R&D Spending (Jul 21, 2022)
- Arm IPO on hold (Jul 21, 2022)
- iWave unveils the implementation of ARINC 818-2 IP Core in next-generation Combat Aircraft, designed by the Aeronautical Development Agency (ADA), Bangalore, India (Jul 21, 2022)
- Arm, Cruise and the driverless road ahead (Jul 21, 2022)
- Renesas Completes Acquisition of Reality AI (Jul 20, 2022)
- GlobalFoundries Statement Following Senate Procedural Vote on Legislation To Bolster U.S. Competitiveness (Jul 20, 2022)
- T2M宣布其伙伴开发的MIPI RFFE 主从控制器 IP 核量产，可用于射频前端复杂接口的控制。 (Jul. 20, 2022)
- Imagination and Khronos celebrate graphics innovation and open API standards with joint event (Jul 20, 2022)
- Alphawave IP: Q2 2022 Trading and Business Update (Jul 20, 2022)
- QuantWare selected to deliver Quantum Processing Units for Israel's first functional quantum computer (Jul 20, 2022)
- Andes Technology RISC-V Processors Reveal Outstanding Performance and Efficiency in MLPerf Tiny (Jul 20, 2022)
- Imagination与Khronos展示图形创新与开放API (Jul. 20, 2022)
- 瑞萨电子完成对Reality AI的收购 (Jul. 20, 2022)
- SEMI台灣總裁：現在是台廠切入車用市場最佳時機 (Jul. 20, 2022)
- 西門子推出 Symphony Pro 平台，大幅擴展混合訊號 IC 驗證功能 (Jul. 19, 2022)
- Flex Logix Partners With Intrinsic ID to Secure eFPGA Platform (Jul 19, 2022)
- In-house software team provides Sondrel with a key advantage for its turnkey ASIC service of turning concept into silicon (Jul 19, 2022)
- Rambus Expands Portfolio of DDR5 Memory Interface Chips for Data Centers and PCs (Jul 19, 2022)
- Accelercomm Launches LEOphy for Low-Earth Orbit 5G Satellites (Jul 19, 2022)
- Vidatronic Expands FinFET Portfolio with 7 nm to 4 nm FlexGUARD™ and Power Quencher® Intellectual Properties (IPs) Available for Licensing (Jul 19, 2022)
- Rambus 扩展了用于数据中心和 PC 的 DDR5 内存接口芯片产品组合 (Jul. 19, 2022)
- Agile Analog to move into iconic Radio House office block in Cambridge, UK to enable significant increase in engineering staff (Jul 18, 2022)
- 10Gbps?The fastest LPDDR5/5X IP deliver production ! (Jul 18, 2022)
- MIPI RFFE Master & Slave Controller IP Cores to control your complex RF-Front End Interfaces (Jul 18, 2022)
- TSMC Trims Expansion Plans as Outlook Dims (Jul 18, 2022)
- 10Gbps! The fastest LPDDR5/5X IP deliver production ! (Jul 18, 2022)
- Socionext Introduces ISO26262 Certified Smart Graphic Display Controllers (Jul 18, 2022)
- Global Total Semiconductor Equipment Sales On Track to Record $118 Billion in 2022, SEMI Reports (Jul 18, 2022)
- 晶心科搭RISC-V熱潮 接單旺 (Jul. 18, 2022)
- 资本助力"芯"机遇：并购整合将是半导体发展新趋势 (Jul. 16, 2022)
- Cadence Completes Acquisition of Future Facilities (Jul 15, 2022)
- 台积电财报电话会：2023年芯片行业将进入下行周期 但整体降幅将好于2008年 | 财报见闻 (Jul. 15, 2022)
- 我国首个高清无线音频标准HWA发布 (Jul. 15, 2022)
- Intrinsic ID 与 Progate Technology 签署韩国代表协议，以进一步扩大其基于 PUF 的安全解决方案在亚太地区的商业范围 (Jul. 15, 2022)
- 采用硅验证后的 12FFC 技术，体验 DDR5/DDR4/LPDDR5 Combo PHY 和配套控制器 IP 核的无缝 RAM 接口速度 (Jul. 14, 2022)
- Arm Neoverse Adopted by Google Cloud (Jul 14, 2022)
- Are Micron and the Taiwanese Semi Suppliers the Canaries in the Coal Mine? (Jul 14, 2022)
- TSMC Reports Second Quarter EPS of NT$9.14 (Jul 14, 2022)
- Alphawave IP Expands Canadian Presence with New Ottawa Office (Jul 14, 2022)
- Tower Semiconductor and Cadence Expand Collaboration to Accelerate Automotive IC Development (Jul 14, 2022)
- 苹果、AMD、NV等5nm订单在手 台积电利润大涨76% (Jul. 14, 2022)
- 功耗降低30% 台积电重申2nm工艺2025年量产 (Jul. 14, 2022)
- 晶心科技與Crypto Quantique建立全球合作夥伴關係 攜手建立RISC-V物聯網裝置最高安全性 (Jul. 14, 2022)
- Kudelski IoT empowers hardware security for semiconductor manufacturers with new Secure IP portfolio (Jul 13, 2022)
- US Department of Defense Awards SkyWater a $27M Option to Facilitate American-Made Semiconductors Critical to National Security and Domestic Supply Chains (Jul 13, 2022)
- Siemens' Calibre platform expands early design verification solutions (Jul 13, 2022)
- RISC-V TEE "Penglai Enclave" officially entered StarFive chip platform (Jul 12, 2022)
- Truechip Introduces Automation Products - NoC Verification and NoC Performance - for Revolutionizing the Verification Spectrum (Jul 12, 2022)
- Intrinsic ID Signs Representation Agreement for South Korea with Progate Technology to Further Extend Commercial Reach of its PUF-Based Security Solutions in the Asia Pacific Region (Jul 12, 2022)
- Codasip expands design team to Greece (Jul 12, 2022)
- Flex Logix Collaborating with Microsoft to Help Build Secure State-of-the-Art Chips for US Department of Defense (DoD) (Jul 11, 2022)
- STMicroelectronics and GlobalFoundries to advance FD-SOI ecosystem with new 300mm manufacturing facility in France (Jul 11, 2022)
- Creonic Introduces Microchip FPGAs as Supported Technologies (Jul 11, 2022)
- 意法半导体和GlobalFoundries在法国新建300毫米制造厂，推动FD-SOI生态系统的发展 (Jul. 11, 2022)
- Agile Analog announces IR Drop Sensor IP (Jul 11, 2022)
- Experience DDR5/DDR4/LPDDR5 Combo PHY and matching Controller IP Cores seamless RAM interfacing speeds, with Silicon Proven 12FFC technology (Jul 11, 2022)
- Agile Analog announces RC Oscillator IP (Jul 11, 2022)
- 新思科技获台积公司N3E和N4P工艺认证，推动下一代移动和HPC芯片创新 (Jul. 11, 2022)
- Siemens' state-of-the-art Symphony Pro platform expands mixed signal IC verification capabilities (Jul 11, 2022)
- Breker Verification Systems and Codasip Announce Cooperation to Drive Open, Commercial-Grade RISC-V SoC Verification Processes (Jul 11, 2022)
- Cadence to Acquire Future Facilities, A Pioneer in Data Center Digital Twins (Jul 11, 2022)
- Arteris IP's Next Generation of Vision Processing for Edge Devices Selected by Inuitive for Its Next Generation of Computer Vision Platforms (Jul 11, 2022)
- Imperas announces the latest updates to RVVI and welcomes the adoption by many leading RISC?V processor developers (Jul 11, 2022)
- Synopsys Delivers Higher Productivity and Quality for Advanced-Node 5G/6G SoCs on Samsung Foundry's Low-Power Process (Jul 11, 2022)
- Crypto Quantique announces first post-quantum computing IoT security platform compliant with new NIST standards (Jul 11, 2022)
- Electronic System Design Industry Logs 12.1% Year-Over-Year Revenue Growth in Q1 2022, ESD Alliance Reports (Jul 11, 2022)
- Imperas announces the latest updates to RVVI and welcomes the adoption by many leading RISC-V processor developers (Jul 11, 2022)
- 客户是谁？三星3nm芯片目前是否只是个噱头？ (Jul. 10, 2022)
- RISC-V芯片出货量：突破100亿 (Jul. 09, 2022)
- True Circuits Attends Design Automation Conference (Jul 08, 2022)
- Nordic Semiconductor to acquire U.S. memory specialist Mobile Semiconductor (Jul 08, 2022)
- Cadence Introduces the Voltus-XFi Custom Power Integrity Solution, Delivering over 3X Productivity Gains (Jul 08, 2022)
- Fabless Suppliers Hold Record 34.8% Share of Global IC Sales (Jul 08, 2022)
- TSMC June 2022 Revenue Report (Jul 08, 2022)
- 三星采用Ansys仿真工具以打造先进半导体设计和优化高速连接 (Jul. 08, 2022)
- 5G R17标准冻结 5G商用迈向新阶段 (Jul. 08, 2022)
- 晶片業者如何掌握小型收購案價值？ (Jul. 08, 2022)
- GUC Demonstrate World's First HBM3 PHY, Controller, and CoWoS Platform at 7.2 Gbps (Jul 07, 2022)
- 用 28HPC+/HPC 工艺技术的 USB 3.2/ PCIe 3.1/SATA 3.2 Combo PHY IP 核接口，将您的高密度数据处理能力提升到全新高度 (Jul. 07, 2022)
- Imperas Announces Partnership with Breker to Drive Rigorous Processor-to-System Level Verification for RISC-V (Jul 07, 2022)
- Innolink - The advanced Chiplet solution complies with the Universal Chiplet Interconnect Express (UCIe) standard (Jul 07, 2022)
- QuiX Quantum lands €5.5 million for development of world's most powerful photonic quantum computer (Jul 07, 2022)
- Brite Semiconductor Introduces Two Innovative Technologies For DDR PHY (Jul 07, 2022)
- Order Cancellations Strike, 8-inch Fab Capacity Utilization Rate Declines Most in 2H22, Says TrendForce (Jul 07, 2022)
- 灿芯半导体推出两项创新技术用于DDR物理层 (Jul. 07, 2022)
- Global Semiconductor Sales Increase 18.0% Year-to-Year, 1.8% Month-to-Month in May (Jul 06, 2022)
- Outsourcing Supply Chain Management for chip manufacture can increase yields and quality (Jul 06, 2022)
- UMC Reports Sales for June 2022 (Jul 06, 2022)
- WiLAN Signs Second Wireless License in Automotive Industry (Jul 06, 2022)
- Nestwave Announces that Renesas has Adopted its IoT Geolocation Technology for Forthcoming LTE-M/NB-IoT Module (Jul 06, 2022)
- Imperas announce the latest RISC-V test suites are now available free with riscvOVPsimPlus (Jul 06, 2022)
- Digital Core Design and Resquant are ready for quantum computing-resistant cryptography (Jul 06, 2022)
- GUC Monthly Sales Report - June 2022 (Jul 05, 2022)
- Infineon to strengthen its leading expertise as IoT solution provider by acquiring verification expert NoBug in Romania and Serbia (Jul 05, 2022)
- Multiport Memory With Analog Port Patent Issued (Jul 05, 2022)
- Ludicrous Low Power (L2P) by SILICONGATE (Jul 05, 2022)
- Faraday to Showcase FPGA-Go-ASIC Service at DAC in San Francisco (Jul 05, 2022)
- Veriest Joins the Global Semiconductor Alliance (Jul 04, 2022)
- Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets (Jul 04, 2022)
- Enhance your High-Density data processing capabilities to new heights with the USB 3.2/ PCIe 3.1/ SATA 3.2 Combo PHY IP Core interface in 28HPC+/HPC process technology (Jul 04, 2022)
- SEGGER's product line fully supports Arm Cortex-M85 (Jul 04, 2022)
- Optima Launches New IC Security Verification Solution (Jul 04, 2022)
- 直击台积电2022年技术论坛现场：最新产能规划、2nm芯片、特色工艺全覆盖 (Jul. 04, 2022)
- 直击台积电2022年技术论坛现场：最新产能规划、2nm芯片、特色工艺全覆盖 (Jul. 04, 2022)
- Accenture Completes Acquisition of XtremeEDA to Expand Silicon Design Capabilities in Canada and US (Jul 01, 2022)
- Sondrel appoints Gareth Jones as VP ASIC (Jul 01, 2022)
- 【芯视野】先进制程"喂饱"台积电 (Jul. 01, 2022)
- ZAYA及晶心科技攜手提供RISC-V系統可認證的TEE 解決方案 (Jul. 01, 2022)
- 挖角ARM？SiFive成立英国研发中心，网罗CPU设计人才 (Jul. 01, 2022)
- 安谋科技：机器人怎样才能做到更高效、更智能、更安全？ (Jul. 01, 2022)
- 西门子Xcelerator开放式数字商业平台发布 全力加速数字化转型 (Jul. 01, 2022)
- 国产IP迎黄金时代 牛芯半导体如何突出国际巨头重围？ (Jul. 01, 2022)
- 第二季度全球3家客户获得GbE (10/100/1000 Base-T) PHY IP的授权使用 (Jun. 30, 2022)
- Truechip Adds USB 4 Hub Model & USB 4 Retimer Model to its Verification IP Portfolio (Jun 30, 2022)
- Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture (Jun 30, 2022)
- 2022 a Focus for 12-inch Capacity Expansion, 20% Annual Growth Expected in Mature Process Capacity, Says TrendForce (Jun 30, 2022)
- Intel Foundry Services Forms Alliance to Enable Design in the Cloud (Jun 30, 2022)
- Alphacore Joins Forces with Quantum Leap Solutions to Bring World-Class Design IP to the North American Commercial Market (Jun 30, 2022)
- ETSI and MIPI Alliance Announce Incorporation of MIPI I3C Basic into ETSI Smart Secure Platform (Jun 30, 2022)
- Top Five MPU Suppliers Expand Share of Sales to 86% in 2021 (Jun 30, 2022)
- New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs (Jun 30, 2022)
- Breker Verification Systems Joins RISC-V International as a Strategic Member to Drive Cache Coherency and SoC Integration Verification Methodologies (Jun 30, 2022)
- New S2C Multi-FPGA Prototyping Software Eases the Pain (Jun 30, 2022)
- Xiphera's first financing round successfully completed (Jun 30, 2022)
- The Role of Hardware Root of Trust in Edge Devices (Jun 30, 2022)
- 揭秘三星量产的3nm GAA 技术 (Jun. 30, 2022)
- Arm Total Compute Solutions redefine visual experiences and supercharge mobile gaming (Jun 29, 2022)
- Synopsys and Arm Strengthen Partnership to Advance Next-Gen Mobile SoCs for Arm's Total Compute Solutions (Jun 29, 2022)
- Vidatronic Announces Power Management IP Now Certified on Globalfoundries' 22FDX® Platform for IoT Applications (Jun 29, 2022)
- Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions (Jun 29, 2022)
- Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success (Jun 29, 2022)
- EnSilica chassis control ASIC for premium automotive brand enters mass production (Jun 29, 2022)
- Weebit Nano tapes out ReRAM demo chip to SkyWater foundry (Jun 29, 2022)
- 英特爾晶圓代工服務成立聯盟 加速代工客戶產品上市時間 (Jun. 29, 2022)
- 全新 Cadence Xcelium Apps全面加速汽车电子、移动设备和超算系统的软件仿真验证 (Jun. 29, 2022)
- ARM发布Coretx-X3 /A715/A510 CPU：最大12核、全面迈向64位 (Jun. 29, 2022)
- UMC, eMemory, and PUFsecurity Announce Successful Silicon-Proven Secure Embedded Flash IP (Jun 28, 2022)
- Vayyar Selects proteanTecs to Advance Vehicle Safety with Predictive Analytics (Jun 28, 2022)
- Enhanced Serial Peripheral Interface (eSPI) Master/Slave Controller (Jun 28, 2022)
- Flex Logix Hires Barrie Mullins as Vice President of Product Management (Jun 28, 2022)
- Accenture Announces Intent to Acquire XtremeEDA to Expand Silicon Design Capabilities in Canada and US (Jun 28, 2022)
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- Synaptics Selects Allegro DVT's VVC Compliance Streams (Jun 28, 2022)
- New startup MachineWare enables ultra-fast RISC-V simulation (Jun 28, 2022)
- Meet Axiomise's Ashish Darbari at DAC to Learn about Benefits of Formal Verification (Jun 28, 2022)
- SiFive Expands Global Operations, Opens UK R&D Center in Cambridge (Jun 28, 2022)
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- Synaptics选择Allegro DVT的VVC合规流 (Jun. 28, 2022)
- IAR Systems enable Visual Studio Code extensions to meet developer demands (Jun 27, 2022)
- GbE (10/100/1000 Base-T) PHY IP licensed by 3 different customers in Q2 alone for Worldwide Use (Jun 27, 2022)
- TSMC Japan 3DIC R?D Center Completes Clean Room Construction in AIST Tsukuba Center (Jun 27, 2022)
- Ansys Multiphysics Solutions Achieve Certification for TSMC's N3E and N4P Process Technologies (Jun 27, 2022)
- Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips (Jun 27, 2022)
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA (Jun 27, 2022)
- sureCore's ultra-low memory technologies enable designers to create the reality of the metaverse (Jun 27, 2022)
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- PCIe 7.0标准发布，最大数据速率高达 128GT/s (Jun. 24, 2022)
- Codasip的可定制L31 RISC-V内核荣获Embedded World展会最佳产品大奖 (Jun. 24, 2022)
- 英特尔携手微软推动AI规模化部署，发挥边云协同势能 (Jun. 24, 2022)
- Brite Launches High-Precision 16 bit SAR ADC (Jun 23, 2022)
- Tortuga Logic Rebrands as Cycuity as It Addresses Evolving Needs in Product Security (Jun 23, 2022)
- Pulsic Enhances Unity Chip Planning Technology with Incremental Floor-planning Capability to Speed IP block Placement, Planning (Jun 23, 2022)
- IPrium releases 4-channel ATSC 8VSB Modulator (Jun 23, 2022)
- Weebit Nano to publicly demonstrate its ReRAM IP module for the first time (Jun 23, 2022)
- CFX announces commercial availability of anti-fuse OTP technology on 90nm CIS process (Jun 23, 2022)
- Xiphera receives Business Finland's Young Innovative Company funding (Jun 23, 2022)
- TSMC Creates Design Options for New 3nm Node (Jun 23, 2022)
- GlobalFoundries Celebrates New Singapore Fab with Arrival of First Tool (Jun 23, 2022)
- Synopsys Completes Acquisition of WhiteHat Security (Jun 23, 2022)
- 格芯举行新加坡新厂房的首台设备搬入仪式 (Jun. 23, 2022)
- RISC-V发布四项新规范 (Jun. 23, 2022)
- 台積電2nm將採奈米片電晶體架構 速度功耗跨進新世代 (Jun. 23, 2022)
- Cadence 通过面向TSMC 先进工艺的PCIe 5.0 PHY 和控制器 IP 规范合规性认证 (Jun. 23, 2022)
- Supplyframe XQ新特性 新思科技已完成对WhiteHat Security的收购 (Jun. 23, 2022)
- XtremeEDA to enable IoT security deployment with Crypto Quantique's solution using Codasip's RISC-V processor (Jun 22, 2022)
- PCI-SIG® Announces PCI Express® 7.0 Specification to Reach 128 GT/s (Jun 22, 2022)
- 中国头部手机芯片公司获得UFS 3.1 控制器IP组合的完整授权。 (Jun. 22, 2022)
- M31 Technology has Developed and Validated the Ultra-Low Power 12nm PCIe 5.0 High-Speed Interface IP (Jun 22, 2022)
- CEVA Extends its RivieraWaves UWB IP to Support CCC's Digital Key 3.0 Standard for Keyless Access to Vehicles (Jun 22, 2022)
- Codasip adds Veridify secure boot to RISC-V processors (Jun 22, 2022)
- Intento Design Secures Third Round of Investment to Accelerate Its Commercial Deployment (Jun 22, 2022)
- MosChip Technologies Appoints Semiconductor Industry Veteran, DVR Murthy As "Vice President of Strategic Initiatives" to Implement and Execute Expanded Solution Offerings (Jun 22, 2022)
- RISC-V计算领导者SiFive为X280处理器IP引入诸多矢量加速新特性 (Jun. 22, 2022)
- Imagination推出首款即時嵌入式RISC-V CPU- RTXM-2200 (Jun. 22, 2022)
- M31円星科技開發驗證完成超低功耗12奈米PCIe5.0高速接口IP (Jun. 22, 2022)
- 灿芯半导体受邀参加众合科技战略业务系列展 (Jun. 22, 2022)
- OpenHW Group Announces RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software (Jun 21, 2022)
- Imagination launches IMG RTXM-2200 - its first real-time embedded RISC-V CPU (Jun 21, 2022)
- OPENEDGES to Demonstrate Latest NPU IP, ENLIGHT at CVPR 2022 (Jun 21, 2022)
- RISC-V Announces First New Specifications of 2022, Adding to 16 Ratified in 2021 (Jun 21, 2022)
- CV32E40P Core From OpenHW Group Sets the RISC-V Quality Standard For Open-Source Hardware IP (Jun 21, 2022)
- Codasip Studio Mac extends potential to design for differentiation with RISC-V (Jun 21, 2022)
- Codasip L31 customizable RISC-V core is an Embedded World Best in Show (Jun 21, 2022)
- Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity (Jun 21, 2022)
- SiFive Enhances Popular X280 Processor IP to Meet Accelerated Demand for Vector Processing (Jun 21, 2022)
- Cadence Achieves PCIe 5.0 Specification Compliance for PHY and Controller IP in TSMC Advanced Technologies (Jun 21, 2022)
- Expedera Expands Global Reach with New Regional Design Centers and Chinese Langauge Website (Jun 21, 2022)
- Dolphin Design wins an Embedded Award for Tiny Raptor, its Energy-Efficient Neural Network AI Accelerator (Jun 21, 2022)
- Cadence Announces $100 Million Accelerated Share Repurchase Agreement (Jun 21, 2022)
- Complete UFS 3.1 Controller solution (Analog / Digital IP Cores) licensed to China's leading Smartphone Company (Jun 20, 2022)
- Samsung Ventures invests in Israeli AI systems and semiconductor company NeuReality (Jun 20, 2022)
- World's First AV1 Decoder Silicon IP with support for 12-bit pixel size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT (Jun 20, 2022)
- Huawei and Nordic cellular IoT licensing deal takes a big step towards industry-wide component-level licensing (Jun 20, 2022)
- World's first end-to-end integration of ZKP with FPGAs. (Jun 20, 2022)
- VisualSim Antenna System Designer enables simulation of Antenna and Communication Systems (Jun 20, 2022)
- Fraunhofer IPMS develops CANsec Controller IP-Core CAN-SEC (Jun 20, 2022)
- Silicon Topology Joins TSMC Design Center Alliance (DCA) (Jun 20, 2022)
- 台积电最新工艺路线图：2nm正式亮相 (Jun. 19, 2022)
- RISC-V"野心优雅"：从席卷IoT到统治全世界 (Jun. 18, 2022)
- Synopsys Boosts 5G SoC Development Productivity with New RF Design Flow for TSMC N6RF Process (Jun 17, 2022)
- TSMC FINFLEX™, N2 Process Innovations Debut at 2022 North American Technology Symposium (Jun 17, 2022)
- Cadence RFIC Solutions Support TSMC N6RF Design Reference Flow (Jun 17, 2022)
- Embedded World fair: Menta will unveil an unprecedented collaboration with Everspin Technologies (Jun 17, 2022)
- 台積公司舉辦2022年北美技術論壇 會中揭示TSMC FINFLEX™ 技術及N2製程的創新成果 (Jun. 17, 2022)
- Arm SystemReady 创下新里程 为数据中心夯实创新根基 (Jun. 17, 2022)
- SmartDV Charts Course Toward Chiplets, Joins Universal Chiplet Interconnect Express (UCIe) (Jun 16, 2022)
- Renesas Develops Circuit Technologies for 22-nm Embedded STT-MRAM with Faster Read and Write Performance for MCUs in IoT Applications (Jun 16, 2022)
- Alchip Technologies Offers 3nm ASIC Design Services (Jun 16, 2022)
- OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium (Jun 16, 2022)
- Avery Design Systems Announces Verification Support for New UCIe standard, Accelerating Adoption of Chiplet Interconnect Protocol (Jun 16, 2022)
- QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template (Jun 16, 2022)
- Siemens extends support of multiple IC design solutions for TSMC's latest processes (Jun 16, 2022)
- CAST and Fraunhofer IPMS Mark 20-Year Partnership with Product of the Year Win (Jun 16, 2022)
- Cadence Design IP portfolio in TSMC's N5 Process Gains Broad Adoption Among Leading Semiconductor and System Companies (Jun 16, 2022)
- 日本入局，全球2纳米制程争夺战升级 (Jun. 16, 2022)
- CEVA扩展传感器融合产品线，推出用于高精度运动跟踪和方向检测的全新传感器中枢 MCU (Jun. 16, 2022)
- 报道称格罗方德计划携手意法半导体在欧洲投建新晶圆厂 (Jun. 16, 2022)
- The Five Biggest MCU Suppliers Accounted for 82% of 2021 Sales (Jun 15, 2022)
- 中国芯片设计企业获得Wi-Fi 6 (AX)/BLE/15.4 22 nm组合射频 IP 核的授权，设计物联网芯片组 (Jun. 15, 2022)
- Veriest expands Embedded Software team to provide full engineering services (Jun 15, 2022)
- Think Silicon to Unveil Industry's First RISC-V 3D GPU at Embedded World 2022 (Jun 15, 2022)
- Andes全面拥抱RISC-V带来哪些启示？ (Jun. 15, 2022)
- IAR Systems支持全新Arm Cortex-M85处理器 (Jun. 14, 2022)
- intoPIX takes part in Major VSF Interoperability Demonstrations at VidTrans 2022 (Jun 14, 2022)
- Renesas Announces Investment in Popular Open-Source Company Arduino to Access Huge Developer Community (Jun 14, 2022)
- Allegro DVT Acquires Labwise Ltd. to Extend its Compliance Stream Business Line and Enrich its Products & Service Portfolio (Jun 14, 2022)
- Intrinsic ID Signs Representation Agreement with Kaviaz Technology to Extend the Commercial Reach of its Physical Unclonable Function (PUF) Security IP Solutions in Taiwan (Jun 14, 2022)
- Codasip appoints Mike Eftimakis as VP of Strategy and Ecosystem (Jun 14, 2022)
- Real Intent Advances Meridian CDC with Multimode Coverage & Unprecedented 10X Efficiency (Jun 14, 2022)
- Imagination GPU approved by HORIBA MIRA Certification Limited for functionally safe ADAS and HMI applications (Jun 14, 2022)
- Intrinsic ID 与 Kaviaz Technology 签署代理协议，以扩大其物理不可克隆功能 (PUF) 安全 IP 解决方案在台湾的商业范围 (Jun. 14, 2022)
- TSMC May 2022 Revenue Report (Jun 13, 2022)
- Wi-Fi 6 (AX)/BLE/15.4 22nm Combo RF IP Core, Licensed to a leading Chinese Semiconductor Company for IoT Chipset (Jun 13, 2022)
- Alphawave IP Announces Availability of Two New Interconnect IP Products in TSMC Advanced Processes (Jun 13, 2022)
- Analog Bits to Demonstrate Pinless PLL and Sensor IP's in TSMC N5 Process at TSMC 2022 North America Technology Symposium (Jun 13, 2022)
- IAR Systems accelerates innovation for solutions based on Arm Cortex-M85 processor (Jun 13, 2022)
- SkyWater Announces Availability of SRAM Memory Compiler for 90 nm Strategic Rad Hard by Process Offering (Jun 13, 2022)
- Cadence Digital and Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes (Jun 13, 2022)
- Altair Expands Electronic System Design Technology with Acquisition of Concept Engineering (Jun 13, 2022)
- Synopsys Drives Chip Innovation for Next-Generation Mobile and HPC Designs on TSMC N3E and N4P Processes (Jun 13, 2022)
- Cadence Extends Cloud Leadership with Transformational Cadence OnCloud SaaS and e-Commerce Platform (Jun 13, 2022)
- Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022, SEMI Reports (Jun 13, 2022)
- Alphawave宣布两项新互连IP产品面市 (Jun. 13, 2022)
- Socionext开发超小型60GHz毫米波雷达传感器 (Jun. 13, 2022)
- CAES announces Space Grade Qualification of Quad Core LEON4FT Microprocessor (Jun 10, 2022)
- T2M发布经过验证的14 位、4.32Gsps 超高速宽带、时间交织流水架构的 ADC IP 核 (Jun. 10, 2022)
- Mosaid Acquires Major Semiconductor Process Portfolio (Jun 10, 2022)
- Mark Potter and Christian Klingler Join proteanTecs Advisory Board (Jun 10, 2022)
- Mosaid Announces Semiconductor Process License Agreement (Jun 10, 2022)
- Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Designs (Jun 10, 2022)
- 东芝和Japan Semiconductor共同开发用于车载应用的具有嵌入式非易失性存储器的高度可靠多功能模拟平台 (Jun. 10, 2022)
- Cadence Cerebrus 基于 AI 的解决方案为下一代客户设计带来变革性成果 (Jun. 10, 2022)
- 三星、台积电双双遇阻 高端芯片面临"难产" (Jun. 10, 2022)
- First RISC-V-Based System-on-Chip (SoC) FPGA Enters Mass Production (Jun 09, 2022)
- Fraunhofer IPMS RISC-V processor core supported by debugging tool from Lauterbach (Jun 09, 2022)
- TEMPO AI chip tapes out with videantis processor platform (Jun 09, 2022)
- CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection (Jun 09, 2022)
- Cadence Extends Cloud Leadership with Transformational Cadence OnCloud SaaS and e?Commerce Platform (Jun 09, 2022)
- Cadence Revolutionizes System Design with Optimality Explorer for AI-Driven Optimization of Electronic Systems (Jun 09, 2022)
- Agile Analog signs first Chinese licensee for its analog IP (Jun 09, 2022)
- Texas Instruments Keeps A Firm Grip As World's Top Analog IC Supplier (Jun 09, 2022)
- Renesas to Acquire Reality AI to Bring Advanced Signal Processing and Intelligence to the Endpoint (Jun 09, 2022)
- Toshiba and Japan Semiconductor Develop Highly Reliable Versatile Analog Platform with Floadia's G1 technology for Automotive Applications (Jun 09, 2022)
- OIF Releases Common Electrical I/O 5.0 Implementation Agreement (Jun 09, 2022)
- BSC and Intel announce a joint laboratory for the development of future zettascale supercomputers (Jun 09, 2022)
- World's Top Ten IC Design Company Revenue Reached US$39.43 billion in 1Q22, Marvell Growth Rate Tops List, Says TrendForce (Jun 09, 2022)
- 台积电确认：2nm转向纳米片，未来看好CFET (Jun. 09, 2022)
- 灿芯半导体推出高精度16位SAR ADC (Jun. 09, 2022)
- Microchip 宣布业界首款基于RISC-V的片上系统（SoC）FPGA开始量产 (Jun. 09, 2022)
- Arm 发布全新图像信号处理器 助推物联网及嵌入式市场视觉系统发展 (Jun. 09, 2022)
- 瑞萨电子收购Reality AI为终端带来先进信号处理及智能化 (Jun. 09, 2022)
- Spectronite introduces a high-performance 5G wireless solution for mobile operators (Jun 08, 2022)
- The Automotive Industry is driving down acceptable chip defect levels (Jun 08, 2022)
- 14-bit, 4.32Gsps Ultra high speed Wideband, Time-Interleaved Pipeline ADC IP Cores available for license to customers for wide range of applications (Jun 08, 2022)
- Agile Analog signs first Chinese licensee ?for its analog IP (Jun 08, 2022)
- 广泛应用于物联网场景的超低功率模拟数据转换器(ADC) IP 核通过硅验证，可向客户进行授权. (Jun. 08, 2022)
- Intrinsic ID Announces Embedded SRAM PUF Security IP for Military-Grade IP protection in Intel FPGAs (Jun 08, 2022)
- QuantWare awarded €7.5M from the European Innovation Council to rapidly scale superconducting quantum processors (Jun 08, 2022)
- Arm introduces new image signal processor to advance vision systems for IoT and embedded markets (Jun 08, 2022)
- CEVA Bluetooth® 5.3 Platform IP Supports New Auracast™ Broadcast Audio, Transforming the Shared Audio Experience (Jun 08, 2022)
- Intrinsic ID 发布嵌入式 SRAM PUF 安全 IP，用于英特尔 FPGA 中的军用级 IP 保护 (Jun. 08, 2022)
- Agile Analog 签下首家中国模拟IP授权协议 (Jun. 08, 2022)
- Flex Logix 推出 Easyvision – 具有即用型模型和 AI 加速硬件的交钥匙 AI/ML 解决方案 (Jun. 07, 2022)
- TSMC Commits to Nanosheet Technology at 2 nm Node (Jun 07, 2022)
- UMC Reports Sales for May 2022 (Jun 07, 2022)
- Global Semiconductor Sales Increase 21.1% Year-to-Year, 0.7% Month-to-Month in April (Jun 07, 2022)
- Imagination expands with new UK office in Manchester (Jun 07, 2022)
- Real Intent Extends Meridian RDC's Low Noise Reporting & Debug Technology Leadership (Jun 07, 2022)
- IntoPIX teams up with Nextera and Adeas to participate in live IPMX interoperability demonstrations at InfoComm 2022 (Jun 07, 2022)
- Silicon qualified, Ultra-low power Analog Data-Convertors IP Cores (ADCs) available for license to the customers for wide range of IoT applications (Jun 06, 2022)
- GBT is Researching the Development of a Unified, Machine Learning-driven, Automated IC Design Environment (Jun 06, 2022)
- AP Memory launches brand-new product series of 512Mb Ultra-High-Speed (UHS) and 32Mb Ultra-Low-Swing (ULS) PSRAM (Jun 06, 2022)
- GUC Monthly Sales Report - May 2022 (Jun 06, 2022)
- Cyient to Acquire Portugal-Based Celfinet to Strengthen its Wireless Communications Offerings (Jun 06, 2022)
- Flex Logix Launches EasyVision - Turnkey AI/ML Solution with Ready-to-Use Models and AI Acceleration Hardware (Jun 06, 2022)
- Credo推出业界领先的40Gbps PAM3 SerDes技术，旨在满足新市场对高速、低功耗连接的需求 (Jun. 06, 2022)
- 台积电砸超2300亿加码2nm产能 (Jun. 06, 2022)
- 三星芯片及代工高层大洗牌 加速提升3纳米良率比拼台积电 (Jun. 05, 2022)
- Die到wafer的键合，更进一步 (Jun. 03, 2022)
- aiMotive ships first aiWare4 NPU production RTL (Jun 02, 2022)
- Global Semiconductor Equipment Billings Grow 5% Year-Over-Year in Q1 2022, SEMI Reports (Jun 02, 2022)
- Intrinsic ID to Attend Multiple Industry Events in June Addressing Increasing Need for Device-Level Security (Jun 02, 2022)
- Credo Introduces Industry Leading 40Gbps PAM3 SerDes Technology To Address New Markets Requiring High-speed, Low-Power Connectivity (Jun 02, 2022)
- NEUCHIPS' Purpose-Built Accelerator Designed to Be Industry's Most Efficient Recommendation Inference Engine (Jun 02, 2022)
- CAES and Ashling announce Ashling's RiscFree C/C++ Toolchain for CAES' NOEL-V Processors (Jun 02, 2022)
- Semiconductor Growth Still Seen at 11% Despite 2022 Headwinds (Jun 02, 2022)
- Synopsys Launches the Era of Smarter SoC Design with ML-Driven Big Data Analytics Technology (Jun 02, 2022)
- Trusted Objects adds Crypto Quantique's QuarkLink Platform to its Software Root-of-Trust for End-to-End IoT Device Security (Jun 02, 2022)
- Riviera-PRO Supports OpenCPI for Heterogeneous Embedded Computing of Mission-Critical Applications (Jun 02, 2022)
- CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput (Jun 02, 2022)
- Cadence Accelerates Industrial, Automotive, Hyperscale Data Center, and Mobile SoC Verification with Expanded VIP and System VIP Portfolio (Jun 02, 2022)
- Arm新任CEO：RISC-V是个有趣的竞争对手 (Jun. 02, 2022)
- 英特尔投资28亿元建立研究实验室 开发基于RISC-V的处理器 (Jun. 02, 2022)
- 新思科技推出全新DesignDash设计优化解决方案，开启更智能的SoC设计新时代 (Jun. 02, 2022)
- 瑞萨电子为加速电动汽车电池管理系统开发推出复合驱动软件 (Jun. 02, 2022)
- T2M在22 纳米、28 纳米和 40 纳米工艺节点上提供提升视频和显示芯片性能的DisplayPort/eDisplayPort v1.4 Rx的 PHY IP和配套多流传输和匹配的控制器 IP。 (Jun. 01, 2022)
- VeriSilicon Image Signal Processor IP Achieved IEC 61508 Industrial Functional Safety Certification (Jun 01, 2022)
- Jose Cano Joins Alphawave IP as Global Head of Investor Relations (Jun 01, 2022)
- QuickLogic Awarded New $3.0 Million eFPGA Contract (Jun 01, 2022)
- 芯原图像信号处理器IP获得IEC61508工业功能安全认证 (Jun. 01, 2022)
- 西门子推出新版 Nucleus ReadyStart 解决方案帮助简化和保护嵌入式 RISC-V 开发 (May. 31, 2022)
- 智原強化物聯網ASIC推出Soteria!安全IP子系統解決方案 (May. 31, 2022)
- PNG Image Decoder IP Core Available from CAST and IObundle (May 31, 2022)
- Faraday Launches Soteria! Security IP Subsystem for IoT ASIC (May 31, 2022)
- Barry Paterson is the new Agile Analog CEO (May 31, 2022)
- Imagination launches Open Access program, providing scale-ups with a low-cost path to differentiated silicon (May 31, 2022)
- ADTechnology to launch its 5nm A53-based Platform, ADP500 based on Samsung Foundry (May 31, 2022)
- Hewlett Packard Enterprise and SiPearl Partner to Develop HPC Solutions with European Processors and Accelerate Europe's Adoption of Exascale Supercomputers (May 30, 2022)
- ARM battles RISC-V at Renesas (May 30, 2022)
- Ex-Intel Global Senior VP Jim Finnegan joins Corigine (May 30, 2022)
- GBT Filed a Continuation Patent Application for its Long-Range Radio System (May 30, 2022)
- Rambus Completes Acquisition of Hardent (May 30, 2022)
- Elevate your Video and Display applications with the Multi-Stream Transport of DisplayPort/eDisplayPort v1.4 Rx PHY IP Cores in 22nm, 28nm and 40nm with Matching Controllers (May 30, 2022)
- London Stock Exchange welcomes EnSilica plc to AIM (May 30, 2022)
- Synopsys Appoints Two New Directors (May 30, 2022)
- ADTechnology to launch its 5nm A53-based Platform, ADP500™ based on Samsung Foundry (May 30, 2022)
- NSITEXE Selects ImperasDV for Automotive Quality RISC-V Processor Functional Design Verification (May 30, 2022)
- SiPearl Collaborates with NVIDIA on Enabling Accelerated Computing Solutions with European Microprocessor (May 30, 2022)
- Will Broadcom milk VMware dry or become a full stack company? (May 30, 2022)
- 基于Arm Cortex®-M23的新款单片机搭载安全密钥配置解决方案 (May. 27, 2022)
- Broadcom to Acquire VMware for Approximately $61 Billion in Cash and Stock (May 27, 2022)
- T2M推出物联网应用的无线射频收发器 IP 核，可立即获得许可 (May. 26, 2022)
- 成熟的PCIe 6.0 IP可极大降低复杂系统开发难度 (May. 26, 2022)
- 2024年代工产能或过剩 台积电重新评估扩产计划 (May. 26, 2022)
- 2022年开源安全和风险分析：开源无处不在，组件过时却成常态？ (May. 26, 2022)
- 芯事访谈 | 全志科技CTO丁然：视频、AI市场爆发，RISC-V生态需要产业一起努力 (May. 26, 2022)
- The Value of Small M&A Deals for Chipmakers (May 26, 2022)
- Wireless RF Transceiver IP Cores for IoT applications, available for immediate licensing (May 26, 2022)
- New Crypto Quantique device management service streamlines IoT security lifecycle with key integration of the Microchip Trust Platform Design Suite (May 26, 2022)
- Siemens streamlines, secures embedded RISC-V development with latest Nucleus ReadyStart solution (May 26, 2022)
- X-FAB宣布采用Cadence EMX Solver电磁仿真技术，加速创新通信和车用射频设计 (May. 25, 2022)
- LeapMind announces "Efficiera Anomaly Detection model" (May 25, 2022)
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- 新思科技与ADI公司达成合作，共同加速电源系统设计 (May. 24, 2022)
- 瑞薩將展示首款採用最新Arm Cortex-M85處理器的晶片 (May. 24, 2022)
- Synopsys and Analog Devices Collaborate to Accelerate Power System Design (May 24, 2022)
- Top Three Suppliers Held 94% of 2021 DRAM Marketshare (May 24, 2022)
- PUFsecurity's secure crypto coprocessor PUFcc wins COMPUTEX 2022 Best Choice Award (May 24, 2022)
- Renesas Will Demonstrate the First Working Silicon Based on the Recently Debuted Arm Cortex-M85 Processor (May 24, 2022)
- X-FAB Adopts Cadence EMX Solver's Electromagnetic Simulation Technology to Support Innovative RF Designs Targeted at Communication and Automotive Markets (May 24, 2022)
- Silex Insight & Intrinsic ID Join Forces (May. 24, 2022)
- Capgemini positioned as a Leader in the IDC MarketScape Worldwide Cloud Professional Services Vendor Assessment (May. 24, 2022)
- BrainChip Joins Arm AI Partner Program (May 23, 2022)
- Silicon Catalyst welcomes Flex Logix as an In-Kind Partner (May 23, 2022)
- GlobalFoundries and Motorola Solutions Announce Strategic Agreement for Chip Supply (May 23, 2022)
- EnSilica to list on London Stock Exchange's AIM market, expected to begin trading from 24th May (May 23, 2022)
- MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity (May 23, 2022)
- 台积电开发1.4纳米工艺，未来发展极限是什么？ (May. 23, 2022)
- 2036年实现"0.2nm"工艺 你相信吗？ (May. 23, 2022)
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- 中国科大在6G滤波器领域取得重要进展 (May. 22, 2022)
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- 1nm以下先进制程工艺发展路线浮出水面 (May. 21, 2022)
- GlobalFoundries Unveils GF Labs to Accelerate Technology Innovation (May 20, 2022)
- VeriSilicon's Chip Design Process Obtains ISO 26262 Automotive Functional Safety Management System Certification (May 20, 2022)
- ReRAM Proves Resistant To Invasive Attacks (May 20, 2022)
- Fujikura collaborates with GlobalFoundries to accelerate large-scale commercialization of 5G mmWave Technologies (May 20, 2022)
- QOI Image Compression IP Cores available from CAST and Ocean Logic (May. 20, 2022)
- GlobalFoundries Advances RF Leadership with GF Connex™ Portfolio and Customer Collaborations (May 20, 2022)
- Imagination Joins Baidu PaddlePaddle "Hardware Ecosystem Co-Creation Program" (May 20, 2022)
- Cortus joins the Alliance for Internet of Things Innovation (AIOTI) (May 20, 2022)
- 芯原芯片设计流程获得ISO 26262汽车功能安全管理体系认证 (May. 20, 2022)
- 英特尔宣布重磅投资规划，进一步推动数据中心可持续发展 (May. 20, 2022)
- Imagination加入百度飞桨 (May. 20, 2022)
- 台积电预计将在下个月宣布其 1.4 纳米生产节点的计划 (May. 20, 2022)
- SMIC Revenue Soars as Chinese Market Sours (May 19, 2022)
- Xiphera's new IP cores complement the existing ECC portfolio (May. 19, 2022)
- How real is TSMC's bid for conversion to 1.4-nm process node? (May 19, 2022)
- Intrinsic ID Taps Former Arm Executive to Lead Business Development Efforts as Need for Embedded Security Soars (May 19, 2022)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2022 (May 19, 2022)
- Arasan announces its 2'nd Generation of CAN IP (May. 19, 2022)
- China-Based IC Production to Represent 21.2% of China IC Market in 2026 (May 19, 2022)
- Cadence Digital Full Flow Achieves Certification for GlobalFoundries 12LP/12LP+ Process Platforms (May 19, 2022)
- Imagination and Visidon partner for deep-learning-based super resolution technology IMG Series4 NNA enables advanced AI-based software to efficiently upscale images and videos (May 19, 2022)
- oneNav Announces Competitive pureL5 Field Test Performance Using its Latest Customer Evaluation System (CES) (May 19, 2022)
- Intrinsic ID 聘请前 Arm 高管领导业务发展工作，以应对嵌入式安全需求飙升 (May. 19, 2022)
- GlobalFoundries推出GF实验室以加速技术创新 (May. 19, 2022)
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- Introducing the largest portfolio of Verification IP Cores for all types of Testbench verifications of different protocols and interfaces for your advanced Design IPs which are now available for immediate licensing (May 16, 2022)
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- Tower Semiconductor Expands its Leading-Edge Power Management Platforms Supporting Higher Power and Higher Voltage ICs (May 09, 2022)
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- CMC Delivers Over 400 Semiconductor Prototypes in Past Year (May 05, 2022)
- Tachyum Integrates IP From World's Leading Vendors for Tape-Out In 2022 (May 05, 2022)
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- GUC Monthly Sales Report - Apr 2022 (May 05, 2022)
- Steven Laub Joins Rambus Board of Directors (May 05, 2022)
- CoreHW Announces mmWave GF 22FDX PLL IP (May 04, 2022)
- ARM China staff post open letter pledging loyalty to Allen Wu (May 04, 2022)
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- intoPIX introduces the new TicoXS FIP for 4K & 8K AVoIP & WiFi-6 during ISE 2022 (May 04, 2022)
- Apple sues processor startup for theft of trade secrets (May 04, 2022)
- Intento Design Appoints Stephane Cordova as New CEO (May 04, 2022)
- U.S. Department of Defense and GlobalFoundries Partner to Secure Supply of Chips Critical to National Security Systems (May 03, 2022)
- "Onshoring" chip production is a red herring: the UK should double down on its competitive advantage in R&D and IP to create a secure semiconductor supply chain (May 03, 2022)
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- Global Semiconductor Sales Increase 23% in Q1 2022 Compared to Q1 2021 (May 02, 2022)
- VLAB Works enables Embedded Applications with VLAB VDMs (May 02, 2022)
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- Arm China majority shareholders announce the company's corporate governance issue has been resolved (May 02, 2022)
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- Alphawave IP: Full Year 2021 Results and Q1 2022 Trading Update (May 02, 2022)
- 弯道超车？三星3nm制程有可能先于台积电投产 (May. 02, 2022)
- Rubio, Colleagues Urge CFIUS Review of Alphawave Acquisition of U.S. Semiconductor IP Company (May 02, 2022)
- India set for fab (May 02, 2022)
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- Soitec 公布 2022 财年第四季度财报，收入同比增长53% (Apr. 29, 2022)
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- Arm发布Cortex-M85，并持续拓展其物联网全套解决方案 (Apr. 28, 2022)
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- BrainChip and SiFive Partner to Deploy AI/ML Technology at the Edge (Apr 05, 2022)
- Chinese Companies Hold Only 4% of Global IC Marketshare (Apr 05, 2022)
- 台积电|将成为2022年NVIDIAGPU的独家合同供应商 (Apr. 04, 2022)
- Samsung Foundry Adopts Leading Voltage-Timing Signoff Solution from Synopsys and Ansys for Advanced-Node, Energy-Efficient Chips (Apr 04, 2022)
- Flex Logix Announces Production Availability of InferX X1M Boards for Edge AI Vision Systems (Apr 04, 2022)
- VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium (Apr 04, 2022)
- SMIC Announces 2021 Annual Results (Apr 04, 2022)
- Electronic System Design Industry Logs 14.4% Year-Over-Year Revenue Growth in Q4 2021, ESD Alliance Reports (Apr 04, 2022)
- Hynix mulling a bid for Arm (Apr 04, 2022)
- intoPIX announces TicoRAW integration into the new Novitec industrial camera portfolio (Apr 04, 2022)
- Wacom, STMicroelectronics, and CEVA Collaborate to Enhance the Digital Pen Experience (Apr 04, 2022)
- M31 Speeds Delivery of Silicon IP by 5X Using the Cadence Library Characterization Solution in the Cloud (Apr 04, 2022)
- Arm transfers most of its Arm China shareholding to Softbank (Apr 04, 2022)
- Synopsys Launches Industry's First Broad-Scale Cloud SaaS Solution to Transform Chip Development Landscape (Apr 04, 2022)
- Alma Technologies Launches Scalable Encoder and Decoder Semiconductor IP for VESA DSC 1.2b Visually Lossless Compression (Apr 04, 2022)
- eTopus Announces PCIe IP Gen 1-6 and 800G Support For 7/6nm With Support For SoC & Chiplet Clients (Apr 04, 2022)
- Chiplet符合目前国情：芯原戴伟民谈UCIe标准对中国半导体产业的意义 (Apr. 02, 2022)
- 中芯国际财报"暗示"，半导体上游设备是难题也是机遇 (Apr. 02, 2022)
- 芯原股份正式加入UCIe产业联盟 (Apr. 02, 2022)
- RISC-V能发展壮大吗？ (Apr. 01, 2022)
- Alma Technologies推出面向VESA DSC 1.2b视觉无损压缩的可扩展编码器和解码器半导体IP (Apr. 01, 2022)
- 台积电将5nm产量提高到15万片/月 (Apr. 01, 2022)
- 智原發表基於Cortex-A53的SoC平台以加速FinFET晶片開發 (Mar. 31, 2022)
- Sierra Space 使用西门子 Xcelerator 革新太空探索技术 (Mar. 31, 2022)
- Synopsys与微软合作推出SaaS解决方案 (Mar. 31, 2022)
- Wacom、意法半导体和 CEVA达成合作协议 (Mar. 31, 2022)
- Chip demand is slowing says TSMC chairman (Mar 31, 2022)
- SiFive Appoints Nicole Singer as Chief Human Resources Officer to Drive SiFive Growth and Hiring (Mar 31, 2022)
- SEGGER Embedded Studio for Arm now with hard real-time C++ support (Mar 31, 2022)
- WiLAN and Kyocera Enter New Wireless License (Mar 31, 2022)
- ARIES Embedded Presents New MCXL Reference IP Design (Mar 31, 2022)
- Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development (Mar 31, 2022)
- Alena Shiltova becomes Marketing Communications Manager at Menta (Mar 30, 2022)
- QuickLogic Announces a New $1.5 Million eFPGA Contract (Mar 30, 2022)
- CAST Receives ISO 9001:2015 Certification (Mar 30, 2022)
- IAR Systems enables powerful AI/ML applications based on Alif Semiconductor's microcontrollers and fusion processors (Mar 30, 2022)
- Microcontrollers Get a Lift from Automotive After 2021 Rebound (Mar 30, 2022)
- Advancing VHDL's Verification Capabilities with VHDL-2019 Protected Types (Mar 29, 2022)
- Sondrel's 统一设计约束 (Mar. 29, 2022)
- Edgewater Wireless selects CMC Microsystems as fabrication services Partner (Mar 29, 2022)
- ARM-based Server Penetration Rate to Reach 22% by 2025 with Cloud Data Centers Leading the Way, Says TrendForce (Mar 29, 2022)
- Movellus to Provide Intelligent Clock Network IP to BAE Systems (Mar 29, 2022)
- ElectraIC is now a Partner of Xilinx (Mar 29, 2022)
- 推出 DDR5/DDR4/LPDDR5 Combo PHY IP 核，用 12FFC 工艺技术为下一代高性能 SoC 进行硅验证，可立即获得许可 (Mar. 28, 2022)
- Introducing DDR5/DDR4/LPDDR5 Combo PHY IP Core, Silicon Proven in 12FFC for Next-Gen High performance SoCs is available for immediate licensing (Mar 28, 2022)
- Samsung Sued for Infringement of HEVC Essential Patents (Mar 28, 2022)
- Gidel FPGA boards used for next generation wireless communication research (Mar 28, 2022)
- Samsung retains top spot in Omdia Q4 2021 semiconductor market analysis (Mar 28, 2022)
- SEMIFIVE Acquires Analog Bits (Mar 28, 2022)
- MIPS Chooses Ashling's RiscFree Toolchain for its RISC-V ISA Compatible IP Cores (Mar 28, 2022)
- AI Chip Company Syntiant Raises $55 Million to Accelerate Growth (Mar 28, 2022)
- 英伟达欲找英特尔代工？分析师：为压制台积电工艺涨价 (Mar. 25, 2022)
- 台积电的全球布局 (Mar. 25, 2022)
- GAAFET為何在3nm節點輸給FinFET？ (Mar. 25, 2022)
- 5G时代下的互联设计挑战及其解决方案 (Mar. 25, 2022)
- Imagination在GDC 2022上推出下一代移动游戏解决方案 (Mar. 25, 2022)
- 软银拟推动ARM公司IPO，估值至少600亿美元 (Mar. 25, 2022)
- Imagination launches next-gen mobile gaming at GDC 2022 (Mar 25, 2022)
- Arteris IP官宣，任命Michal Siwinski担任首席营销官 (Mar. 24, 2022)
- Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services (Mar 24, 2022)
- O-RAN Fronthaul Transport Subsystem is now available (Mar 24, 2022)
- Amid Rising Volume and Pricing, Top 10 IC Design Companies Post 2021 Revenue Topping US$100 Billion (Mar 24, 2022)
- The Semiwise's Flat Field Transistor enables the continuation of DRAM scaling (Mar 24, 2022)
- Analog Market Momentum to Continue Throughout 2022 (Mar 24, 2022)
- CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale (Mar 24, 2022)
- Cadence Selected by Microsoft for RAMP Phase II Program (Mar 24, 2022)
- 晶心科技、IARS攜手協助車用IC設計領導廠商加速產品上市時程 (Mar. 23, 2022)
- PCIe 6.0三大改變不可不看 (Mar. 23, 2022)
- SmartDV More Than Doubles Sales From 2020 to 2021 (Mar 23, 2022)
- Intrinsic ID PUF Technology Now Fully Compatible with OpenTitan Root of Trust to Strengthen Device Level Security (Mar 23, 2022)
- Silex Insight introduces Network Security Crypto Accelerator (Mar 23, 2022)
- Analog IP offerings a hot commodity in semiconductor M&A (Mar 23, 2022)
- Michal Siwinski Joins Arteris IP as Chief Marketing Officer (Mar 23, 2022)
- Avalanche Technology and Efabless Partner for System-On-Chip Development using Google's Open-Source Program (Mar 22, 2022)
- Andes and IAR Systems Enable Leading Automotive-Focused IC Design Companies to Accelerate Time to Market (Mar 22, 2022)
- 2022年人工智慧推理五大趨勢 (Mar. 22, 2022)
- IObundle and CAST Partner on Audio and Graphics IP Cores (Mar 22, 2022)
- 台积电、英特尔、三星全球布局对比 (Mar. 21, 2022)
- 三星宣称5nm代工厂正在提升产能 但高通可能找台积电改善良率 (Mar. 21, 2022)
- 台积电竹南先进封装厂Q3量产 (Mar. 21, 2022)
- PCIe进入6.0时代，三大变化不可不看 (Mar. 21, 2022)
- Xylon Demonstrates Hot Swapping of Programmable FPGA/SoC Chip Parts (Mar 21, 2022)
- CAES Introduces Family of Radiation Hardened NOR Flash Memories for Space FPGAs (Mar 21, 2022)
- SEGGER releases new Embedded Studio for RISC-V with hard real-time C++ support (Mar 21, 2022)
- RISC-V Processor Core of Fraunhofer IPMS now ready for Edge AI (Mar 21, 2022)
- Menta Announces Joint Partnership with Trusted Semiconductor Solutions (Mar 21, 2022)
- Arm to lay-off up to 1,000 workers as it preps for IPO (Mar 21, 2022)
- Imagination announces ambitious global recruitment drive (Mar 21, 2022)
- Global Semiconductor Materials Market Revenue Tops $64 Billion in 2021 to Set New Record, SEMI Reports (Mar 21, 2022)
- MPEG LA Expands AVC License to Include Complete MVC Coverage (Mar 21, 2022)
- Siemens' Analog FastSPICE certified for UMC's 28nm HPCᵁ+ process technology (Mar 21, 2022)
- SiFive Leadership in RISC-V Powers $2.5B+ Company Valuation (Mar 21, 2022)
- 集微咨询：射频前端迎发展的黄金时代，更多国内实力厂商或将迈向"IDM" (Mar. 21, 2022)
- 分析称Arm将会成为华为云计算越来越重要的合作伙伴 (Mar. 21, 2022)
- Siemens' Analog FastSPICE certified for UMC's 28nm HPC?+ process technology (Mar 21, 2022)
- AMD悄然组了一个RISC-V团队 (Mar. 19, 2022)
- Alphawave IP 2.1亿美元收购SiFive OpenFive 部门 (Mar. 18, 2022)
- 火拼先进封装，台积电英特尔三星急了 (Mar. 18, 2022)
- Fraunhofer将Tensorflow lite移植到RISC-V中 (Mar. 18, 2022)
- Intrinsic ID Optimizes SRAM PUF Security Technology for Advanced Process Nodes with QuiddiKey 4.x (Mar 18, 2022)
- Top 10 Foundries Post Record 4Q21 Performance for 10th Consecutive Quarter at US$29.55B, Says TrendForce (Mar 17, 2022)
- Quadric Announces $21M to Advance Its Disruptive Edge AI Platform (Mar 17, 2022)
- 集微咨询：国产FPGA的晋级之路 从细分市场获取更多技能包 (Mar. 17, 2022)
- 采用 12FFC 的 HDMI 2.0 Tx PHY 与控制器 IP 核，具有高无损的音频/视频数据传输功能，将针对 4KTV SOC 提供授权！ (Mar. 16, 2022)
- Soitec 在法国贝宁增设创新型碳化硅晶圆生产线，以提升 SOI 综合供应能力 (Mar. 16, 2022)
- 2022 Flash Memory CapEx Expected to Reach $29.9B; Set New High (Mar 16, 2022)
- Weebit scaling down its ReRAM technology to 22nm (Mar 15, 2022)
- PCIe 6.0 Designed to Meet Automotive, AI Bandwidth Demands (Mar 15, 2022)
- Alphawave IP Announces Definitive Agreement to Acquire Entire OpenFive Business Unit from SiFive for US$210m in cash (Mar 14, 2022)
- IAR Systems extends powerful RISC-V solutions with 64-bit support (Mar 14, 2022)
- SEGGER announces that Renesas has licensed emWin for all RX microcontrollers (Mar 14, 2022)
- Codasip University Program spurs innovation and boosts curriculums (Mar 14, 2022)
- Rambus Announces James Mitarotonda to Become Board Advisor (Mar 14, 2022)
- HDMI 2.0 Tx PHY in 12FFC along with Controller IP Core with high lossless Audio/Video data transfer, licensed for a 4KTV SoC (Mar 14, 2022)
- Codasip大学项目激发创新并推动课程发展 (Mar. 14, 2022)
- Imagination和瑞昱半导体携手推出全球首款具有图像压缩功能的数字电视SoC (Mar. 11, 2022)
- 新思科技与GlobalFoundries加强合作，以光电统一芯片设计解决方案支持GF Fotonix™新平台 (Mar. 11, 2022)
- 英特尔进军的RISC-V，或许是国产芯片最后的希望 (Mar. 11, 2022)
- 台积电、世界先进8英寸晶圆代工产能3月全面涨价 (Mar. 11, 2022)
- TSMC February 2022 Revenue Report (Mar 10, 2022)
- Zepp Health signs licence agreement for sureCore's EverOn ultra-low voltage memory IP (Mar 10, 2022)
- QuickLogic Announces a New Approximately $1M eFPGA Contract (Mar 10, 2022)
- SEGGER collaborates with HPMicro making Embedded Studio for RISC-V available at no cost (Mar 10, 2022)
- GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs (Mar 10, 2022)
- Imagination and Realtek launch world-first image compression DTV SoC (Mar 10, 2022)
- Rambus Accelerates Automotive SoC Design with ASIL-B Certified Embedded Hardware Security Module (Mar 10, 2022)
- Vidatronic Announces the 5nm FinFET Power Management IP Series for Ultra-Low-Power, System-on-a-Chip (SoC) Integration (Mar 10, 2022)
- QuantWare releases 25-qubit Contralto QPU (Mar 10, 2022)
- PragmatIC Semiconductor leads project to digitise reusable packaging (Mar 10, 2022)
- OPENEDGES Announces Silicon Proven 12nm LPDDR54 PHY IP (Mar 10, 2022)
- AlphaICs welcomes IEEE Fellow Michael Shebanow as Chief Technology Officer (Mar 10, 2022)
- 與勁敵別苗頭 三星準備搶先量產GAA製程 (Mar. 10, 2022)
- 創意電子發佈 2.5D 與 3D 多晶粒 APT 平台，可用於人工智慧、高效能運算及網路應用先進客製化 IC 領域 (Mar. 10, 2022)
- 汽车芯片需要怎样的处理器架构？ (Mar. 10, 2022)
- 用于高级 SoC 中所有高端串行连接接口的 PCIe 5.0 SerDes PHY 和控制器 IP 核可立即获得许可！！ (Mar. 09, 2022)
- Arasan announces the immediate availability of its MIPI D-PHY IP as Tx Only or Rx Only for the GlobalFoundries 12nm FinFET process node (Mar 09, 2022)
- 2022 to Mark the Third Year in a Row of ?20% Growth for the Foundry Market (Mar 09, 2022)
- UK startup is raising funds for Open Power processor (Mar 09, 2022)
- Ubiscale announces new customer for Cobalt, its low-power GNSS IP core (Mar 09, 2022)
- 格芯推出新一代硅光解决方案，为数据中心开创更广阔的新纪元 (Mar. 09, 2022)
- 中国工程师帮助开发 Sondrel 的最新快速跟踪验证培训课程 (Mar. 08, 2022)
- Andes Technology Announces over 10 Billion Cumulative Shipments of Andes-Embedded SoCs and Records All-Time High Annual and Monthly Revenue in 2021 (Mar 08, 2022)
- Reshoring Chip Industry Risks Failure With Just More Fabs (Mar 08, 2022)
- QuickLogic Announces First Rad-Hard eFPGA IP for SkyWater RH90 Process (Mar 08, 2022)
- 先进封装：谁是赢家？谁是输家？ (Mar. 07, 2022)
- CEVA宣布由CEVA赋能的蜂窝物联网芯片交付1 亿颗的里程碑达成 (Mar. 07, 2022)
- OpenFive and EdgeCortix Collaborate on an AI Accelerator Custom SoC (Mar 07, 2022)
- PCIe 5.0 SerDes PHY and Controller IP Cores for all High-End Serial connect Interfaces in advanced SoCs is available for immediate licensing (Mar 07, 2022)
- GUC Monthly Sales Report - February 2022 (Mar 07, 2022)
- ZeroPoint Technologies signs Memory Encryption contract (Mar 07, 2022)
- sureCore appoints Taiwan Dream Services Company to spearhead its growth into the APAC wearables market (Mar 07, 2022)
- Synopsys Extends OptoCompiler Support for New GF Fotonix Platform (Mar 07, 2022)
- Ambient Scientific Announces Beta Release of Software Compilers for its Programmable AI Processor GPX-10 (Mar 07, 2022)
- Flex Logix and the Air Force Research Laboratory Expand their License to Include any Flex Logix Technology for Research and Chip Prototyping in all Available Processes including Radhard (Mar 07, 2022)
- sureCore委託台湾梦想服务公司拓展在亚太地区穿戴式装置的成长 (Mar. 07, 2022)
- GlobalFoundries Announces Next Generation in Silicon Photonics Solutions and Collaborates with Industry Leaders to Advance a New Era of More in the Data Center (Mar 07, 2022)
- 台积电N3E增强版变精简版， 3nm工艺向良率妥协促量产 (Mar. 07, 2022)
- 台积电新一代3nm将提前量产 (Mar. 05, 2022)
- 世界首颗3D芯片诞生！集成600亿晶体管，突破7nm制程极限 (Mar. 04, 2022)
- Silex Insight新推出適用於高性能系統(ASIC/FPGA)的DDR加密器 (Mar. 04, 2022)
- FPGA技术如何优化用于工业4.0及5.0的人工智能？ (Mar. 04, 2022)
- UMC Reports Sales for February 2022 (Mar 04, 2022)
- Credo Expands High Performance Seagull Family With Integrated 50Gbps PAM4 VCSEL and EML Drivers (Mar 04, 2022)
- Arteris Announces Financial Results for the Fourth Quarter and Full Year 2021 and Estimated First Quarter and Full Year 2022 Guidance (Mar 04, 2022)
- Pankaj Mayor Joins Arteris IP as Executive Vice President of Global Sales (Mar 04, 2022)
- Global Semiconductor Sales Increase 26.8% Year-to-Year in January (Mar 04, 2022)
- Pankaj Mayor加入Arteris IP担任全球销售执行副总裁 (Mar. 04, 2022)
- 半導體、封裝、IP供應商、晶圓代工廠和雲端服務提供廠商 攜手合作驅動小晶片生態系的標準化 (Mar. 03, 2022)
- "半导体IP之王"芯原股份：公司将推进 Chiplet 技术产业化 (Mar. 03, 2022)
- 瑞萨电子汽车级半导体被Honda用于其ADAS系统 (Mar. 03, 2022)
- Codasip steps up its focus on Europe and appoints Till-Vattier as EMEA VP (Mar 03, 2022)
- Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem (Mar 03, 2022)
- Microsoft Executive Bobby Yerramilli-Rao Joins GlobalFoundries Board of Directors (Mar 03, 2022)
- oneNav Announces pureL5 GNSS Digital IP Core and Customer Evaluation System - World's First Single Frequency L5 GNSS Receiver (Mar 03, 2022)
- Graphcore Supercharges IPU with Wafer-on-Wafer (Mar 03, 2022)
- Dolphin Design chooses DEFACTO's SoC Compiler 9.0: a turnkey methodology to reduce project costs and increase team efficiency (Mar 03, 2022)
- Cadence Recognized with TSMC OIP Ecosystem Forum Customers' Choice Award for 3D-IC Design (Mar 02, 2022)
- Sondrel explains the 10 steps to model and design a complex SoC (Mar 02, 2022)
- Small Prime Divisors Attack and Countermeasure against the RSA-OTP Algorithm (Mar 02, 2022)
- Khronos Releases Vulkan SC 1.0 Open Standard for Safety-Critical Accelerated Graphics and Compute (Mar 02, 2022)
- Semi Industry Capex Forecast to Jump 24% and Reach Over $190 Billion This Year (Mar 02, 2022)
- USB 3.1 设备和主机控制器 IP 核具有高度可配置的设计，可用于各种先进的 SoC 中的超高速数据传输，可立即获得许可 (Mar. 01, 2022)
- 瑞萨电子推出64位RISC-V CPU内核RZ/Five通用MPU，开创RISC-V技术先河 (Mar. 01, 2022)
- 为 AI 处理器集群供电 (Mar. 01, 2022)
- 英特尔、AMD、台积电、苹果、谷歌等集体 (Mar. 01, 2022)
- VESA Readies DisplayPort UHBR (Ultra-High Bit Rate) Device Certification and Begins Certification of UHBR Cables (Mar 01, 2022)
- Computing-in-Memory Innovator Solves Speech Processing Challenges at the Edge Using Microchip's Analog Embedded SuperFlash Technology (Mar 01, 2022)
- Expedera Announces First Production Shipments of Its Deep Learning Accelerator IP in a Consumer Device (Mar 01, 2022)
- USB 3.1 Device & Host Controller IP Cores with highly configurable design for Superspeed data transfers in all kinds of advanced SoCs is available for immediate licensing (Mar 01, 2022)
- Silex Insight launches DDR encrypter for High-Performing Systems (ASIC/FPGA) (Mar 01, 2022)
- intoPIX and Fraunhofer IIS team with Vectis to offer JPEG XS patent pool license (Mar 01, 2022)
- Arm clears out top management (Mar 01, 2022)
- Renesas Pioneers RISC-V Technology With RZ/Five General-Purpose MPUs Based on 64-Bit RISC-V CPU Core (Mar 01, 2022)
- CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped (Mar 01, 2022)
- Axiomise Celebrates Fourth Anniversary with Executive Appointments, Move to New Office (Mar 01, 2022)
- CAST and Achronix Expand Partnership to Deliver Secure FPGA Solutions (Mar 01, 2022)
- Imperas unifies new RISC-V verification ecosystem with RVVI (Mar 01, 2022)
- Taking a RISC: Expanding Chip Options (Feb 28, 2022)
- Microprocessor Growth Will Slow in 2022 after Cellphone MPU Surge (Feb 28, 2022)
- ZeroPoint Technologies signs Memory Booster contract (Feb 28, 2022)
- The age of end-to-end 5G networks built on Arm is now (Feb 28, 2022)
- Breker Verification Systems Unleashes the SystemUVM Initiative to Empower UVM Engineering (Feb 28, 2022)
- PCI Express VIP from Avery Design Systems Selected by Fungible for Ensuring Compliance, Connectivity in Hyperscale Data Centers (Feb 28, 2022)
- CEVA Streamlines 5G New Radio Modem Design with PentaG2, the Industry's Most Comprehensive 5G Baseband Platform IP for Mobile Broadband and IoT (Feb 28, 2022)
- Renesas Develops Bluetooth Low Energy RF Transceiver Technologies that Simplify Board Design, Reduce Circuit Size and Increase Power Efficiency (Feb 28, 2022)
- OIF Members Demonstrate How Interoperability Accelerates Solutions for Today's and Future Global Networks at OFC 2022 (Feb 28, 2022)
- CEVA Extends Wi-Fi Portfolio with Wi-Fi 6/6E IP for the Access Point Market (Feb 28, 2022)
- U.S. Chops Russia's Access to Integrated Circuits (Feb 28, 2022)
- Imperas announces RISC-V Physical Memory Protection (PMP) Architectural Validation test suite for high quality security applications (Feb 28, 2022)
- Cadence and Dassault Systemes Partner to Transform Electronic Systems Development (Feb 28, 2022)
- 国产风华一号显卡 GPU 技术源自英国 ImgTec IMG BXT (Feb. 27, 2022)
- 【芯调查】RISC-V不愿只做配角 (Feb. 27, 2022)
- 台积电研发负责人谈下一代芯片 (Feb. 26, 2022)
- 英特尔泄露路线图显示 他们正加快研发新的CPU产品线 (Feb. 25, 2022)
- Codasip发布全新RISC-V嵌入式内核支持AI/ML边缘定制 (Feb. 25, 2022)
- Gartner发布2022年汽车行业五大技术趋势 (Feb. 25, 2022)
- 消息称英特尔欧洲晶圆厂已选定德国马格德堡 (Feb. 25, 2022)
- 专访安谋科技执行董事长兼CEO吴雄昂：芯片老将的生态破冰之路 (Feb. 25, 2022)
- Codasip's latest RISC-V embedded cores enable AI/ML edge customization (Feb 25, 2022)
- Andes Technology Is the First RISC-V Vendor to Accomplish ISO 26262 Functional Safety ASIL D Development Process Certification with SGS-TU?V Saar (Feb 24, 2022)
- Weebit delivers significant technical and commercial progress in H1 FY22 (Feb 24, 2022)
- UMC announces new 22nm wafer fab in Singapore (Feb 24, 2022)
- Secure-IC Launches a Unique Cybersecurity Lifecycle Management Platform for Connected Objects (Feb 24, 2022)
- Cadence Reports Fourth Quarter and Fiscal Year 2021 Financial Results (Feb 24, 2022)
- 西门子加入英特尔晶圆代工服务计划 EDA 联盟 (Feb. 22, 2022)
- Faraday Reports 2021 Revenue at NT$8,085 Million, the Second-Best Record (Feb 22, 2022)
- Imec, KU Leuven and PragmatIC Semiconductor demonstrate fastest 8-bit flexible microprocessor for low-power applications (Feb 22, 2022)
- LeapMind announces license agreement for AI accelerator "Efficiera" with Maxell Frontier (Feb 22, 2022)
- Orca Systems Announces World's First Fully Integrated SoC Solution for Direct-to-Satellite IoT Connectivity (Feb 22, 2022)
- Andes Technology Is the First RISC-V Vendor to Accomplish ISO 26262 Functional Safety ASIL D Development Process Certification with SGS-TÜV Saar (Feb 22, 2022)
- Intel open to joining consortium to buy Arm (Feb 22, 2022)
- From the Beginning, Arm IPO Was Plan A (Feb 22, 2022)
- Berkeley Lab Unveils ASIC Chip Failure Bypass System (Feb 22, 2022)
- Veriest expands to Physical Design and opens UK design center (Feb 22, 2022)
- DCD-SEMI introduces secure & comprehensive CAN-ALL solutions for automotive (Feb 22, 2022)
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- Semiconductor Sales To Rise at 7.1% CAGR Through 2026 (Feb 11, 2022)
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- 用於車輛診斷的ISO-14229 UDS協議入門 (Feb. 10, 2022)
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- 12 纳米、16 纳米和 22 纳米制程节点的 USB 3.0/PCIe 3.0/SATA 3.0 Combo PHY IP 具有简单的集成和灵活的定制功能，可立即获得许可实现您的高级 SoC 设计！ (Feb. 07, 2022)
- 熵碼科技和力旺電子針對雲端應用推出新一代硬件信任根IP (Feb. 07, 2022)
- Intrinsic联合Imec开发新型忆阻器，采用CMOS工艺 (Feb. 07, 2022)
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- Looking Back on 2021: Strong Growth Momentum of RISC-V Market (Feb 07, 2022)
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- Codasip appoints Functional Safety VP (Feb 07, 2022)
- US Court of Appeals for Federal Circuit Confirms Finding that Apple Infringes WiLAN Patents (Feb 07, 2022)
- GUC Monthly Sales Report - January 2022 (Feb 07, 2022)
- Siemens joins Intel Foundry Services' EDA Alliance program (Feb 07, 2022)
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- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP in 12nm, 16nm and 22nm process nodes with simple integration and flexible customization is ready for immediate licencing for your advanced SoC design (Feb 07, 2022)
- NSCore, Inc. Introduces its Automotive Grade-1 Qualified Non-Volatile Memory solution to help address the increasing need for Low Cost Semiconductor Chips (Feb 07, 2022)
- Synopsys Joins New Intel Foundry Services Ecosystem Alliance to Propel Development of Next-Generation Semiconductor Designs (Feb 07, 2022)
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- Analog Bits Partners with Intel Foundry Services as IP Alliance Partner (Feb 07, 2022)
- France: EIB lends €7.5 million to Menta to speed up its development (Feb 07, 2022)
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- Rain Neuromorphics Raises $25M Series A to Transform AI Hardware Landscape (Feb 03, 2022)
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- Ceremorphic Exits Stealth Mode; Unveils Technology Plans to Deliver a New Architecture Specifically Designed for Reliable Performance Computing (Jan 26, 2022)
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- Cadence Announces Full DRAM Verification Solution for Automotive, Data Center, and Mobile Applications (Jan 24, 2022)
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- Amcor announces strategic investment in PragmatIC Semiconductor (Jan 20, 2022)
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- HEVC Advance Patent Pool Momentum Grows (Jan 10, 2022)
- 2022 Semiconductor Sales to Grow 11% After Surging 25% in 2021 (Jan 10, 2022)
- Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications (Jan 10, 2022)
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- TSMC December 2021 Revenue Report (Jan 10, 2022)
- eDisplay Port/Display Port v1.4 Tx PHY and Controller IP Cores in 12FFC and 40LP for cutting edge display applications is available for immediate licensing (Jan 10, 2022)
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- CEVA's Bluetooth Dual Mode 5.3 SIG Qualified Platform Offers Improved Security, Less Interference and Better Power Consumption for Wireless Audio (Jan 07, 2022)
- 3nm工艺洽谈之后，Intel与台积电再度合作2nm (Jan. 06, 2022)
- Sondrel通过提前分配BGA芯片封装中的凸点 - 电子创新网 (Jan. 06, 2022)
- CEVA和信骅科技合作在第二代智能摄像头和视频会议系统的Cupola360 SoC 上实现出色的语音体验 (Jan. 06, 2022)
- Lattice FPGAs Power Next Generation Lenovo Edge/AI Experiences (Jan 06, 2022)
- Wi-Fi CERTIFIED 6 Release 2 adds new features for advanced Wi-Fi applications (Jan 06, 2022)
- Analog Compute is Key to The Next Era of AI Innovation (Jan 06, 2022)
- Nestwave and Samea Unveil Ultra-Low-Power Super-Thin, Re-Usable GPS Tracker (Jan 06, 2022)
- SK hynix completes the First Phase of Intel NAND and SSD Business Acquisition (Jan 06, 2022)
- CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture (Jan 06, 2022)
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- UMC Reports Sales for December 2021 (Jan 06, 2022)
- 智能摄像头将迈入64 位处理技术 (Jan. 05, 2022)
- Wi-Fi CERTIFIED 6™版本2为先进Wi-Fi®应用新增多项功能 (Jan. 05, 2022)
- Winner Micro Licenses CEVA's Bluetooth and Wi-Fi IP Platforms for IoT Connectivity SoC (Jan 05, 2022)
- GUC Monthly Sales Report - December 2021 (Jan 05, 2022)
- Dolphin Design, a leader in Edge Computing and AI platforms for the Internet of Things (IoT), is expanding into Asia and opens a processing center in Singapore (Jan 05, 2022)
- Mendix平台助力零售业拥抱低代码 (Jan. 04, 2022)
- Synapse Design, a QuEST Global Company, joins TSMC Design Center Alliance (DCA) (Jan 04, 2022)
- Global Semiconductor Sales Increase 23.5% Year-to-Year in November; Industry Establishes Annual Record for Number of Semiconductors Sold (Jan 04, 2022)
- 台积电成缺芯潮最大赢家 3纳米制程年内进入风险量产 (Jan. 04, 2022)
- Credo Appoints Lip-Bu Tan as Chairman and Bolsters Board with the Addition of Industry Veterans Sylvia Acevedo and Manpreet Khaira (Jan 04, 2022)
- CEVA Bluebud Platform Takes Center Stage for a Differentiated, Premium Wireless Audio Experience in TWS Earbuds, Gaming Headsets, Hearables, Wearables and More (Jan 04, 2022)
- 芯片设计公司将迎来最好时刻！芯片巨头"内卷"建厂，台积电砸重金投资新工艺，三星英特尔不甘示弱 (Jan. 03, 2022)
- 如何在MCU上實現AIoT？ (Jan. 03, 2022)
- ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems (Jan 03, 2022)
- USB 4.0, MIPI DSI/CSI 2.0, Display Port 1.4, HDMI 2.1, DDR5, PCIe5.0, 1G Ethernet IP Cores and many more Wired Interface IP Cores available for immediate licensing (Jan 03, 2022)
- AMD and Xilinx Provide Update Regarding Expected Timing of Acquisition Close (Jan 03, 2022)
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- Axiomise Unveils Intelligent Debug Solution for Formal Verification of RISC-V Cores (Jan 03, 2022)
- 【2021-2022专题】2021年半导体并购案盘点，智路资本或是最大赢家？ (Jan. 02, 2022)
- 三星大战台积电 (Jan. 02, 2022)
- 年终喜讯！「中国创新创业大赛」芯来科技获佳绩 (Dec. 31, 2021)
- 内外因素共同驱使下，2022年半导体行业的机遇和挑战 (Dec. 31, 2021)
- CES 2022实体展参展商名单继续缩水， IBM、松下、宝马与梅赛德斯奔驰宣布退出 (Dec. 31, 2021)
- 日本半导体厚积薄发：欲在十年内量产2nm (Dec. 30, 2021)
- 5G和Wi-Fi 6 CPE開發與展望 (Dec. 29, 2021)
- 台积电、英特尔、三星都进军先进封装，如何超越摩尔定律 (Dec. 28, 2021)
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- 台积电有意计划在台中建2nm芯片工厂 (Dec. 27, 2021)
- GlobalFoundries Announces Extension of AMD Wafer Supply Agreement to Guarantee Supply (Dec 27, 2021)
- Access Advance Welcomes Microsoft as a Licensor and Licensee of the HEVC Advance Patent Pool (Dec 27, 2021)
- Arm CPUs Make Gains in Data Centers (Dec 27, 2021)
- 3nm比5nm提升多少？台积电公布三大关键指标 (Dec. 25, 2021)
- 台积电加紧N3制程节点生产计划， 苹果M3系列将实现全线自研芯片 (Dec. 24, 2021)
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- 台积电自曝2nm晶体管新结构：终于告别FinFET (Dec. 23, 2021)
- DRAM、NAND很快就会被新型存储器取代吗？ (Dec. 23, 2021)
- CEVA 和 Mimi Hearing Technologies合作为真正无线耳机市场推动辅助听力发展 (Dec. 23, 2021)
- 新思科技任命葛群为中国区董事长及总裁 (Dec. 23, 2021)
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- Successful conclusion of European Processor Initiative Phase One (Dec 22, 2021)
- Weebit Nano receives first silicon demonstration wafers integrating its embedded ReRAM module (Dec 22, 2021)
- The European Space Agency (ESA) has awarded a contract to CAES, in the frame of the ARTES Competitiveness & Growth programme, to develop System-on-Chip for space applications (Dec 22, 2021)
- Kneron Announces $25 Million Funding To Advance Smart City Technology For Auto (Dec 22, 2021)
- 台媒：联电再发涨价通知 (Dec. 21, 2021)
- Ultra-Low power GNSS Multi-Constellation Digital IP core available for Battery powered IoT devices and Smart Wearables SoC application (Dec 21, 2021)
- Secure Thingz and Intrinsic ID Partner to Ensure Supply Chains of Trust for the Embedded Industry (Dec 21, 2021)
- Interview with the CEO at Silex Insight - Michel Van Maercke (Dec 21, 2021)
- IBM, Samsung Unveil VTFET to Extend Moore's Law (Dec 21, 2021)
- North American Semiconductor Equipment Industry Posts November 2021 Billings (Dec 21, 2021)
- MIPI M-PHY Update Doubles Peak Data Rate for Next-Generation Flash Memory Storage Applications (Dec 21, 2021)
- 17 Semiconductor Companies Forecast to Have >$10.0 Billion in Sales This Year (Dec 21, 2021)
- SEMIFIVE Acquires Hanatec (Dec 21, 2021)
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- Real Intent Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Static Sign-Off (Dec 21, 2021)
- Synopsys SiliconSmart Library Characterization Solution Achieves Certification for TSMC N5, N4 and N3 Advanced Processes (Dec 21, 2021)
- imec展示200V GaN-on-SOI智慧功率整合電路平台 (Dec. 21, 2021)
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- Imagination Series3NX神经网络加速器助力展锐打造其新一代5G智能手机平台 (Dec. 20, 2021)
- 大厂力挺CXL互联标准，相关产品陆续出现 (Dec. 20, 2021)
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- Imagination's Series3NX neural network accelerator helps UNISOC to create 5G smartphone platform (Dec 20, 2021)
- Creonic GmbH is Heavily Invested in the Expansion and Research of 6G Technologies (Dec 20, 2021)
- Imagination appoints Carol Chesney to board as non-executive director (Dec 20, 2021)
- SiPearl awarded a €17.5M funding from the EIC Accelerator program (Dec 20, 2021)
- PCIe 5.0 & PCIe 4.0 PHYs and Controller IP Cores are available for immediate licensing to maximize your Interface speed for complex SoCs (Dec 20, 2021)
- Hardent VESA DSC IP Cores Licensed by Teledyne LeCroy for DisplayPort Test Solution (Dec 20, 2021)
- Teledatics Introduces World's First Open Wi-Fi "HaLow" Development Platform (Dec 20, 2021)
- 台积电英特尔高管预测3D化将带动芯片性能提升，半导体设备和材料迎新商机 (Dec. 19, 2021)
- IBM和三星新芯片设计大幅降低能耗的原因是什么？垂直堆叠晶体管设计! (Dec. 19, 2021)
- 功能强大的开发平台赋能新型网络技术引入车辆架构 (Dec. 19, 2021)
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- 赛昉科技：昉·惊鸿7110高性能RISC-V视觉处理平台明年Q2量产 (Dec. 18, 2021)
- 三星电子拿下IBM和意法半导体的微控制器订单 (Dec. 17, 2021)
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- Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests (Dec 17, 2021)
- Kandou Closes $75 Million in Series D Funding (Dec 17, 2021)
- Industry's fastest TLS accelerator ready to boost Xilinx Versal platform (Dec 17, 2021)
- 台積公司推出N4X製程 (Dec. 16, 2021)
- 赛昉科技发布并开源基于Yocto的昉·天枢Linux SDK (Dec. 16, 2021)
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- TSMC Introduces N4X Process (Dec 16, 2021)
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- Kandou Delivers USB-C Multiprotocol Retimer Product Family for USB4 Support (Dec 16, 2021)
- Synopsys Initiates $200 Million Accelerated Share Repurchase Agreement (Dec 16, 2021)
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- TSMC Presents 2021 Excellent Performance Award to Outstanding Suppliers (Dec 16, 2021)
- 3Q21 Revenue of Global Top 10 IC Design (Fabless) Companies Reach US$33.7 billion, Four Taiwanese Companies Make List, Says TrendForce (Dec 16, 2021)
- FPGA Development Opens Up (Dec 15, 2021)
- 創意電子採用Cadence數位全流程工具 (Dec. 14, 2021)
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- Semi Capex on Pace for 34% Growth in 2021 to Record $152.0 Billion (Dec 14, 2021)
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- Arasan announces the immediate availability of its ultra-low power MIPI D-PHY IP for the GlobalFoundries 12nm FinFET process node (Dec 13, 2021)
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- sureCore delivers ultra-low power register files with more than 50% less power than off-the-shelf versions (Dec 09, 2021)
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- Soitec 携手美尔森，为电动汽车市场开发多晶碳化硅衬底 (Dec. 08, 2021)
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- 三星：专注于发展逻辑芯片业务，合并移动和消费电子部门 (Dec. 07, 2021)
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- CES 2022: Intrinsic ID Demonstrates Strength and Versatility of PUF Technology for Identification and Security Applications at World's Biggest Tech Show (Dec 07, 2021)
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- GUC Monthly Sales Report - November 2021 (Dec 06, 2021)
- Imperas releases new RISC-V verification product that changes the fabric of processor DV (Dec 06, 2021)
- SDIO Host and Device Controller IP Cores with superfast I/O interlink and support for massive storage capacities is ready for immediate licencing (Dec 06, 2021)
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- Alphawave IP: Acquisition of Precise-ITC and completion of major milestones for China Product Partnership (Dec 02, 2021)
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- Arasan Chip Systems announces Immediate availability of MIPI I3C PHY I/O IP (Dec 01, 2021)
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- AMIQ EDA Joins OpenHW Group and Contributes Linting Capabilities for CORE-V Open-Source RISC-V Cores and Testbenches (Nov 25, 2021)
- 采用4nm工艺，传2023年苹果与台积电制造5G调制解调器芯片 (Nov. 24, 2021)
- Microchip发布新款用于边缘嵌入式视觉设计的新一代开发工具，助力开发人员利用低功耗PolarFire® RISC-V® SoC FPGA进行开发 (Nov. 24, 2021)
- 芯原图像信号处理器IP获得汽车功能安全标准ISO 26262认证 (Nov. 24, 2021)
- VeriSilicon Image Signal Processor IP Achieved ISO 26262 Automotive Functional Safety Certification (Nov 24, 2021)
- 28/40nm晶圆代工产能遍地开花，2022年能否舒缓芯片缺货潮？ (Nov. 23, 2021)
- 行芯通过三星先进工艺认证，正式成为其全球SAFE™ EDA合作伙伴 (Nov. 23, 2021)
- 美国或推动半导体制造业监管改革，创建 (Nov. 23, 2021)
- Grovf Inc. Releases Low Latency RDMA RoCE V2 FPGA IP Core for Smart NICs (Nov 23, 2021)
- CEVA SensPro Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic) (Nov 23, 2021)
- 28/40nm晶圆代工产能遍地开花，2022年能否舒缓芯片缺货潮？ (Nov. 23, 2021)
- 以基於雲端架構的嵌入式開發作業加速IoT發展 (Nov. 22, 2021)
- Samsung and Its Foundry Partners Reveal Solutions for a Strong Design Infrastructure at 3rd SAFE Forum 2021 (Nov 22, 2021)
- DVB-S2X/S2/S/T2/T/C Combo Demodulator/Decoder IP Cores licensed to America's leading TV Semiconductor Company (Nov 22, 2021)
- BrainChip Partners with MegaChips to Develop Next-Generation Edge-Based AI Solutions (Nov 22, 2021)
- Siemens extends support of multiple IC design solutions for Samsung Foundry's latest process technologies (Nov 22, 2021)
- Access Advance Welcomes ZTE as a Licensor and Licensee of the HEVC Advance Patent Pool (Nov 22, 2021)
- Codasip Adopts Imperas for RISC-V Processor Verification (Nov 22, 2021)
- Synopsys Full EDA Flow First to Achieve Samsung Foundry 4LPP Process Certification (Nov 22, 2021)
- sureCore designs special high performance multi-port memory for Semidynamics AI chip (Nov 22, 2021)
- Imperas Models - reference for the newly ratified RISC-V Specifications (Nov 22, 2021)
- DCD-SEMI joins CAN in Automation, a leading CAN manufacturers' group (Nov 22, 2021)
- GlobalFoundries, Ford to Address Auto Chip Supply and Meet Growing Demand (Nov 22, 2021)
- RISC-V Low-Power Embedded Processor IP Core Now Available from CAST (Nov 22, 2021)
- Elmos adopts Arm Cortex-M IP for its next-generation automotive MCU based product family (Nov 22, 2021)
- Announcing superfast, HD Audio & Video through HDMI 2.0 Tx & Rx PHY & Controller IP Cores uncompressed data transfer in 28HPC+ and 12FFC! (Nov 22, 2021)
- Intrinsic ID and Rambus Raise the Bar for Hardware Security with Integration of PUF Technology and Rambus Root of Trust (Nov 22, 2021)
- MediaTek and TSMC Unveil the World's First 7nm 8K Resolution Digital TV System-on-Chip (Nov 22, 2021)
- 以基於雲端架構的嵌入式開發作業加速IoT發展 (Nov. 22, 2021)
- 中芯国际联合首席执行官：两大原因造成全球缺芯 (Nov. 20, 2021)
- 新思科技和台积公司推动芯片创新，开发基于N4P制程技术的最广泛IP核组合 (Nov. 19, 2021)
- Arteris IP推出Harmony Trace Design Data Intelligence 解决方案，助力实现系统级芯片半导体设计自动追溯 (Nov. 19, 2021)
- CXL Consortium Showcases First Public Demonstrations of Compute Express Link Technology at SC21 (Nov 19, 2021)
- RISC-V創新應用百花齊放 中國MCU業者積極佈局 (Nov. 18, 2021)
- Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications (Nov 18, 2021)
- Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library (Nov 18, 2021)
- UK Widens Probe of Nvidia-Arm Deal (Nov 18, 2021)
- Annual Revenue Growth to Skyrocket Among Top 25 (Nov 18, 2021)
- Arteris IP Helps Automate System-on-Chip Semiconductor Design Traceability with Harmony Trace Design Data (Nov 18, 2021)
- 瑞萨电子推出具有超低功耗、低成本的FPGA产品家族, 以满足低密度、大批量的应用需求 (Nov. 17, 2021)
- Synopsys 3DIC Compiler Qualified for Samsung Foundry's Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs (Nov 17, 2021)
- Renesas Enters FPGA Market with the First Ultra-Low-Power, Low-Cost Family Addressing Low-Density, High-Volume Applications (Nov 17, 2021)
- Xilinx Launches Alveo U55C, Its Most Powerful Accelerator Card Ever, Purpose-Built for HPC and Big Data Workloads (Nov 16, 2021)
- Analog Bits to Demonstrates Low Latency PCIe/CXL Gen 5 on Samsung 8nm at SAFE Forum 2021 (Nov 16, 2021)
- Faraday Announces Proven MIPI D-PHY for Samsung Foundry 14LPC Process (Nov 16, 2021)
- Soitec荣获联华电子公司（UMC）"杰出合作伙伴"奖 (Nov. 16, 2021)
- BBright UHD Media Gateway integrates intoPIX JPEG XS technology (Nov 16, 2021)
- 富提亚科技宣布在华虹宏力 180BCD上提供可耐受摄氏150度的嵌入式非易失性存储器(eNVM) (Nov. 15, 2021)
- IAR Systems enables next generation automotive applications with NXP's S32K3 MCU family (Nov 15, 2021)
- eDisplay Port / Display Port v1.4 Tx PHY and Controller IP Cores is available in 40nm ULP and 12nm FFC for your picture perfect UHD, 8K, 4K Display Applications (Nov 15, 2021)
- SMIC Management Shakeup Continues (Nov 15, 2021)
- Lattice Acquires Mirametrix (Nov 15, 2021)
- BrainChip appoints Sean Hehir as New Chief Executive Officer (Nov 15, 2021)
- Floadia Announces eNVM of 150 degree C retention on HHGrace 180BCD (Nov 15, 2021)
- SMIC Reports 2021 Third Quarter Results (Nov 15, 2021)
- 雲端連結沒有你想像的那麼安全！ (Nov. 15, 2021)
- 芯原的神经网络处理器IP获百余款人工智能芯片采用 (Nov. 12, 2021)
- 中芯国际称明年12英寸晶圆产能将增两倍 国家大基金入局88.7亿美元新项目 (Nov. 12, 2021)
- 台积电加速全球扩张的计划将削弱其高毛利优势 (Nov. 12, 2021)
- SK 海力士获得 ISO 26262 汽车半导体芯片安全认证 (Nov. 12, 2021)
- 中芯国际第三季净利同比增逾两成营收创新高 上调今年营收增长目标至约29% (Nov. 12, 2021)
- VeriSilicon's Neural Network Processor IP Embedded in Over 100 AI Chips (Nov 12, 2021)
- Net Insight teams up with intoPIX to develop next-generation JPEG XS compliant solutions (Nov 12, 2021)
- Imagination和Mobica合作创建汽车虚拟化环境 (Nov. 11, 2021)
- 新思科技促进NSITEXE RISC-V并行处理器IP通过严格功能安全认证 (Nov. 11, 2021)
- Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications (Nov 11, 2021)
- Cerebras Systems Raises $250M in Funding for Over $4B Valuation to Advance the Future of Artificial Intelligence Compute (Nov 11, 2021)
- New Lattice sensAI Solution Stack Accelerates Next-Generation Client Devices (Nov 11, 2021)
- After Strong Gains, DRAM Prices Expected To Retreat in 4Q21 (Nov 11, 2021)
- 日本IP公司的RISC-V处理器，被瑞萨车用MCU采用 (Nov. 10, 2021)
- Menta and Secure-IC Partnership Expands to Provide the Most Secure eFPGA IP Available (Nov 10, 2021)
- Introducing JESD204B Controllers and matching PHYs for high-speed, high-resolution device interconnection for high density systems! (Nov 10, 2021)
- TSMC October 2021 Revenue Report (Nov 10, 2021)
- NSITEXE unveils A New Product AI accelerator "ML041", realizes high power efficiency (Nov 10, 2021)
- Weebit undertakes capital raising to support accelerated growth; introduces major Israeli institutional investors onto the register (Nov 10, 2021)
- GF携手新思科技提供首个符合云标准和面向ASIL-D设计的汽车参考流程 (Nov. 09, 2021)
- BrainChip Completes Testing Production Version of the Akida Chip (Nov 09, 2021)
- Nextchip licenses aiMotive's aiWare4 for their Apache6 automotive domain processor (Nov 09, 2021)
- sureCore-led consortium wins £6.5M Innovate UK grant to develop cryogenic CMOS IP to accelerate Quantum Computing scalability (Nov 09, 2021)
- Samsung and Alphawave IP Announce Acceleration of Deep Partnership with Flagship Global Hyperscaler Design Win at 4nm (Nov 09, 2021)
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder (Nov 09, 2021)
- Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead (Nov 09, 2021)
- NSITEXE DR1000C, a RISC-V based parallel processor IP with vector extension (DFP: Data Flow Processor) has been licensed for Renesas' new RH850/U2B Automotive MCUs (Nov 09, 2021)
- Tessolve Joins GlobalFoundries' Design Enablement Network Program as a Design Partner to Bring Advanced Design Solutions to Accelerate Customer Product Development (Nov 09, 2021)
- Embedded FPGA (eFPGA) technology: Past, present, and future (Nov 09, 2021)
- Codasip Expands Ecosystem with XtremeEDA (Nov 09, 2021)
- Imagination and Mobica partner to create virtualized automotive environment (Nov 09, 2021)
- Diakopto's ParagonX Platform Selected by The Six Semi for High-Speed Memory PHYs (Nov 09, 2021)
- CEVA, Inc. Announces Third Quarter 2021 Financial Results (Nov 09, 2021)
- 建構基於RISC-V的MCU「芯」生態 (Nov. 09, 2021)
- Achronix和MoSys携手为5G无线和宽带网络加速提供解决方案 (Nov. 09, 2021)
- Flex Logix Accelerates Growth With New Office In Austin; Prepares For Global Expansion Of Its Edge AI Inference Product Line (Nov 09, 2021)
- Digital Blocks DB9000 TFT LCD and OLED Display Controller & Processor IP Application Leadership Advancements (Nov 09, 2021)
- 台积公司授予新思科技多项"年度OIP合作伙伴"大奖项，肯定双方在半导体创新方面的长期合作 (Nov. 08, 2021)
- Heterogeneous Computing Is About Optimizing Resources (Nov 08, 2021)
- TSMC Recognizes Long-Standing Collaboration with Synopsys on Semiconductor Innovation with Multiple OIP Partner of the Year Awards (Nov 08, 2021)
- Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 40nm ULP is available for immediate licensing for Audio SoC applications. (Nov 08, 2021)
- Corigine Brings Prototyping And Emulation Acceleration To The Desktop With MimicTurbo GT Card (Nov 08, 2021)
- Mythic Adds Two Silicon Valley Veterans to Its Leadership Team (Nov 08, 2021)
- GUC Monthly Sales Report - Oct 2021 (Nov 08, 2021)
- Imagination launches the most advanced ray tracing GPU (Nov 08, 2021)
- IAR Systems enables early technology adoption of the AI-capable Arm Cortex-M55 core (Nov 08, 2021)
- 晶片缺货潮有望2023缓解 台积电/联电扩产计划是关键 (Nov. 05, 2021)
- Sondrel开发性能验证环境以快速创建ASIC (Nov. 05, 2021)
- Dialog半导体公司的DA16200 Wi-Fi SoC获得PSA一级认证 (Nov. 05, 2021)
- 西门子与台积电深化合作，不断攀登设计工具认证高峰 (Nov. 04, 2021)
- 力旺電子攜手聯華電子推出新興非揮發記憶體ReRAM矽智財 (Nov. 04, 2021)
- 开启GPU新时代，Imagination 推出最先进的移动实时光线追踪GPU！手游党有福气了！ (Nov. 04, 2021)
- eMemory and UMC Bring New ReRAM Intellectual Property to Market (Nov 04, 2021)
- UMC Reports Sales for October 2021 (Nov 04, 2021)
- Kneron Edge AI SoC Powered by Andes RISC-V Processor Core D25F (Nov 04, 2021)
- Worldwide Silicon Wafer Shipments Reach Record High in Third Quarter of 2021, SEMI Reports (Nov 04, 2021)
- proteanTecs UCT Supports TSMC 3nm Process Technology to Accelerate Lifecycle Health Monitoring (Nov 03, 2021)
- Sondrel develops Performance Verification Environment to fast-track ASIC creation (Nov 03, 2021)
- Codasip Founder Karel Masarik elected to RISC-V Technical Steering Committee (Nov 03, 2021)
- 台積電推出N4P製程 (Nov. 03, 2021)
- 新思科技PrimeLib统一库表征和验证解决方案获三星5nm、4nm和3nm工艺认证 (Nov. 03, 2021)
- 中移芯昇采用芯来内核推出低功耗大容量RISC-V MCU (Nov. 03, 2021)
- Codasip创始人马克仁（KAREL MASAŘÍK）当选为RISC-V技术指导委员会委员 (Nov. 02, 2021)
- Omni Design Announces Availability of LiDAR Receiver Subsystem (Nov 02, 2021)
- Rambus Reports Third Quarter 2021 Financial Results (Nov 02, 2021)
- IBM and NeuReality team up to build the next generation of AI inference platforms (Nov 02, 2021)
- Morse Micro Unveils Wi-Fi CERTIFIED HaLow Platform and Industry's First 8MHz Reference Design (Nov 02, 2021)
- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP Cores for High Bandwidth, Low Power data communication in PCs, Mobiles, SSDs, and other Multimedia Devices. (Nov 02, 2021)
- eMemory Receives 2021 TSMC OIP Partner of the Year Award for Embedded Memory IP (Nov 02, 2021)
- DDR5 Ecosystem Ramps Up (Nov 02, 2021)
- Wi-Fi CERTIFIED HaLow delivers long range, low power Wi-Fi (Nov 02, 2021)
- Synopsys Acquires AI-Powered, Real-Time Performance Optimization Leader Concertio (Nov 02, 2021)
- GlobalFoundries Announces Closing of Initial Public Offering (Nov 02, 2021)
- Codasip appoints Brett Cline to drive company growth worldwide (Nov 02, 2021)
- Weebit delivers its most successful quarter, achieving key business and technical milestones (Nov 02, 2021)
- 新思科技与台积公司拓展战略技术合作，为下一代高性能计算设计提供3D系统集成解决方案 (Nov. 01, 2021)
- Omni Design宣布推出激光雷达接收器子系统 (Nov. 01, 2021)
- Andes Technology Issues GDR to Be Listed on Luxembourg Stock Exchange for Expansion Plan (Nov 01, 2021)
- Alphawave IP Receives Prestigious 2021 TSMC OIP Partner of the Year Award for High-Speed SERDES IP (Nov 01, 2021)
- M31 Technology Receives 2021 TSMC OIP Partner of the Year Award (Nov 01, 2021)
- CODASIP为其STUDIO处理器设计工具添翼AXI总线自动设计功能 (Oct. 29, 2021)
- 《2021-2022中国人工智能计算力发展评估报告》发布 (Oct. 29, 2021)
- VESA发布嵌入式DisplayPort标准1.5版， 提高运动图像质量且更节能 (Oct. 29, 2021)
- Arteris IP 宣布首次公开募股定价，在互联IP细分市场表现出色 (Oct. 29, 2021)
- Truechip Introduces Silicon IP For Network on Chip (NoC) Focussed For Tilelink RISC-V Chips (Oct 29, 2021)
- proteanTecs Receives 2021 TSMC OIP Partner of the Year Award (Oct 29, 2021)
- Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices (Oct 29, 2021)
- AccelerComm Announces 5G IP with O-RAN Acceleration Abstraction Layer (AAL) Interface (Oct 28, 2021)
- Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs (Oct 28, 2021)
- GlobalFoundries Announces Pricing of Initial Public Offering (Oct 28, 2021)
- Arteris IP Announces Pricing of Initial Public Offering (Oct 28, 2021)
- Samsung to triple foundry capacity (Oct 28, 2021)
- Achronix Demonstrates Speedster7t High-Performance Interfaces (Oct 28, 2021)
- SiPearl: collaboration with Intel to accelerate exascale supercomputing deployment in Europe (Oct 28, 2021)
- Rapid Silicon Announces Seed Funding of $15M (Oct 28, 2021)
- Faraday Reports Third Quarter 2021 Revenues at NT$2,218 Million, Up 31% QoQ (Oct 28, 2021)
- Annual Foundry Revenue Expected to Reach Historical High Once Again in 2022 with 13% YoY Increase with Chip Shortage Showing Sign of Easing (Oct 28, 2021)
- Semiconductor Sector Shows Signs of Cooling (Oct 28, 2021)
- VESA Publishes Embedded DisplayPort Standard Version 1.5 (Oct 28, 2021)
- Europe opens extended investigation into ARM-Nvidia deal (Oct 28, 2021)
- S2C Delivers VU19P FPGA-based Logic Matrix LX2 - a New Benchmark in High-performance & High-density Prototyping (Oct 28, 2021)
- Morris Chang says domestic US chip supply chain is impossible (Oct 28, 2021)
- SiFive has briefly pulled back the curtains on its most powerful Risc-V processor yet. (Oct 28, 2021)
- 台積公司頒發2021年度開放創新平台合作夥伴獎項 (Oct. 27, 2021)
- SiFive推出媲美x86与Cortex-A78的IP核 (Oct. 27, 2021)
- Xilinx and Leading Broadcast and AV System and IP Integrators Deliver Complete, Production-Ready Multimedia Streaming End-Point Solutions (Oct 27, 2021)
- TSMC Details The Benefits of Its N3 Node (Oct 27, 2021)
- Synopsys and TSMC Drive Chip Innovation with Development of Broadest IP Portfolio on TSMC N4P Process (Oct 27, 2021)
- TSMC Recognizes Partners of the Year at 2021 OIP Ecosystem Forum (Oct 27, 2021)
- Achronix and MoSys Partner to Target 5G Wireless and Broadband Networking Acceleration (Oct 27, 2021)
- SD 5.1/eMMC 5.1 Host and Device Controllers with Matching PHYs for all kind of Portable Memory Storage Devices, making it easy to integrate a wide range of Applications in your products (Oct 27, 2021)
- Siemens collaborates with TSMC on design tool certifications for TSMC's advanced technologies and other industry milestones (Oct 27, 2021)
- JEDEC Publishes Update to DDR5 SDRAM Standard Used in High-Performance Computing Applications (Oct 27, 2021)
- 台积电到底会不会"提供"客户的"机密数据"？挖掘背后的真相！ (Oct. 26, 2021)
- Rambus推出最新CXL 2.0控制器，内置业界领先零延迟IDE安全模块 (Oct. 26, 2021)
- Silex Insight offers low-power embedded video solution for manufacturing and automotive (Oct 26, 2021)
- Analog Bits to Present Papers, Demo of N5 Working Silicon, and Roadmap on IPs for TSMC N4 and N3 Processes (Oct 26, 2021)
- MegaChips Deploys Omni Design's Silicon-Validated Data Converters (Oct 26, 2021)
- TSMC Expands Advanced Technology Leadership with N4P Process (Oct 26, 2021)
- Codasip boosts Studio processor design tools with AXI automation (Oct 26, 2021)
- 台積公司推出N4P製程以擴大先進技術領先地位 (Oct. 26, 2021)
- 台積公司推出N4P製程以擴大先進技術領先地位 (Oct. 26, 2021)
- 5G毫米波的「苦」與「甜」 (Oct. 26, 2021)
- QuickLogic Announces First eFPGA IP From Australis IP Generator on UMC 22nm Process (Oct 26, 2021)
- Omni Design发布数据转换器产品，采用台积电16纳米工艺并已通过流片验证 (Oct. 25, 2021)
- 三星携手新思科技加快汽车SoC的ISO 26262合规进程 (Oct. 25, 2021)
- North American Semiconductor Equipment Industry Posts September 2021 Billings (Oct 25, 2021)
- Xiphera expands its AEAD portfolio (Oct 25, 2021)
- IAR Systems extends functional safety offering for RISC-V with leading build tools for Linux (Oct 25, 2021)
- Crypto Quantique partners with Macronix to add ArmorFlash support to its IoT security management platform (Oct 25, 2021)
- videantis processing platform reduces cost, increases flexibility of fail-operational systems (Oct 25, 2021)
- ISDB-S3 Demodulator IP Core is now available for licensing to STB & TV SoC Manufacturers (Oct 25, 2021)
- Vidatronic Joins the Silicon Catalyst Semiconductor Ecosystem as an In-Kind Partner (Oct 22, 2021)
- Arm宣布成立Arm 5G解决方案实验室，以实现端到端5G网络 (Oct. 21, 2021)
- 瑞萨电子宣布开发支持低功耗蓝牙® 5.3的下一代无线MCU (Oct. 21, 2021)
- Cadence 数字和定制/模拟流程获TSMC最新 N3 和 N4 工艺认证 (Oct. 21, 2021)
- Cadence 在TSMC N5 工艺上演示面向 PCI Express 6.0 规范的 IP 测试芯片 设计套件现在可供早期采用者使用 (Oct. 21, 2021)
- 結合軟硬體 全面解決方案消弭IoT開發痛點 (Oct. 21, 2021)
- Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process (Oct 21, 2021)
- Synopsys Digital and Custom Design Platforms Achieve Certification for TSMC N3 Process (Oct 21, 2021)
- Green Hills Software Creates Clear Path for Arm Cortex-A78AE Early Adopters in High-Performance Critical Embedded Systems (Oct 21, 2021)
- Alphawave IP Group plc Q3 Trading Statement (Oct 21, 2021)
- Siemens accelerates IP validation by 1,000X at Arm using ML-powered Solido Variation Designer on AWS Graviton2 (Oct 21, 2021)
- Cadence Digital and Custom/Analog Flows Achieve the Latest TSMC N3 and N4 Certifications (Oct 21, 2021)
- BrainChip Begins Taking Orders of Akida AI Processor Development Kits (Oct 21, 2021)
- Flex Logix Announces Production Availability Of InferX X1 PCIe Boards for Edge AI Systems (Oct 21, 2021)
- Precise-ITC受邀参加2021年度日本电子高科技线上博览会 (Oct. 20, 2021)
- Enyx releases nxFramework version 5.4 for subscribers which includes new ULL IP cores and 40G support (Oct 20, 2021)
- De-RISC, the H2020 project which will create the first RISC-V fully European platform for aerospace, celebrates its second anniversary (Oct 20, 2021)
- NSCore, Inc. introduces its OTP+ solution to address the IoT market need for an Ultra-Low-Power OTP NVM IP Solution in 40nm (Oct 20, 2021)
- TSMC's Japan Expansion Puts Profit at Risk (Oct 20, 2021)
- Precise-ITC to Exhibit at CEATEC 2021 ONLINE (Oct 20, 2021)
- Synopsys Expands Strategic Technology Collaboration with TSMC to Extend 3D-System Integration Solutions for Next-Generation High-Performance Computing Designs (Oct 20, 2021)
- Arteris IP FlexNoC Interconnect Licensed by Eyenix for AI-Enabled Imaging/Digital Camera SoC (Oct 20, 2021)
- The Elements of Traceability (Oct. 19, 2021)
- 中芯国际大规模扩产，今年新增5.5万片晶圆！ (Oct. 19, 2021)
- 阿里开源玄铁RISC-V系列处理器，大幅加速RISC-V软硬件技术 (Oct. 19, 2021)
- 格罗方德半导体公布IPO发行价区间 融资26亿美元估值250亿 (Oct. 19, 2021)
- Enabling end-to-end 5G networks on Arm (Oct 19, 2021)
- eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined latency of sub 10ns (Oct 19, 2021)
- Alibaba Cloud Unveils New Server Chips to Optimize Cloud Computing Services (Oct 19, 2021)
- Cadence Introduces Comprehensive Safety Solution for Faster Certification of Automotive and Industrial Designs (Oct 19, 2021)
- MIPI RFFE (RF Front-End Control Interface) v3.0 Master and Slave Controller IP Cores for ultimate control of your RF Front-end Cellular or Base station SoC's with Low Power Consumption and Reduced Latencies (Oct 19, 2021)
- Arm transforms the economics of IoT with Virtual Hardware and a new solutions-led offering (Oct 19, 2021)
- GlobalFoundries Announces Launch of Initial Public Offering (Oct 19, 2021)
- Omni Design Announces Silicon Validated Data Converters on TSMC 16nm Process (Oct 19, 2021)
- 【最後報名】Arm DevSummit 2021-科技業開發者與設計人員不可錯過的全球論壇，10月19日上線！ (Oct. 18, 2021)
- PragmatIC Semiconductor Secures $80 Million Funding (Oct 18, 2021)
- Defacto enables ETRI to Automate IP Integration and Build Complex AI Chips (Oct 18, 2021)
- Global Silicon Wafer Shipments Projected to Log Robust Growth Through 2024, SEMI Reports (Oct 18, 2021)
- Imperas Models for Arm Processors now available in TESSY by Razorcat (Oct 18, 2021)
- 台積電證實計畫在日本設廠 但聚焦22nm、28nm成熟製程技術代工 (Oct. 16, 2021)
- Semiconductor Industry Veteran Doug Ridge Has Joined CAST, Inc. (Oct. 15, 2021)
- 台積電宣布3奈米製程2021年試產 2022下半年量產 (Oct. 14, 2021)
- Rambus发布第二代RCD芯片， 面向下一代服务器使用的DDR5-5600 (Oct. 14, 2021)
- 芯来助力飞思灵打造轩辕"芯" (Oct. 14, 2021)
- 為什麼您應該在下一代SoC中選擇Imagination的IP？ (Oct. 14, 2021)
- intoPIX delivers new JPEG XS 4K60 HDMI evaluation design on Intel Cyclone 10 GX Development Platform (Oct. 14, 2021)
- New Siemens Aprisa IC place-and-route software version targets faster time-to-market with performance improvements (Oct 14, 2021)
- Rambus Announces Departure of Chief Financial Officer (Oct. 14, 2021)
- Samsung Foundry Promises Gate All-Around in '22 (Oct. 14, 2021)
- Samsung Foundry Promises Gate All-Around in '22 (Oct 14, 2021)
- SmartDV Announces Reusable Plug-and-Play Validation Solution to Test Prototype Silicon (Oct 14, 2021)
- TechInsights Acquires The Linley Group to Further Expand Its Platform of Semiconductor Content (Oct 14, 2021)
- TSMC Reports Third Quarter EPS of NT$6.03 (Oct 14, 2021)
- CrossBar Announces New ReRAM Use for FTP and OTP Memory Applications (Oct. 14, 2021)
- Electronic System Design Industry Logs Double-Digit Q2 2021 Year-Over-Year Revenue Growth, ESD Alliance Reports (Oct 14, 2021)
- IC Industry at Heart of Possible China Takeover of Taiwan (Oct. 14, 2021)
- Gartner：将在未来两年对数字商务产生重大影响的四项技术 (Oct. 13, 2021)
- 新思科技推出面向低功耗嵌入式SoC的全新ARC DSP IP解决方案，提升处理器IP核领导地位 (Oct. 13, 2021)
- 產業分析》匯豐：晶圓代工價明年續漲 上調台積電聯電目標價 (Oct. 13, 2021)
- Europe to extend investigation of Nvidia-ARM deal (Oct. 13, 2021)
- GlobalFoundries' IPO will not soothe semiconductor shortage, says GlobalData (Oct. 13, 2021)
- Rambus Advances Server Memory Performance with the Industry's First 5600 MT/s DDR5 Registering Clock Driver (Oct. 13, 2021)
- RISC-V player announces expansion of US operation (Oct. 13, 2021)
- Wi-Fi 802.11 ax + Bluetooth LE v5.3 + 15.4 2.4GHz RF Transceiver IP Core in 22nm ULL, available for immediate licensing for IoT applications. (Oct. 13, 2021)
- Agile Analog Names In-Q-Tel as Newest Investor, Demonstrating Endorsement in Company's disruptive analog IP offering (Oct. 13, 2021)
- Alphawave IP announces production availability of new PCIe-CXL solution on TSMC N5 process for storage and broader chiplet market (Oct. 13, 2021)
- 日媒：台积电与新力正式合作在熊本建厂 日相喜称有助经济安全 (Oct. 12, 2021)
- 新思科技助力Achronix新一代应用于数据和人工智能加速的FPGA首次通过硅验证 (Oct. 12, 2021)
- Silex Insight announces record-breaking speed for their ChaCha20-Poly1305 solution - 800Gbps (ASIC) / 100Gbps (FPGA) (Oct. 12, 2021)
- China's 14th Five Year Plan and what it means for data centers (Oct. 12, 2021)
- France in €6bn boost for semiconductors (Oct. 12, 2021)
- Just how impactful will TSMC and Sony's semiconductor factory be? (Oct. 12, 2021)
- MosChip Announces Multi-Protocol Long Range 8G SerDes PHY in 28nm (Oct. 12, 2021)
- Samsung Starts Mass Production of Most Advanced 14nm EUV DDR5 DRAM (Oct. 12, 2021)
- CEVA、博通集成和 VisiSonics 发布3D 空间音频参考设计 (Oct. 12, 2021)
- RISC-V 基础指令集将扩展，类似DSP (Oct. 11, 2021)
- 10/100/1000 Gigabit Ethernet PHY IP Cores including MAC Controller is available for immediate licensing for your advanced SOC to drive Data faster and farther (Oct 11, 2021)
- Andes Technology USA Corp. Announces Major Expansion of Its U.S. Operation (Oct. 11, 2021)
- CFX announces commercial availability of anti-fuse OTP technology on 40nm Logic process (Oct. 11, 2021)
- MIPI Alliance Completes Development of A-PHY v1.1, Doubling Maximum Data Rate and Adding New Options to Automotive SerDes Interface (Oct. 11, 2021)
- Softbank Leads $50M Series C Funding for Cornami to Bring Real-Time Fully Homomorphic Encryption (FHE) to Market (Oct. 11, 2021)
- What's driving the acquisitions in the analog design realm? (Oct 11, 2021)
- Thalia's IP reuse platform joins Cadence Connections EDA Program (Oct 11, 2021)
- 三星3nm GAA工艺2022年上半年量产，2nm将于2025年量产 (Oct. 09, 2021)
- 索尼将与台积电在日本打造价值70亿美元的半导体工厂 (Oct. 09, 2021)
- 台积电第三季度营收4147亿台币 创历史新高 (Oct. 09, 2021)
- Synopsys ARC处理器家族新增成员，面向更轻型的嵌入式应用 (Oct. 09, 2021)
- Synopsys推出业界首个完整HBM3 IP和验证解决方案，加速多芯片设计 (Oct. 09, 2021)
- intoPIX releases RTP Packetization IP-cores for JPEG XS Video Encapsulation over SMPTE 2110-22 (Oct. 08, 2021)
- TSMC September 2021 Revenue Report (Oct 08, 2021)
- Cadence发布突破性新产品 Integrity 3D-IC平台，加速系统创新 (Oct. 08, 2021)
- 瑞萨电子宣布将全面支持面向未来汽车级MCU和SoC的ISO/SAE 21434标准 (Oct. 08, 2021)
- IoE：機會與挑戰共存的超連接新時代 (Oct. 08, 2021)
- Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform (Oct. 07, 2021)
- Green Hills Software Expands INTEGRITY Support to Include RISC-V Architecture (Oct. 07, 2021)
- Intel backs RISC-V for Nios FPGA processor (Oct. 07, 2021)
- Interlaken IP Core for high-speed chip-to-chip applications is now available (Oct. 07, 2021)
- Samsung Foundry Innovations Power the Future of Big Data, AI/ML and Smart, Connected Devices (Oct. 07, 2021)
- Synopsys Accelerates Multi-Die Designs with Industry's First Complete HBM3 IP and Verification Solutions (Oct. 07, 2021)
- Addressing the growing threat of firmware attacks on enterprise edge computing platforms (Oct. 06, 2021)
- How a Global Foundry Is Losing Money in a Chip Boom (Oct. 06, 2021)
- Invia partners with Running Springs Technology (Oct. 06, 2021)
- Logic Fruit handed over ARINC818 based Single Board Computer to Hon'able RM at DRDO Directors' Conclave (Oct 06, 2021)
- Marvell Completes Acquisition of Innovium (Oct. 06, 2021)
- Marvell Extends Data Infrastructure Leadership with TSMC 3nm Platform (Oct. 06, 2021)
- NeuroBlade Raises $83 Million in Series B Funding to Massively Accelerate Data Analytics (Oct 06, 2021)
- OPENEDGES and The Six Semi Announce Silicon Proven LPDDR5/4/4x PHY in Samsung Foundry 14LPP Technology Operating at 6400Mbps (Oct. 06, 2021)
- Rambus Delivers CXL 2.0 Controller with Industry-leading Zero-Latency IDE (Oct. 06, 2021)
- UMC Reports Sales for September 2021 (Oct 06, 2021)
- EdgeCortix Acquires Multiple Patents for Dynamic Neural Accelerator AI Processor Technology (Oct 05, 2021)
- Global Semiconductor Sales Increase 29.7% Year-to-Year, 3.3% Month-to-Month in August (Oct. 05, 2021)
- GlobalFoundries Files Registration Statement for Proposed Initial Public Offering (Oct. 05, 2021)
- intoPIX and Lattice to Showcase Latest FPGA-based Lossless Compression Solutions at Vision 2021 (Oct 05, 2021)
- LeapMind Announces the Beta Release of their Ultra-low Power Consumption AI Inference Accelerator IP (Oct. 05, 2021)
- Next generation intelligent wearables enabled by sureCore's ultra-low power memory (Oct. 05, 2021)
- Codasip Announces UK Hiring for RISC-V Development (Oct. 05, 2021)
- EdgeCortix Acquires Multiple Patents for Dynamic Neural Accelerator AI Processor Technology (Oct. 05, 2021)
- Global Semiconductor Sales Increase 29.7% Year-to-Year, 3.3% Month-to-Month in August (Oct. 05, 2021)
- GlobalFoundries Files Registration Statement for Proposed Initial Public Offering (Oct. 05, 2021)
- GUC Monthly Sales Report - September 2021 (Oct 05, 2021)
- Thalia announces new CEO and board structure to support continued growth (Oct. 05, 2021)
- 消息称半导体芯片产业链Q4 持续涨价，台积电、联电涨幅10%起跳 (Oct. 04, 2021)
- Alphacore Inc.: We're partners in the GF FDX Network (Oct. 04, 2021)
- Arteris IP Announces Filing of Registration Statement for Proposal Initial Public Offering (Oct. 04, 2021)
- Sondrel India staff numbers to double to handle new business (Oct. 04, 2021)
- Weebit demonstrates successful scaling of its ReRAM technology to 28nm (Oct 04, 2021)
- 台积电创先进制程产学合作新模式 首颗16纳米芯片流片 (Oct. 03, 2021)
- 瑞萨电子推出超高性能入门级MCU产品 (Oct. 01, 2021)
- Arasan announces its Total MIPI Soundwire IP Solution with the launch of its Soundwire PHY IP (Oct. 01, 2021)
- QuickLogic Announces Strategic Investment by Current Shareholders; Enhances Outlook for the Third Quarter (Oct. 01, 2021)
- WiLAN Signs Wireless License with Motorola (Oct 01, 2021)
- 半导体行业和ISO 26262 (Sept. 30, 2021)
- A Feasible Alternative to FDSOI and FinFET: Optimization of W/La2O3/Si Planar PMOS with 14 nm Gate-Length (Sept. 30, 2021)
- CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds (Sept. 30, 2021)
- Comparison of One and Two Stage RF Rectifiers Designed in FDSOI 28 nm and BiCMOS 55 nm (Sept. 30, 2021)
- FortifyIQ Revolutionizes Hardware Security Analysis with Pre-silicon Security Verification (Sept. 30, 2021)
- GBT is Developing an EDA Technology For Automatic Generation of Integrated Circuits Layout IPs (Sep 30, 2021)
- Moore's Law Could Ride EUV for 10 More Years (Sep 30, 2021)
- 赛昉科技受邀参加世界互联网大会，驱动RISC-V在数字技术的创新及发展 (Sept. 30, 2021)
- 芯原于2021科创领军者峰会上斩获两项大奖 (Sept. 30, 2021)
- Chip M&A Deals Reach $22 Billion in First Eight Months of 2021 (Sep 29, 2021)
- Arteris IP Announces 4D LiDAR Pioneer Aeva as its 200th Customer (Sep 29, 2021)
- Fraunhofer IPMS presents a scalable TSN multiport switch at the TSN/A conference (Sept. 29, 2021)
- SoC-e Announces 10G Multiport TSN Switch Release (Sep 29, 2021)
- Arm DevSummit 2021报名开启，相聚云端共话前沿技术 (Sept. 29, 2021)
- 2021新思科技开发者大会：揽数字芯光，话未来芯愿 (Sept. 29, 2021)
- Faraday Announces the Success of Its ARM-based SoCs in Wide Ranging Applications (Sep 28, 2021)
- intoPIX extends its range of TICO-RAW IP-cores with smaller architectures supporting a wider range of image sensors and cameras (Sep 28, 2021)
- 智原的ARM核心SoC深受肯定 涵蓋應用領域廣泛 (Sept. 28, 2021)
- Intrinsic ID Announces NIST-Certified Software Random Number Generator (Zign RNG) for IoT Devices (Sep 28, 2021)
- Tiempo Secure in collaboration with CEA makes the Internet of Things more resilient with French Government support (Sep 28, 2021)
- Bluespec, Inc. Releases Ultra-Low Footprint RISC-V Processor Family for Xilinx FPGAs, Offers Free Quick-Start Evaluation. (Sep 28, 2021)
- Siemens introduces mPower power integrity solution for analog, digital and mixed-signal IC designs (Sep 28, 2021)
- 從雲到端 國際大廠陸續布局 RISC-V 10月重磅登場 (Sept. 28, 2021)
- Imagination和腾讯WeTest开展深度合作，助力开发者获取GPU关键报告 (Sept. 27, 2021)
- Building a foundation for our digital future: Say hello to Xcelerator as a Service (Sep 27, 2021)
- Synopsys Achieves AIM Photonics Certification (Sep 27, 2021)
- Imagination and Tencent WeTest carry out in-depth cooperation to help developers obtain key report on GPU (Sep 27, 2021)
- Mercury Systems to acquire Avalex Technologies Corporation (Sep 27, 2021)
- Spin-Orbit-Torque Tackles MRAM Constraints (Sep 27, 2021)
- Intel Breaks Ground on Two New Leading-Edge Chip Factories in Arizona (Sep 27, 2021)
- 2025年超越台积电！英特尔两座新晶圆厂动土 (Sept. 25, 2021)
- Daejin semiconductor, takes over the distribution of Dolphin Design in Korea (Sep 24, 2021)
- RISC-V再添欧洲阵营：自主芯片EPAC1.0 22nm工艺首发 (Sept. 24, 2021)
- RISC-V双周报 9.10-9.24 (Sept. 24, 2021)
- 精测电子：出货给中芯国际的测试设备装机完毕，正在调试验证 (Sept. 24, 2021)
- 9/24盤前》台積衝先進封裝 7檔獲關注 (Sept. 24, 2021)
- 三星与特斯拉洽谈代工下一代自动驾驶芯片 (Sept. 24, 2021)
- Gartner发布推动近期人工智能创新的四项趋势 (Sept. 24, 2021)
- 行业领先企业联发科技（MediaTek）、爱德万（Advantest）以及保时捷汽车控股公司投资proteanTecs (Sept. 24, 2021)
- Lattice mVision Solution Stack Enables 4K Video Processing at Low Power for Embedded Vision Applications (Sep 23, 2021)
- Cadence Accelerates Development of Mobile, Automotive and Hyperscale Systems with the Helium Virtual and Hybrid Studio (Sep 23, 2021)
- Movellus launches global distribution partners to accelerate adoption of its Intelligent Clock Network IP (Sept. 23, 2021)
- Rambus and Kioxia Renew Patent License Agreement (Sep 23, 2021)
- Foundry Market Tracking Toward Record-tying 23% Growth in 2021 (Sep 23, 2021)
- NEWRACOM Introduces First Wi-Fi HaLow Sensor Solution (Sep 23, 2021)
- Xilinx and NEC Accelerate Next-Generation 5G Radio Units for Global Deployment (Sep 23, 2021)
- Allegro DVT and Beamr Announce the World's First Content-Adaptive Silicon IP Video Encoder (Sep 23, 2021)
- Syntiant Unveils NDP200 Neural Decision Processor for Always-On Vision Edge AI Applications (Sep 23, 2021)
- Strategic Investment in proteanTecs from Industry Leaders MediaTek and Advantest Joined by Porsche Automobil Holding SE to Advance Electronics Health Monitoring (Sep 23, 2021)
- Xiphera expands its Advanced Encryption Standard portfolio (Sep 23, 2021)
- Allegro DVT和Beamr宣布推出全球首个内容自适应硅IP视频编码器 (Sept. 23, 2021)
- Cadence发布Helium Virtual和Hybrid Studio 平台，加速移动、汽车及超大规模系统开发 (Sept. 23, 2021)
- EPI EPAC1.0 RISC-V Test Chip Samples Delivered (Sep 22, 2021)
- Alphawave IP: Interim results for the 6 months to 30 June 2021 (Sep 22, 2021)
- Samsung Foundry Certifies Synopsys PrimeLib Unified Library Characterization and Validation Solution at 5nm, 4nm and 3nm Process Nodes (Sep 22, 2021)
- 100G MAC and 100G PCS IP Cores for high performance applications are now available (Sep 21, 2021)
- Update to Royalty-Free MIPI I3C Basic Utility and Control Bus Specification Boosts Speed and Flexibility (Sep 21, 2021)
- DCD-SEMI introduces octa SPI IP Core for smart wear, audio and mobile (Sep 21, 2021)
- Codasip Opens UK Design Center led by Simon Bewick (Sep 21, 2021)
- 瑞萨电子加速面向ADAS和自动驾驶应用的深度学习开发 (Sept. 21, 2021)
- AI Processor Chipmaker Deep Vision Raises $35 Million in Series B Funding (Sep 20, 2021)
- Revenue of Top 10 IC Design (Fabless) Companies Reaches US$29.8 Billion for 2Q21, Though Growth May Potentially Slow in 2H21, Says TrendForce (Sep 20, 2021)
- SkyWater Technology Joins CHIPS Alliance to Further Efforts to Make Chip Design and Production More Accessible (Sep 20, 2021)
- Synopsys Advances Processor IP Leadership with New ARC DSP IP Solutions for Low-Power Embedded SoCs (Sep 20, 2021)
- Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports (Sep 20, 2021)
- 中国芯片企业和苹果都无法接受台积电涨价，三星或因此受益 (Sept. 19, 2021)
- 中国占6G专利申请量40.3％，高居榜首 (Sept. 18, 2021)
- 台积电5nm、7nm订单被砍？ (Sept. 18, 2021)
- Xiphera launches solutions for encrypted data storage (Sep 17, 2021)
- 欧盟计划投资1770亿美元支持区块链、5G等新型技术 (Sept. 17, 2021)
- GF and Synopsys Deliver New Reference Flows for GF 22FDX Process: Cloud-Qualified and First Automotive Flow for ASIL-D Designs (Sep 16, 2021)
- GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products (Sep 16, 2021)
- GlobalFoundries Unveils Innovative Solutions that Deliver a New Era of More in Semiconductor Manufacturing (Sep 16, 2021)
- intoPIX Releases a New Range of Compact Encoders and Decoders for JPEG XS (Sep 16, 2021)
- 格芯推出创新解决方案，为半导体制造业开创更加广阔的新纪元 (Sept. 16, 2021)
- 格芯与高通签署先进5G射频前端产品交付协议 (Sept. 16, 2021)
- Ken Potts joins the Alphacore team as Chief Operating Officer (Sep 16, 2021)
- Elissa Murphy Joins GlobalFoundries Board (Sep 16, 2021)
- New Arm technologies to transform the software-defined future for the automotive industry (Sep 16, 2021)
- Visit Alphacore Interactive Virtual booth at the 2021 GlobalFoundries Technology Summit (GTS) Virtual Conference beginning Sept. 15, 2021 (Sep 16, 2021)
- MoSys and Peraso Technologies Announce Definitive Agreement for Business Combination (Sep 16, 2021)
- 格芯推出创新解决方案，为半导体制造业开创更加广阔的新纪元 (Sept. 16, 2021)
- 报告 | 激光雷达与汽车照明正在融合，看看专业人士怎么说？ (Sept. 15, 2021)
- Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions (Sep 15, 2021)
- Siemens' Aprisa place-and-route solution now certified for GlobalFoundries' 22FDX platform (Sep 15, 2021)
- Movellus Hires Semiconductor Industry Veteran Matthew Raggett as VP of Growth (Sep 15, 2021)
- Dutch AI Semiconductor Startup Axelera AI Launches With $12 Million Seed Round (Sep 15, 2021)
- RISC-V正向HPC市场急速拓展 (Sept. 15, 2021)
- 瑞萨电子携手豪威科技提供汽车摄像头系统集成参考设计 (Sept. 15, 2021)
- RISC-V正向HPC市场急速拓展 (Sept. 15, 2021)
- Synopsys Accelerates Most Stringent Functional Safety Certification of NSITEXE RISC-V Parallel Processor IP (Sep 14, 2021)
- Synopsys Appoints Sassine Ghazi as President and Chief Operating Officer; Chi-Foon Chan to Transition from co-CEO Role (Sep 14, 2021)
- SmartDV Provides Broad Portfolio of Memory Modeling, Design and Verification Solutions (Sep 14, 2021)
- Analog Circuit Works Adopts Diakopto's ParagonX Platform for High-Performance Analog Circuit IP (Sep 14, 2021)
- Mixel Announces Immediate Availability of MIPI C-PHY/D-PHY Combo IP on TSMC N5 Process (Sep 14, 2021)
- RISC-V将撼动86亿美元的半导体IP市场 (Sept. 14, 2021)
- Security that Builds Value: Managed NAND as a Foundation for IoT Security (Sept. 14, 2021)
- Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform (Sep 13, 2021)
- MIPI UFS v3.1 Ctrl., MIPI UniPro v1.8 Ctrl. & MIPI M-PHY v4.1 IP Cores in 12nm & 28nm available for immediate licensing for high performance serial interface applications (Sep 13, 2021)
- 3Q21 Earnings Outlooks Bode Well for Most Leading Semi Suppliers (Sep 13, 2021)
- Imagination looking at IPO or sale (Sep 13, 2021)
- Synopsys PrimeSim Reliability Analysis Solution Accelerates Design of Hyper-Convergent ICs for Mission-Critical Applications (Sep 13, 2021)
- Omdia：RISC-V架构变得越来越受欢迎 (Sept. 10, 2021)
- 对话睿思芯科创始人谭章熹：RISC-V有望全面替代ARM，预计到2024年行业大爆发 (Sept. 10, 2021)
- TSMC August 2021 Revenue Report (Sep 10, 2021)
- Attopsemi's I-fuse OTP IP Embedded into NJR's Products (Sep 09, 2021)
- System Level Solutions's eUSB 3.1 Gen2 Device Controller (eUSB31SF) IP core now available with Isochronous transfer support (Sep 09, 2021)
- Weebit and SkyWater Announce Agreement to take ReRAM Technology to Volume Production (Sep 09, 2021)
- 力旺電子安全強化型OTP矽智財於台積電N6製程完成可靠度驗證 (Sept. 09, 2021)
- Agile Analog 和 Silex Insight 达成战略合作，提供模拟和数字 IP 组合解决方案，为芯片制造商提供高级安全性和对侧信道攻击 (SCA) 的保护 (Sept. 09, 2021)
- Aviva Technology Holding Raises $26.5M Series A Financing to Accelerate Automotive Connectivity (Sep 09, 2021)
- Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon (Sep 09, 2021)
- eMemory's Security-Enhanced OTP IP Qualified on TSMC N6 Process (Sep 09, 2021)
- Codasip Strengthens Senior Leadership Team (Sep 09, 2021)
- Efinix Announces AEC-Q100 Qualification and Automotive Product Line Initiative (Sep 09, 2021)
- Intel to invest $95bn in Europe over 10 years, says CEO (Sep 09, 2021)
- Credo 有源电缆（AEC）产品家族再添新成员：第二代HiWire™ SPAN AEC (Sept. 08, 2021)
- Andes Technology Corp. Brings Its Broad Family of RISC-V CPU IP to the Silicon Catalyst Semiconductor Incubator (Sep 08, 2021)
- Flex Logix to speak at the 2021 AI Hardware Summit on Optimizing AI Inference Performance (Sep 08, 2021)
- ZeroPoint Technologies raises EUR 2.5 million in seed funding (Sep 08, 2021)
- QuickLogic Announces Australis eFPGA IP Generator (Sep 08, 2021)
- 英特尔将投资高达 950 亿美元在欧洲建立新工厂 (Sept. 08, 2021)
- 瑞萨电子扩展"云实验室"，重塑远程设计 (Sept. 07, 2021)
- Second Quarter 2021 Global Semiconductor Equipment Billings Surge 48% Year-Over-Year to Record High of $24 Billion, SEMI Reports (Sep 07, 2021)
- Global Semiconductor Sales in July Up 29.0% Year-to-Year, 2.1% Month-to-Month (Sep 07, 2021)
- Agile Analog and Silex Insight form partnership to offer combined analog and digital IP solutions to provide advanced security and protection against side-channel attacks (SCA) for chip manufacturers (Sep 07, 2021)
- Omni Design and LeddarTech Collaborate to Accelerate Mass Market Deployment of LiDAR for ADAS and Autonomous Vehicles (Sep 07, 2021)
- Sondrel's IP platform provides powerful computing at the Edge with integrated Arm security subsystem (Sep 07, 2021)
- Semiconductors: a strategic industry ripe for UK leadership (Sep 07, 2021)
- Arteris IP FlexNoC Interconnect Licensed for Use in SK Telecom SAPEON AI Chips (Sep 07, 2021)
- Omni Design Opens Design Center in Fort Collins, Colorado (Sep 07, 2021)
- VisualSim Cloud brings popular System-Level Modeling Solution to the Browser (Sep 07, 2021)
- UMC Reports Sales for August 2021 (Sep 06, 2021)
- GUC Monthly Sales Report - Aug 2021 (Sep 06, 2021)
- 中芯国际一日内公告两件大事：12英寸扩产，公司换帅 (Sept. 06, 2021)
- Quantum-driven semiconductor IP for IoT security verified as PSA Certified Level 2 Ready (Sep 06, 2021)
- Achronix和Signoff半导体携手为人工智能/机器学习应用提供FPGA和eFPGA IP设计服务 (Sept. 03, 2021)
- Synopsys Completes the Acquisition of the Semiconductor and Flat Panel Display Solutions from BISTel (Sep 03, 2021)
- Silvaco Announces Resignation of CEO (Sep 03, 2021)
- MIPI D-PHY v3.0 Doubles Data Rate of Physical Layer Interface While Extending Power Efficiency (Sep 03, 2021)
- VESA Introduces New DisplayHDR True Black 600 Performance Tier Targeting Higher Luminance HDR Levels for OLED and other Emissive Display Technologies (Sep 03, 2021)
- Uhnder雷達採用proteanTecs通用晶片遙測技術 (Sept. 03, 2021)
- 中芯国际573亿上海建12寸晶圆厂 (Sept. 03, 2021)
- 为什么说 RISC-V 是 40 年来人类计算路线的最大变量？ (Sept. 03, 2021)
- 三星在深圳举办第三届未来技术论坛 (Sept. 02, 2021)
- 戴伟立投资了一家做RISC-V服务器芯片的公司 (Sept. 02, 2021)
- 功耗最低晶粒對晶粒全方位方案登場 (Sept. 02, 2021)
- SEMI Anti-Piracy Server Certification Protocol for Software License Management Reaches Key Milestone (Sep 02, 2021)
- Ventana Micro Systems Inc., the RISC-V Performance Leader, Raises $38 Million in Series B Funding (Sep 02, 2021)
- AccelerComm announces 5G O-RAN standards-compliant base station accelerator based on Silicom's N5010 platform (Sep 02, 2021)
- BSC executes, for the first time, big encrypted neural networks using Intel Optane Persistent Memory and Intel Xeon Scalable Processors (Sep 02, 2021)
- Emerging Memories Look to Displace NOR, SRAM (Sep 02, 2021)
- QuickLogic Announces New eFPGA Contract (Sep 02, 2021)
- TSMC hikes prices (Sep 02, 2021)
- 台积电之后，三星也宣布芯片代工服务涨价20% (Sept. 02, 2021)
- sureCore announces development of cryo-CMOS IP that will unlock Quantum Computing's potential (Sep 01, 2021)
- Weebit Nano broadens its technology portfolio to further bolster its ReRAM capability and expand commercialisation opportunities (Sep 01, 2021)
- Achronix and Signoff Semiconductors Partner for AI/ML FPGA and eFPGA IP Design Services (Sep 01, 2021)
- Xilinx and Motovis Introduce Complete Hardware and Software Solution to Further Automotive Forward Camera Innovation (Sep 01, 2021)
- Reports: ARM China makes independent move in autonomous driving (Sep 01, 2021)
- Tachyum Boots Linux on Prodigy FPGA (Sep 01, 2021)
- 創意電子發佈業界頻寬最大、功耗最低的晶粒對晶粒 (GLink 2.0) 全方位解決方案 (Aug. 31, 2021)
- 瑞萨电子推出35款以上 包含Dialog产品的成功产品组合 (Aug. 31, 2021)
- Synaptics to Acquire DSP Group, Expanding Leadership in Low Power AI Technology (Aug 31, 2021)
- Renesas Completes Acquisition of Dialog Semiconductor (Aug 31, 2021)
- Rambus Demonstrates Industry-first PCIe 5.0 Digital Controller IP for FPGAs (Aug 31, 2021)
- GUC Announces Industry Highest Bandwidth and Power Efficient Die-to-Die (GLink 2.0) Total Solution (Aug 31, 2021)
- Foundry Revenue for 2Q21 Reaches Historical High Once Again with 6% QoQ Growth Thanks to Increased ASP and Persistent Demand, Says TrendForce (Aug 31, 2021)
- Haawking licenses SEGGER's emRun for RISC-V (Aug 31, 2021)
- Microprocessor Sales Will Continue Double-Digit Growth in 2021 (Aug 30, 2021)
- 芯和半导体联合新思科技业界首发"3DIC先进封装设计分析全流程"EDA平台 (Aug. 30, 2021)
- 一家不容小觑的RISC-V 初创公司，团队来自苹果、谷歌等 (Aug. 30, 2021)
- 对不起，自动驾驶做不到零事故 (Aug. 28, 2021)
- 中国中芯国际上半年净利同比增2.8倍 被美列入"实体清单"带来不确定风险 (Aug. 28, 2021)
- 韩国第二大晶圆代工厂东部高科可能被出售？ (Aug. 28, 2021)
- JEDEC发布XFM嵌入式与可移动存储设备标准 (Aug. 27, 2021)
- 新思科技举办"联合创新数字未来"研讨会，聚力创芯，共抵数字未来 (Aug. 27, 2021)
- 突发！欧盟将对英伟达收购ARM案展开正式调查 (Aug. 27, 2021)
- Can AI Design a Better Chip Than a Human? (Aug 27, 2021)
- Xenergic joins GlobalFoundries FDX Network (Aug 27, 2021)
- 中国已成为6G专利申请主要来源国 (Aug. 27, 2021)
- 三星集团宣布2050亿美元投资计划 (Aug. 26, 2021)
- Imagination宣布入局RISC-V，重返CPU市场 (Aug. 26, 2021)
- Lattice Certus-NX FPGAs Optimized for Automotive Applications (Aug 26, 2021)
- Espressif Systems Announces an IEEE 802.15.4 + Bluetooth 5 (LE) RISC-V SoC (Aug 26, 2021)
- North American Semiconductor Equipment Industry Posts July 2021 Billings (Aug 26, 2021)
- JEDEC Publishes XFM Embedded and Removable Memory Device Standard to Expand Storage Solutions in Embedded and Automotive Applications (Aug 26, 2021)
- Rambus Preps for HBM3 (Aug 26, 2021)
- UK Regulator Says Nvidia-Arm Deal Could Stifle Innovation (Aug 26, 2021)
- Synopsys Initiates $175 Million Accelerated Share Repurchase Agreement (Aug 26, 2021)
- Cerebras Systems Announces World's First Brain-Scale Artificial Intelligence Solution (Aug 26, 2021)
- CAES to Enable Critical Infrastructure for Next Generation Lunar Landers (Aug 25, 2021)
- Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem (Aug 25, 2021)
- Flex Logix Appoints Lee Leibig As Vice President Of Sales For AI Inference (Aug 25, 2021)
- Esperanto Technologies Unveils Energy-Efficient RISC-V-Based Machine Learning Accelerator Chip (Aug 25, 2021)
- Rambus推出支持HBM3的内存子系统，速率可达8.4Gbps，助力AI/ML性能提升 (Aug. 25, 2021)
- Engineering recruitment stepped up by surge in demand for ultra-low power memory solutions (Aug 24, 2021)
- 给内存加上AI？三星是这样做的 (Aug. 24, 2021)
- eTopus Selects Diakopto's ParagonX Platform for Ultra-High Speed SerDes IP (Aug 24, 2021)
- PragmatIC Semiconductor re-invents the iconic processor that changed the world (Aug 24, 2021)
- Synopsys Enables First-Pass Silicon Success for Achronix's New FPGA for Data and AI Acceleration Applications (Aug 24, 2021)
- Imagination, update on 2021 progress (Aug 24, 2021)
- 台积电展示CoWoS封装技术路线图， 为下一代小芯片架构和HBM3做准备 (Aug. 23, 2021)
- 台媒：联电扩产超预期，产能依然被抢光 (Aug. 23, 2021)
- Nvidia-Arm merger would substantially lessen competition says U.K. government report (Aug 23, 2021)
- Samsung Passes Intel to Become World's Largest Semi Supplier in 2Q21 (Aug 23, 2021)
- ARM Nvidia deal goes to full investigation in the UK (Aug 23, 2021)
- BAE Systems collaborates with GlobalFoundries to produce radiation-hardened single board computers for space (Aug 23, 2021)
- 量子计算建模仿真，助力新一代电池研发 (Aug. 21, 2021)
- 英特尔发布重大技术架构的改变和创新，面向CPU、GPU和IPU 英特尔驱动数据中心、边缘和客户端迈入下一个计算时代 (Aug. 20, 2021)
- 格芯计划在德国扩建晶圆厂，以争夺百亿欧元补贴 (Aug. 20, 2021)
- Dialog半导体公司推出针对高性能汽车AI SoC的最新PMIC系列 (Aug. 19, 2021)
- 近60亿美元并购案，瑞萨：或于8月底前完成收购Dialog (Aug. 19, 2021)
- Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation (Aug 19, 2021)
- Andes Technology and Cyberon Collaborate to Provide Edge-Computing Voice Recognition Solution on DSP-capable RISC-V Processors (Aug 19, 2021)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2021 (Aug 19, 2021)
- 台积电超越腾讯成为亚洲市值最高的公司 (Aug. 19, 2021)
- 为什么传感器对自动驾驶如此重要 (Aug. 19, 2021)
- 大家都想从台积电的3nm节点分一杯羹 (Aug. 18, 2021)
- Arm营收创历史新高 (Aug. 18, 2021)
- Arasan Chip Systems announces its 2'nd Generation Sureboot QSPI IP (Aug 18, 2021)
- Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications (Aug 18, 2021)
- Xpeedic EDA Cloud Platform on Microsoft Azure (Aug 18, 2021)
- Rambus Completes Acquisition of PLDA (Aug 18, 2021)
- 一款基于RISC-V的加密芯片，能抵御量子计算攻击 (Aug. 18, 2021)
- 谷歌也入局，RISC-V正在变得无处不在 (Aug. 17, 2021)
- 勒索软件危机加剧，勒索金额创下新高 (Aug. 17, 2021)
- 三星使用人工智能设计未来Exynos芯片组 (Aug. 17, 2021)
- MCU大廠瑞薩併英商戴樂格 預計月底完成手續 (Aug. 17, 2021)
- BrainChip Receives Akida Chips from Socionext America (Aug 17, 2021)
- Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready Memory Subsystem (Aug 17, 2021)
- CSEM and USJC team up to develop an ultra-low-power chip (Aug 17, 2021)
- Major Update to MIPI DSI-2 Specification Enables Advancements in Mobile Displays (Aug 17, 2021)
- 赛昉科技完成A+轮融资，累积融资金额超10亿 (Aug. 17, 2021)
- Palma Ceia SemiDesign Named to EE Times "Silicon 100 Startups Worth Watching In 2021" (Aug 16, 2021)
- 可能受到人工智能颠覆性影响的7个行业 (Aug. 16, 2021)
- 拿下近50% 5G模組訂單 高通耕耘中國市場有成 (Aug. 16, 2021)
- Renesas and Dialog Semiconductor Announce Conclusion of Final Regulatory Review and the Expected Closing Date for Renesas' Proposed Acquisition of Dialog Semiconductor (Aug 16, 2021)
- The Worldwide Semiconductor Market is expected to show an outstanding growth-rate of 25.1 percent in 2021 (Aug 16, 2021)
- Motivo, Inc. Raises $12 Million Series A to Accelerate AI-Enabled Chip Design and Improve Manufacturing Yields (Aug 16, 2021)
- Tower Semiconductor and Cadence Announce New Reference Flow for Advanced 5G Communications and Automotive IC Development (Aug 16, 2021)
- CrossBar Aims to Secure Computing with ReRAM (Aug 16, 2021)
- BLE如何提升實體零售服務與價值 (Aug. 16, 2021)
- x86架構仍穩居伺服器市場之冠 (Aug. 13, 2021)
- Synopsys为DDR5和DDR4创建了新的物理接口 (Aug. 13, 2021)
- Data Movement Depends on PCIe (Aug 12, 2021)
- Avnu Alliance Announces Silicon Validation Task Group (Aug 12, 2021)
- Automotive MCU Sales to Surge 23% in 2021 Despite Shortages (Aug 12, 2021)
- Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems (Aug 12, 2021)
- Facebook Open Sources Time Appliance For Data Center Networks (Aug 12, 2021)
- Precise-ITC FlexO/OTUw IP Core - Optimized Optical Networks (Aug 12, 2021)
- 台积电28nm下半年暂停涨价意味着什么？ (Aug. 11, 2021)
- 这个团队推出了一款可用于手机的RISC-V芯片 (Aug. 11, 2021)
- Faraday Accelerates Software Development for IIoT ASIC with SoReal! 2.0 Virtual Platform (Aug 10, 2021)
- Sondrel creates unique modelling flow software to cut ASIC modelling time from months to a few days (Aug 10, 2021)
- SiliconArts releases Ray Tracing IP Core to Intel Solutions Marketplace, open source ray tracing APIs on Github (Aug 10, 2021)
- Pixilica Signs Development Agreement with SiliconArts for RayCore GPU Core (Aug 10, 2021)
- Mixel Achieves ISO 26262 for Automotive Functional Safety and ISO 9001 Certification for IP Quality Management System (Aug 10, 2021)
- Mythic Licenses Codasip's L30 RISC-V Core for Next-Generation AI Processor (Aug 10, 2021)
- Samsung Introduces the Industry's First 5nm Processor Powering the Next Generation of Wearables (Aug 10, 2021)
- TSMC July 2021 Revenue Report (Aug 10, 2021)
- MYTHIC授权使用CODASIP L30 RISC-V核心，为其下一代AI处理器产品保驾护航！ (Aug. 10, 2021)
- 传台积电下半年将暂停调涨28nm报价 (Aug. 09, 2021)
- Chips&Media Announces 1 billion Cumulative Shipments of Multimedia IP (Aug 09, 2021)
- CEVA, Inc. Announces Second Quarter 2021 Financial Results (Aug 09, 2021)
- 先进封装是NAND的未来吗？那性能和容量已经到了瓶颈了吗？(图文) (Aug. 08, 2021)
- 台积电已开始安装3nm工艺产线 今年试产明年投入量产 (Aug. 06, 2021)
- 应对自动驾驶新征程的三大挑战，为什么说非FPGA不可？ (Aug. 06, 2021)
- 中芯国际发布2021Q2财报，产能利用率超100% 营收暴涨 (Aug. 06, 2021)
- 从 Intel 与 ARM 的成功历史看 RISC-V (Aug. 06, 2021)
- NVMe 2.0版讓多樣化儲存裝置開發更快速簡單 (Aug. 05, 2021)
- 先進封裝：八仙過海各顯神通 (Aug. 05, 2021)
- SMIC Reports 2021 Second Quarter Results (Aug 05, 2021)
- CAST IP帮助Socionext开发先进的自动驾驶系统 (Aug. 05, 2021)
- Chips&Media Expects a Supercycle in Semiconductors This Year (Aug 05, 2021)
- AccelerComm joins DARPA Toolbox initiative for advanced communications research projects (Aug 05, 2021)
- Robust Growth Rates Expected For Nearly All IC Products in 2021 (Aug 05, 2021)
- GUC Monthly Sales Report - July 2021 (Aug 05, 2021)
- UMC Reports Sales for July 2021 (Aug 05, 2021)
- 赛昉科技与澎峰科技结成合作伙伴关系，共同推动RISC-V应用生态发展 (Aug. 05, 2021)
- CEVA 凭借蓝牙5.3 IP继续引领无线连接技术向前迈进 (Aug. 05, 2021)
- CAST IP Helps Socionext Develop Advanced Autonomous Driving Systems (Aug 05, 2021)
- 赛昉开源单板计算硬件平台将于今年第三季度末正式发布 (Aug. 04, 2021)
- StarFive to release open source single board platform Q3 2021 (Aug 04, 2021)
- 利用RISC-V以不到1美元的价格实现"可配置的CPU" (Aug. 04, 2021)
- 英特爾加速製程與封裝創新 (Aug. 03, 2021)
- 量子计算战争：一场国家实力和技术路线的双重对抗 (Aug. 03, 2021)
- Arasan Announces the Industry's First ONFI v5.0 Compliant NAND Flash IP (Aug 03, 2021)
- Omni Design Announces Silicon Validated Gigasample+ Low Power ADC and DAC on TSMC 28nm Technology (Aug 03, 2021)
- Marvell to acquire Innovium for $1.1 Billion (Aug 03, 2021)
- DVB-S2X/S2/S Demodulator IP Core licensed to a Major Chinese Semiconductor company for integration into an 8K TV SOC (Aug 03, 2021)
- Rambus Reports Second Quarter 2021 Financial Results (Aug 03, 2021)
- Global Semiconductor Sales Increase 29.2% Year-to-Year in June; Q2 Sales Up 8.3% Over Q1 (Aug 03, 2021)
- Intrinsic ID Partners with DARPA to Provide Streamlined Access to Industry-Leading PUF Technology (Aug 03, 2021)
- CEO interview: Globalfoundries' Tom Caulfield on the European project (Aug 03, 2021)
- 浙江大学-芯原智能图形处理器联合研究中心正式揭牌 (Aug. 02, 2021)
- 【原创】新思科技承诺：要让IC设计效率提升1000倍！ (Aug. 02, 2021)
- Efabless & OpenROAD Advance Commercial Open Source Chip Design (Aug 02, 2021)
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- 人工智慧時代的雙面刃 (Aug. 02, 2021)
- NSITEXE Announces a RISC-V 32bit CPU supporting ISO26262 ASIL D (Aug 02, 2021)
- Imagination opens Cambridge office (Aug 02, 2021)
- NSITEXE achieves world's first RISC-V processor with vector extension certified for ISO 26262 ASIL D ready product (Aug 02, 2021)
- IAR Systems collaborates with NSITEXE to accelerate functional safety development for RISC-V (Aug 02, 2021)
- 台积电正在评估赴日、德建厂：针对车用芯片 成本是难题 (Aug. 02, 2021)
- 用AI解密眼底世界 (Jul. 30, 2021)
- 国家第三代半导体技术创新中心（江苏）发布首批揭榜挂帅项目 (Jul. 30, 2021)
- 韩媒：三星追赶台积电将愈发艰难 (Jul. 30, 2021)
- 边缘人工智能需求激增，创新存储方案受青睐 (Jul. 30, 2021)
- 最详细：英特尔公布未来三年制程工艺和封装技术路线 (Jul. 29, 2021)
- 深度解读：1100个RISC-V内核的AI芯片 (Jul. 29, 2021)
- Cadence Tensilica Xtensa 处理器满足最严格的汽车功能安全要求，完全达到 ISO 26262 ASIL-D 等级 (Jul. 29, 2021)
- SmartDV Leads Industry with Greatest Number of Design and Verification MIPI Protocol Standards Solutions for Mobile Applications (Jul 29, 2021)
- Silicon Wafer Shipments Reach New High in Second Quarter 2021, SEMI Reports (Jul 29, 2021)
- Optima Design Automation Announces TUV Certification of its Entire Safety Platform for ISO 26262 ASIL-D Functional Safety Verification (Jul 29, 2021)
- IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year (Jul 29, 2021)
- Ampere to Acquire OnSpecta to Accelerate AI Inference on Cloud-Native Applications (Jul 29, 2021)
- 台当局批准台积电在大陆增产半导体材料 (Jul. 29, 2021)
- 消息称联发科基于tsmc 4nm的旗舰芯预估年底发布 (Jul. 29, 2021)
- MLPerf发表TinyML测试基准，小型AI系统也能跑分了 (Jul. 28, 2021)
- 芯原推出全新Vivante产品系列之超低功耗8K HDR显示处理器DC9000 (Jul. 28, 2021)
- SK海力士确认今年下半年开始量产DDR5内存颗粒 (Jul. 28, 2021)
- DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licensing (Jul 28, 2021)
- PUFsecurity's PUFiot Helps IoT Devices Meet FIDO Device Onboard Specification (Jul 28, 2021)
- Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D (Jul 28, 2021)
- JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications (Jul 28, 2021)
- 中芯国际两天大涨24% 半导体逆市拉升 (Jul. 28, 2021)
- Cadence推出以機器學習為基礎的革命性產品Cerebrus (Jul. 27, 2021)
- CAST And Avery Design Systems Expand IP Partnership to Support Next Generation High-Bandwidth Automotive Networking And Control Systems (Jul 27, 2021)
- Cadence Announces Anirudh Devgan to Become CEO in December 2021; Lip-Bu Tan to Transition to Role of Executive Chairman at That Time (Jul 27, 2021)
- Blaize, leading AI Solution for Edge Computing, Announces $71M Series D Financing to Further Accelerate Growth (Jul 27, 2021)
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- DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licencing (Jul 26, 2021)
- 台积电或在德国建立首家欧洲芯片工厂 (Jul. 26, 2021)
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- 传明年联电再涨10%~15% (Jul. 26, 2021)
- 人工智能和机器学习在网络安全中的7种积极和消极影响 (Jul. 26, 2021)
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- NovaSparks Unveil the First FPGA Market Data Aggregator (Jul 22, 2021)
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- Fraunhofer IPMS RISC-V processor core for functional safety supported by development tools from IAR Systems (Jul 09, 2021)
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- Another Industry first: Extreme Networking- 1K TCP & UDP Session on intel/Xilinx FPGAs, high availability application performance - 2U Accelerator box with Linux iWARP/RoCE (Jul 08, 2021)
- Liverpool 5G Create and Blu Wireless develop industry-boosting IP (Jul 08, 2021)
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- 新思科技与三星合作，加速推广变革性3纳米GAA技术 (Jul. 07, 2021)
- Another Industry first: Extreme Networking- 1K TCP & UDP Session on intel/Xilinx FPGAs, high availability application performance – 2U Accelerator box with Linux iWARP/RoCE (Jul 07, 2021)
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- 大咖云集！2021国产IP与定制芯片生态大会日程公布 (Jul. 06, 2021)
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- Global Semiconductor Sales in May Up 26.2% Year-to-Year, 4.1% Month-to-Month (Jul 06, 2021)
- Think Silicon and the Aristotle University of Thessaloniki Create a Research Team to Solve Engineering Challenges of Next-Generation Graphics and AI Processors (Jul 06, 2021)
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- Sondrel's SFA 100 IP platform for intelligence gathering chips at the Edge (Jul 05, 2021)
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- GUC Monthly Sales Report - June 2021 (Jul 05, 2021)
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- ARM CEO：ARM被英伟达收购要好于独立上市 (Jul. 05, 2021)
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- 2021年Silicon 100榜单出炉！9家中国公司新入选 (Jul. 05, 2021)
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- NVMe Gets Refactored (Jul 01, 2021)
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- Arteris IP FlexNoC互连产品用于杰发科技的汽车片上系统开发 (Jul. 01, 2021)
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- Intel to offer RISC-V core in 7nm foundry (Jun 28, 2021)
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- IAR Systems extends development tools performance capabilities for Andes RISC-V cores (Jun 23, 2021)
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- SEGGER and Codasip Announce Cooperation on RISC-V (Jun 23, 2021)
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- Silvaco Names Greg Swyt as Chief Financial Officer (Jun 23, 2021)
- Arm CCA will put confidential compute in the hands of every developer (Jun 23, 2021)
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- SiFive Performance P550 Core Sets New Standard as Highest Performance RISC-V Processor IP (Jun 22, 2021)
- Alphawave IP Adopts Diakopto's ParagonX EDA Platform and Methodology (Jun 22, 2021)
- GLOBALFOUNDRIES?Breaks Ground on?New Fab in?Singapore (Jun 22, 2021)
- Intrinsic ID QuiddiKey Hardware IP is Now CAVP Certified by NIST (Jun 22, 2021)
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- Codasip Announces A71X RISC-V Application Core with Dual-Issue Capability (Jun 22, 2021)
- 为促进半导体技术国内研发 日本向台积电拨款190亿日元 (Jun. 22, 2021)
- 英诺达国内首个EDA硬件验证云平台投入使用 (Jun. 21, 2021)
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- 外媒称台积电日本工厂将投资145亿美元 高于美国工厂投资 (Jun. 21, 2021)
- Rebooting Imagination: A Heterogeneous Compute Strategy (Jun 21, 2021)
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- Rambus to Acquire AnalogX, Accelerating Next-Generation Data Center Interface Solutions (Jun. 17, 2021)
- eFabless Joins the Open Source FPGA Foundation as Corporate Member (Jun. 17, 2021)
- SmartDV Joins the Xilinx Partner Program (Jun. 17, 2021)
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- Silex Insight launches the all-new VIPER (4K60 4:4:4 AV over IP transmitter/receiver board), ideal for collaboration featuring seamless switching between multiple inputs (2xHDMI/1xUSB-C) (Jun 16, 2021)
- IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24% (Jun 16, 2021)
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- Precise-ITC 800G_AX Ethernet IP Core Optimized for AI Application (Jun. 15, 2021)
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- Graphcore and SiPearl: strategic partnership to combine artificial intelligence and high performance computing (Jun 15, 2021)
- Hardent VESA DSC and FEC IP Cores Licensed by Kinetic Technologies (Jun 15, 2021)
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- Alphawave与PLDA宣布合作，为包括PCIe(r) 5.0、CXL(TM)和PCIe 6.0在内的互连技术打造紧密集成的控制器和PHY IP解决方案 (Mar. 10, 2021)
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- Intel to Collaborate with Microsoft on DARPA Program (Mar 08, 2021)
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- CEVA 推出高集成度无线音频平台 Bluebud™，简化蓝牙音频技术难度 (Feb. 23, 2021)
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- IAR Systems introduces 64-bit Arm core support in leading embedded development tools (Feb 22, 2021)
- Imagination's GPU selected by StarFive to create high-performance, small and low-cost BeagleV RISC-V AI single board computer (Feb 22, 2021)
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- Secure-IC and MosChip Announce Strategic Partnership to Provide Turnkey ASIC Solutions With Embedded Security for Edge Applications (Feb 22, 2021)
- MIPI D-PHY TSMC 22ULP & TSMC 22ULL Silicon Proven IP Core for IOT and Wearables products is available immediately (Feb 22, 2021)
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- 新思出品：2021年汽车行业四大趋势预测 (Feb. 22, 2021)
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- Achronix and Logic Fruit Introduce IP Solutions for Test and Measurement Applications (Feb 19, 2021)
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- Sales of Logic ICs Account for Largest Share of China's IC Market in 2020 (Feb 19, 2021)
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- IC Insights发布全球企业晶圆产能排名：三星超台积电，中芯第十 (Feb. 19, 2021)
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- 报价高出20%！消息称台积电已同意将汽车芯片订单放在首位 (Feb. 19, 2021)
- PLDA Announces a Unique CXL Verification IP Ecosystem, Delivering Robust Verification That Reduces Time-to-Design for CXL 2.0 Applications (Feb 18, 2021)
- SPARK Microsystems Announces CDN$17.5 Million Financing (Feb 18, 2021)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2021 (Feb 18, 2021)
- Proposed Arm Buyout: Huang on So Many Levels (Feb 18, 2021)
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- Micro Magic, Inc. Delivers Ultra Low Power 64-Bit RISC-V Core (Feb 18, 2021)
- Mark Redford Named Vice President, Operations & Supply Chain for Palma Ceia SemiDesign - Former Arm Executive (Feb 18, 2021)
- 三星HBM-PIM芯片问市，功耗可降低70% (Feb. 18, 2021)
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- 高通反对收购：NVIDIA 或成 Arm 技术守门人 (Feb. 18, 2021)
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- GlobalFoundries又一工厂将为美国防部供货，扩建选址美国本土 (Feb. 18, 2021)
- CEVA Appoints Jaclyn Liu to its Board of Directors; Bruce A. Mann Retires (Feb 17, 2021)
- Veriest Solutions and CEVA develop functional safety verification methodology for automotive devices (Feb 17, 2021)
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- 2020年内地代工双雄中芯、华虹全年数据分析 (Feb. 16, 2021)
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- Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9% (Dec 29, 2020)
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- Renesas Extends Arm Cortex-Based MCU Family with RA4M3 MCU Group for Industrial and IoT Applications (Dec 09, 2020)
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- Cobham Gaisler and fentISS Deepen Collaboration around RISC-V (Dec 09, 2020)
- SmartDV Announces New Line of Design IP Controllers for High-Speed Communications (Dec 09, 2020)
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- Menta eFPGA and Codasip Announce Technology Partnership (Dec 08, 2020)
- OneSpin Contributes to the OpenHW Ecosystem to Achieve Processor Integrity for the CORE-V CVE4 Open-Source RISC-V Cores (Dec 08, 2020)
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- C-DAC Selects Valtrix STING For Design Verification Of RISC-V Based Microprocessors (Dec 08, 2020)
- Dolphin Design unveil a new and improved version of its Power Controller IP - MAESTRO - to speed-up energy-efficient SoC design (Dec 08, 2020)
- Neoverse expands further into cloud with new network-optimized instances at AWS re:Invent (Dec 08, 2020)
- Codasip announces three new RISC-V Application Processor Cores providing Multi-core and SIMD capability (Dec 08, 2020)
- UMC Reports Sales for November 2020 (Dec 08, 2020)
- Menta and Andes Announce Partnership Enabling Hardware Reconfiguring for ISA Extension (Dec 08, 2020)
- Vidatronic Appoints Carnyx Consulting as Its Representative for European Markets (Dec 08, 2020)
- OpenFive Licenses Flex Logix's eFPGA to Develop a Low Power Communications SoC Requiring a Large eFPGA (Dec 08, 2020)
- 2020Q4全球TOP10晶圆代工厂排名预测 (Dec. 08, 2020)
- TSMC's market cap rises to 9th highest in world (Dec. 08, 2020)
- Dolphin Design推出了其功率控制器IP的新改进版-MAESTRO-加快了节能SoC设计的速度 (Dec. 07, 2020)
- OpenFive许可Flex Logix的Efpga开发需要大Efpga的低功耗通信Soc (Dec. 07, 2020)
- Imperas Extends free riscvOVPsimPlus Simulator for RISC-V (Dec 07, 2020)
- DRAM Leads in Revenue, NAND With Top Percentage Growth in 2020 (Dec 07, 2020)
- Announcement of SMIC (Dec 07, 2020)
- China's Semiconductor Progress to Be Impacted Once Again as SMIC Becomes Sanctioned by U.S. Department of Defense, Says TrendForce (Dec 07, 2020)
- GUC Monthly Sales Report - Nov 2020 (Dec 07, 2020)
- Total Revenue of Top 10 Foundries Expected to Increase by 18% YoY in 4Q20 While UMC Overtakes GlobalFoundries for Third Place, Says TrendForce (Dec 07, 2020)
- Porting PikeOS to NOEL-V and LEON: SYSGO and Cobham Gaisler Extend Cooperation around RISC-V (Dec 07, 2020)
- 中芯国际被美国防部列入黑名单 特朗普继续施压 (Dec. 05, 2020)
- Codasip announces three new RISC?V Application Processor Cores providing Multi-core and SIMD capability (Dec 04, 2020)
- intoPIX delivers its new full stack of TICO-RAW solutions improving RAW image workflows and camera designs (Dec 04, 2020)
- CFX announces commercial availability of anti-fuse OTP technology on Silterra I11L process (Dec 04, 2020)
- 中芯国际关于关注到相关事项的后续公告 (Dec. 04, 2020)
- Codasip宣布推出三个新的RISC‐V应用处理器内核，这些内核可提供多核和SIMD功能 (Dec. 04, 2020)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2020 (Dec 03, 2020)
- Embeetle and GigaDevice collaborate to bring a new powerful and simple IDE to ARM and RISC-V based MCUs (Dec 03, 2020)
- Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers (Dec 03, 2020)
- Andes RISC-V Vector Processor NX27V Is Upgraded to RVV 1.0 (Dec 03, 2020)
- BrainChip Confirms Completion of the Akida Production Design (Dec 03, 2020)
- Faster, Smaller and More Accurate Edge AI Using Deeplite and Andes Technology Software + Hardware (Dec 03, 2020)
- Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time (Dec 03, 2020)
- 智原科技将于ICCAD 2020展出最新IoT/MCU开发平台与高速串行接口方案 (Dec. 03, 2020)
- IAR Systems and GigaDevice extend partnership with powerful Arm solutions (Dec 03, 2020)
- Can IBM Ecosystem Advance AI Chip Performance 1000x? (Dec 03, 2020)
- Synopsys and Samsung Foundry Collaborate to Deliver Fastest Design Closure and Signoff for Process Nodes Down to 3nm (Dec 03, 2020)
- Esperanto Technologies to Reveal Chip with 1000+ Cores at RISC-V Summit (Dec 03, 2020)
- Third-Quarter 2020 Global Semiconductor Equipment Billings Surge 30% Year-Over-Year, SEMI Reports (Dec 03, 2020)
- Imperas Simulator Supports Andes Custom Extension to Accelerate Software Development in Domain Specific Applications (Dec 03, 2020)
- 消息人士：台积电第二代3nm工艺2023年推出，苹果率先采用 (Dec. 03, 2020)
- 首款ISP处理器面世！安谋中国发布"玲珑"多媒体产品 线 (Dec. 03, 2020)
- Arm 30周年纪念——如今的Arm比以往更强大 (Dec. 03, 2020)
- 首发 | 芯来科技900系列 RISC-V处理器IP (Dec. 03, 2020)
- ARM CEO：被英伟达收购不涉及出口管制，希望监管机构"看好"此交易 (Dec. 03, 2020)
- Q3全球半導體設備出貨年成長30% (Dec. 03, 2020)
- Mobiveil Announces Compute Express Link (CXL) 2.0 Design IP, Successful Completion of CXL 1.1 Validation with Intel's CXL Host Platform (Dec 02, 2020)
- PCIe Gen5 & PCIe Gen4 Phy IP available in TSMC 12FFC (Dec 02, 2020)
- 台积电与三星的工艺之争已扩展到到封装领域 (Dec. 01, 2020)
- CEVA低功耗蓝牙 5.2平台成为首个蓝牙技术联盟认证IP (Dec. 01, 2020)
- Imagination sells Ensigma Wi-Fi technology to Nordic Semiconductor (Dec 01, 2020)
- Xilinx Acquires Assets of Falcon Computing Solutions to Advance Software Programmability and Expand Developer Community (Dec 01, 2020)
- Faraday Leads Industry to Adopt TCFD Framework for Corporate Sustainability (Dec 01, 2020)
- PLDA Announces the Successful CXL Interoperability with pre-production Intel Xeon CPU, Code Named Sapphire Rapids (Dec 01, 2020)
- Secure-IC Announces U.S. Subsidiary Opening (Dec 01, 2020)
- Imagination hires Tim Whitfield as new Chief of Engineering (Dec 01, 2020)
- BrainChip Appoints Geoffrey Carrick as Non-Executive Director (Nov 30, 2020)
- Nordic Semiconductor expands into Wi-Fi by acquiring the entire Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group (Nov 30, 2020)
- 路透社：美国准备将中芯国际列入黑名单 (Nov. 30, 2020)
- Broadcom Debuts Industry's First 5nm ASIC for Data Center and Cloud Infrastructure (Nov 30, 2020)
- Bluetooth RF Transceiver Phy KGD for adding Bluetooth Connectivity to "any SoC" (Nov 30, 2020)
- Xiphera announces FPGA-based TLS 1.3 IP core for mission-critical applications (Nov 30, 2020)
- Arteris IP Completes Acquisition of Magillem Design Services Assets, Creating World's Premier System-on-Chip Integration Company (Nov 30, 2020)
- Andes Announces New RISC-V Processors: Superscalar 45-Series with Multi-core Support and 27-Series with Level-2 Cache Controller (Nov 30, 2020)
- Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC (Nov 26, 2020)
- intoPIX demos newest compression technologies shaping the future of lossless quality wired/wireless transmission: 4K/8K JPEG XS, TICO-RAW and FlinQ - lowest latency & power, highest quality (Nov 26, 2020)
- Innatera raises EUR 5M to bring neuromorphic intelligence to the sensor-edge (Nov 26, 2020)
- IAR Systems delivers extended optimization and trace capabilities for RISC-V development (Nov 26, 2020)
- 智原為行動裝置OLED驅動晶片供應記憶體編譯器 (Nov. 26, 2020)
- 台湾半导体产业再进入一个新的里程碑 (Nov. 26, 2020)
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- 大规模物联网连接数量增加三倍，物联网设备系统设计应考虑哪些因素？ (Nov. 26, 2020)
- 汇聚新能源汽车半导体技术和产业专家的"中国国际汽车电子高峰论坛"成功在上海举行 (Nov. 26, 2020)
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- Gyrfalcon Launches AI-X: Full-Stack Solution for Edge-AI Development (Nov 25, 2020)
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- 2020年半导体厂商TOP15预测：海思消失，联发科激进 (Nov. 25, 2020)
- 台积电与美国客户合作开发先进3D封装技术 将有助于半导体产业改变现状 (Nov. 24, 2020)
- 降低5G测试成本的五种方法 (Nov. 24, 2020)
- Intel to Keep Its Number One Semiconductor Supplier Ranking in 2020 (Nov 24, 2020)
- CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification (Nov 24, 2020)
- 台积电与美国客户合作开发先进3D封装技术，计划2022年量产 (Nov. 24, 2020)
- 半導體製造需要更具彈性的策略 (Nov. 24, 2020)
- Mythic launches industry-first AI analog matrix processor (Nov 23, 2020)
- North American Semiconductor Equipment Industry Posts October 2020 Billings (Nov 23, 2020)
- Audio Weaver + TalkTo reference design now available on Qualcomm QCS400 series of audio System-on-Chips (SoCs) (Nov 23, 2020)
- China TSMC Rival HSMC Runs Out of Cash, Ex-CEO Says (Nov 23, 2020)
- Alphawave Announces Successful Bringup of 5nm ALPHACORE100 IP (Nov 23, 2020)
- 中国5G网络加速成型，未来将深刻影响各个行业！ (Nov. 22, 2020)
- 英伟达三季报透露将于2022年完成对ARM的收购 (Nov. 20, 2020)
- Gartner预测2021年全球公有云终端用户支出将增长18% (Nov. 20, 2020)
- 半导体使汽车设计大规模变革 (Nov. 20, 2020)
- Mentor加入Nano 2022研发计划，以促进半导体设计和验 证的创新 (Nov. 20, 2020)
- Palma Ceia SemiDesign发布Wi-Fi HaLow的参考设计，可用于设计基于IEEE 802.11ah的IC系统 (Nov. 20, 2020)
- Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign (Nov 20, 2020)
- 美國罕見出資支援臺積電設廠 背後是與北京暗戰 (Nov. 20, 2020)
- 中芯國際14nm已達業界水平 更先進工藝來了 (Nov. 20, 2020)
- Dialog推出SmartServer IoT合作夥伴生態系統 用於智慧建築和工廠的邊緣解決方案 (Nov. 20, 2020)
- SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge (Nov 19, 2020)
- Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products (Nov 19, 2020)
- Mentor joins Nano 2022 R&D program to foster innovation in semiconductor design and verification (Nov 19, 2020)
- Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions (Nov 19, 2020)
- Introducing new Arm Roadmap Guarantee and other Arm IoT initiatives for accelerating Endpoint AI (Nov 19, 2020)
- Secure Thingz supports next-generation Secure Install technologies for IP Protection and malware prevention (Nov 19, 2020)
- Ferroelectric Memory GmbH (FMC) Raises $20 Million to Accelerate Next-Generation Memory for AI, IoT, Edge Computing, and Data Center Applications (Nov 19, 2020)
- AI Startup Deep Vision Powers AI Innovation at the Edge (Nov 19, 2020)
- Fugaku Tops Supercomputer Rankings Again as Arm HPC Ecosystem Expands (Nov 18, 2020)
- BrainChip Appoints Todd Vierra Director of Technical Sales (Nov 18, 2020)
- Foundry Revenue Expected to Increase by 23.8% YoY in 2020, with Advanced Nodes and 8-Inch Capacities Being Key to Industry Competitiveness in 2021, Says TrendForce (Nov 18, 2020)
- First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced (Nov 18, 2020)
- Wafer Capacity by Feature Size Shows Strongest Growth at <10nm (Nov 18, 2020)
- 2020年全球晶圆代工产值或年增23.8%，突破近十年高峰 (Nov. 18, 2020)
- 对比比亚迪与英飞凌，看国产汽车半导体面临的挑战与发展机遇 (Nov. 18, 2020)
- 创意电子芯粒间 (D2D) 整体解决方案开启旗舰级SoC的新时代 (Nov. 17, 2020)
- GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC (Nov 17, 2020)
- Marvell Announces Industry's First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure (Nov 17, 2020)
- Kandou Raises $92.3 Million in Series C Funding (Nov 17, 2020)
- Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications (Nov 17, 2020)
- Arteris IP Achieves Major Milestone: 150th Licensee (Nov 17, 2020)
- Lattice Expands Radiant Software Tool Capabilities (Nov 16, 2020)
- SimpleMachines, Inc. Debuts First-of-its-Kind High Performance Chip (Nov 16, 2020)
- Apple M1 Processor, Passing on the Chiplets (Nov 16, 2020)
- BrainChip Demonstrates How Its Akida Technology Is Delivering the Next-Generation of AI at the Edge at First-Ever AI Field Day (Nov 16, 2020)
- 三星发布Exynos 1080移动处理器 ：5nm工艺、性能成倍提升 (Nov. 13, 2020)
- 芯联芯授权宣布 Wave Computing 将在 MIPS 核芯中增加 RISC–V 支持-嵌入式系统-与非网 (Nov. 13, 2020)
- 中芯國際回應無法供貨華為怎麼辦 任正非為晶片產業困難支招 (Nov. 13, 2020)
- Faraday's 22nm Fundamental IP Adopted for Intelligent IoT Devices (Nov 12, 2020)
- CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC (Nov 12, 2020)
- Efinix Announces Trion Titanium Tapeout at TSMC 16 nm Process Node (Nov 12, 2020)
- Vidatronic Achieves up to 10X Speedup Using the Cadence Spectre X Simulator (Nov 12, 2020)
- Imagination launches multi-core IMG Series4 NNA - the ultimate AI accelerator delivering industry-disruptive performance for ADAS and autonomous driving (Nov 12, 2020)
- Silvaco Acquires Memory Compiler Technology of Dolphin Design SAS (Nov 12, 2020)
- De-RISC first anniversary, a H2020 project which will create the first RISC-V, fully European platform for space (Nov 12, 2020)
- CXL Consortium Releases Compute Express Link 2.0 Specification (Nov 12, 2020)
- Xilinx and Samsung Deliver Industry's First Adaptable Computational Storage Drives (Nov 12, 2020)
- Google Partners with SkyWater and Efabless to Enable Open Source Manufacturing of Custom ASICs (Nov 12, 2020)
- Lattice Accelerates Development of Low Power FPGA-Based Custom Solutions with Lattice Design Group (Nov 12, 2020)
- Imagination推出多核 Series4 NNA—终极AI加速器为ADAS和自动驾驶提供颠覆行业的性能 (Nov. 12, 2020)
- 智原22纳米基础组件IP已采用于智能物联网装置 (Nov. 12, 2020)
- Silex Insight与Silicon Labs达成战略合作——提供最先进的安全组件 eSecure (Nov. 12, 2020)
- 封装的演进，芯片技术将步入Chiplets时代 (Nov. 12, 2020)
- 中芯国际：14nm及以下节点，已有10多个国内外客户流片项目 (Nov. 12, 2020)
- 自動駕駛車的AI演算法及其挑戰 (Nov. 12, 2020)
- Synopsys Acquires In-chip Monitoring Solutions Leader Moortec (Nov 11, 2020)
- TSMC October 2020 Revenue Report (Nov 11, 2020)
- Xilinx 携手三星推出业界首款灵活应变的计算存储驱动器 (Nov. 11, 2020)
- 台积电美国建厂计划将于明年2月动工 (Nov. 10, 2020)
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- Graphcore leverages multiple Mentor technologies for its massive, second-generation AI platform (Nov 10, 2020)
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- Synopsys Announces Industry's First CXL 2.0 VIP Solution for Breakthrough SoC Performance (Nov 10, 2020)
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- ARC: from 3D Game Chips to Licensable RISC Processor (Sep 22, 2020)
- Imagination发布光线追踪等级系统 (Sept. 22, 2020)
- Imagination launches Ray Tracing Levels System (Sep 22, 2020)
- Arteris IP FlexNoC & Resilience Package Support SemiDrive ISO 26262-Compliant Chip Production (Sep 22, 2020)
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- CEVA Enhances the User Experience and Extends the Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software (Sep 22, 2020)
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- 芯来基础软件平台(Nuclei Software Platform)重磅升级 (Sept. 21, 2020)
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- AccelerComm secures $7.5m Series A funding from IQ Capital, Bloc Ventures and IP Group (Sep 21, 2020)
- Nvidia收购Arm细节曝光,包括预付7.5亿IP授权,最低价格只有327.5亿美元 (Sept. 19, 2020)
- 商务部正式发布《不可靠实体清单规定》 (Sept. 19, 2020)
- Analog Bits Provides Enabling IP for Graphcore IPU-Machine M2000 (Sep 18, 2020)
- Imagination and Packetcraft announce partnership for low energy audio (Sep 17, 2020)
- SiFive Appoints Patrick Little as President and Chief Executive Officer (Sep 17, 2020)
- SOT-MRAM Pioneer Antaios Secures 11 Million Dollars in Funding (Sep 17, 2020)
- videantis appoints Stephan Janouch as marketing director (Sep 17, 2020)
- Xylon Announces Rebranding in Celebration of Its 25-Year Anniversary (Sep 17, 2020)
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- NSITEXE Successfully Develops Multiple Custom Processors for Automotive Applications in Half the Time with Synopsys ASIP Designer Tool (Sep 17, 2020)
- Cobham Gaisler Awarded ESA Contract for Development and Validation of New LEON3FT Microcontroller for Space Applications (Sep 17, 2020)
- Nvidia's $40 Billion ARM Purchase Will Test Current M&A "Ceiling" (Sep 17, 2020)
- SEMI警告美：把中芯国际列入黑名单将影响美企份额 (Sept. 17, 2020)
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- Gyrfalcon Showcases New Tech at 2020 Embedded Vision Summit (Sep 16, 2020)
- proteanTecs Granted US Patent for High Bandwidth Memory (HBM) Signal Quality and Reliability Monitoring (Sep 16, 2020)
- Arteris IP FlexNoC Interconnect Licensed by VITEC for High Resolution Video Encoder and Decoder Chips (Sep 16, 2020)
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- The Industry's First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture is Now Available (Sep 16, 2020)
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- Secure-IC is ready for ASIL B or ASIL D levels projects with its Securyzr integrated Secure Element (Sept. 16, 2020)
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- New IP for wearables and hearables at IP SoC Shanghai 2020 (Sep 15, 2020)
- Nvidia Begins Campaign to Close Arm Acquisition (Sep 15, 2020)
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- Technology Analyzer transforms analog IP reuse (Sep 14, 2020)
- Synopsys Introduces the Industry's First Unified Electronic and Photonic Design Platform (Sep 14, 2020)
- Total Microprocessor Sales to Edge Slightly Higher in 2020 (Sep 14, 2020)
- NVIDIA to Acquire Arm for $40 Billion, Creating World's Premier Computing Company for the Age of AI (Sep 14, 2020)
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- Imagination appoints Sir Peter Bonfield to board as non-executive director (Sep 14, 2020)
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- Silex Insight and Faraday Extend Strategic Partnership to Deliver Secure IoT and AI Solutions (Sep 10, 2020)
- BrainChip Demonstrates Company's Event-Based AI Neural Processor at Embedded Vision Summit (Sep 10, 2020)
- Rambus Advances HBM2E Performance to 4.0 Gbps for AI/ML Training Applications (Sep 10, 2020)
- SkyWater Begins Domestic Fab Expansion Tool Installation to Support DOD Investment of up to $170M (Sep 10, 2020)
- TSMC August 2020 Revenue Report (Sep 10, 2020)
- DSP Group Selects Synopsys' ARC EM Processor IP for Adaptive Processing Smart Codecs (Sep 10, 2020)
- Lattice Shrinks Design Footprint and Cost, Boosts Reliability in Embedded Systems with Single Wire Aggregation IP Solution (Sep 10, 2020)
- Rambus的HBM2E性能实现4.0 Gbps，为AI/ML提速 (Sept. 10, 2020)
- Silvaco Acquires the Assets of Coupling Wave Solutions S.A. (Sep 09, 2020)
- UMC Reports Sales for August 2020 (Sep 09, 2020)
- Fraunhofer IIS presents 8k video over IP transmission with JPEG XS at the virtual IBC 2020 (Sep 08, 2020)
- Socionext starts providing high-speed, high-quality H.264 video encoder available on Amazon Web Services (Sep 08, 2020)
- CAST and Fraunhofer IPMS Introduce CAN XL Bus Controller IP Core (Sep 08, 2020)
- Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports (Sep 08, 2020)
- Chips&Media to Exhibit at the 2020 Embedded Vision Summit (Sep 08, 2020)
- IAR Systems supports ultra-low-power Renesas RE MCU Family in industry-leading Arm tools (Sep 08, 2020)
- Credo Introduces Seagull 50 PAM4 DSP to Drive Front- and Mid-Haul 5G Wireless Networks (Sep 08, 2020)
- Silicon Labs提升物聯網裝置安全性 (Sept. 07, 2020)
- Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in July (Sep 07, 2020)
- Semiconductor Manufacturing International Corporation Responses to Media on the U.S. Government's Consideration to Add the Company to a Trade Blacklist (Sep 07, 2020)
- Arasan Announces MIPI I3C IP Cores compliant to the MIPI I3C Specifications v1.1 (Sep 07, 2020)
- GUC Monthly Sales Report - Aug 2020 (Sep 07, 2020)
- 2H20 Growth Expectations Vary Among Leading IC Suppliers (Sep 07, 2020)
- Thalia and Dolphin Design announce partnership to transform analog IP re-use economics and to accelerate time to market (Sep 07, 2020)
- S2C Announces 300 Million Gate Prototyping System with Intel Stratix 10 GX 10M FPGAs (Sep 07, 2020)
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- 中芯国际关于外媒报道美国政府考虑将公司列入贸易黑名单的声明 (Sept. 05, 2020)
- 中国电信科普WiFi6：网络更快更安全 (Sept. 05, 2020)
- SiFive与巴塞罗那超级计算中心扩大合作 (Sept. 04, 2020)
- 最高性能的Arm Cortex-R处理器驱动计算型存储的未来 (Sept. 04, 2020)
- Wi-Fi技术将成为工业4.0的一部分 (Sept. 04, 2020)
- 曝三星代工与台积电之间的差距有望缩小 高通力挺三星 (Sept. 04, 2020)
- Imagination推出首门RISC-V计算机体系结构课程-控制器/处理器-与非网 (Sept. 04, 2020)
- 外媒：中国正出台政策发展半导体行业，将其赋予跟原子能力同样优先地位 (Sept. 04, 2020)
- SiFive and Barcelona Supercomputing Center Advance Industry Adoption of RISC-V Vector Extension (Sep 03, 2020)
- Mentor achieves certifications for TSMC's leading-edge 3nm process technology (Sep 03, 2020)
- Arm announces Cortex-R82: powering the future of computational storage (Sep 03, 2020)
- Chips&Media Announces Making the First License Deal of Upscaling HW IP, c.WAVE120 (Sep 03, 2020)
- Synopsys and Nestwave Collaborate to Develop a Low-Power Geolocation IP Solution for IoT Modems (Sep 03, 2020)
- BrainChip and VORAGO Technologies Agree to Collaborate through the Akida Early Access Program (Sep 03, 2020)
- Blockchain Hardware Accelerator from Silex Insight is now available on AWS Marketplace (Sep 03, 2020)
- Lattice Expands CrossLink-NX FPGA Family of Best-in-Class Low Power FPGAs for Smart and Embedded Vision Systems (Sep 03, 2020)
- Kneron Boosts On-Device Edge AI Computing Performance with Cadence Tensilica IP (Sep 03, 2020)
- Rambus and Micron Extend Patent License Agreement (Sep 03, 2020)
- Aspinity Raises $5.3 Million Series A Funding to Stop Battery Drain in Always-on Smart Sensing Products (Sep 03, 2020)
- Imagination announces the first RISC-V computer architecture course (Sep 02, 2020)
- Secure-IC and NSITEXE form a global partnership to jointly provide cutting-edge security solutions for Cyber-Physical Systems (CPS) (Sep 02, 2020)
- Synopsys Appoints Jeannine Sargent to Board of Directors (Sep 02, 2020)
- SensiML Joins Arm AI Partner Program (Sep 02, 2020)
- 最新版5G規格Release 16多了什麼？ (Sept. 02, 2020)
- PUFsecurity Unveils PUFiot, PUF-based Secure Crypto Coprocessor (Sep 01, 2020)
- Synopsys and Elektrobit Announce Availability of EB tresos Classic AUTOSAR Software for ARC Functional Safety Processor IP (Sep 01, 2020)
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- Cadence Announces Availability of UltraLink D2D PHY IP on TSMC N7, N6 and N5 Processes (Aug 25, 2020)
- Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows (Aug 25, 2020)
- TSMC Plots the Process Course to Its Next "Generational Node" (Aug 25, 2020)
- TSMC Showcases Leading Technologies at Online Technology Symposium and OIP Ecosystem Forum (Aug 25, 2020)
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- Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Generation SoC Design (Aug 25, 2020)
- Analog Bits to Present Papers on Wafer-Scale Sensors and PCIe Clock Systems at TSMC 2020 Open Innovation Platform Ecosystem Forums (Aug 25, 2020)
- GigaDevice launches the New GD32E5 Series of MCU's, marking a new milestone for high-performance computing based on the Arm Cortex-M33 core. (Aug 25, 2020)
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- 刚刚，俄罗斯宣布将与华为开展5G合作！ (Aug. 24, 2020)
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- Dolphin Design Releases its First Development Platform on TSMC 22ULL Process for Smart Home Applications (Aug 24, 2020)
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- Subaru Selects Xilinx to Power New-Generation EyeSight System (Aug 20, 2020)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2020 (Aug 20, 2020)
- OpenFive Enhances Differentiated IP Portfolio with Die-to-Die Interface Controllers for HPC and Chiplet Markets (Aug 20, 2020)
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- Synopsys IC Validator, Running on AMD EPYC Processor Powered Azure Virtual Machines, Verifies AMD Radeon Pro VII GPU Design in Under Nine Hours (Aug 20, 2020)
- Synopsys Appoints Sassine Ghazi as Chief Operating Officer (Aug 20, 2020)
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- Arm and DARPA Sign Partnership Agreement to Accelerate Technological Innovation (Aug 20, 2020)
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- CEVA's Wi-Fi 6 Solution Becomes World's First IP to Achieve Wi-Fi CERTIFIED 6 Status from the Wi-Fi Alliance (Aug 19, 2020)
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- The Landmark IPO of VeriSilicon (688521.SH) on Shanghai STAR Market (Aug 18, 2020)
- Rianta Releases 800G MACsec ASIC/SoC IP Core for Next-Gen Data Center and 5G Backhaul Applications (Aug 18, 2020)
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- BrainChip Inc and Magik Eye Inc. Partner to Combine Best of AI with 3D Sensing for Total 3D Vision Solution (Aug 17, 2020)
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- Silicon Creations' SerDes Technology Designed into Novatek 8K TV SoC on TSMC 12nm Process (Aug 17, 2020)
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- UMC Reports Sales for July 2020 (Aug 10, 2020)
- Huawei to end production of leading edge mobile chipsets (Aug 10, 2020)
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- Mentor extends industry-leading EDA software support for Samsung Foundry's 5/4nm process technologies (Aug 10, 2020)
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- TSMC July 2020 Revenue Report (Aug 10, 2020)
- CEVA, Inc. Announces Second Quarter 2020 Financial Results (Aug 10, 2020)
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- 北科大攜手台積電推出半導體設備學程 (Aug. 07, 2020)
- Socionext 成功开发全新HDMI模块"cecTalker" (Aug. 07, 2020)
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- Aldec's TySOM Embedded Development Kits are Now Qualified for AWS IoT Greengrass (Aug 06, 2020)
- SMIC Reports 2020 Second Quarter Results. (Aug 06, 2020)
- MediaTek and Intel Advance Partnership to Bring 5G to Next Generation of PCs (Aug 06, 2020)
- CAST HDLC/SDLC IP Core Now Ready for DO-254 Compliance in Airborne Systems (Aug 06, 2020)
- Lattice FPGA Brings High-Performance MIPI Bridging to Ambarella's CVflow Architecture for Automotive and Machine Vision Applications (Aug 06, 2020)
- Codasip and Metrics Design Automation Announce the Integration of the Metrics Cloud Simulation Platform in Codasip's RISC-V SweRV CORE Support Package Pro (Aug 06, 2020)
- RISC-V企业芯来科技完成小米领投融资 后续将就AIoT进行合作 (Aug. 06, 2020)
- 什么是RISC-V？如何找到合适的开发板？ (Aug. 06, 2020)
- 联发科携手英特尔将5G带入下一代PC市场，已成功完成独立组网通话 (Aug. 06, 2020)
- 英伟达与Xsens共同发力智能汽车，助推无人驾驶更快发展 (Aug. 06, 2020)
- HiWire Consortium Publishes first Active Electrical Cable (AEC) Specification (Aug 05, 2020)
- Global Semiconductor Sales Increase 5.1 Percent Year-to-Year in June; Q2 Sales Down Slightly Compared to Q1 (Aug 05, 2020)
- Pliops Storage Processor Proven to Boost Flash Performance (Aug 05, 2020)
- GUC Monthly Sales Report - July 2020 (Aug 05, 2020)
- Rambus Reports Second Quarter 2020 Financial Results (Aug 05, 2020)
- Syntiant Surpasses 1 Million Units Shipped; Raises $35M in Series C Led by M12 and Applied Ventures (Aug 05, 2020)
- 比科奇采用32颗晶心N25F RISC-V处理器核心打造5G NR小基站基频系统级芯片 (Aug. 04, 2020)
- 6月美洲半导体销售额增长近30%，但未来仍充满严峻挑战 (Aug. 04, 2020)
- PUFsecurity Launches Unique Quantum-Tunneling PUF-based Root-of-Trust (Aug 04, 2020)
- Goodix Closes Acquisition of Dream Chip Technologies (Aug 04, 2020)
- Picocom Embeds 32 Andes N25F RISC-V Cores into Its 5G NR Small Cell Baseband SoC (Aug 04, 2020)
- 比科奇采用晶心科技32位RISC-V处理器设计5G芯片 (Aug. 04, 2020)
- 中芯国际携手北京开发区共投530亿，为国产半导体产业链提供稳定基础 (Aug. 03, 2020)
- 分析师：三星晶圆代工业务将在下半年进一步发展 (Aug. 03, 2020)
- Gartner: 2020年全球5G网络基础架构市场支出达565亿元 (Aug. 03, 2020)
- Greg Lang Joins Rambus Board of Directors (Aug 03, 2020)
- Nvidia in pole position to buy Arm (Aug 03, 2020)
- NAND Flash, DRAM Forecast to Remain Largest IC Markets in 2020 (Aug 03, 2020)
- Nvidia-Arm Deal Would Be a Technology "Disaster" (Aug 03, 2020)
- Nvidia Buying Arm Would be Reckless (Aug 03, 2020)
- 半導體技術顛覆汽車設計 (Jul. 31, 2020)
- 消息称英伟达就收购Arm展开深入谈判，计划数周内达成交易 (Jul. 31, 2020)
- 智能边缘2025年将超过650亿美元规模，与AI、5G进入关键融合期 (Jul. 31, 2020)
- 消息称英伟达就收购Arm展开深入谈判，计划数周内达成交易 (Jul. 31, 2020)
- Intento Design announces the launch of ID-Calibre, an ID-Substrate extension for behavioural TCAD simulation on a complete AMS chip (Jul 30, 2020)
- Gen-Z Seeks to Share Memory, Lower Latencies (Jul 30, 2020)
- Intel Outside ... Just Like all the Others (Jul 30, 2020)
- Analog Devices Acquires HDMI Business From INVECAS, Expanding High Performance Audiovisual Capabilities (Jul 30, 2020)
- CEVA音频DSP支持 Dolby MS12多码流解码器已获认证 (Jul. 30, 2020)
- 英特尔三"力"齐发，数据价值实现迎来关键技术转折点 (Jul. 30, 2020)
- 台积电市值跻身全球TOP 10，英特尔从此不再辉煌？ (Jul. 29, 2020)
- 它本該成為厲害的晶圓代工業者… (Jul. 29, 2020)
- 清算时刻 ：中美科技冷战进行式 (Jul. 29, 2020)
- Media Links moves to intoPIX TICO-XS for its MDP3020 IP Media Gateway (Jul 29, 2020)
- Arm China asks Beijing government to intervene in row with Arm UK (Jul 29, 2020)
- Intel is a Potentially Great Foundry (Jul 29, 2020)
- Fraunhofer IIS licenses MPEG-H Audio patents to Samsung (Jul 29, 2020)
- ADI公司收购INVECAS的HDMI业务，以扩展高性能音视频能力 (Jul. 29, 2020)
- Arm中国要求北京方面介入其与英国母公司的纠纷 (Jul. 29, 2020)
- ON Semiconductor Provides BLE Solution with Veridify (Jul. 29, 2020)
- Dolby MS12 Multistream Decoder Now Supported and Approved on CEVA's Audio DSP (Jul 28, 2020)
- Peninsular Capital Acquires NovaSparks (Jul 28, 2020)
- Marvell Unveils the Industry's Most Comprehensive Custom ASIC Offering (Jul 28, 2020)
- Marvell全面推出客户定制的ASIC产品 (Jul. 28, 2020)
- 上半年發明專利申請台積電居冠 商標註冊創歷史新高 (Jul. 28, 2020)
- 新华三半导体成功采用赛昉科技RISC-V U7多核处理器 (Jul. 28, 2020)
- Verimatrix WhiteBox Offers Unmatched Control and Protection Against Cyberattacks for Mobile Apps, IoT Devices and OEM Partner Integrations (Jul. 28, 2020)
- 智原Q3雙位數增，惟需觀察疫情影響 (Jul. 27, 2020)
- 中国新基建产业独角兽100强 (Jul. 27, 2020)
- Fraunhofer IIS announces licensing program for the new MPEG-H 3D Audio Baseline Profile (Jul 27, 2020)
- Exostiv Labs achieves 50 Gbps interoperability tests with Avnet ONIX board. (Jul 27, 2020)
- Innovium Secures $170M in New Funding to Accelerate Product and Customer Momentum Worldwide (Jul 27, 2020)
- Second Quarter 2020 Silicon Wafer Shipments Up Over First-Quarter and Year-Ago Volumes (Jul 27, 2020)
- 中国联通谈5G在工业互联网领域的用途 (Jul. 26, 2020)
- 上半年国内集成电路工业与通信产业情况 (Jul. 24, 2020)
- 英特尔宣布7纳米量产时间延迟6个月 (Jul. 24, 2020)
- 三星投资格芯帮其扩建德国工厂，开拓欧洲新市场 (Jul. 24, 2020)
- Intel難產7奈米晶片，台積電會是救星嗎？ (Jul. 24, 2020)
- M31開發完成台積電22nm完整的實體IP解決方案 (Jul. 24, 2020)
- AI发展进入新阶段 呈现出三大特征 (Jul. 24, 2020)
- 印度5G吹大了？100%国产5G实际是组装的？ (Jul. 24, 2020)
- 若英伟达真的收购了Arm，对国产Arm系厂商影响有多大？ (Jul. 24, 2020)
- M31 Completes the Comprehensive Physical IP Platform on TSMC 22nm Process (Jul 24, 2020)
- North American Semiconductor Equipment Industry Posts June 2020 Billings (Jul 24, 2020)
- Faraday Reports Second Quarter 2020 Revenues at NT$1,306 Million with an EPS of NT$0.58 (Jul 24, 2020)
- 英伟达或有意收购ARM？ (Jul. 23, 2020)
- 证监会同意芯原微等3家企业科创板IPO注册 (Jul. 23, 2020)
- Carlos Mazure, EVP of Soitec and Chairman of the SOI Industry Consortium, Joins Silvaco Board of Directors (Jul 23, 2020)
- Brite Semiconductor Provides Total Solution for NVDIMM OEM (Jul 23, 2020)
- Alchip Technologies 7nm ASIC Capabilities Set Advanced Technology Pace (Jul 23, 2020)
- Mobile Semiconductor's Enhanced Memory Compilers Dramatically Improve Power On Edge AI Devices (Jul 23, 2020)
- European Space Agency, Blue Pearl Software and ADIUVO Engineering Partner Contract to Improve the usability of ESA Soft-Cores (Jul 23, 2020)
- Village Island creates a new breakthrough in the Broadcast market by offering JPEG-XS technology on its VICO series (Jul 23, 2020)
- Softbank talks to Apple and Nvidia about Arm sale (Jul 23, 2020)
- SiFive Elevates Custom SoC Design With Enhanced Processor IP Portfolio (Jul 23, 2020)
- Cadence and UMC Certify mmWave Reference Flow on 28HPC+ Process for Advanced RF Designs (Jul 23, 2020)
- Aldec Provides Static Verification for RISC-V Designs with the latest release of ALINT-PRO (Jul 23, 2020)
- Cadence與聯電攜手完成28奈米HPC+製程先進射頻毫米波設計流程認證 (Jul. 23, 2020)
- SiFive发布全新RISC-V内核20G1，更高计算和更低功耗 (Jul. 23, 2020)
- 多家EDA公司与GLOBALFOUNDRIES合作开发22FDX平台iPDK (Jul. 22, 2020)
- GLOBALFOUNDRIES Partners with Synopsys, Mentor, and Keysight on Interoperable Process Design Kit (iPDK) Support for 22FDX (Jul 22, 2020)
- OpenHW Ecosystem Implements Imperas RISC-V reference models for Coverage Driven Verification of Open Source CORE-V processor IP cores (Jul 22, 2020)
- Codasip推出Bk7 64位 RISC-V内核 (Jul. 22, 2020)
- 现在的高性能RISC-V处理器和Arm比起来如何？ (Jul. 22, 2020)
- 遠端工作成常態 再忽視雲端網路安全就弱了！ (Jul. 22, 2020)
- 不是Arm实现不了软银的物联网梦，可能是软银太缺钱 (Jul. 21, 2020)
- 美媒：欧盟敢禁华为5G，中国就敢反制诺基亚爱立信 (Jul. 21, 2020)
- Flex Logix Announces EFLX eFPGA And nnMAX AI Inference IP Model Support For The Veloce Strato Emulation Platform From Mentor (Jul 21, 2020)
- PLDA Announces Robust Verification Toolset, Increasing Design Accuracy and Reducing Time-to-Production for Next Generation SoCs with CXL, PCIe 6.0 or Gen-Z Interconnect (Jul 21, 2020)
- Codasip Releases the First Linux-Capable RISC-V Core Bk7 Optimized for Domain-Specific Applications (Jul 21, 2020)
- Synaptics to Acquire DisplayLink, Extending Video Interface Market Leadership (Jul 21, 2020)
- New Analog FastSPICE eXTreme technology boosts verification performance by up to 10X (Jul 21, 2020)
- Cadence Reports Second Quarter 2020 Financial Results (Jul 21, 2020)
- Moore's Law Isn't Slowing down - Just Ask System Companies (Jul 21, 2020)
- PLDA®宣布推出Robust Verification Toolset，以提高搭载CXL®、PCIe® 6.0或Gen-Z® Interconnect的下一代SoC的设计精度并缩短生产时间 (Jul. 21, 2020)
- CFI funding fuels new services for researchers from CMC and CNDN (Jul. 21, 2020)
- 强化自身半导体生态系统，日本再次邀请台积电在当地建厂？ (Jul. 20, 2020)
- 华为针对美电信商Verizon、思科及惠普发起专利侵权诉讼 (Jul. 20, 2020)
- 强化自身半导体生态系统，日本再次邀请台积电在当地建厂？ (Jul. 20, 2020)
- True Circuits Participates in First Virtual DAC! Showcases Silicon Proven PLLs, DLLs and DDR 4/3 PHYs (Jul 20, 2020)
- STMicroelectronics makes acquisitions to further strengthen the wireless connectivity capabilities of STM32 microcontrollers (Jul 20, 2020)
- Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform (Jul 20, 2020)
- Synopsys VCS Used by Graphcore to Verify Next-Generation Colossus GC200 IPU (Jul 20, 2020)
- SmartDV, Aldec Partner to Link SmartDV's Verification IP with Aldec's Riviera-PRO Simulator (Jul 20, 2020)
- Perforce Software Acquires Methodics, Expanding DevOps Portfolio (Jul 20, 2020)
- Mentor introduces Calibre nmLVS-Recon technology to dramatically streamline overall IC circuit verification (Jul 20, 2020)
- SMIC: Advanced Process Technologies and Gov't Funding (Part 2) (Jul 20, 2020)
- CFX announces commercial availability of anti-fuse OTP technology on SMIC 40HV process (Jul 20, 2020)
- 美媒：中国正在赢得万亿美元5G战 (Jul. 18, 2020)
- Arm的新买家有可能是"三星"？ (Jul. 18, 2020)
- 不止中美欧争夺，印度也要加入5G竞争？ (Jul. 17, 2020)
- 全球變局下中國半導體產業的「危」與「機」 (Jul. 17, 2020)
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- 台积电Q2净利增长81%，9月15日正式生效断供华为 (Jul. 17, 2020)
- 台积电、中芯国际一片飘红，但过度追捧恐成为"捧杀" (Jul. 17, 2020)
- 台积电宣布断供华为，9月14日后停供 (Jul. 17, 2020)
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- Spin Memory Announces Extension of Series B Funding (Jul 17, 2020)
- CHIPS Alliance Announces AIB 2.0 Draft Specification to Accelerate Design of Open Source Chiplets (Jul 17, 2020)
- TSMC Raises Capital Expenditure Plan on Improved Outlook (Jul 17, 2020)
- USB-IF Publishes USB Device Class Specification for MIDI Devices v2.0 (Jul 17, 2020)
- Nestwave wins Must Award in the category Most Innovative Startup (Jul. 17, 2020)
- 消息人士：Arm拟提高部分客户授权费，芯片成本或涨4倍 (Jul. 16, 2020)
- 智原推出Ariel™物聯網SoC開發平台 採用英飛凌SONOS eFlash技術 (Jul. 16, 2020)
- TSMC Reports Second Quarter EPS of NT$4.66 (Jul 16, 2020)
- Siemens acquires Avatar, expands EDA footprint with innovative Place and Route technology (Jul 16, 2020)
- 1Q/4Q "Direction Indicator" Signals Rebound in the 2020 IC Market (Jul 16, 2020)
- Kandou Appoints Jeff Winzeler CFO (Jul 16, 2020)
- Menta Announces New Software Version and New Adaptive DSP at DAC 2020 (Jul 16, 2020)
- Arm Research Selected for DARPA Secure Silicon Program (Jul 16, 2020)
- EasyIC Design celebrates its 10th anniversary (Jul 16, 2020)
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- 软银要改革，arm成牺牲品？4年前曾花320亿美元收购！ (Jul. 15, 2020)
- Softbank Said to Have a Buyout Offer for Arm (Jul 15, 2020)
- Mixel MIPI D-PHY IP Integrated into the Perceive Ergo Edge Inference Processor (Jul 15, 2020)
- Dr. Walden Rhines Joins Cornami as President and CEO (Jul 15, 2020)
- SMIC: Advanced Process Technologies and Gov't Funding (Jul 15, 2020)
- Efinix Announces Trion Titanium Family (Jul 15, 2020)
- Synopsys Announces Industry's First JEDEC DDR5 Verification IP for Next-Generation DRAM/DIMM Designs (Jul 15, 2020)
- JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems (Jul 15, 2020)
- VITEC Licenses Codasip Bk5 Core for Multi-Purpose Use in Video Products (Jul 15, 2020)
- Tenstorrent Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using Synopsys' Broad DesignWare IP Portfolio (Jul 15, 2020)
- Maxim Integrated Deal Cements Analog Devices at No 2 in Analog (Jul 15, 2020)
- 叫板英伟达？英国Graphcore推出594亿晶体管的AI芯片 (Jul. 15, 2020)
- 打破训练数据瓶颈，浪潮AIStation为AI开发 (Jul. 14, 2020)
- 重磅！ADI将以170亿美元收购Maxim (Jul. 14, 2020)
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- 台积电2nm制程成功切入GAA技术，领先全球地位持续稳固 (Jul. 13, 2020)
- TSMC June 2020 Revenue Report (Jul 13, 2020)
- Flex Logix Announces EFLX eFPGA Emulation Models For The Cadence Palladium Z1 Platform (Jul 13, 2020)
- Mentor collaborates with Samsung Foundry to boost product yield and streamline in-fab memory testing (Jul 13, 2020)
- Analog Devices Announces Combination with Maxim Integrated, Strengthening Analog Semiconductor Leadership (Jul 13, 2020)
- ESD Alliance Reports Electronic Design Automation Industry Revenue Growth for Q1 2020 (Jul 13, 2020)
- DMP releases AI Processor IP Core "ZIA DV740" (Jul 13, 2020)
- DMP releases IP Core "ZIA ISP" (Jul 13, 2020)
- 紫光展锐IPO进展顺利，2020年底科创板上会 (Jul. 13, 2020)
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- Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices (Jul 09, 2020)
- UMC Reports Sales for June 2020 (Jul 09, 2020)
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- Arm计划将拆分物联网服务业务，加深对核心半导体IP业务关注 (Jul. 09, 2020)
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- Mirabilis Design announces the first Application-Specific University Program (Jul 09, 2020)
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- Imagination announces XS, the automotive industry's most advanced GPU IP (Jul 08, 2020)
- Arm intends to strengthen focus on core semiconductor IP business growth (Jul 08, 2020)
- Arm intends to strengthen focus on core semiconductor IP business growth (Jul 08, 2020)
- Synaptics to Acquire Rights to Broadcom's Wireless IoT Connectivity Business (Jul 08, 2020)
- SmartDV Broadens Support for Arm AMBA Protocol with Verification IP Solutions for AMBA CHI, CXS, LPI (Jul 08, 2020)
- Soitec announces POI substrates business agreement with Qualcomm Technologies for 5G RF filters (Jul 08, 2020)
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- Imagination推出汽车行业最先进的XS图形处理器（GPU）知识产权（IP）产品 (Jul. 08, 2020)
- Synaptics将以2.5亿美元收购博通的无线物联网业务 (Jul. 08, 2020)
- Apple to Start Mass Producing Self-Designed Mac SoC, Projected to Cost under US$100, in 1H21, Says TrendForce (Jul 07, 2020)
- Imagination announces latest licensing deal with NXP (Jul 07, 2020)
- videantis processor platform adopted for TEMPO neuromorphic edge AI chip (Jul 07, 2020)
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- 行业首发|芯动科技基于SMIC 14nm工艺的多款高速接口IP研发及量产成功 (Jul. 06, 2020)
- GUC Monthly Sales Report - June 2020 (Jul 06, 2020)
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- Global Semiconductor Sales Increase 5.8 Percent Year-to-Year in May; Annual Sales Projected to Increase 3.3 Percent in 2020, 6.2 Percent in 2021 (Jul 06, 2020)
- Ingenic Semiconductor integrates Allegro DVT Encoding IP into Next-Generation Smart-Video System-On-Chip Solutions (Jul 06, 2020)
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- Creonic joins partnership with the University of Bremen to expand the development of Artificial Intelligence (Jul 06, 2020)
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- TSMC November 2019 Revenue Report (Dec 10, 2019)
- Andes Technology and Deeplite, INC. Join Forces To Deploy Highly Compact Deep Learning Models Into Daily Life (Dec 10, 2019)
- Codasip Teams Up with Western Digital to Support Adoption of Open?Source Processors (Dec 10, 2019)
- NSITEXE Selects SmartDV TileLink Verification IP for RISC-V Based Applications (Dec 10, 2019)
- 台积电3nm工艺进展"令人欣慰" 2nm工艺提上日程！ (Dec. 10, 2019)
- Verimatrix Completes Sale of its Silicon IP Business Unit to Rambus (Dec 09, 2019)
- Xilinx Issues Statement in Response to Analog Devices Patent Infringement Lawsuit (Dec 09, 2019)
- Rambus Completes Acquisition of the Verimatrix Silicon IP, Secure Protocols and Provisioning Business (Dec 09, 2019)
- UltraSoC donates RISC-V trace implementation to enable true open-source development (Dec 09, 2019)
- WiLAN Subsidiary and CXMT Enter into License and Acquisition Agreements (Dec 09, 2019)
- GUC Monthly Sales Report - Nov 2019 (Dec 09, 2019)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2019 (Dec 09, 2019)
- Andes Corvette-F1 N25 Platform Becomes one of the first RISC-V Platforms Qualified for Amazon FreeRTOS (Dec 09, 2019)
- UMC Reports Sales for November 2019 (Dec 09, 2019)
- Tech Industry Heavyweight Joins SiFive - Manoj Gujral Tapped As SVP & GM of Silicon Business Unit (Dec 09, 2019)
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- 剖析Imagination的A-Series GPU新架构：和高通Adreno和Arm Mali比比 (Dec. 09, 2019)
- 汽车摄像头和大屏普及趋势下，如何以创新总线连接引领视频技术升级？ (Dec. 09, 2019)
- 半导体行业发展迅猛，我国存在严重的供应链安全风险 (Dec. 09, 2019)
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- 爱立信被曝行贿5国，罚10亿美元与美国和解 (Dec. 09, 2019)
- 中芯国际关于韩国媒体涉EUV不实报道的声明 (Dec. 09, 2019)
- New Vidatronic CTO to Innovate and Scale Technology (Dec 06, 2019)
- ADC也会精神错乱？ (Dec. 06, 2019)
- SiFive To Present New Technologies At RISC-V Summit 2019 (Dec 05, 2019)
- Andes 45-Series Expands RISC-V High-end Processors 8-Stage Superscalar Processor Balances High Performance, Power Efficiency, and Real-time Determinism with Rich RISC-V Ecosystem (Dec 05, 2019)
- BrainChip and Tata Consultancy Services (TCS) jointly Present a Demonstration Featuring Its Akida Neuromorphic Technology Platform at NeurIPS 2019 (Dec 05, 2019)
- Andes certifies Imperas models and simulator as reference for new Andes RISC-V Vectors Core with lead customers and partners (Dec 05, 2019)
- Veriest marks 1st anniversary of meetup series with special event in Belgrade (Dec 04, 2019)
- Neoverse N1 makes debut in new AWS cloud instances (Dec 04, 2019)
- Third Quarter 2019 Worldwide Semiconductor Equipment Billings Jump 12 Percent, SEMI Reports (Dec 04, 2019)
- RISC-V Foundation Founding Member Andes Technology Turns Platinum (Dec 04, 2019)
- Global Semiconductor Sales Increase 2.9 Percent Month-to-Month in October; Annual Sales Projected to Decrease 12.8 Percent in 2019 (Dec 04, 2019)
- SmartDV's TileLink, Verilator VIP on Full Display at RISC-V Summit (Dec 04, 2019)
- Aldec's Active-HDL Verification Capabilities Enhanced to Support SystemVerilog Constructs and UVM (Dec 04, 2019)
- Andes Presents Ground-Breaking 27-Series Processor at RISC-V Summit 2019 (Dec 04, 2019)
- 10亿美元！苹果完成对Intel基带业务的收购 (Dec. 03, 2019)
- Mixel Announces Immediate Availability of MIPI D-PHY v2.5 IP (Dec 03, 2019)
- Think Silicon demonstrates early preview of Industry's first RISC-V ISA based 3D GPU at the RISC-V Summit (Dec 03, 2019)
- Lift off: De-RISC to create first RISC-V, fully European platform for space (Dec 03, 2019)
- SiFive Learn Inventor Development System Now AWS Qualified (Dec 03, 2019)
- UNISOC and Imagination carry out strategic cooperation on AI based on IMG Series3NX neural network accelerator (Dec 03, 2019)
- Imagination launches IMG A-Series: "The GPU of Everything" (Dec 03, 2019)
- Cadence and National Instruments Enter into Strategic Alliance Agreement to Enhance Electronic System Innovation (Dec 03, 2019)
- Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications (Dec 03, 2019)
- Intel Completes Sale of Smartphone Modem Business to Apple (Dec 02, 2019)
- UMC Announces 22nm Technology Readiness Following Silicon Validation on World's Smallest USB 2.0 Test Vehicle (Dec 02, 2019)
- Dolphin Design is ISO 9001 and EN 9100 certified (Dec 02, 2019)
- EnSilica and Macnica Europe GmbH Sign Distribution Agreement for Custom ASIC Design and Supply Services (Dec 02, 2019)
- Moortec's In-Chip Monitoring Subsystem Supports Uhnder in Groundbreaking Digital Automotive Radar-on-Chip (Dec 02, 2019)
- SiFive Announces SiFive Learn Initiative (Dec 02, 2019)
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- Creonic Participates in H2020 "VERTIGO" Research Project (Nov 28, 2019)
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- MediaTek Announces Dimensity, World's Most Advanced 5G Chipset Family, & Dimensity 1000 5G SoC (Nov 26, 2019)
- Aldec's Latest Embedded Development Platform is First to Feature Largest PolarFire and SmartFusion2 FPGAs on a Single Board (Nov 26, 2019)
- Silex Insight Introduces Video Codec IP using RAW input (CFA) (Nov 26, 2019)
- Imperas delivers highest quality RISC-V RV32I compliance test suites to implementers and adopters of RISC-V (Nov 26, 2019)
- MIT开发出基于碳纳米管FET的RISC-V微处理器 (Nov. 25, 2019)
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- MediaTek and Intel Partner to Bring 5G Connectivity to the Next Generation of PCs (Nov 25, 2019)
- S2C Delivers New Prodigy FPGA Prototyping Solutions with the Industry's Highest Capacity FPGA from Intel (Nov 25, 2019)
- WiLAN Signs Wireless License with LG (Nov 25, 2019)
- Netherlands Energy Harvesting Semiconductor Firm Nowi Reaches $14 Million in Funding (Nov 25, 2019)
- AccelerComm introduces improved channel equalisation for 5G NR at MWC Barcelona 2020 (Nov 25, 2019)
- 【芯视野】临芯投资李亚军：科创投资的术与道 (Nov. 23, 2019)
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- UVM-AMS Working Group Formed to Standardize UVM Analog/Mixed-Signal Extensions (Nov 20, 2019)
- Graphcore leveraged Mentor's Questa technologies to verify massive Colossus GC2 AI processor (Nov 20, 2019)
- Alereon Adopts Omni Design's Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications (Nov 20, 2019)
- North American Semiconductor Equipment Industry Posts October 2019 Billings (Nov 20, 2019)
- Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk "I-fuse: A Disruptive OTP Technology" (Nov 20, 2019)
- Credo Joins Open Compute Project (OCP) to Accelerate 400G and Beyond Connectivity Solutions for Hyperscale Datacenters and Telecom (Nov 20, 2019)
- ArchiTek Select SiFive and DTS-Insight To Enable Next-Generation AI Solution Development (Nov 19, 2019)
- IntelliProp to Demo World's First UPI to Gen-Z Load/Store Host Adapter at SC19 (Nov 19, 2019)
- Expanding Universe for HPC, NVIDIA CEO Brings GPU Acceleration to Arm (Nov 19, 2019)
- EasyIC Design joins Arm Approved Design Partner Program (Nov 19, 2019)
- High-speed comms options enable in-life debug and optimization for datacenter, HPC and storage customers (Nov 19, 2019)
- 中芯国际建议发行本金额200百万美元零息可换股债券 (Nov. 19, 2019)
- 使用有安全保障的闪存存储构建安全的汽车系统 (Nov. 18, 2019)
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- 今日到期，美国打算第三次向华为提供延长临时许可 (Nov. 18, 2019)
- Intel to Reclaim Number One Semiconductor Supplier Ranking in 2019 (Nov 18, 2019)
- Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP (Nov 18, 2019)
- Synopsys Custom Compiler Adopted by Samsung Foundry to Accelerate IP Design for 5LPE Process Technology with EUV Technology (Nov 18, 2019)
- NUVIA Raises $53 Million to Reimagine Silicon Design for the Data Center (Nov 18, 2019)
- Moortec To Showcase Its Latest Embedded PVT Monitoring IP For 40nm-5nm At The 2019 ICCAD in Nanjing (Nov 18, 2019)
- Intel announces open oneAPI initiative and development beta release with Data Parallel C++ language for programming CPUs, GPUs, FPGAs, and other accelerators (Nov 18, 2019)
- 传MIPS开放计划将终止：开源之路"战败"了？ (Nov. 16, 2019)
- Gyrfalcon's New Chip Raises Bar (12.6 TOPS/W) on High Performance Edge AI with Lower Power Use (Nov 15, 2019)
- Synopsys Completes Acquisition of DINI Group (Nov 15, 2019)
- Diamond Design Software from Lattice Semiconductor Enables Enhanced Security Features for MachXO3D FPGAs (Nov 15, 2019)
- ASML光刻机或延迟出货？中芯国际：影响不大 (Nov. 15, 2019)
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- 边缘AI大战一触即发 (Nov. 15, 2019)
- Arm Treasure Data导入Treasure Boxes与Custom Scripts (Nov. 15, 2019)
- FlexIC Foundry enables custom flexible integrated circuit design (Nov 14, 2019)
- New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective Packaging (Nov 14, 2019)
- Nordic Semiconductor unveils world's first dual Arm Cortex-M33 processor wireless SoC for the most demanding low power IoT applications (Nov 14, 2019)
- Gyrfalcon Technology and Sensory Deliver Enhanced AI Biometric Access on Edge Devices (Nov 14, 2019)
- Mirabilis Design unveils the first rapid prototyping platform for Artificial Intelligence Processors and Applications (Nov 14, 2019)
- 寒武纪发布边缘AI芯片思元220，全面覆盖云边端 (Nov. 14, 2019)
- RISC-V 活力搅局，IP 企业伤痕累累 (Nov. 14, 2019)
- 三星解散CPU团队，折射出ARM路线潜藏风险 (Nov. 14, 2019)
- Secure-IC and Andes Technology jointly provide cybersecurity enhanced RISC-V cores (Nov 13, 2019)
- Rambus Announces Comprehensive PCI Express 5.0 Interface Solution (Nov 13, 2019)
- Efinix Rolls Out Trion T120 FPGAs (Nov 13, 2019)
- Achronix to Showcase 7nm FPGA Solutions at SC19 (Nov 12, 2019)
- 连接工业系统和物联网： IAP（物联网访问协议）实现工业系统和云端技术的互操作性 (Nov. 12, 2019)
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- 国内中低端CIS芯片乍现缺货潮 (Nov. 12, 2019)
- New Smart Meter using Adesto's Memory and Communications Technologies Begins Pilot Program in Africa and Middle East (Nov 12, 2019)
- SMIC Reports 2019 Third Quarter Result (Nov 12, 2019)
- Xilinx Vitis Unified Software Platform Now Available for Download (Nov 12, 2019)
- Aerendir Mobile Inc. and SiFive Inc. Collaborate to Accelerate the Adoption of AI-Enabled Processors (Nov 12, 2019)
- Synopsys DesignWare ARC Data Fusion IP Subsystem Incorporated by Himax in Their Artificial Intelligence WiseEye ASIC (Nov 12, 2019)
- Rianta Releases Ethernet MAC/PCS/FEC IP Suite for ASICs targeting Datacenter, Networking and 5G Mobile Infrastructure (Nov 12, 2019)
- Blaize Emerges from Stealth to Transform AI Computing (Nov 12, 2019)
- Xilinx Announces the World's Highest Performance Adaptive Devices for Advanced ADAS and AD Applications (Nov 12, 2019)
- GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio (Nov 12, 2019)
- Mentor introduces Tessent Safety ecosystem to meet IC test requirements of the autonomous vehicles era (Nov 12, 2019)
- Silicon Wafer Area Shipments Fall for Fourth Consecutive Quarter (Nov 12, 2019)
- Q3产能接近满载！中国区营收超6成，中芯国际开始重启成长 (Nov. 12, 2019)
- Palma Ceia SemiDesign to Showcase Complete NB-IoT Solution during Synopsys ARC Processor Summit in Beijing (Nov 11, 2019)
- Arasan Announces MIPI D-PHY IP compliant to the latest MIPI D-PHY v2.1 Specifications for TSMC 16nm (Nov 11, 2019)
- MediaTek Delivers 112G Long Range SerDes IP, Silicon-Proven on 7nm for ASIC Services (Nov 11, 2019)
- Synopsys to Acquire Certain IP Assets from eSilicon (Nov 11, 2019)
- Accolade Technology Partners with Titan IC in Search Acceleration on FPGA-based SmartNICs and ATLAS Packet Conditioners (Nov 11, 2019)
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- AI与IoT的集大成：紫光展锐用AIoT赋能万物互联 (Nov. 09, 2019)
- UMC Reports Sales for October 2019 (Nov 08, 2019)
- MediaTek's World-Leading 8K DTV SoC in Volume Production on TSMC 12FFC Technology (Nov 08, 2019)
- TSMC October 2019 Revenue Report (Nov 08, 2019)
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- SmartDV to Exhibit at SemIsrael Expo, ICCAD China 2019 (Nov 07, 2019)
- 传中芯订购EUV设备交付被延期，ASML官方回应 (Nov. 07, 2019)
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- Announcing OpenTitan, the First Transparent Silicon Root of Trust (Nov 06, 2019)
- Rambus Reports Third Quarter 2019 Financial Results (Nov 05, 2019)
- IAR Systems delivers development from device to cloud through integration with Amazon Web Services (Nov 05, 2019)
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- AdaCore Introduces Support for C++ Embedded Environments (Nov 05, 2019)
- Dream Chip Technologies (DCT) joins the Arm Functional Safety Partnership Program (Nov 05, 2019)
- GUC Monthly Sales Report - Oct 2019 (Nov 05, 2019)
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- Innosilicon's Broad IP Portfolio Qualified on GLOBALFOUNDRIES 12LP FinFET Platform for High-Performance Applications (Oct 24, 2019)
- TensorFlow gets native support for PowerVR GPUs via optimised open-source SYCL libraries (Oct 24, 2019)
- Renesas Expands Access to Portfolio of Leading-Edge IP Licenses (Oct 24, 2019)
- VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX for Edge AI and IoT Applications (Oct 24, 2019)
- SiFive Announces New SiFive Shield For Modern SoC Design (Oct 24, 2019)
- AES Encryption IP Cores from CAST Receive NIST Certification (Oct 24, 2019)
- Veriest experts presenting at DVCon Europe Conference (Oct 24, 2019)
- 中国内存产业真的能实现自给自足吗？ (Oct. 24, 2019)
- 光子芯片技术又见突破 (Oct. 24, 2019)
- Exynos980到990发布时差不足两月 三星真的很着急 (Oct. 24, 2019)
- New Arm IP brings intelligent, immersive experiences to mainstream markets (Oct 23, 2019)
- Cadence Announces First-to-Market NVMe 1.4 Verification IP for High-Performance Computing (Oct 23, 2019)
- BrainChip Awarded New Patent for Artificial Intelligence Dynamic Neural Network (Oct 23, 2019)
- Astera Labs Accelerates PCI Express 5.0 System Deployment in Collaboration with Intel and Synopsys (Oct 23, 2019)
- 全新Arm IP为主流市场带来智能沉浸式体验 (Oct. 23, 2019)
- OPENEDGES and INNOSILICON unveil advanced DDR Controller and DDR PHY integrated IP solutions (Oct 22, 2019)
- Cadence Reports Third Quarter 2019 Financial Results (Oct 22, 2019)
- USC ISI The MOSIS Service and Samsung Foundry collaborate to spur microelectronics innovation in the US (Oct 22, 2019)
- Synopsys Launches New ARC VPX DSP Processor IP for High-performance Signal Processing SoC Designs (Oct 22, 2019)
- CEVA Celebrates Wireless IoT Milestone, Surpassing 100 Licensing Deals for its Bluetooth and Wi-Fi Technologies (Oct 22, 2019)
- Chips&Media Delivers The World's First Commercial AV1 Hardware Decoder IP, WAVE510A (Oct 22, 2019)
- PHY Wireless Launched to Address Today's Real World Cellular Location and Capacity Challenges (Oct 22, 2019)
- Microchip's Low-Power Radiation-Tolerant (RT) PolarFire FPGA Enables High-Bandwidth Space Systems with Lower Total System Cost (Oct 22, 2019)
- Rambus Closes Sale of Payments and Ticketing Businesses to Visa (Oct 22, 2019)
- 增加并隔离信任根以实现芯片设计的更高安全性 (Oct. 21, 2019)
- DeepMind的团队让AI系统绘出人脸画像，AI要抢画家饭碗了？ (Oct. 21, 2019)
- 车联网时代基于硬件的车辆安全解决方案 (Oct. 21, 2019)
- 特斯拉或发明能续航百万英里的电动汽车电池 (Oct. 21, 2019)
- 中国公民在美获刑40个月，因向中国非法出口技术？ (Oct. 21, 2019)
- 已有美国公司与华为磋商购买5G技术 (Oct. 21, 2019)
- 全球不到 10 家，中芯国际四年从 28nm 飞跃至 14nm (Oct. 21, 2019)
- 硅谷数模全球总部正式落户苏州！ 立足本土市场开启全新征程 (Oct. 21, 2019)
- 特斯拉在欧洲和中国这么受欢迎？特斯拉直接延长美国Model 3的交付时间 (Oct. 21, 2019)
- 滴滴自动驾驶年底落地，安全问题能解决吗？ (Oct. 21, 2019)
- 硅谷数模全球总部正式落户苏州！ 立足本土市场开启全新征程 (Oct. 21, 2019)
- 高通首席技术官：5G+AI是至关重要的组合 (Oct. 21, 2019)
- 因爱立信、诺基亚 5G 价格高，美国要购买华为 5G？ (Oct. 21, 2019)
- Samsung wants to rally more fabless customers (Oct 21, 2019)
- TSMC Recognizes Synopsys with Four "Partner of the Year" Awards (Oct 21, 2019)
- Cadence Automotive Reference Flow Certified by Samsung Foundry for Advanced-Node Design Creation (Oct 18, 2019)
- Cadence 3D-IC Advanced Packaging Integration Flow Certified by Samsung Foundry for its 7LPP Process Technology (Oct 18, 2019)
- 法国半导体公司Soitec公布2020财年Q2业绩：营收1.39亿欧元，同比增长46% (Oct. 18, 2019)
- 无人驾驶汽车需要透明窗口显示 (Oct. 18, 2019)
- 华为海思首次对外出售4G通信芯片Balong 711 (Oct. 18, 2019)
- The Benefits of C-Fuse OTP in IoT, FinTech, and Biometric Applications with High Security Feature (Oct 17, 2019)
- TSMC Reports Third Quarter EPS of NT$3.90 (Oct 17, 2019)
- X-FAB Adds Non-Volatile Memory Functions to its 180nm BCD-on-SOI Platform (Oct 17, 2019)
- Wafer Capacity by Feature Size Shows Rapid Growth at <10nm (Oct 17, 2019)
- SmartDV Heads to DVCon Europe to Showcase VIP Support for Verilator and TileLink, Demonstrate Smart ViPDebug Protocol Debugger (Oct 17, 2019)
- Confidential Computing Consortium Establishes Formation with Founding Members and Open Governance Structure (Oct 17, 2019)
- M31 Memory Compiler and GPIO are certified with ASIL-D safety level of ISO 26262 (Oct 17, 2019)
- Silex Insight Introduces Hardware Security Module (HSM) for Xilinx FPGA Devices (Oct 17, 2019)
- SEAKR Selects Rambus SerDes and Security IP for Aerospace and Satellite Communications (Oct 17, 2019)
- Synopsys Design Platforms Enabled for Samsung Foundry 2.5D-IC Multi-Die Integration (Oct 17, 2019)
- Locix using Imagination's Ensigma Wi-Fi IP for high-performance local positioning (Oct 17, 2019)
- Lattice MachXO3D Secure Control FPGA Receives Security Certification from NIST (Oct 17, 2019)
- Samsung Foundry and Synopsys Deliver Comprehensive Automotive Solutions for Autonomous Driving and ADAS (Oct 17, 2019)
- Cadence Custom/AMS Flow Certified for Samsung 5LPE Process Technology (Oct 17, 2019)
- sureCore PowerMiser Low Power SRAM IP Now on Samsung 28nm FDS Process Technology (Oct 16, 2019)
- Silicon IP Provider Allegro DVT Acquires Amphion Semiconductor to Create a New Leader in the Video Codec IP Space (Oct 16, 2019)
- CHIPS Alliance Growth Continues With New Members and Design Workshop this November (Oct 16, 2019)
- Numem Inc. Exhibits at Samsung Foundry SAFE FORUM 2019 (Oct 16, 2019)
- Brite Semiconductor Begins Mass Production of Smart Meter Chips (Oct 16, 2019)
- QuickLogic Teams with SiFive to Make eFPGA Technology Available via DesignShare Portfolio (Oct 16, 2019)
- Synopsys Introduces Native Automotive Solutions Optimized for Efficient Design of Autonomous Driving and ADAS SoCs (Oct 15, 2019)
- NXP to Adopt Synopsys' Native Automotive Design Solutions for Next-generation Safety-critical SoCs (Oct 15, 2019)
- Imagination announces second generation IEEE 802.11n Wi-Fi IP designed for low-power applications (Oct 15, 2019)
- Mercury Systems Announces Strategic Investment in Trusted Microelectronics Technology Innovation (Oct 15, 2019)
- BrainChip Introduces First in a Revolutionary New Breed of Neuromorphic Computing Devices at the Linley Processor Conference (Oct 15, 2019)
- 华为5G天线白皮书提出三大产业趋势 (Oct. 14, 2019)
- AI和异构集成给EDA厂商带来哪些设计挑战？ (Oct. 14, 2019)
- GLOBALFOUNDRIES Acquires Smartcom's PDK Engineering Team to Expand Worldwide Design Enablement Capacity (Oct 14, 2019)
- Arm Responds to RISC-V, and More (Oct 14, 2019)
- 美中貿易戰兩面刃 泰國提升經濟體質分散風險 (Oct. 13, 2019)
- 当汽车被黑客攻击成为常态，当汽车网络安全测试初露头角 (Oct. 11, 2019)
- 你的AI芯片有自己的DNN吗？ (Oct. 11, 2019)
- 2019 Microprocessor Slump Snaps Nine Years of Record Sales (Oct 11, 2019)
- GLOBALFOUNDRIES and Racyics GmbH Demonstrate Ultra-Low-Power Microcontroller for the Internet of Things (Oct 10, 2019)
- GLOBALFOUNDRIES Brings New Level of Security and Protection on 22FDX Platform for Connected Systems (Oct 10, 2019)
- Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich (Oct 10, 2019)
- GLOBALFOUNDRIES Qualifies Synopsys Fusion Design Platform on 12LP FinFET Platform (Oct 10, 2019)
- Achronix, Cisco, Facebook, Netronome, NXP and zGlue Collaborate on Proof-of-Concept for Chiplet Solutions as Part of OCP ODSA Subproject (Oct 10, 2019)
- 5G时代的耗电和发热，或将有由EUV缓解 (Oct. 10, 2019)
- 英特尔AI团队正研发基于AI技术的智能脊柱接口 (Oct. 10, 2019)
- 嵌入式平台上的自动音频接口测试 (Oct. 10, 2019)
- ARM为Cortex M系列内核加入自定义指令集功能 为了应对RISC-V的挑战 (Oct. 10, 2019)
- Arm为何一定要置RISC-V架构于死地？ (Oct. 10, 2019)
- Arm and silicon partners collaborate on IoT development through new Mbed OS Partner Governance model (Oct 09, 2019)
- LG Launched Phone Powered by Gyrfalcon Technology Inc.'s AI Chip (Oct 09, 2019)
- Collaborating for an autonomous future: Arm and industry leaders establish the Autonomous Vehicle Computing Consortium (Oct 09, 2019)
- Cadence Collaborates with Arm and Samsung Foundry on Delivery of 5LPE Flow for Mission-Critical Applications Using Next-Generation "Hercules" CPU (Oct 09, 2019)
- TSMC September 2019 Revenue Report (Oct 09, 2019)
- CCIX Consortium Releases CCIX Base Specification Revision 1.1 Version 1.0 with Support for 32GT/s (Oct 09, 2019)
- Arm Announces Custom Instructions for embedded CPUs and Mbed OS Partner Governance (Oct 09, 2019)
- UMC Reports Sales for September 2019 (Oct 09, 2019)
- A Total Compute approach to delivering digital immersion under a common architecture (Oct 09, 2019)
- Renesas Electronics Unveils RA Family of 32-Bit Arm Cortex-M Microcontrollers with Superior Performance and Advanced Security for Intelligent IoT Applications (Oct 09, 2019)
- 车主指控特斯拉，电池组缺陷导致自燃 (Oct. 09, 2019)
- 『全球CEO峰会』重磅演讲者：吴雄昂详解Arm新生态与计算新纪元 (Oct. 09, 2019)
- Synopsys, Arm, and Samsung Foundry Enable Accelerated Development of Next-Generation Arm "Hercules" Processor on 5LPE Process (Oct 08, 2019)
- Silex Insight and Medium Inc. accelerate towards 1 million ECDSA signature verifications per second on a blockchain (Oct 08, 2019)
- IC'Alps joins Arm Approved Design Partner program to better support customers with ASIC development (Oct 08, 2019)
- Dream Chip Technologies joined Samsung Foundry's Design Solution Partner (DSP) Program (Oct 08, 2019)
- Qorvo Acquires Cavendish Kinetics, Inc. (Oct 08, 2019)
- UltraSoC announces next-generation hardware-based cybersecurity products (Oct 08, 2019)
- Mentor boosts 64-bit Arm-based server platform by enabling Arm architecture support for Questa simulation tools (Oct. 08, 2019)
- MIPI Alliance Advances Activities for ADAS, ADS and Other Automotive Applications (Oct. 08, 2019)
- GUC Monthly Sales Report - Sep 2019 (Oct 07, 2019)
- Achronix Exhibits High-Performance FPGA and eFPGA IP Solutions at Arm TechCon (Oct 07, 2019)
- TSMC's N7+ Technology is First EUV Process Delivering Customer Products to Market in High Volume (Oct 07, 2019)
- Adesto Engages with the European Space Agency to Develop Next-Generation Satellite Communications Technology (Oct 07, 2019)
- Moortec to Showcase its Latest Embedded PVT Monitoring IP for 40nm-5nm at the 2019 ARM TechCon in San Jose (Oct 07, 2019)
- Dialog Semiconductor to Acquire Creative Chips adding Industrial IoT Products to its Portfolio (Oct 07, 2019)
- Synopsys Announces Industry-First Unified Functional Safety Verification Solution to Accelerate Time-to-Certification for IPs and SoCs (Oct 07, 2019)
- Synopsys to Showcase Optimized Solutions for Arm-based Designs at Arm TechCon 2019 (Oct 07, 2019)
- ESA Contract Awarded for High-Performance Compute Board (Oct. 07, 2019)
- Verimatrix nTitleMe Receives Perfect Score from Broadband Technology Report’s Diamond Technology Reviews 2019 (Oct. 07, 2019)
- 台積電創高引爆4大亮點 (Oct. 06, 2019)
- 5G元年即将过去，在接下来的五年内，5G会发生些什么？ (Oct. 06, 2019)
- 創意電子民國108年9月份營收報告 (Oct. 05, 2019)
- 半导体行业与七大巨鲸共游 (Oct. 05, 2019)
- CAN to TSN Gateway from CAST Bridges CAN 2.0/FD Buses with Time Sensitive Ethernet (Oct 04, 2019)
- 海豚设计网络研讨会：利用新的秘密技术，突破SoC的能效极限 (Oct. 04, 2019)
- 中国计算机产业：从追赶到领先 从未放弃自主CPU的研制 (Oct. 04, 2019)
- IP Controller Core CAN 2.0b and CAN FD of Fraunhofer IPMS certified according to ISO security standard (Oct 03, 2019)
- NXP Launches the GHz Microcontroller Era (Oct 03, 2019)
- Synopsys Completes Acquisition of QTronic GmbH (Oct 03, 2019)
- Los Alamos National Laboratory Teams with Arm to Develop Tailored, Efficient Processor Architectures (Oct 03, 2019)
- Silicon Creations Named 2019 TSMC Partner of the Year for Analog / Mixed-Signal IP (Oct 03, 2019)
- 微软Surface Pro X能否为Arm处理器在PC市场赢得一席之地？ (Oct. 03, 2019)
- Adesto and Cadence Collaborate to Expand xSPI Ecosystem for Emerging IoT Devices (Oct 02, 2019)
- M31 Technology Won TSMC's 2019 Partner of the Year Award for Specialty Process IP (Oct 02, 2019)
- Xilinx Announces Vitis - a Unified Software Platform Unlocking a New Design Experience for All Developers (Oct 02, 2019)
- M31獲頒2019年台積電特殊製程矽智財合作夥伴獎 (Oct. 02, 2019)
- TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide (Oct 01, 2019)
- Gen-Z Physical Layer Specification 1.1 now available for download (Oct 01, 2019)
- HDL Design House Appoints Frank Werner as Worldwide Sales Director (Oct 01, 2019)
- SmartDV Adds Support for Verilator Open Source HDL Verilog Simulator (Oct 01, 2019)
- Andes Technology and Tiempo Secure Announce Strategic Partnership to Enhance RISC-V Platform Security up to CC EAL5+ Certification (Oct 01, 2019)
- Global Semiconductor Sales Down 15.9 Percent Year-to-Year in August (Oct 01, 2019)
- 余承东回应华为6G研发：还在研发中，预计还需10年时间 (Sept. 30, 2019)
- 携手阿里共同"杀入"IoT市场 汇顶科技实力究竟有多强？ (Sept. 30, 2019)
- Titan IC to Accelerate Pattern and String Matching on Mellanox's New BlueField-2 I/O Processing Unit (IPU) Device (Sep 30, 2019)
- Synopsys Introduces PrimeECO Solution for Zero-Iteration Signoff-Driven Design Closure (Sep 30, 2019)
- Live webinar from Dolphin Design: Pushing the limit of SoC energy efficiency with a NEW secret technique (Sep 30, 2019)
- SiFive Enables Embedded Vision With New DesignShare Partners (Sep 30, 2019)
- New Lattice CrossLinkPlus FPGAs Accelerate and Enhance Video Bridging for World-class MIPI-based Embedded Vision Systems (Sep 30, 2019)
- XMOS secures $19M funding to accelerate growth (Sep 30, 2019)
- UltraSoC selected by Japan's NSITEXE for automotive development (Sep 30, 2019)
- Huawei & Arm Meet Behind Closed Doors (Sep 30, 2019)
- Total Wafer Shipments to Drop 6 Percent in 2019, Resume Growth in 2020, Set New High in 2022, SEMI Reports (Sep 30, 2019)
- 淡定看待千亿市值，汇顶加码研发布局物联网 (Sept. 30, 2019)
- 2G到5G SA通吃，华为发布业界首个全容器化5G核心网 (Sept. 29, 2019)
- 赛昉科技结合跃昉科技助力格兰仕集团推出首款RISC-V家电物联网模组 (Sept. 29, 2019)
- 5G射频频谱的极致延伸，绝缘硅已无力独自承担 (Sept. 29, 2019)
- ST的前身，是这家神秘机构的"子公司" (Sept. 29, 2019)
- 从7纳米过渡到5纳米，EUV微影技术的最佳时间点到了？ (Sept. 29, 2019)
- 台积电和ARM联合展示首款基于7nm中介层的多芯片系统 为高性能计算领域设计 (Sept. 28, 2019)
- 印度IC设计产业春天来了？ (Sept. 28, 2019)
- 汽车厂商有必要软硬件全部自己来做吗？ (Sept. 27, 2019)
- Achronix加入台积电半导体知识产权（IP）联盟计划 (Sept. 27, 2019)
- 任正非：5G技术只卖给美国 (Sept. 27, 2019)
- New Version of Most Widely Used Camera and Imaging Interface - MIPI CSI-2 - Designed to Build Capabilities for Greater Machine Awareness (Sep 27, 2019)
- Multiple Mentor product lines now certified on TSMC's most advanced processes (Sept. 27, 2019)
- Sofics releases pre-silicon analog I/O's for high-speed SerDes for TSMC N5 process technology (Sept. 27, 2019)
- Data Compression Accelerators from CAST Now Available on Xilinx Alveo Boards (Sep 27, 2019)
- GLOBALFOUNDRIES Appoints Michael Hogan as SVP and General Manager to Support New Market Engagement Strategy (Sep 27, 2019)
- 是谁在撬动 ADAS 市场？ (Sept. 27, 2019)
- AGIC C-Fuse为AEC-Q100 Grade 0车规等级量身订做的OTP解决方案 (Sept. 26, 2019)
- Analog Bits Showcases Silicon of Analog and Mixed Signal IP Products on TSMC N7 Process Targeting Automotive Grade with Split Corner Lots and PVT Characterization Results Available (Sept. 26, 2019)
- Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform Ecosystem Forum in Santa Clara (Sep 26, 2019)
- Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements (Sept. 26, 2019)
- Truechip Announces First Customer Shipment of CXL Verification IP (Sep 26, 2019)
- Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process (Sep 26, 2019)
- Lattice Semiconductor and Synopsys Renew Partnership on FPGA Synthesis Tools (Sep 26, 2019)
- Rambus Tapes Out 112G XSR SerDes PHY on Leading-edge 7nm Process (Sept. 26, 2019)
- Arm and TSMC Demonstrate Industry's First 7nm Arm-based CoWoS Chiplets for High-Performance Computing (Sept. 26, 2019)
- SiFive Announces Key Enablement Of Trace And Debug (Sept. 26, 2019)
- TSMC's Leading-Edge Fab Investments Set Stage for Sale Surge in 2H19 (Sep 26, 2019)
- Andes and Dover Microsystems Partner to Deliver Professional Network Security Solution for RISC-V (Sept. 26, 2019)
- Adesto Reaches Shipment Milestone of One Billion Non-Volatile Memory Devices (Sept. 26, 2019)
- 格芯推出12LP+ FinFET制程，2021年正式量产 (Sept. 26, 2019)
- 解读Arm与华为的闭门会议透露的三点"不变"的讯息 (Sept. 26, 2019)
- 云服务器FPGA架构及其电源方案初探 (Sept. 26, 2019)
- Wave Computing CEO离职，MIPS架构前途堪忧 (Sept. 26, 2019)
- 联电获准100％并购日本富士通12吋厂 (Sept. 26, 2019)
- 自下而上，从应用现状看FD-SOI技术发展 (Sept. 26, 2019)
- 余承东：华为开始从国内厂采购元器件，培养国内产业链 (Sept. 26, 2019)
- Analog Bits and Aragio Solutions Team Up with GLOBALFOUNDRIES to Deliver Automotive IP Solutions (Sep 25, 2019)
- 阿里巴巴发布全球最强AI芯片，芯云战略终成型！ (Sept. 25, 2019)
- Breker Verification Systems Unveils Intelligent Regression Optimization Solution to Accelerate Simulation, Emulation Execution (Sep 25, 2019)
- Synopsys Extends Portfolio of Cloud Computing IP with 112G Ethernet PHY for Hyperscale Data Center SoCs (Sept. 25, 2019)
- GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications (Sep 25, 2019)
- Veriest announces opening of Budapest office (Sep 25, 2019)
- CEO Leaves Wave, Putting MIPS' Future in Doubt (Sep 25, 2019)
- M31 Technology Develops Optimized IP Solutions on Multiple TSMC Specialty Processes (Sept. 25, 2019)
- UMC Receives Final Approval for 100% Acquisition of Mie Fujitsu Semiconductor (Sep 25, 2019)
- European Space Agency Selects AdaCore's Qualified Multitasking Solution for Spacecraft Software Development (Sep 25, 2019)
- Kandou Secures $56 Million in Series C Funding (Sep 25, 2019)
- Achronix Joins TSMC IP Alliance Program (Sep 25, 2019)
- Evaluation Boards Now Available for Flex Logix EFLX4K eFPGA on GLOBALFOUNDRIES' Most Advanced FinFET Platform (Sept. 25, 2019)
- Cadence Digital and Signoff Full Flow and Custom/Analog Tools Certified for TSMC N6 and N5/N5P Process Technologies (Sept. 25, 2019)
- China is eroding the U.S. edge in AI and 5G (Sept. 25, 2019)
- eMemory Wins 2019 TSMC IP Partner of the Year Award (Sep 24, 2019)
- Andes Technology Features 32-bit A25MP and 64-bit AX25MP RISC-V Multicore Processors With Andes Custom Extension at TSMC 2019 Open Innovation Platform Ecosystem Forum (Sep 24, 2019)
- CSEM joins GLOBALFOUNDRIES' FDXcelerator Program bringing ultra-lowPower IP to 22FDX process (Sep 24, 2019)
- Silicon Creations to Showcase PLL Developments on 22nm to 5nm Processes at TSMC 2019 Open Innovation Platform Ecosystem Forum (Sep 24, 2019)
- Moortec Drives Optimised Performance & Increased Device Reliability on TSMC's N5 and N5P Process Technologies with its Complete In-Chip Monitoring Subsystem (Sep 24, 2019)
- GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications (Sept. 24, 2019)
- 第一届中国 RISC-V 论坛 – "征稿通知" (Sept. 24, 2019)
- FD-SOI的低功耗，究竟有什么用？ (Sept. 23, 2019)
- 北京超8800个5G基站完成布局 5G加速走进千家万户 (Sept. 23, 2019)
- Avery Design Partners with Marquee Semiconductor to Provide Sales, Support in India, and Deepens its Relationship to Prime Marquee's SoC Solution Platform (Sep 23, 2019)
- Cambridge Consultants Becomes Arm Approved Design Partner (Sep 23, 2019)
- IAR Systems launches functional safety tools for STMicroelectronics' 8-bit MCUs (Sep 23, 2019)
- Avery Design Introduces CXL VIP (Sep 23, 2019)
- North American Semiconductor Equipment Industry Posts August 2019 Billings (Sep 23, 2019)
- Rambus Announces Portfolio of Advanced Memory and SerDes PHYs on TSMC N7 Process (Sep 23, 2019)
- eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects (Sep 23, 2019)
- Spectral Design and Test Inc., Announces a New Family of MemoryIP Targeted at the 5G Market (Sep 23, 2019)
- Dolphin Integration becomes Dolphin Design (Sep 23, 2019)
- 台积电5纳米需求超预期，或提前到明年3月量产 (Sept. 23, 2019)
- TowerJazz接盘成都格芯 扩充RF SOI产能迎接5G (Sept. 23, 2019)
- 8周！中国初创公司首颗自研AI芯片变成量产机 (Sept. 21, 2019)
- 『全球CEO峰会』重磅演讲者：Graphcore CEO：Nigel Toon的英国情结 (Sept. 21, 2019)
- Alphawave IP Announces Industry Veteran and Marvell Founder Dr. Sehat Sutardja Has Joined Its Board of Directors (Sep 20, 2019)
- Xilinx Announces Chief Financial Officer Transition (Sept. 20, 2019)
- Intel Ships Stratix 10 DX FPGAs; VMware Among Early Partners (Sept. 20, 2019)
- CAST CAN 2.0/FD Bus IP is Safety-Ready with ISO 26262 Certification (Sept. 20, 2019)
- Attopsemi Technology Presented "I-fuse: Dream OTP Finally Comes True" and won the best Innovative IP award on IP SoC 2019 China (Sep 20, 2019)
- 长鑫DRAM投产，首次公开源自奇梦达的技术细节 (Sept. 20, 2019)
- 详解SPICE模型的优点和缺点 (Sept. 20, 2019)
- 模组厂商破局需多方并进 4G、5G模组将长期共存 (Sept. 20, 2019)
- Semiconductor Acquisitions Regain Momentum in 2019 (Sept. 19, 2019)
- ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies (Sep 19, 2019)
- Intensivate Engages SiFive's RISC-V Expertise to Develop Leading Accelerator (Sept. 19, 2019)
- SEGGER Makes Its Entire Ecosystem of Tools Available for AndesCores (Sept. 19, 2019)
- DDR5 插槽连接器如何为下一代技术助力 (Sept. 19, 2019)
- 从A股十大市值纯芯片设计公司等企业看芯片设计业发展 (Sept. 19, 2019)
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- Veriest kick-starts Formal Verification methodology at Valens (Sept. 18, 2019)
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- ESD Alliance Reports EDA Industry Revenue Increase for Q2 2019 (Sep 17, 2019)
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- Synopsys' New Embedded Vision Processor IP Delivers Industry-Leading 35 TOPS Performance for Artificial Intelligence SoCs (Sep 16, 2019)
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- Arm Flexible Access for Research to accelerate innovation for academia and research (Sep 16, 2019)
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- AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable (Sep 16, 2019)
- GOWIN Semiconductor Announces their GoAI Solution for AI Acceleration at the Edge (Sept. 16, 2019)
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- Second Quarter 2019 Worldwide Semiconductor Equipment Billings of $13.3 Billion Down 20 Percent from 2018, 3 Percent from Prior Quarter (Sep 12, 2019)
- Silex Insight releases ARIA crypto engine for the Korean market (Sept. 12, 2019)
- AI Chip Market to More than Double in 5 Years (Sep 12, 2019)
- MIT engineers build advanced microprocessor out of carbon nanotubes (Sep 12, 2019)
- Verimatrix signs a binding agreement to sell its Silicon IP business unit to Rambus (Sep 12, 2019)
- Rambus Signs Agreement to Acquire Silicon IP and Secure Protocols Business from Verimatrix (Sep 12, 2019)
- Synopsys Delivers Industry's First Compute Express Link (CXL) IP Solution for Breakthrough Performance in Data-Intensive SoCs (Sept. 11, 2019)
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- MIPI Alliance Opens Access to its Debug and Trace Specifications (Sep 11, 2019)
- JEDEC Announces Publication of Serial Presence Detect Support and Module Labels Specifications to Support New Hybrid Memory (NVDIMM) (Sep 11, 2019)
- HCL Technologies to acquire Sankalp Semiconductor to enhance leadership in the semiconductors and industrial IoT spaces (Sep 10, 2019)
- Swift Navigation Partners with Arm to Bring Precise Positioning Technology to Autonomous Vehicle Compute Platforms (Sep 10, 2019)
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- Memory Forecast to Account for 43% of Total 2019 Semi Spending (Sep 10, 2019)
- NOR Flash满足汽车与工业应用的功能安全要求 (Sept. 10, 2019)
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- TSMC August 2019 Revenue Report (Sep 10, 2019)
- PLDA Achieves PCI Express 4.0 Compliance for its XpressRICH PCIe Controller IP During the First Official PCI-SIG PCIe 4.0 Compliance Workshop (Sep 09, 2019)
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- Synopsys Collaborates with Google Cloud to Broadly Scale Cloud-based Functional Verification (Sep 09, 2019)
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- UMC Reports Sales for August 2019 (Sep 09, 2019)
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- ARM对华为"断供"怎么办？余承东：华为CPU也有"备胎"！ (Sept. 09, 2019)
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- Edgewater Expands into Licensing of Breakthrough IP (Sep 05, 2019)
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- GUC Monthly Sales Report - Aug 2019 (Sep 05, 2019)
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- InnoGrit adopts M31's optimization solutions of PCIe 4.0/3.0 and ONFi 4.1 I/O IP cores for Artificial Intelligence Storage chips (Sep 04, 2019)
- Global Semiconductor Sales Decrease 15.5 Percent Year-to-Year in July (Sep 04, 2019)
- Nations Technologies Selects QuickLogic's ArcticPro eFPGA to Power its Next Generation Low Power IoT SoC (Sep 04, 2019)
- NASA awards five 2019 SBIR/STTR Phase I research programs to Alphacore (Sep 04, 2019)
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- Rambus to Acquire Silicon IP and Secure Protocols Business From Verimatrix, Creating Global Authority in Semiconductor Security IP (Sep 04, 2019)
- VESA Updates DisplayHDR Standard with Tighter Specifications and New DisplayHDR 1400 Performance Level (Sep 04, 2019)
- IP Security Assurance Standard (Sept. 04, 2019)
- Synopsys Enables First-Pass Silicon Success of High Performance NSITEXE Data Flow Processor-based SoC Test Chip for Autonomous Driving (Sep 03, 2019)
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- 中国量产64层3D NAND闪存，明年直上128层！ (Sept. 02, 2019)
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- 英特尔开始发售10nm Agilex FPGA (Aug. 31, 2019)
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- 阿里平头哥：SoC平台"无剑"可降50%芯片设计成本 (Aug. 30, 2019)
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- 世纪大战：AC与DC重返战场 (Aug. 29, 2019)
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- SMIC Announces Unaudited 2019 Interim Results (Aug 29, 2019)
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- Sofics releases pre-silicon analog I/O's for high-speed SerDes for 5nm FinFET technology (Aug 28, 2019)
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- GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany (Aug 27, 2019)
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- sureCore Unveils Low Power Design Service (Aug 27, 2019)
- Rambus Completes Acquisition of Northwest Logic, Extending Leadership in Interface IP (Aug 27, 2019)
- GigaDevice unveils the GD32V series with RISC-V core, in a brand new 32bit general purpose microcontroller (Aug 27, 2019)
- Creonic Participates in National Research Project KI-Radar (Aug 27, 2019)
- Does Your AI Chip Have Its Own DNN? (Aug 26, 2019)
- Sofics releases analog I/O's for high-speed SerDes in TSMC N5 FinFET technology (Aug 26, 2019)
- Arasan and Xilinx announce their design win in providing a Total UFS 3.0 Solution to Wuhan Jingce (Aug 26, 2019)
- 自动驾驶汽车的机遇与不确定性 (Aug. 26, 2019)
- 小马智行宣布与丰田建立合作 进一步探索自动驾驶技术 (Aug. 26, 2019)
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- 华为发布AI处理器昇腾910，号称业界算力最强 (Aug. 23, 2019)
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- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2019 (Aug 22, 2019)
- Creonic Demonstrates its Beyond 5G FEC IP at the EuCNC Conference (Aug 22, 2019)
- Porsche Invests in Israeli Startup TriEye to Increase Road Visibility and Safety (Aug 22, 2019)
- Next Generation Video Codec Standard Proposed: MPEG Video Coding for Machines (VCM) (Aug 22, 2019)
- Qualcomm And LGE Enter Into a New Global Patent License Agreement (Aug 22, 2019)
- HDL Design House Introduces Expandable SoC IoT Platform (Aug 22, 2019)
- Xilinx Announces the World's Largest FPGA Featuring 9 Million System Logic Cells (Aug 21, 2019)
- Top-15 Semiconductor Suppliers' Sales Fall by 18% in 1H19 (Aug 21, 2019)
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- Alphacore To Develop Rad-Hard CMOS Standard Cell Library, Meeting DOD Standards, For U.S. Navy (Aug 19, 2019)
- UPMEM Puts CPUs Inside Memory to Allow Applications to Run 20 Times Faster (Aug 19, 2019)
- Arasan Chip Systems expands its storage IP Portfolio with ONFI 4.1 PHY and I/O PAD IP seamlessly integrated with its NAND Flash Controller IP for UMC 28nm SoC Designs (Aug 19, 2019)
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- eSilicon to debut AI Accelerator software and a new chiplet model at Hot Chips 2019 (Aug 15, 2019)
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- Everspin and Seagate Sign IP Patent Assignment and Licensing Agreements (Aug 12, 2019)
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- Mentor sets new software scaling benchmark for Semiconductor Design Workload on Microsoft Azure (Jun 03, 2019)
- Gyrfalcon offers Automotive AI Chip Technology (Jun. 03, 2019)
- ARM新版Mali GPU简析：这次终于赶超高通和苹果？ (Jun. 03, 2019)
- 只设计不生产的华为二级部门"海思"，是否能与美国正面"硬刚"？ (Jun. 03, 2019)
- 英商Dialog CEO：中美技术战，我站中国 (Jun. 03, 2019)
- 英飞凌敲定90亿欧元收购赛普拉斯 (Jun. 03, 2019)
- IEEE宣布解除对华为的限制 (Jun. 03, 2019)
- 【芯视野】国外巨头把持下的高端蓝牙芯片市场中国企业如何突围？ (Jun. 03, 2019)
- Avery Design Systems Announces SimCluster GLS to Accelerate Gate-Level Sign-Off Simulations (May 31, 2019)
- Avery Design Systems Announces SymXprop for X Accurate RTL Simulation (May 31, 2019)
- True Circuits Demonstrates Silicon Proven DDR 4/3 PHY at the Design Automation Conference (May. 31, 2019)
- Fab Joint Venture Seen for 200 mm (May. 31, 2019)
- 耗时三年打造，融合ASIC的全新FPGA如何做到比对手快10倍？ (May. 31, 2019)
- 4G小型基站市场终起飞，5G起步尚待时日... (May. 31, 2019)
- 亟待零突破：中国汽车半导体芯片的征程才刚刚开始 (May. 31, 2019)
- 2019全球可穿戴设备Q1出货量公布,华为增幅最大 (May. 31, 2019)
- AGIC实现AI边缘运算的关键技术——内存内运算(IMC) (May. 31, 2019)
- Pixilica Licenses SiFive's RISC-V Embedded Processor IP (May 30, 2019)
- Synopsys Extends Leadership with Enhanced Verification Continuum Platform (May 30, 2019)
- Moortec to Showcase its High Accuracy Embedded Sensing Fabric at DAC 2019 in Las Vegas (May. 30, 2019)
- Synopsys Design and Verification Solutions Enable Astera Labs to Develop Industry's First PCIe 5.0 Retimer SoC (May. 30, 2019)
- PCI-SIG Achieves 32GT/s with New PCI Express 5.0 Specification (May. 30, 2019)
- Efinix and M31 Technology Corporation Partner to Address Demand for Emerging AI Edge Computing Requirements (May 30, 2019)
- Mixel MIPI D-PHY IP Integrated into Teledyne e2v Snappy CMOS Image Sensors (May 30, 2019)
- Silvaco and Si2 Release Unique, Free 15nm Open-Source Digital Cell Library (May. 30, 2019)
- Wave Computing and Imperas Introduce New MIPS Open Simulator - MIPSOpenOVPsim (May. 30, 2019)
- NVIDIA Deploys the New Cadence Protium X1 Platform to Accelerate Software Development of Large-Capacity GPUs (May 29, 2019)
- Cadence Launches Protium X1, the First Scalable, Data Center-Optimized Enterprise Prototyping System for Early Software Development (May 29, 2019)
- 缺芯当道，手机业今天的会是汽车业明天的吗？ (May. 29, 2019)
- RISC-V是否受到管制而不能向华为出售IP？ (May. 29, 2019)
- 联发科5G SoC芯片发布：7nm工艺，内置M70调制解调器 (May. 29, 2019)
- Building China’s own chip industry will be a costly 10-year marathon, former Intel China MD says (May. 29, 2019)
- MediaTek Unveils Groundbreaking New 5G SoC for First Wave of 5G Flagship Devices (May 29, 2019)
- BrainChip Announces the Availability of Advanced AI Intellectual Property (May 29, 2019)
- Google and eSilicon at DAC 2019: Doing EDA in the Cloud? Yes, It's Possible! (May 29, 2019)
- Sofics' clipping/scaling circuit enhances reliability of Near Field Communication (NFC) and other wireless interfaces (May 28, 2019)
- Hex Five Adds MultiZone Security to the AdaCore Software Ecosystem (May 28, 2019)
- 一季度全球DRAM厂整体产值大幅下滑28.6% (May. 28, 2019)
- Arm发布新架构，大家只关心麒麟990能安排上吗？ (May. 28, 2019)
- Arm创始人Saxby爵士获得2019年IEEE创始者奖章 (May. 28, 2019)
- Synopsys Introduces PrimeYield for 100X Faster SoC Yield Analysis and Optimization (May 28, 2019)
- IC Compiler II with Advanced Fusion Technologies Delivers Optimal QoR and Reduces ECO Turnaround Time More Than 40% at Juniper Networks (May 28, 2019)
- Silvaco Announces Viola I0-X - 10X Faster I/O Pad Characterization for Nanometer Silicon (May 28, 2019)
- 减小EMI、提高密度和集成隔离是2019年电源发展的三大趋势 (May. 28, 2019)
- 芯片人才平均薪资近万元，2020年芯片人才缺口超30万 (May. 28, 2019)
- 中国市占增至50%！传华为要求三星等韩企维持零件供应 (May. 28, 2019)
- 美国打压华为是两败俱伤？这十余家海外公司严重受损 (May. 28, 2019)
- 兼具FPGA灵活性和ASIC性能：新兴AI/ML应用需要新的FPGA架构 (May. 28, 2019)
- Delivering next-generation AI experiences for the 5G world (May 27, 2019)
- TSMC to Keep Supplying Chips to Huawei (May 27, 2019)
- Faraday Showcases FinFET ASIC Solutions and SoCreative!V SoC Platform at DAC 2019 (May 27, 2019)
- Synopsys and Arm Collaborate to Enable Tapeouts by Early Adopters of Arm's Latest Premium Mobile Processors (May 27, 2019)
- Credo First to Demonstrate 7nm, 112G XSR SerDes (May 27, 2019)
- Thinci Deploys Full Cadence Verification Suite for AI Designs, Accelerating Project Schedule by Months (May. 27, 2019)
- Cadence Full-Flow Digital and Signoff Tools Optimized for New 7nm Arm Cortex-A77 CPU (May 27, 2019)
- eSilicon Technical Advisory Board Members Win Facebook Research Award (May 27, 2019)
- OneSpin's Newest App Assures Quality of RISC-V Processor Cores for Safety-, Security-Critical Applications (May 27, 2019)
- 2019年第一季全球十大封封测排名出炉 (May. 27, 2019)
- 华为遭五大标准组织 (May. 27, 2019)
- 五大标准组织围剿，对华为有何影响？ (May. 27, 2019)
- 被美国严防死守5颗电子芯片，能卖给中国算奇迹 (May. 27, 2019)
- 美国制裁面面观：不只是华为，其他国产厂商将面临什么影响？ (May. 27, 2019)
- IAR Systems takes RISC-V to the next level with launch of professional development tools with leading performance and ensured code quality (May 23, 2019)
- SmartDV Speeds Delivery of its New CXL Verification IP (May 23, 2019)
- AnalogX Launches Ultra Low Power Interconnect SerDes IP Portfolio to Fuel Next-Generation I/O Connectivity (May. 23, 2019)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2019 (May 23, 2019)
- Synopsys Announces Software-driven SoC Power Analysis Solution, Enabling 1000X Faster Time-to-Results (May 23, 2019)
- Arm Deals Massive Blow to Huawei (May 23, 2019)
- CAST Expands Popular UDP/IP Networking Cores Line (May 23, 2019)
- TSMC-Certified OIP Virtual Design Environment with Synopsys Tools Now Available on Google Cloud (May 23, 2019)
- AGIC Technology to Achieve In-Memory Computing for AI Edge Computation (May. 23, 2019)
- Synopsys Delivers 100X Faster Formal Verification Closure for AI, Graphics, and Processor Designs (May 23, 2019)
- SmartDV Unveils First Verification IP to Support Ethernet TSN (May 23, 2019)
- After 2Q19 Bottom, Expectations Increase for a 3Q19 IC Market Rebound (May 22, 2019)
- Sankalp Semiconductor to Exhibit at Design Automation Conference - 2019 (May 22, 2019)
- US Grants 90-Day Reprieve for Huawei Suppliers (May 22, 2019)
- MVSILICON License and Deploy CEVA Bluetooth IP in its latest Wireless Audio Platform (May 22, 2019)
- Arasan announces the immediate availability of its MIPI CSI-2 v2.1 IP supporting C-PHY v1.2 and D-PHY v2.1 (May 22, 2019)
- Fraunhofer IIS Licenses MPEG-H Audio Patents to LG Electronics (May 22, 2019)
- North American Semiconductor Equipment Industry Posts April 2019 Billings (May 22, 2019)
- sureCore Appoints Cedric Plomion Global Sales Director (May 22, 2019)
- US ban on Huawei delayed 90 days (May. 21, 2019)
- Innovative Logic USB IP Portfolio Strengthens RISC-V Ecosystem (May 21, 2019)
- Marvell to Acquire Avera Semi, Creating an Infrastructure ASIC Powerhouse (May 21, 2019)
- Faraday Geared Up for Data Communication Applications in ASIC Development (May 21, 2019)
- Arteris IP and Wave Computing Collaborate on Reference Architecture for Enterprise Dataflow Platform (May 21, 2019)
- ClioSoft and Silvaco Collaborate to Integrate ClioSoft's SOS Design Data Management Platform with Silvaco's Analog Custom Design Tools (May 21, 2019)
- Minima Processor names Semiconductor Veteran Tuomas Hollman as CEO (May 21, 2019)
- Achronix Introduces Ground-Breaking FPGA Family, Delivering New Levels of Performance with Adaptability for High-Bandwidth Data Acceleration Applications (May. 21, 2019)
- Smart phone breakout: discover breakthroughs in chip and 5G hardware innovation (May. 20, 2019)
- Image sensor promotes the development of embedded vision technology (May. 20, 2019)
- Intel, Qualcomm, Xilinx, and Broadcom follow up Huawei's "ban on sale" (May. 20, 2019)
- Google services are terminated! Huawei "Plan B" operating system started (May. 20, 2019)
- German semiconductor giant Infineon joins Huawei to stop supplying (May. 20, 2019)
- INGChips selects Dolphin Integration's Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash (May. 20, 2019)
- Synopsys and Kudan Collaborate to Accelerate Development of Intelligent Computer Vision Processing SoCs (May. 20, 2019)
- Cadence Palladium and Protium Platforms Enable Innovium to Accelerate First-Pass Silicon Success for the Data Center Market (May 20, 2019)
- Lattice's New MachX03D FPGA Enhances Security with Hardware Root-of-Trust Capabilities (May. 20, 2019)
- CEVA Announces Availability of SLAM Software Development Kit for CEVA-XM Intelligent vision DSPs and NeuPro AI Processors (May. 20, 2019)
- Producing stronger AI, scientists are committed to solving the mystery of human brain computing (May. 19, 2019)
- What is the enthusiasm of domestic distributors for the overseas market under the trade war? (May. 18, 2019)
- Samsung plans to launch GAA technology 3 nanometer process in 2021, surpassing TSMC and Intel (May. 17, 2019)
- lowRISC Expands and Appoints New Members to the Board of Directors from Google and ETH Zurich (May 17, 2019)
- Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung (May 17, 2019)
- Expansion of 14nm+, preparation for 10nm and 7nm, Intel CPU out of stock problem or quarterly soothing (May. 17, 2019)
- SoC chip design focuses on the "invisible champion" of security IP (May. 17, 2019)
- IDC: Global chip revenue will fall 7.2% this year (May. 17, 2019)
- Huawei was banned from the US company: 700 billion yuan in volume and 11 billion US dollars in US procurement (May. 17, 2019)
- Macron; France will not reject Huawei, and technological innovation is the right way. (May. 17, 2019)
- Intrinsic ID Secures EUR 11 Million Loan from European Investment Bank (May 17, 2019)
- New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets (May. 16, 2019)
- Making virtual more of a reality with the new Arm Mali-D77 display processor (May. 16, 2019)
- SmartDV Reduces Protocol Debug Time with Smart ViPDebug (May 16, 2019)
- How hot is the construction of China domestic fabs? Take stock of the latest developments in ten domestic fabs! (May. 16, 2019)
- Samsung 3nm is coming, but the cost is prohibitive (May. 16, 2019)
- Renewable silicon wafers grow strongly, expanding to $633 million in 2021 (May. 16, 2019)
- New quantum circuit detects the weakest radio signals (May. 16, 2019)
- Monitoring and protection design, HEV and EV power system stability (May. 16, 2019)
- Trump restricts the business cooperation between US companies and Huawei. Will Huawei become the second ZTE? (May. 16, 2019)
- Morningcore Buy Arteris® IP's FlexNoC® interconnect technology for automotive LTE-V2X modems for the Chinese market (May. 16, 2019)
- Cadence ：Vision DSPs for Imaging and Vision (May. 15, 2019)
- Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform (May 15, 2019)
- AI Chipmaker Hailo Releases Industry-Leading Deep Learning Processor (May 15, 2019)
- Silicon Labs Partners with Pulsic, Selecting Animate as Its Automated Layout Solution for Analog IC Designs (May. 15, 2019)
- Arm demonstrates new IoT test chip and board for highly efficient, secure IoT designs (May. 15, 2019)
- eSilicon Announces Production Qualification of 5G Infrastructure ASIC (May. 15, 2019)
- Cadence Tapes Out 112G Long-Reach SerDes IP on Samsung Foundry's 7LPP Process Technology (May. 15, 2019)
- Cadence Announces Broad Next-Generation Memory Standard Support in Samsung Foundry's Advanced Process Technologies (May. 15, 2019)
- Yangtze Memory Technologies mass production of 64-layer 3D NAND products at the end of the year, which may affect the price of NAND Flash next year. (May. 15, 2019)
- Unicom spent 20 billion to purchase Ericsson 5G equipment, why not choose Huawei ZTE? (May. 15, 2019)
- Intel exposes security vulnerabilities: hackers can steal PC confidential data (May. 15, 2019)
- MIPS Open further opens the lowest power microAptiv (May. 14, 2019)
- China launched a $60 billion counterattack! From June 1st, a variety of passive components and modems are subject to a tariff of up to 25%. (May. 14, 2019)
- Huawei and Samsung patent infringement series reached a settlement (May. 14, 2019)
- AWS Makes It Easier for Embedded Developers to Build IoT Applications with Additional Preconfigured Examples for FreeRTOS on Armv8-M Architectures (May. 14, 2019)
- Wave Computing Adds MIPS32 microAptiv Cores to MIPS Open Program (May 14, 2019)
- EDA Vendors Spread Wings as Market Softens (May 14, 2019)
- Eta Compute Awarded Additional Patent For Asynchronous Microprocessor Technology (May 14, 2019)
- Tiempo Secure Joins Deutsche Telekom's nuSIM Partnering Network (May 14, 2019)
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS (May 14, 2019)
- The first quarter of Global Wafer's operation is the second highest in the history. The second quarter is expected to be the same as the first quarter. (May. 13, 2019)
- 5G network explodes, the number of wireless base stations will double (May. 13, 2019)
- Synopsys:Use nature and leverage to create an amazing AI SoC (May. 13, 2019)
- $325 billion! The United States will announce the details of tariffs imposed on the "fourth round" of Chinese goods, and smartphone element providers will be hard! (May. 13, 2019)
- PowerVR GPU and NNA available on SiFive platform (May. 13, 2019)
- Agile Analog secures $5M in funding to change the semiconductor industry (May 13, 2019)
- Amphion Semiconductor introduces 4K/UHD capable AV1 video decoder hardware IP extension to its Malone video decoder family (May. 13, 2019)
- Elektrobit and Synopsys Collaborate to Accelerate Automotive Electronic System Virtual Development (May 13, 2019)
- Samsung Foundry Begins Partnership with Silvaco to Launch their Semiconductor IP Assets (May 13, 2019)
- Moortec Support Canaan Creatives Mass Production ASIC on TSMC 7nm Process (May. 13, 2019)
- Does a SCM Controller Need a Translation Table? (May 13, 2019)
- Cadence Custom/AMS Flow Certified for Samsung 28nm FD-SOI Process Technology (May. 13, 2019)
- TSMC may achieve mass-production 7nm Apple A13 chip this month (May. 12, 2019)
- Arteris IP FlexNoC Licensed by Lynxi Technologies (May. 10, 2019)
- ON Semiconductor Executive Named to Alphacore Inc. Advisory Board (May 10, 2019)
- ClioSoft Achieves TUV SUD Certification in Support of Automotive ISO 26262 Standard (May 10, 2019)
- Imagination announces ray tracing technology for licensing (May. 10, 2019)
- 2021: AMD made Zen 4 with 5nm, Intel just started 10nm? (May. 10, 2019)
- Can Arm withstand the challenges of RISC-V? (May. 10, 2019)
- Texas Instruments Widens Its Lead As World's Top Analog IC Supplier (May 10, 2019)
- TSMC April 2019 Revenue Report (May 10, 2019)
- Intel Targets 2021 for 7 nm (May 10, 2019)
- Meng Wan Zhou reappeared at the court, Huawei Canada announced three commitments (May. 09, 2019)
- Is RDIMM or LRDIMM suitable for your design? (May. 09, 2019)
- Marvell Acquires Aquantia for $452 million to strengthen automotive network business (May. 09, 2019)
- NAND Flash is seriously oversupply, and SSD is expected to replace HDD this year. (May. 09, 2019)
- SMIC Announces Q1 Financial Report, FinFET R&D is progressing smoothly (May. 09, 2019)
- SMIC Reports 2019 First Quarter Result (May 09, 2019)
- SmartDV Appoints HyperSilicon Exclusive Sales Representative in China (May 09, 2019)
- Efinix Partners with Samsung to Develop Quantum eFPGAs on 10nm Silicon Process (May 09, 2019)
- Wave Computing Appoints Industry Veteran Art Swift CEO (May 09, 2019)
- Imagination Tech to License Ray-Tracing IP as 5G Beckons (May 09, 2019)
- eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip (May 09, 2019)
- Algo-Logic Systems Delivers Ultra-Low-Latency Pre-Trade Risk Check (PTRC) Solution Powered by Xilinx (May. 09, 2019)
- UMC Reports Sales for April 2019 (May 09, 2019)
- CoreHW and RoodMicrotec to establish long-term supply chain partnership (May 09, 2019)
- ASML commercial stealing case wins: XTAL compensates 5.7 billion (May. 08, 2019)
- South Korea's mobile phone manufacturing industry is dying? There are still opportunities in the distribution market (May. 08, 2019)
- GOWIN Semiconductor Joins Arm DesignStart Offering Free Arm Cortex-M Processors for its FPGA Product Families (May 08, 2019)
- Samsung Systems LSI Business Unit Purchases ArtNos IP's FlexNoC® Interconnect Technology For digital TV chips (May. 07, 2019)
- 5G security agreement introduced without Huawei’s participation? Ministry of Foreign Affairs: Not authoritative (May. 07, 2019)
- Samsung makes another big move in the Internet of Things! New solution has been released (May. 07, 2019)
- Cycle-accurate trace boosts performance optimization capabilities of UltraSoC embedded analytics infrastructure (May 07, 2019)
- Fudan Microelectronics Group Selects Synopsys' DesignWare Bluetooth IP for Smart IoT System-on-Chips (May 07, 2019)
- eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip (May 07, 2019)
- Cadence Delivers Smart JasperGold Formal Verification Platform (May 07, 2019)
- Codasip Presence at upcoming events: China Roadshow, DAC 2019, and RISC-V Workshop Zurich (May 07, 2019)
- Arteris IP FlexNoC & Resilience Package Licensed by Semidrive for ISO 26262-Compliant Autonomous Driving Chips (May 07, 2019)
- Imitating the human brain with artificial synapses, the energy required is 1/10 of the most advanced computing system (May. 06, 2019)
- Trump sends another tweet! The semiconductor industry may be significantly affected (May. 06, 2019)
- Again Apple! The EU will officially launch an anti-monopoly investigation (May. 06, 2019)
- PRO DESIGN Launches Intel Arria 10-Based Product Family of FPGA-Based Prototyping Systems (May 06, 2019)
- ON Semi Acquiring GF Fab Deemed a Win-Win (May 06, 2019)
- GUC Monthly Sales Report - Apr 2019 (May 06, 2019)
- OPENEDGES NoC (Network on Chip) Interconnect IP & DDR Controller licensed by ASICLAND (May. 06, 2019)
- CEVA, Inc. Announces First Quarter 2019 Financial Results (May 06, 2019)
- Sankalp Semiconductor to Exhibit at ChipEx - 2019 (May 06, 2019)
- Blu Wireless raises $16.6 million in growth funding round for 5G applications (May 06, 2019)
- China accounts for 34% of Global 5G patents , ranking first (May. 05, 2019)
- Chip sales in the first quarter hit the biggest quarterly recession in 35 years (May. 05, 2019)
- Qualcomm received an Apple settlement of $4.5 billion! (May. 05, 2019)
- Europe and the United States 32 countries to introduce new 5G security standards, a fatal blow to Huawei? (May. 05, 2019)
- Mobile phone chip warming Three fabs 12-inch orders rebound (May. 05, 2019)
- South Korea eager to be wafer foundry first, making next-generation semiconductor to national competition (May. 04, 2019)
- POC promotes more mature technology/applications NB-IoT business opportunities are coming (May. 04, 2019)
- Sino-US artificial intelligence competition will be more intense (May. 03, 2019)
- Ex DJI employees leaked the company source code through Github, they were fined 200,000 and sentenced to six months. What do you think? (May. 03, 2019)
- Protecting privacy or monopoly? Apple App Store is questioned again (May. 03, 2019)
- Tesla raises $2 billion, Musk says autopilot will increase the company's market value tenfold (May. 03, 2019)
- The hottest RISC-V continues to have a fever, how will the future CPU situation evolve? How will the RISC-V ecosystem develop? Let Andes Technology show you ! (May. 02, 2019)
- Intel introduces Intel Optane memory H10 combining DRAM and NAND Flash (May. 02, 2019)
- 1Q19 Registers the 4th Largest Sequential IC Market Decline on Record (May 02, 2019)
- ZTE Selects Intel's eASIC Devices for 5G Wireless Deployment (May 02, 2019)
- Qualcomm Booking $4.5B in Apple Deal (May 02, 2019)
- Vela enters into strategic partnership with Enyx (May 02, 2019)
- Semiconductors realize dimensional control of wafer-level high quality InAs nanostructures (May. 02, 2019)
- Synopsys Announces Industry's First DDR5 NVDIMM-P Verification IP for Next-generation Storage-class Memory Designs (May. 01, 2019)
- Comcores and DENSO AUTOMOTIVE Deutschland GmbH test TSN Ethernet for Automotive Applications in the Research Project EMPHASE (May. 01, 2019)
- Moortec Provide Embedded Monitoring Solutions for Arm's Neoverse N1 System Development Platform on TSMC 7nm Process Technology (May. 01, 2019)
- Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores (May 01, 2019)
- eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC (May 01, 2019)
- The "power point" of automotive electrification innovation? (May. 01, 2019)
- Samsung starting! The first 7nm EUV process processor came out (Apr. 30, 2019)
- The rise of AI and ML: The future risks are unpredictable? (Apr. 30, 2019)
- Survey: China's Fabless IC Firms Optimistic on Sales Growth (Apr 30, 2019)
- Gyrfalcon Technology Introduces IP Licensing Model for Greater Customization for AI Chips from "Edge to Cloud" (Apr 30, 2019)
- Global Semiconductor Sales Down 15.5 Percent in First Quarter of 2019 (Apr 30, 2019)
- GOWIN Adopts HyperBus for built-in PSRAM and HyperRAM Interfacing (Apr 30, 2019)
- eSilicon Expands Technical Advisory Board (Apr 30, 2019)
- Moortec To Showcase Its PVT Monitoring IP At TSMC 2019 Boston Technology Workshop (Apr 30, 2019)
- Arm Appoints CFO with IPO Experience (Apr. 30, 2019)
- Synopsys Launches New VESA DSC IP for Visually Lossless Compression in Mobile, AR-VR, and Automotive SoCs (Apr 30, 2019)
- Multiple Arteris IP FlexNoC Interconnect Licenses Purchased by VeriSilicon for Multiple Chip Designs (Apr 30, 2019)
- Samsung said that it wants to be the Top in the logic chip market. What does TSMC/Intel say? (Apr. 29, 2019)
- Demand for 8-inch silicon wafers is high-demanding! GlobalWafers Italy factory opened this year (Apr. 29, 2019)
- Terahertz waves may compensate for millimeter-wave short boards and speed up 6G/7G implementation (Apr. 29, 2019)
- Apple Apple steal Intel 5G Engineer: Responsible for Chip Architecture (Apr. 29, 2019)
- Silicon Wafer Shipments Drop to Lowest Level Since Fourth Quarter of 2017 (Apr 29, 2019)
- eSilicon Signs Multi-Year Agreement with Google Cloud (Apr 29, 2019)
- ARM, MIPS, Imagination lose IP market share (Apr 29, 2019)
- Arm announces appointment of Inder Singh as Chief Financial Officer (Apr 29, 2019)
- Intel Cuts 2019 Sales Forecast (Apr 29, 2019)
- SiFive Announces Strategic Partnership with QuickLogic and Launches SoC Templates for Rapid Chip Design (Apr 29, 2019)
- Comparison of three 3D imaging technologies tells you: How to choose mobile face recognition technology? (Apr. 29, 2019)
- Domestic lithography machines have been repeatedly innovated, but why can't they solve the essential problem? (Apr. 28, 2019)
- Intel will not provide 10nm desktop CPUs until 2022 (Apr. 28, 2019)
- Arteris IP_Ncore® and FlexNoC® Interconnects and Resilience Packages Licensed by Mobileye (Apr. 26, 2019)
- Apple wants to solve the problem of unmanned car safety with night sensors (Apr. 26, 2019)
- TSMC Strengthens OIP Cloud Alliance with New Partner and New Solution Enablement (Apr 26, 2019)
- Safety of automotive electronics supply chain (Apr. 26, 2019)
- The General Directorate of Market Supervision launched an antitrust investigation against Ericsson (Apr. 26, 2019)
- Xilinx to Acquire Solarflare (Apr 25, 2019)
- Docker and Arm Partner to Deliver Frictionless Cloud-native Software Development and Delivery Model for Cloud, Edge, and IoT (Apr 25, 2019)
- Xilinx Reports Record Revenues Exceeding $3 Billion For Fiscal 2019 (Apr 25, 2019)
- TSMC Steps Through 7, 6, 5, Moore (Apr 25, 2019)
- Tamba Networks' IP Selected for Innovium's TERALYNX 12.8 Tbps Data-Center Optimized Switch (Apr 25, 2019)
- Gyrfalcon Technology Introduces IP Licensing Model for Greater Customization for AI Chips from (Apr. 25, 2019)
- Intilop Delivers Their Enhanced One Thousand TCP/UDP Session Hardware Accelerator and Kernel Bypass Linux Driver for Hyper-Performance Networking Systems (Apr 25, 2019)
- After Apple and Amazon, Microsoft’s market capitalization exceeded the trillion dollar (Apr. 25, 2019)
- Xilinx Announces Acquisition of Solarflare (Apr. 25, 2019)
- It is said that the UK will not block Huawei network equipment and change to strict supervision to reduce risks. (Apr. 25, 2019)
- Tamba Networks' IP Selected for Innovium's TERALYNX 12.8 Tbps Data-Center Optimized Switch (Apr. 25, 2019)
- Mobiveil, Inc. today announced availability of its PCI Express 5 controller IP (Apr. 24, 2019)
- Cadence Design Solutions Certified for TSMC-SoIC Advanced 3D Chip Stacking Technology (Apr 24, 2019)
- North American Semiconductor Equipment Industry Posts March 2019 Billings (Apr 24, 2019)
- Synopsys Design Platform Certified for TSMC's Innovative SoIC Chip Stacking Technology (Apr 24, 2019)
- Q1 finished, TSMC Q2 revenue estimates as high as 7.65 billion US dollars (Apr. 23, 2019)
- GF sold the 12-inch fab in New York State, and ON Semiconductor took over $430 million! (Apr. 23, 2019)
- Andes Technology will hold RISC-V CON (Apr. 23, 2019)
- China Unicom and Qualcomm and Chinese OEMs jointly launch China 5G deployment (Apr. 23, 2019)
- Is Qualcomm Cloud AI 100 an AI chip or a mobile gaming cloud platform? (Apr. 23, 2019)
- Musk said Tesla's autopilot chip is the best, do you believe it? (Apr. 23, 2019)
- Apple and Qualcomm reconciled, the iPhone signal problem will be saved? (Apr. 23, 2019)
- Apple is again litigated! (Apr. 23, 2019)
- Digital Blocks DB9000 TFT LCD and OLED Display Controller & Processor IP Application Leadership Advancements (Apr 2019) (Apr. 23, 2019)
- Rambus Reports First Quarter 2019 Financial Results (Apr 23, 2019)
- Silvaco Opens Chengdu Office to Support Company's China Expansion and Growing Demand for Power Semiconductor Design Solutions (Apr 23, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Samsung's System LSI Business for Digital TV Chips (Apr. 23, 2019)
- TSMC Celebrates 25th Anniversary of the North American Technology Symposium (Apr 23, 2019)
- Alphawave Joins TSMC IP Alliance Program (Apr. 23, 2019)
- Mobiveil's GPEX IP with PCI Express 5.0 technology support to be made available in End Point, Root Complex, Dual mode and Switch configurations with Configurability, Reliability and Serviceability (Apr. 23, 2019)
- Analog Bits Showcases PCIe Gen2 / Gen3 / Gen4 Reference Clock PHY Design Kits Available on TSMC 7nm / 12nm / 16nm / 22nm process technology (Apr. 23, 2019)
- Arasan Announces its Total eMMC IP Solution on TSMC 7nm Process Technology (Apr. 23, 2019)
- Cadence Reports First Quarter 2019 Financial Results (Apr 23, 2019)
- Synopsys Achieves More Than 250 Design Wins with DesignWare IP on TSMC 7nm FinFET Process (Apr. 23, 2019)
- Tortuga Logic and Synopsys Collaborate to Deliver System-Level Security to SoCs Built with Synopsys DesignWare ARC Processor IP (Apr. 23, 2019)
- Radiant 1.1 Lattice FPGA Design Tools Release Accelerates Design Reuse (Apr. 23, 2019)
- The MOST Ultimate OTP Technology - AGIC Particle Momentum (Apr. 22, 2019)
- RISC-V open architecture customization to win! Andes contract number ushered in explosive growth (Apr. 22, 2019)
- Is analog signal processing the future of AI? (Apr. 22, 2019)
- 5G commercial or will drive global server shipments, is expected to hit a new high in 2020 (Apr. 22, 2019)
- Graphcore CEO Touts 'Most Complex Processor' Ever (Apr 22, 2019)
- TSMC Certifies Synopsys' Digital and Custom Design Platforms on TSMC 5nm FinFET Process Technology (Apr. 22, 2019)
- ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility (Apr 22, 2019)
- RISC-V, DARPA Advance Security (Apr 22, 2019)
- Machine Learning on DSPs: Enabling Audio AI at the Edge (Apr 22, 2019)
- Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design (Apr. 22, 2019)
- Desay SV Standardizes on Synopsys Virtualizer Virtual Prototyping Solutions (Apr 22, 2019)
- 5 nanometer process independent graphics card has a chance? Intel may find Samsung OEM to take GPU (Apr. 19, 2019)
- Arm China selects Mentor's Questa Verification Solution to enhance power efficiency and speed development of MCU designs (Apr 19, 2019)
- Mercury Systems Announces Acquisitions of The Athena Group and Syntonic Microwave (Apr 19, 2019)
- TSMC Reports First Quarter EPS of NT$2.37 (Apr 18, 2019)
- Baidu buys Arteris IP's FlexNoC® interconnect product for data center Kunlun AI cloud chip (Apr. 18, 2019)
- Intel to Exit 5G Smartphone Modem Business, Focus 5G Efforts on Network Infrastructure and Other Data-Centric Opportunities (Apr 18, 2019)
- Safety, cybersecurity and cost delaying mass deployment of autonomous cars (Apr 18, 2019)
- Rambus Announces Tapeout and Availability of 112G Long Reach SerDes PHY on Leading-edge 7nm Node for High-Performance Communications and Data Centers (Apr 18, 2019)
- Allegro DVT Introduces the Industry First Real-Time AV1 Video Encoder Hardware IP for 4K/UHD Video Encoding Applications (Apr. 18, 2019)
- Synopsys Establishes Center of Excellence with STMicroelectronics to Speed Development of Automotive Electronic Systems (Apr 18, 2019)
- Cadence LPDDR4/4X Memory IP Subsystem Achieves ISO 26262 ASIL C Certification from SGS-TUV Saar Using TSMC 16FFC Process Technology (Apr 18, 2019)
- Globalfoundries' Morgenstern: Diversity is key in Dresden (Apr 18, 2019)
- Intel Acquires Omnitek, Strengthens FPGA Video and Vision Offering (Apr 17, 2019)
- Omnitek achieves world-leading CNN performance per watt in a midrange programmable device. (Apr 17, 2019)
- M31 Technology Develops SRAM Compiler IP on TSMC's 28nm Embedded Flash Process Technology Providing High Performance and Low Power Solutions (Apr 17, 2019)
- Exablaze and Algo-Logic partner to deliver ultra-low latency trading solutions (Apr 17, 2019)
- Qualcomm and Apple agree to drop all litigation (Apr 17, 2019)
- Moortec to Showcase its PVT Monitoring IP at TSMC 2019 Technology Symposium (Apr 17, 2019)
- Bluetooth 5.1 makes Bluetooth technology suitable for you (Apr. 16, 2019)
- Trump remote A shares? 5G shares have risen collectively for another reason! (Apr. 16, 2019)
- Last year, global semiconductor manufacturing equipment sales totaled 64.53 billion US dollars, and China jumped to second place. (Apr. 16, 2019)
- Get Ready for Augmented Driving (Apr. 16, 2019)
- TSMC Unveils 6-nanometer Process (Apr. 16, 2019)
- Fujitsu Begins Production of Post-K (Apr 16, 2019)
- Arteris IP FlexNoC Interconnect Licensed by DisplayLink for Systems-on-Chip (Apr 16, 2019)
- Samsung Successfully Completes 5nm EUV Development to Allow Greater Area Scaling and Ultra-low Power Benefits (Apr 16, 2019)
- Will the Apple A14 chip use the 5nm process? TSMC will invest $25 billion to promote mass production (Apr. 15, 2019)
- Arteris IP Announces New FlexNoC®4 Interconnect IP (Apr. 15, 2019)
- What upgrades does 5G bring to the Internet of Vehicles and Autopilot? (Apr. 15, 2019)
- Following Qualcomm, Ericsson fell into patent authorization antitrust investigation (Apr. 15, 2019)
- Global PC shipments fell 4.6% in the first quarter of 2019 (Apr. 15, 2019)
- EDA Industry Revenue Grows for Full Year 2018 but Slows for Fourth Quarter (Apr. 15, 2019)
- Countdown: How Close is China to 40% Chip Self-Sufficiency? (Apr 12, 2019)
- Ampere Computing raises new round of capital, including new investor Arm (Apr 12, 2019)
- Unexpectedly: 5G complexity is far more than imagination! (Apr. 12, 2019)
- Cobham Processor Technology Powers Commercial NanoSatellite (Apr. 12, 2019)
- DynapCNN - the World's First 1M Neuron, Event-Driven Neuromorphic AI Processor for Vision Processing (Apr 12, 2019)
- Dutch media said Chinese employees steal ASML secrets (Apr. 12, 2019)
- Self-driving tests require the right indicators! (Apr. 12, 2019)
- How does Renesas respond to the OTA challenge? (Apr. 12, 2019)
- SmartDV's DVCon China Exhibit to Showcase Extensive Verification IP Portfolio (Apr 11, 2019)
- Gartner Says Worldwide Semiconductor Revenue Grew 12.5 Percent in 2018 (Apr 11, 2019)
- SiFive Tapes Out First in a Series of 7nm IP Enablement Platforms (Apr. 11, 2019)
- Qorvo to Acquire Active-Semi International (Apr 11, 2019)
- Wave Computing Unveils New Licensable 64-Bit AI IP Platform to Enable High-Speed Inferencing and Training in Edge Applications (Apr. 11, 2019)
- CEVA Wins 2018 CEM Editor's Choice Award for its NB-IoT IP Solution (Apr 11, 2019)
- 7nm EUV chip is coming! Samsung announced that it will start mass production in June this year (Apr. 11, 2019)
- Flex Logix Releases InferXTM X1 8TOPS High Performance, Low Power, Low Cost AI Edge Reasoning Chip (Apr. 11, 2019)
- Creonic Shows 100 Gbps Polar Decoder in International SENDATE-TANDEM Research Project (Apr 10, 2019)
- Michael Boukaya Promoted to Chief Operating Officer of CEVA, Inc. (Apr 10, 2019)
- TSMC March 2019 Revenue Report (Apr 10, 2019)
- 2018 Global Semiconductor Equipment Sales Jump to Record $64.5 Billion (Apr 10, 2019)
- SiFive Launches the World's Smallest Commercial 64-bit Embedded Core (Apr. 10, 2019)
- Flex Logix Launches InferX X1 Edge Inference Co-Processor That Delivers Near-Data Center Throughput at a Fraction of the Power and Cost (Apr 10, 2019)
- Numem Inc. Exhibits at IP-SoC Santa Clara 2019 (Apr 09, 2019)
- Faraday Unveils RISC-V ASIC Solution to Support Edge AI and IoT SoCs (Apr. 09, 2019)
- UMC Reports Sales for March 2019 (Apr 09, 2019)
- First software-driven JPEG XS solutions demonstrated by intoPIX at NAB Show 2019. (Apr 09, 2019)
- Vidatronic Announces Series of 40 nm Integrated Power Management Unit (PMU) IP Cores Optimized for Wireless and NB-IoT Applications (Apr. 09, 2019)
- Synaptics Selects and Designs SiFive Custom E2 Series Core IP in Record Time (Apr. 09, 2019)
- Intrinsic ID's BroadKey Delivers Hardware Root-of-Trust Security at Core of Authentico's New Password Security System (Apr 08, 2019)
- Sofics Releases Analog IO's and ESD protection clamps for Advanced Applications using TSMC 7nm FinFET process (Apr 08, 2019)
- Sankalp Semiconductor to Exhibit & Present at Design & Reuse IPSoC Santa Clara 2019 (Apr 08, 2019)
- intoPIX TICO-RAW technology to simplify and improve image signal processing of next-gen 4K & 8K cameras at NAB Show 2019 (Apr 08, 2019)
- intoPIX announces availability of TICO-XS IP-cores supporting HD and 4K with a low FPGA footprint at NAB 2019 (Apr. 08, 2019)
- Andes Records a Rapid Growth of Design Wins in 2018 For Its New Family of RISC-V Processor Cores (Apr 08, 2019)
- GUC Monthly Sales Report - March 2019 (Apr 08, 2019)
- Qualcomm: As long as Apple wants, Qualcomm is willing to supply 5G chips (Apr. 08, 2019)
- The MIT team can accelerate the AI-optimized AI design process by 240 times! (Apr. 08, 2019)
- The automotive electronics market is developing rapidly? Samsung and LG sales are growing rapidly (Apr. 08, 2019)
- IoT industry trend: By 2023, 83% of AI chips worldwide will supply IoT devices (Apr. 08, 2019)
- Samsung released its first quarter earnings report for 2019, profits plummeted 60% (Apr. 08, 2019)
- Gexin participates in the establishment of an IoT chip company to help small and medium-sized IoT companies (Apr. 05, 2019)
- TSMC's 5nm process enters trial production and will push the complete design architecture (Apr. 04, 2019)
- TSMC 7nm chip sales increased, Q3 reached 100% (Apr. 04, 2019)
- SMIC earned a net profit of $1.16 billion last year (Apr. 04, 2019)
- Diodes completes acquisition of TI wafer fab (Apr. 04, 2019)
- The new forces and the old forces of the AI+ security era (Apr. 04, 2019)
- Qualcomm CFO left, quickly joined Intel (Apr. 04, 2019)
- New Zealand Prime Minister: We do not block Huawei (Apr. 04, 2019)
- PLDA Announces Two Innovative vDMA Engine IP Solutions, Delivering Robust Performance and Scalability across a PCIe link or AMBA AXI fabric (Apr. 04, 2019)
- V-Nova and NGCodec ship industry's lowest cost real-time UHD encoding (Apr 04, 2019)
- Silvaco CTO, Babak Taheri, to Present at IP-SoC Santa Clara, April 9 (Apr 04, 2019)
- Menta and Mentor Partner for High-Level Synthesis of Embedded FPGA IP (Apr 03, 2019)
- Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design (Apr. 03, 2019)
- Apple is left behind? Purchase 5G baseband rejected by Samsung (Apr. 03, 2019)
- Boeing's B737 Max and Automotive 'Autopilot' (Apr. 03, 2019)
- Intel unveils new FPGA platform Agilex: launching a counterattack against Xilinx (Apr. 03, 2019)
- TSMC and OIP Ecosystem Partners Deliver Industry's First Complete Design Infrastructure for 5nm Process Technology (Apr 03, 2019)
- Intel driving Data-Centric World with new 10nm Intel Agilex FPGA Family (Apr 03, 2019)
- The data transmission speed is over 1000 times! Intel's $13 million investment in Untether AI (Apr. 03, 2019)
- Ericsson layout 5G! Announced that it has signed contracts with 17 operators worldwide (Apr. 02, 2019)
- Huawei loses its leading position in communications equipment, and its 5G estimated shipments are only 4th. (Apr. 02, 2019)
- Vehicle Image Recognition System Chip Integrates Deep Neural Network Accelerator (Apr. 02, 2019)
- Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments (Apr 02, 2019)
- Global Semiconductor Sales Decrease 7.3 Percent Month-to-Month in February (Apr 02, 2019)
- Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms (Apr 02, 2019)
- Silex Insight expands into North America with opening of Silicon Valley office (Apr 02, 2019)
- Sambanova Systems Announces $150M Series B From Intel Capital And GV To Advance Its Breakthrough AI Platform (Apr 02, 2019)
- Movellus Raises $6M in Venture Funding, Led by Stata Venture Partners (Apr 02, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Horizon Robotics for ADAS Chips (Apr 02, 2019)
- proteanTecs Completes Successful Series B Funding and Launches Out of Stealth Mode (Apr 02, 2019)
- Global Semiconductor Materials Sales Hit New High of $51.9 Billion (Apr 02, 2019)
- GF big transformation (Apr. 01, 2019)
- SMIC sells LFoundry (Apr. 01, 2019)
- Cadence: What opportunities and challenges does artificial intelligence bring to electronic design? (Apr. 01, 2019)
- Cadence Digital Implementation and Parasitic Extraction Tools Enabled for Samsung Foundry Gate-All-Around Technology (Apr. 01, 2019)
- Omnitek Releases Highly Optimised 3D LUT IP for FPGAs (Apr 01, 2019)
- SMIC Announces 2018 Annual Results (Apr 01, 2019)
- The MOST Ultimate OTP Technology - AGIC Particle Momentum (Apr. 01, 2019)
- Renesas Completes Acquisition of Integrated Device Technology (Apr 01, 2019)
- Vidatronic Sponsors Design & Reuse's IP SoC Days Conference 2019 in Santa Clara (Apr 01, 2019)
- When RISC-V encounters AIoT, how big ecological consequence will be resulted? (Apr. 01, 2019)
- Processors, Sensors Drive Embedded Vision (Apr 01, 2019)
- SMIC Rift: Rare Peek into China IC Industry (Apr 01, 2019)
- The 2019 China IC Leaders Summit ended successfully, and the winners of the Design Achievement Awards were announced. (Mar. 29, 2019)
- Britain has revealed again Huawei security problem? Huawei has responded (Mar. 29, 2019)
- Wave Computing Releases First MIPS Open Program Components to Accelerate Innovation for Next-Generation System on Chip Designs (Mar 29, 2019)
- The long patent case has progressed: Does Apple still have the chance? (Mar. 28, 2019)
- TSMC and MediaTek will face patent litigation and face the US 337 investigation (Mar. 28, 2019)
- What new material challenges will Rogers face in the 5G wave? (Mar. 28, 2019)
- TacSense makes "beyond human touch" possible (Mar. 28, 2019)
- ZTE: net profit loss of 6.984 billion yuan, a year-on-year decrease of 252.88% (Mar. 28, 2019)
- Sankalp Semiconductor Expands International Operations in Japan (Mar 28, 2019)
- ON Semiconductor to Acquire Quantenna Communications (Mar 28, 2019)
- Efinix Transitions Trion T20 FPGAs to High-Volume Production (Mar 28, 2019)
- Cadence Collaborates with Northrop Grumman on Chip Design (Mar 28, 2019)
- Intrinsic ID's Hardware Root of Trust IP Selected by Tyrion Integration for Industry 4.0 IoT Security in Oil & Gas Deployment (Mar 27, 2019)
- Arm Pelion IoT platform provides foundation for comprehensive IoT utility deployments (Mar. 27, 2019)
- Moore's Law Ending? No Problem (Mar 27, 2019)
- Nextera Video Announces NMOS IS-08 as the Latest Addition to their Industry-Leading 2110 Video Over IP FPGA Core Set (Mar. 27, 2019)
- U.S. Companies Continue to Represent Largest Share of Fabless IC Sales (Mar 27, 2019)
- Atmosic Technologies Extends Controlled Energy Harvesting Technology to Harness Photovoltaic Power for IoT Device Connectivity (Mar 27, 2019)
- CyberX Capitalizes on IIoT Security Momentum with Additional $18 Million in Strategic Funding (Mar 27, 2019)
- Synopsys Announces Collaboration with Samsung Foundry to Offer Secure and Scalable Environment on the Cloud for IC Design and Verification (Mar. 27, 2019)
- Achronix Demonstrates Silicon Validation Device with 112 Gbps SerDes (Mar. 27, 2019)
- Global IC design ranking, the United States is the dominant (Mar. 27, 2019)
- Qualcomm releases new smart speaker chip (Mar. 27, 2019)
- China's core "new opportunities": domestic chip companies have entered the RISC-V architecture, compete with ARM on AI and the Internet of Things (Mar. 26, 2019)
- Robotic visual electronic design for industrial and space applications (Mar. 26, 2019)
- MediaTek's smart home business group is unveiled , the first 8K chip will be available soon (Mar. 26, 2019)
- Disable Huawei devices? Experts believe there are other ways to deal with threats (Mar. 26, 2019)
- REALSEC includes Silex Insight high performance crypto IP for all their HSM solutions (Mar. 26, 2019)
- Apple v. Q'comm Cases and Impacts (Mar 26, 2019)
- UltraSoC strengthens data science and machine learning team with appointment of new VP Software Development (Mar 26, 2019)
- China Lures SMIC Co-CEO Zhao (Mar 26, 2019)
- Wave Collaborates with UC Berkeley's BAIR Open Research Alliance to Accelerate Cutting-Edge Artificial Intelligence Research (Mar 26, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Morningcore for Automotive LTE-V2X Modems for China Market (Mar 26, 2019)
- SMIC Releases World's First Ultra-wideband Dual-Polarization 5G Millimeter Wave Antenna RF Chip Integrated Package Technology (Mar. 25, 2019)
- Cortus Announces the General Availability of a RISC-V Processor Family - from Low End Embedded Controller to 64 bit Processor with Floating Point. (Mar. 25, 2019)
- Advanced nodes face edge error problems (Mar. 25, 2019)
- The three major operators have 760 million Internet of Things connections, and the industry is welcoming the era of gold development. (Mar. 25, 2019)
- In the case of the phone lock screen, can the APP still monitor user sensitive information? (Mar. 25, 2019)
- 7nm+EUV process! Huawei Mate 30 series Qilin 985 was launched (Mar. 25, 2019)
- Renesas acquired IDT for $6.7 billion (Mar. 25, 2019)
- Huawei VS. Apple is in the air! New products will be released at the same time next Tuesday. Which one do you support? (Mar. 22, 2019)
- North American Semiconductor Equipment Industry Posts February 2019 Billings (Mar 22, 2019)
- SCALINX expansion continues with ASIC design center in Caen, France (Mar 22, 2019)
- Wave Computing Appoints Michael Schroeder as Chief People Officer To Help Drive Company's Global Expansion Plans (Mar 22, 2019)
- Samsung Announces 1Z Nano Process DRAM, Mass Production in the Second Half of 2019 (Mar. 22, 2019)
- Imagination provides the latest enhanced development tools for the Android market (Mar. 22, 2019)
- Tesla sued former employees for stealing Autopilot source code to join Xiaopeng Automobile (Mar. 22, 2019)
- Huawei CEO: Thanks to the US government for advertising for Huawei everywhere. (Mar. 21, 2019)
- DATE 2019: eSilicon to present two papers on advanced floor planning techniques with the Polytechnic University of Catalonia (Mar 21, 2019)
- Synopsys Introduces New embARC Machine Learning Inference Software Library for Power-Efficient Neural Networks (Mar. 21, 2019)
- Sonics and Arteris IP Agree to Dismiss Litigation (Mar 21, 2019)
- sureCore Delivers Customised Low Power SRAM for Data Intensive Designs (Mar. 21, 2019)
- Samsung Develops Industry's First 3rd-generation 10nm-Class DRAM for Premium Memory Applications (Mar 21, 2019)
- InSync Technology Ltd Adopts the Adeas/Nextera ST2110 IP Core Set (Mar 21, 2019)
- WIPO 2018 IP Services: Innovators File Record Number of International Patent Applications, With Asia Now Leading (Mar 21, 2019)
- Soitec：SOI technology has unique advantages in the 5G and AIOT eras (Mar. 21, 2019)
- Synopsys and GF team up to develop the industry's first automotive Tier 1 IP for 22FDX process (Mar. 21, 2019)
- 5G wireless applications unlock the 2019 new technology era in three ways (Mar. 21, 2019)
- Synopsys Unveils TestMAX Family of Products to Address Critical and Evolving Test Challenges (Mar 20, 2019)
- Synopsys Fusion Design Platform Extends Leadership at 7nm, Surpasses 100-Tapeout Milestone in First Year (Mar 20, 2019)
- SOI wafers double capacity in China (Mar. 20, 2019)
- Tsinghua University research team innovative magnetic flip mechanism breaks through the bottleneck of MRAM technology (Mar. 20, 2019)
- Demand for smartphone storage has surged, and flash memory manufacturers have blossomed (Mar. 20, 2019)
- Huawei prepares for 5G, over-subjects or changes the chip market map (Mar. 20, 2019)
- Demystifying the new ecology of AI chips, what did the big leads from Qualcomm/Intel/Huawei/ say ? (Mar. 20, 2019)
- Samsung's semiconductor ambition (Mar. 20, 2019)
- Huawei CEO: Thanks to the US government for advertising for Huawei everywhere. (Mar. 20, 2019)
- eFPGA will solve the 5G base station problem (Mar. 19, 2019)
- Arteris® IP FlexNoC® Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems (Mar. 19, 2019)
- AI assists, smart medical development (Mar. 19, 2019)
- How Edge Computing Technology Drives IoT Business Application Development (Mar. 19, 2019)
- Huawei builds an IoT ecosystem and actively deploys overseas markets (Mar. 19, 2019)
- Reluctantly abandon the iPhone and turn to embrace Android? Apple supplier foundry is worrying about orders… (Mar. 19, 2019)
- U.S. Court Finds Apple Infringed Qualcomm IP (Mar 19, 2019)
- Nvidia Mum on 7nm GPU (Mar 19, 2019)
- Arteris IP FlexNoC Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems (Mar 19, 2019)
- Imagination delivers new and enhanced developer tools for Android (Mar 19, 2019)
- This is the Warring States period of autonomous driving, and also the golden age of technological development. (Mar. 19, 2019)
- Number of 300mm IC Wafer Fabs Expected to Reach 121 in 2019 (Mar 18, 2019)
- Andes Technology Strengthens the RISC-V EasyStart Alliance to 15 ASIC Design Service Partners (Mar 18, 2019)
- Synopsys Unveils IC Validator NXT to Cut Physical Signoff Cycle by 2X (Mar 18, 2019)
- Global Top Ten IC Foundries Ranked for 1Q19, with TSMC Expected to Reach 48.1% Market Share, Says TrendForce (Mar 18, 2019)
- Boeing's B737 Max and Automotive 'Autopilot' (Mar 18, 2019)
- Taiwan wafer foundry revenue in the first quarter may fall 23.4% (Mar. 18, 2019)
- Apple lost, paying Qualcomm $31 million (Mar. 18, 2019)
- 5G communication will subvert the edge of the network (Mar. 18, 2019)
- AI+5G+IoT Viomi Home Internet of Things Solution (Mar. 18, 2019)
- Data Centers Open Source Silicon (Mar 15, 2019)
- Baidu, Facebook and Microsoft work together to define the OCP Accelerator Module specification (Mar 15, 2019)
- Imagination in UK's top ten for European Patent Filing (Mar 15, 2019)
- GF official statement: the sale of Singapore Fab 7 factory is a rumor (Mar. 15, 2019)
- Huawei sues the US government for counterattack? (Mar. 15, 2019)
- The US-China crisis? What are the negative effects of the chip industry? (Mar. 15, 2019)
- AI demand drives the rise of memory computing architecture (Mar. 14, 2019)
- Chips-as-a-Service on Startup's Menu (Mar 14, 2019)
- The RISC-V Foundation Appoints Calista Redmond As Chief Executive Officer (Mar 14, 2019)
- Synopsys' Fusion Compiler Enables Renesas to Accelerate Delivery of Next-Generation Automotive Designs (Mar 14, 2019)
- Synopsys Delivers Industry's First USB4 Subsystem Verification Solution, VIP, and Test Suite for High-performance USB Architecture (Mar 14, 2019)
- Cadence Announces Industry's First Verification IP for USB4 (Mar. 14, 2019)
- Mobile Semiconductor Licenses memory compilers to Sandia National Laboratories (Mar 14, 2019)
- GOWIN Semiconductor Corporation Appoints Pan-European Representative (Mar 14, 2019)
- Andes and SEGGER Partner to Deliver Professional Development Solutions for RISC-V (Mar 14, 2019)
- What does RISC-V bring to China (Mar. 13, 2019)
- It’s too late to watch out TCL. (Mar. 13, 2019)
- 5G outbreak and anxiety (Mar. 13, 2019)
- OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth (Mar 13, 2019)
- Facebook Buys Interconnect IP Vendor Sonics (Mar 13, 2019)
- Latest Release of Synopsys' Design Compiler NXT is Ready for Broad Availability (Mar. 13, 2019)
- Arm, Cadence, and Xilinx jointly launch the first Arm Neoverse system development platform based on TSMC's 7-nm process for next-generation cloud-to-edge infrastructure (Mar. 13, 2019)
- From 5G to submarine cable, Huawei was once again obstructed by the United States (Mar. 13, 2019)
- Huawei was boycotted, Ericsson added 5G orders to meet the opportunity to turn over? (Mar. 13, 2019)
- China's AI patent application number is nearly 2.5 times that of the US (Mar. 13, 2019)
- 2019 technology investment in the field of data analysis and network security will grow substantially (Mar. 13, 2019)
- A key element in creating a smart factory (Mar. 12, 2019)
- Attopsemi's I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology (Mar. 12, 2019)
- Key Industry Players Converge to Advance CXL, a New High-Speed CPU Interconnect for Breakthrough Data Center Performance (Mar 12, 2019)
- Linux Foundation to Host CHIPS Alliance Project to Propel Industry Innovation Through Open Source Chip and SoC Design (Mar 12, 2019)
- Intel, RISC-V Rally Rival Groups (Mar 12, 2019)
- Global Fab Spending to See 2019 Decline, New Highs in 2020 (Mar 12, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Silicon Mobility for OLEA ISO 26262 ASIL-D Automotive FPCU (Mar 12, 2019)
- Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology (Mar 12, 2019)
- CEVA Computer Vision, Deep Learning and Long Range Communication Technologies Power DJI Drones (Mar 12, 2019)
- Andes Technology Announces RISC-V Single-core and Multicore Processors with DSP Instruction Set (Mar. 12, 2019)
- eFPGA IP from Menta Selected by Beijing Chongxin Communication Company to Enable Programmability in 4G/5G Wireless Baseband SoC (Mar. 12, 2019)
- Spectral Edge Fusion innovation brings RGB and Near Infrared light together for breakthrough, no-compromise performance in low lighting (Mar 11, 2019)
- Intel Expected to Recapture #1 Semi Supplier Ranking in 2019 (Mar 11, 2019)
- UMC Reports Sales for February 2019 (Mar 11, 2019)
- TSMC February 2019 Revenue Report (Mar 11, 2019)
- The AI era is coming, what are the characteristics of national strategies and corporate layouts? (Mar. 11, 2019)
- Intel drone leader: Flying car will appear in the next 5 years (Mar. 11, 2019)
- Samsung memory chip revenue plummeted, intel is expected to return to semiconductor leader (Mar. 11, 2019)
- Sonics: Our Next Chapter (Mar 11, 2019)
- NVIDIA to Acquire Mellanox for $6.9 Billion (Mar 11, 2019)
- TSMC recruits 2,000 talents this year (Mar. 10, 2019)
- Cypress Semiconductor ModusToolbox suite reduces IoT design complexity and supports third-party platform development processes such as Arm Mbed OS (Mar. 09, 2019)
- Middle school procurement smart bracelets lead to controversy, smart campus or "electronic handcuffs"? (Mar. 08, 2019)
- Automotive applications change Qualcomm's DNA (Mar. 08, 2019)
- Carriers, OEMs Seek Huawei Clarity (Mar. 08, 2019)
- A new design that allows mobile phones to simultaneously access 4G and 5G networks (Mar. 07, 2019)
- Huawei announces lawsuit against US government: it has invaded Huawei server, and the national defense authorization law is unconstitutional (Mar. 07, 2019)
- Samsung Electronics Starts Commercial Shipment of eMRAM Product Based on 28nm FD-SOI Process (Mar. 07, 2019)
- Teledyne LeCroy Demonstrates First Protocol Analyzer Platform for Next-Generation USB4 and Thunderbolt 3 Systems (Mar 07, 2019)
- Codasip to Demonstrate Technology Leadership and Commitment to Open Standards at Taiwan RISC-V Workshop (Mar 07, 2019)
- AV Safety Ventures Beyond ISO 26262 (Mar 07, 2019)
- Dialog Semiconductor to Acquire Silicon Motion's Mobile Communications Business Including Ultra-Low-Power Wi-Fi, Extending its Position in IoT Connectivity (Mar 07, 2019)
- Renewable wafers are gaining momentum, and RS's revenue surged 133% last year. (Mar. 07, 2019)
- Europe established Edge Computing Alliance to develop standard edge computing platform (Mar. 07, 2019)
- Apple will recruit baseband engineers at Qualcomm headquarters (Mar. 07, 2019)
- Former Cisco employees were arrested for allegedly defrauding the company for more than $9.3 million (Mar. 06, 2019)
- 5G needs a new security method (Mar. 06, 2019)
- Intel Announces First 58Gbps FPGA Transceiver in Volume Production Enabling 400G Ethernet Deployment (Mar 06, 2019)
- Cobham Gaisler's HiRel GR712RC processor was launched on February 21, 2019 onboard the SpaceIL mission to the Moon (Mar. 06, 2019)
- MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts (Mar. 06, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Lynxi Technologies for Artificial Intelligence (AI) Chips (Mar. 06, 2019)
- Interoperability demo at OFC: eSilicon 56G SerDes and Precise-ITC 400G FEC (Mar 06, 2019)
- Is the United States falling behind on 5G? Where is China's 5G technology in? (Mar. 06, 2019)
- Advantech, AMD, and Mentor work together to explore AI business opportunities and help AI embedded systems (Mar. 06, 2019)
- Cadence Announces Complete, Silicon-Proven LPDDR5 IP Solution (Mar. 05, 2019)
- USB 4.0 is coming, the rate is doubled, and Intel's Thunderbolt 3 is also integrated. (Mar. 05, 2019)
- US is doing research of new fuel cells, which will be used in underwater drones and electric aircraft (Mar. 05, 2019)
- US startups Syntiant launch AI voice chip (Mar. 05, 2019)
- USB 4.0 is coming, the rate is doubled, and Intel's Thunderbolt 3 is also integrated. (Mar. 05, 2019)
- Apple wants to produce a folding phone, and Cook hints that the new product "surprise you." (Mar. 05, 2019)
- GUC Monthly Sales Report - Feb 2019 (Mar 05, 2019)
- Global Semiconductor Sales Down 5.7 Percent Year-to-Year in January (Mar 05, 2019)
- Crowded AI Chip Market Still Has Room for New Entrants According to New Linley Group Study (Mar 05, 2019)
- Esperanto Technologies Appoints Nick Aretakis as VP of Sales and Marketing (Mar 05, 2019)
- Synopsys to Showcase Design and IP Solutions for Optical Datacom and Hyperscale Data Centers at OFC 2019 (Mar 05, 2019)
- Alphawave IP Launched in Canada to Revolutionize Multi-Standard Connectivity for the Digital World (Mar 05, 2019)
- Intrinsic ID's Scalable Hardware Root of Trust IP Delivers Device Authentication for IoT Security in NXP LPC Microcontroller Portfolio (Mar. 04, 2019)
- USB Promoter Group Announces USB4 Specification (Mar 04, 2019)
- Global Top Ten IC Design Companies Ranked by Revenue; Only Qualcomm and MediaTek Suffered Decreases (Mar 04, 2019)
- Advanced Nodes Face Edge Errors (Mar 04, 2019)
- How to ensure the security of BLE connections in IoT applications (Mar. 04, 2019)
- Analysis of nine AI enhanced chips and platforms, which is the best choice for embedded projects? (Mar. 04, 2019)
- Meng's extradition process started, Huawei sued the Canadian government (Mar. 04, 2019)
- Gen-Z ecosystem expands with new technology solutions (Mar 01, 2019)
- Wave Computing's MIPS Processors Power 80% of Today's ADAS-Enabled Automobiles (Mar 01, 2019)
- Comment: GloFo gets warm words, but for how long? (Mar 01, 2019)
- Inside Secure Announces the Closing of the Acquisition of Verimatrix (Mar 01, 2019)
- Over the past 10 years, 97 IC fabs worldwide have been shut down or changed (Mar. 01, 2019)
- Global semiconductor shipments exceeded 1 trillion in 2018 (Mar. 01, 2019)
- The 7nm process has come, what advantages does Intel's 10nm have? (Feb. 28, 2019)
- Apple's self-driving department layoff details released (Feb. 28, 2019)
- 5G mobile phone still faces the power challenge of mmW (Feb. 28, 2019)
- The United States is frustrated again! UAE announces the use of Huawei equipment to build 5G (Feb. 28, 2019)
- The world's top ten IC design companies 2018 revenue released: Qualcomm is the most miserable (Feb. 28, 2019)
- Samsung and Huawei have settled their patent dispute for two years (Feb. 28, 2019)
- TikTok overseas was accused of violating children’s privacy and was fined $5.7 million by the United States. (Feb. 28, 2019)
- SiFive Welcomes Former Intel Capital VP to Executive Team (Feb 28, 2019)
- Cadence Tensilica Product Development Process and Software Products Certified for ISO 26262 ASIL D Compliance for Automotive Applications (Feb. 28, 2019)
- 97 IC Wafer Fabs Closed or Repurposed During Past 10 Years (Feb 28, 2019)
- KEPCO Partners with Inside Secure to Further Bolster Protection for Latest Chips Used in IoT Devices (Feb. 28, 2019)
- WiLAN and Several Subsidiaries Sign Comprehensive Semiconductor License Agreement with SK hynix (Feb 28, 2019)
- Inside Secure Selected by ATsolutions to Provide Market-Leading Code Protection for its Banking and Credit Card Apps (Feb 28, 2019)
- Inside Secure Selected by HiSilicon to Protect Device Secrets throughout Manufacturing Process (Feb 28, 2019)
- Huawei CEO: Meng Wan Zhou will never become the successor of Huawei (Feb. 27, 2019)
- Arm joins China Unicom to jointly build the Internet of Things (Feb. 27, 2019)
- Behind the 5G mobile phone push release, what is the relationship between 5G+AI? (Feb. 27, 2019)
- Analysis of 5G chips released on MWC 2019 (Feb. 27, 2019)
- Intel terminates cooperation with Unisoc 5G baseband (Feb. 27, 2019)
- 3 billion dollars! Semiconductor giant United Automotive Group leads AI show (Feb. 27, 2019)
- Plan ahead, the two giants of memory announced the launch of DDR5 at the end of the year (Feb. 27, 2019)
- Apple fell to the throne of the king, who is the 50 most innovative companies in the world? (Feb. 27, 2019)
- China's sales market is losing, Apple is burying its head to develop new technologies (Feb. 27, 2019)
- Again encounter "patent rogue"? Apple LTE related patents are accused of infringement (Feb. 27, 2019)
- OFC 2019: eSilicon to demonstrate two 7nm IP products, 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem (Feb 27, 2019)
- Cobham Joins RISC-V Foundation (Feb 27, 2019)
- New Cadence Tensilica ConnX B20 DSP Boosts Performance by Up to 10X for Automotive Radar/Lidar and Up to 30X for 5G Communications (Feb 27, 2019)
- Minima Processor and Arm Collaborate on Ultra-Low Power Solutions for Mobile and IoT (Feb. 27, 2019)
- Silvaco Opens Shenzhen Office to Support Company's Asian Expansion and Growing Demand for Semiconductor Design Solutions (Feb 27, 2019)
- Arm and China Unicom Sign Partnership Agreement to Drive IoT Adoption in China (Feb 27, 2019)
- Chips&Media announced licensing of Image Signal Processing (ISP) to one of leading SoC developer targeting advanced automotive applications such as ADAS and Autonomous Driving (Feb. 27, 2019)
- Synopsys' New Enhanced Security Package for ARC HS Processors Protects Embedded Systems Against Evolving Threats (Feb 27, 2019)
- Weak market demand, DRAM output declined by 18.3% in the fourth quarter of 2018 (Feb. 26, 2019)
- Trump postpones tariffs on China, and the semiconductor trade recovery is steady. (Feb. 26, 2019)
- Silvaco, Inc. and Avery Design Systems Partner to Deliver Complete CAN-FD Automotive and MIPI I3C IP and VIP Solutions (Feb. 26, 2019)
- Wireless network topology (Feb. 26, 2019)
- Imagination and Andes collaborate to enable ultra-low power connected microprocessors for IoT (Feb. 26, 2019)
- STMicroelectronics Introduces STM32MP1 Microprocessor and Linux Distribution to Accelerate IoT and Smart Industry Innovation (Feb. 26, 2019)
- Arm PSA Certified: Building Trust in IoT (Feb. 26, 2019)
- Inside Secure launches Flexible Secure Provisioning to Easily Protect Connected Devices Secrets' During Manufacturing Process (Feb. 26, 2019)
- Chinese slowdown hits SE Asia, dragging down manufacturing output (Feb. 26, 2019)
- Geely Announces Work with Qualcomm and Gosuncn to Launch the First Domestically Mass-Produced 5G and C-V2X-Enabled Vehicles (Feb. 26, 2019)
- TRUECHIP Introduces TruEYE -The Debug GUI - A Unique tool for design & verification (Feb 26, 2019)
- AIStorm Introduces Real-Time AI-in-Sensor Solutions for Driver Assistance, Mobile Handsets, Cameras, and IoT (Feb 26, 2019)
- DinoplusAI Partners with SiFive to Develop Mission-Critical AI Processor Platform for High Performance Processing with Ultra-Low Latency (Feb 26, 2019)
- Graphcore Selected 16nm FinFet ESD Solutions from Sofics for its Transformative Artificial Intelligence Processor (Feb 26, 2019)
- CEVA Completes its First Test Trial of CEVA-Dragonfly NB2 NB-IoT Silicon at Vodafone Narrowband-IoT Open Lab (Feb 26, 2019)
- UltraSoC demonstrates advanced multicore debug at Embedded World 2019 (Feb 26, 2019)
- The Qt Company and Inside Secure to Offer Joint Integrated Solutions for Creating Secure IoT and Embedded Devices (Feb 26, 2019)
- Synopsys to Showcase its Leading Prototyping, IP, and Software Integrity Solutions at Embedded World 2019 (Feb 26, 2019)
- intoPIX previews JPEG XS technology for remote production and studio-over-IP applications at VidTrans 2019 (Feb 26, 2019)
- Faraday Reports 2018 Annual Revenues of NT$4.91 Billion, NRE NT$1.3 Billion, up 107% YoY; 2018 Gross Margin was 53.1%, a 11 Year High (Feb 26, 2019)
- What is the application of ADAS in the future car? (Feb. 25, 2019)
- TSMC's second-generation 7nm process is mass-produced in March, and 5nm is about to be trial-produced. (Feb. 25, 2019)
- silicon wafer prices have fallen for the first time in two years. (Feb. 25, 2019)
- Arm and Vodafone Commit to Work Together to Simplify Internet of Things (IoT) Deployment (Feb 25, 2019)
- Arm and Leading Test Laboratories Unveil Independent Security Certification for IoT Devices (Feb. 25, 2019)
- New SoC Security Platform Announced by CAST and Beyond Semiconductor (Feb. 25, 2019)
- North American Semiconductor Equipment Industry Posts January 2019 Billings (Feb 25, 2019)
- Tiempo Secure lowers entry barriers to securing the Internet of Things with its CC EAL5+ grade Secure Element IP macro dedicated to secure Systems-on-Chip (Feb 25, 2019)
- Cadence Drives Release of Alternative EVS Codec Implementation in 3GPP (Feb. 25, 2019)
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment (Feb 25, 2019)
- GreenWaves Technologies Announces 7M Euros Series A Funding (Feb 25, 2019)
- Infineon, Xilinx and Xylon team up for new microcontroller solutions in safety-critical applications (Feb 25, 2019)
- Hex Five and wolfSSL Announce the First Secure IoT Stack for RISC-V (Feb 25, 2019)
- GOWIN Semiconductor Announces Release of the New GOWIN EDA Tools for Improved Performance on New FPGA Product Families (Feb. 25, 2019)
- Syntiant Brings Speech Interfaces to the Edge With New Ultra-Low-Power Neural Decision Processors (Feb 25, 2019)
- PSA Certified: Building Trust in IoT (Feb 25, 2019)
- Racyics extends its Silicon Proven ABB IP Portfolio (Feb 25, 2019)
- Synopsys and Palma Ceia SemiDesign Collaborate to Develop a Complete Hardware/Software NB-IoT IP Solution (Feb. 25, 2019)
- Arm and Vodafone Commit to Work Together to Simplify Internet of Things (IoT) Deployment (Feb. 25, 2019)
- Intel and Apple Among Stocks Set to Gain on Improving U.S.-China Relations (Feb. 25, 2019)
- Arasan announces the immediate availability of its MIPI D-PHY / C-PHY Combo IP for TSMC 22nm SoC Designs (Feb. 23, 2019)
- How does Huawei construct a car? Explain the key technologies of autonomous driving and electric vehicles (Feb. 22, 2019)
- Trump: No block anymore, the United States wants to compete 5G (Feb. 22, 2019)
- Shocked! 2.56 million private data was leaked. Who will protect the "face password"? (Feb. 22, 2019)
- What lithography challenges are faced by fan-out packages? (Feb. 22, 2019)
- Nurlink Launches NB-IoT and GNSS SoC Powered by CEVA-Dragonfly NB2 IP (Feb. 22, 2019)
- Xilinx Extends its Breakthrough Zynq UltraScale+ RFSoC Portfolio to Full sub-6GHz Spectrum Support (Feb 21, 2019)
- Indoor Positioning Accuracy Revolutionized with a State-of-the-Art Bluetooth-Enabled Solution (Feb 21, 2019)
- UltraSoC announces support for Western Digital RISC-V SweRV Core and OmniXtend cache-coherent interconnect (Feb 21, 2019)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2019 (Feb 21, 2019)
- Rambus and GLOBALFOUNDRIES to Deliver High-Speed SerDes on 22FDX for Communications and 5G Applications (Feb. 21, 2019)
- Synopsys and GLOBALFOUNDRIES Collaborate to Develop Industry's First Automotive Grade 1 IP for 22FDX Process (Feb 21, 2019)
- TrendForce: China's IC design output value increased by nearly 23% in 2018 (Feb. 20, 2019)
- Cadence Tools and IP Optimized for New Arm Neoverse N1 Platform to Advance the Cloud-to-Edge Infrastructure Market (Feb 20, 2019)
- Arm announces Neoverse N1 platform & Neoverse E1 platform built for cloud to edge infrastructure (Feb 20, 2019)
- Cadence and Green Hills Software Announce Strategic Partnership to Accelerate Embedded System Safety and Security (Feb 20, 2019)
- Nurlink Launches NB-IoT and GNSS SoC Powered by CEVA-Dragonfly NB2 IP (Feb 20, 2019)
- GLOBALFOUNDRIES Crosses Billion-Dollar Design Win Threshold with 8SW RF SOI Technology (Feb 20, 2019)
- JEDEC Updates Standard for Low Power Memory Devices: LPDDR5 (Feb 20, 2019)
- Samsung, Toshiba Detail AI Chips (Feb 20, 2019)
- Globalfoundries sees success for its diversification strategy (Feb 20, 2019)
- CoreHW launches a highly accurate indoor positioning solution (Feb 20, 2019)
- Wave Computing Creates MIPS Open Advisory Board (Feb 20, 2019)
- Intel Says FinFET-based Embedded MRAM is Production Ready (Feb 20, 2019)
- CEA-Leti & Stanford Target Edge-AI Apps with Breakthrough NVM Memory Cell (Feb 20, 2019)
- Cadence Reports Fourth Quarter and Fiscal Year 2018 Financial Results (Feb 20, 2019)
- Huawei Enters into MPEG LA's AVC Patent Portfolio License (Feb 20, 2019)
- Synopsys Fusion Design Platform Enables Successful Tapeout of Samsung Foundry's Industry-first Gate-All-Around Transistor SoC (Feb 20, 2019)
- 25 Gigabit Ethernet Consortium Offers Low Latency Specification for 50GbE, 100GbE and 200GbE HPC, Financial and Other Performance-Critical Networks (Feb 20, 2019)
- Our Next Step in Preparing the Cloud for 1T Intelligent Devices (Feb. 20, 2019)
- Former Qualcomm Vice President joined GF as President of China (Feb. 19, 2019)
- Open Source Hardware Benefits Procurement Practices (Feb 19, 2019)
- eMemory Receives ISSCC Award for Breakthrough Security Technology (Feb 19, 2019)
- Intel Buys Indian SoC Designer Ineda Systems (Feb 19, 2019)
- SiFive Sees Big Year for RISC-V (Feb. 19, 2019)
- Qualcomm Unveils World's Most Advanced Commercial Multimode 5G Modem to Accelerate Global 5G Rollout (Feb. 19, 2019)
- Moving AI Processing to the Edge Will Shake Up the Semiconductor Industry (Feb 19, 2019)
- Renesas Electronics Develops 28nm MCU with Virtualization-Assisted Functions for Next-Generation Automotive Architectures (Feb. 19, 2019)
- AccelerComm introduces software only 5G NR channel coding IP at MWC Barcelona 2019 (Feb 19, 2019)
- Autotalks and CEVA Collaborate on World's First Global V2X Solution (Feb. 19, 2019)
- GLOBALFOUNDRIES and Dolphin Integration to Deliver Differentiated FD-SOI Adaptive Body Bias Solutions for 5G, IoT and Automotive Applications (Feb. 19, 2019)
- UltraSoC selects Redtree for expanding European market opportunity (Feb 19, 2019)
- Xpeedic's IRIS Qualified on GLOBALFOUNDRIES 12LP Process for High-Performance Applications (Feb. 19, 2019)
- TSMC prepares for the second generation 7nm and 5nm, and grabs the ASML half EUV lithography machine (Feb. 18, 2019)
- The 5G era is coming! Unicom delivered the first batch of 5G test smartphone (Feb. 18, 2019)
- Palma Ceia SemiDesign Announces Silicon-Proven Dual Band LTE NB-IoT Transceiver for IoT Applications (Feb. 18, 2019)
- TSMC January 2019 Revenue Report (Feb 18, 2019)
- Chips&Media paving new road towards 8K with launch of Dual-CORE HEVC+H.264 combined codec IP (Feb. 18, 2019)
- Revolutionary automotive industry development - car autopilot (Feb. 18, 2019)
- Global wafer monthly capacity ranking: the fastest growth rate is in the mainland (Feb. 15, 2019)
- SMIC's revenue in China in 2018 is high, and breakthrough in 12nm process research and development (Feb. 15, 2019)
- UltraSoC extends on-chip analytics architecture for the age of machine learning, artificial intelligence and parallel computing (Feb. 15, 2019)
- Soitec Becomes Strategic Partner of Silicon Catalyst Start-up Incubator (Feb 15, 2019)
- Cadence Selected as Primary EDA Tool Vendor by GLOBALFOUNDRIES (Feb. 15, 2019)
- Can MIPS Leapfrog RISC-V? (Feb. 15, 2019)
- Huawei's defeat of Apple is not a user's sentiment, but really depends on… (Feb. 14, 2019)
- UMC Reports Sales for January 2019 (Feb 14, 2019)
- SmartDV Unveils SimXL Portfolio of Synthesizable Transactors for Hardware Emulation, FPGA Prototyping Platforms (Feb 14, 2019)
- Mobile Semiconductor Introduces a 22nm FDX (FDSOI) ULP Memory Compiler with Market Leading Features (Feb 14, 2019)
- Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity (Feb 14, 2019)
- eSilicon builds momentum as a strong tier one FinFET ASIC supplier (Feb 14, 2019)
- Next-generation Armv8.1-M architecture: Delivering enhanced machine learning and signal processing for the smallest embedded devices (Feb. 14, 2019)
- SMIC Reports 2018 Fourth Quarter Results (Feb 14, 2019)
- Andes Technology Records 1 Billion SoC Shipments in 2018 Based on Its CPU IP and 3.5 Billion Since Inception (Feb 14, 2019)
- Sital Technology Announces the World's First Secured 1553 Component (Feb 14, 2019)
- The Future of the Cars and ADAS (Feb. 14, 2019)
- How does Wi-Fi 6 increase more speed with more devices? (Feb. 14, 2019)
- What will be the biggest problem facing the self-driving field in 2019? (Feb. 13, 2019)
- Britain is considering prohibiting Huawei from participating in large-scale network construction (Feb. 13, 2019)
- Can Arm Survive RISC-V Challenge? (Feb. 13, 2019)
- CEVA, Inc. Announces Fourth Quarter and Year End 2018 Financial Results (Feb 13, 2019)
- Silicon Creations' PLL Technology Contributes to the First 7nm Mass Production Mining Chip (Feb 13, 2019)
- Apple A13 is exclusively manufactured by TSMC and will debut on this year's iPhone. (Feb. 12, 2019)
- ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly (Feb 12, 2019)
- AccelerComm Lands Funding for 5G New Radio and 4G LTE Networks IP (Feb. 12, 2019)
- Achronix Announces Partner Program for Speedster, Speedchip, and Speedcore Ecosystem (Feb 12, 2019)
- Sankalp Semiconductor to Exhibit & Participate at IESA Vision Summit 2019 (Feb 12, 2019)
- Pliops Raises $30 Million in Series B Funding Led by SoftBank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML (Feb 12, 2019)
- Andes Technology Corp. Targets Deeply Embedded Protocol Processing and Entry-level MCUs With the New N22, the Smallest RISC-V Core in its V5 Family (Feb 12, 2019)
- 200mm Fabs to Add 700,000 Wafers Through 2022, SEMI Reports (Feb 12, 2019)
- TDK-Micronas renews its trust in Dolphin Integration's RAM and ROM Silicon IPs (Feb. 11, 2019)
- AIStorm Raises $13.2M to Bring Real-Time AI-in-Sensor Technology to the Edge at a Fraction of the Cost (Feb 11, 2019)
- GUC Monthly Sales Report - Jan 2019 (Feb 11, 2019)
- Diodes acquires TI Scottish wafer fab GFAB (Feb. 11, 2019)
- ST and Hyundai Autron work together to build a joint development lab for environmentally friendly automotive solutions (Feb. 11, 2019)
- FBI fishing law enforcement, saying that Huawei steals American diamond glass technology (Feb. 11, 2019)
- Take the lead and build the early supply chain path to 5G. (Feb. 09, 2019)
- SoC-e networking IP porfolio extends with SpaceWire: The standard for Spacecraft communication networks (Feb 08, 2019)
- China IC Production Forecast to Show a Strong 15% 2018-2023 CAGR (Feb 08, 2019)
- ISM forecast: US manufacturing will have higher growth in 2019 than in previous years (Feb. 08, 2019)
- New intoPIX FlinQ Image Technology Empowers Next Generation DM NVX Network AV (Feb. 07, 2019)
- Apple, Q'comm Fight Over Engineers (Feb 07, 2019)
- Eclipse Ventures Adds Mike McNamara and Sanjay Jha As General Partners (Feb 07, 2019)
- Graphcore leverages Mentor DFT solutions to speed time to market for innovative AI acceleration chip (Feb. 07, 2019)
- NVMe Over TCP Will Take Time to Eclipse RDMA (Feb 07, 2019)
- Logic Design Solutions Introduces the first member of NVMe HOST RECORDER IPs (Feb. 07, 2019)
- IDC executives: There will be 10 major changes in the electronic component supply chain in 2019 (Feb. 07, 2019)
- EDN Names Achronix's Speedcore Gen4 eFPGA to its Hot 100 Products of 2018 (Feb 06, 2019)
- Arm takes centre stage at Mobile World Congress 2019 (Feb 06, 2019)
- AdaCore Enhances Security-Critical Firmware With NVIDIA (Feb 06, 2019)
- SmartDV Supports RISC-V Movement with TileLink Verification IP for RISC-V Based Systems (Feb. 06, 2019)
- Audinate adds intoPIX best-in-class JPEG2000 Technology to new Dante AV Product Design Suite (Feb. 06, 2019)
- Norway issued an annual report pointing to Huawei, the embassy responded: absurd attacks (Feb. 06, 2019)
- Xilinx Introduces HDMI 2.1 IP Subsystem (Feb 05, 2019)
- MuxLab Leverages intoPIX's Ultra Low Latency JPEG 2000 to Manage 4K60 on 1GbE Networks (Feb. 05, 2019)
- Arteris IP FlexNoC Interconnect Used by NationalChip for Set Top Box (STB) Chips (Feb. 05, 2019)
- What are the new trends in the semiconductor supply chain in 2019? (Feb. 05, 2019)
- IoT new comers is eager to take Commercial Market (Feb. 05, 2019)
- After FB, Google was disqualified from development due to violations of monitoring iPhone user behavior. (Feb. 04, 2019)
- intoPIX and Macnica Preview a 4K AV over 1GbE Module Powered by TICO-XS and ST 2110 IP Transport for Pro AV Market at ISE 2019 (Feb 04, 2019)
- FABU Technology Selects Synopsys' DesignWare IP Portfolio to Deliver Intelligence in ADAS and Autonomous Driving SoCs (Feb 04, 2019)
- Mobile Semiconductor Introduces A New 55nm High Density Memory Compiler Especially Designed For IoT Devices (Feb 04, 2019)
- Gartner Says Four Chinese OEMs Were Among the Top 10 Global Semiconductor Customers in 2018 (Feb 04, 2019)
- Renesas to Cut 1,000 Jobs in Japan (Feb 04, 2019)
- Global Semiconductor Sales Increase 13.7 Percent to $468.8 Billion in 2018 (Feb 04, 2019)
- GF 1.56 billion for sale 200mm fab! TSMC earned a lot this time. (Feb. 02, 2019)
- Wi-Fi and Bluetooth win the future of IoT wireless connectivity (Feb. 02, 2019)
- FTC's monopoly investigation of Qualcomm reveals the operation of 2G/3G/4G/5G patent fees (Feb. 01, 2019)
- Semiconductor R&D Spending Will Step Up After Slowing (Feb 01, 2019)
- The latest development of new fabs in China (Feb. 01, 2019)
- Select AI chip for embedded design (Feb. 01, 2019)
- Explore the secrets of Qualcomm's Self-driving program (Feb. 01, 2019)
- 5G expansion is far more difficult than our imagination (Feb. 01, 2019)
- Annual Silicon Shipments Hit Record High, Market Exceeds $10 Billion for First Time Since 2008 (Jan 31, 2019)
- Hardent and Xilinx Collaborate to Deliver Complete 8K Ready DisplayPort 1.4 IP Subsystem (Jan. 31, 2019)
- Sital's Enhanced Reliability FPGA IP powers NASA's GEDI on board communications (Jan 31, 2019)
- Feature-rich RISC-V IDE Available for Free Download (Jan. 31, 2019)
- VIS To Acquire GLOBALFOUNDRIES' Fab 3E In Singapore (Jan 31, 2019)
- Bluespec Returns from Landmark RISC-V Summit; CTO Nikhil Leads Discussion on ISA Formal Spec (Jan 31, 2019)
- SMIC and Etrasemi jointly announced the first heterogeneous integration of GaAs RF front-end module wafer-level microsystems (Jan. 30, 2019)
- Sankalp Semiconductor Appoints Abhijit Dutta as Head of Mixed Signal Solutions (Jan 30, 2019)
- eSilicon and Wild River Technology Announce Advanced SerDes Test System (Jan. 30, 2019)
- AdaCore Joins the RISC-V Foundation to Provide C and Ada Compilation Support (Jan 30, 2019)
- The global semiconductor industry will slow down in the next two years with Long-term optimism (Jan. 30, 2019)
- Rambus Announces Tapeout of GDDR6 Memory PHY on TSMC 7nm Process Technology (Jan. 30, 2019)
- OEM orders are difficult to grab, they have to cut prices by 20%? (Jan. 30, 2019)
- Zhuhai Chuangfeixin Antifuse eFPGA IP (Jan. 29, 2019)
- SMIC 14nm is mass-produced this year! (Jan. 29, 2019)
- The United States has filed 23 criminal charges against Huawei and Meng Wanzhou (Jan. 29, 2019)
- The United States accuses Huawei, extradition of Meng Wanzhou? The Ministry of Foreign Affairs and Huawei responded (Jan. 29, 2019)
- CEVA Locates More Success with Bluetooth 5.1 IP (Jan. 29, 2019)
- Arteris IP Adds 20 New Licensees and Releases Three New Products in 2018 (Jan. 29, 2019)
- eSilicon Announces Technical Advisory Board (Jan 29, 2019)
- Zhuhai Chuangfeixin Announces Antifuse eFPGA IP (Jan 29, 2019)
- Rambus Reports Fourth Quarter and Fiscal Year 2018 Financial Results (Jan 29, 2019)
- Semiconductor mergers and acquisitions in 2018, the total turnover exceeded 734.5 billion (Jan. 28, 2019)
- Imagination Technology and its AI ecosystem (Jan. 28, 2019)
- Semiconductor Unit Shipments Exceeded 1 Trillion Devices in 2018 (Jan 28, 2019)
- Silicon Creations Relies on Silvaco's Custom Design Flow for New Advanced FinFET Designs (Jan. 28, 2019)
- China, Chips, and 2019 Still Unclear (Jan 28, 2019)
- Dolphin Integration appoints Philippe Berger as Chief Executive Officer (Jan. 28, 2019)
- MosChip announces acquisitions to strengthen Semiconductor Business Unit & CEO appointment (Jan 28, 2019)
- The 10 most noteworthy Fabless semiconductor startups (Jan. 26, 2019)
- Huawei introduced its 5G chips (Jan. 25, 2019)
- Cost/performance are outstanding, FD-SOI forces is rising (Jan. 25, 2019)
- North American Semiconductor Equipment Industry Posts December 2018 Billings (Jan 25, 2019)
- Taiwan will announce the blacklist of mainland technology companies (Jan. 24, 2019)
- Artificial intelligence will enter the EDA industry (Jan. 24, 2019)
- 2018 mobile phone panel shipment ranking: Samsung first (Jan. 24, 2019)
- GOWIN Semiconductor Licenses Intrinsic ID's BroadKey to Deliver Hardware Root of Trust for IoT Security (Jan. 24, 2019)
- Synopsys' New ARC EM Software Development Platform Accelerates Software Development for IoT, Sensor Fusion, and Voice Recognition Applications (Jan. 24, 2019)
- Imagination's New CEO Plots Turnaround Strategy (Jan 24, 2019)
- Multicore Association Releases Version 2 Specification for Advanced Tool Support with Multicore Processors (Jan 24, 2019)
- Xilinx Reports Record Revenues And EPS In Fiscal Third Quarter (Jan 24, 2019)
- Eta Compute selects IAR Embedded Workbench as the Preferred Toolchain for new neural network-based AI SoCs (Jan. 24, 2019)
- Canadian Ambassador in China: Meng Wanzhou holds strong arguments and may not be extradited to USA (Jan. 24, 2019)
- DRAM transaction price decline in the first quarter of 2019 expanded to nearly 20% (Jan. 23, 2019)
- DesignCon 2019: eSilicon to demonstrate 7nm 56G DSP SerDes over 5-meter Samtec cable assembly (Jan 23, 2019)
- Inomize is selected to develop and supply HP Indigo next generation ASIC for Digital Press (Jan 23, 2019)
- Global GDP Growth Increasingly Important Driver of IC Market Growth (Jan 23, 2019)
- Hailo Expands Series A Round to $21M and Launches Hailo-8 Fast Track Program for Select Customers (Jan 23, 2019)
- NXP's Reger Re-defines CTO's Role (Jan 23, 2019)
- China launched domestic 5G driverless bus official road test (Jan. 23, 2019)
- The United States will officially propose the extradition of Meng Wanzhou to the United States for trial! (Jan. 22, 2019)
- Will NVIDIA's next-generation 7nm GPU be manufactured by Samsung? (Jan. 22, 2019)
- MorningCore Technology Licenses Flex Logix's eFPGA on TSMC's 12FFC Process (Jan. 22, 2019)
- 5G may go hand in hand with autonomous vehicles? (Jan. 22, 2019)
- AI, 5G, Sino-US trade war... 2019 when prosperity and uncertainty coexist (Jan. 22, 2019)
- Arteris IP FlexNoC Interconnect Licensed by NETINT Technologies for PCIe 4.0 Enterprise SSD Controllers (Jan. 22, 2019)
- TSMC's Outlook Underscores Foundry Market Challenges (Jan 22, 2019)
- MorningCore Technology Licenses Flex Logix's Embedded Field-Programmable Gate Array on TSMC's 12FFC Process (Jan 21, 2019)
- Six major development trends of the Internet of Things in 2019 (Jan. 21, 2019)
- Uber plans to develop an unmanned electric scooter (Jan. 21, 2019)
- Soitec Expands Collaboration with Samsung Foundry on FD-SOI Wafer Supply (Jan. 21, 2019)
- Huawei CEO talks about the prohibition of Huawei from entering Europe and the United States: they will have to buy it. (Jan. 21, 2019)
- 7 nanometer strong outbreak (Jan. 20, 2019)
- Updated HBM Standard Geared for HPC, Networking (Jan 18, 2019)
- Q'comm Exec: "Automotive Changed Our DNA" (Jan 18, 2019)
- Value of Semiconductor Mergers and Acquisitions Falls Considerably (Jan 18, 2019)
- Synopsys Releases Seven Forecasts of Software Security Industry in 2019 (Jan. 18, 2019)
- "IoT hypothesis" really trapped me (Jan. 18, 2019)
- From "prohibited" to "compliance": a lesson that ZTE spent $2 billion to learn (Jan. 18, 2019)
- New generation AI grade OTP/MTP/NVM provides the best memory solution for new generation ICs (Jan. 17, 2019)
- Huawei has stolen the technology of the United States again? it was criminally prosecuted. (Jan. 17, 2019)
- Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC (Jan 17, 2019)
- Rambus Acquires Memory Technology Assets of Diablo Technologies (Jan 17, 2019)
- First Battery-Free Bluetooth Sticker Sensor Tag Demonstrated at NRF (Jan 17, 2019)
- Xilinx Technology to Power Baidu Brain Edge AI Applications (Jan. 17, 2019)
- New Generation OTP/MTP/NVM from UK Artificial General Intelligence Cosmos IP total solution (Jan 17, 2019)
- TSMC: This year will be Slow year, and revenue growth of 5-10% will not be achieved. (Jan. 17, 2019)
- Global semiconductor revenues increased by 13.4% in 2018 (Jan. 17, 2019)
- Sensors, mobile and insights to create tomorrow's technology (Jan. 17, 2019)
- Internet of Things drives enterprise digital transformation (Jan. 17, 2019)
- To accelerate innovation and meet 2019 (Jan. 17, 2019)
- 3D sensors will grow rapidly in the mobile phone and automotive markets (Jan. 17, 2019)
- Mentor's Catapult HLS enables Chips&Media to deliver deep learning hardware accelerator IP in half the time (Jan. 16, 2019)
- After 2018 years of unrest, what is the development of the global semiconductor industry last year? (Jan. 16, 2019)
- Declare warfare TSMC, Samsung 7nm EUV process mass production this year (Jan. 15, 2019)
- Arasan Announces availability of its Total UFS 3.0 IP Solution for Xilinx FPGA's (Jan. 15, 2019)
- Imagination Technologies delivers new AI, graphics and connectivity technology for 2019 (Jan. 15, 2019)
- Faced with five major pain points, 5G construction is not as simple as imagined (Jan. 15, 2019)
- Intel wants to buy AMD? Who will be the new CEO? (Jan. 15, 2019)
- Silicon Valley Company unveils the first automotive architecture exploration platform with Time-Sensitive Networking (IEEE802.1Q) protocol (Jan 15, 2019)
- UltraSoC appoints new VP of Global Sales as demand surges for embedded analytics solutions (Jan 15, 2019)
- HDL Design House Webinar: Reducing Integration and Verification Effort in SoC Design (Jan 15, 2019)
- Silvaco Inc. Achieves Fourth Consecutive Year of Double-Digit Growth in Sales Bookings and GAAP Revenue (Jan 15, 2019)
- Semiconductor Leaders' Marketshares Swell Over the Past 10 Years (Jan 15, 2019)
- A New DSP Approach to Accelerate 5G and AI Design Development (Jan 15, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Baidu for Kunlun AI Cloud Chips for Data Center (Jan 15, 2019)
- Synopsys Unveils Coverity Enhancements to Extend Breadth, Depth, and Scalability of Enterprise Application Security Testing (Jan. 15, 2019)
- Aldec shortens time of ASIC design prototype bring-up in FPGA with HES-DVM Proto mode (Jan. 14, 2019)
- Another Huawei executive was arrested abroad! Related to the US-China technical war? (Jan. 14, 2019)
- Will Poland, which arrests Huawei executives, follow the US footsteps to ban Huawei 5G? (Jan. 14, 2019)
- New Generation OTP/MTP/NVM Total Solution from AGICIP ( Artificial General Intelligence Cosmos IP ) (Jan. 14, 2019)
- Habana Labs Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using DesignWare IP (Jan. 14, 2019)
- VSORA：A New DSP Approach to Accelerate 5G and AI Design Development (Jan. 14, 2019)
- IDT Licenses Intrinsic ID's QuiddiKey Hardware Root of Trust for IoT Security (Jan. 14, 2019)
- CEVA Celebrates 10 Billion CEVA-powered Devices Shipped by Ringing the Nasdaq Opening Bell (Jan 14, 2019)
- Apple's $1 Billion Baseband Deal (Jan 14, 2019)
- Apple Testifies in Q'comm Patent Case (Jan 14, 2019)
- zGlue Takes Moore's Law Beyond the Possibilities of System-on-Chips with Custom Chips on Demand (Jan 14, 2019)
- CEVA Opens New Research and Development Center in Bristol, U.K. (Jan 14, 2019)
- UMC retreats from China DRAM venture, Report says (Jan 14, 2019)
- Flash Memory Remains Primary Target for Capex Spending (Jan 14, 2019)
- The United States bans Huawei from shppping back the technology researched in the United States (Jan. 11, 2019)
- The United States restricts the export of AI technology, and the Chinese AI is enjoying a major benefit? (Jan. 11, 2019)
- China's wafer capacity growth rate is the world's first (Jan. 10, 2019)
- Apple's bleak prospects affect global suppliers (Jan. 10, 2019)
- Six employees of TSMC supplier were arrested for leaking to the mainland (Jan. 10, 2019)
- TSMC's December revenue was (Jan. 10, 2019)
- Apple, Samsung, and Qualcomm are all ARM camps. Why not Huawei? (Jan. 10, 2019)
- Faraday Unveils ASIC Success in Factory Automation (Jan. 10, 2019)
- Greenipcore: Secure SOC for Security Aware Applications (Jan. 10, 2019)
- Samsung chip and mobile phone sales all slowed down in China (Jan. 10, 2019)
- IFI CLAIMS Announces 2018's Top U.S. Patent Recipients (Jan 10, 2019)
- Semis Hope for Soft Landing (Jan 10, 2019)
- TSMC December 2018 Revenue Report (Jan 10, 2019)
- Weebit Nano and Silvaco Form Development Program Partnership to Create ReRAM Models and Design Tools (Jan. 09, 2019)
- Innovium Selects Synopsys' IC Validator for Physical Signoff (Jan. 09, 2019)
- Silicon Valley Company Mirabilis Design unveils the first automotive architecture exploration platform with Time-Sensitive Networking (IEEE802.1Q) protocol (Jan. 09, 2019)
- OPENEDGES and TAKUMI partner to promote ORBIT Memory Subsystem IP in Japan (Jan. 09, 2019)
- NXP and Kalray Enter Partnership to Develop Platform for Safe, Reliable Autonomous Driving (Jan 09, 2019)
- UMC Reports Sales for December 2018 (Jan 09, 2019)
- Everspin Ships the World's First Pre-Production 28 nm 1 Gb STT-MRAM Customer Samples (Jan 09, 2019)
- VeriSilicon's Artificial Intelligence Processor IP Used in Next-Generation Large Screen Smart Home System-on-Chip (SoC) (Jan 09, 2019)
- China Market Drives Essentially All Pure-Play Foundry Growth in 2018 (Jan 09, 2019)
- VeriSilicon and NXP Collaborate on Machine Learning Across Wide Range of ML-Enabled Devices (Jan 09, 2019)
- Vayyar Selects Cadence Tensilica Vision DSP for Advanced Millimeter Wave 3D Imaging Radar Solution (Jan 09, 2019)
- Under the shadow of the trade war, Chinese manufacturers are still willing to go to CES? (Jan. 08, 2019)
- Inside Secure Debuts Industry's First Software-Only Solution for High-Bandwidth Digital Content Protection (HDCP) 2.3 (Jan 08, 2019)
- China Wafer Production Capacity Growth Fastest in World (Jan 08, 2019)
- Huawei released the server processor based on ARM architecture, Kun Peng 920, and said it will continue to cooperate with Intel. (Jan. 07, 2019)
- What will be the biggest problem facing the self-driving field in 2019? (Jan. 07, 2019)
- The Vietnam electronics industry profits from the Trade War between Sino-US. (Jan. 07, 2019)
- The Federal Trade Commission (FTC) accused Qualcomm of allegedly damaging the competition in the smartphone industry (Jan. 07, 2019)
- Innosilicon Announces silicon proven and mass production of the World First Silicon Proven Commercial GDDR6 IP on Samsung's 14LPP Process (Jan. 07, 2019)
- INVECAS Announces World's First HDMI 2.1 with HDCP2.3 Chip & IP Solutions for TV, AVR, Soundbar and STB (Jan. 07, 2019)
- Bestechnic Licenses CEVA Bluetooth 5 Dual Mode IP for its Audio Platforms (Jan. 07, 2019)
- CEVA Introduces WhisPro, Neural Network-Based Speech Recognition Technology For Voice Assistants and IoT devices (Jan. 07, 2019)
- QuickLogic Acquires SensiML SaaS AI Company (Jan 07, 2019)
- Toshiba Develops DNN Hardware IP for Image Recognition AI Processor Visconti 5 for Automotive Driver Assistance Systems (Jan 07, 2019)
- Cisco Announces Intent to Acquire Silicon Photonics Leader, Luxtera (Jan 07, 2019)
- ESD Alliance Reports EDA Industry Revenue Increase For Q3 2018 (Jan 07, 2019)
- Gartner Says Worldwide Semiconductor Revenue Grew 13.4 Percent in 2018; Increase Driven by Memory Market (Jan 07, 2019)
- GUC Monthly Sales Report - Dec 2018 (Jan 07, 2019)
- Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level (Jan 07, 2019)
- Around the image sensor, semiconductor giants will start a fight (Jan. 05, 2019)
- Samsung will have a big customer? Nvidia may adopt Samsung 7nm technology in the future (Jan. 04, 2019)
- 7nm node who wins ? Multi-data perspective comparing Samsung and TSMC (Jan. 04, 2019)
- Apple’s first income warning, blame the Chinese market? (Jan. 04, 2019)
- In 2019, 5G and AI will develop under the gloom of Sino-US trade wars. (Jan. 04, 2019)
- The German iPhone ban will take effect! Why can't China ban? (Jan. 04, 2019)
- CEVA Announces CEVA-BX, a New All-Purpose Hybrid DSP / Controller Architecture for Digital Signal Processing and Digital Signal Control in IoT devices (Jan. 04, 2019)
- intoPIX introduces the new JPEG XS standard at CES (Jan. 04, 2019)
- Does the autopilot need a laser radar? (Jan. 03, 2019)
- New Challenge of SRAM (Jan. 03, 2019)
- SkyWater Launches Direct Multi Project Wafer (MPW) FastShuttle Program, Expanding Capabilities to Meet Growing Customer Momentum (Jan. 03, 2019)
- Arm unveils new image signal processors to meet higher image quality requirements (Jan. 03, 2019)
- Nordic Semiconductor Licenses and Deploys CEVA DSP in Low Power Cellular IoT SoC (Jan. 03, 2019)
- USB-IF Launches USB Type-C Authentication Program (Jan 03, 2019)
- Researchers Explore Emerging Memories for AI (Jan 03, 2019)
- VESA Introduces DisplayHDR True Black High Dynamic Range Standard for Organic Light Emitting Diode (OLED) and other Emissive Displays (Jan 03, 2019)
- Wi-Fi Startups Polish HaLow for IoT (Jan 03, 2019)
- Internet of Things Technology Forecast for 2019 (Jan. 02, 2019)
- Xiaomi leads the domestic wearable market Huawei and BBK is chasing after (Jan. 02, 2019)
- The semiconductor industry is not optimistic in the future, autonomous driving may become the savior (Jan. 02, 2019)
- In-depth study of the key to anti-counterfeiting technology: network security certification chip (Jan. 02, 2019)
- Samsung mobile phone manufacturing factory closed, but announced that it wants to hire more employees in China (Jan. 02, 2019)
- Foxconn plans to invest 9 billion US dollars to build a chip factory in China (Jan. 02, 2019)
- Optek Licenses and Deploys CEVA Bluetooth IP in its latest Multimedia Platform (Jan. 02, 2019)
- Seeking emerging memory for further development of artificial intelligence (Jan. 02, 2019)
- SST Announces Automotive Grade 1 Qualification of Embedded SuperFlash Memory on UMC's 55 nm Platform (Jan. 02, 2019)
- Global Semiconductor Sales Up 9.8 Percent Year-to-Year in November (Jan 02, 2019)
- 2018 TSMC's surprise and joy | Summary 2018 (Jan. 01, 2019)
- Linux meet RISC-V: open source groups team up (Jan. 01, 2019)
- The US is in danger, so they want to ban Huawei ZTE equipment? (Dec. 31, 2018)
- Attacking the 10nm process Intel chips take root in Israel (Dec. 31, 2018)
- Foxconn plans to spend $9 billion to build Zhuhai Fab (Dec. 28, 2018)
- Apple's three-month market value evaporates an Alibaba, so save yourself! (Dec. 28, 2018)
- Avoid hidden costs of automotive isolated designs (Dec. 28, 2018)
- Guess the seven stops of the artificial intelligence "train" in 2019 (Dec. 28, 2018)
- Artificial intelligence still has trust problems (Dec. 28, 2018)
- Reuters: Trump will order the ban on Huawei and ZTE next year, the fastest January implementation (Dec. 27, 2018)
- RISC-V will help China occupy the center of the SoC field (Dec. 27, 2018)
- CEVA Reaches New Milestone with 10th Design Win for its SIG Qualified Bluetooth Mesh IP (Dec. 27, 2018)
- InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets (Dec. 27, 2018)
- Do you know the true progress of the 5G network? (Dec. 27, 2018)
- Foxconn Reportedly Readies Chip Fab in China (Dec 27, 2018)
- Apple vs. the Wireless Industry (Dec. 26, 2018)
- Samsung is also a traitor? South Korea's FTC and LG procure Qualcomm (Dec. 26, 2018)
- Chairman of Huawei responded to questions such as Meng Xizhou and the crisis of Western trust (Dec. 25, 2018)
- Global server shipment ranking in 2018: TOP5 China has three seats (Dec. 25, 2018)
- The United States accused two Chinese citizens of hacking, and the Foreign Ministry responded with a tough response. (Dec. 24, 2018)
- Samsung 7nm EUV won a big customer! Will make the next generation processor for IBM (Dec. 24, 2018)
- Prospects for the development of the semiconductor industry in 2019 (Dec. 24, 2018)
- Huawei self-developed Arm server chip released, praise and question (Dec. 23, 2018)
- How is the commercial situation of each RISC-V product? (Dec. 22, 2018)
- Qualcomm applied for part of the iPhone will be banned in Germany (Dec. 21, 2018)
- ADAS Boosted by 2018 (Dec. 21, 2018)
- NXP China sues former employees for entrepreneurship: more important than talent is the spirit of contract (Dec. 21, 2018)
- TSMC's 3nm plant passed the EIA and strived to mass production in 2022. (Dec. 20, 2018)
- Graphcore secures lead in global AI chip race with $200 million in new capital from BMW, Microsoft and leading financial investors (Dec 20, 2018)
- Attopsemi Technology Attended SemIsrael 2018 and Presented a Talk (Dec. 20, 2018)
- Dover Microsystems' Revolutionary Silicon IP Cybersecurity Approach Fuels Momentum (Dec 20, 2018)
- Attopsemi Technology Attended SemIsrael 2018 and Presented a Talk "100% Testable OTP for Automotive" (Dec 20, 2018)
- AMEC 5nm etching machine will be used for TSMC 5nm chip manufacturing (Dec. 19, 2018)
- Arm announces new "Automotive Enhanced" processor designed for safe next-gen driver experiences (Dec 19, 2018)
- Industry Leaders Collaborate with Synopsys on Modeling Standards to Address Design Down to 2nm (Dec. 19, 2018)
- No longer open to the outside world! Intel will close the foundry business (Dec. 18, 2018)
- All are improving AI performance, why Apple/Huawei Hisilicon integrated NPU, Qualcomm and MediaTek have chosen to optimize? (Dec. 18, 2018)
- Kneron and Cadence work together to bring advanced vision applications to a new generation of smart devices (Dec. 18, 2018)
- The world's first! Huawei has won more than 25 5G contracts and shipped tens of thousands of 5G base stations (Dec. 18, 2018)
- Semiconductors enter the off-season Supply chain is estimated to recover in the second quarter of next year (Dec. 18, 2018)
- Imagination announces new CEO candidate (Dec. 18, 2018)
- MIPS Goes Open Source (Dec. 18, 2018)
- Former Intel exec to lead Arm's automotive and embedded business (Dec 18, 2018)
- Total Fab Equipment Spending Reverses Course, Growth Outlook Revised Downward (Dec 18, 2018)
- JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard (Dec 18, 2018)
- Wave Computing Launches the MIPS Open Initiative To Accelerate Innovation for the Renowned MIPS Architecture (Dec 18, 2018)
- CEVA's NeuPro Family of Edge AI Processors Wins "Digital Semiconductor Product of the Year" at Elektra Awards 2018 (Dec 18, 2018)
- eMemory's Reprogrammable NeoMTP Qualified on GLOBALFOUNDRIES' 130nm BCDLite and BCD Technology Platforms for Automotive Applications (Dec. 17, 2018)
- US postpones tax increase time for China Sino-US trade friction is expected to "close truce" (Dec. 17, 2018)
- Arasan Announces availability of its Total I3C IP Solution for Xilinx FPGA's (Dec. 17, 2018)
- Vidtoo Technology Licenses Codasip's Bk3 RISC-V Processor for High-Performance Computing SoC (Dec. 17, 2018)
- Bluespec, Inc. Releases a Second Family of Open-Source RISC-V Processors to Spur Open Innovation (Dec. 17, 2018)
- NSITEXE Develops Test Chip with Next-generation Semiconductor IP Core Called a DFP (Dec 14, 2018)
- Western Digital Delivers New Innovations to Drive Open Standard Interfaces and RISC-V Processor Development (Dec 14, 2018)
- The US officially extended the $200 billion Chinese goods tax increase date to March 1 (Dec. 14, 2018)
- Qualcomm applied to China for a ban on iPhone XS/XS Max/XR again (Dec. 14, 2018)
- DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019 (Dec 14, 2018)
- Mass production of the world's first 12-inch 3D TSV wafer-level package production line (Dec. 14, 2018)
- Huawei lost another "alliance": France Orange confirmed that Huawei 5G equipment is not used (Dec. 14, 2018)
- Efinix Drives AI Edge Computing with Trion T20 FPGA Samples and Expansion of Product Offering to 200K LEs with T200 FPGA (Dec 13, 2018)
- PCS Releases New 3GPP LTE Release 14-Compliant NB-IoT Transceiver IP Supporting High-Band and Low-Band Operation (Dec. 13, 2018)
- Huawei payed $2 billion restructuring but in Japan Huawei is still banned (Dec. 12, 2018)
- Meng wanzhou was released on bail, and former Canadian diplomat was arrested in China (Dec. 12, 2018)
- Fuzhou Intermediate People's Court called the Apple ban: no appeal, no second instance (Dec. 12, 2018)
- AI In China: It Begins with Toys (Dec. 12, 2018)
- Numem to Present at IEDM 2018's MRAM Global Innovation Forum (Dec 12, 2018)
- Movellus Closes Second Round of Intel Capital Funding (Dec 12, 2018)
- Minima Processor and NXP Join Forces to Deliver Ultra-Low-Power DSP Solutions (Dec. 12, 2018)
- Semiconductor Equipment Sales Forecast: $62 Billion in 2018 A New Record, Market Reset in 2019 with New High in 2020 (Dec 12, 2018)
- Menta Selected as Sole Provider of Embedded FPGAs for European Processor Initiative (Dec 12, 2018)
- MIPI Alliance Releases I3C Basic Interface Specification for Widespread Implementation in Mobile and Beyond (Dec 12, 2018)
- CEVA's NeuPro Family of Edge AI Processors Wins "Digital Semiconductor Product of the Year" at Elektra Awards 2018 (Dec. 12, 2018)
- AccelerComm opens office in Shanghai to exploit Asian market growth in telecommunications (Dec 12, 2018)
- BitSim Demonstrates an Embedded Vision Platform (Dec. 12, 2018)
- Samsung will make up for the loss of memory price reduction through foundry: 2020 push 3nm process (Dec. 12, 2018)
- Samsung, Intel accelerate the embedded MRAM commercial footsteps (Dec. 12, 2018)
- SST and SK hynix system ic Partner to Expand Availability of Embedded SuperFlash Technology (Dec. 11, 2018)
- Siflower Produces Smart Home Access Points With Catena's Wi-Fi 11ac (WiFi-5) Front-End IP (Dec 11, 2018)
- Intel, Samsung Describe Embedded MRAM Technologies (Dec. 11, 2018)
- Flex Logix Unveils New Architectural Details on its NMAX Neural Inferencing Engine at the Edge AI Summit (Dec. 11, 2018)
- Faraday Reveals Its Multi-protocol Video Interface IP on UMC 28HPC (Dec. 11, 2018)
- Gowin Semiconductor Opens European Office and Commences Sales Operations Serving the EMEA Region (Dec 11, 2018)
- Kandou Announces 100th Patent Grant by U.S. Patent Office (Dec 11, 2018)
- D&R partner: Brite Semiconductor, Naneng Microelectronics, and PLDA Collaborate to Release Complete PCIe 2.0/3.0 Solution (Dec. 10, 2018)
- TSMC's November revenue was released, 7nm is the main shipping force (Dec. 10, 2018)
- Brite Semiconductor, Naneng Microelectronics, and PLDA Collaborate to Release Complete PCIe 2.0/3.0 Solution (Dec 10, 2018)
- TSMC November 2018 Revenue Report (Dec 10, 2018)
- Synopsys and imec Demonstrate Accelerated Modeling of Innovative Complementary FET (CFET) Technology (Dec. 10, 2018)
- UMC Reports Sales for November 2018 (Dec 10, 2018)
- Mythic Chooses Codasip to Deliver RISC-V Computing in their Revolutionary Neural Network Platform (Dec. 10, 2018)
- Credo selects Moortec's In-Chip Monitoring IP to optimise performance and reliability in their latest generation of SerDes chips (Dec. 10, 2018)
- NVM Express, Inc. Announces NVMe-MI 1.1 Specification in Ratification (Dec 10, 2018)
- Suddenly! Apple phones face a ban! China’s court agreed to Qualcomm’s request (Dec. 10, 2018)
- Samsung focuses on the new energy market and invests 2.4 billion US dollars to develop Tianjin factory (Dec. 10, 2018)
- Cadence Timing Signoff Tools Enable MaxLinear to Deliver Industry's First 400Gbps PAM4 SoC on 16FF Process (Dec. 10, 2018)
- Arm Releases IoT Predictions for 2019 (Dec. 10, 2018)
- Five highlights of the first open source microprocessor RISC-V summit (Dec. 09, 2018)
- French Finance Minister Bruno Le Maire welcomes Huawei's investment in France (Dec. 08, 2018)
- The Ministry of Foreign Affairs demanded the immediate release of Meng Wanzhou, and Huawei sent a letter to appease its suppliers. (Dec. 07, 2018)
- Codasip Releases Studio 8, a Breakthrough in RISC-V Automation, and the Bk7 RISC-V Processor Core for Real-Time Computing Applications (Dec. 06, 2018)
- CoreHW releases IP library with over 200 IP (Dec. 06, 2018)
- CEVA's Bluetooth 5 Low Energy Software and Link Layer IP Integrate with Atmosic Technologies Solutions for Battery-Free IOT Devices (Dec. 06, 2018)
- Zeno Demonstrates Scalability of World's Smallest SRAM Bitcell Technology to FinFET Technology Node at IEDM Conference (Dec 06, 2018)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2018 (Dec 06, 2018)
- CEA-LETI Develops Circuits for Neuromorphic Processors That Replace CMOS Transistor-Based Tcam Memory With Rram-Based Tcam Memory (Dec 06, 2018)
- Andes Custom Extension Further Accelerates Your High Performance RISC-V Processors (Dec. 06, 2018)
- Imagination announces PowerVR Series3NX Neural Network Accelerator, bringing multi-core scalability to the embedded AI market (Dec. 06, 2018)
- Achronix Announces Immediate Availability of Speedcore Gen4 eFPGA IP for AI/ML and Networking Hardware Acceleration Applications (Dec. 05, 2018)
- RISC-V Takes a Leap Forward (Dec. 05, 2018)
- GUC Monthly Sales Report - Nov 2018 (Dec 05, 2018)
- 3nm in progress! Samsung says the foundry business is crucial in the future (Dec. 05, 2018)
- Imagination announces PowerVR Series3NX Neural Network Accelerator, bringing multi-core scalability to the embedded AI market (Dec. 04, 2018)
- Codasip Secures $10M in Series A Financing to Expand RISC-V Processor Technology Offerings (Dec 04, 2018)
- Industry's First RISC-V SoC FPGA Architecture Brings Real-Time to Linux, Giving Developers the Freedom to Innovate in Low-Power, Secure and Reliable Designs (Dec 04, 2018)
- Imagination reveals new PowerVR Series9 GPUs (Dec 04, 2018)
- Wave Computing Appoints Industry Veteran Art Swift As President of its Recently Acquired MIPS Licensing Business (Dec 04, 2018)
- Global Semiconductor Sales Increase 12.7 Percent Year-to-Year in October; Double-Digit Annual Growth Projected for 2018 (Dec 04, 2018)
- NVMe Hits a Tipping Point (Dec 03, 2018)
- Worldwide Semiconductor Equipment Billings Drop to $15.8 Billion in Third Quarter 2018, SEMI Reports (Dec 03, 2018)
- Imperas and Valtrix announce partnership for RISC-V Processor Verification (Dec 03, 2018)
- Micron Selects Rambus CryptoManager Platform for Secure Provisioning to Authenta Technology (Dec 03, 2018)
- Achronix: Dedicated + flexible, 7nm eFPGA IP solves AI/machine learning application challenges (Dec. 03, 2018)
- IAR Systems and SiFive partner to meet customers' demands for professional solutions for RISC-V (Dec. 03, 2018)
- Qualcomm's acquisition of NXP began: $44 billion in mergers and acquisitions failed, but also lost $2 billion (Dec. 03, 2018)
- China and USA: Tariff escalation stops, and all tariffs imposed this year may be cancelled (Dec. 03, 2018)
- Is Chinese"domestic lithography machine" really powerful or fake? (Dec. 01, 2018)
- Samsung: Curved screen technology leaked to a number of Chinese companies lost $ 5.8 billion (Dec. 01, 2018)
- Sankalp wins STPI Highest Exporter Award - ITES (Nov 30, 2018)
- Brite Semiconductor, Naneng Microelectronics and Corigine Collaborate to Release Complete USB 3.0 IP Solution (Nov. 30, 2018)
- Think Silicon Announces New NEMA | GUI-Builder to Empower Programmers of IoT, Embedded and Wearable Devices (Nov. 30, 2018)
- Samsung's Big Semi Capex Spending Keeps Pressure on Competition (Nov 30, 2018)
- Zhuhai Chuangfeixin Introduces eNOR Embedded Flash Memory IP Solution and SPI NOR Flash Products on 65nm Floating-Gate Flash Process (Nov 30, 2018)
- Arm Drops Cordio BLE IP (Nov 30, 2018)
- Truechip Announces First Customer Shipment of SD Express Verification IP (Nov 30, 2018)
- China has created the first independent new lithography machine, which can make 10nm chips in the future. (Nov. 30, 2018)
- Qualcomm concession? Negotiating with Apple (Nov. 30, 2018)
- Our partner at ICCAD: Imecas shows at ICCAD (Nov. 29, 2018)
- GLOBALFOUNDRIES Announces Industry's First 300mm SiGe Foundry Technology to Meet Growing Data Center and High-Speed Wireless Demands (Nov 29, 2018)
- IEEE Publishes IEEE 802.1CM-2018 Standard Addressing Time-Sensitive Networking for Fronthaul (Nov 29, 2018)
- IAR Systems and Andes collaborate to boost performance for RISC-V users (Nov. 29, 2018)
- Perceptia Second-Generation Digital PLL IP Enters Mass Production (Nov. 29, 2018)
- Wave Computing Raises $86M in Oversubscribed Series E Round To Fuel Global Expansion and Further Accelerate Wave's Cloud-to-Edge Strategy (Nov 29, 2018)
- UltraSoC launches "any processor" lockstep solution for safety-critical systems (Nov. 29, 2018)
- MicroBT employs Moortec's 16nm Embedded Temperature Sensor in their HPC ASIC (Nov 29, 2018)
- GLOBALFOUNDRIES Announces Industry's First 300mm SiGe Foundry Technology to Meet Growing Data Center and High-Speed Wireless Demands (Nov. 29, 2018)
- 8 inch wafer foundry capacity is expected to be eased next year (Nov. 29, 2018)
- Quick live coverage! Professor Wei Shaojun 2018 ICCAD speech complete PPT (Nov. 29, 2018)
- Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds (Nov 28, 2018)
- The Linux Foundation and RISC-V Foundation Announce Joint Collaboration to Enable a New Era of Open Architecture (Nov. 28, 2018)
- Arm and AWS: Working together to "Re:Invent" the cloud (Nov 28, 2018)
- GUC Announces ShenZhen Office Opening (Nov 28, 2018)
- Xilinx's New FPGAs Address Evolving Threats, Fake ICs (Nov 28, 2018)
- Allegro DVT Launches a new High-Performance, Multi-Format Video Encoder IP for 4K/UHD Video Resolutions and Beyond (Nov. 28, 2018)
- Efabless Launches the Chiplicity Design Partner Program Featuring Chipus Microelectronics, Sankalp Semiconductor and Symmid Corporation (Nov 28, 2018)
- Argon Design licenses Argon Streams AV1 to Realtek Semiconductor (Nov 28, 2018)
- Is RISC-V really a hope for China's chips to achieve autonomy, control, innovation and prosperity? (Nov. 28, 2018)
- Zhuhai Chuangfeixin eNOR embedded Flash Memory IP SOLUTION and SPI NOR FLASH QUALIFIED IN 65nm Floating-Gate Flash Process (Nov. 27, 2018)
- Automotive Remains Hot Market for Chips (Nov. 27, 2018)
- Huaxintong ARM architecture server chip officially appeared on the market (Nov. 27, 2018)
- Sino-US trade war with the decline of apple market value is overtaken by Microsoft (Nov. 27, 2018)
- Sonova License and Deploy CEVA Bluetooth IP in SWORD 3.0 Wireless Chip for Hearing Aids (Nov. 27, 2018)
- PLDA and Samtec Demonstrate PCIe 4.0 Communication over Twinax Cables Allowing Full 16GT/s PCIe 4.0 Bandwidth at Minimal Manufacturing Cost (Nov. 27, 2018)
- SureCore Joins the RISC-V Foundation (Nov. 27, 2018)
- Thales joins RISC-V Foundation to help secure open-source microprocessors (Nov. 27, 2018)
- Express Logic Provides Support for Infineon TriCore Microcontrollers (Nov 27, 2018)
- There's More to The RISC-V China Story (Nov 26, 2018)
- SiFive Appoints VP to Growing SoC IP Group (Nov 26, 2018)
- PLDA Offers XpressRICH PCIe and CCIX Controller IP Through SiFive DesignShare Program (Nov. 26, 2018)
- IAR Systems Expands Support for Arm DesignStart with High Performance Tools for Arm Cortex-A5 (Nov 26, 2018)
- Only Qualcomm Reported to Post Slight Decline Among Top Ten Fabless IC Design Houses by 3Q18 Revenue, Says TrendForce (Nov 26, 2018)
- Will 7nm mass production make high-end CPUs or graphics cards cheaper? (Nov. 26, 2018)
- Intel's ninth generation low-voltage processor unveiled, using 10nm process (Nov. 26, 2018)
- Among smartphone 5 giants sales, only Samsung did negative growth (Nov. 26, 2018)
- Huawei sued Samsung was awarded 80.5 million in the "invention patent invalidation case" final judgment (Nov. 26, 2018)
- Edge Internet of Things: How artificial intelligence will change the Internet of Things architecture (Nov. 26, 2018)
- US court ruled that Qualcomm must authorize the opponent the license, may impact the current patent license of mobile phones (Nov. 24, 2018)
- Qualcomm plans to provide more development kits for AI assistants, and manufacturers have followed up (Nov. 23, 2018)
- TSN IP Core making devices fit for real-time Ethernet (Nov. 22, 2018)
- Winbond and Tiempo Secure join forces to offer the world's first fully CC EAL5+ certifiable Secure Element IP for IoT (Nov. 22, 2018)
- Silex Insight joins RISC-V foundation (Nov 22, 2018)
- TSMC's new packaging architecture details are open, Samsung will meet its "final competition" (Nov. 22, 2018)
- North American Semiconductor Equipment Industry Posts October 2018 Billings (Nov 21, 2018)
- OPENEDGES' Memory Subsystem IP - DDR Controller & NoC interconnect licensed for high end 4K multimedia SoC (Nov 21, 2018)
- UMC and Gear Radio Introduce 55nm Bluetooth 5 IP Platform (Nov 21, 2018)
- Gear Radio Introduces Complete Bluetooth 5 Low-Power IP Solution for IoT SoC Applications (Nov 21, 2018)
- TSMC N7+ process node mass production next year (Nov. 21, 2018)
- CFX Technology partners with Design&Reuse for further implementing IP design and market development (Nov. 20, 2018)
- 5G has not yet popularized, 6G is coming, how many fiber will be replaced? (Nov. 20, 2018)
- What are the "sensitive technologies" involved in the regulation of 14 emerging technology exports in the United States? (Nov. 20, 2018)
- Sankalp Semiconductor announces ARM Empowered Design Suite (Nov. 20, 2018)
- Attopsemi's I-fuse OTP Passed 250 degrees Celsius for 1,000hrs Wafer-level Burn-in Studies on GLOBALFOUNDRIES 22FDX FD-SOI Technology (Nov 20, 2018)
- Toshiba Unveils 130nm FFSA Development Platform Featuring High Performance, Low Power and Low Cost Structured Array (Nov 20, 2018)
- Blu Wireless Technology announces the HYDRA 2.X family of System IP for 802.11ay mmWave applications (Nov 20, 2018)
- Xilinx Extends Functional Safety into AI-class Devices (Nov 20, 2018)
- Outlook Remains Bright for Automotive Electronic Systems Growth (Nov 20, 2018)
- Cadence Announces Tapeout of GDDR6 IP on Samsung's 7LPP Process, Enabling Complete GDDR6 IP Solution (Nov 20, 2018)
- IAR Systems, Secure Thingz and Renesas Electronics collaborate on solutions for reliable industrial IoT security (Nov 19, 2018)
- Attopsemi's I-fuse OTP Passed 250°C for 1,000hrs Wafer-level Burn-in Studies on GLOBALFOUNDRIES 22FDX FD-SOI Technology (Nov. 19, 2018)
- Attopsemi's I-fuse OTP worked at 0.4V and 1uW read on GLOBALFOUNDRIES 22nm FD-SOI for Fraunhofer Institute for Photonic Microsystems' (IPMS) battery-less 61GHz RFID tags (Nov 19, 2018)
- aiCTX Closes Pre-A Investment Round With Baidu Ventures (Nov 19, 2018)
- Moortec to showcase its advances in PVT in-chip monitoring for 40nm, 28nm, 16nm, 12nm and 7nm at ICCAD in Zhuhai China (Nov 19, 2018)
- TSMC wins IBM's latest server order Challenge Intel's exclusive market position (Nov. 19, 2018)
- Why RISC-V Lags in China (Nov. 19, 2018)
- AI advances step by step to smart factory (Nov. 19, 2018)
- Samsung Electronics dragged its legs, Samsung Group's market value fell nearly 12% (Nov. 19, 2018)
- The United States is strictly scrutinizing, EU legislation is confined, and Chinese capital investment in semiconductors will become increasingly difficult! (Nov. 19, 2018)
- PixArt Imaging selects voltage regulators IPs from Dolphin Integration for its ultra-low power MCU Sensor in 40 nm (Nov 19, 2018)
- Mobileye's New EyeQ5: How Open is Open? (Nov 19, 2018)
- TSMC was excluded, AMD RX590 12nm process from Samsung and GF (Nov. 18, 2018)
- GLOBALFOUNDRIES, indie Semiconductor Deliver Performance-Enhanced Microcontrollers for Automotive Applications (Nov. 16, 2018)
- RISC-V Momentum Seen Growing in China (Nov. 16, 2018)
- Why RISC-V Lags in China (Nov 15, 2018)
- QuickLogic Announces eFPGA Now Available on TSMC 40nm Process (Nov. 15, 2018)
- Achronix Unveils New "eFPGA Accelerator" Programs for Researchers and Test-Chip Developers (Nov. 15, 2018)
- Achronix Finalist for the Global Semiconductor Alliance's 2018 Most Respected Private Semiconductor Company Award (Nov 15, 2018)
- Xilinx Advances State-of-the-Art in Integrated and Adaptable Solutions for Aerospace and Defense with Introduction of 16nm Defense-Grade UltraScale+ Portfolio (Nov 15, 2018)
- RISC-V Momentum Seen Growing in China (Nov 15, 2018)
- Verne Global introduces Arm architecture via Marvell ThunderX2 processor-based servers to hpcDIRECT (Nov 15, 2018)
- GLOBALFOUNDRIES, indie Semiconductor Deliver Performance-Enhanced Microcontrollers for Automotive Applications (Nov 15, 2018)
- Q&A with ST CEO: Who He Is, What He's Done (Nov 15, 2018)
- Samsung speeds up for 5G to invest 22 billion US dollars (Nov. 15, 2018)
- Intel launches new neural computing stick to build smarter AI edge devices (Nov. 15, 2018)
- Apple: Unmanned car without steering wheel has no possibility of going on the road at this stage (Nov. 15, 2018)
- Micron and Achronix Deliver Next-Generation FPGAs Powered by High-Performance GDDR6 Memory for Machine Learning Applications (Nov. 14, 2018)
- Cortus S.A.S Appoints Mr. Gordon Yang Guo-dong as Vice President of Business Development (Nov 14, 2018)
- Xilinx Extends Data Center Leadership with New Alveo U280 HBM2 Accelerator Card; Dell EMC First to Qualify Alveo U200 (Nov 14, 2018)
- IntelliProp to Demo PCIe to Gen-Z Bridge at SC18 (Nov 14, 2018)
- Cadence Delivers Advanced Packaging Reference Flow for Samsung Foundry Customers (Nov. 14, 2018)
- Wafer foundry chaos war, only Samsung VS TSMC in the high-end level (Nov. 14, 2018)
- TSMC plans to invest US$3.36 billion to build a new fab and increase production capacity (Nov. 14, 2018)
- Global semiconductor manufacturer's annual revenue ranking: storage is king! Samsung has two consecutive championships, Hynix is better than TSMC! (Nov. 13, 2018)
- Apple's suppliers may be countered by the iPhone's heat loss (Nov. 13, 2018)
- Imagination introduces industry's most comprehensive GNSS IP core (Nov. 13, 2018)
- Intel released 5G modem, 6 months ahead of schedule (Nov. 13, 2018)
- China Fixates on AI and Trump (Nov. 13, 2018)
- Imagination reveals next step in PowerVR automotive strategy (Nov 13, 2018)
- Arasan completes its Total IP Solution for the UFS 3.0 Standard with immediate availability of its MIPI M-PHY 4.1 IP Core (Nov. 13, 2018)
- HPC Systems Inc. Expands the Science Cloud Offering with the Latest Arm-based HPC (Nov 13, 2018)
- Nexell Licenses Intrinsic ID Hardware Root of Trust for AI Application Processor (Nov 13, 2018)
- Andes Technology and INVECAS Announce Partnership to Win RISC-V-Based SoC Designs for Advanced Processes (Nov 13, 2018)
- Nine Top-15 2018 Semi Suppliers Forecast to Post Double-Digit Gains (Nov 13, 2018)
- Spin Memory Teams With Applied Materials to Produce a Comprehensive Embedded MRAM Solution (Nov 12, 2018)
- Synopsys Unveils Fusion Compiler, Enabling 20 Percent Higher Quality-of-Results and 2X Faster Time-to-Results (Nov. 12, 2018)
- Spin Memory's MRAM Design-Enhancing Endurance Engine Licensed by Arm (Nov 12, 2018)
- Open-Silicon, SiFive and Credo Showcase End-to-End Solutions for HPC and Networking Applications at SC18 in Dallas (Nov 12, 2018)
- DINI Group announces immediate availability of the DNVUPF4A - Prototyping for 5G (Nov 12, 2018)
- Nextera and Adeas Announce Village Island as Distributor for IP Cores in Japan (Nov 12, 2018)
- Hex Five adds MultiZone Security to the Andes RISC-V Cores on GOWIN FPGAs (Nov 12, 2018)
- Moortec's 7nm In-Chip Monitoring Subsystem IP chosen by Esperanto Technologies to optimise performance and reliability in its high-performance AI Chip (Nov. 12, 2018)
- Spin Memory Announces $52 Million Series B Funding Round (Nov 12, 2018)
- Soitec CEO: FD-SOI optimizes substrate for AioT and 5G revolution (Nov. 12, 2018)
- ANSYS engineering simulation program passed TSMC 7nm + FinFET Plus advanced process certification (Nov. 11, 2018)
- UMC Reports Sales for October 2018 (Nov 09, 2018)
- TSMC October 2018 Revenue Report (Nov 09, 2018)
- Huawei Kirin 990 uses TSMC's second-generation 7nm process, reducing power consumption by 10% and improving performance by 10%! (Nov. 09, 2018)
- October revenue increased by 7%, TSMC is optimistic about the future development of 7nm and 7+nm (Nov. 09, 2018)
- Stealing Micron Technology's intellectual property? UMC snap back: we have 15 years of experience (Nov. 09, 2018)
- ST CEO: The Internet of Things moves from vision to reality, guided by semiconductor technology (Nov. 09, 2018)
- CEVA, Inc. Announces Third Quarter 2018 Financial Results (Nov 08, 2018)
- NSCore Inc. Addresses the IoT Market Need for an NVM IP Solution in Advanced Process Technology Nodes (Nov. 08, 2018)
- Dr. Jesse Zhixi Fang Appointed as Chair of the RISC-V Foundation China Advisory Committee to Accelerate Adoption of the RISC-V ISA in China (Nov 08, 2018)
- What NXP Lost and Regained Post-Qualcomm (Nov 08, 2018)
- Arm Looking forward to the future trend of AI, Zhouyi artificial intelligence platform has been on the road (Nov. 08, 2018)
- VeriSilicon: Where will the car go in the next 5 years? (Nov. 08, 2018)
- Perceptia Devices Strengthens Europe Sales Network (Nov 07, 2018)
- AMD Unveils World's First 7nm Datacenter GPUs (Nov 07, 2018)
- Vidatronic Announces ACCUREF Series of Ultra-Precise, Extremely Low-Power Voltage and Current Reference IP Cores (Nov. 07, 2018)
- Judge Rules Qualcomm Must License Modem Patents (Nov 07, 2018)
- Pinnacle Imaging Systems and ON Semiconductor Collaborate on New HDR Surveillance Solution Using Xilinx Technology to Push the Boundaries of High Dynamic Range Video (Nov 07, 2018)
- UMC and Jurui Electronics jointly develop 55nm Bluetooth 5 IP platform (Nov. 07, 2018)
- New Mentor Symphony platform addresses nanometer-scale SoC mixed-signal verification challenges (Nov 07, 2018)
- Third Quarter Silicon Wafer Shipments Increase, Set New Quarterly Record (Nov 07, 2018)
- SMIC Reports 2018 Third Quarter Results (Nov 07, 2018)
- Imperas Empowers RISC-V Community with riscvOVPsim (Nov 07, 2018)
- US court ruled that Qualcomm must license patent technology to its competitors (Nov. 07, 2018)
- Qualcomm CEO: A number of 5G trials have been successful, driving business to become a reality next year (Nov. 06, 2018)
- Samsung 7nm Exynos chip exposure: integrated dual-core NPU (Nov. 06, 2018)
- Media unveilled that new iPhone demand is sluggish, and Apple will no longer publish quarterly sales data. (Nov. 06, 2018)
- Google, Facebook and other big households are shrinking. The memory market is not optimistic next year. (Nov. 06, 2018)
- Dr. John Zhuang Appointed as CEO of Brite Semiconductor (Nov 06, 2018)
- Corigine and New H3C Enable Mass Deployment of High-Performance Network Routers (Nov. 06, 2018)
- sureCore names Roger Bailey VP Worldwide Sales (Nov 06, 2018)
- Synopsys Extends Synthesis Leadership with Next-Generation Design Compiler (Nov 06, 2018)
- Everspin and SilTerra join forces to create new manufacturing center for MRAM (Nov 06, 2018)
- Arm Kigen solutions see further adoption and achieve GSMA accreditation (Nov 06, 2018)
- Synopsys Unveils Fusion Compiler, Enabling 20 Percent Higher Quality-of-Results and 2X Faster Time-to-Results (Nov 06, 2018)
- Esperanto Technologies Secures $58 Million in Series B Investment for AI Chips (Nov 05, 2018)
- GUC Monthly Sales Report - Oct 2018 (Nov 05, 2018)
- SMIT Acquires S2C, a Hardware-based Verification Systems and Software Company (Nov 05, 2018)
- Who's Who in AI SoCs (Nov 05, 2018)
- Arm's Data Center Two Step (Nov 05, 2018)
- PathPartner to showcase a spectrum of innovations in Automotive ADAS and Internet of Things at Electronica 2018 (Nov 05, 2018)
- New Architectures Bringing AI to the Edge (Nov 05, 2018)
- Silex Insight unveils high-throughput version of Chacha20-Poly1305 authenticated encryption (Nov. 05, 2018)
- AMF Photonics SiP Process Design Kit Available for Synopsys OptoDesigner Photonic IC Layout Solution (Nov 05, 2018)
- FABU America, Developer of SoCs for Autonomous Driving, Selects Agnisys IDesignSpec to Create an Executable Design Specification (Nov 05, 2018)
- Knowledge Transfer, or IP Theft? (Nov 05, 2018)
- Wave Computing Turbo Boosts "MIPS" with Licensable AI Subsystems, An Expanded Ecosystem & New Product Roadmap (Nov. 05, 2018)
- Samsung Still Spending Heavily on Capex (Nov 05, 2018)
- GF: The recovered fist is only for a stronger fight. (Nov. 05, 2018)
- Silicon wafer price increases slowed, out-of-stock conditions will continue (Nov. 05, 2018)
- Safety Ready first, Arm hard drive self-driving safety market (Nov. 05, 2018)
- China's chip design level is second in the world, but… (Nov. 05, 2018)
- Jinhua: There is no stealing behavior, asking USA to stop wrong actions (Nov. 05, 2018)
- Wave Computing Turbo Boosts "MIPS" with Licensable AI Subsystems, An Expanded Ecosystem & New Product Roadmap (Nov 05, 2018)
- New Zealand: The possibility of prohibiting Huawei from participating in 5G construction is not ruled out (Nov. 03, 2018)
- (Nov 02, 2018)
- VeriSilicon Announces Ultra Low Power BLE 5.0 RF IP Based on GLOBALFOUNDRIES 22FDX FD-SOI Process for IoT Applications (Nov. 02, 2018)
- TSMC Nanjing Plant Fab 16 official mass production (Nov. 02, 2018)
- From 5G to the edge of IoT, CEVA deep learning blooms everywhere (Nov. 02, 2018)
- AI moves from the cloud to the edge, the new architecture emerges (Nov. 02, 2018)
- Imagination introduces industry's most comprehensive GNSS IP core as part of its Ensigma wireless communications portfolio (Nov. 02, 2018)
- The US Department of Justice sued Jinhua and UMC for stealing, and will be fined $20 billion for conviction. (Nov. 02, 2018)
- The US Department of Justice sued UMC for stealing MiG secrets, UMC: fully prepared for dealing with (Nov. 02, 2018)
- GLOBALFOUNDRIES Introduces Avera Semi, a Wholly Owned Subsidiary to Deliver Custom ASIC Solutions (Nov 01, 2018)
- Flex Logix Launches NMAX Neural Inferencing Engine that Delivers 1 to 100+ TOPS Performance Using 1/10th the Typical DRAM Bandwidth (Nov 01, 2018)
- Imagination delivers industry's first visually lossless image compression for GPUs with a guaranteed reduction in memory footprint (Nov. 01, 2018)
- Huawei blockchain: AI chip to build cloud + network + terminal solution (Oct. 31, 2018)
- ON Semiconductor Introduces RSL10 Bluetooth 5 Radio Series Mesh Network and New Development Support Tools (Oct. 31, 2018)
- Silicon Valley company unveils the first Artificial Intelligence-based Power Exploration platform for electronics systems and semiconductors (Oct 31, 2018)
- AImotive's aiWare3 Hardware IP Helps Drive Autonomous Vehicles To Production (Oct 31, 2018)
- GE Power Management licenses SoC-e wire-speed Cryptography IP for GOOSE&Sampled Values Security (Oct 31, 2018)
- Arteris IP Announces New FlexNoC 4 Interconnect IP with Artificial Intelligence (AI) Package (Oct 31, 2018)
- SiFive Core IP 7 Series Creates New Class of Embedded Intelligent Devices Powered by RISC-V (Oct 31, 2018)
- Cadence Introduces the Tensilica HiFi 5 DSP, the First DSP Optimized for AI Speech and Audio Processing (Oct 31, 2018)
- Imagination introduces industry's most comprehensive GNSS IP core as part of its Ensigma wireless communications portfolio (Oct 31, 2018)
- In order to solve the 14nm capacity urgently, Intel has chosen to hand over Atom to TSMC. (Oct. 31, 2018)
- Samsung ranks as a foundry runner-up, EUV will be used for DRAM mass production, but capacity expansion will lead to crisis (Oct. 31, 2018)
- GlobalWafers will invest 438 million US dollars in Korea (Oct. 30, 2018)
- Arm and Midea Group reached a strategic cooperation, providing Mbed OS to help smart home appliance development (Oct. 30, 2018)
- Samsung will conduct 5G field trials in India in the first half of 2019 (Oct. 30, 2018)
- Rambus Reports Third Quarter 2018 Financial Results (Oct 30, 2018)
- Application of Speedcore eFPGA in automotive intelligence (Oct. 30, 2018)
- Rambus Appoints Luc Seraphin as President and Chief Executive Officer (Oct 30, 2018)
- Synopsys Enhances DesignWare Memory Test and Repair Solution for Embedded MRAM (Oct 30, 2018)
- Credo First to Publicly Demonstrate 112G SerDes in 7nm at TSMC's 2018 China OIP Forum (Oct 30, 2018)
- Silicon Valley company Mirabilis Design unveils the first Artificial Intelligence-based Power Exploration platform for electronics systems and semiconductors (Oct. 30, 2018)
- Imec teamed up with ASML layout post-3nm lithography (Oct. 29, 2018)
- IBM announces the largest acquisition in history: $34 billion acquisition of Red Hat (Oct. 29, 2018)
- Broadcom is suspected of forcing customers to buy chips, facing EU, FTC antitrust review (Oct. 29, 2018)
- Synopsys Advances Test Fusion Technology with Test Points to Reduce Manufacturing Costs and Boost Quality (Oct 29, 2018)
- Gowin Semiconductor Brings Ultra Low Power Programmable Logic Devices To Market (Oct 29, 2018)
- Moortec To Showcase Its PVT Monitoring IP At the TSMC China OIP Ecosystem Forum in Nanjing (Oct 29, 2018)
- SigmaStar Deploys CEVA Computer Vision and Deep Learning Platform in its Intelligent Camera SoC (Oct 29, 2018)
- Global Semiconductor Sales in September Up 13.8 Percent Year-to-Year (Oct 29, 2018)
- Synopsys Improves Automotive Functional Safety with Fast Soft-Error Analysis (Oct 29, 2018)
- GLOBALFOUNDRIES and Chengdu Realign Joint Venture Strategy (Oct 29, 2018)
- Real Intent Provides Comprehensive Reset Analysis with Meridian RXV (Oct 29, 2018)
- Kazan Networks Announces NVMe-oF ASIC Production Release (Oct 29, 2018)
- CEVA adds ONNX support to the CDNN neural network compiler (Oct. 29, 2018)
- Intel Reports Tepid Progress on 10 nm (Oct 29, 2018)
- Chinese Firm to Buy NXP Spinoff (Oct 29, 2018)
- PLDA and MegaChips announce a cooperation to design PCIe controllers and PCIe PHY IP on TSMC's 16nm Process Technology (Oct. 29, 2018)
- Silicon Creations' Fractional-N PLL Technology Leveraged at Israel's Bar-Ilan University SoC Lab (Oct 29, 2018)
- Sudden! GF Announces Cancellation of Phase I Investment in Chengdu, China (Oct. 26, 2018)
- Low-power IoT and 4G cellular communication are getting closer (Oct. 26, 2018)
- Apple Samsung deliberately slowed down the phone and accelerated the elimination, Italy issued a penalty (Oct. 26, 2018)
- GF canceled the mature technology investment, force 22FDX, and re-sign a new cooperation agreement in Chengdu (Oct. 26, 2018)
- Intel's revenue exceeds expectations but CEO is worried about the impact of trade war next year (Oct. 26, 2018)
- Silex Insight releases IPsec as a hardware block to accelerate IoT, cloud, or edge servers (Oct. 26, 2018)
- China’s semiconductor industry in serious talent shortage (Oct. 25, 2018)
- NovuMind Releases Details of Breakthrough AI Chip (Oct 25, 2018)
- eSilicon 56G long-reach 7nm DSP SerDes is now available for licensing (Oct. 25, 2018)
- Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families (Oct 25, 2018)
- UltraSoC and ResilTech partner to further functional safety in automotive systems (Oct. 25, 2018)
- DVB-RCS2 Satellite Modulator IP Core from Creonic Now Available (Oct 25, 2018)
- Arm enhances PSA from device coverage to data IoT security (Oct. 25, 2018)
- 60-GHz Wi-Fi Gets a Refresh (Oct. 24, 2018)
- Synopsys and Truphone enable secure wireless configuration with integrated SIM IP and managed service solutions (Oct. 24, 2018)
- CEVA Adds ONNX Support to CDNN Neural Network Compiler (Oct 24, 2018)
- Synopsys Announces Fastest, Most Power Efficient DDR5 and LPDDR5 IP Solutions (Oct 24, 2018)
- Analysis: Dialog finds a better way out from under Apple (Oct 24, 2018)
- Cadence Custom/AMS Flow Certified on Samsung 7LPP Process Technology (Oct 24, 2018)
- Cypress Delivers Smart, Fail-Safe Storage Platform Leveraging Arm Processor for Enhanced Safety and Reliability (Oct 24, 2018)
- North American Semiconductor Equipment Industry Posts September 2018 Billings (Oct 24, 2018)
- OneSpin Puts Verification on the Move with New PortableCoverage Solution (Oct 24, 2018)
- Synopsys and Truphone enable secure wireless configuration with integrated SIM IP and managed service solutions (Oct. 24, 2018)
- Intel will terminate 10nm processor development? (Oct. 23, 2018)
- Why is the 7nm process so difficult? (Oct. 23, 2018)
- Huawei 5G overseas market is frequently banned, Samsung and NEC cooperate to take advantage of (Oct. 23, 2018)
- STMicroelectronics Launches Sigfox Monarch Solution for Industrial Asset Management, Seamlessly Connecting Global IoT Devices (Oct. 23, 2018)
- Cadence Accelerates Next-Generation Cloud Datacenter Infrastructure with Industry's First Silicon-Proven, Long-Reach 7nm 112G SerDes IP (Oct 23, 2018)
- How to choose the right AI hardware acceleration solution for different applications? (Oct. 23, 2018)
- ReRAM enhances edge AI (Oct. 23, 2018)
- Renesas Electronics and BlackBerry jointly launched an information security development environment to accelerate the development of automotive infotainment system technology (Oct. 23, 2018)
- Synopsys Custom Design Platform Delivers Breakthrough Analog Simulation and Fusion Technologies (Oct. 23, 2018)
- Synopsys FineSim SPICE Cuts Analog Simulation Time by 3X (Oct. 23, 2018)
- Cadence Reports Third Quarter 2018 Financial Results (Oct 23, 2018)
- Synopsys Custom Compiler Doubles New Customer Adoptions, Introduces New Release (Oct 23, 2018)
- Rambus Unveils Vaultify Trade for Secure Transaction and Storage of Crypto Assets on Blockchain (Oct 22, 2018)
- Silvaco Appoints Babak Taheri as Chief Technology Officer (Oct 22, 2018)
- Percepio Announces Tracealyzer Support for STLINK-V3 Debug Probes (Oct 22, 2018)
- Sankalp Semiconductor Expands its Design Centre in Hubli (Oct 22, 2018)
- NEC collaborates with Arm to develop secure IoT solutions for Smart Cities using AI (Oct 22, 2018)
- MIPI Alliance Enables First Wave of 5G Smartphones (Oct 22, 2018)
- Dolphin Integration unveils a new RAM dedicated to IoT and Low Power MCU applications in 55 nm, GLOBALFOUNDRIES LPx process (Oct 22, 2018)
- Arm DesignStart program expands to accelerate Linux-based embedded design (Oct 22, 2018)
- IEDM: Intel embeds MRAM in FinFET process (Oct 22, 2018)
- Stage Tec introduces HSR for Professional Audio Broadcasting using SoC-e Technology (Oct 22, 2018)
- 7nm broke out positively, TSMC let everyone breathe a sigh of relief (Oct. 22, 2018)
- What is the next step for 5G? (Oct. 22, 2018)
- Countering the EU price penalty! For Android devices in the European market, Google will charge a license fee of up to $40 (Oct. 22, 2018)
- ARM introduces new IoT operating system Mbed Linux OS (Oct. 22, 2018)
- Arm DesignStart project re-expands to accelerate Linux-based embedded design (Oct. 22, 2018)
- Analyst: U.S.-China Relations Need a Reboot (Oct. 22, 2018)
- Following TSMC, Samsung announced that it is mass producing 7nm LPP chips. (Oct. 19, 2018)
- US startups accuse Huawei of stealing its semiconductor technology (Oct. 19, 2018)
- China Policy Needs a Reset (Oct. 19, 2018)
- Cadence Verification Suite Enabled on Arm-Based HPC Datacenters (Oct. 18, 2018)
- STMicroelectronics Introduces STM32L5 Ultra-Low-Power Microcontrollers for a More Secured IoT (Oct 18, 2018)
- Communications Rise To Represent Largest Portion of Foundry Sales (Oct 18, 2018)
- L&T Technology Services announces completion of Graphene Semiconductor Services acquisition (Oct 18, 2018)
- NXP Secures the Edge with Two Industry-First Multi-Core Arm Cortex-M33 Solutions (Oct 18, 2018)
- Samsung Complements the Production of its Revolutionary 7nm EUV with Exceptional SAFE Ecosystem Solutions (Oct 18, 2018)
- Samsung Electronics Starts Production of EUV-based 7nm LPP Process (Oct 18, 2018)
- TSMC Reports Third Quarter EPS of NT$3.44 (Oct 18, 2018)
- Google first recognized the Chinese version of the search engine (Oct. 18, 2018)
- Dolphin Integration Online webinar: How to design high energy efficiency SoCs at advanced process nodes to extend battery life in IoT applications (Oct. 17, 2018)
- Arasan to demonstrate its I3C Host and Device IP and participate at the I3C Interoperability Session at the 2018 MIPI Devcon in Seoul (Oct 17, 2018)
- eMemory's OTP IP Qualified on 22nm FD-SOI process (Oct. 17, 2018)
- Silicon Creations Named TSMC Partner of the Year 2018 for Analog / Mixed-Signal IP (Oct 17, 2018)
- IAR Systems leads the way for secure IoT development based on Arm TrustZone and Arm Cortex-M (Oct 17, 2018)
- Rambus and Riscure Team Up to Deliver Best-in-class Security Testing Platform for Side-channel Analysis (Oct 17, 2018)
- Arteris IP FlexNoC Interconnect Licensed by Iluvatar CoreX for Artificial Intelligence Application (Oct 17, 2018)
- Inside Secure's Latest Whitebox Software Security Tool Brings Mobile Developers New Levels of Protection, Performance and Control (Oct 17, 2018)
- IBM, GLOBALFOUNDRIES Enhance Si2 Unified Power Model Standard (Oct 17, 2018)
- Wafer Shipments Forecast to Set New Highs Through 2021 (Oct 17, 2018)
- Arm goes higher up the stack for device-to-data IoT security (Oct 17, 2018)
- Synopsys Awarded DARPA Electronics Resurgence Initiative Contract for Advanced Emulation Technology (Oct 17, 2018)
- Arm Neoverse: The modern cloud to edge infrastructure foundation for a world of a trillion intelligent devices (Oct 17, 2018)
- IAR Systems supports new secure, ultra-low-power Arm Cortex-M33 MCUs from STMicroelectronics (Oct 17, 2018)
- More than 100 Major IC vendors, OEMs and Broadcasters Already Adopted Allegro DVT Compliance Streams (Oct 17, 2018)
- Is the Apple-Dialog acquisition a win-win situation? (Oct. 17, 2018)
- Socionext Develops World's First HDMI 2.1 Compatible Video Processing Chips (Oct 16, 2018)
- Allegro DVT Introduces High Dynamic Range and High Frame Rate System Compliance Streams for DVB UHDTV (Oct 16, 2018)
- Intel is selling ASML shares again as EUV is about to go into production. (Oct. 16, 2018)
- Canada refuses to disable Huawei 5G equipment, the United States is not happy (Oct. 16, 2018)
- Eta Compute Launches Machine Learning Platform with Ultra-Low-Power Consumption for Edge Devices (Oct. 16, 2018)
- ALTEN Calsoft Labs Acquires Si2Chip, a VLSI Chip Design Company (Oct 16, 2018)
- Now is the time to expand the EUV technology blueprint! (Oct. 16, 2018)
- UltraSoC announces integrated multi-core debug, visualization and data science / analytics suite (Oct. 16, 2018)
- Cadence Accelerates Arm-Based Server Development by Automating Arm Pre-Silicon Bare Metal Compliance Testing (Oct. 16, 2018)
- Synopsys ASIP Designer Tool Speeds Development of Application-Specific Instruction-Set Processors for STMicroelectronics (Oct. 16, 2018)
- Synopsys Enables Tapeout Success for Early Adopters of Arm Neoverse IP (Oct. 16, 2018)
- SiFlower Licenses and Deploys CEVA's 802.11ac Wi-Fi IP in its Smart Home Access Point SoC (Oct. 16, 2018)
- OPENEDGES unveils world-first Memory Subsystem IP solution coupling Network-on-Chip (NoC) interconnect with DDR memory controller (Oct. 16, 2018)
- Moortec to show off its advances in PVT monitoring for 40nm, 28nm, 16nm, 12nm and 7nm at ARM TechCon in San Jose (Oct 15, 2018)
- CEVA's 2018 Technology Symposium Series Coming to Taiwan, China and Japan (Oct 15, 2018)
- Power Regulation IPs from Dolphin Integration, now Silicon Proven on GLOBALFOUNDRIES 22FDX Technology Platform (Oct. 15, 2018)
- Achronix to Demonstrate Speedcore eFPGA's Flexibility at Arm TechCon (Oct 15, 2018)
- JPEG-XS standard preview by intoPIX at SMPTE ATC 2018 (Oct 15, 2018)
- Synopsys Delivers Platform Architect Ultra to Enable the Next Wave of AI SoCs (Oct 15, 2018)
- Xilinx and Huawei Announce the First FPGA Cloud-based Real-time Video Streaming Solution in China (Oct 15, 2018)
- Flex Logix to Demonstrate Modular eFPGA at ARM TechCon (Oct 15, 2018)
- Vidatronic Signs Schoenduve Corporation as Its Sales Representative for Northern California and Nevada (Oct 15, 2018)
- Intel, Arduino and myDevices join the rapidly expanding Arm Pelion IoT Platform ecosystem (Oct 15, 2018)
- Advanced Technology Key to Strong Foundry Revenue per Wafer (Oct 15, 2018)
- GF Expands RFwave Partner Program to Accelerate the Wireless Connectivity, Radar and 5G Applications (Oct. 15, 2018)
- TSMC's single-chip wafer revenue leads the market with an advantage of more than 36%! Will compete fiercely in the next five years (Oct. 15, 2018)
- Microsoft "stole" a group of Qualcomm engineers to develop chips for quantum computing (Oct. 12, 2018)
- Will the "spy chip" storm accelerate the return of the US electronics manufacturing industry from China? (Oct. 12, 2018)
- Spectral & NSCore Announce Strategic Relationship that Significantly Expands Access and Distribution of MTP/OTP Memory Compilers to accelerate SOC integration of NVRAM & Low Power SRAMs for IOT applications (Oct. 11, 2018)
- Xylon Unveils New Panoramic Multi-Sensor Camera Demo at Xilinx Developer Forum (Oct. 11, 2018)
- Silvaco to Showcase Octal SPI in Presentation at ARM TechCon (Oct 11, 2018)
- Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Synaptics VXR7200 IC Enabling Next Generation VR Headsets (Oct. 11, 2018)
- Dialog Semiconductor and Apple enter agreement (Oct 11, 2018)
- IntelliProp to Exhibit at SC18 in Dallas, TX (Oct 11, 2018)
- Arasan to demonstrate its MIPI DSI, CSI, C-PHY and D-PHY IP Cores at the 2018 MIPI Member Meeting Asia (Oct 11, 2018)
- GLOBALFOUNDRIES Expands RFwave Partner Program to Speed Time-to-Market for Wireless Connectivity, Radar and 5G (Oct 11, 2018)
- After giving up 7nm, GF started the transformation with 22FDX (Oct. 11, 2018)
- Apple acquires some assets of Dialog (Oct. 11, 2018)
- Cadence Recognized with Four 2018 TSMC Partner of the Year Awards (Oct 10, 2018)
- Sankalp Semiconductor Opens Second Design Centre in Bangalore (Oct 10, 2018)
- Cadence to Demonstrate System and Automotive Solutions at Arm TechCon 2018 (Oct 10, 2018)
- Gowin Semiconductor's GW1NS Family of Products Named Arm TechCon 2018 Innovation Award Finalist For Design Innovation of the Year (Oct 10, 2018)
- Rambus and Phison Sign Patent License (Oct 10, 2018)
- Truechip Successfully hosted TrueConnect 2018 - The 2nd Annual Technical Conference (Oct 10, 2018)
- Apple is inseparable from TSMC within two years. Apple will bear the risk of a single supplier. (Oct. 09, 2018)
- Intel released 28 core and 18 core series CPU new products (Oct. 09, 2018)
- Arteris FlexNoC Interconnect IP Licensed by Enflame (Suiyuan) Technology for Multiple Artificial Intelligence (AI) Chips (Oct. 09, 2018)
- UMC Reports Sales for September 2018 (Oct 09, 2018)
- QuickLogic Announces Silicon-Proven ArcticPro eFPGA on GLOBALFOUNDRIES 22FDX Process (Oct. 09, 2018)
- TSMC September 2018 Revenue Report (Oct 09, 2018)
- Synopsys to Showcase Optimized Solutions and Expert Services for Arm-based Designs at Arm TechCon 2018 (Oct 09, 2018)
- Inside Secure Selected by Norway's Nationwide Debit Card System to Secure Mobile Contactless Payments (Oct 09, 2018)
- Mentor releases optimized flow, new fill automation for GLOBALFOUNDRIES' 22FDX IC manufacturing process (Oct 09, 2018)
- Silicon Valley Company unveils revolutionary Artificial Intelligence (AI) driven Processor Generator (Oct 09, 2018)
- Andes Announces over 1.2 GHz RISC-V Cores Series at 28nm: A25/AX25 and N25F/NX25F (Oct. 08, 2018)
- Arasan Chip Systems Relocates it's Corporate Headquarters to accommodate future growth (Oct 08, 2018)
- Live webinar by Dolphin Integration: how to design an energy-efficient SoC in advanced nodes for increasing battery lifetime for IoT applications (Oct. 08, 2018)
- Rambus Renews Patent License with NVIDIA (Oct 08, 2018)
- TSMC 7+ Nano EUV mass production next year (Oct. 08, 2018)
- China's wafer foundry market will grow 51% in 2018 (Oct. 08, 2018)
- 4.38 billion US dollars investment expansion! Global wafer manufacturers continue to expand production of 12-inch silicon wafers (Oct. 08, 2018)
- The lithography machine leader ASML responded to the rumor that "advanced equipment is not sold to China" (Oct. 08, 2018)
- How is the Carpooling based on the Internet of Things changing the way we drive? (Oct. 08, 2018)
- AI algorithm progresses faster than Moore's Law (Oct. 08, 2018)
- Intel announced expansion of 14nm to ease out of stock, 10nm mass production next year (Oct. 08, 2018)
- Samsung adopts a conservative strategy? DRAM investment will drop 20% next year, NAND flash investment continues to increase (Oct. 08, 2018)
- US court ruling: ZTE's supervision period is extended for two years! (Oct. 08, 2018)
- Qualcomm is in the midst of a patent lawsuit between Germany and Apple, and is expected to make new progress next year. (Oct. 08, 2018)
- DRAM Market Braces For Slower Growth (Oct. 04, 2018)
- Synopsys Design Platform Enabled for TSMC's Multi-die 3D-IC Advanced Packaging Technologies (Oct 04, 2018)
- eMemory Receives 2018 TSMC IP Partner Award (Oct. 04, 2018)
- TSMC Goes Photon to Cloud (Oct 04, 2018)
- SiFive Welcomes Former Tesla Executive to Lead Global Growth Strategy (Oct 04, 2018)
- Omnitek Demonstrates Highest Performance Convolutional Neural Network on an FPGA (Oct. 04, 2018)
- Xilinx Unveils Versal: The First in a New Category of Platforms Delivering Rapid Innovation with Software Programmability and Scalable AI Inference (Oct. 04, 2018)
- M31 Receives TSMC's 2018 Partner of the Year Award for Specialty Process IP (Oct. 04, 2018)
- Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC N7+ FinFET Process (Oct 04, 2018)
- Silicon Valley Company unveils revolutionary Artificial Intelligence (AI) driven Processor Generator (Oct. 04, 2018)
- Northwest Logic and Mixel Delivering C-PHY/D-PHY Combo MIPI IP Solution (Oct. 04, 2018)
- Cadence Delivers Support for TSMC InFO_MS Advanced Packaging Technologies (Oct. 03, 2018)
- Synopsys Announces Availability of TSMC-certified IC Design Environment in the Cloud (Oct 03, 2018)
- Silicon Creations Highlights PLL Developments in 22nm, 12nm, 7nm, and 5nm at TSMC OIP Ecosystem Forum (Oct 03, 2018)
- Analog Bits to demonstrate Low Power SERDES at TSMC's Open Innovation Platform Ecosystem Forum (Oct 03, 2018)
- Wi-Fi Alliance introduces Wi-Fi 6 (Oct 03, 2018)
- Cadence Expands its Cloud Portfolio with Delivery of TSMC OIP Virtual Design Environment (Oct 03, 2018)
- Xilinx Launches the World's Fastest Data Center and AI Accelerator Cards (Oct. 03, 2018)
- TSMC Announces OIP Ecosystem Enabled in the Cloud (Oct. 03, 2018)
- Arm awarded TSMC Partner of the Year award for Processor IP (Oct. 03, 2018)
- AMD's 7Nm processor samples is finished, which has little threat to Intel (Oct. 02, 2018)
- Intel will push aggressively 10nm processes next year (Oct. 02, 2018)
- Winbond is spending 335 billion in Kaohsiung to build a 12 inch wafer fab, which is expected to be completed in 2020. (Oct. 02, 2018)
- What is transfer learning? It is the key to AIoT (Oct. 02, 2018)
- Synopsys Digital and Custom Design Platforms Certified on TSMC 5-nm EUV-based Process Technology (Oct. 02, 2018)
- M31 Technology's Diversified TSMC 28HPC+ ULL Memory Compilers Empower More Flexible SoC Design Architecture (Oct. 02, 2018)
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Autotalks for Automotive V2X Communications Chipsets (Oct. 02, 2018)
- TSMC relies three important technologies to take Apple’s orders (Oct. 01, 2018)
- Next year, 8 inch silicon wafer will increase 10% less than this year (Oct. 01, 2018)
- ADAS is going to be popular in China (Oct. 01, 2018)
- Intel Promises to Boost 14nm Production (Oct 01, 2018)
- Open-Silicon to Demonstrate and Present on Custom SoC Platform Solutions for AI Applications at the TSMC OIP Event in Santa Clara (Oct 01, 2018)
- ESD Alliance Reports EDA Industry Revenue Increase for Q2 2018 (Oct 01, 2018)
- GOWIN Semiconductor Licenses Andes Technology RISC-V CPU Core For Its Arora GW-2A FPGA Family Products (Oct 01, 2018)
- Dolphin Integration accelerates the development of energy-efficient SoCs for Arm-based secure IoT devices (Oct 01, 2018)
- Synopsys Delivers Automotive-Grade IP in TSMC 7-nm Process for ADAS Designs (Oct 01, 2018)
- Cadence Achieves EDA Certification for TSMC 5nm and 7nm+ FinFET Process Technologies to Facilitate Mobile and HPC Design Creation (Oct 01, 2018)
- Arm expands design possibilities with free Cortex-M processors for Xilinx FPGAs (Oct. 01, 2018)
- Synopsys Digital and Custom Design Platforms Certified on TSMC 5-nm EUV-based Process Technology (Oct. 01, 2018)
- Arm announces Arm Safety Ready program and introduces Cortex A76AE automatic driving computing architecture (Sept. 30, 2018)
- "IPhone baseband infringement" ITC judgment biased apple, Intel began to attack Qualcomm (Sept. 30, 2018)
- Intel responded to the 10nm chip challenge, saying its annual revenue will be 4 billion 500 million dollars higher than expected (Sept. 29, 2018)
- US tariff increases the price of graphics cards, NVIDIA and AMD respond (Sept. 29, 2018)
- Attopsemi Technology Provided a Talk Along with an AIoT Panel at the 6th FD-SOI Forum in Shanghai (Sept. 28, 2018)
- China's foundry market has risen 51% this year: the growth rate is 6 times that of the world (Sept. 28, 2018)
- T2M announces its first Image Signal Processing (ISP) Technology for advanced mobile camera applications (Sept. 28, 2018)
- Arm announces new flagship IP and safety program for automotive (Sep 27, 2018)
- GreenWaves Technologies Licenses Intrinsic ID Hardware Root of Trust for RISC-V AI Application Processor (Sep 27, 2018)
- Achronix to Showcase Flexibility of Speedcore eFPGAs During TSMC OIP Ecosystem Forum (Sep 27, 2018)
- GEO Deploys Mixel's MIPI Solution in the World's First Edge Based Automotive Smart Viewing Camera Processor (Sep 27, 2018)
- GLOBALFOUNDRIES Delivering 8SW RF SOI Client Chips on 300mm Platform for Next-Generation Mobile Applications (Sep 27, 2018)
- Spectral introduces NeuralRAM, memory architectures in 14nm FinFET tech node targeted for a wide range of AI algorithms (Sep 27, 2018)
- Andes to discuss news RISC-V offerings at the TSMC Open Innovation Platform Ecosystem Forum (Sep 27, 2018)
- M31 MIPI M-PHY is certified with ASIL-B safety level of ISO 26262 to provide safe and reliable automotive SoC design (Sep 27, 2018)
- China Forecast to Account for 90% of Pure-Play Foundry Market Growth in 2018 (Sep 26, 2018)
- Imagination and GLOBALFOUNDRIES Collaborate to Deliver Ultra-Low-Power Connectivity Solutions for IoT Applications (Sep 26, 2018)
- Intel Adds to Portfolio of FPGA Programmable Acceleration Cards to Speed Up Data Center Computing (Sep 26, 2018)
- Chronos Tech Deploys Fabric to Seamlessly Integrate Diverse IPs in Next-Gen System on Chips (Sep 26, 2018)
- GF Grabs AI Wins with FD-SOI (Sep 26, 2018)
- Terasic chooses Enyx to offer ultra-low latency development framework and design services for their latest FPGA platform (Sep 26, 2018)
- GLOBALFOUNDRIES Extends FinFET Offering with New Features to Enable Tomorrow's Intelligent Systems (Sep 26, 2018)
- Sankalp Semiconductor to Exhibit at Taiwan Innotech Expo 2018 (Sep 26, 2018)
- Without safety, there is no future for autonomous driving (Sep 26, 2018)
- Silicon wafer quotes continue to rise and factory orders are full. (Sept. 25, 2018)
- Intel partners to accelerate the application of China's Internet of vehicles technology (Sept. 25, 2018)
- China Telecom has built more than 400 thousand IoT stations (Sept. 25, 2018)
- AI company is unstoppable. The three industries of China have achieved artificial intelligence landing. (Sept. 25, 2018)
- Lattice Expands Ultra-Low Power sensAI Stack with Optimized Solutions for Always-On, On-Device AI (Sept. 25, 2018)
- Floadia G1 eFlash IP has exceeded 30,000 wafers shipment at Powerchip for system LSI customers (Sept. 25, 2018)
- sureCore Opens Low-Power SRAM IP Customization Service (Sep 25, 2018)
- Boeing Defense, Space & Security Licenses Flex Logix's Embedded Field-Programmable Gate Array on GlobalFoundries 14nm Process (Sep 24, 2018)
- Synopsys and SMART Photonics Expand InP-Based PIC Design Automation (Sep 24, 2018)
- Intilop to Showcase their 40G-10G TCP-UDP Acceleration Technology and Solutions at MIT's Lincoln Labs (Sep 24, 2018)
- Qualcomm's share price has risen by 50% in the past few months (Sept. 24, 2018)
- Ampere carries arm IP architecture and TSMC 7 nm. A new chips designer suddenly rises. (Sept. 22, 2018)
- To protect the price, Samsung intends to reduce the output of memory chips next year. (Sept. 22, 2018)
- New global Fab investment is expected to reach new heights in 2019. (Sept. 21, 2018)
- The biggest challenge of auto car (Sept. 21, 2018)
- Cadence Launches New Tensilica DNA 100 Processor IP Delivering Industry-Leading Performance and Power Efficiency for On-Device AI Applications (Sep 20, 2018)
- Renesas Expands Access to Robust Portfolio of IP Licenses (Sep 20, 2018)
- Each AI chip has been put in place and put into the data center for testing. (Sept. 20, 2018)
- Ali cloud IoT announced the deep cooperation with Intel in the Internet of things to launch cloud edge integrated edge computing products (Sept. 20, 2018)
- TSMC: for 10 years, mainland IC design technology has entered the mainstream of the world. (Sept. 20, 2018)
- Seven IC Products to Outpace Total 16% IC Market Growth in 2018 (Sep 19, 2018)
- ARM's Greg Yeric on memory, logic and making it (Sep 19, 2018)
- HDL Design House Appoints New Sales Representative for US and Canada (Sep 19, 2018)
- Report: Intel to outsource 14nm chip production to TSMC (Sep 19, 2018)
- Occupied by three new iPhone chips, Intel may outsource its orders to TSMC. (Sept. 19, 2018)
- Fraunhofer IIS introduces SDK for JPEG XS image coding (Sept. 18, 2018)
- Open-Silicon Appoints New VP of Engineering (Sep 18, 2018)
- Ampere Announces Availability of eMAG for Hyperscale Cloud Computing and Unveils Aggressive, Multi-Generation Roadmap (Sep 18, 2018)
- Cadence Achieves Amazon Web Services Industrial Software Competency Status for Its Cloud-Hosted Design Solution (Sep 18, 2018)
- Arm delivers production-ready open source Bluetooth Low Energy software stack to unleash IoT innovation (Sep 18, 2018)
- LG Electronics Selects Synopsys HDMI 2.1 IP with HDCP 2.3 Content Protection to Deliver Immersive Viewing Experiences (Sep 18, 2018)
- Graphcore Uses Synopsys Design Platform to Implement Colossus Chip to Accelerate AI Computing (Sep 18, 2018)
- eSilicon Announces Availability of neuASIC IP Platform for AI ASIC Design (Sep 18, 2018)
- ZCAN Licenses SonicsGN NoC and MemMax DRAM Scheduler for new Cryptocurrency Chip Design (Sep 18, 2018)
- TrueConnect 2018 - 2nd Annual Technical Conference of Truechip (Sep 17, 2018)
- Attopsemi's I-fuse OTP worked at 0.4V and 1uW read at 22nm process for IoT application (Sept. 17, 2018)
- Gowin Semiconductor Unveils the Latest Embedded Memory Products for their Families of Programmable Logic Devices (Sep 17, 2018)
- intoPIX to show first TICO-XS hardware implementation at IBC 2018 (Sep 17, 2018)
- Entering the 2 nanometer process, TSMC’s the real purpose on memory manufacturers (Sept. 17, 2018)
- High demand of 7nano process, TSMC's new iPhone revenue is expected to reach a new high. (Sept. 17, 2018)
- Demand for telecom applications will return to normal. 3Q18 Taiwan wafer foundry revenue will increase by 6.2% in the quarter. (Sept. 17, 2018)
- Taiwan chip factorys use new products to break through the dilemma (Sept. 17, 2018)
- Intel enters industrial Internet of things，visual computing as "sharp weapon" (Sept. 17, 2018)
- SoC-e's 1588Tiny IP Core now supports Layer-3 PTP operation (Sep 17, 2018)
- VEXXHOST Leverages the Power of Arm Processors and OpenStack with New Virtual Machine Architecture Offering (Sep 17, 2018)
- Innosilicon announces the World Best BTC Miner T2T+32T for shipment, 68W/TH (Sep 17, 2018)
- New Fabs Invest Over $220 Billion; 2019 to Mark All-Time Spending High (Sep 17, 2018)
- MRAM Makes a Move into the Embedded Space (Sept. 16, 2018)
- MediaTek's revenue in India is expected to grow in double figures this year, and the market share will continue to advance to 4. (Sept. 16, 2018)
- MCU sales increased to $23 billion 900 million in 2022 (Sept. 14, 2018)
- IDC:2022 global smart watch shipments will reach 94 million 300 thousand, accounting for half of wearable devices. (Sept. 14, 2018)
- Imecas and Design & Reuse partnership (Sept. 14, 2018)
- MCUs Sales to Reach Record-High Annual Revenues Through 2022 (Sep 13, 2018)
- Wasiela Brings Encryption, FEC and Connectivity IP to DesignShare (Sep 13, 2018)
- Arasan Announces it's 2'nd Generation MIPI C-PHY / D-PHY IP Combo Core for C-PHY v1.2 Specifications (Sept. 13, 2018)
- Allegro DVT Announces Availability of Full Compliance Test Suite for Alliance for Open Media's New AV1 Video Codec (Sept. 13, 2018)
- eSilicon Announces Silicon Validation of 7nm 56G SerDes (Sept. 13, 2018)
- Media Links Integrates TICO Lightweight Compression into its MDP Series (Sept. 13, 2018)
- Nuvoton Launches NuMicro M2351 Series TrustZone Empowered Microcontroller Focusing on IoT Security (Sep 13, 2018)
- Apple Describes 7nm iPhone SoC (Sep 13, 2018)
- Nextera, Adeas, and intoPIX team up for 4K video over ST 2110 (Sept. 12, 2018)
- TSMC: Chip Scaling Could Accelerate (Sep 12, 2018)
- NAGRA announces integration of NexGuard watermarking and Inside Secure's downloadable security solution (Sept. 12, 2018)
- Smartlogic announces PCI Express Multifunction IP Core for Xilinx 7 Series (Sept. 12, 2018)
- Renesas to Acquire Integrated Device Technology, to Enhance Global Leadership in Embedded Solutions (Sep 11, 2018)
- Allegro DVT Introduces Industry's First HEVC SHVC Encoder IP, Pushes Video Quality to New Levels (Sep 11, 2018)
- NGCodec Leverages Accelize's Digital Right Management (DRM) Platform for Flexible and Secure Deployment of its Next-Generation Video Compression Solutions (Sep 11, 2018)
- Synopsys and Truphone Enable Secure Over-the-Air Provisioning with Integrated SIM IP and Managed Services Solution (Sep 11, 2018)
- Intel Acquires NetSpeed Systems for Chip Design (Sep 11, 2018)
- Taiwan's silicon wafer, memory and passive components expand to prepare for mass production in 2019. (Sept. 11, 2018)
- UNH-IOL Meets Industry Need for 50, 100, 200 and 400 Gigabit Ethernet Testing Services (Sept. 10, 2018)
- Codasip Expands its Global Reach by Signing Channel Partnerships throughout Asia (Sep 10, 2018)
- SoC-e's Managed Ethernet Switch now supports up-to 32 ports (Sept. 10, 2018)
- TSMC August 2018 Revenue Report (Sep 10, 2018)
- BrainChip Announces the Akida Architecture, a Neuromorphic System-on-Chip (Sep 10, 2018)
- New Chip Seen Boosting Huawei's Market Share (Sep 10, 2018)
- AMD will discuss the wafer supply agreement with global foundry for the seventh time. (Sept. 10, 2018)
- Hex Five Security Adds MultiZone Trusted Execution Environment to the SiFive Software Ecosystem (Sept. 10, 2018)
- New Synopsys HPC Design Kit Delivers Superior Performance, Power, and Area Efficiency for DesignWare Embedded Vision Processor IP (Sept. 10, 2018)
- MediaTek first launched the M70 baseband 5G test prototype. (Sept. 10, 2018)
- New Chip Seen Boosting Huawei’s Market Share (Sept. 10, 2018)
- Revelation of global semiconductor industry transfer (Sept. 10, 2018)
- Worldwide Semiconductor Equipment Billings Reach $16.7 Billion in Second Quarter 2018, SEMI Reports (Sep 10, 2018)
- Samsung will become the world's first 3D SiP foundry next year, 3nm trial production in 2020. (Sept. 09, 2018)
- From 7Nm to 3nm GAA, why did Samsung adopt EUV radically? (Sept. 09, 2018)
- UMC Reports Sales for August 2018 (Sep 07, 2018)
- Continental wafer foundry will account for 20% of the world's capacity in 2020. (Sept. 07, 2018)
- The US China trade war is limited, and mainland semiconductor demand is strong. (Sept. 07, 2018)
- Accellera Forms IP Security Assurance Working Group (Sep 06, 2018)
- Impressive World-Wide Syndicate Invests $65 Million In AI Platform Venture ThinCI's Oversubscribed Series C Funding Round (Sep 06, 2018)
- Synopsys Announces Support for the Open Neural Network Exchange Format in ARC MetaWare EV Development Toolkit (Sept. 06, 2018)
- Global semiconductor giant mergers and acquisitions calm down (Sept. 06, 2018)
- Global fab and chip customers are slowing down their investment in 7nm (Sept. 05, 2018)
- The foundry warfare: GF exit, the probability of Intel abandonment increased (Sept. 05, 2018)
- Intel watched as the opponent ran farther and farther on the EUV (Sept. 05, 2018)
- Imagination and Chips&Media deliver integrated GPU and Video Codec IP with advantages of system level compression (Sept. 05, 2018)
- If everyone is competing for 5G chips, can China change the market structure? (Sept. 05, 2018)
- Achronix Presentation at D&R IP SoC China will Detail Accelerating Computing at the Edge with Speedcore eFPGAs (Sep 05, 2018)
- Intel welcome its first "airborne soldier" CEO (Sept. 05, 2018)
- If Unicom Telecom merges, China Mobile benefits from Huawei's ZTE damage (Sept. 05, 2018)
- Lattice Semiconductor Appoints Steve Douglass as Corporate VP, R&D (Sep 05, 2018)
- UltraSoC embedded analytics selected by Kraftway for solid state disk controller products (Sept. 05, 2018)
- Sankalp Semiconductor to present technical paper at CDNLive Bangalore (Sep 05, 2018)
- GUC Monthly Sales Report - Aug 2018 (Sep 05, 2018)
- Global Semiconductor Sales Increase 17.4 Percent Year-to-Year in July (Sep 05, 2018)
- TSN Ethernet Subsystem Available from CAST Proven at IIC and LNI Plugfests (Sept. 05, 2018)
- Artosyn Selects Synopsys DesignWare Security IP for Drone SoC (Sept. 05, 2018)
- China's foundry production capacity will reach 20% share in the world in 2020. (Sept. 05, 2018)
- Why are the ADAS performance of different vehicles uneven? (Sept. 05, 2018)
- Hybrid cars and electric cars: more revolutionary than automatic driving? (Sept. 05, 2018)
- Huawei Launches Kirin 980, the World's First Commercial 7nm SoC (Sep 04, 2018)
- NXP Acquires OmniPHY to Accelerate Autonomous Driving and Vehicle Networks (Sep 04, 2018)
- China's Semiconductor Fab Capacity to Reach 20 Percent Worldwide Share in 2020 (Sep 04, 2018)
- Leti and VSORA Demonstrate 3GPP New Radio (5G NR) on Multi-Core Digital Signal Processor (Sept. 04, 2018)
- Palma Ceia SemiDesign Announces Silicon-Proven LTE NB-IOT Transceiver for IoT Applications (Sept. 04, 2018)
- Industrial Internet of Things enters a period of rapid development (Sept. 04, 2018)
- First announcement after Qualcomm "breakup", NXP China business start again (Sept. 04, 2018)
- Tiannengbo optimises their latest Mining Chip using Moortec's Embedded Temperature Sensor (Sept. 03, 2018)
- Credo to Demonstrate 100G Mixed-Signal DSP for 100G DR1 & 400G DR4 Optical Modules at CIOE (Sep 03, 2018)
- Brite Semiconductor Appoints Dr. John Zhuang as Acting Chief Executive Officer (Sept. 03, 2018)
- ADAS SoC: Show Me Your Benchmark (Sep 03, 2018)
- GF announced that it will scale out applications based on existing 14/12 nm FinFET process nodes (Sept. 03, 2018)
- Chinese C-SKY Releases World's First RISC-V Processor Supporting IoT Security (Sept. 03, 2018)
- Socionext Establishes "ForteArt" to Enhance Sound Quality in Wide Range of Applications (Aug 31, 2018)
- Huawei Launches Kirin 980 for 5G, the World's First Commercial 7nm SoC (Aug. 31, 2018)
- Application specific processor for accelerated deep learning (Aug. 30, 2018)
- Jon Peddie Research reports the Q2'2018 GPU shipments (Aug 30, 2018)
- Yocto Project Welcomes New Members, Advances Open Source Embedded Systems Through Momentum (Aug 30, 2018)
- SMIC Announces Unaudited 2018 Interim Results (Aug 30, 2018)
- MRAM Makes a Move into the Embedded Space (Aug. 30, 2018)
- Cadence Full-Flow Digital Tool Suite Achieves GLOBALFOUNDRIES 22FDX Certification (Aug. 30, 2018)
- Apple Goes Vertical & Why It Matters (Aug 29, 2018)
- Frontier collaborates with NXP on new Smart IoT software licensing business (Aug 29, 2018)
- Rambus and Infineon Renew Patent License Agreement (Aug 29, 2018)
- Memory ICs to Account for 53% of Total 2018 Semi Capex (Aug 29, 2018)
- GF exits 7nm process foundry: the biggest victim is not AMD but IBM (Aug. 29, 2018)
- GF Announces Stopping 7nm FinFET Project (Aug. 28, 2018)
- Microsemi RTG4 FPGAs Become Industry's First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification (Aug 28, 2018)
- The dispute between Apple and Qualcomm (Aug. 28, 2018)
- China released the world's first ultra-wideband visible light communication chipset (Aug. 28, 2018)
- Analysis: Outpaced by TSMC, GloFo cuts its cloth (Aug 28, 2018)
- Lattice Semiconductor Appoints Jim Anderson as CEO (Aug 28, 2018)
- RoodMicrotec selected as key partner for EnSilica automotive ASIC project (Aug. 28, 2018)
- Faraday ASIC Service Leverages Samsung FinFET Platform to Target Next-generation Applications (Aug. 28, 2018)
- GLOBALFOUNDRIES Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings (Aug 28, 2018)
- Gartner Says Huawei Secured No. 2 Worldwide Smartphone Vendor Spot, Surpassing Apple in Second Quarter 2018 (Aug 28, 2018)
- Drone.io Announces Official Support for Arm Architectures (Aug 27, 2018)
- Synopsys Delivers 10X Performance in Formal Property Verification with Breakthrough Machine Learning Technology (Aug. 27, 2018)
- The correct way to open RISC-V (Aug. 27, 2018)
- GOWIN Semiconductor Corp. Announces RISC-V Microprocessor Implementation for GOWIN FPGA Solutions and Expands Sales Channels in the Americas Region (Aug. 27, 2018)
- Japan, Russia consider disabling Huawei ZTE telecom equipment (Aug. 27, 2018)
- Who is the dominant electronics manufacturer in mainland China and Taiwan? (Aug. 27, 2018)
- NVIDIA GeForce RTX Series GPU: The foundry will be co-founded by Samsung and TSMC (Aug. 24, 2018)
- Adopting TSMC's 7-nanometer process Qualcomm pushes the first 5G mobile platform by the end of the year (Aug. 24, 2018)
- 2019 iPhone's A13 chip is still exclusively produced by TSMC (Aug. 24, 2018)
- Rambus: Memory Does not Come Cheap…. Or Does It? (Aug. 24, 2018)
- Fujitsu Presents Post-K CPU Specifications (Aug 23, 2018)
- Apple, Qualcomm in Fatal Attraction (Aug 23, 2018)
- Apple, Intel Good Partners, For Now (Aug 23, 2018)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2018 (Aug 23, 2018)
- Worldwide Semiconductor Revenue Hit Record $120.8 Billion in Q2 2018, IHS Markit Says (Aug 23, 2018)
- Flex Logix: eFPGA Development Board Promotes eFPGA Applications (Aug. 23, 2018)
- Imagination Technologies: Life after Apple (Aug 22, 2018)
- Apple-TSMC Sole-Source Embrace Holds Risk for iPhone Maker (Aug 22, 2018)
- Flex Logix Partners with Quantum Leap Technical Sales To Meet Strong Demand for EFLX Embedded FPGA Throughout North America (Aug. 22, 2018)
- Companion chips: A smart choice for AI? (Aug. 22, 2018)
- Seven Top-15 1H18 Semi Suppliers Register ?20% Gains (Aug 21, 2018)
- AI is now the Show Time for new companies and new architectures (Aug. 21, 2018)
- Soitec and MBDA to Acquire Dolphin Integration Assets (Aug 21, 2018)
- IP Cores, Inc. Announces an Update for Its True Random IP Core (Aug. 21, 2018)
- ASIC Design Services Adds Core Deep Learning IP to SiFive DesignShare Program (Aug. 21, 2018)
- UMC 8-inch customers increase price for obtaining capacity (Aug. 21, 2018)
- 7nm mining chip is not the same as 7nm general chip (Aug. 20, 2018)
- ARM first announced product roadmap: 2019 launched two generations of CPU, performance will exceed Intel Core i5 (Aug. 20, 2018)
- SiFive Announces First Open-Source RISC-V-Based SoC Platform With NVIDIA Deep Learning Accelerator Technology (Aug. 20, 2018)
- DRAM price Q4 fears loose, ending the 9th quarter (Aug. 20, 2018)
- 2018 first half of the TOP-15 semiconductor manufacturers sales ranking released (Aug. 20, 2018)
- Xilinx Unveils its Vision for the Future of Computing, Details New Programmable Engine Fabric and Multiple AI Technologies (Aug 20, 2018)
- Skyworks Closes Acquisition of Smart Interface Innovator Avnera Corporation (Aug 20, 2018)
- Esperanto Technologies Expands AI Engineering Leadership Team (Aug 20, 2018)
- IBM and Synopsys Accelerate Post-FinFET Process Development with DTCO Innovations (Aug 20, 2018)
- HfS Positions L&T Technology Services in 'Winner's Circle' for Automotive Engineering Services (Aug. 20, 2018)
- Apple abandons Qualcomm, the 5G era may change dramatically (Aug. 18, 2018)
- Size of Semiconductor Acquisitions May Have Hit Limit soon (Aug. 18, 2018)
- How ignoring Huawei 5G is stupid, Australia knows best (Aug. 17, 2018)
- Samsung introduces the first 5G baseband chip fully compatible with 3GPP Release 15 specification, expected to be sampled at the end of the year (Aug. 17, 2018)
- "China's IC Industry Talent White Paper" released (Aug. 17, 2018)
- SK Telecom Deploys Xilinx FPGAs for AI Acceleration, Achieves 5X Performance/16X Performance-per-watt over GPUs (Aug 16, 2018)
- Arasan Announces NAND Flash Controller PHY and I/O Pad IP compliant to ONFI 4.1 Specifications (Aug. 16, 2018)
- Bluespec, Inc. Releases a New Family of Open-Source RISC-V Processors (Aug. 16, 2018)
- Size of Semiconductor Acquisitions May Have Hit Limit (Aug 16, 2018)
- TSMC's 3nm plant has an investment of more than 600 billion, and mass production by the end of 2022 (Aug. 16, 2018)
- Taiwan's wafer foundry industry may always dominate the world? (Aug. 16, 2018)
- Faraday Unveils the Industry's Smallest USB 2.0 OTG PHY IP (Aug. 15, 2018)
- IBM and Synopsys Accelerate 3nm Process Development with DTCO Innovations (Aug 15, 2018)
- Fundamentals of Semiconductor ISO 26262 Certification: People, Process and Product (Aug. 15, 2018)
- UMC announced that it will no longer invest in new processes below 12 nanometers! (Aug. 14, 2018)
- The new wafer fab in mainland China will be on the soar of production, and the battle for a single battle is about to begin. (Aug. 14, 2018)
- UltraSoC selects MosChip to support its growth in India (Aug 14, 2018)
- OPENEDGES Joins SiFive's DesignShare (Aug. 14, 2018)
- Antmicro and SiFive join forces to propose complete RISC-V offering (Aug 14, 2018)
- SEMI Integration of ESD Alliance Underway (Aug 14, 2018)
- The Linley Group Microprocessor Report Details eSilicon 7nm IP (Aug 14, 2018)
- Cadence Palladium Z1 Enterprise Emulation Platform Enables GUC to Accelerate SoC Design (Aug. 14, 2018)
- Huarunshanghua and Ruichengxinwei launch a complete low-power Internet of Things solution (Aug. 13, 2018)
- Intel in the Cloud Post-Moore's Law (Aug 13, 2018)
- Startup AI Chip Passes Road Test (Aug 13, 2018)
- Argon Design Releases Argon Streams AV1 (Aug. 13, 2018)
- SiFive:Do you want to choose an open source processor core? (Aug. 13, 2018)
- Silicon wafers are ushered in shortages? The hidden worries behind the Chinese fab attack (Aug. 12, 2018)
- Why are miners preemptively achieving mass production of 7nm chips? (Aug. 10, 2018)
- Qualcomm reached a settlement with Taiwan's anti-monopoly agency, and the fine of 23.4 billion Taiwan dollars fell to 2.73 billion (Aug. 10, 2018)
- SMIC Reports 2018 Second Quarter Results (Aug 09, 2018)
- India Startup Preps RISC-V, AI Cores (Aug 09, 2018)
- Skyworks to Acquire Smart Interface Innovator Avnera Corporation (Aug 09, 2018)
- Arm targets any number of devices and any type of data (Aug 09, 2018)
- UMC Reports Sales for July 2018 (Aug 09, 2018)
- Andes Technology forms a Multinational Alliance with ASIC Design Service Companies to Provide RISC-V Total Solutions (Aug. 09, 2018)
- SMIC's 14nm FinFET process has made significant progress (Aug. 09, 2018)
- Intel's 2017 artificial intelligence processor chip sales reached 1 billion US dollars (Aug. 09, 2018)
- CEVA, Inc. Announces Second Quarter 2018 Financial Results (Aug 08, 2018)
- PLDA Announces Integration of their PCIe 3.0 Controller IP into Kazan Networks' NVMe Over Fabric Fuji ASIC, Providing a Dramatic Increase in Scalability and Flexibility for Storage Applications (Aug. 08, 2018)
- QuickLogic Collaborates with ETH Zurich to Integrate eFPGA into PULP Platform (Aug. 08, 2018)
- eSilicon Licenses Industry-Leading SiFive E2 Core IP for Next-Generation SerDes IP (Aug. 08, 2018)
- FADU Launches Industry Leading SSD Solutions Powered by SiFive RISC-V Core IP (Aug. 08, 2018)
- Achronix and Mentor Partner to Provide Link Between High-Level Synthesis and FPGA Technology (Aug. 08, 2018)
- Stratix 10 FPGA: REFLEX CES adds 26G Acceleration hardware to the "XpressGXS10-FH200G" line already shipping. (Aug 08, 2018)
- Mobiveil Inc. and SiFive, Inc. partner to develop RISC-V based configurable SSD Platform For Data Center and Enterprise storage Applications (Aug. 08, 2018)
- Cadence, Nvidia to apply machine learning to EDA (Aug. 08, 2018)
- Arm acquires Treasure Data to set the stage for IoT transformation (Aug. 07, 2018)
- eMemory's 2nd Generation NeoMTP Enables a Wide Range of Power Management Applications on DB HiTek's BCD Process (Aug 07, 2018)
- Lekha Wireless appoints T2M for global marketing, representation and business development (Aug 07, 2018)
- Avery Design Systems Pairs PCIe and NVM Express VIP with Teledyne LeCroy Summit Protocol Exercisers (Aug. 07, 2018)
- Q'comm-NXP Break-Up: There Will Be Fallout (Aug 06, 2018)
- Lessons from the Broadcom-Qualcomm Debacle (Aug 06, 2018)
- UMC and Avalanche Technology Partner for MRAM Development and 28nm Production (Aug. 06, 2018)
- IntelliProp to Demo Gen-Z 1.0 Compliant IP at Flash Memory Summit 2018 (Aug 06, 2018)
- Where Did Qualcomm Go Wrong? (Aug 06, 2018)
- TSMC Details Impact of Computer Virus Incident (Aug 06, 2018)
- GUC Monthly Sales Report - July 2018 (Aug 06, 2018)
- Mid-Year Global Semiconductor Sales Up 20.4 Percent Compared to 2017 (Aug 06, 2018)
- TSMC will recover from virus attack today, and new iPhone shipments will be affected. (Aug. 06, 2018)
- Huawei decides to quitte from the US market (Aug. 06, 2018)
- eSilicon 56Gbps PAM4 SerDes IP Hits the Lab (Aug. 06, 2018)
- TSMC was exposed to virus intrusion；SMIC checked the virus (Aug. 05, 2018)
- IP-Maker to showcase NVMe Host demo at Flash Memory Summit (Aug. 03, 2018)
- MIPI Alliance to Advance Autonomous Driving, other Automotive Applications with New Data Interface Specifications at 12-24 Gbps and Beyond (Aug 02, 2018)
- Wave Computing Announces Strategic Collaboration with Broadcom For Next-Generation AI DPU ASIC (Aug 02, 2018)
- Stratix 10 FPGA: REFLEX CES adds 26G Acceleration hardware to the (Aug. 02, 2018)
- Arasan to demonstrate its SD Card UHS-II PHY IP and eMMC 5.1 PHY IP for 12nm SoC Designs at the 2018 Flash Memory Summit (Aug. 02, 2018)
- Nurlink and Vidatronic Collaborate to Develop SoC for Internet of Things (IoT) Applications (Aug. 02, 2018)
- Numem exhibits and presents at MRAM Developer Day (Aug. 02, 2018)
- Numem exhibits at the Flash Memory Summit (Aug. 02, 2018)
- UltraSoC brings SEGGER J-Link to embedded debug and analytics environment (Aug. 02, 2018)
- Microsemi Announces Sampling of Industry's Highest Performing Enterprise Gen 4 PCIe Controller (Aug 02, 2018)
- CEVA: Extend wireless network technology to the Internet of Things field through built-in 802.11ax (Aug. 02, 2018)
- Nokia has gotten $3.5 billion, the world's largest 5G order! (Aug. 02, 2018)
- Qualcomm launches stock repurchase program and expects to repurchase $30 billion in stocks before fiscal year 2019 (Aug. 02, 2018)
- Qualcomm Vets Join Blockchain RISC-V Chip Developer (Aug. 01, 2018)
- Thalia-DA and Catena confirm successful tape-outs of first analog IP re-use projects (Aug. 01, 2018)
- Innosilicon's Bitcoin ASIC powered by Samsung's Low Power FinFET technology to achieve record breaking performance (Aug 01, 2018)
- Arm to Spend $600 Million to Widen IoT Ecosystem Offer (Aug. 01, 2018)
- TSMC wins AMD7 nanometer big order (Jul. 31, 2018)
- Intel 10nm chip production schedule is postponed again. (Jul. 31, 2018)
- Taiwan Semiconductor enters China mainland A shares (Jul. 31, 2018)
- Chinese IC production in the first half of the year increased by 15% year-on-year (Jul. 31, 2018)
- In response to the rise of China, the United States promotes the (Jul. 31, 2018)
- eMemory's Reprogrammable eNVM solution available on TowerJazz BCD platform (Jul. 31, 2018)
- IP Cores, Inc. Announces One-Year Anniversary of the Delivery of XTS4 Cores for the Server Memory Encryption (Jul 31, 2018)
- Synopsys Redefines Interactive Application Security Testing with New Seeker Solution Optimized for DevSecOps (Jul. 31, 2018)
- STMicroelectronics Make Vehicle Sounds Safer (Jul. 31, 2018)
- Second Quarter 2018 Silicon Wafer Shipments Increase Quarter-Over-Quarter - All-Time Quarterly High (Jul 30, 2018)
- Digital Blocks Extends its MIPI I3C Controller IP Core Family with I3C Master/Slave, I3C Master, and I3C Slave Releases. (Jul. 30, 2018)
- Rambus Appoints Sanjay Saraf to Board of Directors (Jul 30, 2018)
- PLDA and HPE collaborate to develop Gen-Z semiconductor IP (Jul. 30, 2018)
- H1 2018 results: Inside Secure announces strong profitable growth (Jul 30, 2018)
- Chips&Media announced new ISP deal to provide 4K UHD (8Mpixel) resolution Image Signal Processing (ISP) IP (Jul. 30, 2018)
- Chipus Brings Ultra-Low-Power IP to SiFive's DesignShare Ecosystem (Jul. 30, 2018)
- Moore's Law, China vs. Team USA (Jul 30, 2018)
- Intel Claims Progress on 10nm Yields (Jul 30, 2018)
- ONKYO Joins HEVC Advance to Expand HEVC/H.265 Video Compression Technology (Jul 30, 2018)
- Xilinx Reports Record Quarterly Revenues And EPS; Raises Fiscal Year 2019 Guidance (Jul 30, 2018)
- How to reposition the 8-inch wafer foundry (Jul. 27, 2018)
- Samsung developing new GPU (Jul. 27, 2018)
- Efinix Expands Executive Leadership Team and Board of Directors (Jul 26, 2018)
- Applied, ARM to develop CeRAM for neuromorphic applications (Jul 26, 2018)
- Chinese chipmaker Tsinghua Unigroup to buy France's Linxens for $2.6 billion: sources (Jul 26, 2018)
- Qualcomm-NXP deal off (Jul 26, 2018)
- ADASMark Autonomous Driving Benchmark Suite Is Now Available for Licensing From EEMBC (Jul 26, 2018)
- SMIC's business operations continue to increase (Jul. 26, 2018)
- Samsung self-developed GPU experts exposed (Jul. 26, 2018)
- Dolphin Integration announces a new release of its innovative IDE for the RISC-V ecosystem (Jul. 25, 2018)
- C-SKY selects UltraSoC embedded intelligence for Chinese developed AI SoC (Jul. 25, 2018)
- Kandou Bus Closes Series B Investment Round (Jul 25, 2018)
- North American Semiconductor Equipment Industry Posts June 2018 Billings (Jul 25, 2018)
- Silicon Industry Veteran Joins SiFive Executive Team (Jul 25, 2018)
- BrainChip Unveils the Akida Development Environment (Jul. 25, 2018)
- Chinese domestic 12-inch silicon wafers are certified. The annual production capacity will reach 100,000 pieces/month. (Jul. 25, 2018)
- UltraSoC's Alibaba design win underlines China's significance (Jul. 25, 2018)
- 14nm process: Intel 8-core Core i9-9900K frequency up to 5GHz (Jul. 24, 2018)
- ESD Alliance Reports EDA Industry Revenue Increase For Q1 2018 (Jul 24, 2018)
- Cadence Selected for DARPA ERI Machine Learning Contract to Accelerate Electronic Design Innovation (Jul. 24, 2018)
- Gowin Semiconductor Corp. announces LittleBee Family GW1NS Series GW1NS-2K FPGA SoC Device Engineering Samples and Development Board Available (Jul. 24, 2018)
- AI, China Dominate Semiconductor Funding (Jul. 24, 2018)
- Microsemi PolarFire FPGAs Enable Smallest, Lowest Power DisplayPort Implementations with New IP from Bitec (Jul. 24, 2018)
- NXP and Dover Microsystems Join Forces to Deliver Unprecedented Network Security, Safety, and Privacy for Processors (Jul. 24, 2018)
- Synopsys Targets 400G Hyperscale Data Centers with High-Performance Ethernet IP (Jul. 24, 2018)
- Samsung developing new GPU (Jul 24, 2018)
- Data Center Scaling at Breakneck Pace (Jul 23, 2018)
- Android Wants to Be Truly Free (Jul 23, 2018)
- Will Robocars Need More than Ethernet? (Jul 23, 2018)
- TSMC's EUV leading mass production advantage will take all orders such as 5G and AI (Jul. 23, 2018)
- TSMC trial production of 5nm in the first quarter of next year, and mass production at the end of the year (Jul. 23, 2018)
- Cadence Introduces Voltus-XP Technology with Extensive Parallelism, Up to 5X Acceleration, and Increased Capacity for Power Signoff at Advanced Nodes (Jul. 23, 2018)
- Where will the next round of AI chips explosion? (Jul. 23, 2018)
- The latest release of Cadence Sigrity 2018, integrated 3D design and analysis (Jul. 20, 2018)
- Global Foundries Mark Granger: Automotive Electronics is growing rapidly. How will semiconductor companies make strategies? (Jul. 20, 2018)
- eMemory: In the AIoT era, how to protect chip and data security with fingerprint chip technology? (Jul. 20, 2018)
- Qualcomm intends to abandon its acquisition of NXP and plans to repurchase nearly $30 billion in company stock (Jul. 20, 2018)
- Stratix 10 FPGA: REFLEX CES launches an 800G acceleration card (Jul. 19, 2018)
- Semi Content in Electronic Systems Forecast to Reach 31.4% in 2018 (Jul 19, 2018)
- Ferroelectric Memory Company receives growth financing from eCAPITAL and HTGF (Jul 19, 2018)
- Lattice Semiconductor Takes Additional Action to Reduce Operating Expenses; Company to Discontinue Millimeter Wave Business to Focus on Core Business Opportunities (Jul 19, 2018)
- TSMC Reports Second Quarter EPS of NT$2.79 (Jul 19, 2018)
- Open-Silicon and Credo Demonstrate Solutions for Deep Learning and Networking Applications at TSMC OIP and Symposium in Amsterdam (Jul 19, 2018)
- SWIM.AI Secures $10M in Series B Funding (Jul 19, 2018)
- Texas Instruments: Brian Crutcher resigned as CEO (Jul 19, 2018)
- Credo Demonstrates Industry Leading SerDes on TSMC's 7nm Process at TSMC 2018 OIP Forum and Technology Symposium in Amsterdam (Jul 19, 2018)
- ASML's second-quarter EUV sales exceeded expectations, SMIC added another order (Jul. 19, 2018)
- Is This the Moment for RISC-V? (Jul. 19, 2018)
- Flex Logix: Machine Learning and Embedded FPGA IP (Jul. 19, 2018)
- Xilinx Announces the Acquisition of DeePhi Tech (Jul 18, 2018)
- Huawei adopts TSMC's 7-nanometer process and has entered the chip verification period. (Jul. 18, 2018)
- Xilinx Announces the Acquisition of DeePhi Tech (Jul. 18, 2018)
- After nearly a huge loss of nearly 9 billion, ZTE will welcome the first big order after return! (Jul. 18, 2018)
- Huawei and Samsung competes for South Korean 5G equipment orders, security issues may drag the deal. (Jul. 17, 2018)
- Is This the Moment for RISC-V? (Jul 17, 2018)
- HDL Design House Greece Joins HETIA (Jul 17, 2018)
- Rambus and Socionext Sign Broad Patent License Agreement (Jul 17, 2018)
- RISC-V : the open processor core will play the role of hardware innovation! (Jul. 17, 2018)
- Samsung Electronics Announces Industry’s First 8Gb LPDDR5 DRAM for 5G and AI-powered Mobile Applications (Jul. 17, 2018)
- Intel 10nm foundry was dragged down by x86 (Jul. 16, 2018)
- AI Becomes the New Moore's Law (Jul 16, 2018)
- Sensing system connected to the line, edge intelligent protect IoT node security (Jul. 16, 2018)
- Intel to Acquire eASIC (Jul. 16, 2018)
- Arm joins industry leaders in commitment to fair enforcement of open source licenses (Jul 16, 2018)
- USB 3.0 – A Cost Effective High Bandwidth Solution for FPGA Host Interface (Jul. 14, 2018)
- China vigorously develops lithography machine (Jul. 13, 2018)
- GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX Technology (Jul. 13, 2018)
- Xylon: Available MPSoC Version of the logiADAK ADAS Development Kit (Jul. 13, 2018)
- Moortec to exhibit at the TSMC Europe Open Innovation Platform Ecosystem Forum & Technology Symposium (Jul 12, 2018)
- AMIQ EDA Announces its Design and Verification Tools Eclipse IDE Supports First Release of Accellera Portable Test and Stimulus Standard (PSS) (Jul 12, 2018)
- Veriest appoints Vukota Pekovic as General Manager, Serbia (Jul 12, 2018)
- Cadence Automotive Solution for Safety Verification Used by ROHM to Achieve ISO 26262 ASIL D Certification (Jul. 12, 2018)
- DSP Group and Inside Secure Collaborate on Development of Advanced Secured AI Processors (Jul. 12, 2018)
- ArcSoft and Cadence Partner to Develop AI and Vision Applications (Jul. 12, 2018)
- The large-scale consolidation of the semiconductor industry will continue (Jul. 12, 2018)
- 7nm networking platform delivers unprecedented performance and configurability for data center ASICs (Jul. 11, 2018)
- Samsung announced mass production of 96-layer V-NAND, 1Tb capacity will become mainstream in 2019 (Jul. 11, 2018)
- GF announces 22FDX process design revenue breaks through $2 billion (Jul. 10, 2018)
- To achieve the edge AI, we must first break through the "memory wall" (Jul. 10, 2018)
- China will top the list in 2019, global semiconductor manufacturing equipment sales are expected to reach $67.6 billion (Jul. 10, 2018)
- Huawei will continue to purchase US chips this year, with an annual investment of 4 billion US dollars for basic research. (Jul. 10, 2018)
- GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX Technology (Jul 10, 2018)
- Terminus Circuits Brings Complete ASIC Solutions to DesignShare (Jul. 10, 2018)
- Stratix 10 SoC: REFLEX CES is releasing to market its new version of the COM Express module based on Stratix 10 SoC technology from Intel PSG (Jul. 10, 2018)
- TSMC June 2018 Revenue Report (Jul 10, 2018)
- Arteris IP Ncore and FlexNoC Interconnects and Resilience Packages Licensed by Mobileye for AI-Powered EyeQ Chips (Jul. 10, 2018)
- Microchip release first Arm Cortex-M23 based chip bringing new levels of security for constrained IoT devices (Jul. 10, 2018)
- Renode 1.4 released: 64-bit RISC-V HiFive Unleashed support, multiple Silicon Labs targets, and more (Jul. 09, 2018)
- UMC Reports Sales for June 2018 (Jul 09, 2018)
- Cadence JasperGold Formal Verification Platform Enables Hitachi to Develop Measures for Fault Avoidance to Comply with IEC 61508 Series SIL 4 Requirements (Jul. 09, 2018)
- Hardware: Golden Age or Golden Ager? (Jul 09, 2018)
- Baidu Accelerator Rises in AI (Jul. 09, 2018)
- EDA Takes to the Cloud (Sort of) (Jul. 09, 2018)
- Inside Secure Technology Chosen to Secure Kalray's Intelligent Processors for Autonomous Vehicles and Next-Generation Data Centers (Jul. 09, 2018)
- Samsung Electronics Wins at Two Top Global AI Machine Reading Comprehension Challenges (Jul. 09, 2018)
- Silex Inside eSecure Root-of-Trust Security IP Is Excellent Fit with RISC-V Cores (Jul. 06, 2018)
- PMIC tailored for the processor (Jul. 06, 2018)
- GUC Monthly Sales Report - June 2018 (Jul 05, 2018)
- Samsung will build Arm A76 architecture based on 5nm/7nm (Jul. 05, 2018)
- iTech announced the integration of MOSFET wafer post-process integration services (Jul. 05, 2018)
- Baidu's self-driving platform Apollo will surpass the West? (Jul. 05, 2018)
- Samsung Foundry and Arm Expand Collaboration to Drive High-Performance Computing Solutions (Jul. 05, 2018)
- Synopsys and Siemens Team Up to Expand and Extend Electronic Design Automation Collaboration (Jul. 04, 2018)
- Cadence teams with Google, Microsoft, Amazon, on cloud-based EDA (Jul. 04, 2018)
- Intel 10nm production meets difficulty (Jul. 04, 2018)
- Silex Inside releases a secure connection engine (Jul. 03, 2018)
- Cadence Full-Flow Digital and Signoff Tools Certified on Samsung Foundry's 7LPP Process Technology (Jul 03, 2018)
- Mass production of 65nm RF-SOI process (Jul. 03, 2018)
- RISC-V ISA Wins Prestigious Electrons d'Or Award, Validating Industry’s Commitment to the RISC-V Ecosystem (Jul. 03, 2018)
- CAST Releases TSN Ethernet Subsystem for Automotive and Industrial Applications (Jul. 02, 2018)
- UMC Announces Acquisition of Entire Shares in MIFS (Jul. 02, 2018)
- EDA Startup Rises From Ashes of ATopTech (Jul 02, 2018)
- Blu Wireless HYDRA 1.X mmWave IP validated in successful real-world trial (Jul. 02, 2018)
- Siemens-Mentor: How's It Working Out? (Jul 02, 2018)
- L&T Technology Services launches new NB-IoT Protocol Stack IP, collaborates with Cadence to facilitate smart connectivity (Jul. 02, 2018)
- Inomize joins Arm Approved Design Partner program (Jul 02, 2018)
- GLOBALFOUNDRIES to Deliver Socionext's Next Generation Graphics Controller for Advanced In-Vehicle Display Applications (Jul. 02, 2018)
- UMC Acquires 100% Ownership of Mie Fujitsu Semiconductor (Jul 02, 2018)
- Sonics Partners With SiFive To Support Agile RISC-V SoC Design Platform With IP Industry's Most Widely Used NoCs (Jul. 02, 2018)
- Global Semiconductor Sales in May Increase 21 Percent Year-to-Year (Jul 02, 2018)
- RISC-V Foundation Announces Security Standing Committee, Calls Industry to Join in Efforts (Jul. 02, 2018)
- TSMC and Taiwan University Cooperate on Key Technology for 3nm Process (Jun. 30, 2018)
- Overcoming FinFET and FD-SOI process control challenges (Jun. 29, 2018)
- Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC (Jun 28, 2018)
- Eta Compute and ROHM Semiconductor Collaborate to Create Low Power Wi-SUN Compatible Sensor Nodes (Jun 28, 2018)
- BlueX License CEVA Bluetooth Low Energy IP for BX2400 Wearable SoC (Jun. 28, 2018)
- Siemens acquires Austemper Design Systems for breakthrough IC functional safety technology (Jun 28, 2018)
- Inside Secure and Andes join forces to deliver secure IoT solutions to chipmakers for greater China and Asia markets (Jun. 28, 2018)
- Arteris IP Achieves Major Milestone: 100th Customer (Jun 27, 2018)
- China's Semi Capex Forecast to be Larger than Europe and Japan Combined in 2018 (Jun. 27, 2018)
- Cadence Perspec System Verifier Supports New Accellera Portable Test and Stimulus Specification 1.0 (Jun 27, 2018)
- Rambus Renews License With IBM (Jun 27, 2018)
- Mentor extends support of tools and solutions for Samsung Foundry's 8LPP and 7LPP process technologies (Jun. 27, 2018)
- Where Do FPGAs Stand in Auto IC Race? (Jun 27, 2018)
- TSMC has mass production on 7nm and plan to produce 5nm next year (Jun. 27, 2018)
- RafaelMicro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC (Jun. 27, 2018)
- Optimum Semiconductor Unveils New Image Recognition SoC (Jun 26, 2018)
- Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment - SAVE (Jun 26, 2018)
- Arbe Robotics Selects Synopsys' IP to Enable its High-Resolution Imaging Radar to Achieve the Highest Automotive Safety Level for Autonomous Vehicles (Jun 26, 2018)
- Flex Logix EFLX4K IO eFPGA Core Enables Very Wide Bus Connections for Networking Applications (Jun 26, 2018)
- General Processor Technologies Announces AI Accelerator and DSP for Digital and Image Processing (Jun 26, 2018)
- Spectral releases Silicon proven High Speed Low Power SRAM compilers in the 40/45nm CMOS/RFSOI process nodes targeted for a wide range of IOT & 5G Applications (Jun 26, 2018)
- Silicon Creations' SerDes Technology Helps Power Leading-Edge 8K TV (Jun 26, 2018)
- Daimler AG Selects Xilinx to Drive Artificial Intelligence-Based Automotive Applications (Jun 26, 2018)
- WiLAN Subsidiary Acquires Patent Portfolio from MagnaChip (Jun 25, 2018)
- Gidel Launches Lossless Compression IP that Reduces Storage Needs by Over 50%, Utilizing Only 1% of the FPGA, with Low Power Consumption (Jun 25, 2018)
- Synopsys Custom Design Platform Accelerates Robust Custom Design for Samsung Foundry's 7LPP Process Technology (Jun 25, 2018)
- Flex Logix Improves Deep Learning Performance By 10X With New EFLX4K AI eFPGA Core (Jun 25, 2018)
- Moortec Supporting Today's Connectivity Boom with IoT Specific Embedded In-Chip Monitoring Subsystem Solution (Jun 25, 2018)
- C-SKY Microsystems Selects QuickLogic as Their Strategic eFPGA Partner by Signing Master Technology License Agreement (Jun 25, 2018)
- Synopsys RedHawk Analysis Fusion Certified for Samsung Foundry's 10LPE, 8LPP, 7LPP Advanced-Node Designs (Jun 25, 2018)
- 9 of the Top 12 Smartphone Suppliers Headquartered in China (Jun 25, 2018)
- CEVA Extends its Leadership in NB-IoT IP with CEVA-Dragonfly NB2, the World's First eNB-IoT Rel14 Solution (Jun 25, 2018)
- Sankalp Semiconductor announces release of its eDP receiver IP for Chip on Glass Applications (Jun 25, 2018)
- Arteris IP and Magillem Partner to Create Integrated System-on-Chip Architecture Environment (Jun 25, 2018)
- SiFive Unveils E2 Core IP Series for Smallest, Lowest Power RISC-V Designs (Jun 25, 2018)
- Cadence Collaborates with Amazon Web Services to Deliver Electronic Systems and Semiconductor Design for the Cloud (Jun 25, 2018)
- NetSpeed launches SoCBuilder - AI-powered design and integration platform to accelerate SoC designs (Jun 25, 2018)
- Cadence and Microsoft Collaborate to Facilitate Semiconductor and System Design on the Microsoft Azure Cloud Platform (Jun 25, 2018)
- Truechip Collaborates with Gowin Semi for Verification of USB Type C & PD (Jun 25, 2018)
- Synopsys' ASIP Designer Tools Enables RIKEN to Successfully Develop Application-Specific Instruction-Set Processor in Less Than Six Months (Jun 25, 2018)
- Cadence Delivers the First Broad Cloud Portfolio for the Development of Electronic Systems and Semiconductors (Jun 25, 2018)
- Silexica raises $18m in Series B funding to advance software development solutions for autonomous driving (Jun 21, 2018)
- Andes Certifies Imperas Models and Simulator as a Reference for Andes RISC-V Cores (Jun. 21, 2018)
- SoftBank confirms sell-off of ARM China stake (Jun 21, 2018)
- North American Semiconductor Equipment Industry Posts May 2018 Billings (Jun 21, 2018)
- UltraSoC embedded analytics and Imperas virtual platforms combine to enhance multicore development and debug (Jun 21, 2018)
- Intel CEO Brian Krzanich Resigns, Board Appoints Bob Swan as Interim CEO (Jun 21, 2018)
- Synopsys Delivers PrimePower Power Analysis to Accelerate Robust SoC Design (Jun 21, 2018)
- NetSpeed unveils Orion AI - Delivering extreme performance and ultimate efficiency for next-gen AI SoCs (Jun 21, 2018)
- T2M to Showcase Advanced Mobile Communications and Low-Power Wireless IoT Technologies at Shanghai Mobile World Congress (Jun. 20, 2018)
- M31 Receives ISO 26262 Development Process Certification and Enters Advanced Automotive Electronics Market (Jun. 20, 2018)
- PLDA Announces Second Annual "PLDA Design Day", in Shanghai, China - a Free Design Workshop, 100% Focused on PCIe Design (Jun 20, 2018)
- Achronix to Demonstrate Embedded FPGA Solutions at Design Automation Conference (Jun 20, 2018)
- T2M to showcase cutting-edge Cellular and Low Power Wireless IoT technologies at MWC Shanghai 2018 (Jun 20, 2018)
- QuickLogic to Exhibit at DAC 2018 (Jun 20, 2018)
- To overtake TSMC, Samsung announced the use of EUV technology 7-nanometer process to complete the verification (Jun. 19, 2018)
- Arasan Announces SD Card UHS-II PHY IP for 12nm SoC Designs (Jun 19, 2018)
- CODASIP AT THE RISC-V WORKSHOP, SHANGHAI, CHINA (Jun. 19, 2018)
- Qualcomm's acquisition of NXP: How many twists and turns of the largest M&A case in the history of global silicon? (Jun. 19, 2018)
- U.S. Senate Votes to Resume Ban on ZTE Sales (Jun. 19, 2018)
- Flex Logix EFLX1K eFPGA Cores Enable Array-Efficient Reconfigurable Logic on 40nm to 180nm Nodes (Jun. 19, 2018)
- Intrinsic ID Names Kumi Thiruchelvam Vice President, Europe & Asia Sales (Jun 19, 2018)
- Inside Secure to Provide Secure Provisioning Solutions to NationalChip (Jun 19, 2018)
- Moortec will be exhibiting their In-Chip Monitoring Subsystem IP at DAC 2018 in San Francisco (Jun 19, 2018)
- CCIX Consortium Enables Next Generation Compute Architectures with the Availability of Base Specification 1.0 (Jun 19, 2018)
- Wave Computing Extends AI Lead by Targeting Edge of Cloud Through Acquisition of MIPS (Jun. 18, 2018)
- Dolphin Integration presents its know-how in EDA for safe Power Regulation Networks implementation at ENIAC's THINGS2DO E.U. project final review (Jun 18, 2018)
- Black Pepper Spices up the Arm Approved Design Partner Program (Jun 18, 2018)
- Artosyn License and Deploy CEVA-XM4 Intelligent Vision Platform for Embedded AI SoC (Jun. 18, 2018)
- Broadcom lays off 1,100; may lay off more (Jun 18, 2018)
- Synopsys Unveils Next-Generation ZeBu Server 4 (Jun. 18, 2018)
- Samsung is claimed $400 Million in Infringement of FinFet Patent (Jun. 17, 2018)
- 5G global unified standard officially released! (Jun. 15, 2018)
- RISC-V Day in Shanghai (Jun. 15, 2018)
- SMIC's 14nm FinFET process R&D is expected to be ready for volume production in 2019 (Jun. 15, 2018)
- PLDA Design Days will hold in Shanghai (Jun. 14, 2018)
- Creonic's Quality Management System Achieves ISO 9001:2015 Certification (Jun 14, 2018)
- SystemC Ecosystem gets boost with Accellera's new SystemC CCI 1.0 Standard (Jun 14, 2018)
- AI Startup Wave Computing To Buy MIPS (Jun 14, 2018)
- Synopsys Fusion Technology Enables Lower Power, Smaller Area, and Higher Performance on Samsung Foundry 7LPP Process with EUV (Jun. 14, 2018)
- Veea Acquires Virtuosys to Bolster Edge Computing Platform, Advancing IoT-Enabled Devices and Smart Applications (Jun. 14, 2018)
- Arm Ready to Sacrifice Profits for Long-Term IoT Growth (Jun. 14, 2018)
- Industrial Internet and Connected Vehicles Drive IoT Sales Through 20211 (Jun 14, 2018)
- Costs Dog PCIe Speed Gains (Jun 14, 2018)
- Synopsys IC Validator Certified by Samsung Foundry for 7nm Signoff Physical Verification (Jun. 14, 2018)
- EUV, 3nm, GAA unveiled for the first time, Samsung Foundry went into the Chinese market (Jun. 14, 2018)
- Shanghai Huali Microelectronics Corporation (HLMC) Announces Collaboration with Adesto and CNE around RRAM Technology for RFID, Stand Alone NVM and Microcontroller Applications (Jun 13, 2018)
- Chips&Media launches HEVC/H.264 combined codec IP (Single Core) optimized for UHD (4K, 60 FPS) (Jun. 13, 2018)
- Cambricon Licenses NetSpeed Fabric IP for Its Next-Gen Artificial Intelligence Products (Jun. 13, 2018)
- Xpeedic's IRIS Certified for EM Simulation in GLOBALFOUNDRIES 22FDX Process (Jun. 13, 2018)
- AI Semiconductor Company Syntiant Demonstrates Analog Neural Network for Always-on Battery-powered Devices, Closes A Round Funding Led by Intel Capital (Jun 13, 2018)
- National Instruments Adopts AccelerComm's 5G NR Polar IP (Jun. 13, 2018)
- Arm Expands IoT Connectivity and Device Management Capabilities with Stream Technologies Acquisition (Jun. 13, 2018)
- Faraday Exhibits AI FPGA-to-ASIC Solution and IoT SoC Platform at DAC 2018 (Jun 12, 2018)
- Huawei 10nm unicorn 710 will be launched in July. (Jun. 12, 2018)
- Intel is able to produce quantum silicon wafers now. (Jun. 12, 2018)
- Globalfoundries Cuts 5% of Workforce (Jun. 12, 2018)
- CAST Adds JPEG-LS Decoder to Lossless Image Compression IP Core Suite (Jun. 12, 2018)
- HunterSun Corporation Licenses AndesCore N1068A-S for Its HS6601 Single-Chip Bluetooth SoC Targeting Wireless Audio Applications (Jun. 12, 2018)
- Breker Verification Systems Unveils Next-Generation Trek5 with Fully Compliant Support for Accellera Portable Stimulus Standard (Jun 12, 2018)
- Semiconductor Equipment Record Spending Streak To Continue Through 2019 (Jun 12, 2018)
- Baum Launches New Version of Power Modeling, Analysis Solutions for Hardware Design (Jun 12, 2018)
- TSMC will invest 7nm LPE process mass production (Jun. 11, 2018)
- After Facebook was forced to abandon cooperation with Huawei, the United States will continue to pressure Google's investigations. (Jun. 11, 2018)
- U.S. Telecom Operator Verizon Appoints New CEO to Focus on 5G Networks (Jun. 11, 2018)
- Fraunhofer's xHE-AAC Audio Codec Software Extends Native AAC Support In Android P For Better Quality At Low Bitrates (Jun. 11, 2018)
- Mentor Veloce hardware emulation platform now available on Amazon Web Services (Jun 11, 2018)
- Scalable Multi-threaded, Multi-core, Multi-cluster IP core designed for safety critical systems in an autonomous age, raises the bar on Functional Safety (Jun. 11, 2018)
- MIPS I6500-F First High Performance 64 Bit Multi-Cluster CPU IP to Receive ISO 26262 and LEC 61508 Certification (Jun. 11, 2018)
- Low-end product fever faded, so did the wearable device market. (Jun. 10, 2018)
- Real Intent Awarded U.S. Patent for Methods and Systems for Correcting X-pessimism in Gate-level Simulation or Emulation (Jun 08, 2018)
- TSMC May 2018 Revenue Report (Jun 08, 2018)
- PowerVR Series2NX neural network accelerator cores set the standard for performance and cost-efficiency (Jun. 08, 2018)
- Wally Rhines: Deep Learning Will Drive Next Wave of Chip Growth (Jun. 08, 2018)
- UMC Reports Sales for May 2018 (Jun 08, 2018)
- Credo Demonstrates Robust 200G & 400G Connectivity Product Solutions at Computex 2018 (Jun. 08, 2018)
- ZTE crisis finished! The agreement includes fines, change of management team, and supervision for 10 years (Jun. 08, 2018)
- More than 50% of AI technology is still immature by 2022 (Jun. 08, 2018)
- On-device natural language processing is ready for prime time (Jun. 07, 2018)
- Arteris IP Announces CodaCache Standalone Last Level Cache (Jun. 07, 2018)
- Sonics Partners With Synkom To Incorporate NoC and EPU IP Into Its Leading Semiconductor Design Services For Japan Customers (Jun. 07, 2018)
- AI Comes to ASICs in Data Centers (Jun. 07, 2018)
- Intento Design Cooperates with STMicroelectronics to Accelerate Analog Design and Migration of FD-SOI Chips at Functional Level (Jun. 07, 2018)
- Arm Sells Stake in China JV as EU Warns of Unfair Practice (Jun 07, 2018)
- Globalfoundries to add another NVM to FDSOI (Jun 07, 2018)
- Faraday Monthly Consolidated Sales Report - May 2018 (Jun 07, 2018)
- Cortus Asserts Intellectual Property Claims Against Microsemi, a Wholly Owned Subsidiary of Microchip Technology Inc. (Nasdaq: MCHP) (Jun 07, 2018)
- Samsung bets on the foundry, automotive OLED and storage (Jun. 07, 2018)
- The "Android" of the auto-pilot car field -- Apollo. (Jun. 07, 2018)
- IEEE Announces Formation of Two New IEEE 802.11 Study Groups (Jun 06, 2018)
- Hailo Raises $12.5 Million Series A Round to Develop Deep Learning Processor for Embedded AI Applications (Jun. 06, 2018)
- Global Semiconductor Sales Increase 20 Percent Year-to-Year in April; Double-Digit Annual Growth Projected for 2018 (Jun 06, 2018)
- PLDA to Demonstrate Industry's First PCIe 4.0 Switch Platform with Multiple Downstream Ports during PCI-SIG DevCon 2018 (Jun. 06, 2018)
- Mobiveil and Avery Design Systems Partner to Provide SoC Designers a Fully Verified and Compliant PCIe 5.0 IP Solution (Jun. 06, 2018)
- TSMC Shareholders Approve NT$8 Cash Dividend and Elect Board of Directors; Board of Directors Elect Mark Liu as Chairman and C.C. Wei as CEO and Vice Chairman (Jun 06, 2018)
- GUC Monthly Sales Report - May 2018 (Jun 06, 2018)
- TSMC will do the 5-nanometer trial production in the first quarter of 2019 (Jun. 06, 2018)
- TSMC chairman Zhang Zhongmou retires today. He has planned 3nm process chip (Jun. 05, 2018)
- Australia may forbid Huawei's 5G equipment for reasons of national security (Jun. 05, 2018)
- Qualcomm Appeals to EU to Cancel $1.2 Billion Antitrust Penalty (Jun. 05, 2018)
- eSilicon revolutionizes machine learning ASIC platform (MLAP) market (Jun. 05, 2018)
- Sankalp Semiconductor to Exhibit at Design Automation Conference - 2018 (Jun 05, 2018)
- Synopsys Delivers AI-enhanced Digital Design Platform Bringing Artificial Intelligence to Design Implementation (Jun. 05, 2018)
- PLDA Announces Availability of XpressRICH5 PCIe 5.0 Controller IP (Jun. 04, 2018)
- Dolphin Integration makes available in free download its innovative IDE SmartVision, for the RISC-V ecosystem (Jun. 04, 2018)
- Automotive IC Market on Pace for Third Consecutive Record Growth Year (Jun 04, 2018)
- IP Cores, Inc. Announces Modifications of the 400 Gbps MACsec IP Cores (Jun. 04, 2018)
- Arm Targets Laptop Performance (Jun 04, 2018)
- Avery Design Systems Fast Tracks PCI Express 5.0 VIP (Jun 04, 2018)
- PathPartner to Showcase Innovations in Face Recognition and Automotive Vision at TU-Automotive, Detroit 2018 (Jun. 04, 2018)
- CEVA Introduces Deep Learning to IoT Edge Devices (Jun. 04, 2018)
- Worldwide Semiconductor Equipment Billings in First Quarter 2018 Reach Record $17.0 Billion, SEMI Reports (Jun 04, 2018)
- Irwin Jacobs on Qualcomm and Moore (Jun 04, 2018)
- Arm next year will present A76 with computer performance and mobile energy efficiency (Jun. 02, 2018)
- Cadence Full-Flow Digital and Signoff Tools and Verification Suite Provide Optimal Results for 7nm Arm Cortex-A76 CPU Designs (Jun. 01, 2018)
- Synopsys Enables Tapeout Success for Early Adopters of Arm's Latest Premium Mobile IP, Including Cortex-A76 and Mali-G76 Processors (Jun 01, 2018)
- Arm announces new suite of IP for premium mobile experiences (Jun. 01, 2018)
- GlobalFoundries adjusted 7-nanometer process to make it easier for AMD to adapte TSMC (Jun. 01, 2018)
- Synopsys' Latest ARC MetaWare EV Development Toolkit Release Speeds Application Software Development for Embedded Vision Systems (May. 31, 2018)
- intoPIX to showcase 8K and best-in-class AV-over-IP compression technologies at InfoComm 2018 (May. 31, 2018)
- USB-IF Publishes HID Standard for Braille Displays (May 31, 2018)
- TrendForce Reports Top 10 Semiconductor Foundries Worldwide for 1H18, TSMC Ranks First with an Estimated Market Share of 56.1% (May 31, 2018)
- A new generation of 5nm process chips unveiled, 24% smaller than previous product size (May. 31, 2018)
- Synopsys Design Platform Certified for Samsung 8LPP Process Technology (May. 31, 2018)
- The U.S. will continue to levy tax on China and limit investment (May. 30, 2018)
- Rambus Announces New Senior Vice President of Global Market Development (May 30, 2018)
- Toshiba Memory Corporation and Synopsys Collaborate to Accelerate 3D Flash Memory Verification (May 30, 2018)
- Technolution to engage in space-proof data processing by taking over Recore Systems' activities (May 30, 2018)
- Real Intent's New Verix SimFix Software Delivers First Intent-Driven Remedy for Verification Pessimism (May 30, 2018)
- Imec demonstrates compatibility of state-of-the-art 0.8V-transceiver, with industry standard Arm Cordio IP for BLE 5 (May 30, 2018)
- IP Cores, Inc. Announces Additional Shipments of its Reed-Solomon Codec for 400G Ethernet (May. 29, 2018)
- GLOBALFOUNDRIES Enters Volume Production of Ultra High Voltage Process Technology for Industrial and Power Applications (May. 29, 2018)
- Inuitive licenses Inside Secure's Root-of-Trust to Secure Mobile and XR Virtual Augmented Reality solutions (May. 29, 2018)
- Sino-US trade war has begun to influence Europe? (May. 29, 2018)
- Resurgence in 8051 Microcontroller Applications Drives New IP Cores Sales for CAST (May 29, 2018)
- Kandou Announces Availability of Glasswing USR SerDes IP (May. 28, 2018)
- Dolphin Integration announces the availability of its RISC-V subsystem: RV32 Tornado (May. 28, 2018)
- TSMC defeated Samsung and take Apple orders alone (May. 28, 2018)
- China may approve Qualcomm’s $44 billion acquisition (May. 28, 2018)
- Brite Semiconductor Joins SiFive's DesignShare Program (May. 25, 2018)
- Silex Inside HDMI over IP OEM solution is interoperable with AES67 and SMPTE 2110 standards (May. 25, 2018)
- Samsung Plans 3nm Gate-All-Around FETs in 2021 (May 24, 2018)
- Agnisys to Present Functional Safety, Machine Learning, IoT Solutions, and More at the Design Automation Conference in San Francisco (May 24, 2018)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2018 (May 24, 2018)
- North American Semiconductor Equipment Industry Posts April 2018 Billings (May 24, 2018)
- Chip Industry Maps Heterogeneous Integration (May 24, 2018)
- Intel to Spend $5 Billion on 10nm Fab in Israel (May 24, 2018)
- Andes Technology Corporation and XtremeEDA Corporation Cooperate to Develop Joint Design Wins on Emerging RISC-V Designs (May. 24, 2018)
- 5nm, 4nm, 3nm, Samsung foundry's "small goals" (May. 24, 2018)
- China's new semiconductor plants are booming. Demand for silicon wafers will increase by 35% in 2020 (May. 24, 2018)
- IP-Maker to launch new NVMe host IP Family For NVMe host acceleration in data center applications (May. 24, 2018)
- Arasan and Test Evolution announce Industry's first C-PHY / D-PHY Combo Compliance Analyzer with Arasan's Total MIPI IP Solution (May. 23, 2018)
- Can Mobileye Validate 'True Redundancy'? (May 23, 2018)
- HDL Design House and Mentor Workshop at Aviation Electronics Europe 2018 (May 23, 2018)
- GLOBALFOUNDRIES Announces Industry's Most Advanced Automotive-Qualified Production FD-SOI Process Technology (May 23, 2018)
- Chipus grows its battery charger IP family (May. 23, 2018)
- IP Cores, Inc. Announces Shipment of a 32-bit Version of its Ultra Low Power FFT IP Core (May. 23, 2018)
- Synopsys Design Platform Certified for Samsung 8LPP Process Technology (May. 23, 2018)
- Imagination appoints PowerVR veteran to lead business unit (May. 23, 2018)
- Samsung Set to Power the Future of High-Performance Computing and Connected Devices with Silicon Innovation (May 23, 2018)
- Cadence Full-Flow Digital and Signoff Tools Certified on Samsung's 8LPP Process Technology (May. 23, 2018)
- ST's New CEO Not Ruling Out Acquisitions in Quest for Growth (May 23, 2018)
- SmartDV Announces OpenCAPI Verification IP (VIP) (May. 23, 2018)
- GLOBALFOUNDRIES Announces Industry's Most Advanced Automotive-Qualified Production FD-SOI Process Technology (May. 23, 2018)
- 7nm processor production will start soon, Samsung EUV lithography performance is better than TSMC? (May. 23, 2018)
- Semi Capex Forecast to Exceed $100B for the First Time in 2018 (May 22, 2018)
- TSMC 7nm wafers will begin shipping in volume from June (May. 22, 2018)
- SMIC pays US$120 million for placing orders for the most advanced EUV lithography machine, however, SMIC has to solve these problems next. (May. 22, 2018)
- U.S. will cancel the ban on ZTE Sales (May. 22, 2018)
- Samsung overtakes Intel's 23% with memory business sales! (May. 22, 2018)
- Arm Gives Glimpse of AI Core (May 22, 2018)
- Brite Semiconductor Joins SiFive's DesignShare Program (May 22, 2018)
- Open-Silicon Achieves ISO 9001:2015 Certification (May 22, 2018)
- Dolphin Integration introduces new Dual Port memory compilers in TSMC 40 nm (May. 21, 2018)
- Microsemi Deal May Spur Broader ReRAM Adoption (May 21, 2018)
- Rambus takes aim at ARM in IoT security (May. 21, 2018)
- Ultra-Low Power Lattice sensAI Leads Mass Market Enablement of Artificial Intelligence in Edge Devices (May. 21, 2018)
- Huali 12-inch plant purchased the mainland's most advanced ASML lithography machine (May. 21, 2018)
- RISC-V is supported by many semiconductor giants, how far away from large-scale applications (May. 21, 2018)
- Startup Maps AI into Flash Array (May 17, 2018)
- Crossbar Announces Licensing Relationship Agreement With Microsemi (May 17, 2018)
- CTAccel Joins Accelize Ecosystem to Make FPGA-Based Image Transcoding Acceleration Available on AccelStore (May 17, 2018)
- Synopsys Introduces Industry's First ASIL D Ready Embedded Vision Processor IP for ADAS Applications and Self-Driving Vehicles (May. 17, 2018)
- SiFive Inc. and Andes Technology Corporation Join Forces to Promote RISC-V (May. 17, 2018)
- Arm Drives Smart Utilities for KEPCO's Behind the Meter Project (May. 17, 2018)
- Stars of IP Party Returns to San Francisco (May 17, 2018)
- T2M and Mindtree to showcase cutting-edge BQB-qualified Mesh SW and Bluetooth 5 IP at Bluetooth Asia, Shenzhen (May. 16, 2018)
- VESA Publishes Display Compression Standard for Mobile Applications (May. 16, 2018)
- MIPI Alliance and VESA Enable Next Generation of High-Performance Displays for Mobile, AR/VR, Automotive, Other Applications (May. 16, 2018)
- New VDC-M (VESA Display Compression-M) IP Cores Launched By Hardent (May. 16, 2018)
- Thirteen Top-15 1Q18 Semi Suppliers Register Double-Digit Gains (May 16, 2018)
- Dolphin Integration joins the RISC-V Foundation (May. 15, 2018)
- Express Logic's X-Ware IoT Platform Brings Industrial-Grade IoT Device Connectivity to the AndesCore N25 and NX25 RISC-V Processors (May. 15, 2018)
- Concentrating Intelligence to Realize Autonomous Driving (May 15, 2018)
- True Circuits Provides Low Power PLL Technology to SiFlower in China (May. 15, 2018)
- Chipus concludes important milestone in the development of analog IP in SilTerra I18L technology (May. 15, 2018)
- Arasan Announces Industries First MIPI I3C Master IP Core compliant to the I3C HCI Specifications v1.0 (May. 15, 2018)
- IntelliProp Announces NVMe-to-SATA Bridge IP Core (May. 15, 2018)
- MIPI Alliance Introduces Set of Touch Specifications to Standardize Touch Integration in Mobile Designs (May. 15, 2018)
- Socionext Develops AI Accelerator Engine Optimized for Edge Computing (May. 15, 2018)
- MagnaChip and YMC to Offer Cost Effective 0.13 micron Multiple-Time Programmable (MTP) IP Solutions (May. 15, 2018)
- GF Seeks Fab, ASIC Partners (May. 15, 2018)
- Flex Logix Awarded Interconnect Patent for Connecting Any Kind of RAM between eFPGA Cores. (May. 15, 2018)
- Andes Technology Corporation Records a Cumulative 2.5 Billion SoC Shipments Containing Its CPU IP Since Inception (May 15, 2018)
- NetSpeed Furthers Leadership in Industrial, Factory Automation and Safety-critical Flight Systems with IEC 61508 Certification (May 15, 2018)
- Flex Logix Co-Founders Awarded Interconnect Patent For Connecting Any Kind Of RAM Between eFPGA Cores To Create Application-Optimized eFPGA Arrays (May 15, 2018)
- Presto Engineering Joins GLOBALFOUNDRIES Ecosystem as ASIC Partner (May. 15, 2018)
- Achronix to Demonstrate Versatility of Speedcore eFPGA Devices Next Week at SEE/MAPLD and Embedded Vision Summit (May. 15, 2018)
- Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation (May. 15, 2018)
- TSMC Technologies for IoT and Automotive (May. 15, 2018)
- Crossbar ReRAM Enabling AI at the Edge (May. 14, 2018)
- SMIC to start 14nm risk production in H1 2019 (May. 14, 2018)
- Synopsys IC Validator Certified by GLOBALFOUNDRIES for Signoff Physical Verification (May. 14, 2018)
- Qualcomm reported to be dumping Arm-based server chips (May 14, 2018)
- First Quarter 2018 Silicon Wafer Shipments Increase Quarter-Over-Quarter to Record Level (May 14, 2018)
- Trump Tweets Announces change of ZTE sanction (May. 14, 2018)
- What is the next step for ZTE? (May. 14, 2018)
- TSMC's April Revenue of 81.87 billion yuan fell 21% month-on-month and faced four major risks in the following months (May. 11, 2018)
- SMIC14nm process is expected to be produced in the first half of 2019 (May. 10, 2018)
- Silicon wafers is short of supply, and prices continue to rise (May. 10, 2018)
- Sankalp Semiconductor Strengthens Management Team (May. 10, 2018)
- Synopsys Provides DesignWare Base IP for TSMC 22nm ULP/ULL Process (May. 10, 2018)
- Synopsys Design Platform Receives TSMC Process Certification, Supports High-Performance 7nm+ Process Technology (May. 10, 2018)
- New Arm IP Protects IoT Devices from Increasingly Popular Physical Threats (May. 10, 2018)
- NetSpeed and Northwest Logic Partner to Boost Performance in Hyperscale and Automotive SoCs (May. 09, 2018)
- Silvaco Joins Arm Approved Design Partner Program (May. 09, 2018)
- SiFive Announces Investment from Intel Capital (May 09, 2018)
- Antmicro reveals partnership with Thales on the disruptive RISC-V open ISA (May. 09, 2018)
- Movellus Closes Funding from Intel Capital for Digital Tool Expansion Technology (May 09, 2018)
- Flexera Provides Seamless Monetization Support for Arm Ecosystem (May 09, 2018)
- Gfast Leader Sckipio Raises $50M to Date with New $10M Funding (May 09, 2018)
- China Domestic 8-inch semiconductor-grade monocrystalline silicon wafers will achieve trial production (May. 09, 2018)
- Intel Capital: $72 million invested in 12 innovative companies, including 3 Chinese companies (May. 09, 2018)
- Arm Releases Artisan Physical IP for TSMC 22nm ULP/ULL Platform (May. 09, 2018)
- Synopsys Announces Availability of Industry's Most Comprehensive ISO 26262 Certified EDA Design Platform (May. 09, 2018)
- Comcores Announce Availability of flexible eCPRI IP solution (May 08, 2018)
- Silex Inside upgrades IP offering for compatibility with Chinese security standards (May. 08, 2018)
- Advance 5nm, TSMC's Latest Technology Blueprint (May. 08, 2018)
- TSMC Releases Stacked Wafer Technology, Both Nvidia and AMD Will Benefit (May. 08, 2018)
- ZTE will postpone the general meeting of shareholders, the date is expected to be set (May. 08, 2018)
- GUC Monthly Sales Report - Apr 2018 (May 07, 2018)
- UltraSoC analytics IP selected by Esperanto Technologies for RISC-V many-core parallel processing in AI and ML applications (May. 07, 2018)
- Faraday Monthly Consolidated Sales Report - April 2018 (May 07, 2018)
- StreamDSP Announces Availability of VITA 17.3 sFPDP Gen 3 IP Core (May. 07, 2018)
- Chips&Media Unveils its first Computer Vision IP (May. 07, 2018)
- QuickLogic Launches Comprehensive QuickAI Platform for Endpoint AI Applications (May. 07, 2018)
- Cadence Innovus Implementation System Speeds Development of New Realtek DTV SoC Solution (May. 07, 2018)
- NovaSparks Introduces Pure FPGA Optmized Market Data Distribution For Microwaves Networks (May 07, 2018)
- Rambus, GigaDevice, THG Ventures Form Reliance Memory to Develop RRAM (May 07, 2018)
- Microsemi and SiFive Launch HiFive Unleashed Expansion Board, Enabling Linux Software and Firmware Developers to Build RISC-V PCs for the First Time (May. 07, 2018)
- True Circuits Signs Multi-year PLL License with Canaan Creative in China (May 07, 2018)
- OpenMedReady framework will promote data provenance, security, privacy and consent in remote patient monitoring (May 07, 2018)
- eWBM selects Dolphin Integration's Single port SRAM and thick oxide standard cell library at GF 55 LPx (May. 07, 2018)
- NetSpeed and Esperanto Partner to Power SoCs for Artificial Intelligence (May. 07, 2018)
- Texas Instruments Expands Lead Among Top Analog Suppliers in 2017 (May 07, 2018)
- Cambricon Selects Synopsys HAPS for Next-Generation Artificial Intelligence Processor Product (May. 07, 2018)
- ZTE applied for a suspension of the punishment order, the crisis may be resolved! (May. 07, 2018)
- New Arm IP Helps Protect IoT Devices from Increasingly Prevalent Physical Threats (May 04, 2018)
- Xylon Appoints Sam Kasgorgis New VP of Sales and Marketing for North America (May 04, 2018)
- Cadence Shortens Automotive Verification Closure with New Verification IP for UFS 3.0, CoaxPress, and HyperRAM (May. 04, 2018)
- TSMC 7nm Process Mass Production: 65% Reduction in Power Consumption and soon 20% Lower Power Consumption in 5nm (May. 04, 2018)
- AI Gets New Benchmark (May. 03, 2018)
- IC Insights Releases 2017 Top Ten Analog IC Manufacturers Worldwide (May. 03, 2018)
- DFI Group Releases Initial Version of the DFI 5.0 Specification for High-Speed Memory Controller and PHY Interface (May. 03, 2018)
- Aldec and Tamba Networks Release Ultra Low Latency Ethernet Solution for UltraScale+ FPGA at The Trading Show 2018 (May. 03, 2018)
- Algo-Logic Systems Introduces Ultra-low-latency Tick-to-Trade System with Multi-leg Turbo Spreader (May 03, 2018)
- Samsung Foundry Announces Customization Services for SMEs (May. 03, 2018)
- T2M attends Bluetooth Asia (May. 03, 2018)
- Cadence Prototypes First IP Interface in Silicon for Preliminary Version of DDR5 Standard Being Developed in JEDEC (May 02, 2018)
- Sondrel and NetSpeed Team Up to Deliver the Fastest, Lowest-risk Route to SoC Solutions (May. 02, 2018)
- Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation (May. 02, 2018)
- New MIPS I7200 Processor Core Delivers Unmatched Performance and Efficiency For Advanced LTE/5G Communications And Networking IC Designs (May 02, 2018)
- Credo Demonstrates 112G PAM4 and 56G PAM4 SerDes IP Solutions at TSMC 2018 Technology Symposium (May 02, 2018)
- Arteris FlexNoC Licensed by Canaan Creative for Artificial Intelligence ASICs (May. 02, 2018)
- Imperas and Andes Extend Partnership, Delivering Models and Virtual Platforms for Andes RISC-V Cores with New AndeStar V5m Extensions (May. 02, 2018)
- Globalfoundries Announced 36 design orders for its 22 nm fully depleted Insulated Silicon Over Insulation (FD-SOI) process technology (May. 02, 2018)
- Huawei is Under Investigation: "National Machines" and Independent Enterprises (May. 02, 2018)
- Arm China's joint venture (May. 02, 2018)
- Arm Physical IP to Accelerate Mainstream Mobile and IoT SoC Designs on TSMC 22nm ULP/ULL Platform (May. 02, 2018)
- Samsung Electronics Partners with Avnet ASIC Israel to Strengthen Customer Support at the Forefront of ASIC Design Services (May 02, 2018)
- New MIPI I3C Host Controller Interface Speeds Sensor Integration (May 02, 2018)
- TSMC achieved its 16nm mass-production in Nanjing , with Bitland as the first customer (May. 02, 2018)
- eSilicon deep learning ASIC in production qualification (May. 01, 2018)
- Cadence Supports New TSMC WoW Advanced Packaging Technology (May. 01, 2018)
- Synopsys Digital and Custom Design Platform Certified for TSMC's Most Advanced 5-nm Process Technology for Early Design Starts (Apr. 30, 2018)
- TSMC Certifies Synopsys Design Platform for High-performance 7-nm FinFET Plus Technology (Apr. 30, 2018)
- Spin Transfer Technologies Announces Breakthrough MRAM Technology for SRAM and DRAM Applications (Apr 30, 2018)
- PLDA Announces XpressCCIX Controller IP Supporting The Cache Coherent Interface For Accelerators (CCIX) Standard (Apr. 30, 2018)
- SST and UMC Announce Qualification of Embedded SuperFlash Technology on 40 nm CMOS Process (Apr. 30, 2018)
- UltraSoC selected by Andes for RISC-V development with trace and debug (Apr. 30, 2018)
- Synopsys and TSMC Collaborate to Deliver DesignWare Foundation IP for Ultra-Low Power TSMC 22-nm Processes (Apr. 30, 2018)
- GlobalSign's Cloud-based, Highly Scalable PKI Solution integrated with Arm Mbed Cloud (Apr 27, 2018)
- eMemory introduces more security features to its eNVM IP for TSMC 7nm Process (Apr. 27, 2018)
- Samsung, GF Ramp FD-SOI (Apr 27, 2018)
- Intel Delays 10nm Volume Production Until 2019 (Apr 27, 2018)
- Arbe Robotics Selects GLOBALFOUNDRIES for its High-Resolution Imaging Radar to Enable Safety for Autonomous Cars (Apr. 27, 2018)
- Achronix's Speedcore eFPGA Devices to be Highlighted at TSMC 2018 North America, China Technology Events in May (Apr. 27, 2018)
- SEMI Reports 2017 Global Semiconductor Materials Sales of $46.9 Billion (Apr 26, 2018)
- Cyient Acquires Semiconductor Firm AnSem N.V. (Apr 26, 2018)
- Mobile Semiconductor's 22nm ULL Memory compiler Joins the GLOBALFOUNDRIES FDXcelerator Partner program (Apr. 26, 2018)
- New MIPI SyS-T Consolidates and Streamlines Embedded Software Debugging in Mobile (Apr. 26, 2018)
- The U.S. investigates Huawei, Huawei claims that "there is no evidence and the impact is not a big deal." (Apr. 26, 2018)
- Beijing's First 8-Inch Integrated Circuit Production Line, Target Monthly Capacity 50,000 Pieces (Apr. 26, 2018)
- Silicon Creations Showcases Latest IP Portfolio at TSMC Technology Symposium (Apr 26, 2018)
- Achronix's Increased Revenue, Expanding Workforce Drives Move to Larger Corporate Headquarters (Apr 26, 2018)
- Xilinx Reports Record Annual And Quarterly Revenues (Apr 26, 2018)
- Innovium Closes $77M in Series D Funding to Drive Commercial Volume Ramps and Innovative Product Roadmaps (Apr 26, 2018)
- Sankalp Semiconductor to Participate in Panel Discussion at "The Annual SOI Silicon Valley Symposium" (Apr 26, 2018)
- M31 Technology Deploys the Full Range of IP for TSMC 22nm ULP/ULL Process (Apr. 25, 2018)
- Synopsys and Arm will continue to deepen cooperation in IP, EDA tools, etc. (Apr. 25, 2018)
- Achronix Application of eFPGA in Embedded 360-degree Vision System (Apr. 25, 2018)
- Partner in Imagination's owner convicted of insider trading (Apr 25, 2018)
- North American Semiconductor Equipment Industry Posts March 2018 Billings (Apr 25, 2018)
- TSMC Continues to Dominate the Worldwide Foundry Market (Apr 25, 2018)
- ZTE is Punished: Dispute behind China's "Core" (Apr. 24, 2018)
- China "Red semiconductor" is coming (Apr. 24, 2018)
- Chipus expands its battery charger IP family (Apr. 24, 2018)
- Accelerators Unite ARM, IBM, X86 (Apr 24, 2018)
- eMCOS AUTOSAR, an AUTOSAR-Compliant Scalable RTOS, Receives ISO 26262 Functional Safety Standard Certification at Highest ASIL D Safety Integrity Level (Apr 24, 2018)
- Cadence Reports First Quarter 2018 Financial Results (Apr 24, 2018)
- InFO Packaging Technology Enables TSMC to win Three Generation Apple Orders (Apr. 23, 2018)
- Gartner Says Worldwide Semiconductor Revenue Grew 21.6 Percent in 2017 as Samsung Takes Over No. 1 Position (Apr 23, 2018)
- Xylon Launches Three New FMC Expansion Boards Featuring High-Speed Serial Links for FPGA Based Multi-Camera Automotive Application Development (Apr. 23, 2018)
- Exostiv Labs now supports Intel Stratix 10 FPGA (Apr. 23, 2018)
- Dongwoon Anatech Licenses Codasip's Bk3 RISC-V Processor for Motor Control ICs for Mobile Camera (Apr. 23, 2018)
- Facebook to design own processors (Apr 23, 2018)
- Algodone Signs a Strategic Partnership with Accelize (Apr 23, 2018)
- Alibaba Adds Embedded CPU Core Designer (Apr 23, 2018)
- Arm Mbed Simplifies IoT Security, Development and Device Management (Apr. 23, 2018)
- Algodone, a Silicon Activation Licensing Technology Provider to the Semiconductor Industry, Expands Executive Team (Apr 23, 2018)
- PLDA Announces New Test And Validation Platforms For PCIe (Apr. 23, 2018)
- Solarflare and NovaSparks Launch Pure-FPGA Tick-To-Trade Development Platform That Slashes Man-Years of Effort (Apr. 23, 2018)
- Fujitsu choose INNOSILICON as cooperative partner (Apr 23, 2018)
- GlobalFoundries choose INNOSILICON as cooperative partner (Apr 23, 2018)
- TSMC's 7nm revenue for the fourth quarter can account for 70% (Apr. 23, 2018)
- Abandon the U.S. market? Huawei Responds to (Apr. 23, 2018)
- It said tht Apple's Order Q2 to Decrease by 50% so that TSMC's Stock Market Tumbled Yesterday (Apr. 21, 2018)
- TSMC engineers was sued for stealing 28 nanometers to Mainland China (Apr. 20, 2018)
- Chinese Alibaba Adds Embedded CPU Core Designer (Apr. 20, 2018)
- Synopsys Accelerated the Development of Renesas Electronics' R-Car V3H SoC, Enabled Cutting-Edge Computer Vision Technology (Apr. 20, 2018)
- STMicroelectronics Showcases Latest Intelligent Industrial Solutions at TECHNO-FRONTIER 2018 (Apr. 20, 2018)
- Qualcomm Begins Layoffs (Apr 19, 2018)
- Microsemi Collaborates with MathWorks to Deliver First Integrated FPGA-in-the-Loop Workflow for PolarFire and SmartFusion2 FPGA Development Boards (Apr. 19, 2018)
- TSMC Reports First Quarter EPS of NT$3.46 (Apr 19, 2018)
- Intel Chip Performs 10 Trillion Calculations per Second (Apr 19, 2018)
- IEEE Publishes Standard Revision for SystemVerilog - Unified Hardware Design, Specification and Verification Language (Apr 19, 2018)
- T2M announces availability of Bluetooth SIG qualified v5 Bluetooth Low Energy Controller, Stack and Profiles IP from Mindtree (Apr. 19, 2018)
- Can the RISC-V architecture allow Chinese domestic ICs to (Apr. 19, 2018)
- The punishment from United States on ZTE will influence both sides? These US companies are also affected. (Apr. 19, 2018)
- Microsemi's Mi-V Ecosystem Continues to Expand as New Member Antmicro Joins to Develop Mi-V RISC-V Processor Subsystems for PolarFire FPGAs (Apr 18, 2018)
- Titan IC has licensed its RegEx Processor to Silicom Ltd for advanced FPGA SmartNIC platforms (Apr 18, 2018)
- Titan IC delivers innovative technology for Deep Packet Processing Module in IRD-100 for Strategic Partner Looking Glass (Apr. 18, 2018)
- Macnica's ST2110 IP Core Successfully Adopted by Sencore for its New SDI over IP Converter (Apr. 18, 2018)
- China ZTE is punished for violation of US sanctions regulations (Apr. 17, 2018)
- Trade war escalated, China postpones the approval of mergers and acquisitions such as Qualcomm and Toshiba (Apr. 17, 2018)
- Inside Secure's Root of Trust Engine Secures eWBM's System-on-Chip for IoT Market (Apr. 17, 2018)
- New Flexible SoC Solution from Arm to Enable Rapid Development of Secure IoT Devices (Apr. 17, 2018)
- Synopsys Extends HAPS Prototyping Family with New Desktop Prototyping Solution (Apr 17, 2018)
- IoT Security Milestone for Intrinsic ID Authentication: More Than 100 Million Devices Protected (Apr 17, 2018)
- Arm Backs New Cybersecurity Tech Accord to Protect Consumers and Businesses (Apr 17, 2018)
- Rambus Launches CryptoManager RISC-V Root of Trust Programmable Secure Processing Core (Apr. 16, 2018)
- Arm Denies joining hands with Paul Jacobs to privatize Qualcomm’s mergers and acquisitions (Apr. 16, 2018)
- Synopsys and Arm Extend Collaboration to Improve Power, Performance, and Time to Results for Arm's Latest IP and Synopsys Tools (Apr. 16, 2018)
- Hu Zhengming, inventor of FinFET: Even if Moore's Law ends, semiconductor is still a promising industry (Apr. 16, 2018)
- GLOBALFOUNDRIES and Toppan Photomasks Extend Advanced Photomask Joint Venture in Germany (Apr. 16, 2018)
- No NN-dedicated hardware on Qualcomm IoT processors (Apr 16, 2018)
- EnSilica becomes Arm Approved Design Partner (Apr. 16, 2018)
- Arm Denies joining hands with Paul Jacobs to privatize Qualcomm’s mergers and acquisitions (Apr. 16, 2018)
- QuickLogic Announces Webcast with AI Ecosystem Partners (Apr. 16, 2018)
- Mining chip demand determines TSMC's second quarter trend (Apr. 15, 2018)
- MediaTek engineer brings technology to Qualcomm and he is sentenced (Apr. 13, 2018)
- CEVA: Can machine learning solve the challenges of complex 5G baseband technology? (Apr. 13, 2018)
- Dover Microsystems Brings Secure Silicon IP to DesignShare (Apr 12, 2018)
- Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout (Apr 12, 2018)
- Lip-Bu Tan on AI, China & Moore (Apr. 12, 2018)
- China's Unigroup plans to spend $60 billion, says report (Apr 12, 2018)
- Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout (Apr. 12, 2018)
- DapTechnology Releases 1394/AS5643 IP for Microsemi IGLOO2 and SmartFusion2 FPGA Devices (Apr 12, 2018)
- Spectral Edge, the image fusion technology specialists, secures $5.3 million in further funding from existing investors Parkwalk Advisors and IQ Capital (Apr 12, 2018)
- Cadence: Last Holdout for Vision + AI Programmability (Apr 12, 2018)
- Cadence Boosts Vision and AI Performance with New Tensilica Vision Q6 DSP IP (Apr. 12, 2018)
- Faraday Leads ASIC Industry with Supporting Major Projector Technologies (Apr 12, 2018)
- TSMC and Samsung actively adopt EUV! (Apr. 11, 2018)
- Adoption of Intel FPGAs for Acceleration of Enterprise Workloads Goes Mainstream (Apr 11, 2018)
- The 7-nanometer war between TSMC and Samsung formally enters the heating phase (Apr. 11, 2018)
- Semiconductor Leaders' Marketshares Surge Over the Past 10 Years (Apr 11, 2018)
- JPEG XS - Image coding for video over IP transmission in production quality (Apr. 11, 2018)
- CEVA-XM6 Computer Vision and Deep Learning Platform Honored by Vision Systems Design 2018 Innovators Awards Program (Apr. 11, 2018)
- Chip Designers Bank on AI, Bitcoin (Apr 11, 2018)
- Aldec's HES UltraScale+ Reconfigurable Accelerator and Northwest Logic's PCI Express Cores Provide Proven PCI Express Solution (Apr. 11, 2018)
- Arm Under Attack in AI (Apr. 10, 2018)
- A picture to understand the BAT's Big Three in the AI field of China (Apr. 10, 2018)
- Synopsys Webinar: Solving Functional Security Problems in SoCs with Test Solutions (Apr. 10, 2018)
- UMC Reports Sales for March 2018 (Apr 10, 2018)
- Partnering with Accelize, Nagase provides a Content-Oriented Find and Replace Accelerator Function on AccelStore for Cloud-based Data Analytics Acceleration (Apr 10, 2018)
- Accelize Launches AccelStore: A Platform-Independent Marketplace that Brings FPGA-based Workload Acceleration to all Cloud Users (Apr 10, 2018)
- CAST and Achronix Enable Processing from Data Center to the Edge with Lossless Compression IP (Apr 10, 2018)
- Faraday Monthly Consolidated Sales Report - March 2018 (Apr 10, 2018)
- Ittiam Licenses its i265 HEVC Codec to Microsoft Azure to Offer High Quality Video Encoding and Decoding Services (Apr 10, 2018)
- TSMC March 2018 Revenue Report (Apr 10, 2018)
- Samsung early with 7nm process, says report. (Apr 09, 2018)
- GUC Monthly Sales Report - Mar 2018 (Apr 09, 2018)
- MediaTek Announces World's First Complete 56G PAM4 SerDes, Silicon-Proven on 7nm for ASIC services (Apr. 09, 2018)
- Design Services Need Uber-izing (Apr 09, 2018)
- intoPIX demonstrates TICO implemented SMPTE 2110 IP running 4K live on FPGA CPU and GPU (Apr. 09, 2018)
- CAST and Accelize Make GZIP Compression Instantly Available via Cloud-Based FPGA Accelerators (Apr. 09, 2018)
- Codasip Welcomes Jerry Ardizzone to Executive Team as Vice President of Worldwide Sales (Apr 09, 2018)
- Flex Logix Validates EFLX 4K eFPGA IP Core on TSMC16FFC; Evaluation Boards Available Now (Apr. 09, 2018)
- intoPIX to unveil newest JPEG-XS compression tech at NAB Show 2018 in Las Vegas - A World First (Apr. 09, 2018)
- PathPartner Technology unveils FPGA based HEVC & HEIF 4K Decoder on Amazon AWS EC2 Cloud (Apr. 09, 2018)
- Dolphin Integration augments the TSMC IP Ecosystem at 40 nm ULP eFlash with new TITAN Read Only Memory (Apr. 09, 2018)
- Huawei Kirin 980 became the first batch of TSMC 7nm SoC, mass production this quarter! (Apr. 09, 2018)
- Economist: TSMC wins Intel as the world’s most advanced chipmaker (Apr. 09, 2018)
- Broadcom Announces that the headquarter already has Moved back to United States (Apr. 09, 2018)
- 14nm process determines the future of SMIC? (Apr. 08, 2018)
- TSMC relies on the mainland to get rid of dependence on Apple? (Apr. 08, 2018)
- Samsung's first-quarter profit hits new highs, and memory chip has become the biggest player (Apr. 08, 2018)
- The world's first EUV lithography! Samsung 7nm completed half a year in advance (Apr. 07, 2018)
- Achronix cooperates with AccelerComm in eFPGA to Accelerate 5G Product Design Timeline (Apr. 07, 2018)
- Brite Semiconductor was awarded 2018 China Outstanding Technical Support IC Design Company (Apr. 07, 2018)
- Arastu Systems evolving in the Industry with a strategic roadmap (Apr 06, 2018)
- Silvaco IP Revs Up Silicon Catalyst's Semiconductor Startup Ecosystem (Apr. 05, 2018)
- SEMI Reports 2017 Global Semiconductor Equipment Sales of $56.6 Billion (Apr 05, 2018)
- Nantero Expands NRAM Product Development, Signs New Customers (Apr 05, 2018)
- The Low Profile PCIe Board XpressGXA10-LP 1150 and 1151 Versions Are Providing HPC, Finance and Networking Markets a Cost-Effective, Low-Latency Solution (Apr. 05, 2018)
- China startup releases AI processors then raises $100 million (Apr 05, 2018)
- Fraunhofer IIS Audio System Selected for Chinese 3D Audio Standard for UHD TV (Apr. 05, 2018)
- HEVC Advance Highlights Momentum with Newest Licensors and Licensees (Apr 05, 2018)
- China shows it takes Imagination opportunity seriously (Apr 05, 2018)
- NVMEngines to Exhibit and Present at IP SOC 2018; Company to Be Renamed Numem (Apr 05, 2018)
- Apple invited Google's AI Leader (Apr. 05, 2018)
- ESD Alliance Reports EDA Industry Revenue Increase For Q4 2017 (Apr 04, 2018)
- Neotion partners with Texplained creating stronger Secure by Design ICs (Apr. 04, 2018)
- Tortuga Logic to Develop Novel Hardware Security Solutions with Support from DARPA Program (Apr 04, 2018)
- Exclusive 7nm process enables TSMC's second quarter results achieve large growth (Apr. 04, 2018)
- China shows it takes Imagination opportunity seriously (Apr. 04, 2018)
- TSMC develops InFO's Packaging and Testing Business, and Post-Capacity Testing Capacity (Apr. 03, 2018)
- IP-Maker to launch new NVMe host IP Family (Apr. 03, 2018)
- Global Semiconductor Sales Up 21 Percent Year-to-Year in February (Apr 03, 2018)
- Imagination Technologies Group Ltd. Announces CEO Succession (Apr 03, 2018)
- SiFive Secures $50.6 Million Funding to Advance RISC-V Based Semiconductors (Apr. 02, 2018)
- Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC Santa Clara 2018 (Apr. 02, 2018)
- Excluded from M&A, China Focuses on Expansion (Apr 02, 2018)
- eMemory, Europractice IC Service form eNVM IP partnership (Apr. 02, 2018)
- Seven-nanometer enhanced version, TSMC is catching up (Apr. 02, 2018)
- Heavy! China imposes tariffs on 128 U.S. imports (Apr. 02, 2018)
- Silex Inside releases a high throughput, scalable and performant MACsec engine (Mar. 30, 2018)
- Mobile Semiconductor Introduces 40nm ULP Memory Compiler Support (Mar 30, 2018)
- SMIC Announces 2017 Annual Results (Mar 30, 2018)
- What will be the next step in the Internet of Things? (Mar. 30, 2018)
- Huawei's 2017 Annual Report: Three Business Lines Expanded, with a Net Profit of 47.5 billion Yuan (Mar. 30, 2018)
- CoreHW partners with GLOBALFOUNDRIES in RF Ecosystem Program (Mar. 29, 2018)
- Cryptocurrency mining demand sucking up TSMC IC production (Mar. 29, 2018)
- EU Project Delivers Open-Source Simulator for Cyber-Physical Systems (Mar 29, 2018)
- SMIC encounters opponents: Xiamen Lianxin trial production 28 nm HKMG process yield 98% (Mar. 29, 2018)
- Samsung fan-out packaging plant purchases equipment for the apple`s order next year (Mar. 29, 2018)
- The Alliance for Open Media Kickstarts Video Innovation Era with "AV1" Release (Mar 28, 2018)
- Mindtree announces BQB qualification of its Bluetooth Mesh v1.0 Software Stack and EtherMind Bluetooth v5.0 Software Stack & Profiles (Mar. 28, 2018)
- NVIDIA and Arm Partner to Bring Deep Learning to Billions of IoT Devices (Mar. 28, 2018)
- TSMC takes Renesas orders alone (Mar. 28, 2018)
- TSMC Leads Four Platforms: Smart phone, HPC, Automotive and IoT (Mar. 28, 2018)
- Mainland China will be the main driver in Global fab equipment spending (Mar. 28, 2018)
- Innosilicon Announces the World's Most Powerful Dash Miner, 65GH/s, 1500W (Mar. 27, 2018)
- Chips&Media was reportedly signed a contract to supply ISP IP package for IP cameras intended for surveillance market (Mar. 27, 2018)
- NEOTION and Invia join expertise in hardware-based security (Mar. 27, 2018)
- How can a self-driving car be stupid enough to hit someone? (Mar. 27, 2018)
- CEVA: Embedded neural network gives machine vision, hearing and analysis capabilities (Mar. 27, 2018)
- China Unicom will close the 2G network completely next year (Mar. 27, 2018)
- FCC Proposal Bans U.S. Operational Commercial Federal Funds to Purchase Huawei ZTE Equipment (Mar. 27, 2018)
- Arteris FlexNoC Interconnect IP Powers DJI Drones (Mar 27, 2018)
- Pentek Announces Kintex UltraScale Co-processor Jade XMC for Signal Processing Applications (Mar 26, 2018)
- Secure Provisioning Solutions from Inside Secure Now Protecting Pay TV Services at Kiwisat (Mar. 26, 2018)
- Omnitek adds AV over IP and video warp Chipsets (Mar. 26, 2018)
- eVaderis collaborates with Mentor on accelerating eMRAM IPs and Compilers development (Mar. 26, 2018)
- Intrinsic ID Awarded EU Grant under Horizon 2020/SME Instrument Phase 2 Program for INSTET Project (Mar. 26, 2018)
- Palma Ceia SemiDesign Establishes China Subsidiary for Development and Support (Mar 26, 2018)
- EnSilica builds sales network to extend its design and supply services for the automotive sector (Mar. 26, 2018)
- China's Fabless rises globally (Mar. 26, 2018)
- 5G war: Why do American politicians try hard to stop Huawei from entering the United States? (Mar. 25, 2018)
- Qualcomm's existing 10 directors re-elected shareholders propose corporate strategy (Mar. 25, 2018)
- Samsung executives: Chip industry barrier is too high for Chinese opponents to surpass easily (Mar. 25, 2018)
- SIA Statement on Trump Administration Section 301 Action on China (Mar 23, 2018)
- U.S. Companies Maintain Largest Share of Fabless Company IC Sales (Mar 23, 2018)
- IPC Urges Trump Administration to Take Measured Approach in Levying Higher Tariffs on Electronics from China (Mar 23, 2018)
- Path to 2nm May Not Be Worth It (Mar 23, 2018)
- North American Semiconductor Equipment Industry Posts February 2018 Billings (Mar 23, 2018)
- EDA Chief Calls AI the New Driver (Mar. 23, 2018)
- Intel wants to return to the first place, needs to expand the foundry, strengthen DRAM advantage (Mar. 23, 2018)
- Synopsys Acquires Silicon and Beyond Private Limited to Expand High-Speed SerDes IP Portfolio (Mar 22, 2018)
- IEEE Publishes IEEE 802.3cc-2017 25 Gb/s Ethernet Standard for Enhanced Enterprise and Metro Network Applications Over Fiber (Mar. 22, 2018)
- SiFive Brings in Mobiveil as Newest Partner in the DesignShare Economy (Mar 22, 2018)
- China's domestic wafer equipment spending is expected to surge (Mar. 22, 2018)
- GLOBALFOUNDRIES Names Ronald Sampson as General Manager of its Leading-Edge Silicon Manufacturing Facility in New York (Mar 21, 2018)
- Report: Globalfoundries asks China to probe TSMC (Mar 21, 2018)
- Synopsys Accelerates Development of Renesas R-Car V3H SoC that Achieves Cutting-edge Computer Vision (Mar. 21, 2018)
- GLOBALFOUNDRIES Launches RF Ecosystem Program to Accelerate Time-to-Market for Wireless Connectivity, Radar and 5G Applications (Mar. 21, 2018)
- The first 90nm! GF silicon photon breakthrough: distance up to 120 km (Mar. 21, 2018)
- 8-inch wafer foundry capacity is in high demand: Samsung wants more market share, SMIC benefits from this situation (Mar. 21, 2018)
- Eta Compute：How to adjust the strategy and implement a single-chip neural network computing platform? (Mar. 21, 2018)
- MediaTek is on Broadcom’s list of next mergers and acquisitions (Mar. 20, 2018)
- Imagination announces powerful new capabilities in PVRTune performance analysis tool for PowerVR GPUs (Mar 20, 2018)
- Stratix 10 FPGA: REFLEX CES is Shipping the Cloud Computing COTS Board "XpressGXS10-FH200G", and the Sargon Stratix 10 GX Development Kit (Mar 20, 2018)
- Synopsys Introduces Breakthrough Fusion Technology to Transform the RTL-to-GDSII Flow (Mar 20, 2018)
- Rambus Signs License Agreement for Its DPA Countermeasures to Beijing Tongfang Microelectronics Co., Ltd. (Mar 20, 2018)
- Synopsys Enables Robust Design Optimization for Next-generation High-performance Computing, Mobile and Automotive Products with IC Compiler II and RedHawk Analysis Fusion (Mar 20, 2018)
- Synopsys Announces Industry's Most Comprehensive Automotive ISO 26262 Certification for Design Platform (Mar 20, 2018)
- Mobiveil Joins Gen-Z Consortium (Mar 20, 2018)
- Imagination streamlines app and game development with GPU debugging as part of new PVRStudio IDE (Mar 20, 2018)
- Accellera Announces Proposed Working Group to Define an IP Security Assurance Specification (Mar 19, 2018)
- Everspin Signs Long-term Patent License Agreement with Alps Electric (Mar 19, 2018)
- HiTrend selects Dolphin Integration's cache controller for its next generation of smart energy metering chips (Mar. 19, 2018)
- Rambus to Develop Hybrid Memory System Architectures for Future Data Centers (Mar. 19, 2018)
- Xilinx CEO Outlines New Vision, Strategy for the Company (Mar 19, 2018)
- GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivity (Mar 19, 2018)
- Broadcom Eyes New Acquisition Targets (Mar 19, 2018)
- SambaNova Systems Emerges From Stealth and Secures $56 Million in Series A Funding Led by Walden International and GV (Mar 19, 2018)
- Xilinx Unveils Revolutionary Adaptable Computing Product Category (Mar 19, 2018)
- Globalfoundries expands silicon photonics roadmap to meet explosive growth requirements for data center connectivity (Mar. 19, 2018)
- Bitland Mining ASIC will be moved to TSMC Nanjing Plant (Mar. 19, 2018)
- China's largest IC wafer project started in Yinchuan (Mar. 19, 2018)
- To privatize Qualcomm, former chairman Paul Jacobs may be kicked out of the board (Mar. 19, 2018)
- 2018 Global Fab Equipment Expenditure Analysis and Forecast (Mar. 17, 2018)
- Seeking privatization? Former chairman Paul Jacobs of Qualcomm will join hands with Softbank to acquire Qualcomm (Mar. 16, 2018)
- Silicon Creations' PMA Technology Part of Microsemi Award-Winning FPGA (Mar. 16, 2018)
- Trump Precedent Won't Chill M&A (Mar 15, 2018)
- IC Insights Raises 2018 IC Market Forecast from 8% to 15% (Mar 15, 2018)
- ArterisIP Drives Artificial Intelligence and Machine Learning Innovation for 15 Chip Companies (Mar. 15, 2018)
- Google sees quantum processor 'supremacy' at reach (Mar. 15, 2018)
- Eta Compute Launches Industry's First Neuromorphic Platform for Ultra-Low-Power Machine Intelligence at the Edge (Mar. 14, 2018)
- EnSilica builds export drive with appointment of Asia Region Manager (Mar 14, 2018)
- Stratix 10 FPGA: REFLEX CES is Shipping the Cloud Computing COTS Board (Mar. 14, 2018)
- Mobile Semiconductor Introduces 28nm Memory Compiler Support (Mar 14, 2018)
- MIPI Alliance Welcomes Bosch and Qualcomm as Promoter Members (Mar 14, 2018)
- Lattice Semiconductor Announces CEO Succession Plan (Mar. 14, 2018)
- Synopsys and Industry Technologists to Address the Path to 2-nm SoC Design (Mar. 14, 2018)
- Qualcomm artificial intelligence engine- AI Engine accelerates artificial intelligence towards the terminal side! (Mar. 14, 2018)
- Achronix New Architectures for Automotive Intelligence (Mar. 14, 2018)
- Samsung Foundry got orders from NXP and Telechips (Mar. 13, 2018)
- Trump banned Broadcom from acquiring Qualcomm with national security (Mar. 13, 2018)
- The 5G war, Huawei will be the only winner in China? (Mar. 13, 2018)
- Arteris IP FlexNoC Interconnect Licensed by VeriSilicon for Multiple Chip Designs (Mar. 13, 2018)
- Credo Demonstrates Robust, Low-Power 112G PAM4 Solutions at OFC 2018 (Mar. 13, 2018)
- Open-Silicon, Credo and IQ-Analog Showcase Complete End-to-End Networking ASIC Solutions at OFC 2018 (Mar 12, 2018)
- Fab Spending Poised For Remarkable Fourth Year of Growth (Mar 12, 2018)
- Synopsys Advances Custom Platform to Accelerate Robust Custom Design (Mar. 12, 2018)
- Xilinx Showcases Future of Optical Networking with Breakthrough Technology and Products at OFC 2018 (Mar 12, 2018)
- Following Significant Technology, Capacity and Expansion Milestones, GLOBALFOUNDRIES' Sanjay Jha to Pass Baton to Industry Veteran Tom Caulfield (Mar. 12, 2018)
- CSEM selects ID-Xplore to accelerate analog design and technology porting at functional level (Mar. 12, 2018)
- QuickLogic Joins RISC-V Foundation (Mar. 12, 2018)
- Faraday Accelerates AI Revolution with Its FPGA-to-ASIC Conversion Service (Mar 12, 2018)
- Mnano selects Dolphin Integration's six-channel Audio converter for its next generation of Smart Speakers (Mar. 12, 2018)
- Qualcomm chairman exempted, it says Intel may consider to acquire Broadcom (Mar. 12, 2018)
- Samsung plant blackout may cause short-term global NAND insufficient supply (Mar. 12, 2018)
- Fingerprint recognition, TDDI chip price storm in Taiwan (Mar. 12, 2018)
- Open source RISC-V architecture is changing the game rules of the IoT processor (Mar. 12, 2018)
- Faraday Accelerates AI Revolution with Its FPGA-to-ASIC Conversion Service in AI (Mar. 12, 2018)
- Samsung's long-term R&D in factory robots is expected to expand into surgery or home (Mar. 12, 2018)
- SMIC: fight back with 14nm Node technology (Mar. 10, 2018)
- Globalfoundries: 7nm 2nd generation Ryzen processor is expected to be launched in 2019 (Mar. 09, 2018)
- TSMC Reports Low Revenue in February since 10 months and Revenue in March Will Break Through 100 Billion Yuan (Mar. 09, 2018)
- TSMC February 2018 Revenue Report (Mar 09, 2018)
- UMC Reports Sales for February 2018 (Mar 09, 2018)
- Arm's New Mali Multimedia Suite Enables Sharp New Vision for Mobile Devices and Digital TV (Mar. 09, 2018)
- MIPI Alliance Expands Reach with New Automotive Working Group (Mar 08, 2018)
- Kneron Announces Low Power AI Processors NPU IP Series with the Lowest Power Consumption: Less Than 5mW (Mar 08, 2018)
- Faraday Monthly Consolidated Sales Report - February 2018 (Mar 08, 2018)
- Interview with Rick O'Connor of RISC-V Foundation (Mar. 08, 2018)
- Synopsys Collaborates with Samsung Foundry to Develop DesignWare IP for Samsung 8-nm FinFET Process (Mar. 08, 2018)
- Corigine adds certified USB IP to SiFive's Growing DesignShare Economy to Accelerate Adoption of RISC-V (Mar. 08, 2018)
- Qualcomm is negotiating with Huawei to try and solve the patent dispute (Mar. 07, 2018)
- CEVA First to Deliver Bluetooth 5 Dual Mode IP (Mar 07, 2018)
- Wave Computing Adopts Low Power MIPS 64-bit Multi-Threaded Core (Mar 07, 2018)
- GCT Semiconductor Licenses CEVA Bluetooth Low Energy IP for its LTE IoT SoC (Mar. 07, 2018)
- Intrinsic ID and Technolution Awarded SBIR to Develop SEMIO IoT Security Platform (Mar. 07, 2018)
- Arm delivers compelling visual experiences to the mainstream (Mar 07, 2018)
- Arteris IP Supports Dream Chip Technologies Innovative Business Model for Automotive SoC Development (Mar. 07, 2018)
- Are the Major DRAM Suppliers Stunting DRAM Demand? (Mar 07, 2018)
- Chipus to offer Ultra-Low-Power Analog IP Solutions for SilTerra's IoT Platform (Mar 07, 2018)
- Imperas Appoints Kevin McDermott as Vice President of Marketing (Mar 07, 2018)
- M31 and Macroblock work together to deploy the global LED driver IC market (Mar 07, 2018)
- Samsung cooperates with Faraday but TSMC has better technology (Mar. 06, 2018)
- Former Intel CEO will rely on Arm SoC to success? (Mar. 06, 2018)
- IC Insights: 2009 to 2017, a total of 92 IC fabs closed or changed their function (Mar. 06, 2018)
- January Semiconductor Sales Up 22.7 Percent Compared to Last Year (Mar 06, 2018)
- Synopsys Adds New Algorithms in DesignWare Security Protocol Accelerators to Increase Protection for IoT SoCs (Mar. 06, 2018)
- Silvaco Completes Acquisition of NanGate (Mar 06, 2018)
- Canaan-Creative employs Moortec's Temperature Sensor in their new ASIC aimed at HPC IC (Mar 05, 2018)
- GUC Monthly Sales Report - Feb 2018 (Mar 05, 2018)
- 92 IC Wafer Fabs Closed or Repurposed From 2009-2017 (Mar 05, 2018)
- HCC Embedded Releases MISRA-Compliant Embedded Cryptography Suite and Manager (Mar 05, 2018)
- Arm's John Ronco on IP for embedded (Mar 05, 2018)
- Trilinear Technologies and Avery Design Systems Team on DisplayPort IP Solutions (Mar. 05, 2018)
- Microchip Technology To Acquire Microsemi (Mar 05, 2018)
- Efinix Releases Trion Programmable Platform (Mar 05, 2018)
- Palma Ceia Closes Series B Funding, Internet of Things Connectivity to be Accelerated (Mar. 05, 2018)
- IDM will continue to outsource wafer, TSMC and SMIC will make more profit (Mar. 03, 2018)
- Microchip will acquire Microsemi for $ 8.35 billion (Mar. 02, 2018)
- Maxim's Dynamic Speaker Management Technology Running on the CEVA-TeakLite-4 Ultra-Low-Power DSP Provides the Ultimate Sound Experience from Micro Speakers (Mar. 02, 2018)
- Ceragon License CEVA DSPs for Full 5G Wireless Backhaul (Mar. 02, 2018)
- The open source RISC-V architecture is changing the game rules for IoT processors (Mar. 02, 2018)
- Microchip will acquire Microsemi for $ 8.35 billion (Mar. 02, 2018)
- 5G iPhone apple will use whose chip? Qualcomm, Samsung, Intel or its own? (Mar. 02, 2018)
- Brite Semiconductor Releases Gen2 DDR LP PHY IP (Mar. 01, 2018)
- Imec and Cadence Tape Out Industry's First 3nm Test Chip (Mar 01, 2018)
- CEVA and Nokia Collaborate for 4.9G and 5G Technologies (Mar. 01, 2018)
- SMIC Micromotors and Power Devices Industrialization Project officially landed in Shaoxing (Mar. 01, 2018)
- Mining, fingerprinting, AI, IoT and other new applications drive foundry industry to maintain growth (Mar. 01, 2018)
- Semiconductor silicon wafer price increase, profitable business for suppliers is expected to be extended to 2020 (Mar. 01, 2018)
- Imec and Cadence Successfully Stream First 3nm Test Chip Hot X (Mar. 01, 2018)
- Brite Semiconductor Releases Gen2 DDR LP PHY IP (Mar. 01, 2018)
- Arm Launches New Mbed Cloud Platform Feature for Interconnecting Restricted Devices (Mar. 01, 2018)
- Qualcomm: Huawei 5G chip is too large for mobile terminals, (Mar. 01, 2018)
- GOWIN Semiconductor selects PLDA XpressRICH3 Controller IP as the PCIe interface block in their FPGA product line (Feb. 28, 2018)
- Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent For Tiling of eFPGA Cores to Create Wide Range of Larger eFPGA Arrays (Feb. 28, 2018)
- GreenWaves Technologies Unveils GAP8, the Industry's Lowest Power IoT Application Processor, Enabling Groundbreaking Embedded Artificial Intelligence at the Very Edge (Feb 28, 2018)
- Truechip Announces First Customer Shipment of PCIe Gen 5 and JESD204C Verification IP (Feb 28, 2018)
- Trinamic Licenses Codasip's Bk3 RISC-V Processor for Next Generation Motion Control Applications (Feb. 28, 2018)
- Northwest Logic's Expresso 4.0 Controller Core and Fidus Systems' Zynq UltraScale+ Platform demonstrates PCIe 4.0 Support (Feb 28, 2018)
- S3 Semiconductors joins Arm Approved design partner program (Feb. 28, 2018)
- Single-Chip Custom Solutions for the IoT Edge (Feb. 27, 2018)
- Maxim's Dynamic Speaker Management Technology Running on the CEVA-TeakLite-4 Ultra-Low-Power DSP Provides the Ultimate Sound Experience from Micro Speakers (Feb 27, 2018)
- GEO Semiconductor Selects Cadence Tensilica Vision P5 DSP for Their Most Advanced Automotive Smart Viewing Camera Processor (Feb. 27, 2018)
- Dream Chip Technologies Demonstrates Superior Power Efficiency with Automotive Driver Assistance SoC on GLOBALFOUNDRIES 22FDX Technology (Feb. 27, 2018)
- Nuance Voice Activation Technology Now Available for CEVA-TeakLite Family, World's Lowest Power Audio/Voice DSPs (Feb. 27, 2018)
- Sonics Partners With Inomize To Enable Automotive Chip Design For ISO 26262 Standard (Feb. 27, 2018)
- Arteris IP FlexNoC Interconnect Licensed by AutoChips for Automotive SoC Development (Feb. 27, 2018)
- Neural Network Inference Engine IP Core Delivers >10 TeraOPS per Watt (Feb. 27, 2018)
- Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent For Tiling of eFPGA Cores to Create Wide Range of Larger eFPGA Arrays (Feb. 27, 2018)
- Qualcomm agreed to be Broadcom acquisition with a high price (Feb. 27, 2018)
- Microchip approached the acquisition of Microsemi (Feb. 27, 2018)
- GLOBALFOUNDRIES Strengthens 22FDX eMRAM Platform with eVaderis' Ultra-low Power MCU Reference Design (Feb 27, 2018)
- AccelerComm and Achronix Enable Fast Time to Market with 5G Polar Code for Speedcore eFPGAs (Feb 27, 2018)
- OPENAIRINTERFACE software stack powering 5G use-cases exhibited at Mobile World Congress Barcelona (Feb 27, 2018)
- Lattice Releases Next-Generation FPGA Software for Development of Broad Market Low Power Embedded Applications (Feb 26, 2018)
- Qualcomm Taps Samsung's 7nm EUV for 5G (Feb 26, 2018)
- AMIQ EDA Announces its Design and Verification Tools Eclipse IDE Supports Cadence Perspec System Verifier using System Level Notation (Feb. 26, 2018)
- Synopsys Delivers Industry's First Complete UFS 3.0 IP Solution for High-Performance Embedded and Removable Storage (Feb 26, 2018)
- Intel Ships Industry's First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV (Feb 26, 2018)
- CEO interview: Flex Logix' Geoff Tate on licensing FPGA (Feb 26, 2018)
- CEVA and mPerpetuo Partner to Deliver Halide Support for CEVA Vision Processors (Feb. 26, 2018)
- Magillem Partners with Imperas (Feb 26, 2018)
- Sequans Introduces New NB-IoT Only Platform: Monarch N (Feb 26, 2018)
- Metrics Partners with Avery to Expand Cloud Verification with Robust VIP Portfolio (Feb 26, 2018)
- CEVA Extends its IP Platforms for Bluetooth and Wi-Fi with RISC-V (Feb. 26, 2018)
- Avery Design Systems Announces SimXACT 5.0 for Improved X-Verification (Feb 26, 2018)
- Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio (Feb 26, 2018)
- Inside Secure to Provide Secure Provisioning Solutions to ALi Corporation (Feb. 26, 2018)
- Ceragon License CEVA DSPs for Full 5G Wireless Backhaul (Feb. 26, 2018)
- North American Semiconductor Equipment Industry Posts January 2018 Billings (Feb 26, 2018)
- Goodix Announces Entry into the Growing NB-IoT Market with Its Acquisition of German-Based CommSolid (Feb 26, 2018)
- IAR Systems enables high-performance machine learning based on latest neural network library from Arm (Feb. 26, 2018)
- TSMC got the 7-nanometer LTE chip orders of Qualcomm (Feb. 26, 2018)
- TSMC focuses on 3 nano technology with billion investment in New R&D center at Hsinchu (Feb. 26, 2018)
- The cooperation between Samsung and Qualcomm for 5G, and the acquisition of Qualcomm by Broadcom will affect the wafer foundry industry market? (Feb. 26, 2018)
- Chinese government puts pressure on Samsung again: Memory price must be cut, give priority to Chinese enterprises (Feb. 26, 2018)
- Semiconductor silicon wafer shortage, the first quarter price soared 10% to 15% (Feb. 25, 2018)
- CEVA Launches PentaG ™, a Comprehensive 5G Wireless Enhanced Mobile Broadband IP Platform (Feb. 24, 2018)
- CEVA Announces Industry's First 802.11ax Wi-Fi IPs (Feb. 24, 2018)
- Arm will take the heavy task of populating artificial intelligence? (Feb. 24, 2018)
- The United States stepped up its efforts to lobby Australia for crowding out Huawei from 5G Deployment (Feb. 24, 2018)
- Why Qualcomm 7nm 5G chip provided by Samsung rather than TSMC? which one is better? (Feb. 23, 2018)
- Barefoot Networks and Xilinx to Showcase Unprecedented Programmability and Visibility for 5G Networks (Feb 23, 2018)
- Blu Wireless Technology inside CCS self-organising mmWave access and backhaul solution (Feb. 23, 2018)
- Samsung announced the foundry Qualcomm 7nm 5G chip HOT (Feb. 23, 2018)
- Expansion of wafer manufacturing cooperation, Qualcomm uses Samsung EUV process to conquer 5G market (Feb. 23, 2018)
- Arm announces the Project Trillium starts (Feb. 23, 2018)
- Huawei expands Hisilicon chips by adopting at least half of handsets this year (Feb. 23, 2018)
- PSA: Next steps toward a common industry framework for secure IoT (Feb. 22, 2018)
- CEVA Introduces PentaG - A Comprehensive 5G New Radio Enhanced Mobile Broadband IP Platform for Smartphones, Fixed Wireless Access and Embedded Devices (Feb 22, 2018)
- New Arm Mbed IoT Device Platform capabilities enable companies to get more from their data (Feb. 22, 2018)
- SoC-e's MTSN Switch IP Core solution now supports 802.1AB (LLDP) (Feb. 22, 2018)
- Vidatronic, Inc. Awarded National Science Foundation Grant for the Development of High Performance CMOS Transmitters for Wireless Applications (Feb. 22, 2018)
- Gartner Says Worldwide Sales of Smartphones Recorded First Ever Decline During the Fourth Quarter of 2017 (Feb 22, 2018)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2018 (Feb 22, 2018)
- Arm delivers integrated SIM identity to secure next wave of cellular IoT devices (Feb. 22, 2018)
- Integrated Circuit Technology Advances Continue to Amaze (Feb 22, 2018)
- WuQi Technologies is the latest licensee of CCww's NB-IoT UE protocol-stack software (Feb 22, 2018)
- Samsung 7nm fab started to construct on Friday with 5.6 billion investment (Feb. 22, 2018)
- WuQi Technologies is the latest licensee of CCww’s NB-IoT UE protocol-stack software (Feb. 22, 2018)
- In short supply, silicon wafer prices (Feb. 21, 2018)
- 48 Arteris IP Engineers Attain ISO 26262 Functional Safety Practitioner Certification by exida (Feb 21, 2018)
- Software-Based GPS Receiver from Galileo Satellite Navigation Now Available on Cadence Tensilica Fusion F1 DSP (Feb 21, 2018)
- UltraSoC and Lauterbach RISC-V collaboration furthers vendor-neutral debug and development environment (Feb 20, 2018)
- Qualcomm Enters into Amended Definitive Agreement with NXP (Feb 20, 2018)
- Microsemi to Showcase Third-Party IP Offerings for Machine Vision Applications Using its Cost-Optimized, Low Power Mid-Range PolarFire FPGAs at Embedded World (Feb 20, 2018)
- AI + IoT again！ Google tried to acquire IoT company Xively (Feb. 19, 2018)
- Google open TPU chip, charging 6.5 US dollars per hour (Feb. 16, 2018)
- Analysts have long favored for TSMC, especially the revenue of HPC, automotive and Internet of Things are taking off (Feb. 14, 2018)
- Arm's Project Trillium Offers the Industry's Most Scalable, Versatile ML Compute Platform (Feb 13, 2018)
- SMIC CEO: We are preparing to meet the customer's technology migration (Feb. 13, 2018)
- Google announced that TPU is open to third parties (Feb. 13, 2018)
- it says that Qualcomm, Broadcom are going to negotiate the acquisition? Just this Wednesday! (Feb. 12, 2018)
- Intrinsic ID to Demonstrate Hardware Root of Trust for IoT Security at Embedded World (Feb. 12, 2018)
- New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8% (Feb. 12, 2018)
- TSMC January revenue up 4.1% (Feb. 12, 2018)
- China Mainland NB-IoT chip shipments will reach to billions this year (Feb. 12, 2018)
- STMicroelectronics new products: new range sensor + vehicle flicker-free camera (Feb. 12, 2018)
- 10nm Technology Node Wars: TSMC vs. Samsung home page (Feb. 11, 2018)
- Apple will invest 1 billion yuan to build a second data center in China, ranking Inner Mongolia (Feb. 11, 2018)
- SMIC 14 nanometer wafer technology products or put into operation in the first half of 2019 (Feb. 10, 2018)
- UltraSoC teamed up with Percepio to provide the first complete embedded analytics platform for real-time systems (Feb. 10, 2018)
- Qualcomm refuses Broadcom 121 billion acquisition price (Feb. 09, 2018)
- GlobalFoundries became STMicroelectronics strategy partner for 22nm FD-SOI development (Feb. 09, 2018)
- GlobalFoundries 7nm strategic deployment follows closely TSMC (Feb. 09, 2018)
- Samsung plans to build a second memory production line in Pyeongtaek (Feb. 08, 2018)
- Siemens continues to invest in IC industry with planned acquisition of Sarokal Test Systems (Feb 08, 2018)
- MIPI Alliance Releases MIPI UniPro v1.8 with Increased Performance and Improved Quality of Service (Feb 08, 2018)
- SMIC Reports 2017 Fourth Quarter Results (Feb 08, 2018)
- Synopsys Expands Photonic Design Solution with the Acquisition of PhoeniX Software (Feb. 08, 2018)
- 2018 IC industry can achieve double-digit growth! (Feb. 08, 2018)
- SMIC 8-inch production capacity are taken mostly by Huawei, Qualcomm, FPC (Feb. 07, 2018)
- NetSpeed and Synopsys Collaborate to Enable Early Architectural Exploration of Advanced ADAS and Datacenter SoCs (Feb. 07, 2018)
- NetSpeed Collaborates with Cadence to Optimize IP for Advanced Automotive SoC Designs (Feb. 07, 2018)
- Arm acquires ChaoLogix for security reasons (Feb 07, 2018)
- Faraday Monthly Consolidated Sales Report - January 2018 (Feb 07, 2018)
- SoC-e releases IEC 61850/62351 SASCrypt IP Core (Feb. 07, 2018)
- SiFive Launches World's First Linux-Capable RISC-V Based SoC (Feb. 07, 2018)
- Malta Tour Shows GF Rising (Feb 07, 2018)
- Huawei and the British government signed a £ 3 billion five-year purchase agreement (Feb. 07, 2018)
- UltraSoC named Aileen Smith, former chief executive of Huawei UK, as its chief strategy officer (Feb. 06, 2018)
- If Qualcomm does not give in, iPhone this year will only use Intel baseband (Feb. 06, 2018)
- Confirmed the Broadcom offer for Qualcomm increased to 121 billion US dollars (Feb. 06, 2018)
- Samsung will launch the first built-in NPU car processor (Feb. 06, 2018)
- FD-SOI ready to make big business by opportunities of IoT market (Feb. 06, 2018)
- Broadcom increase the offer to 145 billion US dollars, up to Qualcomm investors ideal price (Feb. 05, 2018)
- Counterpoint: Samsung is turning to a semiconductor and systems company (Feb. 05, 2018)
- 2017 Top Ten IoT Technology (Feb. 05, 2018)
- intoPIX & Macnica Technology revolutionize AV signal distribution at ISE 2018: Integrating the new ST 2110 standards with intoPIX ultra-low latency compression technologies (Feb. 05, 2018)
- Ampere Launches to Accelerate Hyperscale Cloud Computing Innovations (Feb. 05, 2018)
- Can Ex-Intel President Succeed with Old ARM SoC? (Feb 05, 2018)
- Annual Semiconductor Sales Increase 21.6 Percent, Top $400 Billion for First Time (Feb 05, 2018)
- GUC Monthly Sales Report - Jan 2018 (Feb 05, 2018)
- Xilinx to Showcase 8K and AV over IP Solutions at ISE 2018 (Feb 05, 2018)
- Sankalp Semiconductor opens a New Design Center in Ahmedabad (Feb. 05, 2018)
- 2017 Top Ten IoT Technology (Feb. 05, 2018)
- After three years, Intel has its third CTO (Feb. 05, 2018)
- GlobalFoundries will begin 7 nm mass production for AMD, 5 nm is already in the planning Hot 4 (Feb. 03, 2018)
- UltraSoC delivers industry's first RISC-V processor trace IP (Feb. 02, 2018)
- Samsung counter-attack! Beyond Intel as "the world's NO.1 chip maker" (Feb. 02, 2018)
- Mobile System on Chip Designs, Embedded Processing Lift MPU Market (Feb 02, 2018)
- NVM Express, Inc. Elects Cavium, Cisco, Dell, Facebook, Intel, Microsemi and NetApp to Promoter Board for 2018 (Feb 02, 2018)
- Chip Heads Gauge Silicon Roadmap (Feb 02, 2018)
- Metrics Announces Pay-by-Minute Cloud Simulator & Verification Manager (Feb 01, 2018)
- ASE and Cadence work together to develop the first ASE high-performance, advanced IC packaging technology tailored system-in-package EDA solutions (Feb. 01, 2018)
- AI Expands Role in Design (Feb 01, 2018)
- Cadence Reports Fourth Quarter and Fiscal Year 2017 Financial Results (Feb 01, 2018)
- SMIC receive an investment of billions of dollars from government, dedicates to 14nm and mass production next year (Feb. 01, 2018)
- Chinese fabs are exploring collaborative manufacturing models (Feb. 01, 2018)
- Global Wafer in high demand, rush to work throughout the year of 2019 (Feb. 01, 2018)
- Movellus Announces "True Digital" PLL, DLL, & LDO Generators (Jan. 31, 2018)
- JEDEC Publishes Universal Flash Storage (UFS & UFSHCI) Version 3.0 and UFS Card Extension Version 1.1 (Jan 31, 2018)
- Credo Demonstrates Robust 112G PAM4 Single Lane Electrical SerDes Techology at DesignCon 2018 (Jan 31, 2018)
- Synopsys Announces Verification IP and Test Suite for Arm AMBA ACE5 and AXI5 (Jan. 31, 2018)
- TSMC 28nm market share this year can still reach 70% (Jan. 31, 2018)
- Silex Inside releases JPEG 2000 AV over IP OEM boards (Jan. 31, 2018)
- 2017 top 10 semiconductor components list of buyers released! (Jan. 31, 2018)
- 2017 Top 10 semiconductor buyer, Samsung and Apple take 25% amount (Jan. 30, 2018)
- Xylon announces Motion JPEG Encoder (Jan. 30, 2018)
- TSMC 5nm officially launched (Jan. 29, 2018)
- How did SMIC success? (Jan. 29, 2018)
- China Foundry Seeks Shared Model (Jan 29, 2018)
- Synopsys' New ARC HS Development Kit Accelerates Software Development for ARC-based Systems (Jan. 29, 2018)
- Microsemi Reportedly Mulls Sale (Jan. 29, 2018)
- Icron's Powerful Maverick KVM Extension Platform to be showcased by intoPIX at ISE 2018 Show in Amsterdam (Jan 29, 2018)
- SoC-e IP Cores support new Xilinx UltraScale+ devices (Jan. 29, 2018)
- How did TSMC success? (Jan. 27, 2018)
- TSMC establishes eighteenth factory located in NanKe and lead five nano-process (Jan. 26, 2018)
- STMicroelectronics announces change in leadership team (Jan. 26, 2018)
- Media said Microsemi is going to be acquired soon (Jan. 26, 2018)
- Chinese Xiao Mi may win Samsung in India (Jan. 26, 2018)
- Synopsys DFTMAX LogicBIST Deployed by Renesas for In-System Automotive Test (Jan. 26, 2018)
- Rambus and Marvell Sign Patent License Agreement (Jan 25, 2018)
- Andes Processors Are Not Susceptible to Meltdown and Spectre Attacks (Jan. 25, 2018)
- 2018 silicon wafer prices will increase quarter by quarter (Jan. 25, 2018)
- Qualcomm strongly disagreed after receiving $ 1,229 million fine from EU (Jan. 25, 2018)
- Imagination Announces Neural Network SDK (Jan. 25, 2018)
- Samsung Strengthens its Foundry Customer Support with New SAFE Foundry Ecosystem Program (Jan. 25, 2018)
- Arasan Chip Systems Announces Immediate Availability of MIPI I3C HDK (Jan. 25, 2018)
- Startup Claims AI Design Wins (Jan. 25, 2018)
- SoC-e Announces New Release of Managed Ethernet Switch (MES) IP Core Supporting DLR for Ethernet/IP (Jan. 24, 2018)
- Imagination announces hardware virtualized GPU core to meet automotive needs for cluster, HUD and infotainment (Jan. 24, 2018)
- Qualcomm: in Taiwan the fines expired, it will apply for installments (Jan. 23, 2018)
- TIRIAS Research Publishes White Paper on ASIC Market (Jan 23, 2018)
- Eta Compute Secures $8 Million Series A Financing to Accelerate Development of the 3rd Generation of Neural Networks (Jan 23, 2018)
- TSMC comprehensive starts: 5nm begins this week , 7nm has been received 50 orders (Jan. 22, 2018)
- Thalia expands with new analog design engineering facility (Jan 22, 2018)
- Israeli Semiconductor Consortium Licenses Flex Logix's Embedded FPGA Technology (Jan. 22, 2018)
- TSMC Sees HPC Driving Business (Jan 22, 2018)
- Starblaze Reaches Volume Production with Moortec's Temperature Sensor in their SSD Controller SoC (Jan. 22, 2018)
- Inside Secure Protects New Interactive Video Application Developed by PodOp and HBO (Jan. 22, 2018)
- GUC Announces 20th Anniversary (Jan. 22, 2018)
- MIPS Returns to Silicon Valley To Drive Next Generation of Intelligent Applications (Jan. 20, 2018)
- TSMC confirmed smart phone wafer shipments this year may decline (Jan. 19, 2018)
- Achronix Completes Production Silicon Validation of 16nm FinFET+ Speedcore eFPGA Technology (Jan. 19, 2018)
- Samsung began mass production of GDDR6 memory chip for the next generation of graphics (Jan. 19, 2018)
- For the first time, Trump approved the Chinese buyer's acquisition of US semiconductor equipment company (Jan. 19, 2018)
- Texas Instruments CEO changed! Templeton is about to leave (Jan. 19, 2018)
- Amphion Semiconductor releases enhanced 'Malone' video decoder IP for SoC implementation (Jan. 18, 2018)
- MIPS Is Back, With An Eye on AI (Jan 18, 2018)
- Everspin Begins 40nm STT-MRAM Volume Production (Jan. 17, 2018)
- Achronix Completes Production Silicon Validation of 16nm FinFET+ Speedcore eFPGA Technology (Jan 17, 2018)
- Wafer manufacturing improved! In 2018 China mainland 12-inch wafer monthly capacity can approach 700,000 (Jan. 17, 2018)
- ARM CEO: There is no absolute security, chip bugs may happen again (Jan. 17, 2018)
- Meizu betrayed MediaTek, switch to Qualcomm and Samsung (Jan. 17, 2018)
- Arteris IP Announces 8 New Licensees, 2 New Products in 2017 (Jan. 17, 2018)
- ASR License CEVA DSP and Connectivity Technologies for Smartphones and IoT Devices (Jan. 17, 2018)
- Synopsys Publishes CISO Report; Identifies Four Distinct Approaches to the CISO Role (Jan. 17, 2018)
- Xilinx Announces Availability of Automotive Qualified Zynq UltraScale+ MPSoC Family (Jan. 16, 2018)
- STMicroelectronics presents its latest smart driving solution at the 2018 Japan Automotive Technology Expo (Jan. 16, 2018)
- In 2018, the supply of silicon wafers will continue to be tight, and foundries will tie the contract with prepayments in order to grab production capacity (Jan. 15, 2018)
- Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 12FFC (Jan. 15, 2018)
- TSMC said it will focus on 7 nm, total revenue this year is expected to exceed one trillion (Jan. 15, 2018)
- ESD Alliance Reports EDA Industry Revenue Increase For Q3 2017 (Jan 15, 2018)
- Vidatronic Continues Expansion with New Office in Austin, Texas (Jan. 15, 2018)
- Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.5 Percent in 2018 (Jan 15, 2018)
- Integrate ADAS Domain Controllers with Automotive IP (Jan. 13, 2018)
- Synopsys: Design next-generation flash storage solutions using configurable and scalable processors (Jan. 13, 2018)
- Argus Network Security Technologies and STMicroelectronics Collaborate to Enhance Data Security and Privacy Protection for Connected Car Technologies (Jan. 12, 2018)
- Barco Silex leaves Barco and becomes Silex Inside (Jan. 12, 2018)
- UMC Files Patent Infringement Lawsuit against Micron (Jan 12, 2018)
- Mentor Nucleus RTOS extends system reliability for Arm Cortex v8-A 64-bit processors on multicore SoCs (Jan. 12, 2018)
- Analog IC Market Forecast With Strongest Annual Growth Through 2022 (Jan 12, 2018)
- CEVA and Silentium Partner to Deliver Active Noise Cancellation Solution for the CEVA-TeakLite DSP Family (Jan. 11, 2018)
- Huawei wins the lawsuit, awarded more than 8000 million from Samsung (Jan. 11, 2018)
- Synopsys Expands DesignWare IP Portfolio with Acquisition of Kilopass Technology (Jan. 11, 2018)
- Global SoC Design Service Provider, Incise announces the appointment of T2M for global marketing, representation & business development (Jan 11, 2018)
- Racyics takes FDSOI down to 0.4V (Jan. 11, 2018)
- MIPS Returns to Silicon Valley To Drive Next Generation of Intelligent Applications (Jan. 10, 2018)
- Global SoC Design Service Provider, Incise announces the appointment of T2M for global marketing, representation & business development (Jan. 10, 2018)
- Samsung invests 14 billion US dollars a year into IoT to intelligentize the connected devices (Jan. 10, 2018)
- Microsemi SmartFusion2 SoC FPGAs are exclusively offered worldwide by Digi-Key (Jan. 10, 2018)
- 14nm FinFET 2.5D/HBM2/SerDes Webinar, presented by Samsung, ASE, eSilicon, Rambus and Northwest Logic (Jan. 10, 2018)
- Synopsys: Optimizing SMIC 40LL & 40ULP Designs for Speed & Energy Efficiency (Jan. 10, 2018)
- Flex Logix Names Valy Ossman Technical Director, Solutions Architecture (Jan 09, 2018)
- Cadence Tensilica HiFi Audio DSP is the First DSP IP Core to Support Dolby Atmos for PCs (Jan. 09, 2018)
- A guide to securing your IoT device with Arm TrustZone for Cortex-M (Jan. 09, 2018)
- eVaderis Launches MRAM Microcontroller for the Internet of Things (Jan. 09, 2018)
- videantis introduces new processor and tools for deep learning (Jan. 09, 2018)
- Memory differences remain as ST chooses Globalfoundries for FDSOI (Jan 09, 2018)
- STMicroelectronics Selects GLOBALFOUNDRIES 22FDX to Extend Its FD-SOI Platform and Technology Leadership (Jan 09, 2018)
- eSilicon announces 7nm FinFET ASIC design win (Jan. 09, 2018)
- Top 10 global semiconductor manufacturers in 2017 revenue ranking: Samsung is NO.1 (Jan. 08, 2018)
- 2017 Top 10 Fabless revenue ranking: HiSilicon, Xilinx into the list (Jan. 08, 2018)
- Victor Peng becomes the fourth CEO in Xilinx's history (Jan. 08, 2018)
- Wi-Fi Alliance introduces security enhancements (Jan 08, 2018)
- GUC Monthly Sales Report - Dec 2017 (Jan 08, 2018)
- CEVA Unveils NeuPro™ - A Family of AI Processors for Deep Learning at the Edge (Jan. 08, 2018)
- Dolphin Integration paves the way for the next generation of Digital microphones (Jan. 08, 2018)
- Samsung Delivers Vision for Open and Intelligent IoT Experiences to Simplify Everyday Life (Jan. 08, 2018)
- ON Semiconductor Introduces Scalable Image Sensor Platform for ADAS and Autonomous Driving to Speed and Simplify Design and Implementation (Jan. 08, 2018)
- ON Semiconductor’s AR0430 Image Sensor Recognized at CES 2018 for Simultaneous Delivery of Image Capture and Depth Mapping From a Single Sensor Solution (Jan. 08, 2018)
- Western Digital Unveils New Storage Solutions (Jan. 08, 2018)
- SEMI: Global fab equipment spending will hit a new high (Jan. 05, 2018)
- The first quarter of this year, 8-inch wafer foundry prices will be successfully raised 5 to 10% (Jan. 05, 2018)
- UltraSoC appoints Aileen Smith as Chief Strategy Officer (Jan 04, 2018)
- AImotive, Leading Provider of Camera-First Autonomous Driving Technology, Raises $38 Million USD Series C (Jan 04, 2018)
- MIPI Alliance Enhances its MIPI NIDnT Debug and Test Specification to Enable Debugging over the Latest USB Type-C Connectors (Jan 04, 2018)
- TSMC, this year, has received 40 customer orders and will surpass Samsung in the 7nm chip production (Jan. 04, 2018)
- Samsung fight to upgrade the fighting strength of the semiconductor, four years to be hit more than 20 trillion Korean won (Jan. 04, 2018)
- CEVA's Bluetooth 5 Low Energy IP certified with Ellisys Bluetooth Compliance Tester (Jan. 03, 2018)
- NGCodec Closes $8M Series A, Launches Live Broadcast H.265/HEVC Cloud Video Encoding and Demonstrates Cloud VR (Jan 03, 2018)
- Hardent IP Portfolio Supports New Features of HDMI 2.1 Specification (Jan. 03, 2018)
- DSP Group, Emza and Himax Announce Industry's First AI based Human Presence IoT Visual Sensor for Consumer Appliances and Industrial Applications (Jan 02, 2018)
- Arrow Accelerates IoT Leadership Position with eInfochips Acquisition (Jan 02, 2018)
- eVaderis Completes Tape-Out of Innovative MRAM-Based, Memory-Centric MCU Demonstrator for Next-Generation IoT Applications (Jan 02, 2018)
- TSMC Nanjing plant Q1 cast, shipped in May (Jan. 02, 2018)
- Mainland HPC chip outbreak, 10 million 12nm orders to TSMC (Jan. 02, 2018)
- Growing investiment for SMIC in China (Jan. 02, 2018)
- Qualcomm lost to Samsung self-made SoC, change to attack the Chinese market (Jan. 02, 2018)
- Faraday Signs Satris Group as Its Israeli Distributor (Jan. 02, 2018)
- 2018 six technology trends deserve attention (Jan. 02, 2018)
- Global Semiconductor Sales Increase 21.5 Percent Year-to-Year in November (Jan. 02, 2018)
- Samsung official announcement: Exynos flagship SoC confirmed January 4 debut (Dec. 31, 2017)
- After TSMC, Samsung developed a fan-out wafer-level package (Fo-WLP) process (Dec. 29, 2017)
- Use high-performance memory to achieve low-cost IoT requirements (Dec. 29, 2017)
- Battery problems? Samsung Note 8 can not be recharged after it is exhausted (Dec. 29, 2017)
- 2017 China's top ten semiconductor industry events (Dec. 29, 2017)
- Huawei transcripts: 2017 revenue 600 billion yuan break mobile phone shipments of 153 million units (Dec. 29, 2017)
- Arastu Systems enhances outreach with the establishment of its Global Sales Channel (Dec. 28, 2017)
- Xylon's Innovations at CAR-ELE Japan (Dec. 28, 2017)
- Auto-driving vehicles in 2017 the seven glorious historical moments (Dec. 28, 2017)
- Why China spend hundreds of millions to create a memory? (Dec. 28, 2017)
- Intel fails to match TI’s 25 year record as No.1 (Dec. 27, 2017)
- Semiconductor industry annual sales champion will be changed after 25 years, Samsung Korea will surpass the Intel United States (Dec. 26, 2017)
- China memory three camp forming: Fujian Jinhua, Hefei Changxin and Ziguang Group carry banners (Dec. 26, 2017)
- Global semiconductor investment will enter the top 3 dominating era (Dec. 26, 2017)
- Get rid of Qualcomm / ARM bound, Samsung followed Apple to do self-study GPU (Dec. 25, 2017)
- DRAM market growth will hit the highest record in 23 years (Dec. 25, 2017)
- Follow the footsteps of TSMC, Samsung grab access mining chip list (Dec. 22, 2017)
- Samsung is interviewed by the Development and Reform Commission due to memory prices rising: or involve the industry monopoly (Dec. 22, 2017)
- Competing with Samsung, Qualcomm is allowed to test autopilot cars in California (Dec. 22, 2017)
- China Telecom changed to a wholly state-owned company, no longer involved in mixed change! (Dec. 22, 2017)
- Chipus Microelectronics receives ISO 9001 certification (Dec. 22, 2017)
- QuickLogic to Demonstrate Sensor Processing and eFPGA Solutions at CES 2018 (Dec. 21, 2017)
- Rambus Renews Patent License Agreement with Panasonic (Dec. 21, 2017)
- NXP and Baidu Partner on Apollo Open Autonomous Driving Platform (Dec. 21, 2017)
- The Deals and No Deals that shaped 2017 (Dec 21, 2017)
- UMC Announces Availability of 40nm SST Embedded Flash Process (Dec. 21, 2017)
- Khronos Group Releases NNEF 1.0 Standard for Neural Network Exchange (Dec. 21, 2017)
- Samsung 2018 will receive 22 billion US dollars Apple's large OLED panel (Dec. 21, 2017)
- The STMicroelectronics FCU evaluation board is on sale at Mouser Electronics (Dec. 21, 2017)
- ST unveils Barron that matches its S2-LP 868-927MHz low-power RF transceiver (Dec. 21, 2017)
- How to avoid signal interference in the design of Internet of Things low-power multi-protocol network? (Dec. 21, 2017)
- The product is lance and multi-protocol is the future of IoT wireless connectivity (Dec. 21, 2017)
- Samsung grab the foundry market growth, the competitiveness is under suspection (Dec. 20, 2017)
- Samsung DRAM "overlord" status is hard to shake! Has developed the world's smallest DRAM memory chip (Dec. 20, 2017)
- 2017 is a year of China's IC harvest, you hit points? (Dec. 20, 2017)
- Intel Unveils Industry's First FPGA Integrated with High Bandwidth Memory Built for Acceleration (Dec. 19, 2017)
- 台积电超低价拿下南京厂用地50年使用权 (Dec. 19, 2017)
- X-FAB Introduces New Low-Power eFlash Block Optimized for Energy Harvesting & IoT Devices (Dec 19, 2017)
- Broadcom Ships Tomahawk 3, Industry's Highest Bandwidth Ethernet Switch Chip at 12.8 Terabits per Second (Dec 19, 2017)
- HDL Design House Launches New Website (Dec 19, 2017)
- Creonic Launches 5G Product Line with Polar and LDPC FEC IP Cores (Dec. 18, 2017)
- North American Semiconductor Equipment Industry Posts November 2017 Billings (Dec 18, 2017)
- Inside Secure Delivers Next-generation Content Protection Solutions Extending Leadership in Device Coverage and Early-window Premium Video (Dec. 18, 2017)
- StarHub Deepens Secure Smart Nation Capabilities with Acquisition of D'Crypt (Dec 18, 2017)
- GF FD-SOI制程将兵分两路进击 成都厂着重物联网、5G (Dec. 18, 2017)
- 格罗方德披露7纳米最新进展：提升40%效能、2019年量产 (Dec. 18, 2017)
- 三星半导体未来将着重非存储器 SOC 及代工业务发展 (Dec. 18, 2017)
- 2018年最值得关注的IoT应用！ (Dec. 18, 2017)
- 7nm工艺处理器还是太贵，明年只有这两家敢用 (Dec. 15, 2017)
- Tortuga Logic Appoints Andrew Dauman Vice President of Engineering to Oversee Product Development, R&D (Dec 14, 2017)
- QuickLogic Collaborates with Mentor to Provide Seamless Design Environment for eFPGA Technology (Dec. 14, 2017)
- ICE-P3 EPU Upgrade Simplifies Control Of On-Chip And External Resources To Save More Power In SoC And MCU Designs (Dec. 14, 2017)
- Synopsys and Helic Deliver Unified Electromagnetic-Aware Analog and RF Custom Design Flow (Dec. 14, 2017)
- Achronix Wins 2017 Company of the Year Award (Dec. 14, 2017)
- BrainChip Announces Change in Board Membership (Dec 14, 2017)
- 意法半导体(ST)收购Atollic——专注于Arm®微控制器集成开发环境的嵌入式系统公司 (Dec. 14, 2017)
- 三星获得屏幕新专利，可"双面屏"在三星手上能干什么？ (Dec. 14, 2017)
- 三星明年全球智能手机市场份额料下滑 受中国厂商挤压 (Dec. 14, 2017)
- Innovative Logic的USB 3.1 Gen 2 IP获得USB-IF认证 (Dec. 13, 2017)
- Innovative Logic USB 3.1 Gen 2 IP got Certification from USB-IF (Dec 13, 2017)
- Truechip Successfully hosted TrueConnect 2017 - The First Annual Technical Conference (Dec 13, 2017)
- iC-Haus Selects Synopsys' IC Validator and StarRC for Signoff (Dec. 13, 2017)
- STMicroelectronics Acquires Atollic, an Embedded-Systems Company Engineering Integrated Development Environments for Arm-core-based Microcontrollers (Dec 13, 2017)
- SMIC and Efinix Quickly Deliver the First Quantum-Accelerated Silicon Product (Dec. 13, 2017)
- Aldec releases re-configurable FPGA-based accelerators for High Frequency Trading applications (Dec. 13, 2017)
- Catena selects Thalia-DA to facilitate analog IP re-use (Dec. 13, 2017)
- 行情一片大好，台积电加快在内地建厂速度 (Dec. 12, 2017)
- 为了比iPhone X的深度传感技术还要深，他们在努力 (Dec. 12, 2017)
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- TSMC November 2017 Revenue Report (Dec 08, 2017)
- Faraday Monthly Consolidated Sales Report - November 2017 (Dec 08, 2017)
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- 通吃苹果三星，博通前季 EPS 跳增逾三成 (Dec. 08, 2017)
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- Synapse Design Strategic Growth Activity Continues with Acquisition of ACEIC (Dec 06, 2017)
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- Inomize is selected as Supply Chain Manager and to support the development of 3D camera and XR ASIC using TSMC 12nm FFC Technology (Dec 05, 2017)
- GUC Monthly Sales Report - Nov 2017 (Dec 05, 2017)
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- When Less is Moore (Dec 04, 2017)
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- 坚持不懈的身影：Xilinx首席工程师Michaela Blott (Dec. 04, 2017)
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- Synopsys Delivers a Complete HDMI 2.1 IP Solution with HDCP 2.2 Content Protection (Dec 01, 2017)
- Titan IC launches "Hyperion F1 10G RegEx File Scan" on AWS Marketplace (Dec 01, 2017)
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- 连亏10个季度 LG移动部门高层大换血 (Dec. 01, 2017)
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- With its Modular Switch and End-System IP Technology combining both AFDX and PTP protocols SILKAN hits its target (Nov 30, 2017)
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- Semiconductor Industry Continues Upward Trend Toward Record Year, IHS Markit Says (Nov 30, 2017)
- RISC-V Processor Developer Suite Announced by Imperas (Nov 30, 2017)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2017 (Nov 30, 2017)
- MIPI Alliance Releases MIPI CCS, a New Specification that Streamlines Integration of Image Sensors in Mobile Devices (Nov 30, 2017)
- Inside Secure delivers strong customer authentication for Visma Solutions (Nov 30, 2017)
- 新思科技推出业界第一个具备HDCP 2.2内容保护机制的HDMI 2.1 IP解决方案 (Nov. 30, 2017)
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- 三星量产第2代10nm FinFET工艺SoC 明年首季推出 (Nov. 30, 2017)
- Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology (Nov 29, 2017)
- Western Digital To Accelerate The Future Of Next-Generation Computing Architectures For Big Data And Fast Data Environments (Nov 29, 2017)
- Lattice will migrate products to FDSOI (Nov 29, 2017)
- Cadence Announces Availability of Industry's First PCI Express 5.0 Verification IP (Nov 29, 2017)
- SiFive Joins FDXcelerator Program to Bring RISC-V Core IP to GLOBALFOUNDRIES' 22FDX Process Technology (Nov 29, 2017)
- Intrinsic ID Names Alpesh Saraiya as Senior Director Product Management (Nov 29, 2017)
- Esperanto Technologies Plans Energy-Efficient Chips for Artificial Intelligence and Machine Learning, based on the open RISC-V standard (Nov 29, 2017)
- Lattice 通过HDMI 2.1增强型音频回传通道（eARC）解决方案简化音频连接并提高性能 (Nov. 29, 2017)
- 2017年全球前十大晶圆代工业者排名：台积电市占据半壁江山 (Nov. 28, 2017)
- Codasip宣布推出新款64位RISC-V处理器Bk5-64 (Nov. 28, 2017)
- Siemens 收购 Solido Design Automation，以增强对 IC 市场的承诺 (Nov. 28, 2017)
- Amazon Web Services Names Intrinsic ID Advanced Tier Technology Partner in AWS Partner Network (Nov 28, 2017)
- SiFive and Microsemi Expand Relationship with Strategic Roadmap Alignment and a Linux-Capable, RISC-V Development Board (Nov 28, 2017)
- Minima Processor Reduces SoC Energy Consumption for Near-Threshold Voltage Design (Nov 28, 2017)
- Codasip Announces Bk5-64, a New 64-bit RISC-V Processor (Nov 28, 2017)
- HDMI Forum Releases Version 2.1 of the HDMI Specification (Nov 28, 2017)
- 中芯国际宣布根据一般授权配售新股，建议发行65,000,000美元永久次级可换股证券及Datang，中国集成电路基金及Country Hill优先购股权 (Nov. 28, 2017)
- Digital Blocks DB9000 Display Controller & Processor IP Core Family Extends Leadership Across Medical, Industrial, Aerospace, Automotive, Communications, Computer, Monitor, Consumer, IoT, AR/VR Headsets, Wearables, Signage, and Cinema Applications (Nov 27, 2017)
- TTTech collaborates with Intel to develop FPGA-based TSN solution for Industrial Automation (Nov 27, 2017)
- Intrinsix Cryptographic IP Selected by DARPA for Use in Chips Program, Featuring RISC-V Security Processor (Nov 27, 2017)
- Dolphin Integration breakthrough innovation for TSMC 180 nm BCD Gen 2 process: Up to 30% savings in silicon area with the new SpRAM RHEA (Nov 27, 2017)
- EnSilica's RADAR Imaging Co-processor addresses problem of automotive data overload to accelerate development of self-drive cars (Nov 27, 2017)
- 日月光与矽品两岸布局一览：大啖AI及HPC订单 (Nov. 27, 2017)
- 美国专利局授予王成诚博士三项FPGA互连专利 (Nov. 27, 2017)
- 8论中国半导体产业 (Nov. 27, 2017)
- iPhone X大卖？富士康日产55万部 苹果向台积电追加订单 (Nov. 27, 2017)
- M31円星科技「高速SoC电路设计优化技术」 获绩优SBIR创新技术奖 (Nov. 27, 2017)
- 共享单车、智能音箱…NB-IoT杀手级应用被他承包了？ (Nov. 25, 2017)
- 惠普企业CEO闪电离职：她曾经拯救了惠普 (Nov. 24, 2017)
- 出货量暴增超5倍！无线充电市场彻底被苹果带火了 (Nov. 24, 2017)
- 东芝电子发行步进电机驱动器用于2相恒流操作 (Nov. 24, 2017)
- GUC Announces Nanjing Office Opening (Nov. 23, 2017)
- Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification and Reduces Systems Development Cost (Nov. 23, 2017)
- 电脑模块 fast-track ARM Cortex A53 / A72处理器 (Nov. 23, 2017)
- 7nm SERDES设计和资格挑战！ (Nov. 22, 2017)
- Soitec Tunes Wafers for RF, Imagers, Photonics (Nov. 22, 2017)
- Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification and Reduces Systems Development Cost (Nov. 22, 2017)
- Cybertrust Japan Selects CryptoManager IoT Security Service from Rambus (Nov. 22, 2017)
- North American Semiconductor Equipment Industry Posts October 2017 Billings (Nov. 22, 2017)
- Analyst Warns on Semiconductor Stock Valuations (Nov. 22, 2017)
- Inside Secure发布针对高速网络链路层MACsec安全IP解决方案 (Nov. 22, 2017)
- 成功案例 新思科技与AMD (Nov. 21, 2017)
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- 2017全球半导体排名洗牌：三星取代英特尔成龙头 (Nov. 21, 2017)
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- 向建军： IoT浪潮下的机遇和挑战|锐成芯微现场 (Nov. 21, 2017)
- 2017年全球60家潜力新创公司榜单出炉：谁能成为下一个Intel或ARM？ (Nov. 21, 2017)
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- Broadcom Announces Industry's First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking Applications (Nov. 21, 2017)
- Overall GPU shipments increased 9.3% from last quarter, AMD increased 8% Nvidia increased 30% (Nov 21, 2017)
- Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time (Nov 21, 2017)
- Embedded Tools provider Ashling joins RISC-V Foundation (Nov. 20, 2017)
- Synapse Design Acquires Tech Vulcan to Address Fast Growth and Provide Increased Customer Access to Design Centers (Nov. 20, 2017)
- Argonne to install Comanche system to explore ARM technology for high-performance computing (Nov. 20, 2017)
- Andes and Imperas Partner to Deliver Models and Virtual Platforms for Andes RISC-V Cores (Nov. 20, 2017)
- iPhone X's TrueDepth Module Dissected (Nov. 20, 2017)
- Marvell and Cavium to Combine Creating an Infrastructure Solutions Powerhouse (Nov. 20, 2017)
- Huawei Unveils Xilinx FPGA-Powered Cloud Server to North America at SC17 (Nov. 20, 2017)
- Cadence Appoints Anirudh Devgan as President (Nov. 20, 2017)
- AI to Spur Uptick in ASIC Design Starts (Nov. 20, 2017)
- Andes Announces Advanced SoC Development Environments for V5 AndesCore N25 and NX25 Processors with Tool Partners (Nov. 20, 2017)
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- Samsung Forecast to Top Intel as the #1 Semiconductor Supplier in 2017 (Nov. 20, 2017)
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- Global Unichip Successfully Tapes Out 16nm TCAM Compiler (Nov. 16, 2017)
- UltraSoC will again be attending and participating in the latest (7th) RISC-V Workshop (Nov. 16, 2017)
- Faraday Unveils M1+ Library with Enhanced Routability on UMC 28HPC Process (Nov. 16, 2017)
- Enyx Premieres the First TCP and UDP Offload Engines for Intel Stratix 10 FPGA On REFLEX CES XpressGXS10-FH200G Board (Nov. 16, 2017)
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- Arm to Discuss the Coming Era of Fog Computing in IoT During Keynote at IoT Evolution Expo (Nov. 16, 2017)
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- Samsung's Capex Seen Crushing Memory Startups (Nov. 15, 2017)
- Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC (Nov. 15, 2017)
- Inside Secure Joins RISC-V Foundation (Nov. 15, 2017)
- Inside Secure Unveils Industry's First Root-of-Trust Solution based on RISC-V Processor (Nov. 15, 2017)
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- Cray building ARM-based supercomputer (Nov. 14, 2017)
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- Synopsys and CEA Announce Partnership to Develop Emulation Solutions for Automotive Applications (Nov. 13, 2017)
- Samsung Shows EUV Design at ISSCC (Nov. 13, 2017)
- Arm Launches New Platform Security Framework PSA for IoT Products (Nov. 13, 2017)
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- China Passes U.S. in Supercomputers (Nov. 13, 2017)
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- Qualcomm Datacenter Technologies Announces Commercial Shipment of Qualcomm Centriq 2400 - The World's First 10nm Server Processor and Highest Performance Arm-based Server Processor Family Ever Designed (Nov. 08, 2017)
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- GUC Monthly Sales Report - Oct 2017 (Nov. 06, 2017)
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- Crypto Bugs in IEEE Standard Expose Intellectual Property in Plaintext (Nov. 04, 2017)
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- Synopsys to Pay $565 Million for Security Software Firm (Nov. 03, 2017)
- Renesas Electronics has introduced 3D graphics dashboards to entry-level models with its R-Car D3 SoC (Nov. 03, 2017)
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- Higher DRAM Bit Growth Seen For 2018 (Nov. 02, 2017)
- Faraday Reports EPS NT$0.50 for Third Quarter 2017 Gross Margin 52.5%, Reaches a 3 Year-High (Nov. 02, 2017)
- Xilinx Announces Appointment of Two New Directors (Nov. 02, 2017)
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- Apple May Drop Qualcomm Chips (Nov. 02, 2017)
- Synopsys to Enhance Software Integrity Platform with Acquisition of Black Duck Software (Nov. 02, 2017)
- Andes, Rockchip to Join FD-SOI Club (Nov. 02, 2017)
- FADU Completes Verification of next generation NVMe eSSD using S2C's Prodigy Virtex UltraScale Prototyping Platform (Nov. 02, 2017)
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- Synopsys 密码IP软件库通过NIST验证测试, 加速 FIPS 140-2认证 (Nov. 01, 2017)
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- Hardent Delivers Interoperable VESA DSC IP Solution for the New Arm Mali-D71 Processor (Nov. 01, 2017)
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- OmniPHY to Demonstrate Automotive Design Solutions at IEEE-SA Automotive Ethernet Technology Day (Oct. 30, 2017)
- 19 Views of Arm Tech Con 2017 (Oct. 30, 2017)
- Online BOM calculator simplifies costing process for IIoT custom ICs (Oct. 30, 2017)
- Global Semiconductor Industry Posts Highest-Ever Quarterly Sales (Oct. 30, 2017)
- Thoughts on Jem Davies leading Arm's machine learning group (Oct. 30, 2017)
- China FPGA strategy takes shape (Oct. 30, 2017)
- Arm launched platform security architecture PSA for the establishment of industry-wide framework for the trillions of interconnected devices (Oct. 29, 2017)
- Vidatronic Announces Flexsupply Family of Switched-Capacitor DC-DC Converter IP Cores (Oct. 27, 2017)
- Custom Blocks -The Key Ingredients for Embedded FPGA Success, Achronix's Speedcore embedded FPGAs utilize custom blocks to deliver high-performance ASICs. (Oct. 27, 2017)
- IoT May Need Sub-50-Cent SoCs (Oct. 27, 2017)
- Renesas Electronics and ASTC accelerate software development for smart cameras with R-Car V3M virtual platform (Oct. 27, 2017)
- STMicro Sees Growth Across the Board (Oct. 27, 2017)
- NetSpeed and UltraSoC partner to accelerate development time for complex SoCs (Oct. 26, 2017)
- Intel Enables 5G, NFV and Data Centers with High-Performance, High-Density ARM-based Intel Stratix 10 FPGA (Oct. 26, 2017)
- Arm CEO Sounds Security Alarm (Oct. 26, 2017)
- Arm Unveils New AI Group (Oct. 26, 2017)
- Here's Why Taiwan Semiconductor Manufacturing Co. Ltd.'s 16-Nano Shipments Dropped (Oct. 26, 2017)
- UPDATE 1-China Everbright, VC firm Walden launch $500 mln semiconductor fund (165) (Oct. 26, 2017)
- Dialog becomes the Xilinx management partner on SoC and FPGA-leading power (Oct. 26, 2017)
- Sonics And Moortec Partner To Provide Temperature-Compensated DVFS Capability For SoC And MCU Designers (Oct. 25, 2017)
- Bringing an additional layer of fortification to SoCs powering the next trillion connected devices (Oct. 25, 2017)
- Global Unichip Achieves Critical ISO 13485:2016 Certification for Medical Device Components (Oct. 25, 2017)
- PCI-SIG Releases PCIe 4.0, Version 1.0 (Oct. 25, 2017)
- Bitmain Introduces Its First Hardware for Accelerating Artificial Intelligence (AI) Applications (Oct. 25, 2017)
- eMemory Unveils Auto-Grade EEPROM IP with over 500K Cycle Endurance (Oct. 24, 2017)
- Andes 32-bit CPU IP Cores Implemented on GLOBALFOUNDRIES 22FDX Process Technology (Oct. 24, 2017)
- Fast Processor Models of Latest Arm Cores Released by Imperas and Open Virtual Platforms (OVP) (Oct. 24, 2017)
- Cadence and Arm Deliver First SoC Verification Solution for Low-Power, High-Performance Arm-Based Servers (Oct. 24, 2017)
- Flex Logix Demonstrates Flexible Microcontroller at Arm TechCon (Oct. 24, 2017)
- New ASIL-B Ready ISO 26262 Certified VESA DSC IP Cores Launched by Hardent (Oct. 24, 2017)
- asicNorth announces immediate availability of its IoT Endpoint ASIC Platform (Oct. 24, 2017)
- HEVC Advance Announces Revised Royalty Rates for Lower-Priced Devices (Oct. 24, 2017)
- Apple Talks About Sole Sourcing from TSMC (Oct. 24, 2017)
- PLDA GROUP Announces Divestiture of REFLEX CES, Enabling an Increased Focus on Its Core Activities and Investments in High Potential Business Segments (Oct. 24, 2017)
- UltraSoC appoints Alberto Sangiovanni-Vincentelli as Chairman (Oct. 24, 2017)
- BrainChip Ships First BrainChip Accelerator To a Major European Car Maker for Evaluation in ADAS and AV Systems (Oct. 24, 2017)
- Lauterbach and SiFive Bring TRACE32 Support for High-Performance RISC-V Cores (Oct. 24, 2017)
- 力旺電子推出最新車規嵌入式EEPROM IP編寫次數達50萬次以上 (Oct. 24, 2017)
- RAPID SOC PROOF-OF-CONCEPT FOR ZERO COST (Oct. 23, 2017)
- Lowering Barriers to Entry for ASICs (Oct. 23, 2017)
- 90% Reduction in power consumption for RFID chips with Dolphin Integration's SESAME eLC standard cell library (Oct. 23, 2017)
- TSMC head optimistic about future of semiconductor market (Oct. 23, 2017)
- Menta Joins GLOBALFOUNDRIES' FDXcelerator Partner Program (Oct. 23, 2017)
- Rambus Reports Third Quarter 2017 Financial Results (Oct. 23, 2017)
- Guardtime and Intrinsic ID Awarded Dutch Government Contract for Distributed Energy Marketplace via a Decentralized Trading Platform (Oct. 23, 2017)
- Silvaco Introduces Arm Cortex M0-based I3C Sensor Subsystem (Oct. 23, 2017)
- 高层视角：格芯FDX™技术良性循环的开端 (Oct. 23, 2017)
- Arm and Hackster.io announce the Arm Innovator Program (Oct. 20, 2017)
- QuickLogic to Showcase Latest eFPGA and Sensor Processing Solutions at ARM TechCon 2017 (Oct. 20, 2017)
- ST's low-power fabs are just what Europe needs (Oct. 19, 2017)
- M31 Technology and Corigine have launched the world's first USB-IF certified 28 nm Superspeed+ USB 3.1 Gen 2 IP Solution (Oct. 19, 2017)
- Microsemi's Lowest Power, Cost-Optimized Mid-Range PolarFire FPGAs Achieve Key Milestone by Passing PCI SIG's PCIe Endpoint Compliance Suites (Oct. 19, 2017)
- TSMC Reports Third Quarter EPS of NT$3.47 (Oct. 19, 2017)
- IC Insights Raises 2017 IC Market Forecast to +22% (Oct. 19, 2017)
- CEVA and Cyberon Partner for Ultra-low Power Always-listening Voice Activation Solution (Oct. 19, 2017)
- Inside Secure brings to market industry's only complete and fully-certified cloud-based mobile payment solution (Oct. 19, 2017)
- Microsemi Launches Mi-V Ecosystem to Accelerate Adoption of RISC-V (Oct. 19, 2017)
- Xylon Showcases the New Modular Video Data Logger at Automotive Testing Expo North America 2017 (Oct. 19, 2017)
- Xylon Presents New Modular Video Logger (Oct. 19, 2017)
- Rambus Validates Interoperability of DDR4 High-performance Memory IP Solution for Arm-based Datacenter Systems (Oct. 19, 2017)
- ArterisIP Acquires iNoCs Software and Associated Intellectual Property Rights (Oct. 19, 2017)
- 円星科技和芯启源合作推出通过USB-IF认证的 全球第一个28纳米超高速USB 3.1（主机端与装置端）IP解决方案 (Oct. 19, 2017)
- Samsung Completes Qualification of 8nm LPP Process (Oct. 18, 2017)
- Corigine Unveils First Certified SuperSpeed+ USB 3.1 Gen 2 IP With M31 28nm PHY (Oct. 18, 2017)
- Allegro DVT Releases a New Generation of Encoder IPs (Oct. 18, 2017)
- Synopsys and NXP Extend Multiyear Automotive Center of Excellence Collaboration for NXP S32 Automotive Processing Platform (Oct. 18, 2017)
- Samsung Secures IoT Node-to-Cloud (Oct. 18, 2017)
- CEVA and Brodmann17 Partner to Deliver 20 Times more AI Performance for Edge Devices (Oct. 18, 2017)
- China Semiconductor Fab Equipment Spending Forecasted to Over Than $12 Billion (Oct. 18, 2017)
- CAST Introduces GZIP Accelerator Through New Intel FPGA Data Center Acceleration Ecosystem (Oct. 17, 2017)
- REFLEX CES Partners with NOLAM EMBEDDED SYTEMS to Provide Integrated CANbus IP Core Solutions on FPGA COTS Boards (Oct. 17, 2017)
- sureCore Joins GLOBALFOUNDRIES FDXcelerator Partner Program (Oct. 17, 2017)
- Mixel's MIPI C-PHY/D-PHY Combo IP is Silicon-Proven in Multiple Nodes (Oct. 17, 2017)
- Synopsys Expands DesignWare IP Portfolio with Acquisition of Sidense Corporation (Oct. 17, 2017)
- Achronix Speedcore Custom Blocks Supercharge Data Acceleration Systems (Oct. 17, 2017)
- Intel to Battle in FPGA-as-a-Service Race (Oct. 17, 2017)
- CEVA and LG Electronics Partner for Smart 3D Camera Solution (Oct. 17, 2017)
- Montage Technology Licenses Allegro DVT's Latest Multi-Format Video Encoder IP for Next Generation Set-Top Box Chips (Oct. 17, 2017)
- CENTRI Announces Immediate Availability of IoT Advanced Security for the Arm Mbed IoT Device Platform (Oct. 17, 2017)
- Gartner Says Worldwide Device Shipments Will Increase 2.0 Percent in 2018, Reaching Highest Year-Over-Year Growth Since 2015 (Oct. 17, 2017)
- 新思科技收购Sidense，扩大DesignWare IP产品组合 (Oct. 17, 2017)
- Dolphin Integration Joins GlobalFoundries FDXcelerator Program to Provide Breakthrough Fabric IP (Oct. 16, 2017)
- Wafer Shipments Forecast to Increase in 2017, 2018 and 2019 (Oct. 16, 2017)
- NXP Announces New Automotive Processing Platform that Brings Future Vehicles to Market Faster (Oct. 16, 2017)
- Open-Silicon to demonstrate its IoT Edge SoC Platform Solution, IoT Gateway SoC Reference Design and Comprehensive HBM2 IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+ at ARM TechCon 2017 (Oct. 16, 2017)
- Codasip Hires IP Industry Veteran Chris Jones as Vice President of Marketing (Oct. 16, 2017)
- 赵海军、梁孟松博士受任中芯国际联合首席执行官兼执行董事 (Oct. 16, 2017)
- IC Makers Maximize 300mm, 200mm Wafer Capacity (Oct. 13, 2017)
- Intel FPGAs Power Acceleration-as-a-Service for Alibaba Cloud (Oct. 13, 2017)
- 意法半导体(ST)将其独有的开发生态环境与阿里AliOS操作系统完美结合 (Oct. 13, 2017)
- Gartner Says Worldwide Semiconductor Revenue to Reach $411 Billion in 2017 (Oct. 12, 2017)
- S3 Semiconductors selected to advance Satellite Transceiver Technology in ESA ARTES Partner Programme (Oct. 12, 2017)
- Imec and Analog Devices sign strategic research partnership for development of next-generation IoT devices (Oct. 12, 2017)
- 本周新闻概述 (Oct. 12, 2017)
- Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX Process Technology (Oct. 12, 2017)
- Rambus Delivers High-Speed SerDes Interface Solutions on GLOBALFOUNDRIES FX-14 ASIC Platform for Data Center and Enterprise (Oct. 12, 2017)
- Xilinx Selected by Alibaba Cloud for Next-Gen FPGA Cloud Acceleration (Oct. 12, 2017)
- CEO interview: S3 Semi ready for custom opportunity (Oct. 12, 2017)
- ST to build two new 300mm fabs (Oct. 11, 2017)
- Mobiveil Announces 25xN RapidIO Specification 4.1 (25G) Digital Controller IP for Next-Generation Wireless Networking, High-Performance Computing Applications (Oct. 11, 2017)
- QuickLogic Partners with AcconSys to Expand eFPGA Design Activity in China (Oct. 11, 2017)
- Cadence Achieves TUV SUD's First Comprehensive "Fit for Purpose - TCL1" Certification in Support of Automotive ISO 26262 Standard (Oct. 11, 2017)
- Lauterbach debugger targets 64-bit ARM and Intel chips in cars (Oct. 11, 2017)
- Sankalp Semiconductor receives investment from Stakeboat Capital Fund (Oct. 11, 2017)
- Taiwan Hits Qualcomm With $774 Million Fine (Oct. 11, 2017)
- Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform (Oct. 11, 2017)
- Synopsys与GLOBALFOUNDRIES合作开发22 FDX®工艺的DesignWare IP (Oct. 11, 2017)
- 台积电3nm Fab可能要花200亿美元，大陆赶上需几年？ (Oct. 10, 2017)
- 倍赛达让客户通过Arm DesignStart计划使基于Arm定制ASIC更加易于实现 (Oct. 10, 2017)
- 圈子,服务,政府,看恩智浦如何打造中国汽车生态系统 (Oct. 10, 2017)
- ArterisIP Joins GLOBALFOUNDRIES FDXcelerator Partner Program (Oct. 10, 2017)
- Telco Systems, NXP and Arm Introduce New uCPE Offering (Oct. 10, 2017)
- Sandia National Laboratories Licenses Flex Logix's Embedded FPGA IP For Multiple Products (Oct. 10, 2017)
- NAGASE Partners with Accelize Extending FPGA Acceleration-as-a-Service to Complex Data Analytics (Oct. 10, 2017)
- Imaging SOCs from ON Semiconductor Enable Big Vision with Smaller Automotive Cameras (Oct. 10, 2017)
- Magna Joins The BMW Group, Intel and Mobileye Platform as an Integrator to Bring Autonomous Driving Technology to the Market (Oct. 10, 2017)
- ACTT's Complete IoT Solution Now Available on SMIC 55nm eFlash Platform (Oct. 10, 2017)
- Samsung's New Image Sensors Bring Fast and Slim Attributes to Mobile and IoT Applications (Oct. 10, 2017)
- 格芯推出面向下一代移动和5G应用的8SW RF-SOI技术 (Oct. 09, 2017)
- Near zero power consumption for RFID chips with Dolphin Integration's SESAME eLC standard cell library (Oct. 09, 2017)
- SoC-e releases Multiport Time Sensitive Networking (TSN) IP Core (Oct. 09, 2017)
- AImotive Highlights Significant Limitations In Hardware And Benchmarks For Fully Autonomous Vehicles (Oct. 09, 2017)
- Dialog Semiconductor is acquiring Silego for up to $306 million in IoT push (Oct. 09, 2017)
- 独家对话Imagination买家，了解收购案内情 (Oct. 09, 2017)
- TSMC's 3nm Fab Could Cost $20 Billion (Oct. 09, 2017)
- Foundries Target China (Oct. 06, 2017)
- Faraday Monthly Consolidated Sales Report - September 2017 (Oct. 06, 2017)
- UMC Reports Sales for September 2017 (Oct. 06, 2017)
- TSMC September 2017 Revenue Report (Oct. 06, 2017)
- Pure-Play Foundries Boosting Their Presence in China (Oct. 05, 2017)
- Renesas automotive chips make most of Android for cars (Oct. 05, 2017)
- 32bit ARM power in a tiny wearable, sewable, package (Oct. 05, 2017)
- Synopsys Delivers Industry's First USB 3.2 Verification IP and Test Suite for Higher Performance USB Designs (Oct. 05, 2017)
- NetSpeed's Turing Brings Machine Learning to SoC Design (Oct. 05, 2017)
- ArterisIP announces Ncore 3 Cache Coherent Interconnect (Oct. 04, 2017)
- SiFive Launches First RISC-V Based CPU Core with Linux Support (Oct. 04, 2017)
- How to control automotive complexity (Oct. 04, 2017)
- NXP® Unveils Highest Performance Layerscape® Networking and Data Center Offload System-on-Chip Solution (Oct. 04, 2017)
- Smooth Succession Expected at TSMC (Oct. 04, 2017)
- IoT: Is privacy a priority or an afterthought? (Oct. 04, 2017)
- 利用低功耗蓝牙模块简化和加速物联网设计 (Oct. 03, 2017)
- Intel Offers Innovative Approach to IoT Scaling and Security (Oct. 03, 2017)
- Xilinx joins Linaro (Oct. 03, 2017)
- Inside Secure and Toshiba Information Systems (Japan) Deepen Cooperation to Provide Embedded Security to Japanese Market (Oct. 03, 2017)
- Silicon Creations Named 2017 TSMC Partner of the Year for Analog Mixed Signal IP (Oct. 03, 2017)
- Eta Compute's David Baker, Ph.D. To Present On Low-Power IP For The Internet of Things At Arm TechCon October 25 (Oct. 03, 2017)
- STMicroelectronics and Objenious Collaborate to Speed Connection of IoT Nodes to LoRa® Networks (Oct. 03, 2017)
- Xilinx Delivers Zynq UltraScale+ RFSoC Family Integrating the RF Signal Chain for 5G Wireless, Cable Remote-PHY, and Radar (Oct. 03, 2017)
- Cadence Genus Synthesis Solution Enables Fuji Xerox to Improve Multi-Functional Printer SoCs Design Development (Oct. 02, 2017)
- 莱迪思携手Helion推出开箱即用的ISP解决方案，加速嵌入式视觉应用设计 (Oct. 02, 2017)
- Intel Eases Use of FPGA Acceleration: Combines Platforms, Software Stack and Ecosystem Solutions to Maximize Performance and Lower Data Center Costs (Oct. 02, 2017)
- Q&A: Ray Bingham on Canyon Bridge, Imagination (Oct. 02, 2017)
- TSMC Dr. Morris Chang Announces Retirement in June 2018. Future Dual Leadership Will Be Mark Liu as Chairman And C.C. Wei as CEO. (Oct. 02, 2017)
- Monthly Semiconductor Sales Reach $35 Billion Globally for First Time in August (Oct. 02, 2017)
- Semiconductor Sales Rose 25% in August, DRAM Spiked 85%; Can Sales Keep Rising? (Oct. 02, 2017)
- 格芯CEO：FD-SOI是中国需要的技术 (Oct. 01, 2017)
- TSMC to Build 3nm Fab in Tainan Science Park (Sept. 29, 2017)
- INVECAS, Inc. and Avery Design Systems Collaborate on LPDDR4/3 PHY, VIP Solutions (Sept. 29, 2017)
- Dialog Semiconductor releases BLE-enabled SoCs for automotive tire pressure monitoring systems (Sept. 29, 2017)
- SMIC and Sanechips (ZTE Microelectronics) Announce the First Commercial NB-IoT Chip Designed and Manufactured in Mainland China (Sept. 28, 2017)
- Tessera Files Legal Proceedings Against Samsung for Patent Infringement (Sept. 28, 2017)
- Trusted IoT Alliance formed to add Blockchain layer to enterprise IoT products/services (Sept. 28, 2017)
- TowerJazz and Crocus Expand Presence in Magnetic Sensors Market through Successful Licensing of Crocus' IP and Volume Manufacturing by TowerJazz (Sept. 27, 2017)
- SiFive Joins TSMC IP Alliance Program (Sept. 27, 2017)
- Kilopass Technology Announces Design Win in Next Generation Nuvoton Embedded Controllers Targeting Desktop and Mobile computers (Sept. 27, 2017)
- Partnership Puts ReRAM in SSDs (Sept. 27, 2017)
- Faraday Launches SoReal! 2.0 Virtual Platform to Support Its FPGA Board for Early SoC Software Development (Sept. 27, 2017)
- SecureRF and Intel Collaboration Delivers Future-Proof FPGA Security Solutions (Sept. 27, 2017)
- Mn_nH release stereo 3D 360 stitching IP solution for high-end 3D VR camera (Sept. 27, 2017)
- DENSO Licenses NetSpeed IP for use in Advanced Automotive Platform SoCs (Sept. 27, 2017)
- MIPS: Underdog or Dead Horse? (Sept. 27, 2017)
- 智原SoReal! 2.0虚拟平台扩增硬件整合功能，加速SoC软件提前开发 (Sept. 27, 2017)
- What's New With Cadence PCI Express IP? Almost Everything! (Sept. 26, 2017)
- Synopsys新型ARC安全IP子系统：解决嵌入式SIM卡及其他重要嵌入式应用程序安全威胁 (Sept. 26, 2017)
- 中资凯桥资本宣布5.5亿英镑收购英国半导体公司 (Sept. 26, 2017)
- USB-IF Announces USB 3.2 Specification Published (Sept. 26, 2017)
- Xilinx joins Linaro (Sept. 26, 2017)
- Pixelworks Licenses ArterisIP FlexNoC Interconnect IP Again for Advanced Video Processing SoCs (Sept. 26, 2017)
- Efinix Completes $9.5M Funding Round (Sept. 26, 2017)
- Samsung Announces Industry's First Embedded eUFS Solution For Next-Gen Automotive Applications (Sept. 26, 2017)
- Samsung Certifies Synopsys Design Platform for 28nm FD-SOI Process Technology (Sept. 25, 2017)
- Samsung Expands FD-SOI Process Technology Leadership and its Design Ecosystem Readiness (Sept. 25, 2017)
- CCww's NB-IOT R13 Protocol-stack software is licensed by a leading IoT Chip developer (Sept. 25, 2017)
- New Development Kit from Xylon Accelerates Design of Embedded Multi-Camera Vision Systems (Sept. 25, 2017)
- 利用硬件安全模块将安全性置入你的系统级芯片（SoC） (Sept. 22, 2017)
- Imagination Technologies: Sale of MIPS and update on Formal Sale Process (Sept. 22, 2017)
- Imagination reveals PowerVR Neural Network Accelerator (NNA) with 2x the performance and half the bandwidth of nearest competitor (Sept. 21, 2017)
- Mentor Precision Synthesis announces support for the eFPGA fabric in Silicon Mobility's OLEA automotive IC (Sept. 21, 2017)
- Globalfoundries Reportedly Asks EU to Probe TSMC (Sept. 21, 2017)
- Synopsys Design Platform Certified by GLOBALFOUNDRIES for 22nm FD-SOI Process Technology (Sept. 20, 2017)
- GLOBALFOUNDRIES Announces Availability of Embedded MRAM on Leading 22FDX FD-SOI Platform (Sept. 20, 2017)
- GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance Applications (Sept. 20, 2017)
- Leading-Edge Paves the Way For Pure-Play Foundry Growth (Sept. 20, 2017)
- Rambus Announces Industry's First Functional Silicon of Server DIMM Buffer Chipset Targeted for Next-generation DDR5 (Sept. 20, 2017)
- videantis receives growth financing from eCAPITAL to accelerate market penetration in embedded vision and autonomous driving (Sept. 20, 2017)
- MIPI Alliance to Host DevCon Event in the Heart of Taiwan's High-Tech Sector: Hsinchu City (Sept. 20, 2017)
- 最新Cadence Allegro DesignTrue DFM技术全面加速产品开发及上市流程 (Sept. 20, 2017)
- Embedded FPGAs from Menta qualified for GLOBALFOUNDRIES' Advanced 14nm FinFET and 32nm SOI Process Technologies (Sept. 19, 2017)
- Intel Custom Foundry Certifies Synopsys Design Platform for Intel's 22nm FinFET Low Power Process Technology (Sept. 19, 2017)
- Intel Technology and Manufacturing Day in China Showcases 10 nm Updates, FPGA Progress and Industry's First 64-Layer 3D NAND for Data Center (Sept. 19, 2017)
- Cadence Full-Flow Digital and Signoff Tools and Custom/Analog Tools Certified and Enabled for Intel 22FFL Process Technology (Sept. 19, 2017)
- ArterisIP Ncore Cache Coherent Interconnect and Resilience Package Licensed by NXP (Sept. 19, 2017)
- Synopsys' New ARC Secure IP Subsystem Addresses Security Threats in Embedded SIM and Other High-Value Embedded Applications (Sept. 19, 2017)
- Intel and Waymo team up on driverless cars (Sept. 19, 2017)
- CoreHW accelerates growth - Panostaja invests in CoreHW by purchasing a majority shareholding (Sept. 19, 2017)
- CommSolid is now a Member of 3GPP and ETSI (Sept. 19, 2017)
- The U.S., China and the Chip Industry (Sept. 19, 2017)
- 灿芯半导体、中芯国际及Synopsys合作开发物联网低功耗平台 (Sept. 18, 2017)
- Synopsys' New ARC IoT Development Kit Accelerates Software Development for Sensor Fusion, Voice Recognition and Face Detection Designs (Sept. 18, 2017)
- 莱迪思半导体iCE40 FPGA为SteamVR跟踪平台实现低延迟的同步传感器数据处理功能 (Sept. 18, 2017)
- Cadence Recognized with Three TSMC Partner of the Year Awards (Sept. 18, 2017)
- TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event (Sept. 18, 2017)
- CEVA Named in Fortune's 2017 100 Fastest-Growing Companies List (Sept. 18, 2017)
- Cellular Puts IoT on Speed Dial (Sept. 18, 2017)
- Mentor emulation platform receives safety certificate (Sept. 18, 2017)
- SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology (Sept. 15, 2017)
- Synopsys成功完成台积公司7纳米FinFET制程IP组合的投片 (Sept. 15, 2017)
- iPhone X chip shows problems of Imagination (Sept. 15, 2017)
- TSMC Updates its Silicon Menu (Sept. 14, 2017)
- Flex Logix Wins TSMC Open Innovation Platform Partner Of The Year Award 2017 (Sept. 14, 2017)
- eMemory Receives 2017 TSMC IP Partner Award (Sept. 14, 2017)
- China condemns protectionism after Lattice deal blocked (Sept. 14, 2017)
- Chip Consolidation Nearly Over, Analyst Says (Sept. 14, 2017)
- PLDA Further Strengthen Partner Ecosystem, Unveils Comprehensive PCIe PHY and Controller integrated Solutions, to be Presented at IP-SoC China 2017 (Sept. 13, 2017)
- Synopsys and Alango Technologies Introduce Voice Enhancement Package Optimized for DesignWare ARC Data Fusion IP Subsystem (Sept. 13, 2017)
- Arrows all-in-one IoT platform has Renesas Synergy MCU and Bosch sensors (Sept. 13, 2017)
- Cadence Introduces the Conformal Smart Logic Equivalence Checker (Sept. 13, 2017)
- eSilicon tapes out deep learning ASIC (Sept. 13, 2017)
- Lattice Semiconductor and Canyon Bridge Capital Partners, LLC Announce Termination of Merger Agreement Following Decision from President Trump (Sept. 13, 2017)
- Xilinx、Arm、Cadence和台积共同宣布构建首款基于7纳米工艺的CCIX测试芯片 (Sept. 12, 2017)
- Creonic Joins Consortium to Develop FEC Codes for Beyond-5G Tb/s Use Cases (Sept. 12, 2017)
- QuickLogic First to Offer eFPGA Technology on SMIC 40nm Low Leakage Process (Sept. 12, 2017)
- Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution (Sept. 12, 2017)
- Nextchip License CEVA Imaging and Vision Platform for ADAS Vision System (Sept. 12, 2017)
- Samsung Strengthens Advanced Foundry Portfolio With New 11nm LPP and 7nm LPP With EUV Technology (Sept. 12, 2017)
- Synopsys and TSMC Collaborate to Develop DesignWare Foundation IP for Low-Power TSMC 40-nm eFlash Processes (Sept. 12, 2017)
- Mobiveil Inc. and Crossbar Inc. Announce Partnership to Apply Mobiveil's NVMe Solid State Drive IP to Crossbar's ReRAM IP blocks (Sept. 12, 2017)
- EEMBC Benchmark Verifies Energy Cost of Integrated Microcontroller Peripherals (Sept. 12, 2017)
- Sidense and Intellitech collaborate on Electronic Chip IDs, anti-counterfeiting and semiconductor security for Secure Supply Chain Enablement (Sept. 12, 2017)
- Codeplay adds support to Renesas R-Car platform (Sept. 12, 2017)
- NXP Tackles V2X, Unveils 'Vision' Roadmap (Sept. 12, 2017)
- Fab Equipment Spending Breaking Industry Records (Sept. 12, 2017)
- Silicon Creations Celebrates 100th Tape-Out of Its PLL in TSMC 28nm Process Technology (Sept. 11, 2017)
- Synopsys Successfully Tapes Out Broad IP Portfolio for TSMC 7-nm FinFET Process (Sept. 11, 2017)
- Synopsys' IC Compiler II Completes Certification for TSMC's 12-nm Process Technology (Sept. 11, 2017)
- Cadence Collaborates with TSMC to Advance 7nm FinFET Plus Design Innovation (Sept. 11, 2017)
- SEMI Reports Second Quarter 2017 Worldwide Semiconductor Equipment Figures; Record Quarterly Billings of $14.1 Billion (Sept. 11, 2017)
- PLDA Announces Industry's First Controller for FPGA supporting PCIe 4.0 v0.9, Allowing immediate PCIe 4.0 implementation into FPGAs (Sept. 11, 2017)
- Image Matters Delivers Disruptive Innovation with PathPartner (Sept. 11, 2017)
- PathPartner Technology and Accelize Announce Availability of HEVC / H.265 FPGA Decoder for QuickPlay Development Platform (Sept. 11, 2017)
- Inside Secure Announces Successful Fundraising of 16M Euros (Sept. 11, 2017)
- S3 adds custom chip business model (Sept. 11, 2017)
- Arastu Systems releases R-DIMM and LR-DIMM support for its DDR4 Controller (Sept. 08, 2017)
- 台積公司2017年8月營收報告 (Sept. 08, 2017)
- UMC Reports Sales for August 2017 (Sept. 08, 2017)
- Sital Technology and Logicircuit to Provide DO-254 Certified IP Cores for Avionic Data Buses (Sept. 07, 2017)
- Barco Silex integrates new video coding technique from the latest VC-2 HQ standard. (Sept. 07, 2017)
- Cadence Delivers Comprehensive IP Portfolio for TSMC 16FFC Automotive Design Enablement Platform (Sept. 07, 2017)
- Kilopass Ultra-Low Power OTP NVM Provides Storage for Northrop Grumman Advanced Silicon Processor That Prevents Counterfeit Electronic Parts Entering DoD Supply Chains (Sept. 06, 2017)
- Imec Reports World-Class Low-Power IP Blocks for 5G (Sept. 06, 2017)
- Menta Embeds sureCore Low Power SRAM IP on TSMC's 28nm Process (Sept. 06, 2017)
- Innosilicon Announces the World most efficient LTC Miner A4+, 550Mh, 750W (Sept. 06, 2017)
- Cadence Announces Legato Memory Solution, Industry's First Integrated Memory Design and Verification Solution (Sept. 06, 2017)
- eASIC Engages Si-Edge to Provide Additional Advanced Design Center Support in China for eASIC's Custom IC Platform (Sept. 06, 2017)
- Xilinx Powers Huawei FPGA Accelerated Cloud Server (Sept. 06, 2017)
- SILTERRA Unveils 180nm Ultra Low Leakage Technology To Position in IoT Sensor Hub IC Market (Sept. 06, 2017)
- Global Semiconductor Sales Increase 24 Percent Year-to-Year in July (Sept. 06, 2017)
- Apple vs Qualcomm: Who Extorted Whom? (Sept. 06, 2017)
- Flex Logix加入台积电IP联盟计划 (Sept. 05, 2017)
- "专精化" --半导体厂商的获利秘诀 (Sept. 05, 2017)
- Synopsys硅验证DesignWare蓝牙低功耗链路层和实体层IP取得蓝牙5标准认证 (Sept. 05, 2017)
- Achronix to Speak at D&R IP-SOC Conference in Shanghai (Sept. 05, 2017)
- GUC Monthly Sales Report - Aug 2017 (Sept. 05, 2017)
- Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology for Highly Reliable Security and ID Applications (Sept. 05, 2017)
- Conversant Announces Semiconductor Patent License Agreement With SK hynix (Sept. 05, 2017)
- Samsung SARC Selects Synopsys as Primary Verification Solution for Advanced Mobile Processor Designs (Sept. 05, 2017)
- Stratix 10 FPGA: REFLEX CES Introduces the Widest Range of Boards Based on Stratix 10 GX and SoC technology from Intel PSG (Sept. 05, 2017)
- SecureRF Joins STMicroelectronics Partner Program to Bring Security to the Smallest Devices in the IoT (Sept. 05, 2017)
- With Acquisition in Doubt, Lattice Appeals to Trump (Sept. 05, 2017)
- Cadence优化全流程数字与签核及验证套装，支持Arm Cortex-A75、Cortex-A55 CPU及Arm Mali-G72 GPU (Sept. 05, 2017)
- NFC Semicon sets a new standard for NFC Sensor Chip Solutions (Sept. 04, 2017)
- Huawei integrates AI in its latest mobile processor (Sept. 04, 2017)
- President Trump to rule on Lattice's China deal (Sept. 04, 2017)
- Most of 2017 Capital Spending Will Go to Foundry and Flash Memory (Sept. 01, 2017)
- Atomic Rules launches TimeServo System Timer IP Core for FPGA (Sept. 01, 2017)
- Leti Launches Emulator Service to Boost Roi and Speed Time to Market For European Chipmakers (Sept. 01, 2017)
- Pinnacle launches Denali-MCTM image processing IP (Aug. 31, 2017)
- ARM's embedded TLS library fixes man-in-the-middle fiddle (Aug. 31, 2017)
- Ex-Baidu Scientist Blazes AI Shortcut (Aug. 31, 2017)
- Vidatronic Partners with Avant Technology as Its Distributor for Asian Markets (Aug. 31, 2017)
- S3 Semiconductors refocuses on design-to-delivery custom chip service for industrial applications (Aug. 30, 2017)
- Faraday Launches Its New FPGA to ASIC Turnkey Service (Aug. 30, 2017)
- Qualcomm and Himax Technologies Jointly Announce High Resolution 3D Depth Sensing Solution (Aug. 30, 2017)
- Siemens expands automotive engineering software business with new takeover (Aug. 30, 2017)
- Lidar to grow strongly in automotive sensor market (Aug. 30, 2017)
- Rambus and Northwest Logic Certify Interoperability of HBM2 Interface Solution for High-performance Networking and Data Center Applications (Aug. 29, 2017)
- New MediaTek Helio Chipsets Deliver Rich Features to Booming Mid-Range Market (Aug. 29, 2017)
- Microcontroller Market revenue will reach $18.8 billion by 2024 (Aug. 29, 2017)
- Kilopass Anti-Fuse NVM OTP IP Designed into Tire Pressure Sensor SoC Manufactured on TSMC 55LP Process Node Now Shipping in High Volume (Aug. 29, 2017)
- Samsung to Invest $7 Billion in China Fab (Aug. 29, 2017)
- Synopsys Silicon-Proven DesignWare Bluetooth Low Energy Link Layer and PHY IP Achieve Bluetooth 5 Qualification (Aug. 29, 2017)
- Lattice Semiconductor Further Expands CrossLink Applications with Modular IP Cores (Aug. 29, 2017)
- China Unicom announces IoT partnership (Aug. 29, 2017)
- 莱迪思半导体通过提供模块化IP核进一步丰富了CrossLink应用 (Aug. 29, 2017)
- Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box (Aug. 28, 2017)
- Movidius Beefs up HW Acceleration in AI Chip (Aug. 28, 2017)
- Inside Secure completes the acquisition of Meontrust and enters Security-as-a-Service market (Aug. 28, 2017)
- Automotive Embedded System Market by Vehicle, Electric Vehicle, Type, Component, Application and Region - Global Forecast to 2022 (Aug. 28, 2017)
- 详解百度AI芯片架构 (Aug. 25, 2017)
- 恩智浦携手长安汽车共同打造高竞争力车载娱乐平台 (Aug. 25, 2017)
- North American Semiconductor Equipment Industry Posts July 2017 Billings (Aug. 24, 2017)
- Cambricon employs Moortec's embedded PVT Monitoring Subsystem IP to their Artificial Intelligence (AI) and Machine Learning Chips (Aug. 24, 2017)
- Sondrel Announces 10M GBP Investment in European Semiconductor Sector (Aug. 24, 2017)
- Intel Delivers Real Time AI in Microsoft's New Accelerated Deep Learning Platform (Aug. 24, 2017)
- Silvaco Announces Completion of SoC Solutions Acquisition (Aug. 24, 2017)
- Wearable device sales to grow nearly 17% in 2017, says Gartner (Aug. 24, 2017)
- Semiconductor Industry Capital Spending Forecast to Jump 20% in 2017 (Aug. 23, 2017)
- China to begin 14nm production next year (Aug. 23, 2017)
- Brite Semiconductor partners with SaberTek, Inc. to develop low-cost transceiver chips for WiSUN and 802.11ah (Aug. 23, 2017)
- Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 7FF (Aug. 23, 2017)
- Samsung Elec to make all home appliances smart embedded with AI and IoT by 2020 (Aug. 23, 2017)
- Everspin Appoints Semiconductor Storage Veteran Kevin Conley as CEO (Aug. 23, 2017)
- 灿芯半导体与SaberTek合作开发WiSUN 和 802.11ah低功耗收发器芯片 (Aug. 23, 2017)
- Hot Chips Spotlights Chip Stacks (Aug. 23, 2017)
- 保护通过USB Type-C传输的内容 (Aug. 22, 2017)
- Sino Wealth借助DesignWare蓝牙低能耗IP缩短开发时间，并满足极高的设计要求 (Aug. 22, 2017)
- R&D: 40nm Split Gate Embedded Flash Macro With Flexible 2-in-1 Architecture (Aug. 22, 2017)
- SSD Shipments Top 42 Million in 2Q17, NAND Ourput Up 6% Q/Q to 41EB (Aug. 22, 2017)
- Worldwide Semiconductor Market growth is expected to be up 17 percent in 2017 after 1.1 percent growth in 2016 (Aug. 22, 2017)
- Codasip Announces Latest RISC-V Processor (Aug. 21, 2017)
- SiFive and Rambus to Provide IP to the 'DesignShare' Economy (Aug. 21, 2017)
- Qualcomm Details ARM Server SoCs (Aug. 21, 2017)
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara (Aug. 21, 2017)
- THINCI Inc. Will Present Its Next-Generation Graph Streaming Processor Architecture At the Hot Chips Symposium (Aug. 21, 2017)
- Tower confirms Chinese fab project (Aug. 21, 2017)
- TowerJazz and Tacoma Announce a Partnership for a New 8-inch Fabrication Facility in Nanjing, China (Aug. 21, 2017)
- Taiwan government supports academic edge AI chip development project (Aug. 17, 2017)
- Qualcomm boosts machine learning capability by buying Scyfer (Aug. 17, 2017)
- Uniquify Announces Silicon Success for Latest Timing Controller (T-CON) for DTV (Aug. 16, 2017)
- Sankalp Semiconductor awarded with ISO 9001: 2015 certification (Aug. 16, 2017)
- Achronix to Attend HOT CHIPS: A Symposium on High Performance Chips (Aug. 16, 2017)
- AI Sees New Apps, Chips, says Q'comm (Aug. 16, 2017)
- IoT tech startup DeTect Technologies raises funding from CIIE, Axilor and Keiretsu (Aug. 16, 2017)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2017 (Aug. 16, 2017)
- 基于Xilinx Zynq Z7045 SoC的CNN的视觉识别应用 (Aug. 16, 2017)
- Fiat Chrysler joins autonomous driving platform from BMW / Intel / Mobileye (Aug. 16, 2017)
- Automotive Grade Linux speeds in-car infotainment developments (Aug. 16, 2017)
- DRAM, NAND Flash, Automotive Analog/Logic Among Best-Growing ICs (Aug. 15, 2017)
- LTE-enabled watches may resurrect smartwatch market, says Canalys (Aug. 15, 2017)
- SiFive Appoints Naveed Sherwani as CEO (Aug. 15, 2017)
- Semiconductor Industry Backs Trump's China Probe (Aug. 15, 2017)
- 兆易创新GD32 MCU加速物联网升级 (Aug. 15, 2017)
- Two Senior-Level Appointments Boost EnSilica's Rapidly Expanding SoC Design and Supply Services (Aug. 14, 2017)
- EnSilica and Solomon Systech in multi-year eSi-RISC licensing deal (Aug. 10, 2017)
- TSMC July 2017 Revenue Report (Aug. 10, 2017)
- GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications (Aug. 09, 2017)
- Mie Fujitsu and SST Announce Automotive Platform Development on 40 nm Technology (Aug. 09, 2017)
- UMC Reports Sales for July 2017 (Aug. 09, 2017)
- Intel Closes $15.3B Mobileye Acquisition, Touting Connected Car Business As A 'Huge Growth Opportunity' (Aug. 08, 2017)
- Synopsys and Morpho Collaborate to Accelerate Deep Learning Processing for Embedded Vision Applications (Aug. 08, 2017)
- DENSO licenses Imagination's newest MIPS CPU and PowerVR GPU to drive enhanced in-vehicle electronic processing (Aug. 08, 2017)
- IntelliProp Announces Gen-Z Persistent Memory Controller Combining DRAM and NAND (Aug. 08, 2017)
- USITC Institutes Section 337 Investigation of Certain Mobile Electronic Devices and Radio Frequency and Processing Components Thereof (Aug. 08, 2017)
- Fault tolerant VirtuosoNext RTOS for ARM Cortex-M microcontrollers (Aug. 08, 2017)
- Cadence Full-Flow Digital and Signoff and Verification Suite Optimized to Support Arm Cortex-A75 and Cortex-A55 CPUs and Arm Mali-G72 GPU (Aug. 07, 2017)
- Synopsys 16nm FinFET接口IP组合符合严格的汽车AEC-Q100 1级温度要求 (Aug. 04, 2017)
- Palma Ceia Announces Complete PHY Solution for HaLow 802.11ah, Supporting IoT WiFi Connectivity (Aug. 04, 2017)
- Mid-Year Global Semiconductor Sales Up 21 Percent Compared to 2016 (Aug. 04, 2017)
- Global Unichip Achieves SGS-TUV ISO26262 Certification (Aug. 03, 2017)
- Avery Design Systems Announces NVMe 1.3 and NVMe-MI Verification IP Updates (Aug. 03, 2017)
- Artificial Machines Standardizes on Mentor EDA Design Solutions to Develop Smart Machine IP (Aug. 03, 2017)
- Significant Mid-Year Revision to 2017 IC Market Forecast (Aug. 03, 2017)
- Mobiveil Announces FPGA-Based SSD Platform for 3D NAND Flash Devices, Upgrades NVMe, PCI Express Controllers to Support Latest Specifications (Aug. 03, 2017)
- GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry's First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles (Aug. 03, 2017)
- Gartner Says Worldwide Semiconductor Capital Spending Is Forecast to Grow 10.2 Percent in 2017 (Aug. 02, 2017)
- Vidatronic Contributes Expertise to AMD's Latest High-Performance Processors (Aug. 02, 2017)
- Image recognition processor powers active safety system (Aug. 02, 2017)
- UltraSoC delivers industry's first debug and analytics solution for ARM's AMBA 5 CHI Issue B coherency architecture (Aug. 02, 2017)
- Pixelworks Completes Acquisition of ViXS Systems (Aug. 02, 2017)
- 采用DesignStart和Cordio为你的设计解脱束缚 (Aug. 01, 2017)
- 实施安全可靠的汽车应用FPGA解决方案 (Aug. 01, 2017)
- Telink SDK supports Bluetooth mesh (Aug. 01, 2017)
- Shanghai raises $7.4bn IC promotion fund (Aug. 01, 2017)
- 麦肯锡报告：2017年机器学习和人工智能现状 (Aug. 01, 2017)
- Epostar Chooses PLDA's PCIe Controller for their Next-Generation NVMe-based SSD Controller (Aug. 01, 2017)
- CEVA Deep Neural Network Software Framework Named "2017 Most Innovative Product" by Embedded Computing Design (Aug. 01, 2017)
- Synopsys Interface IP Portfolio on 16-nm FinFET Process Meets Stringent Automotive AEC-Q100 Grade 1 Temperature Requirements (Aug. 01, 2017)
- Is Designing Your Chip Architecture Like Driving a Car with No Pedals? (Aug. 01, 2017)
- Moortec Semiconductor announces new sales representatives in Japan (Aug. 01, 2017)
- Synopsys推出完整的HBM2 IP解决方案，为图形和高性能计算SoC提供超过300GB/s的带宽 (Aug. 01, 2017)
- Azul Systems Collaborates with Qualcomm to Bring Enterprise-Grade Open Source Java on ARM to Datacenters (Jul. 31, 2017)
- Taiwan ITRI reaching out to foreign IoT start-ups (Jul. 31, 2017)
- INVECAS Acquires Lattice's HDMI Design Team and Simplay Labs Subsidiary (Jul. 31, 2017)
- AMD首席技术官谈7nm芯片设计：史上最难 (Jul. 28, 2017)
- 力旺晶片指紋IP已於聯電高階製程平台完成驗證 (Jul. 28, 2017)
- 神经网络加速器研发竞赛开始 (Jul. 28, 2017)
- eMemory Announces Validation of On-Chip Security IP on UMC Advanced Nodes (Jul. 27, 2017)
- UMC Breaks into 14nm (Jul. 27, 2017)
- Mentor supports Xilinx Zynq UltraScale+ MPSoC Platform with updated embedded platform release (Jul. 27, 2017)
- OVH and Accelize Demonstrate the Value of FPGAs in the Cloud with GZIP Compression, from CAST, Achieving Acceleration Factors of >100x (Jul. 27, 2017)
- Automotive, Industrial Continue to Drive TI's Sales Gains (Jul. 26, 2017)
- IoT Growth Slower Than Expected (Jul. 26, 2017)
- Sankalp Semiconductor to hire 300 engineers (Jul. 26, 2017)
- ST Prepares for ToF Sensor Product Ramp (Jul. 26, 2017)
- Cadence推出针对最新移动和家庭娱乐应用的Tensilica HiFi 3z DSP架构 (Jul. 26, 2017)
- Automotive, Industrial Continue to Drive TI's Sales Gains (Jul. 26, 2017)
- 微软将推二代人工智能处理器，争夺行业话语权 (Jul. 26, 2017)
- Patents Detail IoT Security Scheme (Jul. 25, 2017)
- 魏少军：机遇与挑战，中国高端芯片发展之路 (Jul. 25, 2017)
- 三星豪言五年将晶圆代工市占提至25%，台积电淡定回应 (Jul. 25, 2017)
- Value of Semiconductor Industry M&A Deals Slows Dramatically in 1H17 (Jul. 25, 2017)
- 用于优化性能、功耗和面积的7nm设计技巧 (Jul. 25, 2017)
- Synopsys Launches Complete HBM2 IP Solution Offering More Than 300 GB/s Bandwidth for Graphics and High-Performance Computing SoCs (Jul. 25, 2017)
- Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applications (Jul. 25, 2017)
- Report: Samsung Plans to Triple Foundry Market Share (Jul. 25, 2017)
- Blue Pearl Software Streamlines RTL Verification for Xilinx All Programmable FPGAs and SoCs (Jul. 25, 2017)
- Inside Secure announces new high-performance 400G MAC layer security (MACsec) IP for Datacenters and the Cloud (Jul. 24, 2017)
- 机器学习提升嵌入式视觉应用 (Jul. 24, 2017)
- 特斯拉自动驾驶仍不靠谱？那就改装一个更高阶的！ (Jul. 24, 2017)
- Second Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Continue to Ship at Record Levels (Jul. 24, 2017)
- Cadence Reports Second Quarter 2017 Financial Results (Jul. 24, 2017)
- Rambus Reports Second Quarter 2017 Financial Results (Jul. 24, 2017)
- Flex Logix's EFLX Embedded FPGA Accelerates Processor Performance By 40-100X (Jul. 21, 2017)
- HDL Design House and AFuzion Synergy to Enhance DO-254 Projects (Jul. 20, 2017)
- DRAM and NAND are Setting Record Highs This Year, IC Insights Says (Jul. 20, 2017)
- REFLEX CES Takes Its Autonomy with MBO Partenaires (Jul. 20, 2017)
- Cadence Genus Synthesis Solution Enables Toshiba to Complete a Successful ASIC Tapeout with a 2X Logic Synthesis Runtime Improvement (Jul. 20, 2017)
- Mentor 将 Veloce Strato 硬件加速仿真平台软件加入 Mentor Safe ISO 26262 验证程序 (Jul. 20, 2017)
- Design Challenge - IoT on Wheels (Jul. 20, 2017)
- Innosilicon introduces next generation X11 miner, 30.2GH at 750W (Jul. 20, 2017)
- S2C Prodigy Quad Virtex UltraScale FPGA Prototyping Logic Module Now Available for Large Scale Designs (Jul. 19, 2017)
- Arrow Electronics to Help Accelerate the Growth of Internet of Things in Asia-Pacific with its Offerings with IBM (Jul. 19, 2017)
- 全球领先，一步到位! 30.2GH Innosilicon达世大师矿机发布 (Jul. 19, 2017)
- 2017年全球半导体营收将突破4千亿美元 (Jul. 18, 2017)
- Cortex-A75 让你的智能解决方案达到前所未有的性能水平 (Jul. 18, 2017)
- Microsemi and Tamba Collaborate on New PolarFire Devices to Deliver Industry-Leading Low Power FPGA-Based 10G Ethernet Solution (Jul. 18, 2017)
- Solving Critical Bugs: Tracing from Power-Up for DesignWare ARC processors (Jul. 18, 2017)
- New software puts Bluetooth Mesh on old hardware (Jul. 18, 2017)
- IoT environmental sensor talks to the cloud (Jul. 18, 2017)
- U-blox Runs NB-IoT Lab and Field Trials with Huawei, Vivo, CAS Tecnologia and PinMyPet in Brazil (Jul. 18, 2017)
- AI Technologies Will Be in Every New Software Product by 2020 (Jul. 18, 2017)
- Renesas wins US patent infringement lawsuit (Jul. 18, 2017)
- Dolphin Integration sets up a large range of sponsored IPs at 55 nm to reduce SoC power consumption by up to 70% (Jul. 17, 2017)
- Does NVMe Have a Place in Industrial Embedded and IoT? (Jul. 17, 2017)
- Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM (Jul. 17, 2017)
- Qualcomm grabs MediaTek's China slots (Jul. 17, 2017)
- Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM (Jul. 17, 2017)
- Continental's auto-driving software gets handover issue under control (Jul. 17, 2017)
- 对人工智能芯片的思考，魏少军教授的认识绝对是最深刻的 (Jul. 14, 2017)
- Imec enables 5nm 2D FETs (Jul. 13, 2017)
- Semiconductor Content in an Electronic System will reach 28.1% in 2017, says IC Insights (Jul. 13, 2017)
- Faraday Unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD Controller (Jul. 13, 2017)
- Veriest Solutions and CEVA Collaborate for Neural Network Signal Processing IP Project (Jul. 13, 2017)
- TSMC Reports Second Quarter EPS of NT$2.56 (Jul. 13, 2017)
- TSMC Logs First 10nm Sales (Jul. 13, 2017)
- 智原推出28HPC USB 3.1 PHY与40LP Type-C PHY并整合电力传输PD控制器 (Jul. 13, 2017)
- 格芯与芯原联袂实现适合次世代物联网的单芯片解决方案 (Jul. 13, 2017)
- 芯原的Vivante视觉处理器IP助力ADAS投放大众市场 (Jul. 13, 2017)
- 自动驾驶成功的关键是什么？--深度解析 (Jul. 13, 2017)
- 新一代标准让蓝牙更强大 Tech Shenzhen 研讨会上成 (Jul. 13, 2017)
- Siri disappoints again, this time with apps (Jul. 13, 2017)
- Arasan Announces IP solutions for the Next Generation of Mobile Storage - UFS 3.0 (Jul. 12, 2017)
- VeriSilicon's Vivante Vision Processor IP Enables ADAS for Mass Market (Jul. 12, 2017)
- University of Bath to build 60m pounds automotive R&D institute (Jul. 12, 2017)
- Suppliers Beware: The Perils of Vertical Integration (Jul. 12, 2017)
- NGCodec Joins the Alliance for Open Media (Jul. 12, 2017)
- ARM Cortex-A55: 从端到云实现高效能 (Jul. 12, 2017)
- Uniquify Joins FDXcelerator Program to Deliver DDR Memory IP to GLOBALFOUNDRIES 22FDX Technology Platform (Jul. 11, 2017)
- Synopsys扩大embARC计划纳入更多ARC处理器和开源项目以加速嵌入式系统的开发 (Jul. 11, 2017)
- Gartner Says Worldwide Semiconductor Revenue to Reach $400 Billion in 2017 (Jul. 11, 2017)
- 創意電子韓國新辦公室開幕 (Jul. 11, 2017)
- 200mm Fabs Thriving; SEMI's Updated 200mm Fab Report Now Available (Jul. 11, 2017)
- STMicroelectronics Partners with Kilopass For One-Time Programmable Anti-Fuse NVM Memory (Jul. 11, 2017)
- Nagoya University and Cadence Collaborate to Port AUTOSAR-Compliant TOPPERS Automotive Kernel to Tensilica Processors and DSPs (Jul. 11, 2017)
- Embedded Security for Internet of Things Market to Widen at a CAGR of 14.6% by 2027 (Jul. 11, 2017)
- Chip Sales Now Expected to Top $400 Billion (Jul. 11, 2017)
- IP-Maker NVMe IP, ready for persistent memories (Jul. 10, 2017)
- Mali-G72 -- 让明日科技今日成真 (Jul. 10, 2017)
- 瞄准下一波高速成长市场，Synaptics获面向消费类物联网的关键技术 (Jul. 10, 2017)
- Rambus Reportedly Exploring Sale Possibilities (Jul. 10, 2017)
- 台積公司2017年6月營收報告 (Jul. 10, 2017)
- The fastest C-Compiler for i251 from Dolphin Integration is now available with our free discovery license! (Jul. 07, 2017)
- AppoTech Ltd. Selects Andes Technology Corporation N968A CPU For Its Next Generation Audio Codec (Jul. 06, 2017)
- China Makes Two IoT Calls (Jul. 06, 2017)
- ESD Alliance Reports EDA Industry Revenue Increase For Q1 2017 (Jul. 06, 2017)
- Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform (Jul. 06, 2017)
- "智能嵌入式"变身"IoT"，试试采用DesignStart和Cordio来设计 (Jul. 06, 2017)
- Panasonic IoT wireless modules pre-certified at Avnet Abacus (Jul. 06, 2017)
- Micron Fab Incident Disrupts DRAM Supply (Jul. 05, 2017)
- Samsung starts production at world's biggest fab (Jul. 05, 2017)
- Baidu Deploys Xilinx FPGAs in New Public Cloud Acceleration Services (Jul. 05, 2017)
- Bosch invests in Artificial Intelligence (Jul. 05, 2017)
- Imagination raises revenues as sale process continues (Jul. 05, 2017)
- 强势来袭，百度在全新公有云加速服务上部署Xilinx FPGA (Jul. 05, 2017)
- NXP extends software solutions for MCUs based on the Power Architecture (Jul. 05, 2017)
- 利用通过ASIL认证的IP加快汽车ADAS SoC开发 (Jul. 04, 2017)
- 汽车集成电路基础IP的基本要素 (Jul. 04, 2017)
- Microsemi宣布其最低功耗，成本优化的中档极PolarFire FPGA的工程样品可供订货 (Jul. 04, 2017)
- 国产自主物联网操作系统厂商RT-Thread获得华强聚丰及思必驰天使轮投资 (Jul. 04, 2017)
- 起来，不愿做附庸的欧洲人，用电子技术一决高下 (Jul. 04, 2017)
- Global Semiconductor Sales Increase 22.6 Percent Year-to-Year in May (Jul. 04, 2017)
- ARM buys IoT security firm Simulity for 12m Pounds (Jul. 04, 2017)
- 采用Cortex-M原型系统建立Cortex-M3 DesignStart原型 (Jul. 04, 2017)
- 大数据时代，如何同时发挥CPU与FPGA的优势？ (Jul. 04, 2017)
- Qualcomm和吉利携手共进，帮助定义联网汽车体验的未来 (Jul. 04, 2017)
- eVaderis Joins FDXcelerator Program to Deliver Memory IP to GLOBALFOUNDRIES 22FDX Technology Platform (Jul. 03, 2017)
- 百度云发布FPGA云服务器 加速人工智能应用开发 (Jul. 03, 2017)
- Cypress works with Arrow on IoT development platform (Jul. 03, 2017)
- Foresight announces sale of IoT technology business Simulity Labs Limited to ARM (Jul. 03, 2017)
- Synopsys和Mellanox演示了PCI Express 4.0主机和设备之间完善的系统互操作性 (Jul. 03, 2017)
- Synopsys嵌入式视觉处理器IP让机器学习应用的神经网络性能翻两番 (Jul. 03, 2017)
- Synopsys发布ARM AMBA 5 CHI Issue B规范的验证IP和测试套件 (Jun. 30, 2017)
- Synopsys的新超标量ARC HS处理器在高端嵌入式应用领域增强了RISC和DSP性能 (Jun. 30, 2017)
- 自动驾驶车辆平台霸主出现，其它厂商不用玩了？ (Jun. 30, 2017)
- 降低系统级风险，确保连网汽车安全 (Jun. 30, 2017)
- ARM推动物联网设备生态链创新 (Jun. 30, 2017)
- 物联网战场兵法：戒急用忍，行稳致远 (Jun. 30, 2017)
- iFLYTEK On-Device Speech Recognition Software Now Available For CEVA's Ultra-Low Power Audio/Voice DSPs (Jun. 29, 2017)
- Silicon Mobility targets German electric car makers (Jun. 29, 2017)
- VeriSilicon Unveils Vivante 2 Teraflop "MESH" Architecture Compute IP Cores for Embedded Devices (Jun. 28, 2017)
- Kyocera Selects Synopsys VC Formal for High-Performance Property Verification (Jun. 28, 2017)
- ArcSoft and CEVA Partner to Raise the Performance Level of Smartphone Cameras (Jun. 28, 2017)
- Lattice offers FPGA reference design for machine learning (Jun. 28, 2017)
- Speaker-less audio system saves weight, volume (Jun. 28, 2017)
- Exosite Collaboration with ARM Provides Secure, Full-Stack IoT Solution (Jun. 28, 2017)
- eASIC Recognizes Growth in Demand From China and Establishes eASIC Shenzhen WFOE (Jun. 28, 2017)
- Argon Design joins Alliance for Open Media, AOM (Jun. 28, 2017)
- Leti, Fraunhofer join forces on (Jun. 28, 2017)
- 芯原为嵌入式设备应用推出Vivante "MESH"架构计算IP内核 (Jun. 28, 2017)
- CEVA计算机视觉DSP助力Evodotion ROD-1 360°摄像机功能 (Jun. 27, 2017)
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- Intel FPGA Technology Supports NEC in Face Recognition Technology (Jun. 27, 2017)
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- Arastu Systems announces LPDDR3/4 Single Controller for optimal performance (Jun. 21, 2017)
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- 恩智浦和Harman深化合作，实现未来汽车互联 (Jun. 21, 2017)
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- Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node (Jun. 20, 2017)
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- Synopsys将VESA显示流压缩功能集成到DesignWare MIPI DSI IP中以支持4K超高清和更高分辨率显示 (Jun. 20, 2017)
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- Synopsys Delivers Verification IP and Test Suite for ARM AMBA 5 CHI Issue B Specification (Jun. 19, 2017)
- GUC成功推出 HBM2 全方位解決方案 (Jun. 19, 2017)
- Andes Technology Provides System Control Processor IP for Wave Computing's Revolutionary Dataflow Processing Unit Design (Jun. 19, 2017)
- ARM DesignStart 帮助您构建定制型 SoC 的 6 种方式 (Jun. 19, 2017)
- Cadence Expands Online Tool Access for ARM DesignStart Customers to Accelerate SoC Design Delivery (Jun. 19, 2017)
- Cadence针对Palladium Z1仿真平台发布VirtualBridge适配器，软件初启时间最高可缩短三个月 (Jun. 19, 2017)
- Menta Offers Validation Board for Embedded FPGA Supporting TSMC's 28nm HPC+ Process (Jun. 19, 2017)
- Shanghai Frequen Licenses and Deploys CEVA Bluetooth Low Energy IP in New IoT Product Line (Jun. 19, 2017)
- 探讨自主驾驶汽车面临的五大未解之题 (Jun. 19, 2017)
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- Avery Design Systems Unveils DDR5 VIP Solution Targeting DDR5 Design Ecosystem (Jun. 15, 2017)
- Andes Technology and M31 Technology Collaborated on Optimal Power Efficiency CPU Implementation for IoT SoC Market (Jun. 15, 2017)
- ARM模型助力Cortex-A75和Cortex-A55的软件开发及性能分析 (Jun. 15, 2017)
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- ReFLEX CES Partners with Orthogone Technologies to Provide Integrated Ethernet MAC/PCS IP Core Solutions on FPGA COTS Boards (Jun. 14, 2017)
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- ARM, Enea, Marvell and PicoCluster announce world's most compact OPNFV Pharos Lab (Jun. 13, 2017)
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- 雷诺高通联合推出动态无线充电技术 (Jun. 12, 2017)
- Barco Silex updates its 4K over 1Gb OEM solutions with new features for Pro A/V applications. (Jun. 09, 2017)
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- 物联网芯片成半导体巨头最新蛋糕，战鼓擂响，谁是最后胜利者？ (Jun. 09, 2017)
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- Synopsys Expands embARC Initiative to Include Additional ARC Processors and Open Source Projects to Accelerate Development of Embedded Systems (Jun. 08, 2017)
- ELSYS Eastern Europe Selected as Arm Approved Design Partner (Jun. 08, 2017)
- 新式AI芯片为IoT赋予机器学习功能 (Jun. 08, 2017)
- Uniquify's LPDDR4 Super Combo Interface IP in Volume Production at 28nm Low-power Node (Jun. 07, 2017)
- PLDA Announces "Inspector" - An Evolution of the PCI Express 4.0 PDK That Enables PCIe 4.0 Technology Design Validation and Performance Optimization Today (Jun. 07, 2017)
- VeriSilicon's Artificial Intelligence Engine Powers Multi-Sensory Experiences in NXP's i.MX 8 Flagship Applications Processor (Jun. 07, 2017)
- STMicroelectronics Standardizes on Synopsys VC Formal for Faster Verification Closure of Leading Microcontroller Designs (Jun. 07, 2017)
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- Faraday Monthly Consolidated Sales Report - May 2017 (Jun. 07, 2017)
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- Mentor 宣布推出适用于三星 8LPP 和 7LPP 工艺技术的 工具和流程 (Jun. 06, 2017)
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- Avery Design Systems Targets Accelerator Applications With Verification Solutions for CCIX, AMBA 5 CHI, and PCIe 4.0 (Jun. 06, 2017)
- Global Semiconductor Sales Increase 21 Percent Year-to-Year in April; Double-Digit Annual Growth Projected for 2017 (Jun. 06, 2017)
- Record Fab Spending for 2017 and 2018 (Jun. 06, 2017)
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- 惊人！Python+FPGA 实现FPGA开发大提速？！！ (Jun. 05, 2017)
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- ARM's next Mali GPU tweaks Bifrost (May. 29, 2017)
- Bosch partners with Sony for automotive HDR cameras (May. 29, 2017)
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- Foundry ecosystem extends from ASIC design to testing and fabrication (May. 16, 2017)
- Cadence Expands JasperGold Platform for Advanced Formal-Based RTL Signoff (May. 16, 2017)
- Xilinx and IBM First to Double Interconnect Performance for Accelerated Cloud Computing with New PCI Express Standard (May. 16, 2017)
- Cypress' NOR Flash into Bosch's next-gen ADAS (May. 16, 2017)
- Delphi joins autonomous driving project of BMW, Intel and Mobileye (May. 16, 2017)
- Rambus to Demonstrate CryptoManager IoT Device Management with STMicroelectronics (May. 16, 2017)
- Mocana Raises $11 Million in New Funding to Revolutionize IoT Security and Enable IoT Devices to Defend Themselves Against Cyber Attacks (May. 16, 2017)
- South Korean to create world's largest test-bed for autonomous driving (May. 15, 2017)
- 力旺最新安全IP為客戶創造強大競爭優勢 強攻物聯網市場 (May. 15, 2017)
- Rambus Launches Turnkey Secure Connectivity with CryptoManager IoT Device Management (May. 15, 2017)
- 安森美半导体在2017 IoT World重点展示多样化的关键技术 (May. 15, 2017)
- China to invest heavily into European and US tech startups, reports Bloomberg (May. 15, 2017)
- Rambus Tips IoT Security Service (May. 15, 2017)
- Imagination发布首款PowerVR Series8XT IP内核 (May. 12, 2017)
- 车用半导体标准将出炉，车企们准备好了吗？ (May. 12, 2017)
- Toyota Selects Nvidia, Intel Feels Heat (May. 11, 2017)
- 神经网络处理器将提升雷达、视觉应用的性能 (May. 11, 2017)
- Xilinx Spartan-7 FPGA 进入量产，开放订购 (May. 11, 2017)
- 可配置混合信号IC和异步状态机优化嵌入式设计 (May. 11, 2017)
- Racyics Launches "makeChip" Design Service Platform for GLOBALFOUNDRIES' 22FDX Technology (May. 10, 2017)
- X-Fab, Exagan make GaN-on-Si on 200mm wafers (May. 10, 2017)
- Cloud service takes IP to the foundry (May. 10, 2017)
- Imagination announces first PowerVR Series8XT IP core based on new Furian GPU architecture (May. 10, 2017)
- Rambus Joins Microsemi's SoC Partner Program (May. 10, 2017)
- Synopsys Announces PowerReplay Solution for Early and Fast Gate-Level Power Analysis with PrimeTime PX (May. 10, 2017)
- Algo-Logic Systems Launches Third Generation FPGA Accelerated CME Tick-To-Trade System (May. 10, 2017)
- NXP Introduces RAIN RFID Solutions with Higher Security for Emerging Inventory Management and Smart City Applications (May. 10, 2017)
- TSMC April 2017 Revenue Report (May. 10, 2017)
- SMIC Reports 2017 First Quarter Results (May. 10, 2017)
- SMIC Transitions CEO Responsibility to Dr. Haijun Zhao While Dr. Tzu-Yin Chiu Stays as Vice Chairman and Non-Executive Director (May. 10, 2017)
- Cadence发业界首款独立完整神经网络DSP核 (May. 10, 2017)
- 验证时代已来 Cadence开启SoC设计仿真验证新纪元 (May. 10, 2017)
- Nordic Semiconductor的nRF52832 SoC為虛擬實境體感控制器帶來先進的運動追蹤功能 (May. 10, 2017)
- 市值超英特尔，主攻7纳米的台积电正站起来反击三星 (May. 09, 2017)
- Infineon Rides Automotive Wave into Top-10 Semi Supplier Ranking (May. 09, 2017)
- 海豚集成邀您参加网络研讨会，与您探讨如何使睡眠模式下的SoC功耗低于0.5 (May. 09, 2017)
- Xilinx Spartan-7 FPGAs Now in Production (May. 09, 2017)
- 针对汽车大屏幕人机界面的最新maXTouch触摸屏控制器 (May. 09, 2017)
- 意法半导体新推出高连接性的STM32L4 物联网探索套件(B-L475E-IOT01A) (May. 09, 2017)
- UL、MIPI联盟为物联网安全做了这些事 (May. 09, 2017)
- 物联网领域研究的切入点--物联网平台 (May. 09, 2017)
- Flex Logix Raises $5 Million In Series B Funding (May. 09, 2017)
- UMC Reports Sales for April 2017 (May. 09, 2017)
- Andes, First Mainstream CPU IP Provider to Adopt RISC-V, Expands Product Line with New 64bit Processor IP (May. 09, 2017)
- Logic Fruit and Accelize Announce Strategic Partnership to deliver Next Gen IP cores (May. 09, 2017)
- Sonics And Northwest Logic Partner On High Throughput Memory Subsytem Solutions (May. 09, 2017)
- Enea Adds Support for Xilinx Zynq UltraScale+ MPSoC Devices (May. 09, 2017)
- AI and cognitive cloud computing to drive autonomous vehicles (May. 09, 2017)
- Bosch rounds up components for automated driving (May. 09, 2017)
- 中芯、台积电的好日子将到头？看日本"迷你"晶圆厂如何改变市场格局 (May. 08, 2017)
- Synopsys和jNet ThingX针对Synopsys的ARC SEM处理器优化了JavaCard操作系统 (May. 08, 2017)
- InfoSec Global和Synopsys携手交付完整的硬件/软件可信根解决方案 (May. 08, 2017)
- 英飞凌（Infineon）推出面向Xilinx Zynq UltraScale+ MPSoC的电源参考设计 (May. 08, 2017)
- Automotive Growth Pushes Infineon Into Top 10 (May. 08, 2017)
- MIPI addresses security concerns of IoT chip interfaces (May. 08, 2017)
- 芯片并行仿真技术或将成未来二十年主流 (May. 05, 2017)
- STM32 MCU峰会：重点探讨MCU的十大创新以及物联网安全应用 (May. 05, 2017)
- Imagination与苹果谈崩启动争议处理程序，将出售核心业务 (May. 05, 2017)
- TSMC Prosecutes Ex-Employee for Leaking Secrets (May. 04, 2017)
- MIPI Alliance Forms Birds of a Feather Group to Define Embedded Security Considerations for Mobile and Mobile-Influenced Designs (May. 04, 2017)
- MXT1665T maXTouch touchscreen controllers create large-screen automotive HMI (May. 04, 2017)
- Neural Network processor boosts performance of radar, lidar, vision applications (May. 04, 2017)
- Fujitsu begins collaborative verification of IoT-based visualization system in Intel's Penang factory (May. 04, 2017)
- Sankalp Semiconductor Strengthens Management Team (May. 04, 2017)
- Imagination: Year end trading update, Apple dispute resolution procedure and planned sale of MIPS and Ensigma (May. 04, 2017)
- Synopsys Announces Industry's First Verification IP and Test Suites for Latest MIPI CSI-2 v2.0 and PHY Specifications (May. 04, 2017)
- SiFive Launches CPU IP Industry into the Cloud with New RISC-V Cores and an Easy Online Business Model (May. 04, 2017)
- Microsemi and Synopsys Extend 20-Year OEM Relationship and Collaborate on New PolarFire FPGAs to Deliver Customized Synthesis Support (May. 04, 2017)
- CEVA, Inc. Announces First Quarter 2017 Financial Results (May. 04, 2017)
- Cadence发布业界首款面向汽车、监控、无人机和移动市场的神经网络DSP IP (May. 04, 2017)
- 中移物联网与ICONIX加入ARM大学计划 (May. 04, 2017)
- VeriSilicon's Vivante VIP8000 Neural Network Processor IP Delivers Over 3 Tera MACs Per Second (May. 03, 2017)
- Mentor enables 64-bit ARM-v8 Cortex-A72 support in its Nucleus Real-Time Operating System (May. 03, 2017)
- Intel Editorial: Intel Will Succeed in Autonomous Driving - I Bet My Career on It (May. 03, 2017)
- InfoSec Global and Synopsys Collaborate to Deliver Complete Hardware/Software Root of Trust Solution (May. 03, 2017)
- Micron, Microsoft Team on IoT Security (May. 03, 2017)
- 芯原推出Vivante VIP8000神经网络处理器IP，每秒可提供超过3 Tera MAC (May. 03, 2017)
- Synopsys扩展了经ASIL Ready ISO 26262认证的DesignWare IP产品组合 (May. 03, 2017)
- 忆芯科技运用Synopsys Security and Foundation IP实现存储SoC的量产 (May. 03, 2017)
- Amazon AWS F1正式上线，深度解析FPGA与公有云的亲密接触 (May. 02, 2017)
- Xilinx VCU118评估套件实现四通道28Gbps光纤高速数据传输 (May. 02, 2017)
- 了解NB-IoT,你需要一本白皮书 (May. 02, 2017)
- Samsung Poised to Become World's Largest Semi Supplier in 2Q17 (May. 02, 2017)
- Synopsys and jNet ThingX Optimize JavaCard OS for Synopsys' ARC SEM Security Processors (May. 02, 2017)
- Cadence Introduces First Interface and Verification IP Solution for CCIX to Advance New Class of Datacenter Servers (May. 02, 2017)
- Mentor partners with Digi-Key on low-cost PCB design tools (May. 02, 2017)
- Samsung set to take Intel's chip crown (May. 02, 2017)
- China Mobile, ARM, Cavium and Enea Sign Agreement for Cooperation in China Mobile Open NFV Testlab (May. 02, 2017)
- Cadence Unveils Industry's First Neural Network DSP IP for Automotive, Surveillance, Drone and Mobile Markets (May. 01, 2017)
- Lattice Semiconductor Releases New Embedded Vision Development Kit Targeted for Mobile-Influenced Applications at the Edge (May. 01, 2017)
- Aldec unveils the newest Xilinx Zynq-based TySOM Embedded Prototyping Board at Embedded Vision Summit 2017 (May. 01, 2017)
- Khronos Releases OpenVX 1.2 Specification for Cross-Platform Acceleration of Power-Efficient Vision Processing (May. 01, 2017)
- Renesas Electronics America, Intrinsic ID, and Medium One Introduce Complete Sensor-to-Cloud Platform to Simplify Secure IoT Development (May. 01, 2017)
- NXP sells stake in Chinese analog foundry (May. 01, 2017)
- MediaTek Losing Market Share in Smartphones (May. 01, 2017)
- 莱迪思半导体推出全新的嵌入式视觉开发套件适用于移动相关的边缘应用 (May. 01, 2017)
- AI助力智慧驾驶的4种方式 (Apr. 28, 2017)
- NXP合并飞思卡尔超过瑞萨跃居全球第一大MCU供应商 (Apr. 28, 2017)
- Faraday Exhibits Total IP Solutions and IoT SoC Platform at ESC 2017 (Apr. 27, 2017)
- Visual Processors and CNN - the next generation supercomputer (Apr. 27, 2017)
- UMC Sees Weakening Demand at 28nm (Apr. 27, 2017)
- NXP Delivers eDL and Vehicle Registration Smartcards to Algeria (Apr. 27, 2017)
- Starblaze Achieves Volume Production of Storage SoC with Synopsys Security and Foundation IP (Apr. 27, 2017)
- 应用Cadence Protium S1，晶晨半导体大幅缩短多媒体SoC软硬件集成时间 (Apr. 27, 2017)
- 智原将于ESC 2017展出全制程IP方案与物联网SoC开发平台 (Apr. 27, 2017)
- 华虹宏力与华大九天再联手 九天EDA工具助力IP设计 (Apr. 27, 2017)
- Imagination正式回应苹果两年后停用其GPU：专利他们搞不掂 (Apr. 27, 2017)
- Dialog公司为瑞萨电子的汽车SoC提供首选电源解决方案 (Apr. 27, 2017)
- Samsung signs NXP as MRAM-on-FDSOI customer (Apr. 27, 2017)
- Huawei develops ARM-Android open source platform for Linaro (Apr. 27, 2017)
- Amlogic Reduces HW/SW Integration Time for Multimedia SoCs by Two Months Using the Cadence Protium S1 FPGA-Based Prototyping Platform (Apr. 26, 2017)
- Wave Computing Accelerates its Machine Learning Software Bring-up by 12 Months Using Synopsys ZeBu Server Emulation System (Apr. 26, 2017)
- Baidu Battles Google on Robo-Car Derby (Apr. 26, 2017)
- Geon Secure Execution Processor Brings Royalty-Free Protection to IoT Devices (Apr. 26, 2017)
- Xilinx Sales Grow For 6th Consecutive Quarter; Dividend Raised For 12th Consecutive Year (Apr. 26, 2017)
- IAR Systems invests in IoT security by acquiring equity stake in Secure Thingz (Apr. 26, 2017)
- Fraunhofer IIS Joins GLOBALFOUNDRIES FDXcelerator Program to Enable Dynamic Biasing IPs (Apr. 25, 2017)
- Synopsys Extends Portfolio of ASIL Ready ISO 26262 Certified DesignWare IP (Apr. 25, 2017)
- Imagination以前所未有的价格供应SoC嵌入式软件工具 (Apr. 25, 2017)
- SoC安全性耐力测试 (Apr. 25, 2017)
- ARM发布Mali-C71图像信号处理器，推动下一代汽车图像处理 (Apr. 25, 2017)
- IHS公布2016年全球TOP10半导体厂排名 (Apr. 25, 2017)
- Barco Silex and Intrinsic ID to Integrate Security Technology (Apr. 25, 2017)
- eASIC and Mobiveil Announce Flash Reliability Platform (Apr. 25, 2017)
- Mentor announces Nucleus RTOS support for i.MX6UltraLite SoC (Apr. 25, 2017)
- Inside Secure releases latest True Random Number Generator providing continuous protection against security threats in IoT and Datacenters (Apr. 25, 2017)
- IoT Security: What We Need Next (Apr. 25, 2017)
- Wave Computing and Sonics to Present on Deep Learning Technology At ML DevCon (Apr. 25, 2017)
- AMD Expands Technology Portfolio to Drive Immersive Computing Vision with Acquisition of Wireless Virtual Reality IP from Nitero (Apr. 25, 2017)
- Neurala Patents "Whole Brain" Approach to AI, the Basis of the Next Generation of AI (Apr. 25, 2017)
- 发改委：禁止新建燃油汽车项目 新能源车产业将迎大变革 (Apr. 25, 2017)
- 亚马逊EC2 F1实例已广泛采用 Virtex UltraScale+ FPGA (Apr. 24, 2017)
- Xilinx Partial Reconfiguration enables dynamic field updates (Apr. 24, 2017)
- 半导体巨头借重金收购竞逐汽车电子市场 (Apr. 24, 2017)
- Mentor collaborates with Microsoft to accelerate Internet of Things solutions (Apr. 24, 2017)
- The Linux Foundation launches EdgeX Foundry to unify IoT market (Apr. 24, 2017)
- GUC 任命系統首席技術長 (Apr. 24, 2017)
- Cadence Reports First Quarter 2017 Financial Results (Apr. 24, 2017)
- Picture perfect: Driving next-generation image processing for automotive (Apr. 24, 2017)
- Rambus Reports First Quarter 2017 Financial Results (Apr. 24, 2017)
- 从ARM到三星，苹果是如何走向自研芯片的？ (Apr. 21, 2017)
- Xilinx广泛部署动态重配置技术 (Apr. 21, 2017)
- 用在Always-on IoT领域的新型音频和高性能传感器助Synopsys ARC Data Fusion subsystem更加强大 (Apr. 21, 2017)
- Taiwan Eyes Automotive Market (Apr. 21, 2017)
- 联发科采用Cadence 7nm工艺实现流 (Apr. 20, 2017)
- Rambus Partners with Samsung to Develop 56G SerDes PHY on 10nm LPP Process (Apr. 20, 2017)
- Faraday Delivers V-by-One HS PHY & Controller IP on UMC 28HPCU Process (Apr. 19, 2017)
- IP-Maker to release new NVMe host IP (Apr. 19, 2017)
- Arastu Systems Ethernet 10G Digital Switch IP Soft Core for Time-Critical Applications (Apr. 19, 2017)
- Xilinx Announces General Availability of Virtex UltraScale+ FPGAs in Amazon EC2 F1 Instances (Apr. 19, 2017)
- Samsung Completes Qualification of its 2nd Generation 10nm Process Technology (Apr. 19, 2017)
- NXP Sells Stake in China Foundry ASMC (Apr. 19, 2017)
- Apple to cut Imagination royalty to a third, says UBS (Apr. 19, 2017)
- NXP Sells Stake in China Foundry ASMC (Apr. 19, 2017)
- Cadence发布7纳米工艺Virtuoso先进工艺节点扩展平台 (Apr. 18, 2017)
- Dolphin Integration announces the availability of the new generation 28 nm SpRAM generator (Apr. 18, 2017)
- Ncore 2.0缓存一致性互连和Resilience套件助力机器学习SoC设计 (Apr. 18, 2017)
- 內嵌力旺電子NeoEE矽智財之量產晶圓累積出貨突破十萬片 (Apr. 18, 2017)
- 恩智浦首个FD-SOI芯片意味着什么？ (Apr. 18, 2017)
- 三股力量推动定制SoC增长，内核授权亟需轻量级的商业模式 (Apr. 18, 2017)
- DDR4将首度超越DDR3 2017年占整体DRAM58% (Apr. 18, 2017)
- 唯"开放"的自动驾驶平台才能与Mobileye们竞争 (Apr. 18, 2017)
- ADAS准备好被"重新定义"了吗？ (Apr. 18, 2017)
- 低成本快速定制SoC：智能硬件和IoT初创公司的差异化成功之路 (Apr. 18, 2017)
- Cambricon Licenses Arteris FlexNoC Interconnect IP for Machine Learning SoCs (Apr. 18, 2017)
- Inside Secure partners with ContentArmor to address Hollywood studios' higher security requirements for early-window and UHD movies delivered over-the-top (OTT) (Apr. 18, 2017)
- CAST Becomes Member of ESD Alliance (Apr. 18, 2017)
- Lynx出品：基于Xilinx Zynq UltraScale+ MPSoC的内核分离技术LynxSecure (Apr. 17, 2017)
- Rambus Expands Cryogenic Memory Collaboration with Microsoft (Apr. 17, 2017)
- 灿芯半导体喜获上海市浦东新区科学技术奖 (Apr. 17, 2017)
- Cadence发布大规模并行物理签核解决方案Pegasus验证系统 (Apr. 14, 2017)
- 封裝/PCB重要性與日俱增 Cadence整合性方案全力部署 (Apr. 14, 2017)
- Truechip announces first customer shipment of JESD204B Comprehensive Verification IP (CVIP) (Apr. 14, 2017)
- CERN openlab Explores New CPU/FPGA Processing Solutions (Apr. 14, 2017)
- Cadence takes chip verification in cloud to new level (Apr. 13, 2017)
- TowerJazz and Aisin Seiki Announce Mass Production of New Generation Automotive Body Products (Apr. 13, 2017)
- Mouser signs Intel FPGA board firm ReFLEX CES (Apr. 13, 2017)
- TSMC Reports First Quarter EPS of NT$3.38 (Apr. 13, 2017)
- Silicon Creations Selects Mentor Graphics Software for High-Performance Analog and Mixed-Signal IP Verification (Apr. 13, 2017)
- Toshiba Expands Line-up of ARM Cortex-M-Based Microcontrollers (Apr. 13, 2017)
- Gartner Says Worldwide Semiconductor Revenue Forecast to Increase 12.3 Percent in 2017 (Apr. 13, 2017)
- RFEL teams with Plextek for adaptive FPGA-based video processing (Apr. 13, 2017)
- Analog Devices and Renesas Electronics collaborate on automotive radar sensing (Apr. 13, 2017)
- 台积电InFO封装技术升级优化，Cadence到底有啥妙招？ (Apr. 13, 2017)
- 华虹宏力与华大九天再联手 国产EDA工具助力IP设计 (Apr. 13, 2017)
- 恩智浦携手亚马逊，为智能家居带来更多Alexa体验 (Apr. 13, 2017)
- ARM and Intel part of IoT MCU benchmarking group (Apr. 13, 2017)
- Cryptography in the age of AI and quantum computing (Apr. 13, 2017)
- Mentor Announces Availability of Qualified Reference Flow to Help Designers Achieve Success with Samsung 14LPP Process Technology (Apr. 12, 2017)
- Novatek Adopts Synopsys' Industry-First HDMI 2.1 with HDCP 2.2 Verification IP and Test Suite (Apr. 12, 2017)
- Over 100,000 Wafers Embedded with eMemory's NeoEE IP Shipped (Apr. 12, 2017)
- Moortec and UltraSoC collaborate to enable next-generation (Apr. 12, 2017)
- MACOM Announces Reference Design Supporting All Requirements for Next Generation CoaXPress 2.0 Standard (Apr. 12, 2017)
- UK government sets connected vehicle security plan in motion (Apr. 12, 2017)
- Image sensor honed for street viewing (Apr. 12, 2017)
- Xilinx Announces Multi-Year Succession Plan and New COO (Apr. 12, 2017)
- Malware targets IoT devices for data wipes (Apr. 12, 2017)
- Microsemi Announces Libero SoC v11.8 Software Providing FPGA Designers Mixed Language Simulation and Best-in-Class Debugging Capabilities (Apr. 11, 2017)
- Eta Compute Debuts with World's Lowest Power Microcontroller IP Targeting Energy Harvesting Segment (Apr. 11, 2017)
- Cadence Launches the Pegasus Verification System, a Massively Parallel Physical Signoff Solution (Apr. 11, 2017)
- Socionext Develops Small, Low Power 4K/60p HEVC Codec (Apr. 11, 2017)
- Bluetooth low energy smart sportswatch tracks distance covered, steps taken, and calories burned via partner iOS and Android smartphone app (Apr. 11, 2017)
- Qualcomm Files Answer and Counterclaims to Apple Lawsuit (Apr. 11, 2017)
- 瑞萨电子为进一步强化对ADAS及自动驾驶的支持推出Renesas Autonomy™ (Apr. 11, 2017)
- 低功耗蓝牙智能运动手表配合iOS和安卓智能手机App (Apr. 11, 2017)
- 西门子完成对Mentor Graphics的收购 (Apr. 11, 2017)
- Xilinx机器视觉解决方案 (Apr. 10, 2017)
- Kintex-7 FPGA展现卓越的全可编程性： Keysight 发布六个全新PXI AWG/数字转换器 (Apr. 10, 2017)
- 中国信息通信研究院与恩智浦签订智能网联汽车/车联网战略合作协议 (Apr. 10, 2017)
- 智能汽车传感器大融合，Mentor要跟芯片厂抢生意？ (Apr. 10, 2017)
- Open-Silicon to Showcase IoT ASIC Platform and IoT Gateway SoC Platform along with Comprehensive HBM2 IP Sub-System Solution at The IoT DevCon Santa Clara on April 26-27, 2017 (Apr. 10, 2017)
- 物联网最低功耗解决方案究竟是由何种传感器实现的？ (Apr. 10, 2017)
- 山海资本完成对硅谷数模半导体的收购 (Apr. 10, 2017)
- 台積公司2017年3月營收報告 (Apr. 10, 2017)
- Foundries Need Clear Benchmarks (Apr. 10, 2017)
- Chinese Investment Firm Agrees to Buy Xcerra (Apr. 10, 2017)
- 全新物理设计时序优化与Silicon-aware Sign-off解决方案正式发布 (Apr. 10, 2017)
- 车用SoC在最高安全级ASIL D展开竞赛 (Apr. 07, 2017)
- IoT Needs Embedded Cryptography (Apr. 07, 2017)
- 安创深度 | 中国芯片领域趋势变化的理解 (Apr. 07, 2017)
- Anatomy of a secure internet-connected thing (Apr. 07, 2017)
- ARM Compute Library heralds computer vision and machine learning (Apr. 06, 2017)
- EEMBC and prpl align to drive use of hypervisors to create security-by-separation for a more trusted IoT (Apr. 06, 2017)
- Faraday Technology Corporation (TWSE: 3035) 1Q 2017 Investor Conference Call and Webcast (Apr. 06, 2017)
- 智原科技2017年第一季線上暨網路直播 (Apr. 06, 2017)
- Chinese chip market achieves blistering growth (Apr. 06, 2017)
- Microsemi and Athena Announce the TeraFire Hard Cryptographic Microprocessor for PolarFire (Apr. 06, 2017)
- PLDA Launches PLDA Design Day Event In Shanghai, China, a First-of-Its-Kind Event, 100% Focused on PCIe 4.0 Design (Apr. 06, 2017)
- Mentor Announces Availability of Qualified Reference Flow to Help Designers Achieve Success with Samsung 14LPP Process Technology (Apr. 06, 2017)
- Synopsys的IC Compiler II通过了TSMC 7nm制程工艺认证 (Apr. 06, 2017)
- Synopsys的IC Compiler II通过TSMC12nm制程工艺认证 (Apr. 06, 2017)
- ArterisIP Advances Machine Learning SoC Design with Ncore 2.0 Cache Coherent Interconnect and Resilience Package (Apr. 06, 2017)
- Synopsys扩展了汽车的虚拟原型技术生态系统，加入了Silicon Mobility半导体解决方案 (Apr. 06, 2017)
- ISPD Predicts Chip Futures (Apr. 06, 2017)
- Cadence Unveils Expanded Virtuoso Advanced-Node Platform for 7nm Processes (Apr. 05, 2017)
- Mentor Nucleus SafetyCert RTOS extends support to ARM Cortex-M4 Processors for safety-critical systems (Apr. 05, 2017)
- MIPI Alliance Expands Popular CSI-2 Camera Specification Beyond Mobile (Apr. 05, 2017)
- Autoroad and STMicroelectronics Showcased Innovative Automotive Radar Solutions (Apr. 05, 2017)
- Sunplus Technology Licenses Netspeed Orion IP to Accelerate Design of Automotive SoCs (Apr. 05, 2017)
- Arteris is now ArterisIP (Apr. 05, 2017)
- Samsung joins HEVC Advance (Apr. 05, 2017)
- HDL Design House and Mentor Workshop at Aviation Electronics Europe 2017 (Apr. 05, 2017)
- 无人驾驶渐临时，ADAS和信息娱乐将朝哪些方向发生变化？ (Apr. 05, 2017)
- GUC Monthly Sales Report - March 2017 (Apr. 05, 2017)
- 安森美半导体在SAE世界大会上展示用于汽车系统的先进技术 (Apr. 05, 2017)
- Metova Launches Embedded and IoT Development Services (Apr. 05, 2017)
- Open-Silicon Unveils Industry's Highest Performance Interlaken Chip-to-Chip Interface IP (Apr. 04, 2017)
- Cadence Voltus IC Power Integrity Solution Enables Juniper Networks to Achieve First-Pass Silicon Success for its Largest Networking SoC (Apr. 04, 2017)
- Renesas Electronics Enables Security and Safety for Next-Generation Connected Cars With Embedded Virtualization Technology for the R-Car Platform (Apr. 04, 2017)
- Google Calls for Switch Chip API (Apr. 04, 2017)
- China's Tsinghua Secures $22 Billion in State Backing (Apr. 04, 2017)
- Sino Wealth借助DesignWare蓝牙低功耗IP缩短开发时间，并满足极高的设计要求 (Apr. 03, 2017)
- Imagination史上最大危机！苹果宣布停用其GPU产品 (Apr. 03, 2017)
- Imagination Technologies: Discussions with Apple regarding license agreement (Apr. 03, 2017)
- Next-Generation Automotive Door-Zone Controllers from STMicroelectronics Bring Power Management and Failsafe Circuitry On-Chip (Apr. 03, 2017)
- How Apple will dodge an Imagination lawsuit (Apr. 03, 2017)
- Can Imagination survive without Apple? (Apr. 03, 2017)
- SEMI Reports 2016 Global Semiconductor Materials Sales of $44.3 Billion (Apr. 03, 2017)
- 用于计算机视觉和机器学习的 ARM 计算库现在公开发布了！ (Apr. 01, 2017)
- 微软在欧洲开设首家物联网实验室 (Apr. 01, 2017)
- Quick-starting your IoT node design just got easier (Mar. 31, 2017)
- IoT design board makes most of its FPGA (Mar. 31, 2017)
- 百度DuerOS智慧芯片发布 可对话 (Mar. 31, 2017)
- OmniPHY Unveils 25G Backplane SerDes Silicon on TSMC 28nm Technology (Mar. 30, 2017)
- Argon Design signs up first licensee for Argon360 real-time video stitching IP (Mar. 30, 2017)
- IC Insights More Than Doubles its 2017 IC Market Growth Forecast (Mar. 30, 2017)
- Faraday Announces World's Smallest Footprint 40eHV and 40LP SRAM Compiler (Mar. 30, 2017)
- Barco Silex Partners With Accelize, Enabling Encryption-as-a-Service and More for Cloud Service Providers (Mar. 30, 2017)
- 智原科技推出世界最小存储面积的40eHV与40LP SRAM编译器 (Mar. 30, 2017)
- 免费设计、模拟和测试基于 Cortex-M0 的系统 (Mar. 30, 2017)
- 恩智浦推出全新S32K微控制器平台，借此加快汽车级软件设计 (Mar. 30, 2017)
- Understanding cyber insurance and the IoT (Mar. 30, 2017)
- How to implement a secure IoT system on ARMv8-M? (Mar. 29, 2017)
- One more low-cost Zynq SoC dev board, from a reader/spelunker designing SDR cave radios (Mar. 29, 2017)
- Machine learning in embedded vision applications (Mar. 29, 2017)
- TSMC considers US for 3nm wafer fab site (Mar. 29, 2017)
- GUC PCIe 3 PHY IP 與 PLDA EP 控制器組合通過合規測試 (Mar. 29, 2017)
- UMC和Synopsys联合加速14nm定制设计 (Mar. 29, 2017)
- 什么因素推动了低成本定制型物联网 SoC 的开发？ (Mar. 29, 2017)
- How to make analog smart - does building a custom SoC have to be hard? (Mar. 28, 2017)
- 理解汽车DDR DRAM (Mar. 28, 2017)
- Matrix Voice ：一个内嵌FPGA硬件加速器的低价语音识别平台 (Mar. 28, 2017)
- 意法半导体携手DSP Concepts为STM32开发者提供进阶音讯设计工具 (Mar. 28, 2017)
- Synopsys接连斩获半导体行业权威大奖 (Mar. 28, 2017)
- Synopsys' IC Validator Used for Physical Sign-Off on More Than 100 FinFET Production Tapeouts (Mar. 28, 2017)
- Intel Unveils 10, 22nm Processes (Mar. 28, 2017)
- ISRAEL'S BAR-ILAN UNIVERSITY PRODUCES COMPLEX SOC USING SonicsGN NoC AS INTEGRATION FABRIC (Mar. 28, 2017)
- Data Center Duel Deux -- Intel and Xilinx Take More Turf (Mar. 28, 2017)
- Open Connectivity Foundation and Singapore Semiconductor Industry Association Announce Collaboration Framework in Singapore (Mar. 28, 2017)
- Patent Trolls Plague Chip Vendors (Mar. 28, 2017)
- 汽车电子推动SSD接口朝PCI-e方向升级 (Mar. 27, 2017)
- STMicroelectronics Making Everything Smarter at IoT Asia 2017 (Mar. 27, 2017)
- Cadence获封最受认可称号 (Mar. 27, 2017)
- ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform (Mar. 27, 2017)
- ARM launches embedded Linux education kit (Mar. 27, 2017)
- Synopsys' RSoft Photonic Component Design Suite Version 2017.03 Accelerates Optoelectronic Device Analysis (Mar. 27, 2017)
- Study: China increases lead in electromobility, Europe lags (Mar. 27, 2017)
- EDA Sales Jump Most in Five Years (Mar. 27, 2017)
- 恩智浦携手Auto-ISAC共同应对互联汽车的安全挑战 (Mar. 24, 2017)
- BitSim's IP, Bit-MIPI CSI-2 used in Flir's new generation of thermal cameras, the Exx-series (Mar. 24, 2017)
- NXP holds pole position in automotive semiconductor ranking (Mar. 24, 2017)
- Moortec to exhibit at the 2017 TSMC China Technology Symposium in Shanghai (Mar. 24, 2017)
- GlobalSign Joins ARM mbed IoT Device Platform Partnership Program (Mar. 23, 2017)
- Samsung and eSilicon Taped Out 14nm Network Processor with Rambus 28G SerDes Solution (Mar. 22, 2017)
- High-performance, high-bandwidth IP platform for Samsung 14LPP process technology (Mar. 22, 2017)
- Arteris FlexNoC Interconnect IP is Licensed by Samsung for its Foundry Customers (Mar. 22, 2017)
- Ubuntu Core ported to NXP quad-core ARM Cortex-A53 SoC (Mar. 22, 2017)
- Arrow launches FPGA-based IoT maker board (Mar. 22, 2017)
- Renesas benefits from Japan's edge in electromobility (Mar. 22, 2017)
- Renesas Accelerates IoT Design Using the Cadence Perspec System Verifier (Mar. 22, 2017)
- Samsung Edges TSMC in 10 nm (Mar. 22, 2017)
- Cadence获得TSMC 7nm工艺技术认证 (Mar. 22, 2017)
- 从端到端，英特尔让汽车和工厂拥有聪明的 (Mar. 22, 2017)
- Democratizing IoT design with open source development boards and communities (Mar. 22, 2017)
- The Role and Benefits of FPGA Prototyping in the ASIC Design Cycle (Mar. 21, 2017)
- ARM DynamIQ: Expanding the possibilities for artificial intelligence (Mar. 21, 2017)
- ARM to boost processor performance by 50x with new AI instructions (Mar. 21, 2017)
- 含有密码加速功能的Synopsys高性能新安全模块使安全功能加速了100倍 (Mar. 21, 2017)
- The Functional Safety Imperative in Automotive Design (Mar. 21, 2017)
- 为物联网SoC整合低功耗蓝牙IP技术 (Mar. 21, 2017)
- China's Gamble on Industrial IoT (Mar. 21, 2017)
- 苹果宣布在苏州、上海再建研发中心 (Mar. 21, 2017)
- PTV Group and IPG Automotive Offer New Interface for Virtual Test Driving (Mar. 21, 2017)
- Synopsys Announces Availability of Comprehensive Low Power Reference Kit for Design and Verification (Mar. 21, 2017)
- Inside Secure delivers Application Protection to defend against malicious attacks on Android Java devices (Mar. 21, 2017)
- Space Codesign to Announce SpaceStudio V3 to Facilitate Functional Verification and Validation of Embedded Systems (Mar. 21, 2017)
- Can FPGAs Beat GPUs in Accelerating Next-Generation Deep Learning? (Mar. 21, 2017)
- Synopsys' RSoft System Tools Advance Simulation of Optical Communications for Automotive, Ethernet and PIC Applications (Mar. 21, 2017)
- ARM announces multicore processor architecture targeting automated driving (Mar. 21, 2017)
- Apple hires group of UK GPU engineers (Mar. 21, 2017)
- ST's SPAD Imager Likely Linked to iPhone 8 (Mar. 21, 2017)
- Cadence与TSMC合作12FFC工艺技术，驱动IC设计创新 (Mar. 21, 2017)
- ARM推出全新DynamIQ技术，为人工智能开启无限可能 (Mar. 21, 2017)
- Cadence（Tensilica）的可定制处理器 (Mar. 21, 2017)
- Xilinx一系列"业界第一"解决方案亮相OFC 2017 进一步扩展其高速数据中心互联产品 (Mar. 20, 2017)
- Fraunhofer to open Dublin Lab-on-Chip center (Mar. 20, 2017)
- Is ADAS Ready for a Little 'Disruption?' (Mar. 20, 2017)
- Industry's first dual-port CSI-2 quad deserializer hub, Enabling faster and more flexible ADAS applications (Mar. 16, 2017)
- Kanazawa Uni and Hitachi develop aging sensor for autonomous vehicles (Mar. 16, 2017)
- ARM 推出 CoreSight SoC-600，实现下一代调试和跟踪 (Mar. 16, 2017)
- Why ARM wants to do more (Mar. 16, 2017)
- New ARM Physical IP customized for advanced automotive systems (Mar. 16, 2017)
- China Fab Boom Fuels Equipment Spending Revival (Mar. 16, 2017)
- reVISION simplifies FPGA-based vision system development (Mar. 16, 2017)
- Sonics ICE-G3 EPU ADDS CLUSTER CONTROLLER TO SAVE MORE ENERGY FOR COMPLEX CHIP POWER ARCHITECTURES (Mar. 15, 2017)
- Synopsys and TSMC Collaborate to Develop Interface, Analog and Foundation IP for 12-nm FinFET Process (Mar. 15, 2017)
- Synopsys' IC Compiler II Certified for TSMC's 12-nm Process Technology (Mar. 15, 2017)
- Cadence Collaborates with TSMC to Drive Innovation Using New 12FFC Process Technology (Mar. 15, 2017)
- Green Hills Software and Imagination Announce INTEGRITY RTOS Support for MIPS I6400 CPU (Mar. 15, 2017)
- SMIC Signs License Agreement For Invensas' DBI(R) Technology (Mar. 15, 2017)
- Xilinx Debuts Industry-First Solutions at OFC 2017 and Further Expands High Speed Data Center Interconnect Offerings (Mar. 15, 2017)
- True Circuits Showcases State-of-the-art Ultra PLL, Low Power IoT PLL and 16nm IP Portfolio at TSMC NA Technology Symposiums (Mar. 15, 2017)
- Intel/Mobileye Duopoly: Dream or Nightmare? (Mar. 15, 2017)
- 中芯国际与Invensas签署DBI技术转让与授权协议 (Mar. 15, 2017)
- GUC PCIe 3 PHY IP & PLDA EP Controller Combo Passes Compliance Test (Mar. 15, 2017)
- NXP Goes All In on FD-SOI (Mar. 15, 2017)
- Methods2Business 使用Cadence Tensilica DSP成功打造首款可扩展Wi-Fi HaLow MAC (Mar. 15, 2017)
- Cadence携手CommSolid开发全新NB-IoT基带IP，进军移动IoT市场 (Mar. 15, 2017)
- PLDA宣布推出XpressRICH4-AXI™ PCIe® 4.0 IP，为SoC设计提供高性能、高可靠性AXI桥接器 (Mar. 15, 2017)
- Synopsys宣布推出行业首个含集成安全监视器且符合ASIL D Ready的双核锁步处理器IP (Mar. 14, 2017)
- USB 3.1主机IP认证，你需要知道的是什么 (Mar. 14, 2017)
- How a 16Gbps Multi-link, Multi-protocol SerDes PHY Can Transform Datacenter Connectivity (Mar. 14, 2017)
- How Design IP Can Accelerate and Simplify Development of Enterprise-Level Communications and Storage Systems (Mar. 14, 2017)
- Andes Technology Corporation Goes IPO On the Taiwan Stock Exchange (Mar. 14, 2017)
- Mobileye被英特尔收购，将引发汽车电子格局大变 (Mar. 14, 2017)
- Barco Silex and Imagination collaborate on SoC security (Mar. 14, 2017)
- Vector Software Introduces VectorCAST/Probe (Mar. 14, 2017)
- Mbed OS 5.4 offers IoT developers connectivity choice (Mar. 14, 2017)
- The future of debug and trace has arrived (Mar. 14, 2017)
- Arteris Ncore Cache Coherent Interconnect and FlexNoC IP are Licensed by ZTE (Mar. 14, 2017)
- Silicon Creations Delivers 12.7G SERDES PMA for TSMC 40LP Process and PLL IP for TSMC 7nm Process (Mar. 14, 2017)
- UMC and Synopsys Collaboration Speeds 14-nm Custom Design (Mar. 14, 2017)
- NXP Announces ARM Cortex-M4-based MCU with Industry's Largest Embedded SRAM Memory, Optimized for Portable Devices (Mar. 14, 2017)
- Synopsys Extends Automotive Ecosystem for Virtual Prototyping to Include Silicon Mobility Semiconductor Solutions (Mar. 14, 2017)
- OVH and Accelize Partner to Deliver FPGA Acceleration-as-a-Service through OVH RunAbove Lab (Mar. 14, 2017)
- ARM's new RTOS gets visualization from Percepio (Mar. 14, 2017)
- Imagination and Intercede demonstrate the power of the Trust Continuum in securing the IoT (Mar. 14, 2017)
- Silicon Labs Beefs Up IoT SoCs (Mar. 14, 2017)
- The System(s)-on-a-Chip (SoC) Market to Reach a 7.7% CAGR through 2021, says Semico Research (Mar. 14, 2017)
- Synopsys推进虚拟原型技术可支持系统和半导体供应链合作缔造下一代SoC (Mar. 14, 2017)
- Imagination 和 Express Logic 宣布扩展 ThreadX RTOS 对 MIPS CPU 的支持 (Mar. 14, 2017)
- Socionext 的新款嵌入式芯片采用 Imagination 的 PowerVR Series8XE GPU (Mar. 14, 2017)
- XJTAG DFT for Mentor Graphics PADS (Mar. 14, 2017)
- Teaching Machines to See (Mar. 14, 2017)
- 恩智浦为便携式设备推出基于ARM Cortex-M4和业内最大嵌入式SRAM内存的微控制器 (Mar. 14, 2017)
- 恩智浦为创新者提供成熟框架，助力开发新颖、安全的物联网应用 (Mar. 14, 2017)
- 恩智浦推出面向工业物联网、支持TSN的高级SoC (Mar. 14, 2017)
- PLDA Announces XpressRICH4-AXI PCIe 4.0 IP, Providing a High Performance and Reliable AXI Bridge for SoC designs (Mar. 13, 2017)
- Analog Bits Announces Mixed Signal Design Kits for 7nm at TSMC Technology Symposium (Mar. 13, 2017)
- Cadence Expands Capabilities of Integrated Design and Analysis Flow for TSMC InFO Packaging Technology (Mar. 13, 2017)
- Synopsys' IC Compiler II Completed Certification for TSMC's 7-nm Process Technology (Mar. 13, 2017)
- IP设计如何实现汽车功能安全？ (Mar. 13, 2017)
- Xilinx推出reVISION堆栈 为广泛的视觉导向机器学习应用铺平道路 (Mar. 13, 2017)
- 英特尔助力阿里巴巴使用FPGA通过云服务加速各种工作负载 (Mar. 13, 2017)
- Open-Silicon Announces IoT Gateway SoC Platform (Mar. 13, 2017)
- 全球嵌入式技术和物联网发展趋势 (Mar. 13, 2017)
- Cypherbridge Systems and eWBM Introduce Solutions Based on FIDO Alliance U2F and UAF Specifications Powered by Synopsys Security IP (Mar. 13, 2017)
- Xilinx AI Engine Steers New Course (Mar. 13, 2017)
- Cypress Semiconductor PSoC 6 is Purpose-Built for the IoT (Mar. 13, 2017)
- ARM: Lighting the path to production for connected buildings with mbed OS 5.4 (Mar. 13, 2017)
- ARM flags latest CoreSight IP as 'future of debug and trace' (Mar. 10, 2017)
- 为您省钱，虚拟仪表盘、信息娱乐、汽车摄像一颗芯搞掂 (Mar. 10, 2017)
- ARM处理器攻下微软Azure服务器 英特尔遭遇双重打击 (Mar. 10, 2017)
- 台積公司2017年2月營收報告 (Mar. 10, 2017)
- An introduction to ARM Cortex-M0 DesignStart (Mar. 09, 2017)
- Safety Verification and Optimization of Automotive Ethernet Using Dedicated SoC FIT Rates (Mar. 09, 2017)
- 惊艳！Imagination揭开全新PowerVR Furian GPU架构的神秘面纱 (Mar. 09, 2017)
- ReFLEX CES Introduces the 1st Arria 10 SoC System-On-Module, Named (Mar. 09, 2017)
- 将信息安全进行到底，华大三大产业领域参展慕尼黑电子展 (Mar. 09, 2017)
- ON Semiconductor 授予 Digi-Key 2016 全球高技术服务分销商奖 (Mar. 09, 2017)
- InvenSense and GLOBALFOUNDRIES Collaborate on Industry-Leading Ultrasonic Fingerprint Imaging Technology (Mar. 09, 2017)
- M31 Deploys a Full Range of IP for TSMC 16nm FFC Process (Mar. 08, 2017)
- Arteris Announces PIANO 2.0 Automated Interconnect Timing Closure Technology (Mar. 08, 2017)
- Imagination's new PowerVR Furian GPU architecture will deliver captivating and engaging visual and vision experiences (Mar. 08, 2017)
- eMemory's NeoFuse Implemented in HV Process for OLED Application (Mar. 08, 2017)
- Synopsys Advances Virtual Prototyping to Enable System and Semiconductor Supply Chain Collaboration for Next-Generation SoCs (Mar. 08, 2017)
- STMicroelectronics and Prove & Run Provide Scalable Security Platform for IoT Devices (Mar. 08, 2017)
- SoftBank to sell 25% of ARM to Saudi-backed fund (Mar. 08, 2017)
- Sidense Exhibiting at TSMC 2017 North American Technology Symposiums (Mar. 08, 2017)
- 円星科技积极布局台积电16纳米FFC制程的IP解决方案 (Mar. 08, 2017)
- 力旺电子跨足OLED应用领域 NeoFuse硅智财高压制程全都布 (Mar. 08, 2017)
- 巴西的Unitec公司获得Imagination MIPS CPU授权， 用来开发瞄准智慧城市应用的芯片 (Mar. 08, 2017)
- Synopsys rolls ASIL-certified processor IP to ADAS designers (Mar. 08, 2017)
- 首款支持数千兆级调制解调器的通信DSP内核 (Mar. 07, 2017)
- Cadence免费软件开发工具包试用申请 (Mar. 07, 2017)
- 使用Tensilica IP构建基于汽车以太网的音频流解决方案 (Mar. 07, 2017)
- 基于多核ARM的低成本，低功耗影音播放器 (Mar. 07, 2017)
- 使用超低功耗处理器防止侧信道攻击 (Mar. 07, 2017)
- 中低密度FPGA再演双雄会，"洪荒之力"都往哪儿使？ (Mar. 07, 2017)
- 全球芯片销售创六年来最佳 中国销售增速第一 (Mar. 07, 2017)
- Synopsys Announces Industry's First ASIL D Ready Dual-Core Lockstep Processor IP with Integrated Safety Monitor (Mar. 07, 2017)
- Aldec Introduces End-to-end HW/SW Co-verification for Xilinx Zynq SoC FPGAs at Embedded World 2017 (Mar. 07, 2017)
- Everspin Expands MRAM Ecosystem with Xilinx FPGAs (Mar. 07, 2017)
- Imagination shows latest technologies for IoT, automotive and security at Embedded World 2017 (Mar. 07, 2017)
- Record Spending for Fab Equipment Expected in 2017 and 2018 (Mar. 07, 2017)
- Faraday Monthly Consolidated Sales Report - February 2017 (Mar. 07, 2017)
- Globalfoundries成都建厂的三点思考 (Mar. 06, 2017)
- 中芯国际与中科院微电子所共同开发28纳米RRAM技术并取得显著进展 (Mar. 06, 2017)
- Ultra-low power memory generators silicon proven at TSMC 55 nm uLP and uLP eFlash (Mar. 06, 2017)
- AMPHION releases 2 extended performance variants of its highly successful HEVC/H.265 'Malone' video decoder IP core (Mar. 06, 2017)
- 将低功耗蓝牙IP整合进SoC中的好处 (Mar. 06, 2017)
- Rambus Signs License Agreement with Western Digital (Mar. 06, 2017)
- Optimizing compilers for ADAS applications (Mar. 06, 2017)
- Brazil's Unitec licenses MIPS CPU from Imagination Technologies for chip targeting smart cities (Mar. 06, 2017)
- Bounce for wearables (Mar. 06, 2017)
- Startup Taps TSMC to Attack Broadcom (Mar. 06, 2017)
- 意法半导体提升STM32生态系统灵活性，推出最新的STM32F722 Nucleo开发板和STM32F723探索套件 (Mar. 06, 2017)
- FD-SOI：芯片制造工艺向10nm技术节点发展的最佳选择 (Mar. 04, 2017)
- D'Crypt to include Barco Silex IP for public key cryptography in cutting-edge communication chip (Mar. 02, 2017)
- Daliworks Inc. joins ARM mbed partnership to expand its Thing+ IoT ecosystem (Mar. 02, 2017)
- China's Xiaomi Develops First In-House Smartphone Processor in co-operation with ARM (Mar. 02, 2017)
- Texas Multicore Technologies Announces Full Support for ARM Processors (Mar. 02, 2017)
- D&R delivers a new version of its Software License Manager with Real-Time License Management and Matlab-specific support (Mar. 01, 2017)
- Autotalks Turns to Athena for its Truly Secure V2X Solution (Mar. 01, 2017)
- NetSpeed Gains ISO 26262 Certification, ASIL-D Ready, for Its Interconnect IP (Mar. 01, 2017)
- Chip boosts embedded security for IoT (Mar. 01, 2017)
- ARM's soft launch for machine learning library (Mar. 01, 2017)
- Intel, Spreadtrum Demo Brainchild (Mar. 01, 2017)
- 安森美推出新型模块化汽车成像平台 (Mar. 01, 2017)
- Imagination 的 PowerVR 图形技术为联发科的新款 Helio X30 芯片组带来显著的性能提升与功耗节 (Mar. 01, 2017)
- 使用DesignWare逻辑库和嵌入式存储器以获得16FFC SOC最佳PPA (Feb. 28, 2017)
- Aldec unveils Xilinx UltraScale FPGA-based prototyping board enabling Simulation Acceleration and Emulation with the latest release of HES-DVM (Feb. 28, 2017)
- Cadence Delivers Foundry-Enabled In-Design and Signoff Lithography Simulation Integration with ASML (Feb. 28, 2017)
- Spreadtrum Standardizes on Synopsys ZeBu Server Emulation System for Advanced Mobile SoCs (Feb. 28, 2017)
- Dream Chip Technologies Demonstrates Automotive ADAS SoC using Arteris FlexNoC IP at Mobile World Congress (Feb. 28, 2017)
- ON Semiconductor Unveils Innovative Modular Automotive Imaging Platform (Feb. 28, 2017)
- CEVA's Bluetooth 5 Low Energy IP Powers ON Semiconductor's Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices (Feb. 28, 2017)
- BLE modules simplify IoT design (Feb. 28, 2017)
- Masayoshi Son, Softbank Founder Betting on ARM, Preaches Security (Feb. 28, 2017)
- Merger Agreement Approved by Shareholders of Lattice Semiconductor (Feb. 28, 2017)
- TSMC Joins Semiconductor Research Corporation (Feb. 28, 2017)
- Dream Chip Technologies Presents First 22nm FD-SOI Silicon of New Automotive Driver Assistance SoC (Feb. 27, 2017)
- Truechip announces first customer shipment of 25G/ 50G Ethernet Comprehensive Verification IP (CVIP) (Feb. 27, 2017)
- Imagination's PowerVR graphics provide huge performance boost and power savings in MediaTek's new Helio X30 chipset (Feb. 27, 2017)
- Synopsys Announces Expansion of Liberty Modeling Standard, Paving Way for Ultra Low-Power IC Design (Feb. 27, 2017)
- Cadence Launches Xcelium Parallel Simulator, the Industry's First Production-Proven Parallel Simulator (Feb. 27, 2017)
- Cadence Launches Protium S1 FPGA-Based Prototyping Platform for Early Software Development (Feb. 27, 2017)
- CEVA and ASTRI Unveil Dragonfly NB1, a Licensable NB-IoT Solution For Cost and Power-Sensitive LTE IoT Devices (Feb. 27, 2017)
- Dream Chip shows ADAS processor on FDSOI (Feb. 27, 2017)
- Avery Design Systems Focuses on Ultra HD Display VIP Portfolio (Feb. 27, 2017)
- Terminus Circuits and Truechip partner for comprehensive verification of High Speed Serial Protocols, viz.: PCIe Gen4 and USB 3.1 (Feb. 27, 2017)
- Waves Audio Announces Its First Chip To Bring Virtual Reality Audio Capabilities To Any Headphone and Headset (Feb. 27, 2017)
- SecureRF and BaySand Collaborate to Provide Quantum-resistant Security for ASIC-powered IoT Devices (Feb. 27, 2017)
- NXP Joins Auto-ISAC to Collaborate on Security Challenges of Connected Cars (Feb. 24, 2017)
- CommSolid Unveils Market's First Integration-Ready NarrowBand-IoT Modem IP Solution (Feb. 24, 2017)
- CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity (Feb. 23, 2017)
- UMC Enters Mass Production for 14nm Customer ICs (Feb. 23, 2017)
- Taiwan leads in fab capacity (Feb. 23, 2017)
- Neowine selects Barco Silex public key cryptography IP as most efficient hardware block (Feb. 23, 2017)
- EU Privacy Rules Can Cloud Your IoT Future (Feb. 23, 2017)
- Cobham Gaisler LEON3FT Processor Technology Launch Aboard Iridium NEXT (Feb. 23, 2017)
- Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs (Feb. 23, 2017)
- Alango Voice Communication and Voice Enhancement Packages Now Available for Cadence Tensilica HiFi DSP (Feb. 23, 2017)
- Sequans Integrates Think Silicon GPU Technology in New LTE for IoT System-on-Chip (Feb. 23, 2017)
- Oski Technology Launches Formal Verification IP Portfolio for ARM AMBA Interface Protocols (Feb. 22, 2017)
- Faraday's High Margin Products Delivered Positive Results, IP Revenues Reached a 9-Year High of NT$830 Million in 2016 (Feb. 22, 2017)
- Able Device and EMnify Launch SIMbae™ Key Exchange Manager to Provide Enhanced IoT Security for Enterprises (Feb. 22, 2017)
- Sengled Element LED Bulbs Connect to the IoT with Silicon Labs Zigbee Technology (Feb. 22, 2017)
- zigbee evolution continues with wireless IoT security updates (Feb. 22, 2017)
- ip.access to Develop Next Generation IoT Small Cells on the Path to 5G in Collaboration with Intel (Feb. 22, 2017)
- Blu Wireless Technology secures backing from ARM (Feb. 22, 2017)
- Silab Tech wins the "SME of the Year" Award at the Small Enterprise Business Awards 2016. (Feb. 22, 2017)
- NXP Launches Multi-Standard Programmable Family of System on Chip Solutions (Feb. 22, 2017)
- Flexlogic: Power and Performance Optimization for Embedded FPGA's (Feb. 22, 2017)
- Anyka Microelectronics Selects Allegro DVT's Multi-format Video Encoder IP (Feb. 21, 2017)
- Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions (Feb. 21, 2017)
- Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology (Feb. 21, 2017)
- Waves Audio and CEVA Partner for Far-Field Voice Pick Up and Psychoacoustic Sound Enhancement Solutions targeting Mobile, Smart Home and Wireless Audio Markets (Feb. 21, 2017)
- GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications (Feb. 21, 2017)
- Cyberon and Andes Collaborate on Voice Interface Solutions for IoT Devices (Feb. 21, 2017)
- Look Sharp: The IoT is Watching (Feb. 21, 2017)
- Goke Licenses SonicsGN and MemMax Products for STB SoC Platform (Feb. 21, 2017)
- First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP (Feb. 21, 2017)
- Synopsys IC Compiler II Sets the Bar in Quality-of-Results (Feb. 21, 2017)
- Cadence Collaborates with CommSolid to Address the Cellular IoT Market with New NB-IoT Baseband IP (Feb. 21, 2017)
- Save time during the evaluation of silicon IPs thanks to MyDolphin (Feb. 20, 2017)
- Intel Continues to Drive Semiconductor Industry R&D Spending (Feb. 20, 2017)
- Inside Secure announces strong 2016 results following completion of strategic transformation (Feb. 20, 2017)
- Ex-Leadcore Team Crafts SoC for Xiaomi (Feb. 16, 2017)
- Renesas Electronics Becomes First Semiconductor Supplier to Join Civil Infrastructure Platform Project to Accelerate Smart Industrial Devices (Feb. 16, 2017)
- Trillium raises Series A for driverless car security (Feb. 16, 2017)
- Nvidia, and AMD Increase GPU Attach Rates While Total GPU Shipments Remain Flat Quarter to Quarter (Feb. 16, 2017)
- Truechip Partners with SoAR Solution Inc. to Market Verification IP Products in Korea (Feb. 16, 2017)
- Mentor Graphics Announces Veloce Strato Platform Scales Up to 15BG (Feb. 16, 2017)
- A Roadmap to Emulation of 15 Billion Gate ICs (Feb. 16, 2017)
- Globalfoundries to build FDSOI fab in China (Feb. 16, 2017)
- VESA Highlights Growing DisplayPort Alt Mode Adoption and Latest DisplayPort Developments at Mobile World Congress (Feb. 15, 2017)
- IoT Group Sets Broad Agenda (Feb. 15, 2017)
- Altair Introduces the ALT1250, the Most Advanced and Integrated Narrowband CAT-M1 and NB1 Cellular IoT Chip (Feb. 15, 2017)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2017 (Feb. 15, 2017)
- SST Announces Qualification of Embedded SuperFlash on 110 nm CMOS Process (Feb. 15, 2017)
- Make your device unattractive to hackers: Design in security early on (Feb. 15, 2017)
- Huawei Sued for AVC Patent Infringement (Feb. 15, 2017)
- Microsemi Unveils Industry's Lowest Power Cost-Optimized FPGA Product Family for Access Networks, Wireless Infrastructure, Defense and Industry 4.0 Markets (Feb. 14, 2017)
- QuickLogic Signs Agreement with Second Top-Tier Foundry for ArcticPro eFPGA IP (Feb. 14, 2017)
- Aldec sets a new paradigm with a single platform for Design Rule Checking and Clock Domain Crossing Verification for FPGA and ASIC designs (Feb. 14, 2017)
- Driver monitoring solution enables gesture control, personalization (Feb. 14, 2017)
- Security Experts Cite IoT Risks (Feb. 14, 2017)
- SMIC Reports 2016 Fourth Quarter Results (Feb. 14, 2017)
- Extending 2 to 5 times the operation time of your battery-powered SoC (Feb. 13, 2017)
- Profile: Restructured Imagination focusses on PowerVR, MIPS and wireless IP (Feb. 13, 2017)
- Intel Introduces Versatile New FPGA for Industrial and Automotive Markets (Feb. 13, 2017)
- Intrinsic ID Introduces CITADEL, the SRAM PUF-based Key Provisioning System that Breaks the Barriers of IoT Security (Feb. 13, 2017)
- Winners & Losers of GloFo's China Deal (Feb. 13, 2017)
- AEC-Q100 qualified, 40V PoL regulators (Feb. 13, 2017)
- Automotive Grade Linux Continues Rapid Growth (Feb. 13, 2017)
- Sensors, wireless and IoT on the rise at ISSCC (Feb. 13, 2017)
- IDT to Buy Optical Interconnect IC Vendor GigPeak (Feb. 13, 2017)
- Core Wireless Announces Patent License Agreement With Global Consumer Electronics Manufacturer (Feb. 13, 2017)
- Future of Automotive Security Technology Research releases secure vehicle manifesto (Feb. 13, 2017)
- Ford Invests in Argo AI, a New Artificial Intelligence Company, in Drive for Autonomous Vehicle Leadership (Feb. 10, 2017)
- TSMC January 2017 Revenue Report (Feb. 10, 2017)
- SATO deploys Acuitas Digital IoT platform for Thomas Pink (Feb. 09, 2017)
- HOPU-ARM Innovation Fund officially launched (Feb. 09, 2017)
- 力旺电子NeoFuse硅智财率先于台积公司16奈米FFC制程完成可靠度验证 (Feb. 09, 2017)
- Thread Group Takes Leap Forward with Availability of First Certified Software Stacks from ARM, NXP, OpenThread and Silicon Labs; Launches Product Certification Program (Feb. 09, 2017)
- GLOBALFOUNDRIES Expands to Meet Worldwide Customer Demand (Feb. 09, 2017)
- Faraday Monthly Consolidated Sales Report - January 2017 (Feb. 09, 2017)
- G'foundries Revamps China Deal (Feb. 09, 2017)
- MediaTek Launches New Helio SoC (Feb. 08, 2017)
- eMemory Qualified NeoFuse in TSMC 16FFC Process (Feb. 08, 2017)
- TSMC, Samsung Diverge at 7nm (Feb. 08, 2017)
- Crestron Moves to Intel FPGAs to Improve Video Quality, Connections (Feb. 08, 2017)
- iPhone Share Drops in China for First Time (Feb. 08, 2017)
- Intel to Spend $7 Billion on Arizona Fab (Feb. 08, 2017)
- MediaTek Introduces Helio P25 Premium Performance Chip For Dual-Camera Smartphones (Feb. 08, 2017)
- PCI Express 4.0通路裕量和其优点 (Feb. 07, 2017)
- ICU tech GmbH Selects VectorCAST to Shorten IEC 62304 Compliance (Feb. 07, 2017)
- Arteris FlexNoC Interconnect IP is Licensed by Nextchip for Automotive Advanced Driver Assistance Systems (ADAS) (Feb. 07, 2017)
- SonicsGN Provides Integration Fabric for Nexell NXP5540 Application Processor (Feb. 07, 2017)
- Significant IP-core Announcements for Omnitek (Feb. 07, 2017)
- Rambus Introduces High Bandwidth Memory PHY on GLOBALFOUNDRIES FX-14 ASIC Platform using 14nm LPP Process Technology (Feb. 07, 2017)
- Valens and Lattice Semiconductor Partner to Deliver HDBaseT Reference Design to Support 4K 60Hz 4:4:4 Resolutions (Feb. 07, 2017)
- Crestron Leverages intoPIX Ultra-Low Latency JPEG 2000 Technology in New DigitalMedia NVX Series (Feb. 07, 2017)
- Intel Shows 2.5D FPGA at ISSCC (Feb. 07, 2017)
- Micron, Hynix Reportedly Seek Stake in Toshiba (Feb. 07, 2017)
- R-Stratus-LP silicon IP reduces significantly power consumption of flash memories (Feb. 06, 2017)
- Flex Logix Qualifies Serial I/O IP From CAST And SOC Solutions For EFLX Embedded FPGA (Feb. 06, 2017)
- GUC Monthly Sales Report - January 2017 (Feb. 06, 2017)
- Aquantia and AptoVision Unveil First Software-Defined Video over Ethernet (SDVoE) Solution for Pro-AV Market utilizing Aquantia's FPGA Programmable PHY (Feb. 06, 2017)
- Object-Detection Becomes Wearable (Feb. 06, 2017)
- Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP (Feb. 06, 2017)
- Swatch Group and CSEM are developing a Swiss made ecosystem for connected objects (Feb. 05, 2017)
- GUC Unveils Solid State Drive ASIC Capabilities (Feb. 02, 2017)
- Rambus Selects Synopsys' ARC EM Processors for Embedded Security Platform (Feb. 02, 2017)
- Panasonic and UMC Partner for 40nm ReRAM Process Platform (Feb. 02, 2017)
- Apple to add ARM processor to Mac computers (Feb. 02, 2017)
- GUC 推出固態硬碟 ASIC解決方案 整體解決方案涵蓋TSMC 28 奈米front-end設計至封裝技術 (Feb. 02, 2017)
- Rambus Unveils 56G SerDes PHYs on Leading-Edge FinFET Technology (Feb. 01, 2017)
- Barco Silex demonstrates Viper OEM solution for real-time 4K Video networking at ISE 2017 (Feb. 01, 2017)
- WiLAN Subsidiary Enters into Agreement with Microsemi (Feb. 01, 2017)
- Gartner Says Samsung and Apple Continued to Lead as Top Global Semiconductor Customers in 2016 (Feb. 01, 2017)
- CEVA, Inc. Announces Fourth Quarter and Year End 2016 Financial Results (Feb. 01, 2017)
- Telit adds Wi-Fi and low-power solutions for IoT with acquisition of GainSpan to extend end-to-end IoT solutions reach (Feb. 01, 2017)
- Cadence Reports Fourth Quarter and Fiscal Year 2016 Financial Results (Feb. 01, 2017)
- Comment: Five steps to enabling a data-driven, smart factory (Feb. 01, 2017)
- Cavium Deploys the Cadence Palladium Z1 Enterprise Emulation Platform (Jan. 31, 2017)
- Xilinx Displays Pro AV Solutions with Any-to-Any Connectivity at ISE 2017 (Jan. 31, 2017)
- Industrial IoT Nets Blossom (Jan. 31, 2017)
- IoT Contest Shows Security Gaps (Jan. 31, 2017)
- Nokia Applies IMPACT to IoT Fragmentation (Jan. 31, 2017)
- IoT Secure Systems Summit expands speaker lineup (Jan. 31, 2017)
- 2017 embedded processor report: At the edge of Moore's Law and IoT (Jan. 31, 2017)
- Slow India may lose Cricket wafer fab (Jan. 31, 2017)
- Nokia IoT solution targets smart cities (Jan. 31, 2017)
- Credo Demonstrates 112G PAM4 SR, 56G PAM4 LR, and 56G NRZ SerDes Technology at DesignCon (Jan. 30, 2017)
- 25 Gigabit Ethernet Consortium Members Validate Multi-Vendor Interoperability (Jan. 30, 2017)
- Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack (Jan. 30, 2017)
- Synopsys Extends Verification FastForward Program, Enabling Cadence Incisive and Mentor Graphics Questa Users to Adopt VCS Simulation with Fine-Grained Parallelism Technology (Jan. 30, 2017)
- Aquantia Announces the Industrys First FPGA-Programmable Multi-Gigabit Ethernet PHY Device (Jan. 30, 2017)
- Bosch joins MIPI Alliance as new member (Jan. 30, 2017)
- Rambus Reports Fourth Quarter and Fiscal Year 2016 Financial Results (Jan. 30, 2017)
- Toshiba Confirms Memory Chip Selloff (Jan. 27, 2017)
- Memory compressor IP can save time, energy (Jan. 26, 2017)
- Starblaze Achieves First-Pass Silicon Success for Storage SoC with Synopsys ARC Processor and Interface IP (Jan. 26, 2017)
- Synopsys' ARC SEM Security Processors Win Linley Group's 2016 Analysts' Choice Award for Best Processor IP (Jan. 25, 2017)
- Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX Process by SoC Designers (Jan. 25, 2017)
- Peregrine Semiconductor Introduces Next-Generation Technology Platform with Industry's Best RonCoff Performance (Jan. 25, 2017)
- Cypress Offers Enhanced Security, Reliability and Performance for Automotive, Industrial and IoT Applications with New FL-L NOR Flash Memories (Jan. 25, 2017)
- Is Semiconductor M&A Wave Dissipating? (Jan. 25, 2017)
- Ex-Elpida CEO's China Fab Plan Dropped? (Jan. 25, 2017)
- Patent Suits Hit Q'comm Profits (Jan. 25, 2017)
- Cadence Virtuoso ADE Product Suite Named Product of the Year by Electronic Products Magazine (Jan. 24, 2017)
- UMC's 28nm Ramp to Slip This Year (Jan. 24, 2017)
- ZTE Wireless Institute Achieves Performance Breakthrough for Deep Learning with Intel FPGAs (Jan. 24, 2017)
- Nordic Semiconductor nRF52 Series-based Bluetooth low energy and NFC module offers ultra-compact wireless solution for smart cards and wearables (Jan. 24, 2017)
- Flex Logix Works With DARPA To Develop Flex Logix's Embedded FPGA IP For Government Projects (Jan. 23, 2017)
- Dolphin Integration Receives Open-Silicon's Award for the Emerging IP Partner of the Year 2016 in the Low Power IoT Ecosystem (Jan. 23, 2017)
- Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.2 Percent in 2017 (Jan. 23, 2017)
- Concept Engineering's RTLVision Debugger and Viewer to Power Real Intent's Verification Solutions (Jan. 23, 2017)
- X-Fab is Fastest Growing Foundry (Jan. 23, 2017)
- From Hardware Emulation to High-Frequency Trading Riding the FPGA Wave (Jan. 23, 2017)
- Silicon Labs Expands IoT Portfolio (Jan. 23, 2017)
- Silicon Labs Acquires Wi-Fi Innovator Zentri (Jan. 23, 2017)
- Tsinghua to Build $30 Billion Memory Fab in China (Jan. 20, 2017)
- Advantech is Microsoft Global Internet of Things (IoT) Valued Partner (Jan. 20, 2017)
- VIA launches Custom IoT Platform Design Service (Jan. 19, 2017)
- Faraday: World's First ISO 26262 Certified ASIC Service Company (Jan. 19, 2017)
- Future of Chip Research Group Questioned (Jan. 19, 2017)
- Global semiconductor revenue topped $339.7 billion in 2016 (Jan. 19, 2017)
- 智原科技：全球第一家获颁ISO 26262证书的ASIC设计服务厂商 (Jan. 19, 2017)
- Synopsys Releases New Version of Coverity Static Analysis Tool with Enhanced Security for Mobile and Web Applications (Jan. 19, 2017)
- 2015-2016 Deals Dominate Semiconductor M&A Ranking (Jan. 19, 2017)
- SMIC Reaffirms Fourth Quarter 2016 Guidance (Jan. 19, 2017)
- Design and Reuse adds advanced IP Customer Reporting Features to its IP intranet Management Provider Station (IPMS) and delivers a next generation Audit Support Engine (Jan. 18, 2017)
- New Video Compressor and Camera Processor Cores Expand CAST's IP Line (Jan. 18, 2017)
- MIPI Alliance Introduces MIPI Discovery and Configuration (DisCo) Base Architecture and Class Specifications (Jan. 18, 2017)
- Automotive safety hypervisor announced for ARM Cortex-R52 (Jan. 18, 2017)
- Nordic-powered Bluetooth low energy sensors provide wireless solution for detecting water leaks and monitoring changes in temperature and humidity (Jan. 18, 2017)
- Gartner Says Worldwide Semiconductor Revenue Grew 1.5 Percent in 2016 (Jan. 18, 2017)
- WiLAN Provides Litigation Update (Jan. 18, 2017)
- Automotive Ethernet for ADAS (Jan. 18, 2017)
- Three Tips to Maximize your SoC performance (Jan. 17, 2017)
- Beyond Semiconductor partners with Rubicon Labs to deliver full stack solution for cryptographically secure execution processor (Jan. 17, 2017)
- Imagination's new PowerVR GPUs deliver leading performance in lowest area for mid-range markets (Jan. 17, 2017)
- Arteris announces 9 new licensees, multiple interconnect IP product releases and profitable operation in 2016 (Jan. 17, 2017)
- Mantaro Introduces an Advanced Development Platform for the Altera Arria 10 SoC (Jan. 17, 2017)
- Dialog Semiconductor Plc.: Dialog Semiconductor Powers Next-Generation Connected Cars (Jan. 17, 2017)
- Toshiba Mulls Chip Business Spinoff (Jan. 17, 2017)
- Tech body welcomes May's Brexit plan (Jan. 17, 2017)
- Moortec Announce Embedded Temperature Sensor on TSMC 16FF+ & FFC (Jan. 16, 2017)
- Sidense Receives Coveted ISO 9001:2015 Quality Management System Certification (Jan. 16, 2017)
- Rambus Signs Patent License Agreement with Winbond (Jan. 16, 2017)
- Socionext Accelerates Test Generation and Lowers Test Cost Using Synopsys TetraMAX II (Jan. 16, 2017)
- Hundreds of Xilinx Space Grade FPGAs Deployed in Launch of Iridium NEXT Satellites (Jan. 16, 2017)
- Turning cars into mobile devices: MIPI (Jan. 16, 2017)
- Scalable ECU platform to accomplish level 3 autonomous driving (Jan. 16, 2017)
- Nordic Bluetooth low energy-powered scalable design platform for wearables supports AirFuel-compliant wireless charging (Jan. 16, 2017)
- Hardware agnostic IoT solution takes customization to the next level (Jan. 16, 2017)
- Trilinear Technologies Adds Display Stream Compression (DSC) Encode and Decode Solutions to IP Portfolio (Jan. 13, 2017)
- TSMC Expects Flat Year for Foundry (Jan. 13, 2017)
- Pure-Play Foundry Market Surges 11% in 2016 to Reach $50 Billion! (Jan. 13, 2017)
- Google Searches for Better Silicon (Jan. 12, 2017)
- China Expected to Poach More Taiwan Chip Execs (Jan. 12, 2017)
- Mentor Graphics Expands Comprehensive ISO 26262 Qualification Program (Jan. 12, 2017)
- 9 Hottest Embedded Electronics Trends in 2016 (Jan. 12, 2017)
- Gartner Says Worldwide Semiconductor Capital Spending Is Forecast to Grow 2.9 Percent in 2017 (Jan. 12, 2017)
- Crossbar ReRAM in production at SMIC (Jan. 12, 2017)
- BaySand enhanced MetalCopy Program to Support 14nm FPGA Transition to ASIC (Jan. 12, 2017)
- TSMC Reports Fourth Quarter EPS of NT$3.86 (Jan. 12, 2017)
- Cadence宣布推出业界首款蓝牙5验证IP (Jan. 12, 2017)
- 从Xtensa可配置处理器架构出发 了解可配置处理器开发原理 (Jan. 12, 2017)
- China Company Receives Working First Silicon for SingMai's Analogue Video Decoder (Jan. 11, 2017)
- AltaSens Adopts Cadence Modus Test Solution for Mixed-Signal Image Sensor Designs (Jan. 11, 2017)
- TSMC December 2016 Revenue Report (Jan. 10, 2017)
- OmniPHY Joins TSMC IP Alliance Program (Jan. 10, 2017)
- Sequans Extends Collaboration with TSMC to Develop World's first LTE-M chip for IoT (Jan. 10, 2017)
- Synopsys Extends Software Integrity Platform with Acquisition of Forcheck (Jan. 10, 2017)
- Mediatek Licenses Sonics' NoC and Memory Scheduler IP (Jan. 10, 2017)
- Securing chips for the IoT (Jan. 10, 2017)
- Arasan Announces Total IP Solution for MIPI I3C Standard (Jan. 10, 2017)
- Cadence Announces Availability of Industry-First Bluetooth 5 Verification IP (Jan. 09, 2017)
- CEVA Announces Record Revenues for the Fourth Quarter (Jan. 09, 2017)
- UMC Reports Sales for December 2016 (Jan. 09, 2017)
- ARM trusted cores get Lauterbach debug support (Jan. 09, 2017)
- ARM Exec Dizzy for Open-Source Twizy (Jan. 07, 2017)
- Bosch Dev Kit to Ease IoT (Jan. 07, 2017)
- Open Source Reaches Processor Core (Jan. 06, 2017)
- Faraday Monthly Consolidated Sales Report - December 2016 (Jan. 06, 2017)
- Process Makes Smaller, Cheaper Chips (Jan. 06, 2017)
- Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack (Jan. 05, 2017)
- Faraday Extends SoC Design Services to Include Virtual Prototyping Solution Using Synopsys Virtualizer (Jan. 05, 2017)
- DeepGlint Harness the Power of CEVA-XM4 Imaging and Vision Platform for Intelligent Video Analytic and ADAS Solutions (Jan. 05, 2017)
- MIPS I6500 CPU sub-system with NetSpeed's Gemini IP provides highly efficient processing for vision applications (Jan. 05, 2017)
- Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices (Jan. 05, 2017)
- Fortemedia Licenses Tensilica Fusion F1 DSP for Use in Always-On Smart Microphone Processor (Jan. 05, 2017)
- Almalence Video SuperSensor Software Now Improves Video Image Quality Powered by Cadence Tensilica Vision DSP (Jan. 05, 2017)
- Imagination collaborates with Socionext on advanced video and display technologies (Jan. 05, 2017)
- GUC Monthly Sales Report - December 2016 (Jan. 05, 2017)
- AMD Describes Vega GPU (Jan. 05, 2017)
- Socionext Develops New Large Scale, High Efficiency Distributed Processing Server, Fully Utilizing Multi-Core Processors (Jan. 04, 2017)
- SingMai's aCVi decoder successfully tapes out in China (Jan. 04, 2017)
- CSEM announces Bluetooth 5-ready silicon RF IP (Jan. 04, 2017)
- Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs (Jan. 04, 2017)
- ON Semiconductor License CEVA Imaging and Vision Platform for Automotive ADAS (Jan. 04, 2017)
- ZigBee Alliance Offers Universal Language for IoT (Jan. 04, 2017)
- HDMI Forum Announces Version 2.1 of the HDMI Specification (Jan. 04, 2017)
- Cadence and Dolby Collaborate to Enable the World's First TVs Featuring Dolby Atmos Technology (Jan. 04, 2017)
- Apple joins SoftBank's Vision Fund with $1 billion investment (Jan. 04, 2017)
- Intel Tips Plans for 5G Modem (Jan. 04, 2017)
- AndesCore Ultra Low-Power, High Performance N705 CPU Core Wins Design Socket In Sino Wealth Electronic's New Bluetooth Low Energy Chip Design (Jan. 04, 2017)
- Rambus to Demonstrate IoT Security Technology in Qualcomm Booth at CES (Jan. 03, 2017)
- Global Semiconductor Sales Up 7 Percent Year-to-Year (Jan. 03, 2017)
- IoT design needs system focus (Jan. 03, 2017)
- ASolid Adopts AndesCore N9 for its AS2726 eMMC Controller to Deliver Competitive Market Advantage (Dec. 30, 2016)
- 重庆高新区雅特力发布首款自主研发集成电路芯片 (Dec. 29, 2016)
- HDL Design House Selected as ARM Approved Design Partner (Dec. 20, 2016)
- CEVA-X1 DSP Core Targets Cellular IoT Opportunities (Dec. 19, 2016)
- Imagination's PowerVR GPU is first to pass OpenVX 1.1 conformance with Khronos (Dec. 16, 2016)
- ARM extends HPC offering with acquisition of software tools provider Allinea Software (Dec. 16, 2016)
- Faraday Readies MCU ASIC Migration Path with 55nm eFlash (Dec. 15, 2016)
- Mechatronics aids in embedded system design (Dec. 15, 2016)
- Silicon-proven HBM Gen2 Hardened PHY from eSilicon (Dec. 15, 2016)
- GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX Solutions (Dec. 15, 2016)
- Imagination's Ensigma wireless communications IP now Wi-Fi CERTIFIED on chip that powers Creator Ci40 board (Dec. 15, 2016)
- Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution (Dec. 15, 2016)
- Microsemi Adds IP for Resolver Sensors to FPGA-Based Multi-Axis Motor Control Solution Targeting Aerospace and Defense, Automotive and Industrial Applications (Dec. 15, 2016)
- PLDA Group Spins Off its QuickPlay FPGA Accelerator Activities into the Newly Formed Accelize (Dec. 15, 2016)
- GUC Opens New Netherlands Office (Dec. 15, 2016)
- China Dominates Planned Chip Fabs (Dec. 15, 2016)
- 智原55纳米eFlash方案推动MCU ASIC技术演进 (Dec. 15, 2016)
- 62 new fabs coming on-line in 2017-20 (Dec. 14, 2016)
- Himax, emza and CEVA Partner to Create Ultra-Low Power, Always-On Vision Sensor for IoT (Dec. 14, 2016)
- IoT design kit is ZigBee certified for the home (Dec. 14, 2016)
- Samsung Reportedly Mulls Foundry Spinoff (Dec. 14, 2016)
- Chip Market Brightens in 2017 (Dec. 14, 2016)
- European tech M&A deals double in 2016 (Dec. 14, 2016)
- 最小化电源域漏电功耗以及设计余量进而缩短上市时间 (Dec. 13, 2016)
- Flex Logix High-Performance Embedded FPGA IP Core Now Available for TSMC 16FF+ and 16FFC (Dec. 13, 2016)
- SRT Group License CEVA Signal Processing IP (Dec. 13, 2016)
- GLOBALFOUNDRIES Demonstrates Industry-Leading 56Gbps Long-Reach SerDes on Advanced 14nm FinFET Process Technology (Dec. 13, 2016)
- NXP and Google Advance IoT Development on New Android Things Platform (Dec. 13, 2016)
- Smart Home Reference Designs from Silicon Labs Accelerate Development of IoT Connected Devices (Dec. 13, 2016)
- How to Protect Connected Home Devices and Appliances from Cyber Attacks (Dec. 13, 2016)
- Rambus Renews License Agreement with Thales (Dec. 13, 2016)
- WiLAN Subsidiary Acquires Patent Portfolio from GLOBALFOUNDRIES (Dec. 13, 2016)
- Qualcomm Falters at Top Of Fabless Ranking (Dec. 13, 2016)
- Lurking Behind Every M&A Is China (Dec. 13, 2016)
- Moortec Announce Embedded Voltage Monitor on TSMC 16FF+ and FFC Processes (Dec. 12, 2016)
- TSMC Plans New Fab for 3nm (Dec. 12, 2016)
- Lattice gives iCE40 more power, I/O and memory (Dec. 12, 2016)
- Robotics of things - the next big thing in embedded (Dec. 12, 2016)
- TSMC November 2016 Revenue Report (Dec. 09, 2016)
- UMC Reports Sales for November 2016 (Dec. 09, 2016)
- Smartlogic PCI Express DMA IP Cores now available for Intel FPGAs (Dec. 08, 2016)
- Nexell's release of new AP supporting 4K 60fps with Chips&Media' HEVC/H.265 and VP9 (Dec. 08, 2016)
- Alliance between prpl Foundation and IoTSF puts 'security by design' at the heart of embedded computing (Dec. 08, 2016)
- UNH-IOL Shines Spotlight on Internet of Things Interoperability (Dec. 08, 2016)
- CEVA creates new value by enhancing IoT and machine learning applications (Dec. 08, 2016)
- ACE Awards: AMD Wins Company of Year (Dec. 08, 2016)
- What Siemens' Mentor Buy Means to IC Designers (Dec. 08, 2016)
- Synopsys Announces Industry's First DisplayPort 1.4 with DSC 1.2 Verification IP and Test Suites (Dec. 08, 2016)
- ARM Offers Support For TSMC 7nm Manufacturing (Dec. 08, 2016)
- Arasan Chip Sytems Announces Xilinx Alliance Program Membership (Dec. 08, 2016)
- Nantero Secures More Than $21M in Additional Funding (Dec. 08, 2016)
- CEVA Leads the Bluetooth 5 IP Wave (Dec. 07, 2016)
- HiSilicon Divison of Huawei licenses UltraSoC's SoC monitoring and analytics solutions (Dec. 07, 2016)
- Qualcomm Begins Commercial Sampling of World's First 10nm Server Processor and Reshapes the Future of Datacenter Computing (Dec. 07, 2016)
- Synopsys Takes Hierarchical Timing Signoff Mainstream (Dec. 07, 2016)
- ams releases 0.30 um process for ultra-low noise sensing and analog ICs (Dec. 07, 2016)
- Xilinx FPGAs to be Deployed in New Amazon EC2 F1 Instances - Accelerating Genomics, Financial Analytics, Video Processing, Big Data, Security, and Machine Learning Inference (Dec. 07, 2016)
- Comcores demonstrates Radio-Over-Ethernet and L1 offload solution live at ITU FG IMT-2020 Workshop and Demo Day: Wireline Technology Enablers for 5G (Dec. 07, 2016)
- TSMC, IBM Detail 7-nm Work (Dec. 06, 2016)
- STMicroelectronics releases multi-sensor module for IoT and wearable designs (Dec. 06, 2016)
- Bluetooth 5 ready SoC from Nordic redefines scope for smart home, IoT, and wearables by delivering 4x range, 2x bandwidth, and enhanced security with on-chip ARM CryptoCell cryptographic accelerator (Dec. 06, 2016)
- Securing legacy embedded systems in the IoT (Dec. 06, 2016)
- Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement (Dec. 06, 2016)
- Five Suppliers Hold 41% of Global Semiconductor Marketshare in 2016 (Dec. 06, 2016)
- Cadence推出Tensilica Fusion G3 DSP (Dec. 06, 2016)
- D32PRO, a 32-bit CPU from DCD named the Product of the Future by Polish Agency for Enterprise Development (Dec. 05, 2016)
- Global Semiconductor Sales Increase 5 Percent Year-over-Year in October; Industry Forecast Revised Upward (Dec. 05, 2016)
- Vanguard International Completed Qualifying Attopsemi's OTP in several CMOS nodes (Dec. 04, 2016)
- BrainChip and Cisco Internet of Everything Innovation Center Sign Agreement to Demonstrate the Capabilities of BrainChip's Spiking Neural Adaptive Processor (SNAP) Technology (Dec. 02, 2016)
- CEITEC chooses 8051 IP from CAST for Embedded Security Controller Platform (Dec. 01, 2016)
- Intel Snags Exec from ARM to Run IoT (Dec. 01, 2016)
- Arasan Announces MIPI C-PHY IP Core compliant to the latest C-PHY v1.1 Specifications (Dec. 01, 2016)
- Chipus Microelectronics launches a battery charger IP in a 0.18um BCD process (Dec. 01, 2016)
- Multiple Vendors Pursue eFPGA (Dec. 01, 2016)
- Will China Grab ARM Servers? (Dec. 01, 2016)
- Audio Software from Silicon Labs Strikes the Right Note for Automotive Radio Market (Nov. 30, 2016)
- QuickLogic Announces ArcticPro Ultra-Low Power Embedded FPGA IP Licensing Initiative (Nov. 30, 2016)
- NGCodec uses Amazon EC2 F1 instances with custom FPGAs running 4k Video Compression (Nov. 30, 2016)
- Synopsys Completes Acquisitions of Cigital and Codiscope (Nov. 30, 2016)
- QuickLogic Joins GLOBALFOUNDRIES FDXcelerator Partner Program (Nov. 30, 2016)
- WiLAN Subsidiary Enters into License Agreement with Elite Semiconductor Memory Technology Inc. (Nov. 30, 2016)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2016 (Nov. 30, 2016)
- Taiwan Semiconductor Manufacturing Co. (TSM) Shares Sold by Augustine Asset Management Inc. (Nov. 30, 2016)
- D&R announced the latest version of its IP Procurement Manager, part of the Design & Reuse IPMS Enterprise platform (Nov. 30, 2016)
- eSilicon Takes TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper (Nov. 29, 2016)
- SiFive Launches Industry's First Open-Source RISC-V SoC (Nov. 29, 2016)
- ICScape SPICE Simulator Chosen by Kilopass for Pre- and Post-Layout Simulation of Memory IP (Nov. 29, 2016)
- S2C Expands Its FPGA Prototyping Library With Arria 10 Solution And Delivers Its Powerful Technology To The High-Performance Computing Market (Nov. 29, 2016)
- ON Semiconductor to Debut First to Market, Truly Scalable Design Platform for Next Generation Wearable Technology at CES 2017 (Nov. 29, 2016)
- BaySand, Codasip, Codeplay and UltraSoC accelerate IoT development with (Nov. 29, 2016)
- IoT and Automotive to Drive IC Market Growth Through 2020 (Nov. 29, 2016)
- New EEMBC Benchmark Targets Internet of Things Security Functions (Nov. 29, 2016)
- Lattice Deal May Hit A Snag (Nov. 29, 2016)
- Samsung Defection From ARM to RISC-V (Nov. 28, 2016)
- 法国海豚集成邀您参加现场视频讲座： 超低功耗SoC设计 (Nov. 28, 2016)
- prpl Foundation and CABA create important alliance to advance smart home security (Nov. 28, 2016)
- Silexica Receives Series A Financing Led by Merus Capital (Nov. 28, 2016)
- Silab Tech Pvt Ltd Ranked Number 21st Fastest Growing Technology Company on the Deloitte Technology Fast50 India 2016 (Nov. 25, 2016)
- M&A Takes New Twists (Nov. 25, 2016)
- Where are the FPGA Architectures for the 21st Century? (Nov. 24, 2016)
- NANO16: FD-SOI moves towards 22nm and 14nm (Nov. 23, 2016)
- Ningbo Semiconductor International Corporation Officially Inaugurated (Nov. 23, 2016)
- Analyzing the Global Semiconductors Industry 2016 (Nov. 23, 2016)
- Infineon adds two power boards to iMOTION Modular Application Design Kit family (Nov. 23, 2016)
- STMicroelectronics Boosts Trusted Computing with New Advanced Security Modules (Nov. 23, 2016)
- Pycom's five-network IoT development board incorporates Sequans LTE-M technology (Nov. 23, 2016)
- Smart Kiosk: One-stop Service Point for Smart Communities (Nov. 23, 2016)
- The top IoT software platforms for 2016 (Nov. 23, 2016)
- Global Patent Applications Rose to 2.9 Million in 2015 on Strong Growth From China; Demand Also Increased for Other Intellectual Property Rights (Nov. 23, 2016)
- Codasip and UltraSoC deliver advanced RISC-V SoC analysis and debug (Nov. 22, 2016)
- Sidense Exhibiting its 1T-OTP Non-Volatile Memory Solutions at the Inaugural REUSE2016 Tradeshow and Conference (Nov. 22, 2016)
- Silicon Mobility OEMs Mentor Graphics Precision Synthesis Technology to Streamline OLEA Tool Flow for Automotive Applications (Nov. 22, 2016)
- North American Semiconductor Equipment Industry Posts October 2016 Book-to-Bill Ratio of 0.91 (Nov. 22, 2016)
- Strategy Analytics: Apple Captures Record 91 Percent Share of Global Smartphone Profits in Q3 2016 (Nov. 22, 2016)
- Philippe Morali, High Technology Veteran, Joins eSilicon as CFO (Nov. 22, 2016)
- Mobileye Adopts Key Synopsys Automotive Functional Safety Verification Solution to Enable ISO 26262 Compliance of its Next-Generation ADAS SoCs (Nov. 21, 2016)
- MACOM Announces Definitive Agreement to Acquire AppliedMicro (Nov. 21, 2016)
- ARMv8-A, Cavium powering bare-metal servers (Nov. 21, 2016)
- Altair Semiconductor opens IoT R&D center in Finland (Nov. 21, 2016)
- 力旺电子NeoFuse硅智财于台积公司10奈米FinFET制程验证成功 (Nov. 18, 2016)
- IoT Developers, 'Focus on Your Secret Sauce' (Nov. 18, 2016)
- Top 20 IC vendors expected to grow 3% (Nov. 17, 2016)
- CEVA and NextG-Com Partner to offer Integrated LTE Cat-M1 and Cat-NB1 Solutions for Cost-Sensitive IoT applications (Nov. 17, 2016)
- Siemens Acquires Mentor Graphics: What Does This Mean for EDA? (Nov. 17, 2016)
- Gartner Says Chinese Smartphone Vendors Were Only Vendors in the Global Top Five to Increase Sales in the Third Quarter of 2016 (Nov. 17, 2016)
- Intel's Nervana Attacks GPUs (Nov. 17, 2016)
- eMemory's NeoFuse IP Verified in TSMC 10nm FinFET Process (Nov. 16, 2016)
- MegaChips Adopts Omni Design's Ultra-Low Power Analog-to-Digital Converter Front-Ends for Next-Generation Communication Networks (Nov. 16, 2016)
- Five Top-20 Semiconductor Suppliers to Show Double-Digit Gains in 2016 (Nov. 16, 2016)
- NXP's New SmartMX2 P60 Step-Up! Secure Element is Enabled with Intrinsic-ID's Technology to Provide Secure Authentication and Confidential Data Exchange (Nov. 16, 2016)
- Trillium, NXP team up on car security (Nov. 16, 2016)
- Microsemi is First FPGA Provider to Offer Open Architecture RISC-V IP Core and Comprehensive Software Solution for Embedded Designs (Nov. 16, 2016)
- ARM's trillion IoT chips need vision (Nov. 16, 2016)
- NXP Strengthens Industrial Connectivity Portfolio with Multi-Protocol Sub-GHz Wireless Transceiver Platform (Nov. 16, 2016)
- ON Semiconductor Continues to Expand IoT Portfolio with Sigfox Certification for North American Market (Nov. 16, 2016)
- Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development (Nov. 16, 2016)
- DELTA Microelectronics Expands UK Presence, Partners with Solution in Silicon (Nov. 16, 2016)
- Enyx Premieres 25G TCP and UDP Offload Engines with Xilinx Virtex UltraScale+ 16nm FPGA on BittWare's XUPP3R PCIe Board (Nov. 16, 2016)
- The end of the smartphone era: What will be the technology battlegrounds of the next decade? (Nov. 16, 2016)
- Brite Semiconductor Announces DDR4 IP Achieve 2400 Mbps on SMIC 40nm Process (Nov. 15, 2016)
- Real Intent Announces Meridian RDC, a New Product for Reset Domain Crossing Sign-off (Nov. 15, 2016)
- Imagination Technologies Adopts Synopsys STAR Memory System for Embedded Memory Test and Repair for New MIPS Processor (Nov. 15, 2016)
- ST's Bozotti on 'back-to-silicon' differentiation (Nov. 15, 2016)
- Blue Pearl Software Enters in to Agreement with FUJISOFT to Provide RTL Verification Solutions to Japan (Nov. 15, 2016)
- Intel Preps its AI Strategy (Nov. 15, 2016)
- Packet Introduces Global ARMv8-A Bare Metal Cloud to Power Container and IoT Workloads (Nov. 15, 2016)
- SMIC and IMECAS Sign A Cooperation Agreement for MEMS R&D and Foundry Platform (Nov. 15, 2016)
- Enyx Premieres 25G TCP and UDP Offload Engines w/Xilinx Virtex UtlraScale+ 16nm FPGA on BittWares XUPP3R PCIe Board (Nov. 15, 2016)
- Socionext Announces New Low-Power, Scalable ARM-based Multi-Core Processor SoC (Nov. 14, 2016)
- Denso to launch joint research on multithreaded CPU cores with Imagination Technologies (Nov. 14, 2016)
- Cadence Modus Test Solution Enables Support for Safety-Critical SoC Designs Using ARM MBIST Interface (Nov. 14, 2016)
- Synopsys Advances Test and Yield Analysis Solution for 7-nm Process Node (Nov. 14, 2016)
- Xilinx Reconfigurable Acceleration Stack Delivers Fastest Path to 2-6x Compute Efficiency over FPGA Competition (Nov. 14, 2016)
- ARM and US TrustedCare Inc., partner to integrate wearable and medical devices for accountable care (Nov. 14, 2016)
- Siemens to expand its digital industrial leadership with acquisition of Mentor Graphics (Nov. 14, 2016)
- Socionext Develops 4K/60p HEVC Compatible Multi-Format Codec IC (Nov. 11, 2016)
- Could FPGA IP be headed to a SoC near you? (Nov. 10, 2016)
- A Look at New Open Standards to Improve Reliability and Redundancy of Automotive Ethernet (Nov. 10, 2016)
- videantis wins second Deloitte Technology Fast 50 award fueled by rapid growth in automotive (Nov. 10, 2016)
- Thread Group Opens Testing to Members as ARM, NXP and Silicon Labs Bring First Conforming Stacks to Market (Nov. 10, 2016)
- TSMC October 2016 Revenue Report (Nov. 10, 2016)
- Dolphin Integration offers a live webinar on the proven recipe for uLP SoC (Nov. 10, 2016)
- Creonic Delivers New CCSDS LDPC Forward Error Correction IP Core (Nov. 10, 2016)
- Codasip and BaySand Partnership Makes RISC-V Based ASICs an Ideal Choice for IoT Designs (Nov. 10, 2016)
- Xilinx Unveils Details for New 16nm Virtex UltraScale+ FPGAs with High Bandwidth Memory and CCIX Technology (Nov. 09, 2016)
- Synopsys Announces Earnings Release Date for Fourth Quarter and Fiscal Year 2016 (Nov. 09, 2016)
- UMC Reports Sales for October 2016 (Nov. 09, 2016)
- Trump Win Roils Technology Sector (Nov. 09, 2016)
- MoSys and IDT Collaborate to Deliver 100 Gbps Base Station, Data Center and Mobile Edge Computing Solutions Leveraging RapidIO Technology (Nov. 09, 2016)
- Macnica Releases SLVS-EC Interface IP Core for FPGA (Nov. 08, 2016)
- Bluetooth SiP Module from Silicon Labs Offers World's Smallest Footprint for IoT End Nodes (Nov. 08, 2016)
- Xylon Introduces New Development Kit for Building Multi-Camera Embedded Vision Systems (Nov. 08, 2016)
- NXP Introduces Modular IoT Gateway Solution with Multi-Protocol Compatibility for Secure, Reliable Wireless Connectivity in Smart Cities and Smart Industries (Nov. 08, 2016)
- Building the IoT: Samsung AI, device analytics, embedded Cat M1 (Nov. 08, 2016)
- IoT: What NXP Has, What Qualcomm Lacks (Nov. 08, 2016)
- China Signs IoT Interop Plan (Nov. 08, 2016)
- Electronica: CEO Forum Rambles on IoT Security, Safety (Nov. 08, 2016)
- Excelsior's Ahead-Of-Time Java Compiler Now Available For ARM Platforms (Nov. 07, 2016)
- Is FPGA Intel Next Big Thing for IoT ? (Nov. 07, 2016)
- Dialog Semiconductor Announces Strategic Partnership and Investment with Energous Corporation to Accelerate Wireless Charging Adoption (Nov. 07, 2016)
- SMIC Reports 2016 Third Quarter Results (Nov. 07, 2016)
- Synopsys to Expand Software Security Signoff Solution with Acquisition of Cigital and Codiscope (Nov. 07, 2016)
- Digital Blocks Validates Existing I2C Slave Controller IP Core Family Compatibility with MIPI I3Cs (Nov. 06, 2016)
- Digital Blocks Celebrates 19 Years of Offering 82xx Peripheral Replacements (Nov. 03, 2016)
- Which IoT protocol should you use for your design? (Nov. 03, 2016)
- Lattice Semiconductor to be Acquired by Canyon Bridge Capital Partners, Inc. for $1.3 Billion (Nov. 03, 2016)
- ANSYS Acquired KPIT Medini Technologies (Nov. 03, 2016)
- US Plans To Scupper China's Chip Ambitions (Nov. 03, 2016)
- Faraday Reports Third Quarter 2016 Consolidated Results (Nov. 03, 2016)
- SMIC Shenzhen Launches Construction of the First 12-Inch IC Production Line in South China (Nov. 03, 2016)
- 10 Intriguing Technologies from ARM TechCon (Nov. 03, 2016)
- D&R extends capabilities of its Global corporate IP Management System (IPMS) with Intelligent Advisers (Nov. 03, 2016)
- DCD Presents the DBLCD32, a Fully Configurable, Universal LCD/TFT Display Controller (Nov. 02, 2016)
- Mindtree 4.2 Bluetooth Smart IP Powers NXP Kinetis KW41Z Wireless MCU (Nov. 02, 2016)
- Arteris Ncore Cache Coherent Interconnect IP Licensed by Toshiba Corporation (Toshiba) for Automotive ADAS (Nov. 02, 2016)
- CAN Bus Design IP from CAST Now Bundles In Avery Verification IP (Nov. 02, 2016)
- Mentor Graphics Expands Mentor Embedded Linux Support for the latest AMD Embedded G-series Family of Processors (Nov. 02, 2016)
- Imperas and T&VS Partner to Update Software Verification and Validation Methodology for Embedded Systems (Nov. 02, 2016)
- StarChip and Cortus announce a strategic partnership to deliver Secure Solutions for the IoT, M2M and Industry 4.0 markets (Nov. 02, 2016)
- CEVA, Inc. Announces Third Quarter 2016 Financial Results (Nov. 02, 2016)
- Anticipating a More Virtual Moore's Law (Nov. 02, 2016)
- U.S. Needs Big Bet on Chips (Nov. 02, 2016)
- Chipmaker Broadcom to buy network gear maker Brocade for $5.5 billion (Nov. 02, 2016)
- Microsemi Achieves MIL-STD-883 Class B Qualification for its RTG4 High-Speed Radiation-Tolerant FPGAs (Nov. 02, 2016)
- Icon Labs Launches Embedded Credentialing Solution for IoT Devices, Machines, and Endpoints (Nov. 01, 2016)
- Smart Card Alliance Advocates for Embedded Security in Connected IoT Devices Following Record-breaking DDoS Attacks (Nov. 01, 2016)
- XMOS and Sensory partner to deliver keyword detection for the Internet of Things (Nov. 01, 2016)
- Actions, Imagination, and Nibiru team to bring an immersive graphics experience to new all-in-one 2K VR headset solution (Oct. 31, 2016)
- ARM meets Generation Z demand for richer mobile VR and 4K streaming experiences (Oct. 31, 2016)
- Analog Devices Collaborates with ARM to Improve Security and Energy Efficiency for IoT Connected Devices (Oct. 31, 2016)
- Netspeed Raises $10M in Series C Funding Led by Intel Capital to Bring Machine learning to SoC design and architecture (Oct. 31, 2016)
- Graphcore Secures $30m to Accelerate Artificial Intelligence (Oct. 31, 2016)
- Thunderboard Sense Kit from Silicon Labs Inspires IoT Developers to Connect Everything (Oct. 31, 2016)
- Global Semiconductor Sales Increase 11.5 Percent in Q3 (Oct. 31, 2016)
- ARM Fellow Surveys Moore's Law (Oct. 27, 2016)
- M31 Receives TSMC's 2016 Partner of the Year Award for Specialty Technology IP (Oct. 27, 2016)
- Advantech and ARM partner on end-to-end IoT Platform, from device to cloud (Oct. 27, 2016)
- Analog Devices Acquires Innovasic (Oct. 27, 2016)
- UltraSoC enhances support for ARM with industry first AMBA 5 CHI NoC monitor (Oct. 26, 2016)
- Movidius licenses Allegro DVT's multi-format video encoder IP for its next generation low-power machine vision systems-on-chip (SoCs) (Oct. 26, 2016)
- Montage Technology Standardizes on Arteris FlexNoC Interconnect IP Licenses for Set-Top Box (STB) Chips (Oct. 26, 2016)
- SMIC Standardizes on Synopsys StarRC for Signoff Parasitic Extraction (Oct. 26, 2016)
- SilabTech Announces Release of Trace Port PHY (HSSTP) for debug of Multiple Cores designs (Oct. 26, 2016)
- ARM accelerates secure IoT from chip to cloud (Oct. 26, 2016)
- Espressif Licenses and Deploys CEVA Bluetooth in ESP32 IoT Chip (Oct. 26, 2016)
- GlobalSign and Intrinsic-ID Deliver Scalable Hardware-Rooted Device Identities for the IoT Ecosystem (Oct. 26, 2016)
- Intel Introduces 3 Atom E3900 Apollo Lake Processors for IoT, Industrials and Automotive Applications: x5-E3930, x5-E3940, x7-E3950 (Oct. 26, 2016)
- TSMC Likely to Lock up Apple A10, A11 Orders (Oct. 26, 2016)
- Arteris Adds Support for ARM AMBA 5 AHB5 Protocol (Oct. 25, 2016)
- Allegro DVT Enriches its Video Decoder Verification Packages With The Release of Multi-Codec Coverage Tool (Oct. 25, 2016)
- Cadence Enables Accelerated Implementation and Signoff of New ARM Cortex-M23 and Cortex-M33 Processors (Oct. 25, 2016)
- Synopsys Tools Enable Secure, Efficient IoT Designs Based On New ARM Cortex-M23 and Cortex-M33 Processors (Oct. 25, 2016)
- Intel, ARM Battle over IoT (Oct. 25, 2016)
- PRO DESIGN Expands FPGA Prototyping Portfolio with High-Speed proFPGA Virtex UltraScale based FPGA Modules (Oct. 25, 2016)
- EnSilica opens specialist Design Centre for RF and low power sensing applications based near Oxford (Oct. 25, 2016)
- Chipus Microelectronics becomes an official Silterra's design partner (Oct. 25, 2016)
- 海信为其IoT应用选择法国海豚科技的SoC架构IP系列 (Oct. 24, 2016)
- Synopsys' Galaxy Design Platform Enables Superior Low-Power Designs on Samsung's 10-nm Process Technology (Oct. 24, 2016)
- Cadence Reference Flow with Digital and Signoff Tools Certified on Samsung's 10nm Process Technology (Oct. 24, 2016)
- Fujitsu Adopts Cadence Palladium Z1 Enterprise Emulation Platform for Post-K Supercomputer Development (Oct. 24, 2016)
- Xilinx Zynq SoCs and MPSoCs Power Embedded Vision and IIoT Applications at ARM TechCon 2016 (Oct. 24, 2016)
- Moortec to exhibit at the TSMC 2016 China OIP Ecosystem Forum in Beijing (Oct. 24, 2016)
- SoC Solutions joins asicNorth's IoT Design Ecosystem (Oct. 24, 2016)
- Intrinsic-ID collaborates with Wind River to offer robust PUF-Based security library integrated with VxWorks (Oct. 24, 2016)
- Zebra Technologies, Bosch Connected Devices and Solutions and ARM Collaborate on Enterprise-Class Food Safety Solution to Better Protect Consumers (Oct. 24, 2016)
- IDT Announces Wireless 5G Technology Solutions for Xilinx Devices (Oct. 24, 2016)
- FPGA module has 16Gbit/s I/O (Oct. 24, 2016)
- Cadence Reports Third Quarter 2016 Financial Results (Oct. 24, 2016)
- Chips&Media, Inc. Joins the Alliance for Open Media (Oct. 21, 2016)
- 7nm processes at IEDM (Oct. 20, 2016)
- Return to sequential growth at Taiwan foundries (Oct. 20, 2016)
- asicNorth announces a Development Ecosystem to streamline the creation of mixed-signal IoT SoC's (Oct. 20, 2016)
- HMicro Licenses and Deploys CEVA Wi-Fi IP for Healthcare and IoT Devices (Oct. 20, 2016)
- IoT Hears LTE Calling (Oct. 20, 2016)
- S2C's Latest Prodigy Interface Module For Juno ARM Development Platform Speeds FPGA Prototyping And Increases Scalability (Oct. 20, 2016)
- Xilinx Announces Second Quarter 2017 Results; Advanced Products Repeat 60% Year-Over-Year Growth (Oct. 20, 2016)
- Intel launches Stratix 10: Altera FPGA combined with ARM CPU, 14nm manufacturing (Oct. 20, 2016)
- 2016 IC Market Forecast Raised from -2% to +1% (Oct. 20, 2016)
- China plans 3D NAND production next year (Oct. 20, 2016)
- Mentor for sale (Oct. 20, 2016)
- Mentor Graphics Integrates its Questa Verification Solution with Jenkins Ecosystem Enabling Maximum Regression Speed (Oct. 20, 2016)
- Allegro DVT Introduces New Lightweight Multi-Format Video Encoder IP (Oct. 20, 2016)
- CAST Expands Streaming Video IP Line with Motion JPEG Subsystem (Oct. 19, 2016)
- Chongqing Yubei District fuels mass entrepreneurship and innovation through a new ARM IP Pool (Oct. 19, 2016)
- ARM Moves to Fill Industry's Engineering Education Gap (Oct. 19, 2016)
- Faraday Unveils Uranus SoC Development Platform for Ultra-Low-Power IoT (Oct. 19, 2016)
- Protocols For The Wide-Area IoT (Oct. 19, 2016)
- Cadence Enables Customer Innovation with ARM-Optimized Solutions from Chips to Boards to Systems at ARM (Oct. 18, 2016)
- eMemory Receives SMIC Best IP Partner Award for 4th Year in a Row (Oct. 18, 2016)
- Canonical and ARM collaborate to offer commercial availability of Ubuntu OpenStack and Ceph for 64-bit ARM-based servers (Oct. 17, 2016)
- Baidu Adopts Xilinx to Accelerate Machine Learning Applications in the Data Center (Oct. 17, 2016)
- Newracom Announces Availability of Ultra-Low Power ARM Core Based Wi-Fi 802.11 b/g/n MAC/PHY/Subsystem and RFIC IP for Internet of Things Applications (Oct. 17, 2016)
- Imagination and Actions strengthen partnership on MIPS CPUs (Oct. 17, 2016)
- Qualcomm Tips 28 GHz 5G Chip (Oct. 17, 2016)
- SMIC TianJin Launches Capacity Expansion Project; Expected to Become the World's Largest Integrated 8-Inch IC Production Line (Oct. 17, 2016)
- Samsung Starts Industry's First Mass Production of System-on-Chip with 10-Nanometer FinFET Technology (Oct. 16, 2016)
- Linear, Advantech add internet protocol to M2.COM IoT options (Oct. 13, 2016)
- TTTech Acquires Chip IP Specialist Flexibilis to Strengthen Position in Industrial Domain and to Expand Towards Smart Grid Market (Oct. 13, 2016)
- SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab (Oct. 13, 2016)
- TSMC Reports Third Quarter EPS of NT$3.73 (Oct. 13, 2016)
- Imagination rolls out new 'Heterogeneous Inside & Out' MIPS CPU (Oct. 12, 2016)
- Moortec to exhibit at the ARM TechCon Expo in Santa Clara (Oct. 12, 2016)
- Gartner Says Worldwide Semiconductor Capital Spending to Decline 0.3 Percent in 2016 (Oct. 12, 2016)
- Xilinx Announces Production Milestone for 16nm UltraScale+ Portfolio Ahead of Schedule (Oct. 12, 2016)
- Faraday's PowerSlash IP Now Available on UMC's 55nm Ultra-Low-Power IoT Platform (Oct. 12, 2016)
- Free IoT wireless network offered in London (Oct. 12, 2016)
- Did Processor Cause Samsung Note 7 Blowup? (Oct. 12, 2016)
- 智原发表PowerSlash™硅智财于联电55奈米超低功耗工艺 支持物联网应用开发 (Oct. 12, 2016)
- Chips&Media and Goke Microelectronics partner to provide video codec IP (Oct. 11, 2016)
- Cortus Launches High Performance Dual-Issue IP Core for Embedded Applications (Oct. 11, 2016)
- Kilopass Reveals New VLT DRAM Technology This Week at MemCon, CSIA-ICCAD (Oct. 11, 2016)
- CSEM licenses IcyTRX Bluetooth Low Energy silicon RF IP to Oticon for use in advanced hearing aids. (Oct. 11, 2016)
- Arteris Joins CCIX Consortium to Support Heterogeneous Cache Coherency Deployment (Oct. 11, 2016)
- BaySand Introduces Enhanced FPGA to ASIC Conversion Program With IP Partners and Supporting Tools (Oct. 11, 2016)
- Achronix announces immediate availability of Speedcore embedded FPGA IP for SoC acceleration (Oct. 11, 2016)
- Ceva processor tackles IoT wireless standards (Oct. 11, 2016)
- Silicon Labs reckons mesh networks are right for the home (Oct. 11, 2016)
- Infineon Acquires LidarExpertise Through Innoluce Takeover (Oct. 11, 2016)
- Cadence Delivers 10 New VIP Solutions to Accelerate Time to Market for Applications Based on Critical New Standards (Oct. 10, 2016)
- CEVA Introduces Lightweight Multi-Purpose Processor for the Massive Internet of Things (Oct. 10, 2016)
- Mentor Graphics Acquires Galaxy Semiconductor (Oct. 10, 2016)
- Samsung Mass Produces Industry's First Application Processor for Wearable Devices Built on 14-Nanometer FinFET Technology (Oct. 10, 2016)
- Open-Silicon Extends Long-Term Collaboration with Mentor Graphics Technologies for Custom SoC Design Success (Oct. 06, 2016)
- INSIDE Secure and 6WIND partner to bring high-performance and scalability to the Cloud (Oct. 06, 2016)
- SureCore SRAMs design-ready, says CEO (Oct. 06, 2016)
- Accelerate SHA-3 Cryptographic Hash Processing with New Hardware IP Core (Oct. 05, 2016)
- NXP Pushes Hardware Isolation in i.MX8 (Oct. 05, 2016)
- Mentor Graphics, Northwest Logic, and Krivi Semiconductor Announce Availability of Complete DDR4 SDRAM IP Design and Verification Solution (Oct. 05, 2016)
- VIA Labs VL716 USB 3.1 Gen 2 to SATA Bridge with Native USB-C Support Achieves USB-IF Certification (Oct. 05, 2016)
- NXP Doubles Its Portfolio of MagniV Microcontrollers Serving the Growing Global Automotive Motor Control Market (Oct. 05, 2016)
- NXP Extends Secure Car Access Portfolio to Offer New Complete Passive Keyless Entry System (Oct. 05, 2016)
- Qualcomm Snapdragon 600E and 410E embedded/IoT processors available through distributors (Oct. 05, 2016)
- Nokia bolsters its base station power efficiency by acquiring Eta Devices (Oct. 05, 2016)
- HDL Design House Opens New Office in Thessaloniki, Greece (Oct. 04, 2016)
- Mentor Graphics Announces 64-bit ARMv8-A Support for the Nucleus Real-Time Operating System (Oct. 04, 2016)
- Arteris FlexNoC Resilience Package IP Licensed by STMicroelectronics (Oct. 04, 2016)
- STMicroelectronics Announces Timing for 3rd Quarter 2016 Earnings Release and Conference Call (Oct. 04, 2016)
- TSMC Staffing R&D for 3nm Process (Oct. 04, 2016)
- HMicro and STMicroelectronics Announce Wearable Wireless Biosensor Platform that Frees Patients from Cables (Oct. 04, 2016)
- Khronos Launches Dual Neural Network Standard Initiatives (Oct. 04, 2016)
- Rambus Signs License Agreement With Xilinx (Oct. 03, 2016)
- Silicon Labs Acquires Leading RTOS Company Micrium for IoT (Oct. 03, 2016)
- IBM Invests to Lead Global Internet of Things Market -- Shows Accelerated Client Adoption (Oct. 03, 2016)
- Do Chip Designers Worry About the Impact of Power Consumption on Sustainability? (Oct. 03, 2016)
- X-FAB to Acquire Assets of Altis Semiconductor (Sept. 30, 2016)
- Altium Announces Major Update for TASKING VX-toolset for TriCore(tm) with Latest AURIX(tm) Technology (Sept. 30, 2016)
- Arrow and Electric Imp spot big industrial IoT opportunity (Sept. 30, 2016)
- Moortec Receives 2016 TSMC Open Innovation Platform Partner of the Year New IP Award (Sept. 28, 2016)
- Mesh Networking Module from Silicon Labs Simplifies Thread and ZigBee Connectivity (Sept. 28, 2016)
- ARM open source group address IoT software confusion (Sept. 28, 2016)
- Qualcomm Mobilizes in Embedded Processors (Sept. 28, 2016)
- Samsung Calls for New CPU Design (Sept. 28, 2016)
- STMicroelectronics Reveals High-Efficiency Wireless Battery-Charging Chipset for Smaller, Simpler, Sealed Wearables (Sept. 28, 2016)
- <40nm processing drives foundry sales (Sept. 28, 2016)
- Leading-Edge Leads the Way in Pure-Play Foundry Growth (Sept. 28, 2016)
- Cadence Recognized with Four TSMC Partner of the Year Awards (Sept. 27, 2016)
- TSMC Recognizes Synopsys with Three Partner Awards for Interface IP and Joint Development of 7-nm Mobile and HPC Design Platforms (Sept. 27, 2016)
- Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability with 2 to 64 FLOPS/Cycle (Sept. 27, 2016)
- USB-IF Announces USB Audio Device Class 3.0 Specification (Sept. 27, 2016)
- Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs (Sept. 27, 2016)
- Arteris FlexNoC Physical and FlexNoC Resilience Packages Licensed by Mobileye for Next-Generation Advanced Driver Assistance Systems (ADAS) (Sept. 27, 2016)
- Intrinsic-ID overall winner of EU 2016 Innovation Radar Prize (Sept. 27, 2016)
- Fifth-Generation CEVA Imaging & Vision Technology Simplifies Delivery of Powerful Deep Learning Solutions on Low-Power Embedded Devices (Sept. 27, 2016)
- AMD Takes Embedded Applications to the Next Level With New GPUs (Sept. 27, 2016)
- Xilinx Extends its Cost-Optimized Portfolio Targeting a Wide Range of Applications Including Embedded Vision and Industrial IoT (Sept. 27, 2016)
- ARM System IP boosts SoC performance from edge to cloud (Sept. 27, 2016)
- iPhone 7, No Headphone Jack Creates a Recipe for e-Waste (Sept. 27, 2016)
- CEVA refines its Vision DSP (Sept. 27, 2016)
- DCAN FD, A Configurable CAN Bus Controller with Flexible Data-Rate Targets Autonomous Cars & ADAS Systems (Sept. 26, 2016)
- Amazing improvement of power and density for RFID chips with standard cell libraries at 180 nm from Dolphin Integration (Sept. 26, 2016)
- NXP Introduces Industry's Lowest Power ARM Cortex-A7 Based Processor to Fuel Growth of the Internet of Things (Sept. 26, 2016)
- Linaro Announces First Development Board Compliant with 96Boards IoT Edition Specification (Sept. 26, 2016)
- Linaro Announces LITE - Collaborative Software Engineering for the Internet of Things (IoT) (Sept. 26, 2016)
- Chip Market to Go Down, says Future Horizons (Sept. 26, 2016)
- Eurotech announces ESF Release 4.0, featuring support for the new ReliaGATE 20-25 and connectivity to multiple Clouds (Sept. 26, 2016)
- eMemory Receives TSMC IP Partner Award (Sept. 23, 2016)
- PLDA Announces a Full Set of Solutions to Immediately Enable PCIe 4.0 Design Success (Sept. 22, 2016)
- ARM reveals R52 core for 'highest functional safety standards' (Sept. 22, 2016)
- Brite Semiconductor Settled in Hefei to Jointly Build an IC Industrial Park (Sept. 22, 2016)
- Analog Bits to deliver two presentations on 16nm IP at TSMC Open Innovation Platform Ecosystem Forum (Sept. 22, 2016)
- Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms (Sept. 22, 2016)
- TSMC and Synopsys Collaboration Delivers Innovative Technologies for the High Performance Compute (HPC) Platform (Sept. 22, 2016)
- Shanhai Capital to Acquire Analogix Semiconductor (Sept. 22, 2016)
- TSMC Expands its 3D Menu (Sept. 22, 2016)
- How to build an IoT irrigation system with MIPS based Creator Ci40 IoT-in-a-box (Sept. 22, 2016)
- Synopsys Foundation IP Meets Stringent Automotive AEC-Q100 Grade 1 Temperature Requirements for TSMC 16FFC and 28HPC+ Processes (Sept. 21, 2016)
- Synopsys and TSMC Collaborate to Certify Custom Compiler for 16FFC Process (Sept. 21, 2016)
- Rambus to Showcase Its High-Speed SerDes Portfolio at the TSMC 2016 Open Innovation Platform® Ecosystem Forum (Sept. 21, 2016)
- Cadence Delivers Integrated System Design Solution for TSMC InFO Packaging Technology (Sept. 21, 2016)
- 円星科技推出完整MIPI物理层IP解决方案 进军行动装置应用市场 (Sept. 20, 2016)
- iPhone 7 Sports Intel, TSMC (Sept. 20, 2016)
- Synopsys Delivers Complete DesignWare Bluetooth Low Energy IP Solution with Link Layer and PHY on TSMC 40ULP Process for IoT SoCs (Sept. 20, 2016)
- ARM enables autonomous vehicles with its most advanced safety processor (Sept. 20, 2016)
- M31 Technology Develops Complete MIPI PHY Solution Targeting Mobile Device Market (Sept. 20, 2016)
- Cambium Networks choses FlexSwitch IP for their PTP 700 platform (Sept. 20, 2016)
- Arteris FlexNoC IP and FlexNoC Resilience Package Licensed by Toshiba for Advanced Driver Assistance Systems (ADAS) (Sept. 20, 2016)
- Cadence Delivers IP for Automotive Applications with TSMC's Advanced 16nm FinFET C Process (Sept. 20, 2016)
- Emerging Memories: Ship First, Perfect Later (Sept. 20, 2016)
- UltraSoC supports RISC-V: the Linux of the semiconductor industry (Sept. 20, 2016)
- Real Intent Sets a New Benchmark in Early Verification of Digital Designs with Release 2016.A of Ascent Lint (Sept. 20, 2016)
- Wind River integrates VxWorks with IBMs Watson IoT service (Sept. 20, 2016)
- Intel teams with UK web company for industrial IoT (Sept. 20, 2016)
- INSIDE Secure completes the sale of its semiconductor business to Swiss cybersecurity expert WISeKey (Sept. 20, 2016)
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals (Sept. 20, 2016)
- Securing the Industrial Internet of Things (Sept. 20, 2016)
- Eurotech presents new products for Rolling Stock at Innotrans 2016 (Sept. 20, 2016)
- Cache Controller Core from CAST Augments Cache-Less 32-bit Processors (Sept. 19, 2016)
- Credo Demonstrates Single-Lane 112G and 56G PAM-4 SerDes IP at TSMC OIP Forum (Sept. 19, 2016)
- Synopsys and TSMC Collaborate on Development of Interface and Foundation IP for 7-nm FinFET Process (Sept. 19, 2016)
- TSMC Certifies Synopsys IC Compiler II for the Most Advanced 7-nm Process Node Enabling Early Tapeouts (Sept. 19, 2016)
- ARM Raises Bar for Safety, Determinism (Sept. 19, 2016)
- Synopsys Accelerates Development of Safety-Critical Products with Design Solutions for ARM Cortex-R52 (Sept. 19, 2016)
- Cadence Delivers Rapid Adoption Kit for Fast Implementation and Signoff of New ARM Cortex-R52 CPU (Sept. 19, 2016)
- IoT Design 2016: Smart buildings, privacy and trust (Sept. 19, 2016)
- IoT development kits come with ARM or Atom (Sept. 19, 2016)
- ON Semiconductor Successfully Completes Acquisition of Fairchild Semiconductor for $2.4 Billion in Cash (Sept. 19, 2016)
- IoT platforms target proprietary smart building systems (Sept. 15, 2016)
- Green Hills Software to Showcase Its Technology for Automotive Electronics Solutions at the SAE 2016 Convergence Conference (Sept. 15, 2016)
- Linde Starts Specialty Gases R&D in Taiwan (Sept. 15, 2016)
- Chevin Technology releases 25G Ultra Low Latency MAC/PCS for Xilinx Virtex UltraScale FPGAs (Sept. 15, 2016)
- Inova Semiconductors licenses APIX3 to Socionext (Sept. 15, 2016)
- GLOBALFOUNDRIES to Deliver Industry's Leading-Performance Offering of 7nm FinFET Technology (Sept. 15, 2016)
- GLOBALFOUNDRIES Launches Embedded MRAM on 22FDX Platform (Sept. 15, 2016)
- CEVA and AdasWorks to Demonstrate Free Space Detection for Autonomous Driving at AutoSens Conference 2016 (Sept. 15, 2016)
- Processor Cores Feature Improved Security (Sept. 14, 2016)
- FPGA cores offered for TSMC's 40ULP process (Sept. 14, 2016)
- Pressure-sensitive smart insoles offer ANT+ and Bluetooth low energy wireless connectivity to help runners improve running form (Sept. 14, 2016)
- MIPI Alliance Developing MIPI Touch for Mobile Devices, Tablets and Automotive Applications (Sept. 14, 2016)
- TI unveils first ultra-low power dual-band wireless MCU in production (Sept. 14, 2016)
- Tiny energy storage cell for IoT nodes lasts for years (Sept. 14, 2016)
- Arteris FlexNoC IP Licensed by KYOCERA for Enterprise Printing and Imaging Solutions (Sept. 13, 2016)
- Imagination partners with MOSIS to empower universities to implement leading-edge CPUs in silicon for research projects (Sept. 13, 2016)
- VIA Enhances Graphics and Video Performance of VIA AMOS-820 Enterprise IoT System (Sept. 13, 2016)
- Lattice Semiconductor Expands Automotive Product Portfolio With Addition of ECP5™ and CrossLink™ Programmable Devices (Sept. 13, 2016)
- Intersil Deal: Renesas' Survival Bid (Sept. 13, 2016)
- Microsemi Announces New Addition to its Imaging/Video Solution to Support Growing Demand for MIPI CSI-2 Interfaces (Sept. 13, 2016)
- Synopsys Introduces ARC Security Processors for Low-Power Embedded Applications (Sept. 12, 2016)
- Cadence Tensilica HiFi DSP Offers First processor IP Approved for Dolby AC-4 Decoder (Sept. 12, 2016)
- Cadence Offers Industry's First Licensable MPEG-H Audio Decoder for Tensilica HiFi DSPs (Sept. 12, 2016)
- TSMC looks to volume 7nm production in Q1 2018 (Sept. 12, 2016)
- Renesas to Acquire Intersil to Create the Worlds Leading Embedded Solution Provider (Sept. 12, 2016)
- Chip Process War Heats Up (Sept. 12, 2016)
- Qualcomm Opens Qualcomm Communication Technologies in Shanghai for Semiconductor Test Manufacturing (Sept. 12, 2016)
- AMD Partner Globalfoundries Begins 12nm FD-SOI Rollout-Product Tape Out Expected In 2019 (Sept. 10, 2016)
- Leti lines up with Weebit Nano for ReRAM development (Sept. 08, 2016)
- GLOBALFOUNDRIES Unveils Ecosystem Partner Program to Accelerate Innovation for Tomorrow's Connected Systems (Sept. 08, 2016)
- GLOBALFOUNDRIES Extends FDX Roadmap with 12nm FD-SOI Technology (Sept. 08, 2016)
- Synopsys Joins GLOBALFOUNDRIES' FDXcelerator Partner Program to Enable Innovative Designs Using the FD-SOI Process (Sept. 08, 2016)
- IAR Systems expands ARM tools for developers focused on the Internet of Things (Sept. 08, 2016)
- Technology Momentum Extends Synopsys IC Compiler II Deployments Past 100 Customers (Sept. 08, 2016)
- Synopsys Expands Collaboration with ARM to Deliver Artisan Physical Libraries and POP IP Support for IC Compiler II (Sept. 08, 2016)
- Icon Labs and Renesas Share Design Expertise in New IIoT Security Guide White Paper (Sept. 08, 2016)
- Ridgetop Group and BaySand Partner to Expand Mixed-Signal IP Portfolio and Services into Silicon Valley, Asia (Sept. 07, 2016)
- Mixel MIPI D-PHY IP Integrated into Lattice's CrossLink Low Power pASSP (Sept. 07, 2016)
- Allegro DVT Unveils Industry's First ATSC3.0 System Compliance Test Suite at IBC 2016 (Sept. 07, 2016)
- PathPartner Technology Returns to IBC 2016 with Low Latency HEVC Streaming Solutions and Improved Quality for Broadcast Workflows (Sept. 07, 2016)
- NGCodec and PathPartner Technology jointly demonstrate H.265/HEVC codecs running on Xilinx FPGA's at the IBC Show (Sept. 07, 2016)
- Newracom and Aviacomm Announce Availability of High-performance 802.11ah Reference Design for IoT Applications using Sub-1GHz ISM Frequency Bands (Sept. 07, 2016)
- Updated Semiconductor Outlook for Internet of Things (Sept. 07, 2016)
- Synopsys' New Virtualizer Studio Integrated Development Environment Accelerates Virtual Prototyping Productivity (Sept. 07, 2016)
- Artificial Intelligence in Autonomous Driving (Sept. 07, 2016)
- Intrinsic-ID nominated as one of the 16 most dynamic digital innovators in Europe (Sept. 07, 2016)
- Intel Spins out Security Group (Sept. 07, 2016)
- Apple Debuts Three Custom Chips (Sept. 07, 2016)
- Boost Valley Announces its first FPGA proven IP - HDMI-CEC 2.0 Controller IP (Sept. 07, 2016)
- $18bn IoT IC sales in 2016, says IC Insights (Sept. 07, 2016)
- Imagination teams with SaberTek and Mymo Wireless to deliver end-to-end licensable IP for LTE CAT1/0 (Sept. 07, 2016)
- Ashling and Synopsys Collaborate to Accelerate Development and Debugging of Software for ARC-Based Embedded Systems (Sept. 07, 2016)
- INSIDE Secure Delivers Secure Content Distribution and Monetization Software for the HTC Vive Ecosystem (Sept. 06, 2016)
- Arteris FlexNoC IP Licensed by Octasic for Industrial/Tactical Systems (Sept. 06, 2016)
- Synopsys Announces Standards Board Ratification of Its New Parasitic Models for Latest FinFET Process Nodes (Sept. 06, 2016)
- Intel to Acquire Movidius: Accelerating Computer Vision through RealSense for the Next Wave of Computing (Sept. 06, 2016)
- Intel targets IoT machine vision firm Movidius (Sept. 06, 2016)
- Qualcomm and Verizon Double Down on the Internet of Things (Sept. 06, 2016)
- Global Semiconductor Sales Rebound in July (Sept. 06, 2016)
- Allegro DVT's AVS2 Compliance Streams Selected by MediaTek Inc. (Sept. 05, 2016)
- UMC Forges Strategic Partnership with APM to Enhance MEMS Service Capabilities (Sept. 05, 2016)
- Renesas Electronics and TSMC Announce 28nm MCU Collaboration for Next-Generation Green and Autonomous Vehicles (Sept. 01, 2016)
- Nordic-powered Bluetooth low energy development kit offers complete turnkey solution for rapid Internet of Things product development (Sept. 01, 2016)
- Nordic Semiconductor smart remote control reference design marries unparalleled voice input performance with ultra-low power consumption (Sept. 01, 2016)
- Argon Design Licenses Argon Streams HEVC to Socionext (Aug. 31, 2016)
- Fujitsu Semiconductor and Mie Fujitsu Semiconductor License Nantero's NRAM And Have Begun Developing Breakthrough Memory Products for Multiple Markets (Aug. 31, 2016)
- Lockheed Martin Selects Microsemi's Master Reference Oscillators for the U.S. Air Force's Space Based Infrared System Satellite Program (Aug. 31, 2016)
- Samsung in volume production of 14nm Exynos processors (Aug. 31, 2016)
- IC Industry M&A: Who's Left to Buy? (Aug. 31, 2016)
- Moortec Announce Embedded Process Monitor on TSMC 16FF+LL (Aug. 31, 2016)
- Mobile Sensor Technology Company Acconeer AB Closes $7M Investment Round (Aug. 30, 2016)
- Eminent Reached 10 Millions of Successful Production Chips Incorporating Attopsemi's I-Fuse OTP (Aug. 30, 2016)
- Sidense Demonstrates Successful 1T-OTP Operation in TSMC 16nm FinFET Process (Aug. 30, 2016)
- eMemory Unveils EcoBit Technology for RFID and NFC Applications (Aug. 30, 2016)
- Flex Logix Reconfigurable, Low-Power IP Cores Now Available for TSMC 40ULP (Aug. 30, 2016)
- Microsemi Announces LiteFast Serial Communication Protocol to Reduce Customers' Design-In Efforts and Time to Market (Aug. 30, 2016)
- Intel Debuts 14nm+ Processors (Aug. 30, 2016)
- ARM Investors Nod to Its Sale to SoftBank (Aug. 30, 2016)
- MCU Market Forecast to Reach Record High Revenues Through 2020 (Aug. 30, 2016)
- ON Semi to Sell Automotive IGBT Biz to Littelfuse (Aug. 30, 2016)
- Maxim's Industrial IoT Reference Design Speeds Development of Authenticated Data Chains (Aug. 29, 2016)
- Intel and AT&T Launch Platform for IoT (T, INTC) (Aug. 25, 2016)
- AMD Reveals Zen of X86 (Aug. 24, 2016)
- Weltrend Adopts AndesCore in WT8893 Around View Monitor Video Processor Shipping in a Major Sports Utility Vehicle (Aug. 24, 2016)
- Gridbee Achieves First-Pass Silicon Success with Synopsys' DesignWare ARC Processor (Aug. 24, 2016)
- AMD increased market share in Q2 2016 despite overall GPU shipments declining 4%, from last quarter (Aug. 24, 2016)
- Oticon Licenses and Deploys CEVA Bluetooth Low Energy Technology in Breakthrough Hearing Aid (Aug. 23, 2016)
- Irida Labs' NoiseSweeper and EnLight Software Now Available on Cadence Tensilica Imaging/Vision DSPs (Aug. 23, 2016)
- Movidius licenses UltraSoC analytics IP to speed debug and development (Aug. 23, 2016)
- Starblaze Integrates Enterprise Solid State Drive Controller Chip Using SonicsGN (Aug. 23, 2016)
- Microsoft Gives Peek at HoloLens Chip (Aug. 23, 2016)
- Where is the worldwide semiconductor industry headed? (Aug. 23, 2016)
- North American Semiconductor Equipment Industry Posts July 2016 Book-to-Bill Ratio of 1.05 (Aug. 23, 2016)
- Renesas Sets Sights on Intersil (Aug. 23, 2016)
- TowerJazz and SMIC's Sales Forecast to Surge in 2016 (Aug. 23, 2016)
- ARM Reaches for Supercomputers (Aug. 22, 2016)
- Cisco plans layoffs on pivot towards IoT and cloud (Aug. 22, 2016)
- Chinese foundry ups MCU production by 50% (Aug. 22, 2016)
- Nordic-powered Bluetooth low energy sleep analysis solution promotes enhanced sleep quality (Aug. 18, 2016)
- SunEdison Semiconductor to be acquired by GlobalWafers in $683M deal (Aug. 18, 2016)
- eWBM Achieves First-Pass Silicon Success for Highly Secure Microcontroller with Synopsys Security IP (Aug. 18, 2016)
- Intel to Accelerate Altera, Says CEO (Aug. 18, 2016)
- Green Hills certifies RTOS for avionics computers (Aug. 18, 2016)
- MIPI Alliance Releases MIPI Gigabit Debug for IP Sockets (Aug. 17, 2016)
- Creator: connecting the Internet of Things one device at a time (Aug. 17, 2016)
- InterDigital and Sharp Corporation Expand Patent License Agreement to Include LTE Coverage (Aug. 17, 2016)
- Flexible IoT gateway system is application ready (Aug. 17, 2016)
- Intel Developer Forum: 10 Internet of Things Applications Bringing In The Money (Aug. 17, 2016)
- GE CEO: Partners Need To 'Embrace The Future' For Internet of Things (Aug. 17, 2016)
- Intel Foundry embraces ARM; the start of the end? (Aug. 17, 2016)
- ArcherMind Joins 96Boards and Launches Deci-Core ARMv8 Product (Aug. 16, 2016)
- Seven Top-20 Semiconductor Suppliers Show Double-Digit Gains in 2Q16 (Aug. 16, 2016)
- Intel Grabs ARM for 10nm Foundry (Aug. 16, 2016)
- Aldec Delivers Verification Support for Embedded Applications with New TySOM Embedded Development Kit (Aug. 16, 2016)
- Intel plunges deeper into virtual reality, Internet of Things at IDF (Aug. 16, 2016)
- Tokyo Electron Limited Joins Semiconductor Research Corporation (Aug. 16, 2016)
- Novatek Licenses CEVA-XM4 Imaging and Vision DSP for Embedded Visual Intelligence (Aug. 16, 2016)
- Renesas Electronics America Showcases Next-Generation USB Technologies at Intel Developer Forum 2016 (Aug. 16, 2016)
- Qualcomm is Back on Top of the SoC World (Aug. 15, 2016)
- Bridging the Gap between Pre-Silicon Verification and Post-Silicon Validation in Networking SoC designs (Aug. 15, 2016)
- Connected manufacturing: Three steps to cloud security (Aug. 15, 2016)
- Cisco, Intel, Synopsys On Fast Track In Internet of Things: RBC (Aug. 15, 2016)
- 14 Views from the Flash Summit (Aug. 12, 2016)
- Orange Tree announces SuperSpeed USB 3.0 FPGA module (Aug. 11, 2016)
- Intel to Acquire Deep Learning Nervana (Aug. 10, 2016)
- SMIC Raises Target for 2016 Sales (Aug. 10, 2016)
- IC Insights Bulletin: DRAM on Track to Be Worst-Performing Market in 2016 (Aug. 10, 2016)
- IP-Maker to showcase OLTP SQL acceleration (Aug. 10, 2016)
- Chelsio Demonstrates NVMe Over Fabrics With 40GbE iWARP RDMA At Flash Memory Summit 2016 (Aug. 10, 2016)
- Rockchip and CEVA Extend Partnership to Include CEVA-XM4 Intelligent Vision DSP (Aug. 10, 2016)
- Artosyn selects Chips&Media Lossy&Lossless Compression IP for Drone, Robots, AR, and VR SoCs (Aug. 10, 2016)
- Avery Design Systems Scale-Out With NVMe over Fabrics Verification Solutions (Aug. 09, 2016)
- Rambus Signs License Agreement with Idaho Scientific (Aug. 09, 2016)
- New Semiconductor Processes Offer Power Efficiency Opportunities for Apple Watch (Aug. 09, 2016)
- WeEn Semiconductors Selects Silvaco's TCAD Products for Advanced Bipolar Power Device Design (Aug. 09, 2016)
- Discovering the world of IoT with the Connected MCU Lab (Aug. 09, 2016)
- CAST and PLDA GROUP Demonstrate x86-Compliant High Compression Ratio GZIP Acceleration on FPGA, Accessible to non-FPGA Experts Using the QuickPlay Software Defined FPGA Development Tool (Aug. 09, 2016)
- Semtech Completes Divestiture of Its Snowbush IP Business (Aug. 08, 2016)
- Rambus Completes Acquisition of Snowbush IP Assets (Aug. 08, 2016)
- Big Three Chipmakers Likely to Boost Capex (Aug. 08, 2016)
- Samsung to License Patent Portfolio From Tela Innovations (Aug. 08, 2016)
- Qualcomm Signs 3G/4G China Patent License Agreement with vivo (Aug. 07, 2016)
- IntelliProp Announces NVMe Host Accelerator IP Core With User-Friendly Hardware Interface (Aug. 05, 2016)
- Arastu Systems announces highly flexible and compact DDR3/4 single controller (Aug. 05, 2016)
- Next-Gen IoT Consortium Launches (Aug. 05, 2016)
- Integrated IoT SoCs start with a variety of IP and the right core (Aug. 04, 2016)
- INSIDE Secure signs a binding agreement to sell its semiconductor business to Swiss cybersecurity expert WISeKey (Aug. 04, 2016)
- Think Big for Ultra-Low Power IoT SoCs (Aug. 04, 2016)
- Rambus Completes Acquisition of Inphi Memory Interconnect Business (Aug. 04, 2016)
- Fee-Fest For SoftBank-ARM Advisers (Aug. 04, 2016)
- RF design in the 21st century (Aug. 04, 2016)
- China IIoT efforts will dominate global market: Economist (Aug. 04, 2016)
- Powering the future Internet Of Things (Aug. 03, 2016)
- Three IoT lessons from the Softbank acquisition of ARM (Aug. 03, 2016)
- Socionext Bleeds Top Network SoC Talent to Acacia (Aug. 02, 2016)
- Cadence Delivers Industry's First Design and Verification IP for MIPI SoundWire v1.1 High Quality Audio Solutions (Aug. 02, 2016)
- MIPI Alliance Gives Members First Access to MIPI I3C Interface Specification for Sensor Applications (Aug. 02, 2016)
- What the 40nm node means for the instrument cluster (Aug. 02, 2016)
- Semtech LoRa® RF Technology for IoT Used in Compact Wireless Module from Murata (Aug. 02, 2016)
- GainSpan Announces Low-Power, Apple HomeKit Reference Design for Wi-Fi-Enabled Smart Home Accessories (Aug. 02, 2016)
- SIGFOX and UnaBiz Anchor French and Taiwanese Collaboration on Global Internet of Things Testbed (Aug. 02, 2016)
- Global Semiconductor Sales Increase in Second Quarter (Aug. 02, 2016)
- PLDA GROUP announces tighter collaboration with Xilinx on Vivado HLS to enhance software programmability of Xilinx FPGAs in QuickPlay (Aug. 02, 2016)
- China's IC Industry: 'Don't Let World Bully Us (Aug. 02, 2016)
- Intel SoC FPGA Developer Forum: ReFLEX CES Showcases Arria10 SoC FPGA Cards and OpenCL Solutions (Aug. 02, 2016)
- PLDA and Epostar to Demonstrate New PCIe/NVMe Solution, Delivering the Increased Throughput and Decreased Latency Required for Today's PCIe SSD Storage Applications (Aug. 01, 2016)
- Synopsys' New Model for Infineon's Next Generation TriCore Architecture Accelerates Early Automotive Software Development and Test (Aug. 01, 2016)
- Faraday Receives ISO9001: 2015 Plus Award, Proving the High Quality of its Design Service for Customers (Aug. 01, 2016)
- ARM expands IoT security team in Israel (Aug. 01, 2016)
- Hardent Launches New DisplayPort 1.4 Forward Error Correction IP Cores (Jul. 29, 2016)
- SJSemi and Qualcomm Jointly Announce Mass Production of 14nm Wafer Bumping Technology (Jul. 29, 2016)
- STMicroelectronics Acquires ams' NFC and RFID Reader Assets (Jul. 29, 2016)
- China Likely to Give Birth to a Semiconductor Giant (Jul. 28, 2016)
- Synopsys Delivers Industry's First Verification IP for Ethernet 200G (Jul. 27, 2016)
- UMC Sees Jump in 28nm Demand (Jul. 27, 2016)
- MicroEJ Accelerates the Creation of IoT Software for ARM Cortex-M and Cortex-A Processors (Jul. 27, 2016)
- GE Supplies IoT Developer Kit For Predix (Jul. 27, 2016)
- Apply Deep Learning to Building-Automation IoT Sensors (Jul. 27, 2016)
- FPGA Manager IP Eases Data Streaming (Jul. 27, 2016)
- FPGA Mezzanine Card + IP Forms Imaging/Video Engine (Jul. 27, 2016)
- Acromag's New AcroPack™ I/O Platform adds a Reconfigurable Xilinx Artix-7 FPGA for Custom Computing Applications (Jul. 27, 2016)
- China's Final Chance to Achieve Its IC Industry Ambitions Now Underway (Jul. 27, 2016)
- STMicroelectronics Returns to Profit in Q2 (Jul. 27, 2016)
- ARM Achieves Another Successful Quarter (Jul. 27, 2016)
- Developer kit accelerates IoT sensing connectivity (Jul. 26, 2016)
- Active bridge improves PoE-based IoT performance (Jul. 26, 2016)
- Cadence Launches Tensilica Fusion G3 DSP Featuring Exceptional Out-of-the-Box Performance for Compute-Intensive Signal Processing Applications (Jul. 26, 2016)
- FDSOI to Get Embedded MRAM, Flash Options at 28nm (Jul. 26, 2016)
- What Separates Huawei from Ericsson (Jul. 26, 2016)
- Analog Devices and Linear Technology to Combine Creating the Premier Analog Technology Company (Jul. 26, 2016)
- Bessemer Venture Partners Invests $15 Million in Kandou (Jul. 26, 2016)
- SafeZone IoT Security Framework from INSIDE Secure delivers an integrated suite of products that addresses the broad spectrum of critical IoT security needs (Jul. 25, 2016)
- Startup's IoT SoC Packs a Punch (Jul. 25, 2016)
- GLOBALFOUNDRIES Appoints Wallace Pai as General Manager to Oversee China Business Development (Jul. 25, 2016)
- Qualcomm's China Compromise Pays Off (Jul. 22, 2016)
- OTOY and Imagination unveil breakthrough PowerVR Ray Tracing hardware platform for cinematic real time rendering (Jul. 22, 2016)
- SoftBank/ARM Deal: Political Hurdles Ahead? (Jul. 22, 2016)
- ARM acquisition by SoftBank - is it good or bad for the UK and the electronics industry? (Jul. 22, 2016)
- RFEL supplies core for Arizona Radio Observatory (Jul. 21, 2016)
- Taiwan Semiconductor Mfg. Co. Ltd. Reportedly Wins Apple Inc. A11 (Jul. 21, 2016)
- BlackBerry hacks a kettle to demonstrate IoT security strain (Jul. 21, 2016)
- GPS-free geolocation solution for IoT (Jul. 21, 2016)
- Huawei and General Electric partner on industrial IoT (Jul. 21, 2016)
- ARM, Softbank and 1,500 Engineers (Jul. 21, 2016)
- ARM aims to build trust in IoT security (Jul. 21, 2016)
- Versatile FPGA IP Handing, Creation, and Packaging (Jul. 21, 2016)
- Synopsys Expands DesignWare MIPI IP Portfolio with DSI and CSI-2 Device Controllers (Jul. 20, 2016)
- Connected devices need e-commerce standard security say cyber security experts (Jul. 20, 2016)
- ARM, Symantec and more join forces to bolster IoT security (Jul. 20, 2016)
- BaySand to Announce XPresso, the ASIC Wizard to Generate the Intellectual Property (IP) Cores and Accelerate ASIC Design Cycle (Jul. 20, 2016)
- Japan Opens New LoRaWAN Network for IoT Testing (Jul. 20, 2016)
- SoftBank's Son: Quixotic or Prophetic? (Jul. 20, 2016)
- Synopsys' IC Validator Certified by TowerJazz for Signoff Physical Verification (Jul. 19, 2016)
- If not ARM, which architecture next for IoT (Jul. 19, 2016)
- ARM Acquisition: What's In It for SoftBank? (Jul. 19, 2016)
- Test and Verification Solutions expands its operations in Silicon Valley, USA (Jul. 19, 2016)
- CEVA to Unveil its CEVA-X2 DSP at the Linley Mobile & Wearable Conference 2016 (Jul. 18, 2016)
- Rambus CryptoMedia Security Platform Will Protect Pay TV Content for DishTV India (Jul. 18, 2016)
- ParkerVision Enters into Patent License and Settlement Agreement with Samsung (Jul. 18, 2016)
- Recommended acquisition of ARM by SoftBank (Jul. 18, 2016)
- Ceva unveils IP for first 5G smartphone chips (Jul. 18, 2016)
- MIPS virtualization brings secure isolation to deeply embedded applications (Jul. 18, 2016)
- Cypress Aims Low-Pin Memory at Automotive, IoT (Jul. 18, 2016)
- Comment: IoT made ARM takeover inevitable (Jul. 18, 2016)
- ARM Agrees To Be Bought by Japan's Softbank (Jul. 18, 2016)
- Sizing up the IoT, IoE and connected devices market (Jul. 18, 2016)
- The DTPCI32DC - Dual Clock 32bit PCI Bus Target Interface from Digital Core Design (Jul. 14, 2016)
- FinFET Startup Seeks Partners for Collaboration (Jul. 14, 2016)
- Infineon to buy Cree's Wolfspeed SiC business (Jul. 14, 2016)
- Leti Develops 3d Network-On-Chip to Improve High-Performance Computing (Jul. 13, 2016)
- IC manufacturing equipment market will grow 1% (Jul. 13, 2016)
- eMemory's NeoEE Solution Facilitates Module Integration for Fingerprint Applications (Jul. 13, 2016)
- Boeing Licenses Rambus DPA Countermeasures to Protect Critical Aerospace and Defense Systems from Security Threats (Jul. 13, 2016)
- Synopsys' New USB 2.0 Type-C IP Cuts Power and Area for IoT Edge Applications (Jul. 13, 2016)
- Chips&Media launches 2nd generation High Performance Google's VP9 and HEVC Multi-format Decoder IP (Jul. 12, 2016)
- Application of MIPI specifications for interconnecting components in IoT SoCs (Jul. 12, 2016)
- IoT Innovation in the Spotlight as prpl Foundation Continues to Grow (Jul. 12, 2016)
- Why the IoT depends on analog technology (Jul. 12, 2016)
- FPGA Prototyping Becomes Even More Precise with Latest Additions to S2C's World-Class Prodigy Prototype Ready Interface Library (Jul. 12, 2016)
- Toshiba Plans Deployment of Synopsys TetraMAX II on Upcoming SoC Design (Jul. 12, 2016)
- Leti Plans Startup Accelerator (Jul. 12, 2016)
- Microchip to boost 8bit AVR range following acquisition (Jul. 12, 2016)
- Mentor creates cloud community for PCB designers (Jul. 12, 2016)
- IP-Maker to release NVMe PCIe Gen 3 reference design (Jul. 12, 2016)
- Intel Custom Foundry Certifies Cadence Implementation and Signoff Tools for 10nm Tri-Gate Process (Jul. 12, 2016)
- SST Announces Qualification of Embedded SuperFlash on GLOBALFOUNDRIES' BCDLite Process (Jul. 12, 2016)
- Synopsys TetraMAX II ATPG Certified for ISO 26262 Automotive Functional Safety (Jul. 12, 2016)
- Microsemi Announces Imaging/Video Solution Providing a Secure, Reliable, Low Power Device for Imaging Applications (Jul. 12, 2016)
- TetraMAX II Shortens Test Pattern Generation From Days to Hours (Jul. 12, 2016)
- prpl Foundation Unveils the First Open Source Hypervisor for the Internet of Things (Jul. 12, 2016)
- Huaxintong Semiconductor licenses ARMv8-A architectur (Jul. 12, 2016)
- AppliedMicro Adopting TSMC 7nm FinFET Process Technology (Jul. 11, 2016)
- Global Semiconductor Sales Up Slightly in May (Jul. 11, 2016)
- Imec and Synopsys Collaborate on Interconnect Resistivity Model to Enable Early Screening of Interconnect Technology Options at Advanced Nodes (Jul. 11, 2016)
- Imec and ARM collaborate on Design-Technology Co-Optimization for 7nm technology and beyond (Jul. 11, 2016)
- Renesas Adopts Cadence Interconnect Workbench to Accelerate Performance Analysis and Verification of On-Chip Interconnect (Jul. 11, 2016)
- SiFive Introduces Industry's First Open-Source Chip Platforms (Jul. 11, 2016)
- IoT startups begin London bootcamp programme (Jul. 11, 2016)
- ST Grows STM32 MCU Family (Jul. 11, 2016)
- Ex-Broadcom Unit to Shape Cypress IoT Future (Jul. 11, 2016)
- Emerging Universal FPGA, GPU Platform for Deep Learning (Jul. 07, 2016)
- Cypress completes Broadcom wireless IoT acquisition (Jul. 07, 2016)
- Open-Silicon to Showcase Breadth of ASIC Solutions (Jul. 07, 2016)
- Glasgow adds geo-location to LoRa IoT network trial (Jul. 07, 2016)
- How to Create a Working IoT Sensor in One Month (Jul. 06, 2016)
- Synopsys' New HAPS Adaptor for Juno ARM Development Platform Accelerates Software Bring-up (Jul. 06, 2016)
- Cadence Announces Global Tensilica Design Contest for Processor Optimization (Jul. 06, 2016)
- Elolane launches Sigfox Reference Design Module for M2M and IoT Market (Jul. 06, 2016)
- S2C PRODIGY Player Pro 6.3 advance FPGA Prototyping with Progressive Design Partition and Multi-FPGA Debug Capabilities (Jul. 06, 2016)
- Google to acquire image-recognition startup Moodstocks (Jul. 06, 2016)
- InterDigital and Arup Collaborate to Make Connected Smart Cities a Reality (Jul. 06, 2016)
- Glasgow pioneers IoT connectivity (Jul. 06, 2016)
- Global Semiconductor Sales Up Slightly in May (Jul. 05, 2016)
- FinScale's Program to Accelerate Semiconductor Technology Breakthroughs (Jul. 05, 2016)
- Cypress Now the Leading Internet of Things Supplier with Acquisition of Broadcom's Wireless IoT Businiss (Jul. 05, 2016)
- Synopsys Buys Glasgow EDA Startup (Jul. 05, 2016)
- Lossy Imagination Says There's Good Signs in Graphics (Jul. 05, 2016)
- IoT reference design brings ARM and open source tools to Sigfox nodes (Jul. 05, 2016)
- FPGAs solve challenges at the core of IoT implementation (Jul. 04, 2016)
- FPGAs solve IoT implementation issues around power efficiency, interfaces and processors (Jul. 04, 2016)
- sureCore: Second direct investment into 'Emerging Star' from Enterprise Ventures portfolio (Jul. 01, 2016)
- Building Trust: From security foundations to high-value services (Jun. 30, 2016)
- Wi-Fi CERTIFIED ac brings new advances in Wi-Fi performance (Jun. 30, 2016)
- Coreworks Audio Platform Implemented by NTT Electronics in a Next Generation 4K Video Encoder LSI Chip (Jun. 30, 2016)
- ESD Alliance Reports EDA Industry Revenue Increase For Q1 2016 (Jun. 30, 2016)
- Rambus to Acquire Memory Interconnect Business from Inphi (Jun. 30, 2016)
- Electric vehicles drive power electronics market (Jun. 30, 2016)
- GE's IoT Plan For China (Jun. 30, 2016)
- Imagination and 3Glasses collaborate to promote ray tracing technology for virtual reality devices (Jun. 29, 2016)
- Palma Ceia SemiDesign Announces Silicon-Proven IEEE 802.11ah HaLow Transceiver for Industry-Standard IoT Applications (Jun. 29, 2016)
- Silicon Labs Multiband Wireless Gecko SoCs Break New Ground in the IoT (Jun. 29, 2016)
- AMD Buys PC Gaming Software Firm (Jun. 29, 2016)
- Intel invests $1.5m in IoT chip R&D in Ireland (Jun. 29, 2016)
- Feature Flexibility with USB in IoT (Jun. 29, 2016)
- ST falls in image sensor vendor ranking, Sony up (Jun. 29, 2016)
- Synopsys Optimizes DesignWare IP for PCI Express 4.0 Architecture to Reduce Latency by up to 20 Percent (Jun. 28, 2016)
- Alma Technologies Adds Three New Ultra High Throughput H.264 Encoders to its UHT IP Product Line (Jun. 28, 2016)
- Do not miss the Green Thursday offering for ultra Low-Power SoCs at 55 nm (Jun. 28, 2016)
- Dolphin Integration pushes SoC optimization to the next level with all risks managed (Jun. 28, 2016)
- CAN FD Controller IP Core Excels Through Third Plug Fest Testing (Jun. 28, 2016)
- Imagination's PowerVR GPU provides advanced graphics in Sunplus' new automotive SoC (Jun. 28, 2016)
- Alma Technologies Releases Encoder IP Core for CCSDS-Developed Lossless and Lossy Image Data Compression (Jun. 28, 2016)
- Silvaco Expands Automotive IP Porfolio with Release of CAN FD Core (Jun. 28, 2016)
- Neural Network from CEVA (Jun. 28, 2016)
- Google Fellow Talks Neural Nets, Deep Learning (Jun. 28, 2016)
- Microsemi Announces New Development Kit with RTG4 PROTO FPGAs, Providing Space Designers a Comprehensive Evaluation and Design Platform (Jun. 28, 2016)
- Imagination's multi-threaded MIPS CPUs streamline system development in Valens' new automotive solution (Jun. 28, 2016)
- Europe goes for LoRa IoT network technology without UK (Jun. 28, 2016)
- PCIe 4.0 Heads to Fab, 5.0 to Lab (Jun. 28, 2016)
- PLDA to demonstrate a record PCIe 4.0 system (Jun. 28, 2016)
- Acacia Research licenses Barco Silex's JPEG 2000 IP cores for use in search and rescue system (Jun. 27, 2016)
- CEVA's 2nd Generation Neural Network Software Framework Extends Support for Artificial Intelligence Including Google's TensorFlow (Jun. 27, 2016)
- Synopsys and Lattice Semiconductor Extend Multi-Year OEM Agreement for FPGA Design Software (Jun. 27, 2016)
- A guide to IoT processors (Jun. 27, 2016)
- SMIC Acquires LFoundry and Enters into Global Automotive Electronics Market (Jun. 24, 2016)
- Chinese chip maker looks to the global powerline IoT market through IP deal (Jun. 24, 2016)
- ARM Introduces MDK-Plus Edition (Jun. 23, 2016)
- Mobiveil successfully completes RapidIO 3.1 IP (GRIO) interoperability testing with IDT's next generation RXS 50Gbps RapidIO switch (Jun. 23, 2016)
- Truechip adds another new customer for USB 3.1 Verification Solution (Jun. 23, 2016)
- Rambus Cryptography Research Extends License Agreement with NAGRA (Jun. 23, 2016)
- Truechip adds another new customer for USB 3.1 Verification Solution (Jun. 23, 2016)
- STM32 developers get access to low-layer APIs (Jun. 23, 2016)
- PLDA GROUP launches QuickStore, a unique online Marketplace for developers and users of FPGA accelerators (Jun. 22, 2016)
- Adeas, ALSE, Auviz Systems, CAST, Concurrent EDA, Crucial IP, Enyx and Image Matters join the QuickAlliance Ecosystem (Jun. 22, 2016)
- New H.265 hybrid set-top box chipset from ALi Corp. gets a boost with MIPS CPUs (Jun. 22, 2016)
- Transceiver Provides Reliable Radio Connections and Extended Battery Life for IoT and Other Wireless Applications (Jun. 22, 2016)
- Testing the RF circuit for IoT success (Jun. 22, 2016)
- Microsemi Invests in Veracity to Support Commitment to IoT Security Market (Jun. 22, 2016)
- Acquisitions jumble up auto semiconductor rankings (Jun. 22, 2016)
- Consolidation Shuffles Automotive IC Vendor Rankings (Jun. 22, 2016)
- Cadence Debuts PSpice Web Portal and Ecosystem to Help Designers Address System Level Mixed-Signal Wireless and IoT Challenges (Jun. 22, 2016)
- FD SOI Benefits Rise at 14nm (Jun. 21, 2016)
- Cavium Buys QLogic for $1B (Jun. 21, 2016)
- PLDA Announces Gen4SWITCH - The Industry's First PCI Express 4.0 Platform Development Kit (PDK) (Jun. 21, 2016)
- Achronix FPGA-Based Accelerator-6D PCIe Board for Data Center & Network Acceleration (Jun. 21, 2016)
- Rambus prototypes 2x2mm lens-less eye-tracker for headmount displays (Jun. 21, 2016)
- Which CEVA DSP to use to Support Multimode Connectivity Requirements of IoT and M2M? (Jun. 20, 2016)
- Brite Semiconductor and Power Line Communication Leader, Semitech Semiconductor, Collaborate on Industrial M2M SoC (Jun. 16, 2016)
- Sondrel Announced as ARM Approved Design Partner at DAC 2016 (Jun. 16, 2016)
- CEVA Welcomes the Introduction of Bluetooth 5, the Next-Generation Bluetooth Standard (Jun. 16, 2016)
- Imagination increases security on MIPS processors (Jun. 16, 2016)
- Intel, CEA Team on IoT Research (Jun. 16, 2016)
- China to Dominate Fab Building (Jun. 16, 2016)
- SoC Solutions selected as ARM Approved Design Partner (Jun. 15, 2016)
- Discover the STM32 with a free 32-bit Cortex-M0/0+ MCU Professional Developer's Package (Jun. 15, 2016)
- Xilinx Broadens the Zynq UltraScale+ MPSoC Family with Streamlined Dual-Core Devices (Jun. 15, 2016)
- Updated: Micro-sequencing crams 8051 into tiny FPGA space (Jun. 15, 2016)
- Imagination and Intrinsic-ID collaborate on solutions for scalable, flexible and affordable IoT hardware security (Jun. 15, 2016)
- 100 US cities covered by Senet LoRa network for IoT (Jun. 15, 2016)
- NXP gets regulatory approval for RF Power sale (Jun. 15, 2016)
- Xilinx Broadens the Zynq UltraScale+ MPSoC Family with Streamlined Dual-Core Devices (Jun. 15, 2016)
- PLDA and M31 Announce a Compliant PCI Express 3.0 Solution Including PLDA's XpressRICH3 Controller and M31's PHY IP for the TSMC 28HPC+ Process Node at 8 GT/s (Jun. 14, 2016)
- Rambus to Acquire Snowbush IP Assets (Jun. 14, 2016)
- Silvaco Enters IP Market With Acquisition of IPextreme (Jun. 14, 2016)
- Apple Expands in AI, Smart Home (Jun. 14, 2016)
- On semiconductor extends offer to acquire Fairchild semiconductor (Jun. 14, 2016)
- Why Cypress Semiconductor Corp. Gained 18% in May (Jun. 14, 2016)
- MIPI Alliance Welcomes Synopsys as a Promoter Member (Jun. 14, 2016)
- Open source hypervisor exploits hardware virtualization in MIPS CPUs (Jun. 14, 2016)
- OmniShield brings security by isolation to the automotive market (Jun. 14, 2016)
- Nokia announces horizontal IoT platform called Impact (Jun. 14, 2016)
- STMicroelectronics Simplifies Design-In of State-of-the-Art Security for the IoT (Jun. 14, 2016)
- Ireland is Sigfox-enabled for IoT (Jun. 14, 2016)
- STMicroelectronics Seeks Revival (Jun. 14, 2016)
- NXP Sells Biz Unit to China, Downsizes 25% (Jun. 14, 2016)
- Printing IoT security (Jun. 14, 2016)
- Open-Silicon Selected for ARM Approved Design Partner Program (Jun. 13, 2016)
- NXP Semiconductors to Sell Standard Products Unit for $2.75 Billion (Jun. 13, 2016)
- SILKAN Selected by DANAM Systems as ARINC664-Part 7 and Ethernet IP supplier For military and civil helicopters (Jun. 13, 2016)
- Python's role in developing real time embedded systems (Jun. 13, 2016)
- Embedded System Market worth USD 258 Billion by 2023: Global Market Insights, Inc. (Jun. 13, 2016)
- Alma Technologies Discontinues Partnership with Cast (Jun. 13, 2016)
- Open source hypervisor runs multiple OS in IoT designs (Jun. 10, 2016)
- RFEL wideband core IP adopted for Ultra Channeliser (Jun. 09, 2016)
- Taiwan foundries have strong May revenues (Jun. 09, 2016)
- NXP Selects Synopsys As Primary SoC Verification Solution (Jun. 09, 2016)
- Allegro DVT Reconfirms Industry Leadership in Compliance Streams, Extends Its HEVC Test Suites (Jun. 09, 2016)
- Xylon Announces Latest Release of the logiADAK Kit for Vision-Based ADAS (Jun. 09, 2016)
- Inuitive Licenses Ceva Processor (Jun. 09, 2016)
- Artosyn selects Chips&Media HEVC/H.265 Codec IP for Drone, Robots, AR, VR etc. (Jun. 08, 2016)
- SMIC and Synopsys Deliver 28-nm HKMG Low-Power Reference Flow (Jun. 08, 2016)
- Qualcomm launches reference platform for the connected car (Jun. 08, 2016)
- Cadence - Collaboration with ARM accelerates custom SoC (Jun. 08, 2016)
- Synopsys' New Suite of DDR4 IP Features Increases Capacity and Reliability of High-Performance Cloud Computing Systems (Jun. 08, 2016)
- ARM Announces POP IP for ARM Cortex-A73 on TSMC 16FFC Process (Jun. 08, 2016)
- Xilinx Extends SDSoC Development Environment, Enabling Software Defined Programming of the 16nm Zynq Ultrascale+ MPSoC (Jun. 08, 2016)
- Leading Russian semiconductor foundry Angstrem-T has developed a design using a Cortus APS core (Jun. 08, 2016)
- Cadence and SMIC Collaborate on Delivery of Low-Power 28nm Digital Design Reference Flow (Jun. 07, 2016)
- Menta Delivers Industry's Highest Performing Embedded Programmable Logic IP for SoCs (Jun. 07, 2016)
- Arastu Systems' DFI 3.1 compatible and validated DDR4 Controller Core for increased system performance and reliability (Jun. 07, 2016)
- Icron Technologies Announces New Maverick Extension Platform Featuring ExtremeUSB 2.0 and 3.0 with intoPIX TICO UHD Video over Single Cable at InfoComm 2016 (Jun. 07, 2016)
- CAST Licenses GZIP Core to Tier 1 Wireless Chipset Vendor (Jun. 07, 2016)
- Truechip adds a new customer for PCIe Verification Solution (Jun. 07, 2016)
- ARM Announces Solutions for Custom SoC Development (Jun. 07, 2016)
- eInfochips Joins ARM Approved Design Partner Program as a Founding Member (Jun. 07, 2016)
- Intento Enters EDA Market with Software that Accelerates Analog and Mixed-Signal Design, Enables IP Re-Use Through Technology Migration (Jun. 07, 2016)
- Intel Custom Foundry Certifies Mentor Graphics Physical Verification and Circuit Simulation Tools for 10nm Tri-Gate Process (Jun. 07, 2016)
- Avery Design Systems Announces SimXACT 3.0 for Improved X-Verification (Jun. 07, 2016)
- LoRa module extends range of IoT wireless links (Jun. 07, 2016)
- Andes Technology Corporation Announces Quick-Start Design Package That Significantly Reduces Time to Market of SoC Designs (Jun. 07, 2016)
- CEVA-XM4 vector vision processor IP powers vision SoC NU4000 (Jun. 06, 2016)
- ARM expands DesignStart - 45 sample SoCs for $16k (Jun. 06, 2016)
- Cadence Expands Collaboration with ARM to Accelerate Custom SoC and IoT System Designs with Industry's First End-to-End Hosted Design Solution (Jun. 06, 2016)
- EnSilica, Micrium Partners on RTOS/MCU Integration (Jun. 06, 2016)
- Rambus to Pay $32.5M for Semtechs IP Biz (Jun. 06, 2016)
- Ultrasoc, Sondrel team up on debug IP (Jun. 06, 2016)
- Arasan Announces DPHY IP Core @2.5Gbps per lane with TSMC 28nm HPC Process (Jun. 06, 2016)
- Fraunhofer IIS/EAS and SilabTech Announces Best in Class 2.5D Based Chip-to-Chip Interconnect Solution (Jun. 06, 2016)
- EnSilica and Micrium partner to port uC/OS-III RTOS to eSi-RISC processor cores (Jun. 06, 2016)
- ARM Extends Solutions for Custom SoC development in Embedded and IoT Markets (Jun. 06, 2016)
- Imec, Holst Centre and Methods2Business Develop Complete Low-Power Wi-Fi HaLow Radio Solution for Internet of Things (IoT) Applications (Jun. 06, 2016)
- ARM provides 'simplified access' to EDA tools (Jun. 06, 2016)
- ARM expands DesignStart - 45 sample SoCs for $16k (Jun. 06, 2016)
- vestigating Cavium's ThunderX: The First ARM Server SoC With Ambition (Jun. 06, 2016)
- SILICONGATE Presents the IoT Flexible Power Management Solution at the 53th DAC (Jun. 06, 2016)
- sureCore Delivers 40nmULP Memory Compiler (Jun. 03, 2016)
- True Circuits Attends Design Automation Conference Showcases State-of-the-art Ultra PLL, Low Power IoT PLL and Revolutionary DDR 4/3 PHY (Jun. 02, 2016)
- Comcores Announce Availability of a 10G TSN Ethernet MAC solution (Jun. 02, 2016)
- ARM Expands Cycle Model Portfolio with Support for SystemC (Jun. 02, 2016)
- Synopsys' SpyGlass Solution Delivers Critical Technology to Enable Compliance with DO-254 Aviation Safety Standard (Jun. 02, 2016)
- Hitachi Adopts Cadence AMS Model-Based Methodology and Tools for Mixed-Signal Design Verification (Jun. 02, 2016)
- Silvaco Group Acquires edXact for SPICE Simulation Speed-up (Jun. 02, 2016)
- Synopsys' Next-Generation Embedded Vision Processors Boost Performance up to 100X (Jun. 01, 2016)
- Andes Technology Corporation Announces Most Advanced Embedded Security Based on Physical Unclonable Functions From Intrinsic-ID Inc. for Its Secure CPU/MCU Cores (Jun. 01, 2016)
- sureCore 40nm Ultra-Low Voltage SRAM Proves World Beating Low Voltage Operation in Silicon (Jun. 01, 2016)
- Boost Valley Announces V-by-One HS Verification IP (Jun. 01, 2016)
- New FPGA/SoC TFT LCD Display Controller IP Core (Jun. 01, 2016)
- SureCore SRAM IP runs at 20MHz on 0.6V (Jun. 01, 2016)
- FDSOI grabs European money for IoT (Jun. 01, 2016)
- NetSpeed and Magillem partner to enable seamless IP integration of cache coherent NoC IP (Jun. 01, 2016)
- Xiaomi Buys 1,500 Microsoft Patents, Eyes Global Expansion (Jun. 01, 2016)
- Allegro DVT to Highlight Latest Multi-Format Video Codec Hardware IPs at Upcoming DAC 2016 (Jun. 01, 2016)
- Design Verification Challenges in Modern SoCs - HDL Design House Webinar (May. 31, 2016)
- Chips&Media unveils its first Image Signal Processing (ISP) IP solution (May. 31, 2016)
- Latest ARM Premium Mobile Technology to Drive Immersive Experiences (May. 31, 2016)
- HSA spec upgrade supports multivendor SoCs (May. 31, 2016)
- ARM's Bifrost Steps Up Graphics, Bridges to Machine Learning (May. 31, 2016)
- Cadence Next-Generation Virtuoso Platform Deployed by STMicroelectronics for SmartPower Technologies (May. 31, 2016)
- Avnet ASIC Israel Ltd. (AAI) Standardizes on Synopsys' Design Compiler Graphical to Accelerate SoC Design Cycle (May. 31, 2016)
- Industrial IoT starts to make real-world progress (May. 31, 2016)
- Innovium secures more than $50M in funding (May. 31, 2016)
- China Moves in Takeover of European Wafer Supplie (May. 31, 2016)
- GloFo to equip 300mm fab in China (May. 31, 2016)
- Long-term Strategy Pays Off As TI Maintains Analog Leadership (May. 31, 2016)
- INSIDE Secure and Rambus Collaborate to Protect Delivery of 4K and Ultra HD Premium Content (May. 30, 2016)
- ARM aims Artemis at low power (May. 30, 2016)
- ARM takes VR/AR mobile with GPU core (May. 30, 2016)
- Development kit targets industrial IoT (May. 30, 2016)
- Imagination joins the TRON Forum in Open IoT Platform initiative (May. 30, 2016)
- Early Adopters of ARM Cortex-A73 CPU and Mali-G71 GPU Successfully Tape-out Using Synopsys' IC Compiler II (May. 29, 2016)
- Cadence Delivers Rapid Adoption Kits Based on a 10nm Reference Flow for New ARM Cortex-A73 CPU and ARM Mali-G71 GPU (May. 29, 2016)
- Digital Blocks DB9000 TFT LCD Display Controller IP Core Family Achieves Leadership cross a wide range of applications (May. 28, 2016)
- FDSOI Driving ST's Automotive Biz (May. 27, 2016)
- PLDA Achieves PCI Express 3.0 Compliance for XpressSWITCH IP, Adding to its List of PCI Express Compliant Products (May. 26, 2016)
- Xilinx adds FPGA acceleration for new data-centre content-transfer framework (May. 26, 2016)
- Four MIPS-based connected devices for the IoT revolution (May. 26, 2016)
- 10 design steps to IoT heaven (May. 26, 2016)
- Faraday Exhibits 28HPCU SoC Design Service and IP Solutions at DAC 2016 (May. 26, 2016)
- Synopsys Accelerates Software Development for Automotive Systems with New Models for Bosch Timer and In-Car Communication IP (May. 25, 2016)
- Imec, Holst Centre and Barco Silex Collaborate on Data Security for Wearables and Internet of Things Networks (May. 25, 2016)
- Optimised cryptographic solution for home automation on Cortus APS3RP core (May. 25, 2016)
- Globalfoundries Working on Next-Gen FDSOI Process (May. 25, 2016)
- Arteris Ncore Cache Coherent Interconnect IP Enabled by ARM's Cycle Models (May. 25, 2016)
- IoT Security is Imec Target (May. 25, 2016)
- Arteris Ncore Cache Coherent Interconnect IP is Implemented by NXP (May. 24, 2016)
- Analogix Licenses USB-C Technology to LG Electronics (May. 24, 2016)
- Synopsys Delivers Industry's First Cache Coherent Subsystem Verification Solution for Arteris Ncore Interconnect (May. 24, 2016)
- Agnisys and Breker Partner to Generate System-Level Portable Stimulus Sequences (May. 24, 2016)
- Innosilicon Announces that the world 1st 14nm A4 Dominator ASIC is ready for mass shipment in 2 months (May. 24, 2016)
- Synopsys Completes Acquisition of Gold Standard Simulations (May. 24, 2016)
- Agnisys Expands Product Portfolio With Portable Sequence Generator (May. 24, 2016)
- Alizem releases new Safe Engine Stop-Start Software IP to improve energy-efficiency of delivery vehicles (May. 24, 2016)
- ARM Cortex-A72 Models and Virtual Platforms Released by Imperas and Open Virtual Platforms (May. 24, 2016)
- FPGA Manager IP eases data streaming (May. 24, 2016)
- Palma Ceia SemiDesign Tapes Out 802.11ax Analog Frontend for Next-Generation Access Points (May. 23, 2016)
- eMemory NeoFuse IP Qualified in 40nm EHV Process (May. 23, 2016)
- GLOBALFOUNDRIES Releases Performance-Enhanced 130nm SiGe RF Technology to Advance Next Generation Wireless Network Communications (May. 23, 2016)
- Technology Leaders Join Forces to Bring an Open Acceleration Framework to Data Centers and Other Markets (May. 23, 2016)
- Xilinx Expands its 16nm UltraScale+ Product Roadmap to Include Acceleration Enhanced Technologies for the Data Center (May. 23, 2016)
- AMPHION targets DAC 2016 to demonstrate compact HEVC/H.265 hardware decoder IP using H.265 bitstreams from encoder IP innovator NGCodec (May. 23, 2016)
- Synopsys Expands Software Integrity Strategy to Enable Development of Safer and More Secure Automotive Software (May. 23, 2016)
- Synopsys Launches Pre-Wafer Simulation Solution to Reduce Semiconductor Process Development Time (May. 23, 2016)
- Foundries' Sales Show Hard Times Continuing (May. 23, 2016)
- Tower Debuts RF Process For IoT Front Ends (May. 23, 2016)
- Intel selects Mercury Systems to join FPGA tech-based network (May. 19, 2016)
- Fujitsu and BAE Systems enter into a cybersecurity partnership (May. 19, 2016)
- INSIDE Secure to sell its semiconductor business to Swiss cybersecurity expert WISeKey (May. 19, 2016)
- Microsemi Announces RTG4 PROTO FPGAs to Enable Lower Cost Prototyping and Design Validation for High-Speed Radiation-Tolerant FPGAs (May. 19, 2016)
- ANSYS Introduces First Big Data and Machine Learning System for Engineering Simulation (May. 19, 2016)
- ARM Acquires Apical - a Global Leader in Imaging and Embedded Computer Vision (May. 18, 2016)
- Mobileye, ST to develop autonomous driving SoC (May. 18, 2016)
- Imagination goes with Debian OS for MIPS64 processors (May. 18, 2016)
- ARM multi-core v8 test chip fabbed on TSMC 10nm finfet process (May. 18, 2016)
- CEA expands collaboration with Intel in wireless and IoT (May. 18, 2016)
- Security startups strive on IoT, attract venture capital (May. 18, 2016)
- Nokia's brand goes to startup with $500M plan (May. 18, 2016)
- Experts find IoT security lacking (May. 18, 2016)
- 円星科技完整佈局新一代高效能USB矽智財解決方案 (May. 18, 2016)
- New Layers Form within the Cloud (May. 17, 2016)
- Latest Synopsys IC Compiler II Release Boosts Quality-of-Results for Performance-Critical Designs (May. 17, 2016)
- Aldec Extends Spectrum of Verification Tools for Use in Digital ASIC Designs (May. 17, 2016)
- Toshiba Expands Synopsys IC Compiler II Usage Across Groups to Shorten Design Cycle (May. 17, 2016)
- Xentech Solutions Ltd selects Achronix Speedster22i FPGAs for its Axtrinet Ethernet Packet Generators (May. 17, 2016)
- Synopsys Completes Acquisition of Simpleware (May. 17, 2016)
- S2C Shares Expert FPGA Prototyping Knowledge at 2016 Design Automation Conference (May. 17, 2016)
- The World's Best Multiplexer (May. 17, 2016)
- Arteris Redefines Heterogeneous Multicore Cache Coherency with Configurable, Distributed Semiconductor Architecture (May. 17, 2016)
- UltraSOC refines tool suite (May. 17, 2016)
- Truechip announces first customer shipment of CPRI Comprehensive Verification IP (CVIP) (May. 16, 2016)
- First Quarter 2016 Silicon Wafer Shipments Increase Quarter-Over-Quarter (May. 16, 2016)
- NEWRACOM to exhibit top-notch Wi-Fi and Bluetooth technologies for mobile, IoT, and M2M connected consumer devices at COMPUTEX 2016 and DAC 2016 (May. 16, 2016)
- Lattice bridge IC brings mobile display interfaces to industrial apps (May. 16, 2016)
- Xilinx Board Of Directors Increases Repurchase Authorization By $1 Billion (May. 16, 2016)
- Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs (May. 16, 2016)
- Moortec to exhibit at next week's TSMC China Technology Symposium (May. 13, 2016)
- Samsung prepares for China attacks on semiconductor (May. 12, 2016)
- From catching up to forging ahead: China's new role in the semiconductor industry (May. 12, 2016)
- EC funds SMEs to develop cyber-physical systems for robotics and industry (May. 12, 2016)
- Istuary Innovation Group Selects Agnisys IDesignSpec for Enterprise Storage Chips (May. 12, 2016)
- VeriSilicon Supports the Connected Car by Joining Automotive Grade Linux (May. 12, 2016)
- Sidense Exhibiting Secure and Reliable 1T-OTP at TSMC 2016 China and Taiwan Symposiums (May. 12, 2016)
- Algo-Logic Systems Launches FPGA Accelerated CME Tick-To-Trade System (May. 11, 2016)
- ARM University Program Introduces New Mobile Gaming Education Kit (May. 11, 2016)
- ON Semiconductor Expands Low Power Wireless Solutions Portfolio with SIGFOX and ARM for Rapid IoT Deployment (May. 11, 2016)
- NXP takes No.1 auto IC slot (May. 11, 2016)
- Synopsys Expands Portfolio of ARC Processors for Safety-Critical Automotive Applications to Include DSP and Cache Support (May. 11, 2016)
- Analysis of Cypress Semiconductor acquisition of Broadcom wireless IoT assets (May. 11, 2016)
- Addressing Three Critical Challenges of USB Type-C Implementation (May. 10, 2016)
- Design, Test & Repair Methodology for FinFET-Based Memories (May. 10, 2016)
- HDL Design House Appoints New Representative for Central Europe, Nordic Region and the US (May. 10, 2016)
- Gartner Says Worldwide Semiconductor Capital Spending to Decline 2 Percent in 2016 (May. 10, 2016)
- Barco Silex launches flexible eSecure IP module as cornerstone for fully-secured IoT applications (May. 10, 2016)
- Automotive Electronics System Demand Fails to Boost Automotive IC Market in 2015 (May. 10, 2016)
- Cypress Adopts Cadence Digital Implementation and Circuit Simulation Tools for 40nm Automotive Designs (May. 10, 2016)
- Synopsys Verification Solution Certified for the Most Stringent Level of Automotive Safety Measures Defined by the ISO 26262 Standard (May. 10, 2016)
- Imagination Inside Innovative Video Analytics Engine (May. 10, 2016)
- VORAGO Technologies Announces Availability of Industrys First ARM Cortex MCUs Built for Extreme Conditions (May. 10, 2016)
- FPGAs for the Masses? (May. 10, 2016)
- Sigfox plans to build IoT networks in U.S. 100 cities this year (May. 10, 2016)
- 10 Favorite FPGA-Based Prototyping Boards (May. 10, 2016)
- Credo 16-nm 28G and 56G PAM-4 SerDes Now Available on TSMC FinFET Compact Process (May. 09, 2016)
- EnSilica launches eSi-ECDSA cryptographic IP for standards-compliant automotive Car2x communications (May. 09, 2016)
- Why is NXP Moving to FD-SOI? (May. 09, 2016)
- Altera Accelerates High-capacity FPGA Design with Quartus Prime Pro Design Software (May. 09, 2016)
- InvenSense and ARM Innovation Ecosystem Accelerator Partner to Advance China's IoT Industry (May. 09, 2016)
- Tsinghua buys 3% of Imagination (May. 09, 2016)
- MagnaChip and YMC Expand Cost-Effective 0.18um Multiple-Time Programmable (MTP) Manufacturing Processes (May. 09, 2016)
- Tezzaron Cuts Design Time in Half with Cadence Full-Flow Digital RTL-to-Signoff Solution (May. 09, 2016)
- RFEL adds Wideband capability to its award-winning ChannelCore Flex advanced channeliser IP core (May. 09, 2016)
- FinFET Technology Market by Technology, Product, End-User and Geography - Global Forecast to 2022 (May. 09, 2016)
- Smart cities are a mystery to most of us (May. 09, 2016)
- OmniPHY Named One of 2016 20 Most Promising Semiconductor Companies by SiliconIndia (May. 06, 2016)
- Analog, MEMS Drag On ST's Results (May. 06, 2016)
- Samsung considers partnering with Chinese companies in semiconductors (May. 06, 2016)
- A new architecture for consumer IoT applications (May. 05, 2016)
- Chip Sales Edge Up Slightly (May. 04, 2016)
- Faraday Showcases Virtual Platform Solution and 28nm IP at ChipEx 2016 (May. 04, 2016)
- CMOS Image Sensors Expected To Set Record-High Sales for Another Five Years (May. 04, 2016)
- Creonic Participates in International SENDATE-TANDEM Research Project (May. 04, 2016)
- Texas Instruments Leads Industrial Semiconductor Vendor Share Ranking in 2015; Market Rises to $40.7 billion (May. 04, 2016)
- Faraday Reduces Packaging Design Time by 60 Percent Using Cadence OrbitIO Interconnect Designer and SiP Layout (May. 04, 2016)
- New Cadence Allegro Platform Accelerates Design of Compact, High-Performance Products Using Flex and Rigid-Flex Technologies (May. 03, 2016)
- Sonics Develops Industry's First Energy Processing Unit Based on the ICE-Grain Power Architecture (May. 03, 2016)
- NetSpeed Systems expands presence in Taiwan through partnership with Maojet Technology (May. 03, 2016)
- IEEE Releases the Accellera SystemC AMS Standard as IEEE 1666.1-2016 (May. 03, 2016)
- Russian mobile processor firm uses MIPS and PowerVR cores (May. 03, 2016)
- Cadence Expands OrCAD Solution to Address Flex and Rigid-Flex Design Challenges for IoT, Wearables and Mobile Devices (May. 03, 2016)
- Semtech Announces the Industry's First Single Chip Hybrid PLC and LoRa Wireless Platform for Smart Grid, Smart Metering and IoT Applications (May. 03, 2016)
- High Performance HEVC decoder IP release by Chips&Media (May. 03, 2016)
- Synopsys Delivers Next-Generation Verification IP for Micron's Hybrid Memory Cube Architectur (May. 02, 2016)
- Try and adopt Motu-Uta, the benchmark from Dolphin Integration for a fair evaluation of Standard Cell libraries (May. 02, 2016)
- Attopsemi Published a Paper in ICMTS 2016, Ultra-small and Ultra-reliable Innovative Fuse Scalable from 0.35um to 28nm (May. 02, 2016)
- Dongbu HiTek Provides Process Design Kits for Synopsys' Custom Compiler Solution (May. 02, 2016)
- Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications (May. 02, 2016)
- Global Semiconductor Sales Increase Slightly in March (May. 02, 2016)
- Next-generation multi-platform video analytics SoC results from collaboration between Imagination and ELVEES (May. 02, 2016)
- Samsung cranks up third gen FinFET process (May. 02, 2016)
- MaxLinear Buys Microsemi's Broadband Wireless Unit (May. 02, 2016)
- Intel to Exit Mobile SoC Business (Apr. 29, 2016)
- Altera's Design Solutions Network Connects Customers with Experts to Help Innovate With Their FPGA-Based Designs (Apr. 28, 2016)
- Cadence Completes Acquisition of Rocketick Technologies (Apr. 28, 2016)
- Cypress to Acquire Broadcom's Wireless Internet of Things Business (Apr. 28, 2016)
- Microsemi and Mercury Systems Announce Scheduled Closing for Microsemi's Sale of its Embedded Security, RF and Microwave, and Custom Microelectronics Businesses to Mercury (Apr. 28, 2016)
- Cypress to Pay $550 Million for Broadcom's IoT Business (Apr. 28, 2016)
- Apple Drove Entire Foundry Sales Increase at TSMC in 2015 (Apr. 27, 2016)
- Autotalks License and Deploy CEVA DSP for Mass-Market V2X Chipset (Apr. 27, 2016)
- UMC: Business to Bounce Back This Year (Apr. 27, 2016)
- Pleora Brings High-Performance Imaging Expertise to NBASE-T Alliance (Apr. 27, 2016)
- NXP Bullish on Future With Freescale in Fold (Apr. 27, 2016)
- President Obama embraces IoT and Industrie 4.0 (Apr. 27, 2016)
- ANSYS Simulation Solutions Bolster ARM Energy-Efficient IP For Internet of Things and Cloud Servers (Apr. 26, 2016)
- GCT Semiconductor Licenses Arteris FlexNoC Interconnect IP for LTE Digital Baseband Systems-on-Chip (SoCs) (Apr. 26, 2016)
- RFEL launches new Fractional Rate Resampler IP core (Apr. 26, 2016)
- MACOM Initiates Legal Action Against Infineon Technologies Over Next-Generation Semiconductor Technology for 4G/LTE and 5G Networks (Apr. 26, 2016)
- Synopsys Delivers Industry's First MIPI I3C IP for Sensor Connectivity Targeting IoT and Automotive Applications (Apr. 26, 2016)
- Low-power of Bluetooth SoCs depends on Dolphin Integration's oscillators (Apr. 25, 2016)
- AMD Licenses x86 To China (Apr. 25, 2016)
- MicroPnP IoT platform uses LTC SmartMesh networking IP (Apr. 25, 2016)
- Samsung Details Foundry Roadmap (Apr. 22, 2016)
- samsung foundry updates 7nm euv 10lpp and 14lpc (Apr. 22, 2016)
- Combining Deeply Depleted Channel and near / sub-threshold technologies to reduce energy (Apr. 21, 2016)
- Alpha Data has partnered with Chevin Technology to support low latency 10G Ethernet and UDP offload IP on the ADM-PCIE-KU3 Accelerator board with Xilinx Kintex Ultrascale FPGA (Apr. 21, 2016)
- Rambus joins the RISC-V Foundation (Apr. 21, 2016)
- Billions of trainers tagged in "biggest" IoT deployment (Apr. 21, 2016)
- Comcores Announce Availability of CPRI v7.0 (Apr. 20, 2016)
- Comcores provide Flexible Ethernet Switch IP Design Optimized for switching in C-RAN and Next-Generation LTE Advanced Networking Equipment (Apr. 20, 2016)
- Ams Breaks Ground on N.Y. Fab (Apr. 20, 2016)
- Gartner: 10 Semiconductor Vendors With The Most Market Share In 2015 (Apr. 20, 2016)
- Qualcomm Signs 3G/4G Chinese Patent License Agreement with Hisense (Apr. 20, 2016)
- Shifting gears for the IoT (Apr. 20, 2016)
- 真正安全系统的真随机数发生器 (Apr. 19, 2016)
- 使用优化的视频DAC提供高质量模拟视频信号 (Apr. 19, 2016)
- NetSpeed Systems Extends Global Footprint in Israel Through Sales Rep Agreement with Ipro (Apr. 19, 2016)
- Cypress Semiconductor Corp utilizes Aceic Design Technologies for their BLE verification Requirements (Apr. 19, 2016)
- Istuary Innovation Group Selects Arteris FlexNoC Interconnect IP For Development of Proprietary Enterprise Storage Controllers (Apr. 19, 2016)
- Longtime Verific Customer S2C Upgrades to SystemVerilog (Apr. 19, 2016)
- Imagination, Microchip and Digilent deliver cutting-edge IoT curriculum for universities worldwide (Apr. 19, 2016)
- Intel Cuts 12,000, 11% of Staff (Apr. 19, 2016)
- 14 IC Product Categories to Exceed Total IC Market Growth in 2016 (Apr. 19, 2016)
- Number of 300mm IC Wafer Fabs Expected to Reach 100 in 2016 (Apr. 19, 2016)
- Xilinx Extends SmartConnect Technology to Deliver 20 -- 30% Breakthrough in Performance for 16nm UltraScale+ Devices (Apr. 19, 2016)
- Analysts bullish on IoT security (Apr. 19, 2016)
- Rambus Cryptography Research Unveils Latest Release of DPA Workstation Analysis Platform (Apr. 18, 2016)
- Imagination collaborates with Cascoda to bring innovative low-power wireless connectivity to the Creator Ci40 IoT development board (Apr. 18, 2016)
- Qualcomm Signs 3G/4G Chinese Patent License Agreement with Yulong (Apr. 18, 2016)
- Server and Cloud Leaders Collaborate to Create China-based Green Computing Consortium (Apr. 18, 2016)
- Blackmagic Design selects the TICO lightweight compression to move to Live video production over IP (Apr. 18, 2016)
- Altera Demonstrates Ultra High Definition (UHD) Solutions at NAB; Offering a Path to Virtualized Studio Infrastructure (Apr. 18, 2016)
- Could China Get Approval for a Semiconductor Acquisition? (Apr. 18, 2016)
- 联华电子认证Cadence Virtuoso LDE Analyzer适用于其28HPCU制程 (Apr. 15, 2016)
- CAN FD Plug Fest Shows Robust Operation of Controller IP Core by CAST and Fraunhofer IPMS (Apr. 15, 2016)
- UMC Standardizes on Industry-Leading ARM Artisan Platform for Physical IP (Apr. 15, 2016)
- Kilopass, Mie Fujitsu Semiconductor Announce Technology Development Partnership (Apr. 14, 2016)
- Toshiba Launches ARM Cortex-M3-Based Microcontrollers with Latest 65nm Flash Embedded Logic Process (Apr. 14, 2016)
- NXP mulling sale of standard chip business to China (Apr. 14, 2016)
- Mentor Graphics Emulation Services Accelerates Verification with the Veloce Emulation Platform (Apr. 14, 2016)
- Multicore SoCs stay a step ahead of SoC FPGAs (Apr. 14, 2016)
- Cadence buys Israel multicore simulation startup (Apr. 14, 2016)
- FD-SOI Expands, But Is It Disruptive? (Apr. 14, 2016)
- Brite Semiconductor Releases YOU Brand IP Portfolio and Silicon Platform Solution (Apr. 13, 2016)
- Digital Blocks I2C & SPI Controller IP Core Families Extend Leadership in Sensor Interface to Host Processors with System-Level Features & Low Power (Apr. 13, 2016)
- USB 3.0 Promoter Group Defines Authentication Protocol for USB Type-C (Apr. 13, 2016)
- Gartner Says Worldwide Semiconductor Revenue Expected to Decline 0.6 Percent in 2016 (Apr. 13, 2016)
- Foundry Sales Growth Slows (Apr. 13, 2016)
- UMC Qualifies Cadence Virtuoso LDE Analyzer for its 28HPCU Process (Apr. 13, 2016)
- Synopsys Delivers Industry's First Verification IP for USB Power Delivery 3.0 (Apr. 13, 2016)
- Digital Blocks I2C & SPI Controller IP Core Families Extend Leadership in Sensor Interface to Host Processors with System-Level Features & Low Power (Apr. 13, 2016)
- 灿芯半导体发布YOU系列IP和硅平台解决方案 (Apr. 13, 2016)
- Barco Silex announces VC-2 HQ RTP mapping ready for broadcast video production over IP (Apr. 12, 2016)
- Worldwide Semiconductor Foundry Market Grew 4.4 Percent in 2015, According to Final Results by Gartner (Apr. 12, 2016)
- Sayonara, Japan Semiconductor Inc (Apr. 12, 2016)
- China steps up fabless game (Apr. 12, 2016)
- 5 reasons why MIPS M-class CPUs are ideal for IoT (Apr. 12, 2016)
- US Government Seeks Guidance On Its Role in IOT (Apr. 12, 2016)
- JEDEC Launches Quality & Reliability Task Group in China; Invites Industry Participation (Apr. 12, 2016)
- Imagination collaborates with Cascoda to bring innovative low-power wireless connectivity to the Creator Ci40 IoT development board (Apr. 12, 2016)
- Cadence to Acquire Rocketick, Delivering Revolutionary Parallel Logic Simulation Speed-up (Apr. 11, 2016)
- HDL Design House Joins PCI-SIG (Apr. 11, 2016)
- Addressing IoT and Industry 4.0 sensor backplane needs with an embedded smart analog architecture (Apr. 11, 2016)
- TSMC to Sell 5.1% of Xintec Inc. (Apr. 08, 2016)
- Tsinghua buys stake in Lattice (Apr. 08, 2016)
- Ensigma Whisper RPUs and IoT applications (Apr. 08, 2016)
- Wireless M-Bus evaluation kit targets IoT (Apr. 07, 2016)
- Arastu Systems announces DFI 4.0 compatible and validated LPDDR4 DRAM Memory Controller (Apr. 07, 2016)
- Arasan Announces Ultra Low Gate count, Ultra Low Latency Soundwire IP Core (Apr. 07, 2016)
- eMemory Launches Enhanced NeoFuse IP for IoT Applications (Apr. 07, 2016)
- SNPS' Custom Compiler: closing the FinFET productivity gap (Apr. 07, 2016)
- IoT security market to exceed $28 billion by 2020 (Apr. 07, 2016)
- D&R introduces a new version of its IP management platform (IPMS) integrating IP Packaging, IP Delivery and CRM features (Apr. 06, 2016)
- INSIDE Secure and VisualOn Partner to Secure Over-The-Top Content Delivery and Playback Across Multiple Platforms (Apr. 06, 2016)
- Arrow Electronics Showcases IoT Solutions at Connect Expo in Australia (Apr. 06, 2016)
- Intel Acquires Yogitech for IoT Functional Safety (Apr. 06, 2016)
- Chips&Media's Video IP powered SoCs reached 140 Million shipments in 2015 (Apr. 06, 2016)
- Intel Plans A Future of CMOS (Apr. 05, 2016)
- China's Interest in FD-SOI: Is It for Real? (Apr. 05, 2016)
- Samsung Starts Mass Producing Industry's First 10-Nanometer Class DRAM (Apr. 05, 2016)
- Cadence Unveils Next-Generation Virtuoso Platform Featuring Advanced Analog Verification Technologies and 10X Performance Improvements Across Platform (Apr. 05, 2016)
- Synopsys Extends Verification IP Portfolio for Automotive Applications (Apr. 05, 2016)
- Microsoft releases a 64-bit version of Windows 10 IoT Core Pro (Apr. 05, 2016)
- The Alliance for Open Media Welcomes New Members and Announces Availability of Open Source Video Codec Project (Apr. 05, 2016)
- Hua Hong Semiconductor Cooperates with MindMotion to Develop IP Platform Targeting IoT Smart Hardware (Apr. 05, 2016)
- U.S. Companies Continue to Capture Bulk of IDM and Fabless IC Sales (Apr. 05, 2016)
- Cadence addresses complex analogue designs for IoT (Apr. 05, 2016)
- Global Semiconductor Market Slumps in 2015, IHS Says (Apr. 04, 2016)
- France Brevets licenses NFC Patents to Sony (Apr. 04, 2016)
- FinFET's Father Forecasts Future (Apr. 01, 2016)
- Meet the SILABTECH Team and know more about our Product portfolio at the D&R IP-SOC India Conference scheduled on April 6th , 2016 (Apr. 01, 2016)
- Sigfox ties IoT data analytics into Microsoft Azure cloud (Apr. 01, 2016)
- Dolphin Integration Gets the EN 9100 Certification for its Service Activity of ASIC/SoC Integration (Mar. 31, 2016)
- 智原MIPI IP子子系统出货量吐过一千五百万套，涵盖移动装置，安全监控与数 (Mar. 31, 2016)
- Swiss Open-Source Processor Core Ready For IoT (Mar. 31, 2016)
- Open-Silicon to Exhibit and deliver two Tech Talks at IP SoC 2016, Bangalore on Wednesday, April 6, 2016 (Mar. 30, 2016)
- JEDEC Publishes Universal Flash Storage (UFS) Removable Card Standard (Mar. 30, 2016)
- Custom Compiler Pioneers New Era of Visually-Assisted Automation (Mar. 30, 2016)
- Cadence Digital and Signoff Tools Certified on Samsung Foundry's 14LPP Process (Mar. 30, 2016)
- Synopsys' Custom Compiler Certified for TSMC 10-nm and 7-nm FinFET Process Nodes (Mar. 30, 2016)
- Synopsys' Custom Compiler Deployed at STMicroelectronics to Boost IP Development Productivity (Mar. 30, 2016)
- What's trending in the IoT space (Mar. 30, 2016)
- Image Matters and PLDA enables 8K, HDR, HFR and IP transport video system design with new levels of modularity, flexibility and performance (Mar. 30, 2016)
- Synopsys Touts 'Visually Assisted Automation' For FinFET Design (Mar. 30, 2016)
- TSMC and Nanjing Sign 12-inch Fab Investment Agreement (Mar. 29, 2016)
- Arteris FlexNoC Interconnect IP is Licensed by Movidius for Ultra- Low Power Machine Learning and Vision Processing (Mar. 29, 2016)
- NGCodec and PathPartner Technology jointly demonstrate H.265/HEVC codecs running on Xilinx FPGA's at the NAB Show (Mar. 29, 2016)
- Synopsys Accelerates RTL Signoff with Introduction of New SpyGlass Lint Advanced Solution (Mar. 29, 2016)
- Andes Technology Corporation Reaches 1.4 Billion Cumulative Shipments of AndesCores Through Over 100 Customers Worldwide (Mar. 29, 2016)
- INNOSILICON Announce the World's First GF14nm DDR4/LPDDR4 PHY & Controller IP Silicon Proven (Mar. 28, 2016)
- Synopsys Unveils Breakthrough Parallel Simulation Performance Technology for VCS (Mar. 28, 2016)
- Mouser Electronics and Imagination Technologies Announce Global Distribution Agreement (Mar. 28, 2016)
- IoT sensor platform spec emerges (Mar. 24, 2016)
- Toshiba Announces Immediate IP Subsystem Availability of 10 Gigabit Ethernet for Custom LSI Platforms (Mar. 23, 2016)
- Toshiba Launches ARM Cortex-M3-based Microcontrollers with Latest 65nm Flash Embedded Logic Process for Motor Control and Consumer Devices (Mar. 23, 2016)
- Synopsys' PrimeTime Speeds Timing and Power Closure for Complex SoC and IoT Designs (Mar. 23, 2016)
- Samsung is developing a new OS for the Internet of Things (Mar. 23, 2016)
- US leads growing global industrial semiconductor market, IHS says (Mar. 23, 2016)
- Apple has no plans to buy Imagination (Mar. 23, 2016)
- Microsemi Announces Definitive Agreement to Divest Business to Mercury Systems, Inc. (Mar. 23, 2016)
- EnSilica launches Kalman Filter acceleration IP core for advanced driver assistance systems (ADAS) (Mar. 23, 2016)
- GUC Delivers 28G Multi-Standard SerDes IP (Mar. 22, 2016)
- Imagination Stock Rises on Report of Apple Talk (Mar. 22, 2016)
- The DATE 2016 conference and exhibition in Dresden attracted 1400 experts (Mar. 22, 2016)
- Sigfox makes global stride with Altice IoT partnership (Mar. 22, 2016)
- Cadence工具获台积电7纳米早期设计及10纳米芯片生产认证 (Mar. 22, 2016)
- Altera Demonstrates Dual-mode 56-Gbps PAM-4 and 30-Gbps NRZ Transceiver Technology for Stratix 10 FPGAs and SoCs (Mar. 21, 2016)
- GUC Announces Progress in LPDDR4 IP and Reaffirms Commitment to DIMM Application of DDR3/4 (Mar. 17, 2016)
- Imagination Technologies: Restructuring update (Mar. 17, 2016)
- Analog Devices Enhances IoT Sensing Portfolio with SNAP Sensor Acquisition (Mar. 17, 2016)
- Imagination to lay off another 200 people (Mar. 17, 2016)
- Rambus Cryptography Research Division Licenses Advanced Security Technologies to Altis Semiconductor (Mar. 16, 2016)
- TSMC Details Silicon Road Map (Mar. 16, 2016)
- Rapid prototyping platforms for embedded developers (Mar. 16, 2016)
- The Internet Of Things And Machine Learning (Mar. 16, 2016)
- Xilinx All Programmable Optical Transport Network (OTN) IP Subsystems Honored by 2016 Lightwave Innovation Reviews (Mar. 16, 2016)
- GLOBALFOUNDRIES Broadens SiGe Power Amplifier Portfolio, Enhancing RF Performance and Efficiency for Wireless Devices (Mar. 15, 2016)
- Imagination announces latest PowerVR Graphics SDK including full support for new Vulkan API (Mar. 15, 2016)
- Microsemi Announces New Secured FPGA Production Programming Solution to Prevent Overbuilding, Cloning, Reverse Engineering, Malware Insertion and Other Security Threats (Mar. 15, 2016)
- Socionext transceiver claims record for 100Gbit/s transmission on a single wavelength (Mar. 15, 2016)
- TSMC, ARM Aim 7nm at Data Centers (Mar. 15, 2016)
- Cryptographic keys protect production FPGAs, says Microsemi (Mar. 15, 2016)
- It is time to prioritize security for Internet of Things and wearables (Mar. 15, 2016)
- Bluetooth Transport Discovery Service Enables Collaborative IoT (Mar. 15, 2016)
- Semiconductor (Silicon) IP Market Worth 7.01 Billion USD by 2022 (Mar. 15, 2016)
- SEMI reports 2015 semiconductor equipment sales of US$36.5 billion (Mar. 15, 2016)
- TSMC and MediaTek Extend Collaboration on Ultra-Low Power Technology to Capture the Emerging IoT Market (Mar. 15, 2016)
- Cadence Design IP to Support TSMC 16FFC and 28HPC+ Process Technologies (Mar. 15, 2016)
- Exploring design methodologies for next-generation IoT sensors (Mar. 15, 2016)
- Google says (Mar. 15, 2016)
- M31 Technology Announces Its Release of TSMC's 28HPC+ ULL SRAM Compilers for the Intelligent Device Market (Mar. 14, 2016)
- eMemory Announces Industry's First 16nm FinFET Compact (FFC) Process Verified OTP Silicon IP (Mar. 14, 2016)
- Cadence Announces DDR4 and LPDDR4 IP Achieve 3200 Mbps on TSMC 16nm FinFET Plus Process (Mar. 14, 2016)
- Synopsys Announces Broad IP Portfolio for TSMC 16FFC Process (Mar. 14, 2016)
- TSMC Certifies Synopsys IC Compiler II for 10-nm FinFET Production and 7-nm Early Design Starts (Mar. 14, 2016)
- TSMC认证Synopsys IC Compiler II适合10-nm FinFET生产，并开始7-nm工艺的初步设计 (Mar. 14, 2016)
- SMIC and RRAM Leader Crossbar Announce Strategic Partnership Agreement (Mar. 11, 2016)
- Mentor says software apps are vital for SoC emulation (Mar. 11, 2016)
- Renesas protects IoT IP from cradle to grave (Mar. 10, 2016)
- Analog Devices Rolls MCUs for IoT (Mar. 10, 2016)
- THine Electronics Licenses SILICONGATE's Power Management IP Solutions for its Next Generation of Serial Interfaces (Mar. 10, 2016)
- Jury Finds in Favor of Synopsys in ATopTech Copyright Infringement Case (Mar. 10, 2016)
- GLOBALFOUNDRIES Releases New 7SW SOI RF PDK Featuring Latest Keysight Technologies Advanced Design System Software (Mar. 10, 2016)
- PowerVR graphics for cost-sensitive applications (Mar. 09, 2016)
- TSMC Doubles 16nm Capacity; Recruits In USA. (Mar. 09, 2016)
- Mentor Graphics Optimizes Tools and Flows to Help Designers Succeed With Samsung Foundry's 10nm FinFET Process (Mar. 09, 2016)
- Synopsys Releases LucidShape and LucidDrive Version 2.1 (Mar. 09, 2016)
- eMemory Announces Innovative Solution for Cryptographic Security (Mar. 09, 2016)
- Aldec delivers enhanced UVM Support and New Debugging Features with the latest release of Riviera-PRO (Mar. 09, 2016)
- Semiconductor Shipments to Top 1 Trillion Units in 2018 (Mar. 08, 2016)
- Taiwan Semiconductor May Be Doubling Chip Production for the iPhone 7 (Mar. 08, 2016)
- Are Microcontrollers Up For the Challenge of the Internet of Things? (Mar. 08, 2016)
- ARM Showcases the World's No. 1 Computing Ecosystem at Bluetooth World 2016 (Mar. 08, 2016)
- Imagination to Showcase Ground-Breaking Graphics Technologies at GDC 2016 (Mar. 08, 2016)
- Taiwan Semiconductor May Be Doubling Chip Production for the iPhone 7 (Mar. 08, 2016)
- Linaro announces ARM Based Developer Cloud (Mar. 07, 2016)
- ON Semiconductor Extends Tender Offer to Acquire Fairchild Semiconductor (Mar. 04, 2016)
- Cisco Announces Intent to Acquire Leaba Semiconductor (Mar. 03, 2016)
- QuickPlay Extends its Leadership in Software Defined FPGA Development Flow with the Release of Version 2.0 (Mar. 03, 2016)
- Global Semiconductor Sales Off to Sluggish Start in 2016 (Mar. 03, 2016)
- ARM talks IoT security and 5G modems (Mar. 03, 2016)
- Synopsys Extends Leadership in Functional Safety and Security Verification with Addition of Key Technology for ISO 26262 Compliance (Mar. 02, 2016)
- Xilinx Invests in Neural Network Startup (Mar. 02, 2016)
- Startup offers RF IP for 5G communications (Mar. 02, 2016)
- Synopsys Galaxy Design Platform Certified for Samsung Foundry 14LPP FinFET Process (Mar. 02, 2016)
- Express Logic's X-Ware Secure Platform Provides Secure Solution for Information- and Safety-Sensitive IoT Devices (Mar. 01, 2016)
- New Titan IC Systems and Xanadata partnership means huge acceleration to analytics of data in network security solutions (Mar. 01, 2016)
- Resource-rich MCU targets wearable IoT (Mar. 01, 2016)
- iCatch Technology Selects CEVA Imaging and Vision DSP for Digital Video and Image Product Line (Mar. 01, 2016)
- Titan IC Systems Launches Content Inspection Technology (Mar. 01, 2016)
- ARM has R&D interest in neural network cores (Mar. 01, 2016)
- Cisco Rolls 16nm ASICs (Mar. 01, 2016)
- VESA Publishes DisplayPort Standard Version 1.4 (Mar. 01, 2016)
- Intel Security Expands Partner Ecosystem (Mar. 01, 2016)
- Mentor Graphics Adds Memory Models to Create Industry's First Complete UVM SystemVerilog Verification IP Library (Feb. 29, 2016)
- Try and adopt MIWOK by Dolphin Integration, a benchmark for Voice Activity Detectors (Feb. 29, 2016)
- Taiwan Passes South Korea to Become #1 in Total IC Wafer Fab Capacity (Feb. 29, 2016)
- Rambus Cryptography Research Signs Licensing Agreement with The Athena Group to Accelerate Adoption of DPA Countermeasures (Feb. 29, 2016)
- Gartner's Top 10 Internet Of Things Technologies For 2017 & 2018 (Feb. 28, 2016)
- GUC/Partner Jointly Develop USB3.1 PHY/Controller IP (Feb. 26, 2016)
- SmartDV Releases Portfolio of Verification Intellectual Properties that Support Platform-independent Simulation Acceleration (SimXL) (Feb. 26, 2016)
- Arasan announces the Industry's First MIPI DSI-2 Controller IP Cores (Feb. 25, 2016)
- INSIDE Secure announces full year 2015 results along with Company repositioning and restructuring (Feb. 25, 2016)
- CEVA Powers DSP Group's Next-Generation Ultra-Low-Power Always-On Voice Processor (Feb. 24, 2016)
- Credo 100G Retimer Family Delivers Unparalleled Low-Power and Extended Reach (Feb. 24, 2016)
- Synopsys Accelerates Verification Closure of Multimedia SoCs with Next-Generation Verification IP for HDMI 2.0a and HDCP 2.2 (Feb. 24, 2016)
- Imagination and Mentor Graphics collaborate to speed verification of MIPS-based designs with Veloce and Codelink (Feb. 24, 2016)
- Semiconductor Capital Spending Rebound Fails to Materialize in 2015 (Feb. 24, 2016)
- Allegro DVT Launches AVS2 Compliance Streams (Feb. 24, 2016)
- Graphene-on-Glass Makes Doped Transistor (Feb. 24, 2016)
- MWC: Mobile needs "prime time" yields at 14nm, says Cadence CEO Lip-Bu Tan (Feb. 24, 2016)
- prpl Foundation reveals secure SoC service for IoT (Feb. 24, 2016)
- Internet of things providers set to battle over platform dominance (Feb. 24, 2016)
- Silicon Labs Significantly Reduces Design Time Using the Cadence Mixed-Signal Low-Power Flow (Feb. 24, 2016)
- CAN FD Bus Controller IP Core Gains Time-Triggered TTCAN Capability (Feb. 23, 2016)
- New Tiny 80251 Beats Other Low-Power, High-Capability Microcontroller Options (Feb. 23, 2016)
- New Ultra-efficient ARM Cortex-A32 Processor Expands Embedded and IoT Portfolio (Feb. 23, 2016)
- MegaChips Selects S3 Group Data Converter IP (Feb. 23, 2016)
- CEVA and Spreadtrum Expand Long-Term Partnership for LTE SoCs Targeting Mid and High End Smartphones (Feb. 23, 2016)
- Synopsys Delivers Unified Analog and Mixed-Signal Debug with Verdi Advanced AMS Debug Solution (Feb. 23, 2016)
- Realtek Licenses Cadence Tensilica Fusion DSP to Support Ultra-Low-Power Always-On Functions in the RTS3110/RTS3111 Context Hub Chip (Feb. 23, 2016)
- ARM DS-5 Development Studio Extends Support for Functional Safety with LDRA's MISRA Compliance Tools (Feb. 23, 2016)
- UltraSoC delivers enhanced system-level performance optimization capabilities for MIPS users (Feb. 23, 2016)
- S2C's PCIe Virtex UltraScale Solution Provides Advantages Beyond Traditional FPGA Prototyping (Feb. 23, 2016)
- Synopsys and Mindtree Collaborate to Deliver Complete Bluetooth Smart IP Solution for IoT SoCs (Feb. 23, 2016)
- ARM Enables Mass Industrial IoT System Deployments with Hewlett Packard Enterprise (Feb. 23, 2016)
- Vendors accelerate race for low-power IoT network standards (Feb. 23, 2016)
- Latest Imagination PowerVR Series8XE GPUs set new standard for performance, power and area in cost-sensitive markets (Feb. 22, 2016)
- Spreadtrum Licenses Tensilica HiFi Audio/Voice DSP (Feb. 22, 2016)
- Cadence Announces the HiFi Integrator Studio (Feb. 22, 2016)
- CSMC Technologies Corporation Adopts Synopsys Proteus OPC Platform (Feb. 22, 2016)
- Rambus Cryptography Research Extends CryptoManager Platform to Enable Secure In-Field Provisioning Services (Feb. 22, 2016)
- The Dolphin Integration's DELTA standard for voltage regulators breaks the habits for 40 nm IoT SoCs (Feb. 22, 2016)
- Express Logic's X-Ware Secure Platform Provides Secure Solution for Information- and Safety-Sensitive IoT Devices (Feb. 22, 2016)
- Truechip announces first customer shipment of PCIe Gen4 Comprehensive Verification IP (CVIP) (Feb. 19, 2016)
- ARASTU SYSTEMS launches a Comprehensive Low Power Verification Suite for the LPDDR4 Memory (Feb. 18, 2016)
- ARM Cortex-R8 Processor Trail-blazes 5G Need for Speed (Feb. 18, 2016)
- Why partners matter in today's semiconductor industry (Feb. 18, 2016)
- ITRI Selects CEVA-XC DSP for 4G Small Cell Base Stations (Feb. 18, 2016)
- Synopsys and Intrinsic-ID Collaborate to Accelerate Implementation of Security for IoT Edge Devices (Feb. 18, 2016)
- Synopsys and Cypherbridge Accelerate TLS Record Processing for IoT Communication with Optimized Hardware/Software Security Solution (Feb. 18, 2016)
- SMIC Reports 2015 Fourth Quarter Results (Feb. 18, 2016)
- Xilinx and Its Expanded Ecosystem Showcase the Latest 16nm Zynq UltraScale+ MPSoC Technologies at Embedded World 2016 (Feb. 17, 2016)
- UltraSoC and Lauterbach deliver universal SoC debug environment (Feb. 17, 2016)
- Mentor Graphics Signs Multi-year Agreement with ARM for Early Access to ARM IP to Accelerate SoC Verification, Implementation and Testing (Feb. 17, 2016)
- New support in Lauterbach TRACE32 tools makes it easy to debug designs combining MIPS and ARM CPUs (Feb. 17, 2016)
- Introducing The NEW CEVA-X - The World's Most Efficient Processor Architecture for Baseband Applications (Feb. 17, 2016)
- TSMC Says Recovery from Taiwan Quake to Take Longer Than Expected (Feb. 17, 2016)
- Renesas Electronics Expands Renesas Synergy™ Platform for IoT (Feb. 17, 2016)
- Qualcomm, CEVA, ARM Race to Next-Gen Modem (Feb. 17, 2016)
- Samsung: It's time we shut up about the 'Internet of Things' (Feb. 17, 2016)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2016 (Feb. 17, 2016)
- LG Electronics Selects CEVA Imaging and Vision DSP for Mobile Devices (Feb. 16, 2016)
- Xilinx Strengthens Embedded Vision and Industrial IoT Portfolio with Expanded Ecosystem and Platforms (Feb. 16, 2016)
- Embedded World 2016: ReFLEX CES Showcases Extended High-Speed FPGA Boards Portfolio (Feb. 16, 2016)
- Sequans Introduces Monarch, Industry's First LTE Cat M Chip for the Internet of Things (Feb. 16, 2016)
- Cadence Innovus Implementation System Qualified on Samsung 10nm FinFET Process (Feb. 16, 2016)
- SMIC 28nm HKMG Process Ready to Launch Smartphone SoC with Leadcore (Feb. 16, 2016)
- Accelerating the Motor Control Revolution Using New MCU and FPGA Solutions (Feb. 16, 2016)
- IoT Battle: Carriers' Big Narrowband Push (Feb. 16, 2016)
- ST Agony Goes On As Crolles Workers Strike Again (Feb. 11, 2016)
- A Better Year Lies Ahead, says IC Insights (Feb. 11, 2016)
- SilabTech is the winner of IESA 2015 Technology Innovation Award (Feb. 10, 2016)
- Lattice Semiconductor Expands ECP5 FPGA Family (Feb. 10, 2016)
- Why AMD Should ARM China (Feb. 10, 2016)
- Cryptography and the Internet of Everything (IoE) (Feb. 10, 2016)
- Virtex-6 FPGA powers Pentek VITA 49 Radio Transport Standard CompactPCI/AMC/PCIe/VPX Modules for SDR (Feb. 10, 2016)
- EUV Gets $500M Center (Feb. 10, 2016)
- Imagination to showcase leading-edge technologies for mobile, IoT, automotive and connected consumer devices at MWC 2016 (Feb. 09, 2016)
- HCE Service Licenses INSIDE Secure's Award-Winning MatrixHCE and MatrixSSE Mobile Security Software (Feb. 09, 2016)
- eInfochips Announces 'IoT Xcelerator' - A Framework for Solutions Built on IoT Platforms (Feb. 09, 2016)
- Mentor Graphics Expands Embedded Software Development Capabilities for Secure Industrial Applications (Feb. 09, 2016)
- Data Centers Tap ARM, 100GE (Feb. 09, 2016)
- Ensilica Launch New eSi IoT Board at IoT Expo (Feb. 09, 2016)
- Self-testing in embedded systems: Hardware failure (Feb. 09, 2016)
- World's No.1 Computing Ecosystem Running on ARM at Mobile World Congress (Feb. 08, 2016)
- Cadence to Showcase Tensilica DSPs and Design IP at Mobile World Congress 2016 (Feb. 08, 2016)
- CEVA Accelerates Machine-to-Machine System Design with Communication Reference Platform (Feb. 08, 2016)
- Embedded software for free (Feb. 08, 2016)
- SK hynix, Inc., Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems Announce "Start your HBM/2.5D Design Today" Seminar (Feb. 04, 2016)
- ARM Extends 28nm IP Leadership With Latest UMC 28HPC POPs (Feb. 04, 2016)
- Samsung Describes 10nm SRAM (Feb. 04, 2016)
- Barco Silex launches OEM board for pro AV market, enabling 4K/UHD HDMI transport over IP (Feb. 04, 2016)
- Opportunities and Challenges for Near-Threshold Technology in End-Point SoCs for the Internet of Things (Feb. 04, 2016)
- Don't over-constrain in formal property verification (FPV) flows (Feb. 04, 2016)
- TSMC's 300mm Chinese Wafer Fab Wins Approval (Feb. 03, 2016)
- e2v strengthens semiconductors business with acquisition of Signal Processing Devices (Feb. 03, 2016)
- Xilinx Announces Data Center Ecosystem Investment Program to Broaden Cloud Computing and NFV Acceleration Solutions (Feb. 03, 2016)
- FinFETs Flow at Samsung, TSMC (Feb. 03, 2016)
- Develop fail-safe single-chip solutions to high-assurance, physical security design problems using Xilinx's Isolation Design Flow (Feb. 03, 2016)
- Cisco in $1.4 billion Internet of Things deal for Jasper (Feb. 03, 2016)
- Silicon Laboratories Looks to the Internet of Things for Growth (Feb. 03, 2016)
- 应对IP集成与软件开发挑战，加快半导体上市时间 (Feb. 02, 2016)
- 通信SoC中模拟前端性能的快速评估方法 (Feb. 02, 2016)
- Arteris announces 9 new IP licensees in 2015 (Feb. 02, 2016)
- Xilinx Transceiver Breakthrough Brings Greater Cost Efficiency to Data Center Interconnects (Feb. 02, 2016)
- Chips&Media has licensed its VP9 and HEVC multi decoder IP to Nexell and other 5 chip manufacturers (Feb. 02, 2016)
- New Cadence Modus Test Solution Delivers Up to 3X Reduction in SoC Test Time (Feb. 02, 2016)
- Fly over the Dwarf Planet Ceres: New animation based on images taken by Dawn spacecraft, processed by imaging FPGA (Feb. 02, 2016)
- NIST bolsters random number generators (Feb. 02, 2016)
- Easy and secure solution to manage SoC power mode transitions from Dolphin Integration (Feb. 01, 2016)
- Synopsys Delivers Industry's First SAS 24G Verification IP for Enterprise Storage Systems (Feb. 01, 2016)
- Sankalp Semiconductor Completes Acquisition of Interra Systems Design Service Business Unit (Feb. 01, 2016)
- Cadence Announces Complete Digital and Signoff Reference Flow for Imagination Technologies' PowerVR Series7 GPUs (Feb. 01, 2016)
- Global Semiconductor Sales Top $335 Billion in 2015 (Feb. 01, 2016)
- Moore's Law Goes Post-CMOS (Feb. 01, 2016)
- NXP Semiconductors' (NXPI) Q4 Earnings: What's in Store? (Feb. 01, 2016)
- Argon Design licenses Argon Streams VP9 to Renesas Electronics (Feb. 01, 2016)
- True Random Number Generators for Truly Secure Systems (Feb. 01, 2016)
- System Security: A Model from Medieval History (Feb. 01, 2016)
- Building silicon foundations for security (Feb. 01, 2016)
- CIOs mull IoT security concerns (Feb. 01, 2016)
- No clear winner among IoT frameworks (Feb. 01, 2016)
- Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution (Jan. 28, 2016)
- New VESA DSC v1.2 IP Products Announced by Hardent (Jan. 28, 2016)
- Truechip announces first customer shipment of Interlaken and MIPI DSI Comprehensive Verification IP (CVIP) (Jan. 28, 2016)
- Xilinx Ships 16nm Virtex UltraScale+ Devices; Industry's First High-End FinFET FPGAs (Jan. 28, 2016)
- IoT Frameworks Dig in for Battle (Jan. 28, 2016)
- Synopsys Launches New IP Subsystem to Accelerate Data Fusion Processing in IoT Devices (Jan. 27, 2016)
- MorethanIP and OmniPHY Announce Sweeping Partnership on Integrated Ethernet Solutions (Jan. 27, 2016)
- ST Exits Set-Top Box Chip Biz, Plans Layoffs (Jan. 27, 2016)
- Linaro announces Software Reference Platform for ARM servers (Jan. 27, 2016)
- FDSOI carries on despite ST re-org, says COO (Jan. 27, 2016)
- Samsung and Apple Continue to Lead as Top Global Semiconductor Customers in 2015 (Jan. 27, 2016)
- Verification is key as automotive chip design goes 28nm (Jan. 27, 2016)
- India Preps RISC-V Processors (Jan. 27, 2016)
- Videantis partners with Almalence for higher quality imaging (Jan. 26, 2016)
- Rumor: Imagination may sell Pure (Jan. 26, 2016)
- Kandou Uses Cadence Analog/Mixed-Signal Timing and Power Signoff Tools to Deliver High-Speed SerDes PHY IP Design on 28nm Process (Jan. 26, 2016)
- Innovative Logic Announced Licensing of Their USB3.1 SuperSpeedPlus Dual Role IP (Jan. 26, 2016)
- Synopsys Introduces USB 3.1 Type-C IP with DisplayPort 1.3 and HDCP 2.2 for High-Bandwidth Data Transfer with Content Protection (Jan. 26, 2016)
- Sony Acquires Altair Semiconductor, Israeli Innovator of LTE Modem Chip Technology (Jan. 26, 2016)
- Turning open source into a multicore standard (Jan. 26, 2016)
- Optimize the power of always-on logic with SESAME eLV library, a Dolphin Integration solution in TSMC 55 ULP / ULP-eF process (Jan. 25, 2016)
- Altera PowerSoC DC-DC Step-down Converter Delivers Industry-leading Power Density, Performance and Reliability (Jan. 25, 2016)
- Xilinx Demonstrates Next Generation Video Over IP, Processing and Connectivity for the Broadcast and Pro A/V Industry at ISE 2016 (Jan. 25, 2016)
- Synopsys Platform Architect MCO Delivers Industry's First Power-Aware Architecture Analysis Tool Supporting IEEE 1801-2015 UPF 3.0 (Jan. 25, 2016)
- Palma Ceia SemiDesign Selected by LG Electronics to Provide Analog IP for Advanced WiFi (Jan. 25, 2016)
- Rambus Acquires Secure Mobile Payment and Ticketing Solutions (Jan. 25, 2016)
- How a 16Gbps Multi-link, Multi-protocol SerDes PHY Can Transform Datacenter Connectivity (Jan. 21, 2016)
- Ambienta buys Mikrotron (Jan. 21, 2016)
- Barco Silex validates interoperable VC-2 lightweight video compression solution for ASIC/FPGA - ready for UHD and 4K transport (Jan. 21, 2016)
- Sony To Use FD-SOI in Stacked Image Sensors (Jan. 21, 2016)
- Rambus Cryptography Research CryptoMedia Platform to be Integrated into Kaleidescape Home Cinema Products (Jan. 21, 2016)
- UltraSoC enhances universal SoC debug architecture with versatile serial communications (Jan. 21, 2016)
- Semiconductor R&D Growth Slows in 2015 (Jan. 21, 2016)
- ARM Unveils its Highest Performing, Most Power-Efficient 4K-Capable Mobile Display Processor (Jan. 20, 2016)
- Analog Bits' Half Power SERDES Demonstrated at DesignCon (Jan. 20, 2016)
- Synopsys Unveils SiliconSmart ADV Cell Library Characterization Solution (Jan. 20, 2016)
- Qualcomm Rounds Out IoT Offerings At CES 2016 (Jan. 20, 2016)
- Arteris FlexNoC Interconnect IP is Licensed by ZTE (Jan. 19, 2016)
- IntoPIX Announces Its New Generation Of AES IP-Cores Supporting Higher Bitrate Up To 10/100 Gbps With Optimized Footprint To Secure Network Transmission In AV Applications (Jan. 19, 2016)
- Rambus Announces R+ 28G Serial Link PHY on Samsung 14nm LPP Process (Jan. 19, 2016)
- CEVA-XM4 Imaging and Vision DSP Named Best Processor IP of 2015 by The Linley Group (Jan. 19, 2016)
- HEVC Advance Begins Issuing Licenses (Jan. 19, 2016)
- Credo Demonstrates 56G PAM-4, 56G NRZ and 28G NRZ SerDes Technology at DesignCon (Jan. 19, 2016)
- Samsung's 14 nm LPE FinFET Transistors (Jan. 19, 2016)
- sureCore Delivers FDSOI 28nm Memory Compiler (Jan. 19, 2016)
- Telink Semiconductor Launches World's First All-in-One System-on-Chip for the Internet of Things (Jan. 19, 2016)
- WiLAN Subsidiary, North Star Innovations, Inc., Enters Into License Agreement With GLOBALFOUNDRIES (Jan. 19, 2016)
- China's Chip Jackpot Teases (Jan. 19, 2016)
- Microchip Technology To Acquire Atmel (Jan. 19, 2016)
- Allegro DVT Launches Industry's First HEVC Scalable Extension (SHVC) Compliance Streams (Jan. 18, 2016)
- QuickPlay Redefines FPGA Design, Significantly Reducing Development Cost and Time-to-Market (Jan. 18, 2016)
- NXP Embraces 28nm FDSOI for MCUs (Jan. 18, 2016)
- HiSilicon Adopts Cadence Innovus Implementation System for Production DSP Designs (Jan. 18, 2016)
- Qualcomm and Guizhou Province Sign Strategic Cooperation Agreement and Form Joint Venture to Design and Sell World-Class Server Chipsets in China (Jan. 17, 2016)
- Brite Semiconductor Brings Audio/Voice DSP Reference Design Platform to Low-Power 'Smart and Connected' Devices (Jan. 15, 2016)
- Microsemi Corporation Completes Acquisition of PMC-Sierra, Inc. (Jan. 15, 2016)
- eMemory's NeoFuse Technology: A Major Advance in Automotive Panel Driver IC (Jan. 14, 2016)
- IoT and M2M solutions to lead 2016: Analysys Mason (Jan. 14, 2016)
- Move over Moore's Law, analogue is key (Jan. 14, 2016)
- Power Integrations' InnoSwitch-CP ICs Dramatically Improve Charging Performance of Smart Mobile Devices (Jan. 14, 2016)
- NoC Interconnect Fabric IP Improves SoC Power, Performance and Area (Jan. 14, 2016)
- Faraday Delivers a Complete Set of Cell Libraries and Memory Compilers for UMC 28nm HPC Process (Jan. 14, 2016)
- Rambus Cryptography Research Launches CryptoMedia Platform to Provide Secure Access to Premium Digital Entertainment (Jan. 14, 2016)
- UPF 3.0 is Now Official (Jan. 14, 2016)
- Arrow Electronics and Cadence Collaborate to Accelerate the Development of Production-Ready Products for Hardware Engineers (Jan. 13, 2016)
- Samsung Announces Mass Production of 2nd Generation 14-Nanometer FinFET Logic Process Technology (Jan. 13, 2016)
- Global Semiconductor Market Outlook 2022 (Jan. 13, 2016)
- IFI CLAIMS Announces 2015 U.S. Patent Rankings (Jan. 13, 2016)
- Qualcomm and TDK form JV (Jan. 13, 2016)
- Microchip Technology Announces That Its Proposal To Acquire Atmel Has Been Deemed A (Jan. 13, 2016)
- Sonics signs first customer for ICE-Grain Power Architecture and closes 2015 with five new SonicsGN NoC licenses (Jan. 12, 2016)
- Arteris FlexNoC Physical Interconnect IP is Licensed by Renesas Electronics Europe for use in High-End SoCs (Jan. 12, 2016)
- Credo Delivers Industry's Lowest Power 100G MUX Device Based on 50Gbps SerDes Technology (Jan. 12, 2016)
- DMP licenses GPU IP core "SMAPH-F" for Renesas Electronics' SoCs for Office Appliances (Jan. 12, 2016)
- Chip Forecasts, Drivers Diverge (Jan. 12, 2016)
- From IoT hype in 2015 to reality in 2016 (Jan. 12, 2016)
- Visteon Signs Agreement to Acquire India-based Automotive Multimedia Systems Supplier, AllGo Systems (Jan. 12, 2016)
- Gartner Says Worldwide Semiconductor Revenue Declined 1.9 Percent in 2015 (Jan. 11, 2016)
- Sequans and Foxconn Subsidiary Socle Form LTE for IoT Strategic Partnership (Jan. 11, 2016)
- Will Apple Drive Analog ICs? (Jan. 11, 2016)
- Cadence Tempus Timing Signoff Solution Surpasses 200 Tapeout Milestone Within Two Years of Product Inception (Jan. 11, 2016)
- S2C Expands Kintex UltraScale Prototyping Solutions for Consumer-based IoT and Other Small to Medium-Sized Designs (Jan. 11, 2016)
- SoC design verification at all levels is key, says Cadence (Jan. 11, 2016)
- Dolphin Integration joins the international Design & IP Partner Program of imec IC-link's (Jan. 08, 2016)
- INSIDE Secure Collaborates with Microsoft to Address Hollywood Studios' Security Requirements for 4K/UHD and HDR Content (Jan. 07, 2016)
- INSIDE Secure DRM Fusion Adds Support for Google Widevine Modular DRM System (Jan. 07, 2016)
- Samsung, TSMC Remain Tops in Available Wafer Fab Capacity (Jan. 07, 2016)
- Moortec Announces New PVT Controller - Complete PVT Sub-System Solution (Jan. 07, 2016)
- prpl Foundation Reveals Vision for a Secure Internet of Things (Jan. 07, 2016)
- Chips&Media Inc. releases its new ultra-small size and low power HEVC/H.265 codec IP (Jan. 06, 2016)
- Imagination announces new fabric collaboration with NetSpeed (Jan. 06, 2016)
- New PowerVR GPUs from Imagination combine advanced graphics with optimizations for vision and computational photography (Jan. 06, 2016)
- EDA Consortium Reports EDA Industry Revenue Increase For Q3 2015 (Jan. 06, 2016)
- Synopsys DesignWare IP Enables First-Pass Silicon Success for SK Hynix Universal Flash Storage Device (Jan. 06, 2016)
- Cadence Tensilica HiFi Audio DSP Becomes First IP Core Approved for Dolby MS12 Multistream Decoder (Jan. 06, 2016)
- VeriSilicon Completes Acquisition of Vivante (Jan. 06, 2016)
- Annapurna Labs, an Amazon Company, Announces Availability of Home Network and Storage Platform-on-Chip and Subsystem Solutions (Jan. 06, 2016)
- Samsung pledges to become IoT leader (Jan. 06, 2016)
- Amazon Enters Semiconductor Business With Its Own Branded Chips (Jan. 06, 2016)
- DSP Concepts Enhances Audio Weaver to Support Cadence Tensilica HiFi DSPs (Jan. 05, 2016)
- Arteris FlexNoC Interconnect IP is Licensed for use in Select Samsung SUHD TV Models (Jan. 05, 2016)
- Codasip Joins RISC-V Foundation and Announces Availability of RISC-V Compliant Codix Processor IP (Jan. 05, 2016)
- Synopsys Boosts Software Integrity Platform with Coverity 8.0 Release (Jan. 05, 2016)
- China Is Chip Market's Only Growth Region (Jan. 05, 2016)
- RFaxis Expands Portfolio of CMOS RF Front-End ICs for Internet of Things (IoT) (Jan. 05, 2016)
- Global Semiconductor Sales Dip Slightly in November (Jan. 05, 2016)
- CEVA Announces Certification of RivieraWaves Surf Wi-Fi 802.11ac IP Platform (Jan. 04, 2016)
- Celeno Adopts CEVA DSP for High Performance 802.11ac Wave 2 4x4 Products (Jan. 04, 2016)
- STMicroelectronics and ClevX Offer World's First Wireless User-Authentication Technology Platform for IoT-Device Security (Jan. 04, 2016)
- Dolphin Integration unveils extremely dense audio CODECs for application processors at 28 nm and 16 nm (Jan. 04, 2016)
- dbx-tv Total Technology Now Available on Cadence Tensilica HiFi Audio/Voice Processors (Jan. 04, 2016)
- When System Designers Must Care About Silicon IP (Jan. 04, 2016)
- Wi-Fi Alliance introduces low power, long range Wi-Fi HaLow (Jan. 04, 2016)
- SiBEAM Introduces USB 3.0 802.11ad Reference Design Delivering Wireless Connectivity at Multi-Gigabit Speeds (Jan. 04, 2016)
- AMD Demonstrates Revolutionary 14nm FinFET Polaris GPU Architecture (Jan. 04, 2016)
- Chip Sales Dipped Slightly in 2015 (Jan. 02, 2016)
- 16 analog, MEMS and sensor startups to follow in 2016 (Jan. 01, 2016)
- Rambus Renews Patent License Agreement With Toshiba (Dec. 29, 2015)
- Sidense Qualifies 1T-OTP Memory IP at GLOBALFOUNDRIES 55nm Low-Power Process Node (Dec. 29, 2015)
- Synopsys Bolsters Software Integrity Platform with Acquisition of Static Code Analysis Vendor Goanna Software (Dec. 18, 2015)
- Internet of Things Market to Nearly Double by 2019 (Dec. 17, 2015)
- ARM has re-invented itself as a systems company (Dec. 17, 2015)
- Auto chip growth to decelerate (Dec. 17, 2015)
- What's Behind The Power Savings (Dec. 17, 2015)
- Rambus Explores Future Memory Systems (Dec. 17, 2015)
- Leti Strains to Improve FDSOI (Dec. 17, 2015)
- Arasan announces the Industry's First MIPI DSI V1.3 Controller IP Cores (Dec. 17, 2015)
- iCatch Technology Selects Synopsys' DesignWare IP Portfolio for Digital Video and Image SoCs (Dec. 17, 2015)
- Microsemi Corporation Commences Exchange Offer to Acquire PMC-Sierra, Inc. (Dec. 16, 2015)
- Boost Valley Announces the 1st version of their MIPI C-PHY Verification IP (Dec. 16, 2015)
- Cadence to Showcase Tensilica Audio, Imaging/Vision, and IoT DSPs and USB Type-C IP at CES 2016 (Dec. 16, 2015)
- The Internet Of Things And Wearables Are Changing Field Service Automation As We Know it (Dec. 16, 2015)
- Afero Launches Platform to Securely Connect the Internet of Things, in the Home and Beyond (Dec. 16, 2015)
- It's Nearly Winter and the FPGAs are Migrating: Pin compatibility improvements among Kintex UltraScale and UltraScale+ FPGAs (Dec. 16, 2015)
- Cypress Puts Wafer Fab Up for Sale (Dec. 16, 2015)
- CES debut for CEA-Leti (Dec. 16, 2015)
- Think Silicon Launches NEMA|PICO The World Smallest, Most Ultra-Low Power and Cost Efficient 2D GPU at CES 2016 (Dec. 15, 2015)
- Dialog Semiconductor Revises Down Its Revenue Outlook for Q4 2015 (Dec. 15, 2015)
- Taiwan shares end up, led by semiconductor stocks (Dec. 15, 2015)
- Taiwan chip assembler tussles with Tsinghua Unigroup over acquiring rival (Dec. 15, 2015)
- Semiconductor Equipment Sales Forecast: $37 Billion in 2015 and $38 Billion in 2016 (Dec. 15, 2015)
- CyweeMotion's Sensor Fusion Hub Software Now Available on Cadence Tensilica Fusion DSP (Dec. 15, 2015)
- prpl Foundation Launches prpl.works to Mobilize Open Source Developers (Dec. 15, 2015)
- A Novel Approach to Software-Defined FPGA Computing (Dec. 15, 2015)
- Delivering FPGA Vision to the Masses (Dec. 15, 2015)
- Axell Switches to Synopsys' Design Compiler RTL Synthesis Solution for Graphics IC Designs (Dec. 14, 2015)
- InvenSense Provides High-Accuracy Turn-By-Turn Navigation User Experience To HiSilicon Mobile Platforms And Huawei Smartphones (Dec. 14, 2015)
- Dolphin Integration helps reducing BoM cost of IoT circuits thanks to a Panoply of Over Voltage regulators (Dec. 14, 2015)
- Fairchild Semi turns down higher buyout bid; to stick with ON Semiconductor deal (Dec. 14, 2015)
- Apple buys former Maxim chip fab in North San Jose, neighboring Samsung Semiconductor (Dec. 14, 2015)
- Fairchild Semiconductor Announces Further Developments in Connection with an Unsolicited Proposal (Dec. 14, 2015)
- SMIC and M31 Introduce Differentiated IP Solutions for Various Storage Controller Applications (Dec. 10, 2015)
- VeriSilicon and NextG-Com Announce Joint Partnership for Developing Next Generation Cat-0/Cat-M Reference Platform (Dec. 10, 2015)
- Cortus Launches Low-Power Floating Point Processor for Intelligent Connected Devices (Dec. 10, 2015)
- ReFLEX CES celebrates its 15 Year Anniversary with an "open door" technology day focused on FPGA solutions for HPC, Video, Defense (Dec. 09, 2015)
- The Internet of Things at Risk (Dec. 09, 2015)
- IoT Networks Get New Rival (Dec. 09, 2015)
- Security is a critical part of the Internet of Things (Dec. 09, 2015)
- What's worse than a password? (Dec. 09, 2015)
- EC starts anti-trust action against Qualcomm (Dec. 09, 2015)
- TLi goes to Silicon with Arasan UFS IP (Dec. 08, 2015)
- Cadence Tensilica HiFi DSPs Now Support Dynamic Speaker Management Software from Maxim Integrated (Dec. 08, 2015)
- ARM has plan to make $1 Cortex-M processors secure (Dec. 08, 2015)
- Sonics Adds Three New NoC Licensees in China (Dec. 08, 2015)
- Artosyn Licenses SonicsGN On-Chip Network to Integrate Drone SoC (Dec. 08, 2015)
- OmniPhy Announces Silicon-Proven Ethernet PHY IP Adoption in China (Dec. 08, 2015)
- INSIDE Secure Dominates Emerging MACsec Market whose Growth is Driven by Rising Cloud Adoption and Growing Datacenter Market (Dec. 08, 2015)
- Broadcom extends its WICED wireless tech for the Internet of Things (Dec. 08, 2015)
- Fab Equipment Spending: Look for Upward Swing into 2016 (Dec. 08, 2015)
- Leti strains FD_SOI for more speed and less power (Dec. 08, 2015)
- Xilinx Announces Publicly Available Tools and Documentation for 16nm UltraScale+ Devices (Dec. 08, 2015)
- Bunnie Huang's Novena Open-Source Linux Laptop incorporates a User-Programmable Spartan-6 FPGA (Dec. 08, 2015)
- Auviz offers free eval version of its high-performance OpenCV Computer Vision Library for Xilinx All Programmable devices (Dec. 08, 2015)
- No quick fix for automotive insecurity (Dec. 08, 2015)
- TSMC Applies for 12-inch Wafer Fab and Design Service Center in China (Dec. 07, 2015)
- China Swarms into IoT (Dec. 07, 2015)
- ARM Sizes Up Moore's Law (Dec. 07, 2015)
- UMC to Start 12-inch Fab in China Ahead of Schedule (Dec. 07, 2015)
- Cadence Collaborates with Lumerical and PhoeniX Software to Offer Virtuoso Platform-Based Design Flow for Electronic /Photonic ICs (Dec. 07, 2015)
- CEVA Royalty Revenues in 2015 Supports Future IoT Design Win (Dec. 07, 2015)
- Kandou Delivers One Terabit Per Second of Chip-to-Chip Bandwidth at Less Than One Watt (Dec. 03, 2015)
- Extending networks to SoC IP saved power at the IoT edge (Dec. 03, 2015)
- Make it easy, say speakers at Electronics Weekly IoT design conference (Dec. 03, 2015)
- IDMs Could Top Fabless Semiconductor Company Growth for Only the Second Time in History (Dec. 03, 2015)
- Sidense Qualifies 1T-OTP Memory IP at SMIC 130nm and 110nm Processes (Dec. 03, 2015)
- EnSilica and Express Logic collaborate to bring popular ThreadX RTOS to eSi-RISC processor cores (Dec. 02, 2015)
- Credo Delivers Industry's Lowest Power 16nmFF+ 28G LR-Compliant SerDes IP With Comprehensive Development Platform (Dec. 02, 2015)
- Cadence and Spreadtrum Collaborate on Virtual Reference Design Kit to Reduce Customers' Design Cycle by Up to 12 Weeks (Dec. 02, 2015)
- Why security is critical to the success of IoT (Dec. 02, 2015)
- Microsemi and Intrinsic-ID Team Up to Deliver Secure Boot Solution for Electronic Systems in the Government, Aerospace and Defense Markets (Dec. 02, 2015)
- IC Merger Mania Hits Fever Pitch (Dec. 02, 2015)
- Chinese Game Developer Perfect World Licenses ARM Enlighten Global Illumination (Dec. 02, 2015)
- Dream Chip and DELTA Microelectronics Partner for Industry 4.0 (Dec. 02, 2015)
- Xilinx Launches Vivado Design Suite HLx Editions, Bringing Ultra High Productivity to Mainstream System & Platform Designers (Dec. 01, 2015)
- Cadence Unveils Virtuoso Advanced-Node Platform for 10nm Processes (Dec. 01, 2015)
- Seamless Devices Introduces New Analog Signal Processing Solutions That Aim to Enhance the Effectiveness of LTE, WiFi and Microwave Applications (Dec. 01, 2015)
- Vulkan on Think Silicon's NEMA-GPU Series (Dec. 01, 2015)
- Startup Wants to be the ARM of Neuromorphic Cores (Dec. 01, 2015)
- UltraSoC Announces Bare Metal Security (Dec. 01, 2015)
- Vendors race for IoT network coverage (Dec. 01, 2015)
- Security framework for IoT devices (Dec. 01, 2015)
- LG Electronics (LGE) Licenses Rambus Cryptography Research's CryptoManager Security Platform (Nov. 30, 2015)
- Growing IC Companies To Scale (Nov. 26, 2015)
- Top Growth Pick: Cadence Design Systems, Inc. (NASDAQ:CDNS) (Nov. 25, 2015)
- NXP wins U.S. antitrust approval to buy Freescale Semiconductor (Nov. 25, 2015)
- Report: Abu Dhabi holding talks over GlobalFoundries sale (Nov. 25, 2015)
- MediaTek Sees Gains Against Qualcomm Slowing Next Year (Nov. 25, 2015)
- Synopsys Delivers Industry's First Ethernet 400G Verification IP for Next-Generation Networking and Communications Systems (Nov. 25, 2015)
- Cypress adds more ARM Cortex microcontrollers (Nov. 24, 2015)
- Starting all over again on plastic: ARM (Nov. 24, 2015)
- Synopsys' IC Compiler II Qualified for Samsung Foundry 10-nanometer Process (Nov. 24, 2015)
- Securing medical in the IoT (Nov. 24, 2015)
- Cadence Receives Customers' Choice Award for Automotive IP Paper Presented at TSMC OIP Ecosystem Forum (Nov. 24, 2015)
- Microsemi Corporation Enters Definitive Agreement to Acquire PMC-Sierra, Inc. (Nov. 24, 2015)
- MEMS Market: Ups and Upstarts (Nov. 24, 2015)
- Silicon Labs Acquires Telegesis, a Leading Provider of ZigBee Modules (Nov. 23, 2015)
- IoT Groups Merge Efforts (Nov. 23, 2015)
- Imagination fires up Kickstarter to fund Ci40 IoT kit (Nov. 23, 2015)
- Is The Internet Of Things (IoT) Really New Or Simply Recycled? (Nov. 23, 2015)
- Tsinghua, Infineon Kicking Renesas' Tires (Nov. 23, 2015)
- Renesas Electronics and Zebra Technologies Add ARM® mbed™ to Development Environment for Embedded IoT Designers (Nov. 20, 2015)
- Extending networks to SoC IP saved power at the IoT edge (Nov. 20, 2015)
- Xilinx Announces the Spartan-7 FPGA Family (Nov. 19, 2015)
- CEVA Introduces New Low Power Communication DSPs to Address the Multimode Connectivity Requirements of IoT and M2M (Nov. 18, 2015)
- ON Semiconductor to Acquire Fairchild Semiconductor for $2.4 Billion in Cash (Nov. 18, 2015)
- Microsemi Corporation Announces Revised Proposal to Acquire PMC-Sierra for $12.05 per Share in Cash and Stock (Nov. 18, 2015)
- Reference designs target ZigBee lighting (Nov. 18, 2015)
- Sonics Upgrades SoC Development Environment And Flagship NoC To Improve Chip Architecture Optimization And SoC Resiliency (Nov. 17, 2015)
- Imagination's new end-to-end debug environment targets advanced heterogeneous CPU systems (Nov. 17, 2015)
- Inspur and Altera Launch Speech Recognition FPGA Solution with OpenCL (Nov. 17, 2015)
- S2C Extends Its Xilinx Virtex UltraScale FPGA Prototyping Board Family with Dual VU440 Prodigy Logic Module (Nov. 17, 2015)
- Altera to Exhibit FPGA and SoC Solutions for Industry 4.0 and IoT at SPS IPC Drives 2015 (Nov. 17, 2015)
- Embedded FPGAs for SoCs (Nov. 17, 2015)
- TowerJazz Announces Availability of its Next-Generation Power Management Platform Enabling up to 30% Efficiency Boost and Form Factor Reduction (Nov. 17, 2015)
- Applied Micro to sample 16nm finfet 64-bit ARM server chip next year (Nov. 17, 2015)
- Could Qualcomm Be China's Next Target? (Nov. 17, 2015)
- Report: China Has $47bn Chip Fund Focused on U.S. M&A (Nov. 17, 2015)
- UMC's Automotive Semiconductor Revenue Doubles YoY on Strong Customer Adoption (Nov. 17, 2015)
- IPextreme Joins Forces With NXP to Bring Silicon Proven USB Technology to Market (Nov. 17, 2015)
- Cadence Ushers in New Era of Datacenter-class Emulation with Palladium Z1 Enterprise Emulation Platform (Nov. 16, 2015)
- FPGA Interfaces Speeding Up (Nov. 16, 2015)
- IBM and Xilinx Announce Strategic Collaboration to Accelerate Data Center Applications (Nov. 16, 2015)
- Framework scales supercomputing to IoT (Nov. 16, 2015)
- Arasan Announces The Industry's First MIPI SLIMBus v2.0 IP Core (Nov. 16, 2015)
- Low-complexity compression solves video challenges (Nov. 12, 2015)
- Wirepas Joins ARM mbed Ecosystem (Nov. 12, 2015)
- Arteris FlexNoC Interconnect IP is Licensed by SK Hynix for Solid State Storage Device (SSD) Controllers (Nov. 12, 2015)
- Ambiq claims ARM Cortex-M4 power record (Nov. 12, 2015)
- New ARM Cortex-A35 Processor Extends the ARMv8-A Architecture Deeper Into Mobile and Embedded Markets (Nov. 11, 2015)
- GLOBALFOUNDRIES Launches High-Performance ASIC Offering on 14nm FinFET Process Technology (Nov. 11, 2015)
- Mentor Graphics Adds ARM AMBA 5 AHB Verification IP to Mentor Enterprise Verification Platform (Nov. 11, 2015)
- Dream Chip Technologies Supports ARM's Free Access to Cortex-M0 Processor IP (Nov. 11, 2015)
- ARMv8-M Architecture Simplifies Security for Smart Embedded Devices (Nov. 11, 2015)
- Wave Semiconductor Selects Andes Technology for Embedded Core Wave to Use N9 5-Stage Pipeline CPU Core (Nov. 11, 2015)
- MIPS CPUs continue to push boundaries from low to high end (Nov. 10, 2015)
- Cadence Announces Verification IP for ARM AMBA 5 AHB5 (Nov. 10, 2015)
- Northwest Logic Uses Avery Design System's High Bandwidth Memory (HBM) Model to Verify Its High-Performance HBM Controller IP Core (Nov. 10, 2015)
- Arteris Extends Support for ARM AMBA Protocols (Nov. 10, 2015)
- Sonics Supports ARM P-Channel Interface to Extend Commitment to AMBA Ecosystem (Nov. 10, 2015)
- Synopsys Enables Next-Level of Productivity with Addition of System-Level Capabilities to Verification IP for ARM Cache Coherent Protocols (Nov. 10, 2015)
- Synopsys and ARM Expand Collaboration to Accelerate Software Development for ARM-based Designs (Nov. 10, 2015)
- Kilopass Announces Breakthrough Memory Technology for IoT Devices (Nov. 10, 2015)
- Cadence and ARM Deliver an IP Reference System for Internet of Things Applications (Nov. 10, 2015)
- u-blox selects ARM mbed IoT Device Platform for IoT wireless connectivity applications (Nov. 10, 2015)
- Mentor's CEO on Merger Mania (Nov. 10, 2015)
- Imagination and Testin partner to accelerate time-to-market for app development in Greater China (Nov. 10, 2015)
- Avery, CAST, and Rianta Roll Together on Automotive Ethernet and CAN FD IP and VIP Solutions (Nov. 10, 2015)
- Mobiveil Announces Its New 16G PCIe Gen 4 Controller IP (GPEX) With End-to-End Data Path Protection for High-Performance Enterprise Applications (Nov. 10, 2015)
- Scaling Down Semi Process Nodes for IoT Apps (Nov. 09, 2015)
- Cisco, Ericsson Flirt with Merger (Nov. 09, 2015)
- Demand key to driving 2016 semiconductor market, says ASE COO (Nov. 05, 2015)
- ARM 64-bit move gets boost from Cambridge debug firm (Nov. 05, 2015)
- Synopsys Introduces Enhanced Security Package for DesignWare ARC EM Processors (Nov. 04, 2015)
- Allegro DVT Adds Support of 4:2:2 10-bit Video Profiles to its Multi-Format Encoder/Decoder Hardware IPs. (Nov. 04, 2015)
- MIPI Alliance Updates its MIPI SLIMbus Specification to Advance Audio System Performance in Mobile and Mobile-Influenced Devices (Nov. 04, 2015)
- Xilinx Showcases Industry's First 16nm All Programmable MPSoC at ARM TechCon 2015 (Nov. 04, 2015)
- WiLAN Announces Patent Acquisition From Freescale Semiconductor (Nov. 04, 2015)
- Undo Software to deliver support for 64-bit ARM Devices (Nov. 04, 2015)
- Exclusive deal leads to world's smallest sensor for LED lighting & IoT (Nov. 04, 2015)
- China set to challenge global chipmakers with huge state-led project (Nov. 04, 2015)
- Faraday Shows Its Force of Multi-imaging-interface Subsystem on MIPI Alliance Demo Day (Nov. 03, 2015)
- Blu Wireless Licenses Arteris FlexNoC Interconnect IP for HYDRA WiGig and 4G Backhaul Subsystems (Nov. 03, 2015)
- ARM Showcases Innovative Embedded/IoT and Server Platform Technology at JavaOne Conference (Nov. 03, 2015)
- Sckipio Receives Investment from Intel Capital (Nov. 03, 2015)
- FreeBSD hits 64-bit ARM chips, demoed on 96-core server (Nov. 03, 2015)
- Dialog Semiconductor's Bluetooth(R) Smart System-on-Chip Drives Xiaomi's Innovative Voice Remote Control Unit (news with additional features) (Nov. 03, 2015)
- Wave Semiconductor Achieves Rapid Design Success Using S2C FPGA Prototyping Solutions (Nov. 03, 2015)
- Intel Fills Out IoT Portfolio (Nov. 03, 2015)
- ON Semiconductor to Accelerate Edge Device Innovations for the Internet of Things (Nov. 03, 2015)
- Wind River Unveils Cloud Suite and Free Cloud-Connected Operating Systems to Accelerate IoT (Nov. 03, 2015)
- EDA Start-Up Intento Design Raises 900k Euros in Early Stage Funding (Nov. 03, 2015)
- Innosilicon Receives Best Partner of the Year 2015 Award from SMIC (Nov. 03, 2015)
- Global Semiconductor Sales Increase 1.5 Percent in Third Quarter (Nov. 02, 2015)
- Microsemi Corporation Reiterates its Superior $11.88 Per Share Cash and Stock Bid for PMC-Sierra, Inc. (Nov. 02, 2015)
- Altera's New Quartus Prime Design Software Extends Leadership in Design Performance and Productivity (Nov. 02, 2015)
- Agnisys automates development of ARM-based designs (Oct. 28, 2015)
- Creonic to Provide Three LDPC Decoder IP Cores for DOCSIS 3.1 (Oct. 28, 2015)
- MIPS CPU architecture fully supported by Google's new Brillo OS for the IoT (Oct. 28, 2015)
- ACCO Semiconductor Announces World's Most Integrated Power Amplifier Module for 3G/LTE Smartphones (Oct. 28, 2015)
- VESA Rolls Out Production-Ready Embedded DisplayPort Standard 1.4 for Mobile Personal Computing Devices (Oct. 28, 2015)
- Aldec Introduces Hybrid Emulation with ARM Fast Model Support (Oct. 28, 2015)
- mCube Redefines MEMS Sensor Innovation by Unveiling the World's Smallest 1x1mm Accelerometer (Oct. 28, 2015)
- Tiny IoT radio for smart meters (Oct. 28, 2015)
- IoT-connected vehicles will challenge car firms (Oct. 28, 2015)
- Globalfoundries deal broadens FD-SOI, says Leti CEO (Oct. 28, 2015)
- Sony and Toshiba Sign Memorandum of Understanding for the Transfer of Certain Semiconductor Fabrication Facilities (Oct. 28, 2015)
- Brite Semiconductor Acquires Architectural License to Uniquify's DDR Technology to Consolidate Core IP Technology (Oct. 27, 2015)
- AM3D and CEVA Partner to Provide Innovative Sound Enhancement Technology for Portable Devices (Oct. 27, 2015)
- New ARM CoreLink System IP Provides the Foundation for Next-Generation Heterogeneous SoCs (Oct. 27, 2015)
- 5G teams need FPGAs for massive MIMO research (Oct. 27, 2015)
- China driving ARM-based server market (Oct. 27, 2015)
- ARM launches next-gen CoreLink IP (Oct. 27, 2015)
- ARM Upgrades Interconnect, Memory Control IP (Oct. 27, 2015)
- STMicroelectronics Said to Weigh Bid for Fairchild Semiconductor (Oct. 27, 2015)
- UMC Meets Expectations on 28nm Ramp as Demand Slumps (Oct. 27, 2015)
- IoT Startup Revises 802.15.4 Nets (Oct. 27, 2015)
- eSilicon Releases Online Quoting Support for TSMC 16FF+ (Oct. 27, 2015)
- Rambus Initiates Accelerated Share Repurchase Program (Oct. 26, 2015)
- Cadence Reports Third Quarter 2015 Financial Results (Oct. 26, 2015)
- IDT to Acquire ZMDI for $310 Million (Oct. 26, 2015)
- The IP companies creep toward an SoC (Oct. 22, 2015)
- IC Insights Lowers its Worldwide 2015 IC Market Forecast from +1% to -1% (Oct. 22, 2015)
- Arteris tackles tyranny of wires (Oct. 22, 2015)
- ARM tide surges on (Oct. 22, 2015)
- ARM Launches IoT Education Kit in China at Opening of Peking University's New Smart Device Lab (Oct. 21, 2015)
- Andes Technology and INVECAS Enter Into a High Value Collaboration to Win Designs for GLOBALFOUNDRIES 22FDSOI and 14LPP Processes (Oct. 21, 2015)
- CEVA Announces Silicon-based Platform to Streamline Development of Low-Power 'Smart and Connected' Devices (Oct. 21, 2015)
- New Release of Synopsys Synplify Software Delivers Up to 3X Faster Runtime with Higher FPGA Performance (Oct. 20, 2015)
- AXSEM AG is now a part of ON Semiconductor (Oct. 20, 2015)
- Moortec Semiconductor Announces New UMC 28nm HPC High Accuracy Embedded Temperature Sensor (Oct. 20, 2015)
- Innovasic and OmniPhy Announce Collaboration on Automotive Ethernet Solutions (Oct. 20, 2015)
- ARM to Offer Cycle-Accurate Virtual Prototyping for Complex SoCs Through an Asset Acquisition from Carbon Design Systems (Oct. 20, 2015)
- Cadence Announces the First IP Subsystem with Integrated USB Type-C, USB Power Delivery and DisplayPort Alternate Mode Support (Oct. 20, 2015)
- ARM Mali-470 GPU Offers Improved Efficiency and Experiences on Wearable and IoT Devices (Oct. 20, 2015)
- Server Benchmark Debuts at ARM Event (Oct. 20, 2015)
- SEMI Announces Continued Annual Growth for Silicon Shipment Volumes (Oct. 20, 2015)
- Eyeing the IoT with the ARM-powered Raspberry Pi (Oct. 20, 2015)
- Understanding the IoT cloud and how it will change things (Oct. 20, 2015)
- Imagination announces single board MIPS computer for IoT (Oct. 20, 2015)
- iPhone 7: Will It Have Intel Inside? (Oct. 19, 2015)
- Will Intel, with CDMA, Gun for iPhones? (Oct. 15, 2015)
- Report: Analog Devices, Maxim in merger talks (Oct. 15, 2015)
- More-than-Moore Will Lead, Argues GloFo's Wijburg (Oct. 15, 2015)
- Researchers Demonstrate Single-Ended Die-to-Die Transceiver (Oct. 15, 2015)
- Gartner Says Worldwide Semiconductor Capital Spending to Decrease by One Percent in 2015 (Oct. 15, 2015)
- Apple loses patent lawsuit to University of Wisconsin, faces hefty damages (Oct. 15, 2015)
- TSMC Reports Third Quarter EPS of NT$2.91 (Oct. 15, 2015)
- Xilinx Announces Q2 Fiscal 2016 Results; Strong Profitability And New Product Growth (Oct. 15, 2015)
- Phison Electronics Improves Time to Market by 40 Percent with Cadence Voltus-Fi Custom Power Integrity Solution (Oct. 15, 2015)
- Kilopass' CEO Charlie Cheng to Keynote Chinese American Semiconductor Professional Association (Oct. 15, 2015)
- Simplicity Needed in the Internet of Things (Oct. 15, 2015)
- Microsoft and LG extend partnership to Internet of Things (Oct. 15, 2015)
- Internet Society Releases Internet of Things (IoT) Overview: Understanding the Issues and Challenges (Oct. 15, 2015)
- ARM Holdings boosted by M&A chatter in the semiconductor sector (Oct. 15, 2015)
- Connected vehicles are the first big IoT opportunity (Oct. 15, 2015)
- Exostiv Labs announces the availability of its 'EXOSTIV' solution for FPGA debug. (Oct. 14, 2015)
- Renesas offers Cortex-M4 MCUs with Synergy RTOS and stacks (Oct. 14, 2015)
- No way back for the 'smart' microcontroller, says Microchip (Oct. 14, 2015)
- Extracting crypto keys from the Cloud (Oct. 14, 2015)
- VeriSilicon to Acquire Vivante Corporation in All-Stock Transaction (Oct. 13, 2015)
- Wave Semiconductor Licenses SonicsGN On-Chip Network (Oct. 13, 2015)
- Microsemi and Athena Announce FPGA Cores with Strong DPA Countermeasures for Cryptography Users (Oct. 13, 2015)
- ARM Offers Free Access to Cortex-M0 Processor IP to Streamline Embedded SoC Design (Oct. 13, 2015)
- ARM Brings SoC ASIC Design to Embedded IoT Mainstream (Oct. 13, 2015)
- Securing 2.5D and fan-outs (Oct. 13, 2015)
- Analysis: VeriSilicon to Acquire Vivante (Oct. 12, 2015)
- Apple responds to battery life concerns with its A9 SoCs (Oct. 09, 2015)
- UMC Reports Sales for September 2015 (Oct. 08, 2015)
- TSMC September 2015 Revenue Report (Oct. 08, 2015)
- Dolphin Integration as European Foundry portal for ASIC and SoC users (Oct. 07, 2015)
- Imec and Cadence Complete Tapeout of First 5nm Test Chip (Oct. 07, 2015)
- Leti Joins GLOBALFOUNDRIES' Eco-System Partners With Focus on Supporting 22FDX Platform (Oct. 07, 2015)
- Vivante Vision Image Processor to Power Mass Market Surveillance Camera and Automotive Applications (Oct. 07, 2015)
- CEVA Introduces Deep Neural Network Framework to Accelerate Machine Learning Deployment in Low-Power Embedded Systems (Oct. 07, 2015)
- Silicon on Insulator Penetrates Apple/Intel/IBM (Oct. 07, 2015)
- Soft Machines Unveils VISC Processor and SoC Roadmap (Oct. 07, 2015)
- Startup Describes New Core, SoC (Oct. 07, 2015)
- Samsung semiconductor profits rise 80 percent thanks to strong launches, prominent wins (Oct. 07, 2015)
- Andes Technology Corporation First Vendor to Use Official EEMBC Certified CoreMark Results to Reveal the Performance for Its Entire CPU Product Line (Oct. 06, 2015)
- Open Interconnect Consortium and EnOcean Alliance Announce New Liaison Agreement for the Internet of Things (Oct. 06, 2015)
- S2C Shipping Prodigy Virtex UltraScale and Kintex UltraScale FPGA Prototyping Boards to Customers Worldwide (Oct. 06, 2015)
- INSIDE Secure and EZchip Partner to Provide Best of Breed Internet Data Security for Cloud Computing, Digital Video, and Advanced Networking Applications (Oct. 06, 2015)
- Xilinx System Generator Simplifies Wireless Design (Oct. 06, 2015)
- Xilinx Vivado Design Suite 2015.3 Takes Design to New Heights with IP Sub-Systems (Oct. 06, 2015)
- New Cadence Tensilica Vision P5 DSP Enables 4K Mobile Imaging with 13X Performance Boost and 5X Lower Energy (Oct. 06, 2015)
- NetSpeed Introduces the industry's first fully configurable cache-coherent network-on-chip (Oct. 06, 2015)
- Altera Stockholders Approve Merger with Intel (Oct. 06, 2015)
- Sony Semiconductor Solutions Corporation to be Established (Oct. 06, 2015)
- Marvell Introduces Industry's First Hyper-Scale Quad ARM Cortex-A72 and Dual Cortex-A53 Based Chips on Marvell's Revolutionary MoChi and FLC Architecture (Oct. 06, 2015)
- Skyworks to Acquire PMC-Sierra for $2 Billion in Cash (Oct. 05, 2015)
- The dark side of the IoT meets ESC (Oct. 05, 2015)
- Xylon Multimedia Demo for the ZedBoard (Oct. 01, 2015)
- Xilinx Beats Altera to the First FinFET FPGA! (Oct. 01, 2015)
- How to power FPGAs with Digital Power Modules (Oct. 01, 2015)
- Testing PSRR with High-Frequency Ripple (Oct. 01, 2015)
- ARM Aligns With Microsoft Azure (Sept. 30, 2015)
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule (Sept. 30, 2015)
- TSMC at the 2015 Imagination Summit: optimized silicon IP for the IoT market (Sept. 30, 2015)
- Mellanox Technologies, Ltd. Announces Definitive Agreement to Acquire EZchip (Sept. 30, 2015)
- Choosing the Right interface for your SoC (Sept. 30, 2015)
- Truechip announces first customer shipment of HBM Comprehensive Verification IP (CVIP) (Sept. 29, 2015)
- STMicroelectronics Adopts ARM's Latest Processor Technology for Automotive Applications (Sept. 29, 2015)
- Synopsys Announces Industry's First Security IP Solutions for New SHA-3 Cryptographic Hash Standard (Sept. 29, 2015)
- Open-Silicon Announces Comprehensive High Bandwidth Memory (HBM) Gen2 IP Subsystem Solution (Sept. 29, 2015)
- Imagination's Ensigma communications IP receives Wi-Fi CERTIFIED ac certification and Bluetooth Smart qualification (Sept. 29, 2015)
- GE Connects Industrial IoT (Sept. 29, 2015)
- Shifting the Mobile & Wearable Market -- SoC vs. SiP (Sept. 29, 2015)
- Qualcomm Commits Up To $150 Million to Strategic Venture Fund in India (Sept. 28, 2015)
- Creating new opportunities for Imagination in Taiwan (Sept. 28, 2015)
- Speed up your analog simulations thanks to Dolphin Integration's solution (Sept. 24, 2015)
- SMIC Receives 'Hi-Tech Enterprise Achievement Award' for the Second Time (Sept. 24, 2015)
- Moortec Semiconductor Limited Joins TSMC IP Alliance Program (Sept. 24, 2015)
- Intel Outlines Plans for New Category of Smarter, Purpose-Built 'System on Chip' Designs, Products (Sept. 24, 2015)
- INSIDE Secure Increases Momentum in Financial Services with Three New Major Mobile Application Security Wins (Sept. 23, 2015)
- Wearable sensors challenge low voltage design (Sept. 23, 2015)
- FPGAs in embedded systems: It just keeps getting easier (Sept. 23, 2015)
- Developing high-reliability FPGAs for DO-254 (Sept. 23, 2015)
- TSMC Discusses Next MEMS, Monolithic Mics (Sept. 22, 2015)
- Synopsys Accelerates Development of IoT Designs with Industry's Most Comprehensive IP Portfolio (Sept. 22, 2015)
- TSMC Honors ARM with Partner Award for Sixth Consecutive Year (Sept. 22, 2015)
- 16 Insights on ICs (Sept. 22, 2015)
- Conference & exhibition: Technology for building the IoT (Sept. 22, 2015)
- Emulation: Thinking outside of the Big Box (Sept. 22, 2015)
- Helping FPGA Designers get started with UVM (Sept. 22, 2015)
- IP Hot Spot Forms in Egypt (Sept. 22, 2015)
- System-on-Chip (SoC) Market is Expected to Reach USD 71.98 Billion in 2021: Transparency Market Research (Sept. 22, 2015)
- Winbond to License DPA Countermeasures from Rambus Cryptography Research (Sept. 21, 2015)
- Standards light the way in enterprise IoT (Sept. 17, 2015)
- Your very own IoT: Let's talk WiFi (Sept. 17, 2015)
- Mentor Graphics Acquires Calypto Design Systems (Sept. 17, 2015)
- SMIC, CICIIF and Qualcomm Intend to Invest into SJsemi (Sept. 16, 2015)
- Analog Bits to present half-power, multi-protocol SERDES at TSMC Open Innovation Platform Ecosystem Forum (Sept. 16, 2015)
- Mentor Graphics and AMD to Accelerate ARMv8-A Linux Development for Embedded Systems (Sept. 16, 2015)
- HCL Technologies partners IBM for 'Internet of Things' (Sept. 16, 2015)
- Cadence Digital, Custom/Analog and Signoff Tools Achieve TSMC Certification for 10nm FinFET Process (Sept. 16, 2015)
- TSMC Certifies Synopsys' IC Compiler II on 10-nanometer FinFET Process (Sept. 16, 2015)
- Synopsys' New HAPS-80 FPGA-Based Prototyping Solution Delivers Up to 100 MHz System Performance (Sept. 16, 2015)
- Q&A with GloFo CEO: 'IoT Is No Mystical Animal' (Sept. 16, 2015)
- INSIDE Secure Introduces a Single Chip USB Solution for Software Licensing, Authentication and the Latest FIDO Standard (Sept. 15, 2015)
- Mentor Graphics Certified for TSMC 10nm FinFET Process Technology (Sept. 15, 2015)
- FBI: Deal with your own Internet of Things security (Sept. 15, 2015)
- Designing lightweight cryptography for the IoE (Sept. 15, 2015)
- Rambus Reveals Smart Data Acceleration Research Program (Sept. 14, 2015)
- GlobalFoundries Employee Buyout Result of Revenue Drop (Sept. 14, 2015)
- TSMC Wins All Apple's A10 Chip Business, Report Says (Sept. 14, 2015)
- SEMI Reports Second Quarter 2015 Worldwide Semiconductor Equipment Figures; Billings US$9.4 Billion (Sept. 14, 2015)
- Crossbar Closes Series D Funding of $35 Million (Sept. 14, 2015)
- Athena CTO to Speak at 2015 Xilinx Security Working Group (Sept. 10, 2015)
- MStar Semiconductor, Inc. Integrates INSIDE Secure Technology to Protect Premium Content on its New 4K Ultra HD Platform (Sept. 10, 2015)
- CAST and Boost Valley Partner for Better Verification of IP Cores (Sept. 10, 2015)
- Who Will Rule "the Internet of Things"? (Sept. 10, 2015)
- New DesignWare ARC EM Processors Deliver Up to 3X Higher DSP Performance (Sept. 10, 2015)
- Securing connected vehicles (Sept. 10, 2015)
- INSIDE Secure Announces the First DRM Solutions on an ARM Reference Platform to Meet HD/UHD Content Protection Demands of Hollywood Studios (Sept. 09, 2015)
- UltraSoC adds deadlock detection to SoC analysis, debug and profiling tools (Sept. 09, 2015)
- Mentor Graphics Drives Next-Generation, Low-Power Verification with UPF Successive Refinement Methodology (Sept. 09, 2015)
- PathPartner Technology Showcases Exclusive HEVC Solutions on Multiple Embedded and Server Platforms at IBC 2015 (Sept. 09, 2015)
- Korusys Launch 4Kp60 & HDR capable, H.265 Contribution decoder at IBC2015 (Sept. 09, 2015)
- Synopsys' Design Compiler Graphical Adopted by Renesas for Automotive ICs (Sept. 09, 2015)
- With Ultimate Craftsmanship, M31 Develops IP Solutions for IoT (Sept. 09, 2015)
- Moortec to Exhibit at TSMC's 2015 Open Innovation Platform Ecosystem Forum (Sept. 09, 2015)
- Imperas Releases Second Generation of Open Virtual Platforms APIs and Adds to Free Model Libraries (Sept. 09, 2015)
- Microsemi Aims to Solve Most Challenging Cyber Security Issues with Formation of a Security Center of Excellence (Sept. 09, 2015)
- Linaro and Microsoft collaborate on secure media solutions for ARM-based SoCs (Sept. 09, 2015)
- Menta Delivers Off-the-Shelf Embedded FPGA IP Cores that Enable a New Level of Flexibility to be built into Complex SOCs (Sept. 09, 2015)
- Why the Internet of Things is just one part of a much bigger prize (Sept. 09, 2015)
- Synopsys, Customers and Partners Present the Latest Technologies and Trends on Embedded Processor Solutions at the ARC Processor Summit in Silicon Valley (Sept. 08, 2015)
- STMicroelectronics Unveils World's First Set-Top-Box SoC with Integrated Wi-Fi and Support for High Dynamic Range (Sept. 08, 2015)
- Open-Silicon Partners With Silicon Catalyst (Sept. 08, 2015)
- Barco Silex releases new patent-free and lightweight VC-2 LD video codec at IBC 2015 (Sept. 08, 2015)
- Cadence, Mentor Graphics and Breker Announce Collaborative Technology Contribution to Accellera Portable Stimulus Working Group (Sept. 08, 2015)
- Intellitech iJTAGServer Brings IEEE 1149.1-2013 IP Block Verification to Synopsys VCS (Sept. 08, 2015)
- ARM and Thundersoft Open First IoT Ecosystem Accelerator in China (Sept. 07, 2015)
- The Benefits of RTOSes in the Embedded IoT (Sept. 04, 2015)
- IBM and ARM Collaborate to Accelerate Delivery of Internet of Things (Sept. 03, 2015)
- Microsemi's Industry-leading Space Products Support Pluto New Horizons Space Exploration Mission (Sept. 02, 2015)
- MightyWorks Ports Single- and Multi-Microphone Processing Technologies to Cadence Tensilica HiFi DSPs (Sept. 02, 2015)
- Nest heats up interest in the Internet of things with a new thermostat (Sept. 02, 2015)
- Ansys expands Internet of Things offerings with latest acquisition (Sept. 02, 2015)
- IDTechEx: Sensors to enable $70bn wearable technology market by 2025 (Sept. 02, 2015)
- China Server Upstart Hits Spotlight (Sept. 02, 2015)
- The ongoing merger of embedded and EDA (Sept. 02, 2015)
- Altair Semiconductor Adopts Cadence Palladium XP Platform for Advanced IoT SoC Development (Sept. 01, 2015)
- The Secure Content Storage Association (SCSA) Selects Rambus Cryptography Research To Help Secure Next-Generation Digital Video Content (Sept. 01, 2015)
- Next-generation security for the IoT & IIoT (Sept. 01, 2015)
- Lattice Semiconductor Enables Rapid Prototyping of Smart Connectivity Designs with ECP5 Versa Development Kit (Sept. 01, 2015)
- Microsemi FPGAs awarded Rambus Cryptography Research DPA logo certification (Aug. 31, 2015)
- IoT designs need to start in the right direction (Aug. 27, 2015)
- Why big companies struggle against 'internet of things' boom (Aug. 26, 2015)
- Truechip announces first customer shipment of USB Type-C and Power Delivery Comprehensive Verification IP (CVIP) (Aug. 26, 2015)
- USB Type-C Ecosystem, Issues, and Opportunities (Aug. 26, 2015)
- Navigating the DDR4 adoption road map (Aug. 26, 2015)
- SK Hynix Begins to Run World's Largest Semiconductor Factory (Aug. 26, 2015)
- Intel, Qualcomm, 5 Others Raising Red Flags on Semiconductor Index (Aug. 26, 2015)
- Gartner Says Worldwide Server Shipment Market Grew 8 Percent in the Second Quarter of 2015, While Revenue Increased 7.2 Percent (Aug. 26, 2015)
- TSMC to Cease Solar Manufacturing Operations (Aug. 25, 2015)
- Microsemi Introduces XMC Form Factor SATA SSD for Industrial and Defense Applications Requiring the Highest Levels of Security and Reliability (Aug. 25, 2015)
- Startup Wants Better IoT Radios (Aug. 25, 2015)
- INSIDE Secure's Award-winning HCE Payment Solution Achieves Visa Ready Approval (Aug. 25, 2015)
- China Shakes Up ARM Servers (Aug. 25, 2015)
- 51% of Marketers See Internet of Things as Biggest Impact Trend (Aug. 25, 2015)
- Symantec: How We're Securing The Internet Of Things (Aug. 25, 2015)
- Future challenges for DDR4 and beyond (Aug. 25, 2015)
- Toshiba cuts ARM microcontroller power with 65nm flash (Aug. 25, 2015)
- Ittiam and Silicon Philosophies Collaborate to Demonstrate Cinema Craft 4K H.265 (HEVC) and Ultra HD Blu-Ray Encoder Products at IBC 2015 (Aug. 24, 2015)
- The battery is dead; long live power management (Aug. 24, 2015)
- Microchip Doubles Flash Memory and Adds New Security Options in Latest Family of eXtreme Low Power PIC® Microcontrollers (Aug. 24, 2015)
- Smart-meter IC market worth $1.2bn (Aug. 19, 2015)
- Pressing Security Risks of Internet of Things (IoT) Uncovered in New Market Report from Nexusguard and Cybersecurity Ventures (Aug. 19, 2015)
- Cyber Security & the Lack Thereof (Aug. 19, 2015)
- Microchip and Intel Collaborate for Enhanced IoT Privacy and Security (Aug. 19, 2015)
- UMC Joins Elite Club (Aug. 19, 2015)
- CEVA Announces the Certification of RivieraWaves Bluetooth Smart 4.2 Platform IP (Aug. 18, 2015)
- Overall GPU shipments dropped 11% from last quarter, AMD slipped 26%, Nvidia fell 16%, and Intel saw a 7.4% slip (Aug. 18, 2015)
- Inside GlobalFoundries' Fab 8 (Aug. 18, 2015)
- Open-Source Virtual Reality Consortium Selects Xilinx All Programmable Devices to Enable Industry's First, Fully Upgradable Virtual Reality Headset (Aug. 18, 2015)
- Atmel Expands Line of New Innovative Ultra-Low-Power ARM Cortex M0+ MCUs with Segment LCD Controller (Aug. 18, 2015)
- Lattice Semiconductor Expands USB Type-C Product Family (Aug. 18, 2015)
- Gowin Semiconductor Corporation Announced New Non-volatile FPGA Devices -- GW1N (Aug. 18, 2015)
- Internet of Things Reaches Peak Hype: Gartner (Aug. 18, 2015)
- Intel CEO Outlines Company Future Surrounding Smart Devices, Secure IoT Applications (Aug. 18, 2015)
- Understand the future of wearable devices (Aug. 18, 2015)
- HyperSilicon Releases Xilinx- XCVU440 Based FPGA-Based Prototyping Platform for VLSI (Very Large Scale Integration) Verification (Aug. 17, 2015)
- Synopsys, Cypress hasten the delivery of USB Type C products (Aug. 17, 2015)
- PMC-Sierra Scales Storage with PCIe, NVMe (Aug. 14, 2015)
- Why the internet of things should deliver services rather than ads (Aug. 12, 2015)
- Internet of Things is about to hit shore? Not so fast. (Aug. 12, 2015)
- SMIC Expects First 28nm Revenue by Year End (Aug. 12, 2015)
- MIPI Alliance Releases New MIPI M-PHY v4.0 Specification, Achieving a Peak Transmission Rate of Nearly 12 Gbps (Aug. 12, 2015)
- Securing ultra-low-power devices (Aug. 12, 2015)
- Microchip continues to prove that there's life at 8 bits (Aug. 12, 2015)
- Aricent Acquires SmartPlay - Accelerates R&D for Semiconductors, Embedded Systems and Internet of Things (Aug. 11, 2015)
- eASIC Announces Nextreme-3 Platform Support for PCIe Gen 3.1 - SRIS (Aug. 11, 2015)
- Weightless Expands Wide-Area IoT Spec (Aug. 11, 2015)
- Record silicon wafer area shipments in Q2 (Aug. 11, 2015)
- Maker move sees Windows 10 IoT Core run fast on Raspberry Pi (Aug. 11, 2015)
- System-on-Chip Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2015 - 2021 (Aug. 11, 2015)
- Altium Partners with Industry-Leading Semiconductor Manufacturer to Release Development Toolset (Aug. 11, 2015)
- Xilinx Showcases All Programmable Solutions for Cloud and Data Center Flash Storage at Flash Memory Summit 2015 (Aug. 10, 2015)
- Xilinx Announces LDPC Error Correction IP Fundamental to Enabling Next Generation Flash-Based Applications for the Cloud and Data Center Storage Market (Aug. 10, 2015)
- Altera to Demonstrate NAND Flash, FPGA Accelerators, and Storage and Memory Virtualization at Flash Memory Summit 2015 (Aug. 10, 2015)
- Imagination Technologies unveils Vulkan demo on Android with Google at SIGGRAPH (Aug. 10, 2015)
- Dolphin Integration and TSMC collaborate on Low-Power IoT Subsystem Design (Aug. 10, 2015)
- Intilop delivers on Altera FPGAs, their 7th Gen. industry first, Full TCP, UDP & IGMP Hardware Accelerator System with Dual 10G ports for all Hyper Performance Networking Systems (Aug. 07, 2015)
- Optical transistor will be faster than CMOS devices (Aug. 06, 2015)
- Diablo puts flash into servers (Aug. 06, 2015)
- Microsemi's New RF Module Speeds Time-to-Market for Implantable Medical Device Designers (Aug. 05, 2015)
- Zynq UltraScale+ gets Micrium RTOS for all processors (Aug. 05, 2015)
- IoT could demand a whole new, dedicated network -- here's why (Aug. 05, 2015)
- IP extracts on-chip performance data on TSMC 28HPC process (Aug. 05, 2015)
- Montage Technology Licenses Arteris FlexNoC Interconnect IP for Set-Top Box (STB) Systems-on-Chip (SoCs) (Aug. 04, 2015)
- New Cadence Joules RTL Power Solution Delivers 20X Faster Time-Based Power Analysis within 15 Percent Accuracy to Signoff (Aug. 04, 2015)
- Sensors powered by energy harvesting key to IoT success (Aug. 04, 2015)
- Samsung demonstrates 5G FD-MIMO Basestation Prototype with FPGA-based 3D Beamforming at NI Week (Aug. 04, 2015)
- Arduino-compatible IoT platform comes with apps and cloud service (Aug. 04, 2015)
- Configurable controllers tuned for industrial IoT (Aug. 04, 2015)
- Realtek Accelerates System-on-Chip Verification with Cadence Palladium XP Platform (Aug. 03, 2015)
- Synopsys Completes Acquisition of Atrenta (Aug. 03, 2015)
- Altran acquires SiConTech, one of the fastest growing Indian technologies firms, specialised in semiconductor design services (Aug. 03, 2015)
- INSIDE Secure Announces the World's Smallest Communications Security Solution for Internet of Things (IoT) Devices (Aug. 03, 2015)
- ARM Expands IoT Security Capability with Acquisition of Sansa Security (Jul. 30, 2015)
- Implementing Power-Fingerprinting Cybersecurity Using Zynq SoCs (Jul. 30, 2015)
- Get ready for IoT disruptions across sectors (Jul. 29, 2015)
- UMC Cuts Expectations for 28nm Ramp on Weaker Demand (Jul. 29, 2015)
- Synopsys Achieves Certification from Multiple Standards Organizations for Portfolio of IP on TSMC 16-nm FinFET Plus Process (Jul. 29, 2015)
- Tsunami of M&A Deals Underway in the Semiconductor Industry in 2015 (Jul. 29, 2015)
- Machine Learning in the Cloud: Deep Neural Networks on FPGAs (Jul. 29, 2015)
- New security technologies for connected embedded devices (Jul. 29, 2015)
- ams acquires advanced CMOS sensor business from NXP (Jul. 28, 2015)
- IoT Accelerators Offer Advice to Entrepreneurs (Jul. 28, 2015)
- Where Internet of Things Initiatives Are Driving Revenue Now (Jul. 28, 2015)
- PathPartner Technology Announces Availability of HEVC Encoder and Decoder Solutions on x86 Family Platforms (Jul. 28, 2015)
- Global University Partners Alliance Launched by ARM in China (Jul. 27, 2015)
- UltraSoC partners with Tortuga Pacific to advance global SoC debug and analytics market (Jul. 27, 2015)
- High-level synthesis comes of age with SDSoC (Jul. 27, 2015)
- Maximizing the benefits of continuous integration with simulation (Jul. 27, 2015)
- Comment: Can Germany keep Europe in the FD-SOI game? (Jul. 27, 2015)
- Innovative Platform-Based Design for the Industrial Internet of Things (Jul. 24, 2015)
- Imagination joins 5G Innovation Centre to drive development of next-generation mobile data networks (Jul. 22, 2015)
- Synopsys Completes Acquisition of Seeker from Quotium (Jul. 22, 2015)
- Qualcomm Plans 15% Layoffs (Jul. 22, 2015)
- Secure Embedded Systems: Digging for the Roots of Trust (Jul. 22, 2015)
- DAC 2015: IoT's Long Winding Road (Jul. 22, 2015)
- ARM warms to FD-SOI (Jul. 22, 2015)
- Green Hills secures its RTOS for IoT (Jul. 22, 2015)
- ARM sales leap, record processor licences signed (Jul. 22, 2015)
- Will datacentre economics paralyse the Internet of Things? (Jul. 22, 2015)
- Google Inc. Gains A Key Ally In The Internet of Things (Jul. 22, 2015)
- ARM buoyed by race to build the internet of things (Jul. 22, 2015)
- Altera Showcases the Capabilities of Single-Chip Configurable Processors in Latest MAX 10 FPGA Kit (Jul. 21, 2015)
- Xilinx Announces Vivado Design Suite Early Access Support for the 16nm UltraScale+ Portfolio (Jul. 21, 2015)
- North American Semiconductor Equipment Industry Posts June 2015 Book-to-Bill Ratio of 0.98 (Jul. 21, 2015)
- Can Globalfoundries and Europe's chip firms unite? (Jul. 21, 2015)
- Implementing fast, ray traced soft shadows in a game engine (Jul. 21, 2015)
- Go! FD-SOI Wafer Suppliers Ready for High-Volume Ramp; Atomic-Scale Uniformity Assured (Jul. 21, 2015)
- Award-winning PowerVR GR6500 ray tracing GPU tapes out (Jul. 16, 2015)
- StreamDSP Announces latest v5.1 update to its VITA 17.1 sFPDP IP Core (Jul. 15, 2015)
- Atmel Ships World's Highest-Performing ARM Cortex-M7 based MCUs With Atmel | SMART SAM S/E Series Targeting IoT and Industrial Markets (Jul. 15, 2015)
- Xilinx Joins the Industrial Internet Consortium to Collaborate and Drive Common Architectures and Frameworks within the Industrial IoT (Jul. 15, 2015)
- Is software crypto failing? (Jul. 15, 2015)
- World's First Programmable City Arises, Built on Xilinx FPGAs (Jul. 15, 2015)
- Internet of things: the greatest mass surveillance infrastructure ever? (Jul. 15, 2015)
- French gadget-makers pour into the 'internet of things' (Jul. 15, 2015)
- Intel CEO credits solid Q2 results to Internet of Things, data center growth (Jul. 15, 2015)
- Gartner Says Worldwide Semiconductor Capital Spending to Increase 2.5 Percent in 2015 (Jul. 14, 2015)
- Thread Wireless Networking Protocol Now Available (Jul. 14, 2015)
- Dolphin Integration accelerates its Mixed-Signal Front-End Design Solutions (Jul. 13, 2015)
- Globalfoundries' CEO: Why FD-SOI and Why Now (Jul. 13, 2015)
- China Bids $23B for Micron (Jul. 13, 2015)
- Here are eight PowerVR Graphics SDK tutorials for game developers (Jul. 10, 2015)
- SmartDV's USB Power Delivery Verification IP Successfully Deployed by Lattice Semiconductor (Jul. 08, 2015)
- Synopsys' LightTools Delivers Innovative Modeling Capabilities for Freeform Optics in Illumination Systems (Jul. 08, 2015)
- Weak Currencies Zap Europe, Japan in Global Chip Market (Jul. 08, 2015)
- China embraces the Internet of Things - to the tune of €1.45 trillion a year (Jul. 08, 2015)
- Gartner Says Worldwide Semiconductor Sales Expected to Reach $348 Billion in 2015, a 2.2 Percent Increase From 2014 (Jul. 08, 2015)
- ARM's Wish List for IoT (Jul. 07, 2015)
- Sonics and AlphaChips Collaborate to Develop Advanced SoC Design Platforms (Jul. 07, 2015)
- EDA Consortium Reports EDA Industry Revenue Increase For Q1 2015 (Jul. 07, 2015)
- Cyberon Optimizes CSpotter Voice Recognition Software for Cadence Tensilica Fusion and HiFi DSPs (Jul. 07, 2015)
- Sequans Licenses Arteris FlexNoC Interconnect IP for Low Power LTE IoT SoC (Jul. 07, 2015)
- Rambus and Renesas Electronics Renew License Agreement (Jul. 07, 2015)
- Wireless Audio, Voice Control and Other Audio Gizmos (Jul. 07, 2015)
- TSMC Overtakes Intel in Chip Capex Ranking (Jul. 06, 2015)
- How the Internet of Things is disrupting the C-suite (Jul. 05, 2015)
- IoT Opportunity Drives IP Grab (Jul. 03, 2015)
- Mitnick says the IoT is exploitable (Jul. 02, 2015)
- Xilinx Tapes-Out Industry's First All Programmable Multi-Processor SoC Using TSMC's 16nm FF+ for Embedded Vision, ADAS, I-IoT, and 5G Systems (Jul. 01, 2015)
- Altera FPGA-Based Storage Reference Design Doubles Life of NAND Flash (Jul. 01, 2015)
- INSIDE Secure finalizes its partnership agreement with Presto Engineering (Jul. 01, 2015)
- Altera Joins OPNFV Open Source Platform to Bring the Value of FPGAs to Network Function Virtualization (Jul. 01, 2015)
- Renesas adds more DSP to low power IoT MCUs (Jul. 01, 2015)
- Active Texts: The Swiss Army Knife of the schematic editor SLED! (Jul. 01, 2015)
- Imagination Technologies Group plc: Robust licensing and solid progress across all three IP families (Jun. 30, 2015)
- Xilinx and China Mobile Research Institute Collaborate on Next Generation Fronthaul Interface Development for 5G Wireless Networks (Jun. 30, 2015)
- Ceva Makes Waves in Wearables (Jun. 30, 2015)
- 8 FD-SOI Questions You're Afraid to Ask (Jun. 30, 2015)
- Google, Inc. Takes Aim at the Internet of Things, Again (Jun. 30, 2015)
- Solar Energy Microchip Could Enable Internet of Things Wearables (Jun. 30, 2015)
- Synopsys Completes Acquisition of Software Security Company Codenomicon (Jun. 29, 2015)
- GLOBALFOUNDRIES Obtains U.S. Government Clearance for IBM Microelectronics Business Acquisition (Jun. 29, 2015)
- DAC Trip Report: Expanding EDA's Charter & Topical Hardware Emulation (Jun. 29, 2015)
- Synopsys Expands Security Solutions with Acquisition of Elliptic Technologies (Jun. 29, 2015)
- Ten reasons interconnect matters (Jun. 25, 2015)
- GOEPEL electronics protects your Intellectual Property in Xilinx FPGAs (Jun. 24, 2015)
- INVECAS and NetSpeed Systems collaborate to create powerful reference platforms (Jun. 24, 2015)
- Leading Suppliers of Automotive ICs Deploy Synopsys Test Solution (Jun. 24, 2015)
- Hackers will love internet-connected fridges and other appliances, warns a top security expert (Jun. 24, 2015)
- Is your thermostat spying on you? Cyberthreats and the Internet of Things (Jun. 24, 2015)
- Leti spin-out gets €5.7m for GaN power switches (Jun. 24, 2015)
- SMIC, Huawei, imec, and Qualcomm in Joint Investment on SMIC's New Research and Development Company (Jun. 23, 2015)
- Sonics Improves NoC Concurrency Management for SoC Designs with Multi-Channel Memory Sub-systems, Addresses Place & Route Tool Restrictions (Jun. 23, 2015)
- ZTE Chooses Lattice Semiconductor for Feature Differentiation and Integration on Star 2 Smartphone (Jun. 23, 2015)
- Freescale takes its next generation QorIQ multicore platform to 16nm FinFET technology (Jun. 23, 2015)
- PLDA Announces New, PCIe-based Embedded Switch Design, Enhancing Embedded Platform Design and Efficiency (Jun. 23, 2015)
- GlobalFoundries' FD-SOI Revolution (Jun. 23, 2015)
- PCIe 16G May Take Until 2017 (Jun. 23, 2015)
- Freescale introduces industry's most secure MCU platform based on ARM® Cortex®-M technology (Jun. 23, 2015)
- What’s ARM doing in the DSP market? (Jun. 23, 2015)
- Building a secure foundation for wearables (Jun. 22, 2015)
- Microsemi's SmartFusion2 Secure Boot Solution Addresses Side Channel Analysis Vulnerabilities in Competitors' FPGAs Requiring External Configuration (Jun. 18, 2015)
- Chips&Media releases CFrame30, its groundbreaking hardware design for Lossy Frame Buffer Compression (Jun. 17, 2015)
- mCube Unveils Its First Ultra-Low Power Accelerometer Family Optimized for Wearables and the "Internet of Moving Things" (Jun. 17, 2015)
- Algo-Logic Systems Launches 40Gbps TCP Endpoint on BittWare S5-PCIe-HQ FPGA Board (Jun. 17, 2015)
- Rise of the machines: The industrial Internet of Things is taking shape (Jun. 17, 2015)
- IHS Says Ramifications of Moore’s Law Lead to Trillions of Dollars Added to the Global Economy (Jun. 17, 2015)
- Lufthansa Technik and Panasonic Avionics Joint Venture, IDAIR GmbH, Selects INSIDE Secure's DRM Fusion Solution for Its In-Flight Movie Service (Jun. 16, 2015)
- Omnitek shows high speed Xilinx technology with 12G-SDI Development Kit and RTVE 3.1 at InfoComm15 (Jun. 16, 2015)
- eASIC and Comcores Deliver CPRI v6.1 Switch Reference Design for Next-Generation LTE Advanced and 5G Networking Equipment (Jun. 16, 2015)
- Europe Has The Potential To Dominate Industrial IoT, But Can It Deliver? (Jun. 16, 2015)
- Lattice Semiconductor Updates Key Design Tool Suites (Jun. 16, 2015)
- Synopsys' IC Compiler II Accelerates Silicon Validation of Imagination's Ground-breaking PowerVR® Ray Tracing IP (Jun. 15, 2015)
- Renesas dives into the Internet of Things fray with its Synergy platform (Jun. 15, 2015)
- Ensuring security in the connected home (Jun. 11, 2015)
- The Evolution of Biometric Security: Part Two (Jun. 11, 2015)
- CEVA Unveils Wi-Fi IP Platforms to Enable a Broad Range of Connected Devices (Jun. 11, 2015)
- Microsemi Introduces Automotive-grade SoC FPGAs and FPGAs (Jun. 10, 2015)
- 64-bit MIPS architecture provides low-power, high-throughput processing for Cavium's new OCTEON III processors (Jun. 10, 2015)
- ISSI Agrees to Merger Terms with Cypress Semiconductor (Jun. 10, 2015)
- Apple Inc. Co-Founder Steve Wozniak Believes The Internet of Things Bubble Could Burst (Jun. 10, 2015)
- CAPI Acceleration Development Kit brings coherent FPGA acceleration to IBM POWER8 servers (Jun. 10, 2015)
- eASIC Licenses Mobiveil's Universal Multiport Memory Controller IP (Jun. 09, 2015)
- Harnessing the Internet of Things (Jun. 09, 2015)
- No IoT without cyber security – German-British civil security conference (Jun. 09, 2015)
- AMIQ EDA Introduces Duplicate Code Detection in Its Verissimo SystemVerilog Testbench Linter (Jun. 08, 2015)
- Synopsys Continues Innovation Momentum with Latest IC Compiler II Release (Jun. 08, 2015)
- IoT - Hard encryption is better than soft (Jun. 08, 2015)
- Development Platform released for Cortus APS Processor IP Cores (Jun. 03, 2015)
- Microsoft works with Toshiba for IoT (Jun. 03, 2015)
- Nationz Accelerates Design Closure with PrimeRail Signoff Solution (Jun. 03, 2015)
- New ARM IP Tooling Suite Reduces SoC Integration Time from Months to Days (Jun. 03, 2015)
- Think Silicon Ltd. and Tortuga Pacific Announce a Sales Partnership (Jun. 03, 2015)
- Toshiba Standardizes on PrimeRail for Rail Signoff (Jun. 03, 2015)
- Cadence Collaborates with Imagination Technologies to Significantly Improve Designer Productivity on PowerVR Graphics Cores Using Genus Synthesis Solution (Jun. 03, 2015)
- Cadence Introduces Genus Synthesis Solution, Delivering Up to 10X Improvement in RTL Design Productivity (Jun. 03, 2015)
- ARM and Samsung Sign Long-Term Agreement to Take Customers' Visual Experiences to a New Level (Jun. 03, 2015)
- OneSpin Solutions Adds Formal Fault Qualification Analysis to Safety Critical Apps Portfolio; Will Demonstrate OneSpin 360 Qualify at DAC (Jun. 03, 2015)
- Growth of IP Industry Collective Continues as SoC Solutions Joins IPextreme's Constellations (Jun. 02, 2015)
- Codasip and Partners Launch ASIP Design Network to Take Application-Specific Processors Mainstream (Jun. 02, 2015)
- FlexTiles Adaptive Multicore SoC Virtual Platform Now Available from Imperas (Jun. 02, 2015)
- Socionext Adopts Defacto Solution for RTL and Gate-level Design Analysis and Building (Jun. 02, 2015)
- Brite Semiconductor, CEVA and SMIC collaborate on IoT ASIC platform (Jun. 02, 2015)
- PLDA and ARM to deliver PCI Express-enabled ARM Juno development platform (Jun. 02, 2015)
- PRiME Welcomes Moortec Semiconductor as Programme Associate Partner (Jun. 02, 2015)
- Mentor Graphics Announces EZ-VIP Package for Enhanced Testbench Productivity (Jun. 02, 2015)
- Microsemi and Sibridge Technologies Collaborate to Develop Portfolio of High-speed Protocol IPs for SmartFusion2 and IGLOO2 FPGAs (Jun. 02, 2015)
- Why is Altera so important to Intel? (Jun. 02, 2015)
- ARM eyes security firm with focus on Internet of Things, report says (Jun. 02, 2015)
- Global Semiconductor Sales Increase in April; Steady Growth Projected for Next Three Years (Jun. 02, 2015)
- On China's List: Memory, Market Share, M&A (Jun. 02, 2015)
- CEVA-XM4: Computer Vision One Step Closer to Human Vision (Jun. 02, 2015)
- Intel, Altera: Math in Question (Jun. 01, 2015)
- ARM De-risks Design Cycle for IoT Chips (Jun. 01, 2015)
- Massive chip consolidation wave is changing semiconductor industry (May. 28, 2015)
- Atmel Launches Innovative 5V Cortex-M0+ MCU Family With Integrated Peripheral Touch Controller (May. 27, 2015)
- Aldec HES-7 with Xilinx Virtex UltraScale Devices Enables True FPGA-based Verification (May. 27, 2015)
- SoC From Russia With MIPS (May. 27, 2015)
- You needn't decide between prototype or emulation (May. 27, 2015)
- Billions of IoT devices in the next decade may be a pipe dream (May. 27, 2015)
- Mentor Graphics Veloce Power Application Redefines Power Analysis Flow (May. 27, 2015)
- Imagination reports MIPS Warrior P-class CPU at the heart of new communications processor from Baikal Electronics (May. 27, 2015)
- SoC Debug Made Easy! (May. 26, 2015)
- Industrial semi market grows 18% (May. 26, 2015)
- Spreadtrum Guns for Intel's 14nm FinFET in 2016 (May. 26, 2015)
- Beyond Moore's law (May. 26, 2015)
- An end-to-end approach is needed for IoT device security (May. 22, 2015)
- S3 Group announces world's first fully integrated, single conversion radio to be used in devices, transceivers and modem operating off the Iridum network (May. 20, 2015)
- Imagination's OmniShield enables next-generation SoC security (May. 20, 2015)
- Samsung Launches IoT Development Platform (May. 20, 2015)
- Bringing better security to mobile, automotive or IoT (May. 20, 2015)
- Truechip to demonstrate next generation Comprehensive Verification IPs at DAC 2015 (May. 20, 2015)
- Tortuga Logic Bolsters Emerging Design-for-Security Market With Toolkit to Transform Hardware/Systems Developers' Approach to Security (May. 20, 2015)
- Removing the Barrier for FPGA-Based OpenCL Data Center Servers (May. 20, 2015)
- Cadence Strengthens Allegro Technology Portfolio to Make Design Cycles Shorter and More Predictable (May. 20, 2015)
- Ramon Chips Licenses CEVA-X DSP for High Performance Computing for Space Applications (May. 19, 2015)
- UltraSoC and Teledyne LeCroy Collaborate to Unify Debug and Validation for System Designers (May. 19, 2015)
- Altera FPGAs Help Enable Deployment of Harris Corporation's Latest Falcon III Wideband Tactical Radio (May. 19, 2015)
- Intel, Altera Resume Acquisition Talks (May. 19, 2015)
- Low-power, scalable DSP starts with customizable processor (May. 19, 2015)
- System simulation is a way to stress test your IoT application (May. 19, 2015)
- How design and verification technologies can ensure functional safety of automotive SoCs (May. 19, 2015)
- Latest version of Java SE 8 now available for MIPS (May. 18, 2015)
- The IoT is all about sensors (May. 18, 2015)
- Study reveals IoT anxieties (May. 14, 2015)
- ARM Unveils New Quality Assurance Standard for mbed Enabled Devices (May. 13, 2015)
- Altera licenses NetSpeed's Gemini - Configurable Cache Coherent Network-on-Chip IP (May. 13, 2015)
- At DAC 2015 D&R delivers a comprehensive Business Process IP Management Platform (May. 13, 2015)
- Andes Technology Forms New Internet of Things Community Knect.me to Provide Open-Source and Commercial IoT Solutions (May. 13, 2015)
- MIPI UniPro Interoperability Test Workshop Demonstrates Proven, Low Risk Interface Solutions for Wide Industry Adoption (May. 13, 2015)
- Synopsys' Verification IP for DDR4 3DS Enables DRAM Designs with Higher Density and Performance at Reduced Power (May. 13, 2015)
- Xilinx Achieves 28nm Milestone with Over $1B in Cumulative Revenues and 65 Percent Market Segment Share (May. 12, 2015)
- Mitsubishi Electric's Next-Generation MELSEC iQ-R Series C Controller Powered by Altera SoCs to Enable Smarter Factories (May. 12, 2015)
- Andes Partners with eMemory to Provide Hardware Security Solution for the Internet of Things Market (May. 12, 2015)
- Sonics Introduces Semiconductor IP Industry's First Power Management Solution Combining Fine-Grain Partitioning and Autonomous Control (May. 12, 2015)
- Imagination upgrades Creator CI20 micro-computer (May. 12, 2015)
- New EEMBC Benchmark Targets Improved Performance of the "Things" on the Internet of Things (May. 12, 2015)
- Tracing Samsung's Road to 14nm (May. 12, 2015)
- Intel, eASIC Collaborate on Customized Intel-Based Solutions for the Cloud (May. 12, 2015)
- CogniVue Delivers Key Weapon in the Battle for ADAS Market Share: "Opus" Vision Processing Core Enables Critical Competitive Advantages (May. 12, 2015)
- MediaTek Launches the MediaTek Helio™ X20: The World’s First Mobile SoC Featuring Tri-Cluster™ CPU Architecture (May. 12, 2015)
- IoT Feels Samsung's Artik Breeze (May. 12, 2015)
- AAC Technologies Acquires WiSpry (May. 11, 2015)
- Is The IoT Safe To Use? (May. 11, 2015)
- INSIDE Secure Honored as Silver Winner in the 11th Annual 2015 Security Industry’s Global Excellence Award in both Product & Services Excellence and Most Innovative Security Company categories (May. 07, 2015)
- At DAC 15 Discover the latest version of D&R Next Generation Configurable Enterprise Platform (May. 07, 2015)
- Defacto Announces a Unified Design Flow to Ensure Coherency Between RTL, UPF, IPXACT and SDC (May. 06, 2015)
- Conexant AudioSmart Voice and Speech Processing Software Now Optimized for Cadence Tensilica HiFi DSPs (May. 06, 2015)
- Aims Technology releases Aims Himalia, NoC explorer tool to provide complete on-chip interconnect solutions (May. 06, 2015)
- Nvidia Exits LTE Modems (May. 06, 2015)
- ARM and Enea Enable Diverse Silicon Support for Efficient OPNFV (May. 05, 2015)
- ARM, Applied Micro and Netzyn Collaborate on New NFV Platform to Reduce Operator Costs (May. 05, 2015)
- Why Intel and Qualcomm Can't Agree on IoT Framework (May. 05, 2015)
- NXP and Qualcomm Collaborate to Accelerate Adoption of NFC and Security in Mobile, Wearable and Internet of Things Devices (May. 05, 2015)
- PowerVR SDK v3.5 is live, adds support for Android Extension Pack (May. 05, 2015)
- Sansa Security selected as Cool Vendor in Internet of Things, 2015 by Gartner (May. 05, 2015)
- HDCP 2.2 Authentication: RSA Cryptography (May. 05, 2015)
- M31 Announces Partnership with AST Aiming for Israel’s Semiconductor Industry (May. 04, 2015)
- TSMC Aims for 7nm in 2017 (May. 04, 2015)
- Imagination Technologies to focus on security for IoT devices at ChipEx 2015 (May. 04, 2015)
- Symtavision strengthens automotive Ethernet timing design and verification (Apr. 30, 2015)
- Mentor Graphics Enables Internet of Things Embedded Device Connectivity (Apr. 30, 2015)
- eInfochips PCIe Verification IP enables reliability for high-speed computing (Apr. 29, 2015)
- Rethinking the Internet of Things (Apr. 29, 2015)
- High Costs Hint IoT SoC Design Shakeout? (Apr. 29, 2015)
- Google Says the Internet of Things’ Smarts Will Save Energy (Apr. 29, 2015)
- Internet of Things Reaches Into the Trucking Business (Apr. 29, 2015)
- Inomize Becomes TSMC Design Center Alliance Partner (Apr. 28, 2015)
- Parrot Licenses INSIDE Secure Content Protection Technology to Protect its State-of-the-Art Automotive Media Center (Apr. 28, 2015)
- Toshiba Launches Application Processor Development Platforms for Wearable and IoT Devices (Apr. 28, 2015)
- ReFLEX CES implements GigE Vision IP from Pleora Technologies in Military Imaging System (Apr. 28, 2015)
- Cadence Introduces Indago Debug Platform, Improving Debugging Productivity by up to 50 Percent (Apr. 28, 2015)
- Microsemi Successfully Completes Vitesse Tender Offer (Apr. 28, 2015)
- Synopsys' New DesignWare Hybrid IP Prototyping Kits Accelerate IP Prototyping, Software Development and Integration (Apr. 28, 2015)
- Cyber attacks target IP and military secrets (Apr. 28, 2015)
- MIPSfpga programme opens up the MIPS architecture to universities worldwide (Apr. 27, 2015)
- Accelerate IP Software Development With Virtual Prototypes (Apr. 26, 2015)
- ARM Expects Vehicle Compute Performance to Increase 100x in Next Decade (Apr. 23, 2015)
- Securing an evolving cryptographic landscape (Apr. 23, 2015)
- Gartner Says Worldwide Semiconductor Sales Expected to Reach $354 Billion in 2015, a 4 Percent Increase from 2014 (Apr. 22, 2015)
- Arteris Delivers FlexNoC Physical Interconnect IP to Accelerate SoC Layout (Apr. 22, 2015)
- New Tensilica Fusion DSP Sets Low-Energy Benchmarks for IoT, Wearables and Wireless Connectivity (Apr. 22, 2015)
- Leading edge technology company in India will Design, Build and License Semiconductor IP products and Services in 14nm Technology (Apr. 22, 2015)
- Internet of Things is good for India (Apr. 22, 2015)
- Healthcare Internet of Things to Reach $117 Billion by 2020 (Apr. 22, 2015)
- UltraSoC announces industry-first "debug over USB" capability for complex SoCs (Apr. 21, 2015)
- Synopsys' Modeling of 10-nanometer Parasitic Variation Effects Ratified by Open-Source Standards Board (Apr. 21, 2015)
- S2C Sets New Standards For FPGA-Based Prototyping With Prodigy Complete Prototyping Platform (Apr. 21, 2015)
- Samsung Busts TSMC's 'Monopoly,' Analysts Say (Apr. 21, 2015)
- Intel's 10nm Secrets Predicted (Apr. 21, 2015)
- Cadence Expands OrCAD PCB Portfolio with New Products and Technologies to Enable Faster Product Creation (Apr. 21, 2015)
- TI Obsoletes FPGA (Apr. 21, 2015)
- IDC forecasts Canadian Internet of Things market worth more than $6.5 billion by 2018 (Apr. 21, 2015)
- ARM Announces Acquisition of Wicentric and Sunrise Micro Devices (Apr. 16, 2015)
- TVS extends CPU Verification Capability (Apr. 15, 2015)
- Infineon puts EtherCAT on ARM microcontroller (Apr. 15, 2015)
- INSIDE Secure and Presto Engineering to sign a partnership agreement to outsource INSIDE Secure’s semiconductor operations and supply chain activities to specialist provider, Presto Engineering (Apr. 15, 2015)
- Imagination's Ensigma Whisper Cores: the industry's lowest power consumption connectivity IP for wearables and IoT (Apr. 15, 2015)
- FreeRTOS Now Available for Tensilica Processors (Apr. 15, 2015)
- Nokia Agrees to Buy Alcatel-Lucent (Apr. 15, 2015)
- sureCore Limited Opens Leuven Design Centre (Apr. 14, 2015)
- EnSilica launches eSi-3260 processor core with comprehensive SIMD DSP extensions targeting IoT sensing nodes and always-on applications (Apr. 14, 2015)
- Intel Keeps It Simple for IoT Firmware Developers (Apr. 14, 2015)
- Rambus Cryptography Research Division Licenses DPA Countermeasures to Thales (Apr. 14, 2015)
- Movidius Raises $40 Million in Funding to Accelerate Adoption of Visual Sensing in the Internet of Things (Apr. 14, 2015)
- Microsoft and Fujitsu double down on the Internet of Things (Apr. 14, 2015)
- Quanta, Celeno and Imagination partner to provide the first WebRTC-enabled total VP8+H.264 IP camera solution (Apr. 14, 2015)
- Why China Is Shopping for Silicon Valley Chip Companies? (Apr. 13, 2015)
- Intertrust Technologies to integrate CryptoFirewall security cores (Apr. 13, 2015)
- RTOS Evolves to Ease Wireless IoT Device Design (Apr. 09, 2015)
- The future of mobile and embedded GPUs (Apr. 09, 2015)
- INSIDE Secure Introduces DRM Fusion Essential at the National Association of Broadcasters Show 2015 (NAB Show 2015) (Apr. 08, 2015)
- Xilinx and its Ecosystem Demonstrate 'Any Media over Any Network' Connectivity with All Programmable Professional Video Solutions at NAB 2015 (Apr. 08, 2015)
- Microsemi Announces Expiration of HSR Waiting Period for Vitesse Tender Offer (Apr. 08, 2015)
- Elliptic Technologies to Exhibit Leading Security Solutions for Ultra HD Content Protection at the NAB Show 2015 (Apr. 08, 2015)
- Arteris Delivers FlexNoC Version 3 to Enhance System-on-Chip (SoC) IP Assembly (Apr. 08, 2015)
- Chip Fingerprinting Scheme Could Secure IoT Devices Against Malware (Apr. 08, 2015)
- eASIC Joins Hybrid Memory Cube Consortium (Apr. 07, 2015)
- Percepio AB Joins ARM Connected Community (Apr. 07, 2015)
- Leading Global Mobile OEM, Yulong Coolpad, Selects Inside Secure to Protect Flagship Android Smartphone (Apr. 07, 2015)
- Mentor Graphics Announces Nucleus RTOS Safety Critical Certification (Apr. 07, 2015)
- Altera and TSMC Innovate Industry-first, UBM-free WLCSP Packaging Technology Platform for MAX 10 FPGA Products (Apr. 07, 2015)
- Realtek Adopts Faraday's 28nm HLP 7-track miniLib for TV SoC Solution (Apr. 07, 2015)
- Microsemi Announces RTG4 Radiation-tolerant FPGAs For High-speed Signal Processing Applications (Apr. 07, 2015)
- Xilinx UltraScale 20nm Devices Enable JDSU ONT 400G Ethernet Test Platform (Apr. 07, 2015)
- Why EDA Invests in IP (Apr. 07, 2015)
- Barco Silex adds lightweight VC-2 compression to video production toolbox (Apr. 07, 2015)
- MEMS Sensor Company Standing Egg Chooses MIPS CPUs for Sensor Hubs targeting Mobile, IoT, Wearables and Automotive (Apr. 07, 2015)
- Barco Silex Partners with Rambus to Combat Security Threats in Point-of-Sale Market (Apr. 06, 2015)
- SEMI Reports 2014 Global Semiconductor Materials Sales of $44.3 Billion (Apr. 06, 2015)
- Rambus Cryptography Research helps Barco Silex thwart PoS security threats (Apr. 06, 2015)
- Arasan Celebrates Leadership In UFS Based Storage With A Samsung Galaxy S6 Giveaway (Apr. 01, 2015)
- ARM, INSIDE Secure and Microsoft to Join Forces for Thought Leadership Webinar on Content Protection Issues (Apr. 01, 2015)
- Broadcom Introduces Industry's First Family of Secure Microcontrollers with Integrated NFC (Apr. 01, 2015)
- Imec and sureCore collaborate on SRAM Design IP (Mar. 31, 2015)
- Synopsys Joins the AVnu Alliance (Mar. 31, 2015)
- M31 Offers Low-Voltage and Low-Power Physical IP Solutions for TSMC 55ULP Technology Targeting IoT Applications (Mar. 31, 2015)
- Actions Semiconductor Launches Open Source Platform SoC and Reference Design Platform (Mar. 31, 2015)
- Intilop delivers their Enhanced 16 Thousand TCP & UDP Session Hardware Accelerator on Altera and Xilinx FPGAs targeted towards all Hyper Performance Networking Systems (Mar. 31, 2015)
- Arteris' FlexNoC Again Chosen by AppliedMicro for X-Gene Server-on-Chip Products (Mar. 31, 2015)
- Accusonus Speech Enhancement Software Optimized for Tensilica HiFi Audio/Voice DSPs (Mar. 31, 2015)
- Xilinx Launches Next Generation of Video over IP Connectivity Solutions to Address Emerging All IP-Based Networks (Mar. 31, 2015)
- Analysts Cool on Intel/Altera Combo (Mar. 30, 2015)
- Neural Networks Take on Embedded Vision (Mar. 30, 2015)
- Tiempo Secure TESIC-SC dual interface microcontroller is ready for evaluation and software development (Mar. 30, 2015)
- STMicroelectronics Not Fit To Take On The Competition (Mar. 30, 2015)
- Building a high-performance, low-power audio/voice subsystem (Mar. 26, 2015)
- RDA Selects Chips&Media's HD video technology for Mobile AP and DTV Platforms (Mar. 25, 2015)
- New Synopsys ASIP Designer Tool Speeds Development of Application-Specific Instruction-Set Processors by 5X (Mar. 25, 2015)
- GUC Relocates North America (Mar. 25, 2015)
- Mentor CEO says chips can be protected against hackers (Mar. 25, 2015)
- Altera and Eutecus Single-chip, FPGA-Based Solutions "See" and Provide Intelligent Vision for Smart Cities (Mar. 24, 2015)
- Xilinx SDAccel and SDNet Software Defined Development Environments Earn Lightwave Innovation Award Distinctions (Mar. 24, 2015)
- Digital Blocks Announces 2nd Gen Audio/Video & Data Hardware Protocol Stacks Supporting MPEG2 Transport Stream (TS), RTP, and UDP/IP Protocols (Mar. 24, 2015)
- Google to talk IoT at Bluetooth conference (Mar. 24, 2015)
- Java-based platforms certified for IoT (Mar. 24, 2015)
- TI’s 32-bit 'Successor' to the 16-bit MCU (Mar. 24, 2015)
- STMicroelectronics Announces and Demonstrates its Ultra-HDp60 STB Chips for the Chinese Market (Mar. 24, 2015)
- Multicore Microcontrollers Enable Gigabit Ethernet Internet of Things for Under $5 (Mar. 23, 2015)
- Rambus Licenses Patents and Technology Solutions to IBM (Mar. 23, 2015)
- Semiconductors off to slow start in 2015 (Mar. 23, 2015)
- Apple A9 Orders Pivot to TSMC (Mar. 23, 2015)
- Rockchip Licenses Arteris FlexNoC Fabric IP for RK Series SoCs (Mar. 18, 2015)
- SEMI Reports 2014 Global Semiconductor Equipment Sales of $37.5 Billion (Mar. 18, 2015)
- Microsemi Corporation to Acquire Vitesse Semiconductor Corporation (Mar. 18, 2015)
- Chukong Technologies and Imagination collaborate on the latest version of the Cocos2d-x game engine (Mar. 18, 2015)
- Cadence and ARM Announce Strategic IP Interoperability Agreement (Mar. 18, 2015)
- Industrial IoT Drives Microsemi-Vitesse Merger (Mar. 18, 2015)
- U.K. Gov’t Aims Cash At Driverless Cars, Internet Of Things And Digital Currencies (Mar. 18, 2015)
- NXP-Freescale Merger to Result in World's Eighth-Largest Chipmaker and Pose Threat to Other Players, IHS Says (Mar. 17, 2015)
- Synopsys Enables Continuous Debug Innovation with More Than 200 VC Apps Now Available on the Verdi Platform (Mar. 17, 2015)
- Cadence and Intel Collaborate to Release 14nm Library Characterization Reference Flow for Customers of Intel Custom Foundry (Mar. 17, 2015)
- prpl Foundation Announces Formation of Security Working Group to Define Open Framework Addressing Next Generation Security Requirements of Future Connected Devices (Mar. 17, 2015)
- INSIDE Secure Named Finalist in Info Security Products Guide's 11th Annual 2015 Global Excellence Awards (Mar. 17, 2015)
- Defend encryption systems against side-channel attacks (Mar. 17, 2015)
- Kilopass Focuses on Market and Roadmap Expansion After Sidense Patent Litigation (Mar. 16, 2015)
- Ericsson acquires telecom IT services business in China (Mar. 16, 2015)
- Cavium Adds Support for NVIDIA GPU Accelerators in 64-bit ARMv8-A ThunderX Processor Family (Mar. 16, 2015)
- How the internet of things is slashing energy costs for business (Mar. 16, 2015)
- ISSI Enters Into A Definitive Merger Agreement To Be Acquired By Consortium For $19.25 Per Share (Mar. 12, 2015)
- Altera Announces 30-Amp Integrated Digital DC-DC Converter For Generation 10 FPGAs (Mar. 11, 2015)
- Microsemi Announces High Performance SmartFusion2 SoC FPGA Dual-axis Motor Control Kit (Mar. 11, 2015)
- Lenovo Selects Elliptic Technologies for Embedded Hardware Security Solutions (Mar. 11, 2015)
- Toshiba Expands Line-up of ARM Cortex-M3-based Microcontroller for Smart Meters (Mar. 11, 2015)
- SiliconIndia selects OmniPhy for "20 Most Promising US Semiconductor Solution Providers" (Mar. 10, 2015)
- eInfochips shortens verification cycles and improves reliability for ASIC and SoC designs with Verification IPs (Mar. 10, 2015)
- Nufront Selects Uniquify DDR Subsystem IP to Support Advanced 28nm SoC Project (Mar. 10, 2015)
- Synopsys Galaxy Design Platform Deployed by HiSilicon Technologies for Implementation of FinFET Designs (Mar. 10, 2015)
- Synopsys Galaxy Design Platform Enables 90 Percent of Volume-Production FinFET Designs (Mar. 10, 2015)
- IAR Systems shortens build times in leading development toolchain for ARM-based devices (Mar. 10, 2015)
- Lattice Semiconductor Closes Acquisition of Silicon Image (Mar. 10, 2015)
- Cadence Introduces Innovus Implementation System, Delivering Best-in-Class Results with Up to 10X Reduction in Turnaround Time (Mar. 10, 2015)
- Strong Fab Equipment Spending Expected in 2015; Slowing but Positive 2016 (Mar. 10, 2015)
- Freescale Speeds SoC Implementation Time by 7X with Cadence Innovus Implementation System (Mar. 10, 2015)
- Apple Watch: It's an Internet of things play (Mar. 10, 2015)
- Kaspersky Lab CEO: The Internet of Things means 'Internet of Threats' (Mar. 10, 2015)
- Arrow and eInfochips Team to Offer Consulting and Hardware/Software Design Services (Mar. 09, 2015)
- Apple Watch: Time Will Tell (Mar. 09, 2015)
- Cadence Named to FORTUNE’S 2015 List of "100 Best Companies to Work For (Mar. 05, 2015)
- ARM and Tencent Games Collaborate to Advance Mobile Gaming (Mar. 04, 2015)
- Gartner Says Worldwide Server Market Grew 4.8 Percent in Shipments, While Revenue Increased 2.2 Percent in Fourth Quarter of 2014 (Mar. 04, 2015)
- Semtech Announces Acquisition of Triune Systems (Mar. 04, 2015)
- Internet of Things applications moving into healthcare (Mar. 04, 2015)
- The Internet of Things is poised to change how businesses operate in the near future (Mar. 04, 2015)
- Mellanox and Synopsys Demonstrate Industry's First PCIe 4.0 Interoperability (Mar. 03, 2015)
- Khronos Reveals Vulkan API for High-efficiency Graphics and Compute on GPUs (Mar. 03, 2015)
- AMIQ EDA Releases the DVT Debugger Add-On Module for the e language, SystemVerilog, Verilog, and VHDL (Mar. 03, 2015)
- Khronos Releases OpenCL 2.1 Provisional Specification for Public Review (Mar. 03, 2015)
- TVS releases one of the first C-PHY VIP solutions in the market (Mar. 03, 2015)
- New AXI4 VIP Suite to improve FPGA and SoC reliability for ARM-based designs (Mar. 03, 2015)
- Xilinx All Programmable Devices Enabling ZTE Pre5G 3D/Massive MIMO Base Station (Mar. 03, 2015)
- Sibridge Technologies announces customer adoption of USB 3.1 Verification IP (Mar. 03, 2015)
- Brite Semiconductor Secures Series C Round of Finance from Norwest Venture Partners, Gobi Partners and China-based Foundry SMIC (Mar. 03, 2015)
- Mentor Graphics Acquires Tanner EDA (Mar. 03, 2015)
- ViaSat Expands High-Speed Networking Security Portfolio with Acquisition of EAI Design Services (Mar. 03, 2015)
- Vivante Announces Support for Vulkan GPU Rendering and Compute Standards (Mar. 03, 2015)
- NXP CEO: 'Security, IoT, Cars' Drove Freescale Deal (Mar. 03, 2015)
- Unleash The Power of JavaScript For IoT (Mar. 03, 2015)
- Who needs a debugger? (Mar. 03, 2015)
- IBM, Semtech 30-Mile IoT Uses 10-Year AAs (Mar. 03, 2015)
- At DATE 2015 Conference, D&R announces a next version of its Enterprise IP-SoC platform (IPMS™) expanding financial reporting features and adding automated Tear Sheet generation (Mar. 03, 2015)
- DTS Headphone:X Optimized for Cadence Tensilica HiFi Audio DSPs (Mar. 02, 2015)
- Global Semiconductor Industry Posts Highest-Ever January Sales (Mar. 02, 2015)
- Freescale-NXP Merger Leaves Fewer Viable Alternatives in Chip Market (Mar. 02, 2015)
- New PowerVR G6020 GPU targets ultra-affordable mobile and IoT devices (Mar. 02, 2015)
- Asian Share of Global Fab Capacity May Top 69% by 2019 (Mar. 02, 2015)
- INSIDE Secure Introduces HCE Payment Security Updates at Mobile World Congress 2015 (Feb. 26, 2015)
- ARM at Mobile World Congress 2015 - Expanding the Connected Experience (Feb. 25, 2015)
- Xilinx and BEEcube Announce Highly Scalable Prototyping Platform for 5G Massive MIMO Antenna Systems (Feb. 25, 2015)
- Nabto offers its "Internet of Things" Communication Platform on Cortus-based Systems-on-Chips (Feb. 25, 2015)
- CEVA Brings Human-Like Intelligent Vision Processing to Low-Power Embedded Systems (Feb. 25, 2015)
- Blunk Microsystems offers TargetTools™ IDE for Cortus Software Development (Feb. 25, 2015)
- POWER FIRST - Subduing The Power Management Storm (Feb. 25, 2015)
- Arteris FlexNoC Helps Enable Texas Instruments Wireless Connectivity for the Internet of Things (IoT) (Feb. 25, 2015)
- Hitachi Reduces Verification Turnaround Time for Mixed-Signal Chip with Cadence Virtuoso AMS Designer (Feb. 25, 2015)
- Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process (Feb. 25, 2015)
- ARM Connects a New World of Intelligent Devices to the Cloud (Feb. 24, 2015)
- OneSpin Delivers First SystemC Assertion-Based Formal Verification Solution (Feb. 24, 2015)
- CAST Makes Evaluating 32-bit Processor IP Easier with Talos for BA20 Plus FreeRTOS (Feb. 24, 2015)
- Silicon Vision and Mindtree Enable Next Generation IoT Devices with Bluetooth Smart 4.2 (Feb. 24, 2015)
- Lattice Semiconductor Expedites & Simplifies USB Type-C Implementation in Consumer and Industrial Devices (Feb. 24, 2015)
- Microsemi Extends its Leadership in Cyber Security for Automotive and IoT Applications with Escrypt Public Key Infrastructure (Feb. 24, 2015)
- Atmel Launches Automotive Grade ARM Cortex-M0+-based MCUs With Capacitive Touch Hardware Support for HMI and LIN Applications (Feb. 24, 2015)
- Lattice Semiconductor Enables Faster IEC61508 Certification with FPGA Functional Safety Design Flow (Feb. 24, 2015)
- Freescale i.MX 6SoloX Takes Applications Processor Security to New Levels (Feb. 24, 2015)
- Freescale's Kinetis KV5x MCU with ARM® Cortex®-M7 Core Drives Motor Control into the IoT Era (Feb. 24, 2015)
- Freescale Drives for a Secure Internet of Things (Feb. 24, 2015)
- Top Semiconductor R&D Leaders Ranked for 2014 (Feb. 24, 2015)
- eSilicon Uses Sonics' Flagship On-chip Network in Complex SoC Design (Feb. 24, 2015)
- Altera Ships 20 nm SoCs (Feb. 24, 2015)
- Green Hills Software and Imagination Report Expanded Compiler and Tools Support for MIPS CPUs (Feb. 24, 2015)
- ARM Adds Customized Remote Training to Education Portfolio (Feb. 24, 2015)
- TSMC to Start 10nm in 2017, Closing Gap with Intel (Feb. 24, 2015)
- Cadence Announces Stratus High-Level Synthesis Platform (Feb. 24, 2015)
- Samsung Wants Moore's Law End, Analyst Says (Feb. 24, 2015)
- Hillcrest Labs' Freespace Always-On Sensing Software Available on Cadence Tensilica DSP (Feb. 24, 2015)
- Express Logic's ThreadX To Bring Full RTOS to the ARM mbed Ecosystem (Feb. 23, 2015)
- ARM is Enabling Embedded Intelligence for a Smarter World at EW2015 (Feb. 19, 2015)
- INSIDE SECURE named as "2014 European Frost & Sullivan Company of the Year" (Feb. 19, 2015)
- Chipmaker Dialog posts strong Q4; eyes good growth in 2015 (Feb. 19, 2015)
- Imagination at Mobile World Congress 2015 - Driving the future of mobile innovation (Feb. 18, 2015)
- Embedded World 2015: ReFLEX CES Showcases Extended High-Speed FPGA Boards Portfolio (Feb. 18, 2015)
- Semiconductor Unit Shipments To Exceed One Trillion Devices in 2017 (Feb. 18, 2015)
- Two Major Enterprise Solid State Disk (SSD) Vendors License Arteris FlexNoC Interconnect IP (Feb. 18, 2015)
- eWBM Selects Elliptic's Secure Root of Trust Technology for Newest IoT Chipset (Feb. 18, 2015)
- ARM Offers $10,000 in Prizes for Smart Product Design Competition (Feb. 18, 2015)
- Mindtree Enables Next Generation Bluetooth Low Energy Chips at Cypress (Feb. 18, 2015)
- MIPI Alliance Updates its Widely Adopted CSI Specification to Bring High-Resolution Imaging, Richer Color and Video to Mobile and Mobile-Influenced Applications (Feb. 18, 2015)
- CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs (Feb. 18, 2015)
- Achronix Dramatically Reduces Compile Times with New Incremental Compile Support in its ACE Design Tools (Feb. 18, 2015)
- Microsoft, Google Beat Humans at Image Recognition (Feb. 18, 2015)
- Mentor Graphics Signs Agreement with CADD Edge to Distribute Electronic Design and Analysis Products (Feb. 18, 2015)
- IoT Center partner Cypherbridge focuses on security (Feb. 18, 2015)
- Freescale Semiconductor and Alcatel-Lucent’s Research Arm Bell Labs Extend Collaboration to Advance Wireless Technology for the Internet of Tomorrow (Feb. 18, 2015)
- Mobile networks prep for the Internet of Things (Feb. 18, 2015)
- The 'Internet of Things' will be the world's most massive device market and save companies billions of dollars (Feb. 18, 2015)
- How to Fail in the Internet of Things (Feb. 18, 2015)
- Samsung to Acquire LoopPay, Transformative Digital Wallet Platform (Feb. 18, 2015)
- Imagination delivers next generation of embedded and IoT technologies at Embedded World 2015 (Feb. 17, 2015)
- Arteris and YOGITECH Announce Strategic Partnership Enabling ISO 26262 Compliant Advanced Automotive Systems-on-Chip (Feb. 17, 2015)
- Cadence Showcases Advanced Mobile Technologies at Mobile World Congress 2015 (Feb. 17, 2015)
- The Freescale QorIQ Linux® Software Development Kit - aiming to exceed your expectations (Feb. 17, 2015)
- Sorry, IP Isn't EDA (Feb. 17, 2015)
- Build Your Own EDA Tool (Feb. 16, 2015)
- Synopsys Presentations at Embedded World (Feb. 16, 2015)
- INSIDE Seure chosen by leading French Telecom operator SFR for Mobile Device Content Protection (Feb. 12, 2015)
- Synopsys' New DesignWare DDR Explorer Tool Delivers Up to 20 Percent Improvement in DDR Memory Subsystem Efficiency (Feb. 11, 2015)
- Xilinx and Over 30 Alliance Program Members to Showcase Zynq All Programmable SoC Solutions at Embedded World 2015 (Feb. 11, 2015)
- Will the internet of things finally kill privacy? (Feb. 11, 2015)
- INSIDE Secure Shortens Time to Certification with World's First FIPS 140-2-Certified IP Component (Feb. 10, 2015)
- IoT Security: The Road Ahead (Feb. 10, 2015)
- Apple HomeKit acceleration now supported by Barco Silex Crypto Public Key (Feb. 10, 2015)
- Sansa Security Joins the Industrial Internet Consortium (Feb. 10, 2015)
- Great Wall Motors standardizes on Mentor Graphics Capital tools after successful deployment on Haval (Feb. 10, 2015)
- ReFLEX CES takes over PLDA Group's hardware business (Feb. 10, 2015)
- MegaChips Utilizes Cadence Tensilica Xtensa Processor in Ultra-Low Power Internet of Things Sensor Hub IC (Feb. 09, 2015)
- Mentor Graphics Launches Broadest Embedded Systems Solution for Industrial Automation (Feb. 09, 2015)
- Will Altera FPGAs Drive Your Future Audi? (Feb. 06, 2015)
- MStar to Use Cryptography Research DPA Countermeasures to Ward Off Attacks in Set-Top Box Solutions (Feb. 05, 2015)
- eInfochips announces eMMC 5.0 Verification IP (Feb. 05, 2015)
- M31 Technology Adopts Cadence Verification IP to Achieve 2.5X Faster Verification (Feb. 04, 2015)
- Xilinx and its Ecosystem Demonstrate All Programmable and Smarter Vision Solutions at ISE 2015 (Feb. 04, 2015)
- Apple And Samsung Join Forces For The iPhone 7 (Feb. 04, 2015)
- Synopsys' New 25G/50G Ethernet Verification IP Enables Next-Generation Gigabit Designs (Feb. 03, 2015)
- IXYS Announces the Acquisition of RadioPulse (Feb. 03, 2015)
- MaxLinear to Acquire Entropic, Reaffirms Its Fourth Quarter 2014 Guidance and Provides Outlook for First Quarter 2015 (Feb. 03, 2015)
- Silicon Labs Acquires Bluegiga, a Leader in Bluetooth and Wi-Fi Connectivity Solutions (Feb. 03, 2015)
- Cadence Offers Complete Development Environment for ARM Premium Mobile IP Suite (Feb. 03, 2015)
- ARM and Synopsys Collaboration Enables Optimized Implementation of ARM Cortex-A72 Processor-based SoCs with IC Compiler II (Feb. 03, 2015)
- ARM Pumps Mali in Mobile Graphics (Feb. 03, 2015)
- ARM Sets New Standard for the Premium Mobile Experience (Feb. 03, 2015)
- ARM Cores Take on PC Processors (Feb. 03, 2015)
- IoT Invades the Kitchen (Feb. 03, 2015)
- Lattice Semiconductor’s New iCE40 UltraLite Device Enables OEMs to Accelerate Time-to-Market of Feature-Rich Mobile Devices (Feb. 03, 2015)
- Intel Bets on the "Internet of Things" With Latest Acquisition (Feb. 03, 2015)
- Samsung Hires Former Google Exec To Lead Its Internet Of Things Developer Charge (Feb. 03, 2015)
- ARM and Cadence Provide Energy-Efficient, Comprehensive Media Components for Mobile Market (Feb. 02, 2015)
- Bit9 moves to spot lurking threats with Carbon Black 5.0 (Jan. 29, 2015)
- Athena and Intrinsic-ID Team to Deliver the Dragon-QT Security Processor Offering Flexible, Scalable Security for Hardware Root of Trust Applications (Jan. 29, 2015)
- Videantis becomes member of German Automotive Cluster (Jan. 29, 2015)
- FTC sees privacy threats in the 'Internet of Things' (Jan. 28, 2015)
- ST revenues fall 9% (Jan. 28, 2015)
- Espressif Systems Internet of Things WiFi Chips Employ Cadence Tensilica Xtensa Low-Power Processor for Control and DSP (Jan. 28, 2015)
- UMC Boosts Capex to Capture More 28nm Orders (Jan. 28, 2015)
- Small is Beautiful - How UVM Test Case Extraction Can Improve Your Constraint Analysis Productivity (Jan. 28, 2015)
- Freescale Come Back? Stock Market Thinks So (Jan. 28, 2015)
- Lattice Semiconductor to Acquire Silicon Image for Approximately $600 Million (Jan. 27, 2015)
- Spansion and Macronix Reach Settlement Agreement (Jan. 27, 2015)
- The Internet of Things is going to be a legal nightmare (Jan. 27, 2015)
- IoT business is services not things (Jan. 27, 2015)
- Cadence Expands Sigrity 2015 Technology Portfolio with New Products, a Key Feature Update and Flexible Licensing Options (Jan. 27, 2015)
- Sonics Closes 2014 With Strong Business Momentum (Jan. 27, 2015)
- Scared of Multi-FPGA Prototyping, Don't Be !!! (Jan. 25, 2015)
- Sibridge Technologies announces Hardware Diagnostics Tool & Testbench IP (Jan. 22, 2015)
- Toshiba Reorganization to Strengthen IoT-Related Business (Jan. 22, 2015)
- IoT will fire up the Next Generation of Engineers say ARM and UCL (Jan. 21, 2015)
- Cypress Licenses 40-Nanometer Embedded Flash IP to UMC, Enabling Next-Generation MCUs, IoT and Wearables Applications (Jan. 21, 2015)
- Synopsys Expands Memory Verification IP Portfolio with UFS, UniPro and eMMC to Accelerate Verification Closure for Mobile Designs (Jan. 21, 2015)
- Samsung and Apple Continue to Lead as Top Global Semiconductor Customers in 2014, According to Gartner (Jan. 21, 2015)
- Verimatrix Establishes the Standard in Cardless Security with Advanced Security Certification for the Broadest Range of Chipsets (Jan. 21, 2015)
- Forget the Internet of Things, here comes the Industrial Internet of Things (Jan. 21, 2015)
- ASML Forecast Tops Estimates as Chip-Equipment Orders Revive (Jan. 21, 2015)
- Athena Announces Fastest Elliptic Curve Cryptography Accelerator Core (Jan. 21, 2015)
- Truechip announces first customer shipment of PCI Express Gen3 Comprehensive Verification IP (CVIP) (Jan. 20, 2015)
- Horizon 2020 Funding Granted to FANCI Project For Multi-Modal Human-Machine Technologies (Jan. 20, 2015)
- Lattice Semiconductor Announces the Industry's Most Affordable I/O Expansion and Bridging Starter Kit (Jan. 20, 2015)
- UMC and Cadence Collaborate to Deliver 28nm Design Reference Flow for ARM Cortex-A7 MPCore-based SoC (Jan. 20, 2015)
- Mentor Graphics Wins Summary Judgment, Court Dismisses Three Synopsys Patents (Jan. 20, 2015)
- Embedded Virtual Prototype Kits Offer Unified HW-SW Debug and Analysis (Jan. 20, 2015)
- Rambus Unveils On-chip Noise Monitor to Improve Quality and Reduce Time-to-Market of Complex SoCs (Jan. 20, 2015)
- We Asked Executives About The Internet Of Things And Their Answers Reveal That Security Remains A Huge Concern (Jan. 20, 2015)
- Robots embrace Ubuntu as it invades the internet of things (Jan. 20, 2015)
- AMD Upbeat Despite $330M Loss (Jan. 20, 2015)
- What does 3D integration have in store for semiconductor and related industries in 2015? (Jan. 20, 2015)
- Stopping Hardware Trojans in Their Tracks (Jan. 20, 2015)
- Inside Secure announces participation in Entrust Datacard's card Validation Program for Smart Cards (Jan. 15, 2015)
- eInfochips and Toshiba Unveil Development Kits to Accelerate Development of Google Project Ara Modular Smartphones (Jan. 14, 2015)
- Xilinx SDAccel Development Environment for OpenCL, C, and C++, Achieves Khronos Conformance (Jan. 14, 2015)
- FPGAs must be protected from being cloned (Jan. 14, 2015)
- TVS adds web interface to its asureSIGN verification tool for real-time requirements management sign-off status (Jan. 14, 2015)
- Byte Paradigm announces 'Yugo Systems' solutions dedicated to FPGA Debug (Jan. 14, 2015)
- Gartner Says Worldwide Semiconductor Sales Expected to Reach $358 Billion in 2015, a 5.4 Percent Increase From 2014 (Jan. 14, 2015)
- The thing that will make or break the Internet of things isn't a thing (Jan. 14, 2015)
- IoTivity is a new open-source attempt to establish Internet-of-Things standards (Jan. 14, 2015)
- China to Write $10B Check for Chips (Jan. 14, 2015)
- Mentor Graphics Acquires Flexras Technologies (Jan. 13, 2015)
- Toshiba Selects Sonics for New ApP Lite TZ2000 Series (Jan. 13, 2015)
- Eurotech Announces Release of Everyware Software Framework (ESF) 3.0, the Java-OSGi Framework for M2M Gateways, Smart Devices and IoT applications (Jan. 13, 2015)
- Google, Apple Rise in Patent Ranks (Jan. 12, 2015)
- Barco Silex wins Technology & Engineering Emmy Award for Standardization and Productization of JPEG2000 Interoperability (Jan. 09, 2015)
- IoT: energy saver or power drain? (Jan. 09, 2015)
- Truechip announces first customer shipment of ARM AMBA 4 ACE Comprehensive Verification IP (CVIP) (Jan. 08, 2015)
- Security: The future is dark? (Jan. 08, 2015)
- Checking boxes is not a panacea for IoT security (Jan. 07, 2015)
- Intel Tips Mini IoT Module (Jan. 07, 2015)
- Microsemi and STMicroelectronics Collaborate to Develop World-class IoT Solution for Innovative Home-automation Solution (Jan. 07, 2015)
- Micron Had Fastest Growth Among Semiconductor Leaders (Jan. 07, 2015)
- eInfochips to Provide Design Services and Engineering Solutions for Embedded Computing Products Based on Qualcomm Snapdragon Processors (Jan. 06, 2015)
- Gartner Says Worldwide Semiconductor Revenue Grew 7.9 Percent in 2014 (Jan. 06, 2015)
- Telechips Partners with Sansa Security to Enable Digital Rights Management (DRM) for New Hexa-Based TCC896x Chipset (Jan. 06, 2015)
- Microsemi Steps Up Its Cyber Security Leadership in FPGAs: SmartFusion2 SoC FPGAs and IGLOO2 FPGAs Enhanced with Physically Unclonable Function Technology (Jan. 06, 2015)
- Imagination announces PowerVR imaging framework for Android (Jan. 06, 2015)
- Atmel Unleashes Highest-Performing ARM Cortex-M7 based MCUs with Superior Memory Architecture and Connectivity for Automotive, IoT and Industrial Markets (Jan. 06, 2015)
- Cadence Announces Fourth Generation Tensilica HiFi DSP Architecture (Jan. 06, 2015)
- IoT: Collaborate or Else, Says Samsung CEO (Jan. 06, 2015)
- IoT Modules Quicken Innovation (Jan. 06, 2015)
- How to make your FPGA-based design more secure (Jan. 06, 2015)
- HARMAN Clari-Fi Music Restoration Technology Now Available on Cadence Tensilica HiFi Audio/Voice DSP Family (Jan. 06, 2015)
- Atmel Expands Ultra-low Power SAM G ARM Cortex M4 MCU Portfolio for Wearables and Sensor Hub Management (Jan. 05, 2015)
- OmniVision Announces Availability of Optimized Algorithm Library for ARM Mali GPU Technology (Jan. 05, 2015)
- Growing DLNA VidiPath Ecosystem to be Showcased at CES (Jan. 05, 2015)
- Riscure completes evaluation of CryptoFirewall™ security core (Jan. 05, 2015)
- Ensuring security for networks of the future (Jan. 05, 2015)
- Finding the right test strategies for IoT devices (Dec. 30, 2014)
- OmniPhy Announces Automotive Ethernet Silicon IP (Oct. 26, 2012)
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